NCP81206MNTXG - ON SEMICONDUCTOR

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Features of Enhanced Single-Phase RPM Architectures

• High performance RPM control system

• Ultralow offset IOUT monitor

• Dynamic VID feed-forward

• Programmable droop gain

• Zero droop capable

• Thermal monitor

• Ultra-sonic operation

• Digitally controlled operating frequency

Features of Multi-Phase Dual Edge Architecture

• Current-mode dual-edge modulation for fast initial response to transient loading

• High-performance operational error ampliﬁer

• Accurate total summing current ampliﬁer

• High-impedance differential voltage and total current sense ampliﬁers

• Phase-to-phase dynamic current balancing

• “Lossless” DCR current sensing for current balancing

Dual-Edge & RPM Modulation Vcore Controllers

for IMVP8 Designs

Page 2 Computing Solutions

Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases

Integrated

Drivers Interface Package

NCP81201 Tablet Controller VR12.1 RPM 1 1 — SVID QFN-28

NCP81111 Microserver Controller VR12.5 Hybrid 1 1/2/3 —SVID QFN-32

NCP81203 Desktop Controller IMVP8 Dual Edge 23/2/1+2/1 —SVID QFN-52

NCP81203P Notebook Controller IMVP8 Dual Edge 23/2/1+2/1 —SVID QFN-52

NCP81205 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 —SVID QFN-52

NCP81206 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5V SVID QFN-52

NCP81208 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 —SVID QFN-48

NCP81210 Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40

Please contact ON Semiconductor for product datasheets.

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Desktop Solutions

Ultrabook Solution Notebook Solutions

Microserver Solutions

NCP81203 3+2 Phase Controller

• Dual Edge for fast transient response

• Constant on-time for light load efﬁciency

• Supports all MLCC output capacitor solutions

• IMVP8 compliant

NCP81208 1+2+1 Phase Controller

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

NCP81205 3+3+1 Phase Controiler

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

NCP81111 3-Phase Digital Controller

• Optimised to operate at 5MHz using DrMOS

• Can operate as general purpose I2C controller regulator

• Internal compensation using GUI interface

• VR12.5/6 compliant

+12 V

RAIL1

RAIL2

+12 V

NCP81203

3+2

Phase

Controller

CPU

NCP81161

12 V Driver

NCP81161

12 V Driver

NCP81161

12 V Driver

NCP81161

12 V Driver

NCP81161

12 V Driver

+20 V

RAIL1

RAIL2

RAIL3

+20 V

NCP81205

3+3+1

Phase

Controller

CPU

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81253

5 V Driver

RAIL1

NCP81381

DrMOS

NCP81111

Phase

Controller

CPU

NCP81381

DrMOS

NCP81381

DrMOS

RAIL1

RAIL2

NCP81382

DrMOS

NCP81382

DrMOS

RAIL3

NCP81382

DrMOS

NCP81208

1+2+1

Phase

Controller

CPU

NCP81382

DrMOS

Page 3ON Semiconductor

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Page 4 Computing Solutions

IMVP8 Multiphase Controllers for Embedded Applications

NCP81245 3+3+1 Phase Controller

• Dual Edge & DCR current sensing for fast transient response

• EN RPM for fast transition between DCM and CCM mode

• True Differential Current Balancing

• IMVP8 compliant

+20 V

RAIL1

RAIL2

RAIL3

+20 V

NCP81245

3+3+1

Phase

Controller

CPU

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81151

5 V Driver

NCP81253

5 V Driver

Device Market Function VR Spec Controller Architecture Number of Rails CPU Phases

Integrated

Drivers Interface Package

NCP81243 Desktop Controller IMVP8 Dual Edge 23/2/1+2/1 —SVID QFN-52

NCP81245 Notebook Controller IMVP8 Dual Edge & EN RPM 3 1/2/3+1/2/3+1 —SVID QFN-52

NCP81246 Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 3 x 5 V SVID QFN-52

NCP81248* Ultrabook Controller IMVP8 Dual Edge & EN RPM 3 1+1/2+1 - SVID QFN-48

NCP81255* Ultrabook & Notebook Controller IMVP8 EN RPM 1 1 1 + FETs SVID QFN-40

NCP81145 Ultrabook & Notebook 5 V Driver — for Dual Edge Rail — — — — DFN-8

NCP81146 Desktop 12 V Driver — for Dual Edge Rail — — — — DFN-8

NCP81253 Ultrabook & Notebook 5 V Driver — for EN RPM rail — — — — DFN-8

* Pending 1H16.

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System Power

System power management devices provide additional rails in computing applications, beyond Vcore and graphics. They are available

with single or dual channel operation, and also in multi-phase conﬁgurations.

BOOT

VCC

GND

VOS

PGOOD

VIN = 2.5 V − 13.2 VVCC = 4.5 V − 13.2 V

0.1 F

4.7nF

2x1800 F

2.2

1 H

1500 F

1.02k

3.878k

0.014 F

1.02k

74.2

4.12k

0.007 F

17.08k

0.0015 F

COMP/EN

ROCSET

NTD4806 NTD4809

3x22 F

1500 F

2x0.22 F

VBST = 4.5 V − 15 V

GND

VOUT

1.65 V

R9 R10

Device Description Topology

VCC Min

(V)

VCC Max

(V)

fSW Typ

(kHz) Package

NCP1579 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 275 SOIC-8

NCP1587 Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 250 - 300 SOIC-8

NCP1587A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 180 - 220 SOIC-8

NCP1589A Synchronous Buck Controller, Low Voltage Step-Down 4.5 13.2 —DFN-10

NCP1589D Snychronous Buck Controller Step-Down 4.5 13.2 —DFN-10

NCP1589L Synchronous Buck Controller, Low Voltage, with Light Load Efﬁciency and Transient Enhancement Step-Down 4.5 13.2 —DFN-10

NCP5212 Single Synchronous Step Down Controller Step-Down 4.5 27 300 QFN-16

NCP5217 Synchronous Buck Controller, Single Step-Down 4.5 27 300 QFN-14

NCP5230 Low Voltage Synchronous Buck Controller Step-Down 4.5 13.2 —QFN-16

NCP5269 System Agent Controller with 2-bit VID Step-Down 3.3 28 300 - 600 QFN-20

NCP3231 25 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 4.5 18 500 TQFN-40

NCP3232N 15 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 4.5 21 500 TQFN-40

NCP3133A 3 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 2.9 5.5 1100 QFN-16

NCP3135 5 A Synchronous Buck Converter with Intergrated MOSFETs Step-Down 2.9 5.5 1100 QFN-16

Page 5ON Semiconductor

NCP1589A Application Diagram

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Extensive Portfolio

Local Sensors provide temperature information at

the device location

Remote Sensors provide temperature information

of a transistor located at a different position on the

board; also includes local sensor capability

Fan Controllers integrate the temperature sensor

with a fan controller/monitor

System Monitors integrate combinations of

remote and/or local temperature sensing, voltage

monitoring, fan control & monitoring, reset control,

and GPIO functions

Thermal Management and System Monitoring

System

Voltages +12 V

+5 V

+3.3 V

+2.5 V

+1.8 V

+1.5 V

+1.25 V

+0.9 V

VBatt

Chassis Intrusion

ALERT O/P

Bi-directional

THERM Pins

TDM3

TDM1

TDM2

8 GPIOs

SMBus Interface

RESET I/O

Fan Drive and Control

• 4 PWM Fan Drive Outputs

• 8 Tach Inputs

4 PWM O/Ps

8 Tach Inputs

Fan2Max

Temperature

• Measures 4 Temp Zones

1 Local

3 Remote

THERM I/O

Page 6 Computing Solutions

Device

Supply

Range

(V)

Temperature

Range

(°C )

Local

Accuracy

(°C) Interface

Number

Addresses

SRC

(Ω)

Remote

Accuracy

Remote

Channels

Fan

Channels

TACH

Channels

Voltage

Monitoring

Channels GPIOs Package

System

Monitors

ADM1026 3 - 5.5 -40 to +120 ±3 I2C/SMBUS 3 — ±3 2 8 8 19 17 LQFP-48

ADT7462 3 - 5.5 -40 to +125 ±2.25 I2C/SMBUS 2 2 k ±2.25 3 4 8 13 8 LFCSP-32

NCT80 2.8 - 5.75 -40 to +125 ±2 I2C/SMBUS 8 — — — — 2 7 1 TSSOP-24

ADT7476 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 — ±1.5 2 3 4 5 — QSOP-24

Fan

Controllers

ADT7473 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 3 3 k ±1.5 234 QSOP-16

ADT7475 3 - 3.6 -40 to +120 ±1.5 I2C/SMBUS 1 — ±1.5 234 QSOP-16

ADM1033 3 - 3.6 -40 to +120 ±1 I2C/SMBUS 8 1 k ±1 111 QSOP-16

ADM1034 3 - 3.6 -40 to +120 ±1 I2C/SMBUS 8 1 k ±1 222 QSOP-16

Remote

Sensors

NCT72 2.8 - 3.6 -40 to +125 ±1 I2C/SMBUS 21.5 k ±1 1DFN-8, WDFN-8

NCT218 1.4 - 2.75 -40 to +125 ±1.75 I2C/SMBUS 2150 ±1 1WDFN-8, WLCSP-8

NCT210 3 - 5.5 -55 to +125 ±1 I2C/SMBUS 9 — ±3 2QSOP-16

ADM1032 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 — ±1 1SOIC-8, MSOP-8

ADT7461 3 - 5.5 -40 to +125 ±3 I2C/SMBUS 2 3 k ±1 1SOIC-8, MSOP-8

ADT7481 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 2 — ±1 2MSOP-10

ADT7483 3 - 3.6 -40 to +125 ±1 I2C/SMBUS 9 — ±1 2QSOP-16

Local

Sensors

NCT375 3 - 5.5 -55 to +125 ±1 SMBUS 8DFN-8, SOIC-8,

Micro8

NCT475 3 - 5.5 -55 to +125 ±1 SMBUS 4WLCSP-6

NCT203 1.4 - 2.75 -40 to +125 ±1.75 I2C/SMBUS 1DFN-8, SOIC-8,

Micro8

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Integrated MOSFET and Drivers

Drivers for Discrete MOSFET Implementations

Features

• Integrated high- and low-side MOSFETs

• Integrated bootstrap diode

• Matched of driver and MOSFETs optimize switching performance

• Higher switching frequency enables use of smaller inductor and output capacitors

• Low-side MOSFET diode emulation mode provides asynchronous operation

• 65% lower BOM; 45% smaller footprint and simpliﬁed layout versus discrete solutions

VIN

2-Phase

Driver

VIN

IA Rail

GT Rail

3-Phase Driver

Driver

2-Phase

IA Rail

GT Rail

3-Phase

DrMOS

Drivers speciﬁcally designed to work with controller solutions, and optimized for 5 V or 12 V gate applications.

Page 7ON Semiconductor

Discrete Integratedversus

Device PWM Input VIN Max (V) Freq Max (MHz) IOUT Continuous Max (A) Package

NCP5369 5 V Tri-state 25 140 QFN-40

NCP81081 3.3 V Tri-state 25 140 QFN-40

NCP5338 5 V Tri-state 20 140 QFN-40

NCP81380 5 V Tri-state 30 215 QFN-32

NCP81381 5 V Tri-state 30 225 QFN-32

NCP81382 5 V Tri-state 30 235 QFN-28

Device Drivers VCC Typ (V) Integrated Bootstrap Diode Zero Crossover Detection Package

NCP5901 Single 12 N Y DFN-8

NCP5901B Single 12 Y Y DFN-8

NCP81161 Single 12 Y Y DFN-8

NCP81151 Single 5 Y Y DFN-8

NCP81253 Single 5 Y N DFN-8

NCP81061 Dual 12 Y Y QFN-16

NCP81152 Dual 5 Y Y QFN-16

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MOSFETs Provide Optimized Efﬁciency

Page 8 Computing Solutions

Asymmetric Dual

• Co-packaged Power Stage to minimize board space

• Low Side MOSFET with Integrated Schottky

• Parasitic Inductances Minimized

• Optimized Devices to Reduce Power Losses

(8) G2

S2 (5, 6, 7)

(1) G1

S1/D2 (10)

D1 (2, 3, 4, 9)

Maximum Rating

(nC)

Qgd

(nC)

Ciss

(pF)

Crss

(pF)

(Ω)

VDS

(V)

VGS

(V)

RDS(ON) (mΩ)

Device Package Conﬁg Polarity

VGS=

10 V

VGS=

4.5 V Applications

NTMFD4C85N PowerPhase Asym

Dual

N30 20 3.0 4.3 15.0 5.2 1960 102 1.0 Control Side

N30 20 0.8 1.2 45.2 11.8 6660 126 1.0 Synchronous Side

NTMFD4C86N PowerPhase Asym

Dual

N30 20 5.4 8.1 10.9 5.4 1252 126 1.0 Control Side

N30 20 2.1 3.0 21.6 5.5 3040 77 1.0 Synchronous Side

NTMFD4901NF SO-8FL Asym

Dual

N30 20 6.5 10.0 9.7 3.7 1150 105 0.8 Control Side

N + Int Sch 30 20 2.4 3.5 20.0 5.3 2950 82 0.8 Synchronous Side

NTMFD4C87N PowerPhase Asym

Dual

N30 20 5.0 7.7 10.9 5.4 1252 129 1.0 Control Side

N30 20 3.1 4.3 13.8 3.6 1939 49 1.0 Synchronous Side

NTMFD4C20N SO-8FL Asym

Dual

N30 20 7.0 10.8 9.3 4.2 970 125 1.0 Control Side

N30 20 3.4 5.2 13.0 3.0 1950 50 1.0 Synchronous Side

NTMFD4902NF SO-8FL Asym

Dual

N30 20 6.5 10.0 9.7 3.7 1150 105 0.8 Control Side

N + Int Sch 30 20 4.1 6.2 11.5 3.4 1510 83 0.8 Synchronous Side

NTLLD4901NF

8-FL/

WDFN-8

Asym

Dual

N30 20 20.0 30.0 5.5 1.4 605 100 0.8 Control Side

N + Int Sch 30 20 15.0 22.0 5.9 2.9 645 16 0.8 Synchronous Side

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Maximum Rating

(nC)

Qgd

(nC)

Ciss

(pF)

Crss

(pF)

(Ω)

VDS

(V)

VGS

(V)

RDS(ON) (mΩ)

Device Package Conﬁguration Polarity

VGS=

10 V

VGS=

4.5 V Applications

NTMFS4C01N SO-8FL Single N30 20 0.9 1.2 65.0 18.0 9200 231 1.0 HPPC

NTMFS4C03N SO-8FL Single N30 20 2.1 2.8 43.7 5.3 2850 72 1.0 HPPC

NTMFS4983NF SO-8FL Integ Sch N30 20 2.1 3.1 22.6 6.9 3250 90 1.0 Synchronous Side

NTMFS4C35N SO-8FL Single N30 20 3.2 4.2 15.0 5.5 2300 46 1.0 Synchronous Side

NTMFS4985NF SO-8FL Integ Sch N30 20 3.4 5.0 14.2 4.2 2100 60 1.0 Synchronous Side

NTMFS4C05N SO-8FL Single N30 20 3.4 5.0 13.0 3.0 1950 50 1.0 Synchronous Side

NTMFS4C06N SO-8FL Single N30 20 4.0 6.0 14.5 5.5 1988 71 1.0 Synchronous Side

NTMFS4C08N SO-8FL Single N30 20 5.8 8.5 8.7 2.8 1100 38 1.0 Synchronous Side

NTMFS4C09N SO-8FL Single N30 20 6.0 8.8 10.9 5.4 1252 126 1.0 Control Side

NTMFS4C10N SO-8FL Single N30 20 7.0 10.8 9.3 4.2 970 125 1.0 Control Side

NTMFS4C13N SO-8FL Single N30 20 9.1 13.8 6.6 2.7 720 95 1.0 Control Side

NTTFS4C05N µ8-FL Single N30 20 3.6 5.1 13.0 3.0 1950 50 1.0 Synchronous Side

NTTFS4C06N µ8-FL Single N30 20 4.0 6.0 14.5 5.5 1988 71 1.0 Synchronous Side

NTTFS4C08N µ8-FL Single N30 20 5.8 8.5 8.7 2.8 1100 38 1.0 Synchronous Side

NTTFS4C10N µ8-FL Single N30 20 7.4 11.0 9.3 4.2 970 125 1.0 Control Side

NTTFS4C13N µ8-FL Single N30 20 9.1 13.8 6.6 2.7 720 95 1.0 Control Side

NTTFS4C25N µ8-FL Single N30 20 17.0 26.5 4.0 1.3 455 60 1.0 Control Side

NTD4904N DPAK Single N30 20 3.7 5.5 16.8 3.0 3052 23.0 1.0 Synchronous Side

NTD4965N DPAK Single N30 20 4.7 7.0 17.5 8.5 1684 330 0.8 Synchronous Side

NTD4906N DPAK Single N30 20 5.5 8.0 11.0 1.8 1932 19 1.0 Synchronous Side

NTD4969N DPAK Single N30 20 9.0 12.0 8.7 4.0 835 163 0.7 Control Side

NTD4970N DPAK Single N30 20 11.0 15.0 7.7 3.7 743 330 0.9 Control Side

NTMS4937N SOIC-8 Single N30 20 6.5 8.7 17.4 3.3 2563 25 1.0 Synchronous Side

NTMS4939N SOIC-8 Single N30 20 8.4 11.0 12.4 1.9 2000 16 0.7 Synchronous Side

NTMS4916N SOIC-8 Single N30 20 9.0 12.0 14.0 7.0 1468 280 0.7 Control Side

NTMS4917N SOIC-8 Single N30 20 11.0 15.0 10.8 3.5 1132 216 0.7 Control Side

NTMS4800N SOIC-8 Single N30 20 20.0 27.0 7.7 3.2 940 125 1.5 Control Side

NTMS4840N SOIC-8 Single N30 20 24.0 36.0 4.8 1.9 520 70 2.0 Control Side

NTMD4820N SOIC-8 Dual N30 20 20.0 27.0 7.7 3.2 940 125 1.5 DC-DC, Load Switch

NTMD4840N SOIC-8 Dual N30 20 24.0 36.0 4.8 1.9 520 70 1.0 DC-DC, Load Switch

NTMS4177P SOIC-8 Single P-30 20 12.0 19.0 29.0 13.0 3100 370 2.0 Load Switch

NTMS4176P SOIC-8 Single P-30 25 18.0 30.0 17.0 8.4 1720 256 2.9 Load Switch

MOSFETs Provide Optimized Efﬁciency

Page 9ON Semiconductor

SO-8FL

5 x 6 mm

µ8FL

3.3 x 3.3 mm

SOIC-8

5 x 6 mm

DPAK

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MOSFETs Provide Optimized Efﬁciency

Trench 6 High Efﬁciency (T6HE) for Servers and

Point-of-Load Modules

• High Efﬁciency DC-DC Conversion

• Integrated Schottky Lowsides

• Lowest RDS(on) in the industry

Maximum Rating

(nC)

Qgd

(nC)

Ciss

(pF)

Crss

(pF)

(Ω)

VDS

(V)

VGS

(V)

RDS(ON) (mΩ)

Device Package Conﬁg Polarity

VGS=

10 V

VGS=

4.5 V Applications

NTMFS4H01N SO-8FL Single N25 20 0.7 1.0 39.0 8.5 5693 212 1.2 Synchronous Side

NTMFS4H01NF SO-8FL Integ Sch N25 20 0.7 1.0 37.8 8.0 5538 175.3 1.3 Synchronous Side

NTMFS4H013NF SO-8FL Integ Sch N25 20 0.9 1.3 28.0 7.5 3780 150 1.0 Synchronous Side

NTMFS4H02N SO-8FL Single N25 20 1.4 2.2 18.0 4.2 2651 103 1.0 Synchronous Side

NTMFS4H02NF SO-8FL Integ Sch N25 20 1.4 2.3 18.7 4.3 2652 94 1.0 Synchronous Side

NTTFS4H05N µ8-FL Single N25 20 3.3 4.8 8.7 1.9 1205 45 1.0 Control Side

NTTFS4H07N µ8-FL Single N25 20 4.8 7.1 5.7 1.3 771 34 1.0 Control Side

ON Semiconductor offers a range of switching devices for high speed interface in servers, desktop computing, notebook and netbook

computers. Applications include PCI Express, DisplayPort, Gigabit Ethernet and USB 2.0.

Switching Devices

Processor

Gigabit LAN

Transceiver

Internal

Graphics

Processor

External

Graphics

Processor

North Bridge

(ICH)

South Bridge

(MCH)

VGA Switch

Docking Station Connector

PCIe

Switch

HDMI/DVI

Switch

LAN Switch

USB Power/

Data Switch

Codec

Stereo Switch

Mic Switch

TMDS

DisplayPort

Switch

2nd LCD

Display

LCD

Panel

Audio

Amp

Server Implementation

Device Interface Data Rate

Channels

Quiescent

Current

NCN3612B PCIe 3.0, DisplayPort 1.2 8 Gb/s

250 µA

NCN3411 PCIe 3.0 8 Gb/s 8

200 µA

NCN2612B PCIe 2.0, DisplayPort 1.1 5 Gb/s 12

250 µA

NS3L500 Gigabit Ethernet 1 Gb/s 11

250 µA

NCN1188 USB 2.0 / MHL 2.25 Gb/s 2

21 µA

NS5S1153 USB 2.0 480 Mb/s 2

21 µA

NLAS7242 USB 2.0 480 Mb/s 2

1 µA

NLAS52231 Audio 36 MHz 2

1 µA

NLAS4684 Audio 9.5 MHz 2

180 nA

Page 10 Computing Solutions

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Page 11ON Semiconductor

• Copackaged MOSFET plus CMOS controllers – value-added features plus high performance

• Monolithic CMOS smart load switches – value added features, low cost

• Discrete MOSFETs – simple, high performance

ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees.

NCP45xxx Integrated Load Switch Feature

• Simple/clean design

• No current consumption in standby power mode

• Small PCB footprint

• Low RDS(ON) due to charge pump driving NMOS

• Adjustable soft-start time (SR)

• Adjustable integrated discharge

• Fault protection

• Power rail monitoring & sequencing

Thermal,

Undervoltage

Short-Circuit

Protection

Control

Logic

Bandgap

Biases

Delay and

Slew Rate

Control

Charge

Pump

VIN

VOUTBLEEDGNDSR

PGENVCC

Type Device

ron

(mΩ)

I Max

(A)

VI Min

(V)

VI Max

(V)

(

A) Discharge

Slew Rate

(

s) Features Package(s)

Smart Load Switch

NCP330 26 at 3.3 V 3 1.8 5.5 100 - 2000 Reverse blocking TDFN-4

NCP333 55 at 3.3 V 1.5 1.2 5.5 1Auto 95 - WLCSP-4

NCP334 47 at 3.3 V 2 1.2 5.5 1 - 71 - WLCSP-4

NCP335 47 at 3.3 V 2 1.2 5.5 1Auto 71 - WLCSP-4

NCP336 23 at 3.3 V 3 1.2 5.5 1 - 810 - WLCSP-6

NCP337 23 at 3.3 V 3 1.2 5.5 1Auto 810 - WLCSP-6

NCP338 27 at 1.8 V 2 1 3.6 0.6 Auto 20 - WLCSP-6

NCP339 26 at 3.3 V 3 1.2 5.5 2 - 2700 Reverse blocking WLCSP-6

NCP432 50 at 1.8 V 1.5 13.6 0.6 - 20 - WLCSP-4

NCP433 50 at 1.8 V 1.5 13.6 0.6 Auto 20 - WLCSP-4

NCP434 43 at 1.8 V 2 1 3.6 0.6 - 61 - WLCSP-4

NCP435 43 at 1.8 V 2 1 3.6 0.6 Auto 61 - WLCSP-4

NCP436 23 at 1.8 V 3 1 3.6 1 - 27 - WLCSP-6

NCP437 23 at 1.8 V 3 1 3.6 1Auto 27 - WLCSP-6

ecoSWITCH™ Integrated

Load Switch

NCP45524 18.0 60.5 13.5 -Adj - Power good DFN-8

NCP45525 18.0 60.5 13.5 -Adj Adj -DFN-8

NCP45560 2.4 24 0.5 13.5 -Adj Adj Power good; Fault DFN-12

NCP45540 3.3 20 0.5 13.5 -Adj Adj Power good; Fault DFN-12

NCP45541 3.3 20 0.5 13.5 -Adj Adj Power good DFN-12

NCP45520 9.5 10.5 0.5 13.5 -Adj - Power good; Fault DFN-8

NCP45521 9.5 10.5 0.5 13.5 -Adj Adj Fault DFN-8

Advanced Load Switches

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Page 12 Computing Solutions

Electronic Fuse (eFuse) for SAS, SATA, eSATA, USB

3.3 V, 5 V, and 12 V Power Bus Protection

Features

• Low RDS(ON), high operating and trip currents

(IOP, ITRIP)

• Overvoltage protection

• Precise ITRIP control

• Slew rate control

• Thermal shut-down

• EN pin for synchronizing multiple eFuses

• Outperforms poly-fuses:

– Tighter spec tolerances

– Lower resistance

– Lower trip-time

– Superior repeatability

Charge

Pump

Enable

Enable/

Fault

GND

Source

ILimit

dV/dt

Current

Limit

Voltage

Clamp

dV/dt

Control

Thermal

Shutdown

UVLO

VCC

Typical Feature Set for eFuse

Device

Input Voltage

(V)

Output Clamping

Voltage

(V)

ITRIP

Trip Current

(A)

RDS(ON)

(mΩ)

Auto Recovery

Option Latching Option Package

NIS5112 -0.6 to 18 15 2.5 (adjustable) 28 Yes Yes SOIC-8

NIS5132 -0.6 to 18 15 3.5 (adjustable) 44 Yes Yes DF N-10

NIS5232 -0.6 to 18 15 4.0 (adjustable) 44 No Yes DFN-10

NIS5135 -0.6 to 18 6.65 3.5 (adjustable) 68 Yes Yes DFN-10

NIS5452* -0.6 to 14 5.85 3.5 (adjustable) 33 Yes Yes WDFN-10

NIS 54 31* -0.6 to 14 3.85 2.0 (adjustable) 40 No Yes WDFN-10

* Pending 1H16.

5 V Power Bus

SATA/eSATAp

Power

NIS5452

NIS5020*

NIS5820*

RLIM

ENABLE

12 V Power Bus

RLIM

3 V Power Bus

NIS5431

RLIM

ENABLE

12 V

GND

5 V

GND

3.3 V

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Page 13ON Semiconductor

Ethernet: 10/100BASE-T, 1000BASE-TX, and Gigabit

Four Pairs, Low Capacitance Surge and ESD Protection

Line-to-Line Surge

Line Side : LC03-6 (optional)

Transformer Side: TVS8818

Protection against metallic (transverse) strikes

Typical Application

Features

• Line-to-line capacitance < 3 pF

• Vclamp (25 A surge) < 11 V

• IEC 61000-4-2 rating > 30 kV

• No latching danger

• Surge rating maintained to 125°C

Beneﬁts

• Compatible with Gb Ethernet and beyond

• Enhanced protection for downstream electronics

• Accommodates operating transients above 3.3 V

• Small form-factor allows integration into connectors

The 1000BASE-T or Gigabit Ethernet interface operating at higher bitrates is susceptible to ESD strikes, cable-discharge events and

lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.

C5VDD

TVS8818

LC03

C6VDD

LC03

C7VDD

LC03

C8VDD

LC03

TPOPA

TPONA

TPOPB

TPONB

TPOPC

TPONC

TPOPD

TPOND

A+

A-

B+

B-

C+

C-

D+

D-

1000BASE-T

ETHERNET TRANSCEIVER

TRANSFORMER

RJ45

-10 0

10 20 30

Time (μs)

Voltage (V), Current (A)

40 50 60

8/20 μs

Surge Current

ON Semiconductor

Voltage

Competitor

Voltage

RJ-45 Connector

Flow Through

Routing

TVS8818

Transient Voltage Suppressors

Device

VDC Max

(V)

Line

Transient

Max

(V)

Surge IPP,

8/20 ms

(A)

Typical

Line-Line

Capacitance

(pF)

ESD

Contact

Rating

(kV) Package

LC03-6 6.7 7.0 100 8.0 ±30 SOIC-8

TVS4201 5.0 6.0 25 1.5 ±30 TSOP-6

TVS8814 3.0 3.2 35 1.5 ±30 UDFN-8

TVS8818 3.0 3.2 35 1.5 ±30 UDFN -10

NUP4114H 5.0 5.0 12* 0.4 ±13 TSOP-6

SRDA3.3 3.3 5.0 25 4.0 ±8 SOIC-8

SRDA05 5.0 7.0 23 5.0 ±8 SOIC-8

* On Pin 5.

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Page 14 Computing Solutions

USB 3.x Type A Connector

Two SuperSpeed Pairs, One High Speed Pair, VCC, Low Capacitance ESD Protection

Key Requirement

• Cap < 0.7 pF

Features

• 0.35 pF

• Flow through routing

• Industry leading low clamping voltage

versus competitors

Device Interface Data Lines

Capacitance

(pF) Package

Size

(mm)

ESD8704* USB 3.x 2 Pair (Tx, Rx) 0.35 UDFN-10 2.5 x 1.0

ESD7L USB 3.x 1 Pair (D+/-) 0.5 SOT-723 1.2 x 1.2

ESD8504 USB 3.0 2 Pair (Tx, Rx) 0.4 UDFN-10 2.5 x 1.0

ESD8104 USB 3.0 2 Pair (Tx, Rx) 0.3 UDFN-10 2.5 x 1.0

ESD8116 USB 3.0 3 Pair (Tx, Rx, D+/-) 0.3 UDFN-8 2.0 x 1.2

ESD8011 USB 3.x Single Line 0.10 X3DFN-2 0.62 x 0.32

ESD8101 USB 3.x Single Line 0.20 DSN-2 0.43 x 0.23

ESD8111 USB 3.x Single Line 0.20 WLCSP-2 0.6 x 0.3

ESD8006 USB 3.0 3 Pair (Tx, Rx, D+/-)

0.25

UDFN-8 3.3 x 1.0

ESD8116

StdA_SSTX+

StdA_SSTX-

GND_DRAIN

StdA_SSRX+

StdA_SSRX-

USB 3.0 Type A

Connector

GND

D-

D+

D-

D+

Vbus

StdA_SSTX+

D-

StdA_SSTX-

D+

GND_DRAIN

GND

StdA_SSRX+

StdA_SSRX-

ESD8704

ESD7L5.0

Top layer

Other layer

USB 3.0/3.1 Type A

Connetcor

ESD8704 — 0.35 pF, 2 Layer Routing

(ESD8704; ESD7L5.0 for D+, D- Lines)

ESD8116 — 0.30 pF, 1 Layer Routing

USB 3.0 @ 5 Gb/s

Without ESD With ESD

I/O

3. . . . . I/O

(N-2)

I/O

(N-1)

* Pending 1H16.

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Page 15ON Semiconductor

USB 3.x Type C Connector

Key Requirement

• Cap < 0.5 pF

Features

• 0.35 pF

• Flow through routing

• Industry leading low

clamping voltage versus

competitors

Device Data Lines

Capacitance

(pF) Package

Size

(mm)

ESD8704* 2 Pair (Tx, Rx) 0.37 UDFN-10 2.5 x 1.0

ESD7104 2 Pair (CC, SBU, D+/-) 0.30 UDFN-10 2.5 x 1.0

ESD8011 Single Line (Tx, Rx) 0.10 X3DFN-2 0.62 x 0.32

ESD8101 Single Line (Tx, Rx) 0.20 DSN-2 0.43 x 0.23

ESD8111 Single Line (Tx, Rx) 0.20 WLCSP-2 0.6 x 0.3

ESD8472 Single Line (CC, SBU, D+/-) 0.20 X3DFN-2 0.62 x 0.32

ESD7471 Single Line (CC, SBU, D+/-) 0.24 XDFN-2 (SOD-882) 1.0 x 0.6

* Pending 1H16.

USB3.1 Eye Diagram with and without ESD8704. 10 Gb/s

Without ESD With ESD

ESD7104

ESD8704

GND

Type-C Hybrid

Top Mount Connector

TX1+

GND

TX1-

CC1

Vbus

D+

SBU1

D-

Vbus

RX2+

RX2-

Top Layer

ESD7104

ESD8704

Bottom Layer

ESD8704

GND

Type-C Hybrid

Top Mount Connector

TX1+

GND

TX1-

CC1

Vbus

D+

SBU1

D-

Vbus

RX2+

RX2-

Top Layer

ESD8704

Bottom Layer

= ESD7471/

ESD8472

= ESD7471/

ESD8472

ESD9X

TX2+

GND

TX2-

RX1-

Vbus

SBU1

CC1

Vbus

RX1-+

D-

D+

TX2+

GND

TX2-

RX1-

Vbus

SBU1

CC1

Vbus

RX1-+

D-

D+

= Bottom Layer

= Top Layer

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Page 16 Computing Solutions

USB 2.0

One High Speed Pair, VCC, Low Capacitance ESD Protection

Key Requirement

• Cap < 5 pF

Features

• 0.35 - 3.0 pF

• Multi-part solutions available

• Industry leading low clamping voltage

Device Data Lines

Capacitance

(pF) Package

Size

(mm)

NUP2114UPX 1 Pair (D+/-) + Vbus 0.8 SOT-553 1.2 x 1.6

NUP2114UCM 1 Pair (D+/-) + Vbus 0.8

TSOP-6 3.0 x 2.75

NUP4114UPX 2 Pair (D+/-) + Vbus 0.5

SOT-563 1.6 x 1.6

NUP4114UCL 2 Pair (D+/-) + Vbus 0.5

SC-88 2.0 x 2.1

NUP4114H 2 Pair (D+/-) + Vbus 0.5

TSOP-6 3.0 x 2.75

TVS4201MR6 2 Pair (D+/-) + Vbus 3

TSOP-6 3.0 x 2.75

ESD7L5.0 20.5

SOT-723 1.2 x 1.2

ESD8351MUT 1

0.37

X3DFN-2 0.6 x 0.3

ESD8351P2T 1

0.37

SOD-923 1.0 x 0.6

ESD9L5.0 1

0.5

SOD-923 1.0 x 0.6

I/O 1 I/O 2

I/O 3 I/O 4

One High Speed Pair, VCC, Common Mode Filter + ESD Protection

Key Requirement

• Cap < 5 pF

• Common Mode Filtering

Features

• 0.5 - 0.8 pF

• Integrated EMI suppression with ESD protection

• Industry leading low clamping voltage

Device Pairs

Capacitance

@ 2.5 V (pF)

CM Attenuation

@ 800 MHz (–dB)

DM Bandwidth

F3dB (GHz) Package

Size

(mm)

EMI2121 1

0.9 –25 2.5

WQFN 2.2 x 2.0 x 0.75

USB 2.0 @ 480 Mb/s

D+

D-

VBUS

Top layer

Other layer

GND

Micro USB

Connector

EMI2121

-35

-30

-25

-20

-15

-10

-5

1.E+06 1.E+07 1.E+08 1.E+09

Frequency

Common

Mode

Differential

Mode

Suppresses Common Mode Noise

Deeper than Competing Passive Solution

VBUS

D+

D-

Gnd

VBUS

D+

D-

Gnd

NUP4114

USB

Host

Controller

VBUS

D+

D-

Gnd

NUP2114

USB

Host

Controller

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Page 17ON Semiconductor

ESD8116

CONFIG1

CONFIG2

GND

Aux+

Aux–

Thunderbolt Connetctor

Bottom Layer

Thunderbolt Connetctor

Top Layer

GND

ML3–

ML3+

Hot Plug Detect

PWR

ML1+

ML1–

ML0+

ML0–

ML2+

ML2–

Top layer

Bottom layer

ESD8116

ESD9X

GND

Key Requirement

• Capacitance < 0.4 pF

Features

• Capacitance of 0.35 pF or lower

• Integrated solution in 2.0 x 1.2 mm package

• Grounds between pairs to reduce cross-talk

• Flow-through routing

• Industry leading clamping voltage

Thunderbolt

Four High Speed Pairs, up to Six Additional Lines, Low Capacitance ESD

Thunderbolt @ 10 Gb/s

I/O

Common GND = Pins 2, 3

Device Data Lines

Capacitance

(pF) Package

Size

(mm)

ESD8006 3 Pair 0.25 UDFN-8 3.3 x 1.0

ESD8116 3 Pair 0.30 UDFN-8 2.0 x 1.2

ESD8011 Single Line 0.10 X3DFN-2 0.62 x 0.32

ESD8101 Single Line 0.20 DSN-2 0.43 x 0.23

Without ESD8116 With ESD8116

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Page 18 Computing Solutions

HDMI, Display Port

Four High Speed Pairs, Up to Six Additional Interface Lines, Low Capacitance ESD

Key Requirement

• Cap < 0.5 pF

Features

• 0.3 pF ESD protection

• Flow through routing in high speed lines

• Industry leading low clamping voltage

NUP4114

ESD8118

HEC DATA

CEC

SCL

SDA

5 V

HPD

D2+

HDMI Type-A

Connector

D2-

GND

D1+

D1-

GND

D0+

D0-

GND

CLK+

CLK-

GND

ESD8118

Device Data Lines

Capacitance

(pF) Package

Size

(mm)

ESD8104 4 (TMDS) 0.3 UDFN-10 2.5 x 1.0

ESD8118 8 (TMDS) 0.3 UDFN-10 3.2 x 1.2

ESD8040 14 (TMDS + Low Speed + Power) 0.3 UDFN-18 5.5 x 1.5

NUP4114UPX 5 (4 Low Speed + Power) 0.5 SOT-563 1.6 x 1.6

NUP4114UCL 5 (4 Low Speed + Power) 0.5 SC-88 2.0 x 2.1

NUP4114H 5 (4 Low Speed + Power)

0.5

TSOP-6 3.0 x 2.75

I/O

3. . . . . I/O

(N-2)

I/O

(N-1)

HDMI 2.0 Eye Diagram with and without ESD8104. 6 Gb/s

Without ESD With ESD

D2+

D2-

GND

D1+

D1-

GND

D0+

D0-

GND

CLK+

CLK-

GND

Top layer

Other layer

ESD8040

HDMI Type-A Connector

N/C (or HEC_DAT - HDMI1.4)

CEC

SCL

SDA

5 V

HPD (and HEC_DAT - HDMI1.4)

GND

ESD8040

• MediaGuard fully integrated solution

• Includes ethernet protection (HDMI1.4)

• Backdrive current protection

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Page 19ON Semiconductor

Serial EEPROMs

EasyPRO™ is a user-friendly, portable

programming tool for ON Semiconductor

serial EEPROMs (I2C, SPI, Microwire)

Features

•

Broad density range: 1 kb to 2 Mb

•

Wide operating Vcc range: 1.8/1.7 V to 5.5 V

•

High endurance: 1 million program/erase cycles

•

Wide temperature range: industrial and extended

EEPROMs

Data

Transmission

Standard Device Density Organization*

VCC Min

(V)

VCC Max

(V)

fCLK Max

(MHz) Package(s)

I2C

CAT24M01 1 Mb 128k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8

CAT24C512 512 kb 64k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8

CAT24C256 256 kb 32k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8

CAT24C128 128 kb 16k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8

CAT24C64 64 kb 8k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4

CAT24C32 32 kb 4k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5

CAT24C16 16 kb 2k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C08 8 kb 1k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C04 4 kb 512 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

CAT24C02 2 kb 256 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5

SPI

CAT25M02 2 Mb 256k x 8 1.7 5.5 10 SOIC-8

CAT25M01 1 Mb 128k x 8 1.8 5.5 10 SOIC-8, TSSOP-8

CAT25512 512 kb 64k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25256 256 kb 32k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25128 128 kb 16k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25640 64 kb 8k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25320 32 kb 4k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25160 16 kb 2k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25080 8 kb 1k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25040 4 kb 512 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25020 2 kb 256 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

CAT25010 1 kb 128 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8

Microwire

CAT93C86 16 kb 2k x 8 / 1k x 16 1.8 5.5 3 SOIC-8

CAT93C86B 16 kb 2k x 8 / 1k x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

CAT93C76 8 kb 1k x 8 / 512 x 16 1.8 5.5 3 SOIC-8, TSSOP-8

CAT93C76B 8 kb 1k x 8 / 512 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

CAT93C66 4 kb 512 x 8 / 256 x 16 1.8 5.5 2 SOIC-8, TSSOP-8

CAT93C56 2 kb 256 x 8 / 128 x 16 1.8 5.5 2 SOIC-8, TSSOP-8

CAT93C46 1 kb 128 x 8 / 64 x 16 1.8 5.5 2 SOIC-8, TSSOP-8

CAT93C46B 1 kb 128 x 8 / 64 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8

* Organization for Microwire devices is selectable.

Application Speciﬁc EEPROMs

Data

Transmission

Standard Device Density Organization

VCC Min

(V)

VCC Max

(V)

fCLK Max

(MHz) Package(s) Notes

I2C CAT24C208 8 kb 1024 x 8 2.5 5.5 0.4 SOIC-8 VESA™ dual-port serial EEPROM

I2C CAT34C04* 4 kb 512 x 8 1.7 5.5 1 UDFN-8 Serial Presence Detect (SPD) I2C EEPROM for DDR4 DIMM

I2C/SMBus CAT34TS04 4 kb 512 x 8 2.2 5.5 1 TDFN-8, UDFN-8 4 kb SPD EEPROM w/ Temperature Sensor for DDR4 DIMM

I2C CAT34C02 2 kb 256 x 8 1.7 5.5 0.4 UDFN-8, TDFN-8,

TSSOP-8 Serial Presence Detect (SPD) I2C EEPROM for DDR3 DIMM

I2C/SMBus CAT34TS02 2 kb 256 x 8 3.0 3.6 0.4 TDFN-8, UDFN-8 2 kb SPD EEPROM w/ Temperature Sensor for DDR3 DIMM

* Pending 1H16.

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Device

Number

of Inputs Input Type

fin Typ

(MHz)

Number

of Outputs

Output

Type

fout Typ

(MHz)

Spread Spectrum

Outputs Package

NB3N3002 1Crystal; LVCMOS; LVTTL 25 1HCSL 25; 100; 125; 200 No TSSOP-16

NB3N5573 1Crystal; LVCMOS; LVTTL 25 2HCSL 25; 100; 125; 200 No TSSOP-16

NB3N51032 1Crystal; LVCMOS; LVTTL 25 2HCSL 25; 100; 125; 200 Yes TSSOP-16

NB3N51034 1Crystal; LVCMOS; LVTTL 25 4HCSL 100: 200 Yes TSSOP-20

NB3N51044 2Crystal; LVCMOS; LVTTL 25 4HCSL 100: 125 No TSSOP-28

NB3N51054 1Crystal; LVCMOS; LVTTL 25 4HCSL 100 Yes TSSOP-24

Page 20 Computing Solutions

Phase

Detector

Charge

Pump HSCL

Output

Clock Buffer

Crystal Oscillator

CLK0

X1/CLK

VCO

25 MHz Clock or

Crystal

GND

VDD

S0 S1 OE IREF

HSCL

Output CLK1

CLK1

NB3N5573 Simpliﬁed Logic Diagram

Clock Synthesizers for High Performance Computing

Features

• Uses 25 MHz fundamental mode parallel resonant crystal

• PCI-e Gen 1,2 & 3 jitter complaint HCSL differential outputs

• NB3N50134 features conﬁgurable spread spectrum outputs

• NB3N51044 features individual OE control signal for each output, PLL bypass

mode and an Input multiplexer

• NB3N51054 features I2C interface for OE control and conﬁgurable spread

spectrum outputs

• 3.3 V supply

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Device Ratio

Additive

tJitter(RMS) Typ

(ps)

tskew(o-o) Max

(ps)

tpd Typ

(ns)

tR & tF Max

(ps)

fmaxClock Typ

(MHz) Package

NB3L202K* 1:2 0.046 30 1125 350 QFN-16

NB3L204K* 1:4 0.046 30 1125 350 QFN-24

NB3N106K 1:6 0.1 100 0.8 400 400 QFN-24

NB3L208K 1:8 0.046 30 1125 350 QFN-32

NB3N108K 1:8 0.1 100 0.8 400 400 QFN-32

NB3N111K 1:10 0.1 100 0.8 400 400 QFN-32

NB4N111K 1:10 <1 100 0.8 700 400 QFN-32

NB3N121K 1:21 0.1 100 0.8 700 400 QFN-52

NB4N121K 1:21 <1 50 0.8 700 200 QFN-52

Q19

Q20

CLK

VCC

GND RREF

IREF

VTCLK

Page 21ON Semiconductor

NB3N121K Logic Diagram

Fanout Buffers for High Performance Computing

Features

• DC up to 400 MHz

• Accepts LVPECL, LVDS, HCSL, and single-ended inputs

• Typical input clock frequencies: 100, 133, 156.25, 166, 322.26, or 400 MHz

• Typical propagation delay: 800 ps

• HCSL differential outputs

• Integrated 50 Ω input termination resistors

• IREF pin enables setting of output drive

• Additive phase jitter 0.1 ps typical @ 100 MHz; PCI-e Gen 3 jitter complaint

• Additive phase jitter 80 fs maximum @ 156.25 MHz with NB3L208K, NB3L204K,

NB3L202K; DB800H, DB400H, DB200H compliant

* Pending 1H16.

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Page 22 Computing Solutions

Computing Clock for Graphics

P1P8160A Features

• Provides reference clock to the GPU & reduces EMI in the GDDR interface

• Input frequency 27 MHz; crystal or reference clock

• Output frequency 100 MHz spread spectrum clock; 27 MHz RefOUT

• Two tri-level logic pins for selecting eight frequency deviations along with SSOFF

• Modulation rate at 100 MHz: 32 kHz

• Low cycle-cycle & long term jitter

• Supply voltage: 3.3 V ±10%

• WDFN-10 package

D-Sub D-Sub D-Sub D-Sub

SS_clock

Non_SS_clock

27 MHz

100 MHz_SS_clock

DDR

Controller

GPU

Core

Radeon HD 6000/5000 Series

PLL P1P8160A

P1P8160A for AMD Graphics Card Application

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Page 23ON Semiconductor

NB3N1200K Simpliﬁed Block Diagram

IREF**

FB_OUT*

DIF_[11:0]

Control

Logic

CLK_IN

SSC Compatible

PLL

SA_0

SA_1

SDA

SCL

MUX

* FB_OUT pins are for NB3N1200K only; they are NC for NB3W1200L

** IREF pin is for NB3N1200K only; it is NC for NB3W1200L

100M_133M#

PWRGD/PWRDN#

HBW_BYPASS_LBW#

OE_[11:0]#

CLK_IN#

DIF_[11:0]#

RREF

FB_OUT#*

Device Ratio Output

tJitter(Cy-Cy) Typ

(ps)

tskew(I-o) Max

(ps)

tskew(o-o) Max

(ps)

Edge Rate Max

(V/ns) Package

NB3W800L 1:8 Low power NMOS push-pull 34 ±100 50 4QFN-48

NB3N1200K 1:12 HCSL 50 ±100 50 4QFN-64

NB3W1200L 1:12 Low power NMOS push-pull 50 ±100 50 4QFN-64

NB3N1900K 1:19 HCSL 50 ±100 65 4QFN-72

NB3W1900L 1:19 HCSL 50 ±100 85 4QFN-72

Zero Delay Buffers Compliant with DB Specifications

Features

• Differential SRC clock support

• NB3N1900K, NB3N1200K: DB1900Z and DB1200Z compliant with 19 and 12 output pairs respectively

• NB3W1200L, NB3W800L: DB1200ZL and DB800ZL compliant with 12 and 8 low power NMOS push-pull

output pairs respectively

• NB3W1900L: 19 low power NMOS push-pull output pairs

• Optimized for 100 MHz and 133 MHz to meet PCIe* Gen 2/Gen 3 and Intel QPI phase jitter speciﬁcations

• Spread spectrum compatible for low EMI

• Pseudo-external ﬁxed-feedback for low input-to-output delay variation

• Individual OE control pin for each output

• SMBUS programmability for power down mode, PLL BW modes, PLL/Bypass mode & frequency selection

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BRD8025/D

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