2322 661 97... Vishay BCcomponents Horizontal Surface Mount PTC Thermistors For Overload Protection FEATURES * * * * * * Ideal for pick-and-place circuit assembly Low mounting height Suitable for reflow soldering Small ceramic diameter for faster response Low heat transfer to substrate Flat terminations for stable positioning and good solderability. APPLICATIONS * Telecom - Central office switching (C.O.) - Subscriber terminal equipment (T.E.) - Set top box - Modems - Cable TV communications * General industry and automotive - Low power supplies overload protection - Data bus protection. QUICK REFERENCE DATA VALUE STANDARD TELECOM TYPES(1)(2) TYPES(1)(2) DESCRIPTION Nominal R25 Resistance tolerance Maximum overload current (voltage dependent) 2 to 500 10 to 70 10%; 15%; 20% 2 to 10 A Non-trip current Maximum voltage 50 to 500 mA at 25 C 50 to 100 mA at 70 C 16 to 400 V (RMS) 220 to 600 V ( RMS) Response time at 25 C and 20 W overload power Matching Maximum continuous power at DESCRIPTION The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate. <1 s The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux. down to 0.5 2W - Notes 1. Customized products are available on request. 2. Coated and/or reinforced types are available on request. MARKING * All SMD PTCs are marked with the last 3-digits of the type number (XXX) and a date code (YYWW). ELECTRICAL DATA AND ORDERING INFORMATION RESISTANCE R25 TOL ( ) (%) Telecommunication types 10 20 10 20 40 25 25 20 - 15 to 20 15 to 20 - 20 20 35 +15/-20 50 20 General industrial types 3.3 9.4 25 25 Int at It at MATCHING V MAX. (V) 25 C (mA) 70 C (mA) 25 C (mA) MAX. TRIP-TIME at 1 A (s) Imax at Vmax (A) CATALOG NUMBER 2322 661 ..... no 0.5 no 1 no 0.5 0.5 1 1 245 245 265 265 300 300 300 425 425 165 165 80 120 150 150 120 110 90 100 100 50 70 100 100 70 70 60 270 270 130 220 250 250 250 175 150 3.0 3.0 0.8 1.3 1.5 1.5 1.4 1.0 0.8 2.0 2.0 2.0 2.0 1.5 2.0 1.5 0.7 0.7 97012(1) 97016(1) 97002 97005(1) 97004(1) 97003(1) 97018(1) 97009(1) 97019 - - 24 60 400 150 - 100 650 300 6.0 1.8 8.0 3.0 97013(1) 97011(1) Note 1. These types pass ITU-K20-21-45 edition 2003 telecommunication protection recommendation. Document Number: 29068 Revision: 07-Sep-04 For technical questions contact: nlr.europe@vishay.com www.vishay.com 1 2322 661 97... Vishay BCcomponents Horizontal Surface Mount PTC Thermistors For Overload Protection DIMENSIONS OF SOLDER LANDS in millimeters PTC OUTLINES PTC SMD ceramic size: 6.5 mm. 7.2 0 -0.2 2 8.0 2 3.45 0.15 5 0.2 1 10 max. 0.6 3.6 0.1 7.6 0.25 1.2 +0.6 0 11 10 0.25 4 0.2 2.8 4 0.1 DIMENSIONS in millimeters MATERIAL INFORMATION 3 2 1 2 3 REF. DESCRIPTION MATERIAL AND REMARKS 1 ceramic BaTiO3 doped 2 metallization NiCr Ag layer (vacuum deposition) 3 leadframe Ni plated phosphor bronze material covered by PbSn8 solder layer SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with "CECC 00802". Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of a soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering. Vapour phase soldering. 300 300 10 s T T ( C) ( C) 260 C 245 C 250 250 215 C 200 40 s 180 C 150 20 to 40 s 10 s 215 C 200 180 C 150 130 C forced cooling 130 C 100 external preheating 100 C 100 2 K/s internal preheating, e.g. by infrared, max. 2 K/s 50 50 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted lines). 0 0 50 100 150 200 250 t (s) Typical values (solid line). Process limits (dotted lines). HANDLING PRECAUTIONS The special leadframe construction and the applied processes do not allow high handling forces on the component. Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to 10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered product. For those applications where higher handling forces can be present, a re-inforced version is available on request. www.vishay.com 2 For technical questions contact: nlr.europe@vishay.com Document Number: 29068 Revision: 07-Sep-04