2322 661 97...
Vishay BCcomponents
Document Number: 29068 For technical questions contact: nlr.europe@vishay.com www.vishay.com
Revision: 07-Sep-04 1
Horizontal Surface Mount PTC Thermistors
For Overload Protection
FEATURES
•
Ideal for pick-and-place circuit assembly
•
Low mounting height
•
Suitable for reflow soldering
•
Small ceramic diameter for faster response
•
Low heat transfer to substrate
•
Flat terminations for stable positioning and good
solderability.
APPLICATIONS
•
Telecom
– Central office switching (C.O.)
– Subscriber terminal equipment (T.E.)
– Set top box
– Modems
– Cable TV communications
•
General industry and automotive
– Low power supplies overload protection
– Data bus protection.
DESCRIPTION
The component consists of a high-performance PTC
ceramic disc mounted in a lead-frame for direct soldering
onto a printed-circuit board (PCB) or substrate.
The ceramic is soldered to the leadframe by a local reflow
process, during which the solder layer is melted to the
metallized ceramic surface using a low residue flux.
MARKING
•
All SMD PTCs are marked with the last 3-digits of the type
number (XXX) and a date code (YYWW).
Notes
1. Customized products are available on request.
2. Coated and/or reinforced types are available on request.
QUICK REFERENCE DATA
DESCRIPTION
VALUE
STANDARD
TYPES
(1)(2)
TELECOM
TYPES
(1)(2)
Nominal R25 2
to
500 10
to
70
Resistance tolerance
±
10%;
±
15%;
±
20%
Maximum overload current
(voltage dependent) 2 to 10 A
Non-trip current 50 to 500 mA
at 25
°
C
50 to 100 mA
at 70
°
C
Maximum voltage 16 to 400 V
(RMS)
220 to 600 V
( RMS)
Response time at 25
°
C and
20 W overload power <1 s
Matching
−
down to 0.5
Ω
Maximum continuous power at 2 W
Note
1. These types pass ITU-K20-21-45 edition 2003 telecommunication protection recommendation.
ELECTRICAL DATA AND ORDERING INFORMATION
RESISTANCE MATCHING
Ω
V
MAX.
(V)
I
nt
at I
t
at MAX.
TRIP-TIME
at 1 A (s)
I
max
at
V
max
(A)
CATALOG
NUMBER
2322 661 .....
R
25
(
Ω
)
TOL
(%)
25
°
C
(mA)
70
°
C
(mA)
25
°
C
(mA)
Telecommunication types
10 20 no 245 165 100 270 3.0 2.0 97012
(1)
10 20 0.5 245 165 100 270 3.0 2.0 97016
(1)
40 25 no 265 80 50 130 0.8 2.0 97002
25 20 1 265 120 70 220 1.3 2.0 97005
(1)
15 to 20
−
no 300 150 100 250 1.5 1.5 97004
(1)
15 to 20
−
0.5 300 150 100 250 1.5 2.0 97003
(1)
20 20 0.5 300 120 70 250 1.4 1.5 97018
(1)
35 +15/
−
20 1 425 110 70 175 1.0 0.7 97009
(1)
50 20 1 425 90 60 150 0.8 0.7 97019
General industrial types
3.3 25
−
24 400
−
650 6.0 8.0 97013
(1)
9.4 25
−
60 150 100 300 1.8 3.0 97011
(1)
www.vishay.com For technical questions contact: nlr.europe@vishay.com Document Number: 29068
2Revision: 07-Sep-04
2322 661 97...
Vishay BCcomponents
Horizontal Surface Mount PTC Thermistors
For Overload Protection
PTC OUTLINES
DIMENSIONS
in millimeters
DIMENSIONS OF SOLDER LANDS
in millimeters
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with
“CECC 00802”
. Soldering processes which can be
used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260
°
C during 10 s should
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a re-inforced version is available on request.
PTC SMD ceramic size: 6.5 mm.
3.6 ±0.1
10 ±0.25
8.0
2.8
2
4 ±0.1
4 ±0.2
0.2
10°
max.
1
7.6 ±0.25
0.6 +0.6
0
7.2 0
−0.2
3.45
±0.15
1.2
3
2
2
3
1
MATERIAL INFORMATION
REF. DESCRIPTION MATERIAL AND REMARKS
1ceramic BaTiO3 doped
2metallization NiCr Ag layer
(vacuum deposition)
3leadframe Ni plated phosphor bronze material
covered by PbSn8 solder layer
11
5
2
0 50 100 150 200 250
300
250
200
150
100
50
0
( C)
t (s)
215 C
180 C
20 to 40 s
internal preheating,
e.g. by infrared,
max. 2 K/s
100 C
130 C
external preheating
forced
cooling
T
Typical values (solid line).
Process limits (dotted lines).
Vapour phase soldering.
Reflow soldering.
Typical values (solid line).
Process limits (dotted lines).
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 C
130 C
( C)
t (s)
245 C
215 C
180 C
10 s
40 s
2 K/s
T
