AFBR-709SMZ
10Gb Ethernet, 850 nm, 10GBASE-SR/SW,
SFP+ Transceiver
Data Sheet
AFBR-709SMZ
Description
The Avago AFBR-709SMZ transceiver is part of a family of
SFP+ products. This transceiver utilizes Avago’s 850nm
VCSEL and PIN Detector technology to provide an IEEE
10Gb Ethernet design compliant with the 10GBASE-SR
and 10GBASE-SW standards. The AFBR-709SMZ trans-
ceiver is designed to enable 10Gb Ethernet equipment
designs with very high port density based on the new
electrical and mechanical specication enhancements
to the well known SFP specications developed by the
SFF Committee. These specications are referred to as
SFP+ to recognize these enhancements to previous SFP
specications used for lower speed products. Avago
Technologies is a an active participant in the SFF Com-
mittee specication development activities.
Related Products
• The AFBR-709ASMZ is an SFP+ 10 Gigabit Ethernet
10GBASE-SR/SW transceiver with case temperature
operated at 0-85 °C for use on multimode ber cables.
It is best suited for OM3 high bandwidth MMF link
applications with link lengths up to 300 meters.
• AFBR-707SDZ SFP+ 10 Gigabit Ethernet 10GBASE-
LRM transceiver for 220 meter operation in all MMF
link applications including OM1 and OM2 legacy ber
cables and new high bandwidth OM3 ber cables.
• AFCT-701SDZ (AFCT-701ASDZ) with case temperature
0-70 (0-85) °C SFP+ 10 Gigabit Ethernet 10GBASE-LR
transceiver for operation in SMF link applications to
10 km
• AFCT-5016Z SFP+ Evaluation Board The purpose of
this SFP+ evaluation board is to provide the designer
with a convenient means for evaluating SFP+ ber
optic transceivers.
Features
• Avago 850nm VCSEL source and Transmitter Optical
Subassembly technology
• Avago PIN detector and Receiver Optical Subassembly
technology
• Typical power dissipation 600mW
• Full digital diagnostic management interface
• Avago SFP+ package design enables equipment EMI
performance in high port density applications with
margin to Class B limits
Specications
• Optical interface specications per IEEE 802.3ae
10GBASE-SR and 10GBASE-SW
• Link lengths at 10.3125 GBd:
300m with 50um OM3 MM ber
400m with 50um OM4 MM ber
• Electrical interface specications per SFF Committee
SFF 8431 Specications for Enhanced 8.5 and 10
Gigabit Small Form Factor Pluggable Module “SFP+”
• Management interface specications per SFF
Committee SFF 8431 and SFF 8472 Diagnostic
Monitoring Interface for Optical Transceivers
• Mechanical specications per SFF Committee SFF
8432 Improved Pluggable Formfactor “IPF”
• LC Duplex optical connector interface conrming to
ANSI TIA/EA 604-10 (FOCIS 10A)
• Compliant to Restriction on Hazardous Substances
(RoHS) per EU and China requirements
• Class 1 Eye safe per requirements of IEC 60825-1 /
CDRH
Patent - www.avagotech.com/patents
2
Installation
The AFBR-709SMZ transceiver package is compliant
with the SFF 8432 Improved Pluggable Formfactor hous-
ing specication for the SFP+. It can be installed in any
INF-8074 or SFF-8431/2 compliant Small Form Pluggable
(SFP) port regardless of host equipment operating status
The AFBR-709SMZ is hot-pluggable, allowing the mod-
ule to be installed while the host system is operating and
on-line. Upon insertion, the transceiver housing makes
initial contact with the host board SFP cage, mitigating
potential damage due to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identication
The two-wire interface protocol and signaling detail
are based on SFF-8431. Conventional EEPROM memo-
ry, bytes 0-255 at memory address 0xA0, is organized
in compliance with SFF-8431. New digital diagnostic
information, bytes 0-255 at memory address 0xA2, is
compliant to SFF-8472. The new diagnostic information
provides the opportunity for Predictive Failure Identi-
cation, Compliance Prediction, Fault Isolation and Com-
ponent Monitoring.
Predictive Failure Identication
The AFBR-709SMZ predictive failure feature allows a host
to identify potential link problems before system perfor-
mance is impacted. Prior identication of link problems
enables a host to service an application via “fail over”
to a redundant link or replace a suspect device, main-
taining system uptime in the process. For applications
where ultra-high system uptime is required, a digital SFP
provides a means to monitor two real-time laser metrics
asso ciated with observing laser degradation and pre-
dicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-709SMZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify po-
tential component compliance issues. Received optical
power is also available to assess compliance of a cable
plant and remote transmitter. When operating out of re-
quirements, the link cannot guarantee error free trans-
mission.
Fault Isolation
The fault isolation feature allows a host to quickly pin-
point the location of a link failure, minimizing downtime.
For optical links, the ability to identify a fault at a local
device, remote device or cable plant is crucial to speed-
ing service of an installation. AFBR-709SMZ real-time
monitors of Tx_Bias, Tx_Power, Vcc, Temperature and
Rx_Power can be used to assess local transceiver current
operating conditions. In addition, status ags TX_DIS-
ABLE and Rx Loss of Signal (LOS) are mirrored in memory
and available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the AF-
BR-709SMZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or eld
qualication. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.
Description, continued
3
LIGHT FROM FIBER
LIGHT TO FIBER
PHOTO-DETECTOR
RECEIVER
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD– (RECEIVE DATA)
RX_LOS
VCSEL
TRANSMITTER
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD– (TRANSMIT DATA)
TX_FAULT
ELECTRICAL INTERFACE
SDA
SCL
MOD-ABS
CONTROLLER & MEMORY
OPTICAL INTERFACE
RS0
RS1
Figure 1. Transceiver functional diagram
Transmit Fault (TX_FAULT)
A catastrophic laser fault will activate the transmitter
signal, TX_FAULT, and disable the laser. This signal is
an open collector output (pull-up required on the host
board). A low signal indicates normal laser operation
and a high signal indicates a fault. The TX_FAULT will
be latched high when a laser fault occurs and is cleared
by toggling the TX_DISABLE input or power cycling the
transceiver. The transmitter fault condition can also be
monitored via the two-wire serial interface (address A2,
byte 110, bit 2).
Transmitter Section
The transmitter section includes the Transmitter Opti-
cal Sub-Assembly (TOSA) and laser driver circuitry. The
TOSA, containing an Avago designed and manufactured
850 nm VCSEL (Vertical Cavity Surface Emitting Laser)
light source, is located at the optical interface and mates
with the LC optical connector. The TOSA is driven by an
IC which uses the incoming dierential high speed logic
signal to modulate the laser diode driver current. This Tx
laser driver circuit regulates the optical power at a con-
stant level provided the incoming data pattern is DC bal-
anced.
Transmit Disable (TX_DISABLE)
The AFBR-709SMZ accepts an LVTTL compatible trans-
mit disable control signal input which shuts down the
transmitter optical output. A high signal implements this
function while a low signal allows normal transceiver op-
eration. In the event of a fault (e.g. eye safety circuit ac-
tivated), cycling this control signal resets the module as
depicted in Figure 6. An internal pull up resistor disables
the transceiver transmitter until the host pulls the input
low. TX_DISABLE can also be asserted via the two-wire
interface (address A2h, byte 110, bit 6) and monitored
(address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware TX_DISABLE (contact 3) to control transmitter
operation.
4
Receiver Section
The receiver section includes the Receiver Optical Sub-
Assembly (ROSA) and the amplication/quantization cir-
cuitry. The ROSA, containing a PIN photodiode and cus-
tom transimpedance amplier, is located at the optical
interface and mates with the LC optical connector. The
ROSA output is fed to a custom IC that provides post-
amplication and quantization.
Receiver Loss of Signal (Rx_LOS)
The post-amp IC also includes transition detection cir-
cuitry which monitors the AC level of incoming optical
signals and provides a LVTTL/CMOS compatible status
signal to the host. A high status signal indicates loss of
modulated signal, indicating link failures such as broken
ber or failed transmitter. Rx_LOS can also be monitored
via the two-wire serial interface(address A2h, byte 110,
bit 1).
Functional Data I/O
The AFBR-709SMZ interfaces with the host circuit board
through the twenty contact SFP+ electrical connector.
See Table 2 for contact descriptions. The module edge
connector is shown in Figure 4. The host board layout for
this interface is depicted in Figure 8.
The AFBR-709SMZ high speed transmit and receive in-
terfaces require SFF-8431 compliant signal lines on the
host board. To simplify board requirements, biasing re-
sistors and AC coupling capacitors are incorpo rated into
the SFP+ transceiver module (per SFF-8431) and hence
are not required on the host board. The TX_DISABLE, TX_
FAULT and RX_LOS signals require LVTTL signals on the
host board (per SFF-8431) if used. If an application does
not take advantage of these func tions, care must be tak-
en to ground TX_DISABLE to enable normal operation.
Figure 2 depicts the recom mended interface circuit to
link the AFBR-709SMZ to supporting physical layer ICs.
Timing for the dedicated SFP+ control signals imple-
mented in the transceiver are listed in Figure 6.
Application Support
An Evaluation Kit and Reference Designs are available to
assist in evaluation of the AFBR-709SMZ. Please contact
your local Field Sales representative for availability and
ordering details.
Caution
There are no user serviceable parts nor maintenance
requirements for the AFBR-709SMZ. All mechanical ad-
justments are made at the factory prior to shipment.
Tampering with, modifying, misusing or improperly han-
dling the AFBR-709SMZ will void the product warranty. It
may also result in improper operation and possibly over-
stress the laser source. Performance degrada tion or de-
vice failure may result. Connection of the AFBR-709SMZ
to a light source not compliant with IEEE Std. 802.3ae
Clause 52 and SFF-8341 specications, operating above
maximum operating conditions or in a manner inconsis-
tent with it’s design and function may result in exposure
to hazardous light radiation and may constitute an act
of modifying or manufacturing a laser product. Persons
performing such an act are required by law to recertify
and re-identify the laser product under the provisions of
U.S. 21 CFR (Subchapter J) and TUV.
Customer Manufacturing Processes
This module is pluggable and is not designed for aque-
ous wash, IR reow, or wave soldering processes.
Ordering Information
Please contact your local eld sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Ava-
go Technologies’ WEB page at www.avagotech.com For
information related to SFF Committee documentation
visit www.scommittee.org.
5
Electromagnetic Interference (EMI)
Equipment incorporating 10 gigabit transceivers is
typically subject to regulation by the FCC in the United
States, CENELEC EN55022 (CISPR 22) in Europe and VCCI
in Japan. The AFBR-709SMZ enables equipment compli-
ance to these standards detailed in Table 1. The metal
housing and shielded design of the AFBR-709SMZ mini-
mizes the EMI challenge facing the equipment designer.
For superior EMI performance it is recommended that
equipment designs utilize SFP+ cages per SFF 8432.
RF Immunity (Susceptibility)
Due to its shielded design, the EMI immunity of the AF-
BR-709SMZ exceeds typical industry standards.
Eye Safety
The AFBR-709SMZ provides Class 1 (single fault tolerant)
eye safety by design and has been tested for compliance
with the requirements listed in Table 1. The eye safety
circuit continuously monitors the optical output power
level and will disable the transmitter upon detecting a
condition beyond the scope of Class 1 certication Such
conditions can be due to inputs from the host board
(Vcc uctuation, unbalanced code) or a fault within the
transceiver. US CDRH and EU TUV certicates are listed
in table 1.
Flammability
The AFBR-709SMZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 ame retardant plastic.
Regulatory Compliance
The AFBR-709SMZ complies with all applicable laws
and regulations as detailed in Table 1. Certication level
is dependent on the overall conguration of the host
equipment. The transceiver performance is oered as a
gure of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-709SMZ is compatible with ESD levels found
in typical manufacturing and operating environments
as described in Table 1. In the normal handling and op-
eration of optical transceivers, ESD is of concern in two
circumstances.
The rst case is during handling of the transceiver prior
to insertion into an SFP compliant cage. To protect the
device, it’s important to use normal ESD handling pre-
cautions. These include use of grounded wrist straps,
work-benches and oor wherever a transceiver is han-
dled.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
system level ESD requirements.
6
Table 1. Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD)
to the Electrical Pins
MIL-STD-883C
Method 3015.4
Class 1 (> 2000 Volts)
Electrostatic Discharge (ESD)
to the Duplex LC Receptacle
IEC 61000-4-2 Typically, no damage occurs with 25 kV when
the duplex LC connector receptacle is con-
tacted by a Human Body Model probe.
IEC 61000-4-2 10 contacts of 8 kV on the electrical faceplate
with device inserted into a panel.
Electrostatic Discharge (ESD)
to the Optical Connector
IEC 61000-4-2 Air discharge of 15 kV (min.)
contact to connector without damage.
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class A
System margins are dependent on customer
board and chassis design.
Immunity IEC 61000-4-3 Typically shows no measurable eect from a
10 V/m eld swept from 10 MHz to 1 GHz.
Laser Eye Safety and
Equipment Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per
Paragraphs 1002.10
and 1002.12
(IEC) EN 60825-1: 2007
(IEC) EN 60825-2: 2004+A1
(IEC) EN 60950-1: 2006+A11
CDRH Certication No.: 9720151-128
TUV le: R 72121699
Component Recognition Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment including Electrical Business
Equipment
UL le: E173874, Vol. 1
RoHS Compliance RoHS Directive 2002/95/EC and
it’s amendment directives 6/6
SGS Test Report No. LPC/13392 (AD-1)/07
CTS Ref. CTS/07/3283/Avago
BAUART
GEPRUFT
TYPE
APPROVED
TUV
Rheinland
Product Safety
¬
¬
7
Figure 2. Typical application conguration.
Figure 3. Recommended power supply lter.
4.7 µH
4.7 µH
0.1 µF
VCC R
SFP MODULE
22 µF
VCC T
0.1 µF
0.1 µF
3.3 V
HOST BOARD
0.1 µF
NOTE: INDUCTORS MUST HAVE LESS THAN 1Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.
22 µF
LASER DRIVER
MODULE DETECT
LOSS OF SIGNAL
SCL
SDA
Tx_FAULT
Tx_DISABLE
TD+
Tx FAULT
Tx DIS
TD-
RD+
RD-
MOD_DEF2
MOD_DEF1
MOD_DEF0
GND,R
4.7 k to
10 kΩ50 Ω
50 Ω
4.7 k to 10 kΩ4.7 k to 10 kΩ
PROTOCOL IC
V
CC
,T
V
CC
,T
V
CC
,R
µF
3.3 V
SERDES IC
Rx LOS
GND,T
0.1 µF
0.1 µF
POST AMPLIFIER
100 Ω
4.7 k to 10 kΩ
100 Ω
10 kΩ
0.1 µF
V
CC
,R
0.1 µF
4.7 k to 10 kΩ
V
CC
,R
4.7 µH
22 µF
3.3 V
4.7 µH
0.1 µF0.1 µF
22 µF 0.1 µF0.1 µF
8
Notes:
1. The module signal grounds are isolated from the module case.
2. This is an open collector/drain output that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost. See Figure 2.
3. This input is internally biased high with a 4.7 kΩ to 10 kΩ pullup resistor to VccT.
4. Two-Wire Serial interface clock and data lines require an external pullup resistor dependent on the capacitance load.
5. This is a ground return that on the host board requires a 4.7 kΩ to 10 kΩ pullup resistor to VccHost.
Table 2. Contact Description
Contact Symbol Function/Description Notes
1 VeeT Transmitter Signal Ground Note 1
2 TX_FAULT Transmitter Fault (LVTTL-O) – High indicates a fault condition Note 2
3 TX_DISABLE Transmitter Disable (LVTTL-I) – High or open disables the transmitter Note 3
4 SDA Two Wire Serial Interface Data Line (LVCMOS – I/O)
(same as MOD-DEF2 in INF-8074) Note 4
5 SCL Two Wire Serial Interface Clock Line (LVCMOS – I/O)
(same as MOD-DEF1 in INF-8074) Note 4
6 MOD_ABS Module Absent (Output), connected to VeeT or VeeR in the module Note 5
7 RS0 Rate Select 0 - Not used, Presents high input impedance.
8 RX_LOS Receiver Loss of Signal (LVTTL-O) Note 2
9 RS1 Rate Select 1 - Not used, Presents high input impedance.
10 VeeR Receiver Signal Ground Note 1
11 VeeR Receiver Signal Ground Note 1
12 RD- Receiver Data Out Inverted (CML-O)
13 RD+ Receiver Data Out (CML-O)
14 VeeR Receiver Signal Ground
15 VccR Receiver Power + 3.3 V
16 VccT Transmitter Power + 3.3 V
17 VeeT Transmitter Signal Ground Note 1
18 TD+ Transmitter Data In (CML-I)
19 TD- Transmitter Data In Inverted (CML-I)
20 VeeT Transmitter Signal Ground Note 1
Figure 4. Module edge connector contacts
TOP VIEW
OF BOARD
11
20
10
1
TOWARD
HOST
BOTTOM OF
BOARD AS
VIEWED FROM
TOP THROUGH
BOARD
9
Table 3. Absolute Maximum Ratings
Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to
the module even if all other parameters are within Recommended Operating Conditions. It should not be assumed
that limiting values of more than one parameter can be applied concurrently. Exposure to any of the Absolute Maxi-
mum Ratings for extended periods can adversely aect reliability.
Parameter Symbol Minimum Maximum Unit Notes
Storage Temperature TS -40 85 C
Case Operating Temperature TC -40 85 C
Relative Humidity (Non condensing) RH 5 95 %
Supply Voltage VccT, VccR -0.3 3.8 V Note 1
Low Speed Input Voltage -0.5 Vcc+0.5 V
Two-Wire Interface Input Voltage -0.5 Vcc+0.5 V
High Speed Input Voltage, Single Ended -0.3 Vcc+0.5 V
High Speed Input Voltage, Dierential 2.5 V
Low Speed Output Current -20 20 mA
Optical Receiver Input Average Power 0 dBm
Note;
1. The module supply voltages, VccT and VccR must not dier by more than 0.5 V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Recommended Operating Conditions specify parameters for which the electrical and optical characteristics hold
unless otherwise noted. Optical and electrical charactristics are not dened for operation outside the Recommend-
ed Operating Conditions, reliability is not implied and damage to the module may occur for such operation over an
extended period of time.
Parameter Symbol Minimum Maximum Unit Notes
Case Operating Temperature TC 0 70 °C Note 1
Module Supply Voltage VccT, VccR 3.135 3.465 V Fig. 3
Host Supply Voltage VccHost 3.14 3.46 V
Signal Rate 9.8 10.313 GBd
Power Supply Noise Tolerance 66 mVp-p Fig. 3
10Hz to 10MHz
Tx Input Single Ended DC V -0.3 4.0 V
Voltage Tolerance (Ref VeeT)
Rx Output Single Ended Voltage Tolerance V -0.3 4.0 V
Notes:
1. Ambient operating temperature limits are based on the Case Operating Temperature limits and are subject to the host system thermal design.
See Figure 7 for the module Tc reference point.
10
Table 6. High Speed Signal Electrical Characteristics
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter Symbol Minimum Typical Maximum Unit Notes
Tx Input Dierential Voltage (TD +/-) VI 180 700 mV Note 1
Tx Input AC Common Mode Voltage Tolerance 15 mV(RMS)
Tx Input Dierential S-parameter (100 Ω Ref.) SDD11 -10 dB 0.01-1.0 GHz
Note 3 dB 1.0-11.1 GHz
Tx Input Dierential to Common SCD11 -10 dB 0.01-11.1 GHz
Mode Conversion (25 Ω Ref.)
Rx Output Dierential Voltage (RD +/-) Vo 300 850 mV Note 2
Rx Output Termination Mismatch @ 1MHz DZm 5 %
Rx Output AC Common Mode Voltage 7.5 mV(RMS) Note 5
Rx Output Output Rise and Fall Time tr, tf 28 ps
(20% to 80%)
Rx Output Total Jitter TJ 0.70 Ulp-p
Rx Output 99% Jitter J2 0.42 Ulp-p
Rx Output Dierential S-parameter SDD22 -12 dB 0.01-1.0 GHz
(100 Ω Ref.) Note 4 dB 1.0-11.1 GHz
Rx Output Common Mode Reection SCC22 -6 dB 0.01-2.5 GHz
Coecient (25 Ω Ref.) -3 dB 2.5-11.1 GHz
Receiver Output Eye Mask See Figure 5a
Notes:
1. Internally AC coupled and terminated (100 Ohm dierential).
2. Internally AC coupled but requires an external load termination (100 Ohm dierential).
3. Maximum reection coecient is expressed as SDD11=Max(-12+2*sqrt(f) , -6.3+13*log10(f/5.5)), for f in GHz.
4. Maximum reection coecient is expressed as SDD22=Max(-12+2*sqrt(f) , -6.3+13*log10(f/5.5)), for f in GHz.
5. The RMS value is measured by calculating the standard deviation of the histogram for one UI of the common mode signal.
Table 5. Low Speed Signal Electrical Characteristics
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter Symbol Minimum Typical Maximum Unit Notes
Module Supply Current ICC 180 289 mA Note 1
Power Dissipation PDISS 600 1000 mW
TX_FAULT, RX_LOS IOH - 50 + 37.5 mA Note 2
VOL -
0.3 0.4 V
TX_DISABLE VIH 2.0 VccT + 0.3 V Note 3
VIL -0.3 0.8 V
Notes:
1. Supply current includes both VccT and VccR connections.
2. Measured with a 4.7 k Ω load to VccHost.
3. TX_DISABLE has an internal 4.7 kΩ to 10 kΩ pull-up to VccT
11
Table 7. Two-Wire Interface Electrical Characteristics
Parameter Symbol Min. Max. Unit Conditions
Host Vcc Range VccHTWI 3.135 3.465 V
SCL and SDA VOL 0.0 0.40 V Rp[1] pulled to VccHTWI,
VOH VccHTWI - 0.5 VccHTWI + 0.3 V measured at host side of
connector
SCL and SDA VIL -0.3 VccT*0.3 V
VIH VccT*0.7 VccT + 0.5 V
Input Current on the Il -10 10 µA
SCL and SDA Contacts
Capacitance on SCL Ci[2] 14 pF
and SDA Contacts
Total bus capacitance Cb[3] 100 pF At 400 kHz, 3.0 kΩ Rp, max
for SCL and for SDA At 100 kHz, 8.0 kΩ Rp, max
290 pF At 400 kHz, 1.1 kΩRp, max
At 100 kHz, 2.75 kΩ Rp, max
Notes:
1. Rp is the pull up resistor. Active bus termination may be used by the host in place of a pullup resistor. Pull ups can be connected to various
power supplies, however the host board design shall ensure that no module contact has voltage exceeding VccT or VccR by 0.5 V nor requires
the module to sink more than 3.0 mA current.
2. Ci is the capacitance looking into the module SCL and SDA contacts
3. Cb is the total bus capacitance on the SCL or SDA bus.
Figure 5a. Receiver Electrical Optical Eye Mask Denition Figure 5b. Transmitter Optical Eye Mask Denition
150
0
-150
-425
00.35 1.00.65
ABSOLUTE AMPLITUDE - mV
NORMALIZED TIME (UNIT INTERVAL)
425
1.0
0.75
0.73
0.5
0.28
0.25
0
-0.40
0 0.25 0.40 0.45 10.55 0.60 0.75
NORMALIZED AMPLITUDE
NORMALIZED TIME (UNIT INTERVAL)
1.40
12
Table 8. Optical Specications
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter Minimum Typical Maximum Units Notes
Transmitter
Laser OMA output power -4.3 dBm 1, 2, 3, Table 9
Laser mean output power -1.0 dBm 1, 2, 4
Laser o power -30 dBm 1
Extinction ratio 3.0 dB 1, 2
Transmitter and dispersion penalty (TDP) 3.9 dB 1
Center Wavelength 840 860 nm 1,3, Table 9
RMS spectral width, standard deviation 1,3, Table 9
RIN12OMA -128 dB/Hz 1
Optical Return Loss Tolerance 12 dB 1
Encircled Flux 5
Transmitter Output Eye Mask 1, See Figure 5b
Receiver
Stressed sensitivity (OMA) – -7.5 dBm 1
Receive sensitivity (OMA) -11.1 dBm
Receive Power (Pave) Overload -1.0 dBm 1
Reectance -12 dB 1
Center Wavelength 840 860 nm 1
RX_LOS (OMA) O -12 dBm
RX_LOS (OMA) On -30 dBm
RX_LOS (OMA) Hysteresis 0.5 dB
Vertical eye closure penalty 3.5 dB 6
Stressed eye jitter 0.3 UI p-p 6
General Specication Considerations (Notes):
1. IEEE 802.3ae Clause 52 compliant.
2. These parameters are interrelated: see IEEE 802.3ae, Clause 52.
3. See Table 9. Trade-os are available among spectral width, center wavelength, and minimum optical modulation amplitude.
4. The 10GBASE-SR/SW launch power shall be the lesser of the Class 1 safety limit as dened in IEEE 802.3ae 52.10.2 or the average receive
power maximum dened by IEEE 802.3ae -2002 Table 52-9.
5. The transceiver’s launch condition meets the requirement of 10 Gigabit Ethernet multimode ber as detailed in TIA 492AAAC.
6. Vertical eye closure penalty and Stressed eye jitter are test conditions for Stressed sensitivity (OMA) measurements.
13
Table 9. Minimum Optical Modulation Amplitude
Center RMS Spectral Width (nm)
Wavelength Up to 0.05 to 0.1 to 0.15 to 0.2 to 0.25 to 0.3 to 0.35 to 0.4 to
(nm) 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45
840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8
842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9
844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9
848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0
850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0
852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1
856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1
858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2
14
Table 10. Control Functions: Low Speed Signals Timing Characteristics
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Parameter Symbol Minimum Maximum Unit Notes
TX_DISABLE Assert Time t_o 10 µs Note 1 , Fig. 6
TX_DISABLE Negate Time t_on 2 ms Note 2 , Fig. 6
Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3 , Fig. 6
TX_FAULT Assert Time t_fault 1 ms Note 4 , Fig. 6
TX_DISABLE to Reset t_reset 10 µs Note 5 , Fig. 6
RX_LOS Assert Time t_los_on 100 µs Note 6 , Fig. 6
RX_LOS Deassert Time t_los_o 100 µs Note 7 , Fig. 6
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal. A 10 ms interval between assertions of TX_
DISABLE is required.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal and the Two-Wire
interface is available.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
Parameter Symbol Minimum Maximum Unit Notes
TX_DISABLE Assert Time t_o_twi 100 ms Note 1
TX_DISABLE Negate Time t_on_twi 100 ms Note 2
TX_FAULT Assert Time t_fault_twi 100 ms Note 3
Rx_LOS Assert Time t_loss_on_twi 100 ms Note 4
Rx_LOS Deassert Time t_loss_o_twi 100 ms Note 5
Analog parameter data ready t_data 1000 ms Note 6
Two-Wire Interface Ready t_serial 300 ms Note 7
Write Cycle Time Parameter t_write 80 ms Note 8
Two-Wire Interface Clock Rate f_serial_clock 400 kHz Note 9
Time bus free before new t_BUF 20 ms Note 10
transmission can start
Table 11. Control Functions: Two-Wire Interface Timing Characteristics
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Notes:
1. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
2. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
3. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
4. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
5. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
6. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
7. Time from power on until module is ready for data transmission over the two-wire interface (reads or writes over A0h and A2h).
8. Time from stop bit to completion of a 1-8 byte write command. For a one to four byte write the maximum cycle time is 40ms and for a ve to
eight byte write the maximum cycle time is 80ms.
9. Module may clock stretch for f_serial_clock greater than 100 kHz.
10. Between STOP and START. See SFF 8431 Section 4.3
15
Table 12. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
The following characteristics are dened over the Recommended Operating Conditions unless otherwise noted.
Typical values are for Tc = 40°C. VccT and VccR = 3.3 V.
Parameter Symbol Min. Units Notes
Transceiver Internal Temperature TINT ±3.0 °C Temperature is measured internal to the transceiver.
Accuracy Valid from = -10°C to 85°C case temperature.
Transceiver Internal Supply VINT ±0.1 V Supply voltage is measured internal to the transceiver
Voltage Accuracy and can, with less accuracy, be correlated to
voltage at the VccT contact. Valid over 3.3 V ± 10%.
Transmitter Laser DC Bias Current IINT ±10 % IINT accuracy is better than ±10% of the nominal value.
Accuracy
Transmitted Average Optical PT ±3.0 dB Average Power coupled into 50/125 µm multi-mode
Output Power Accuracy ber. Valid from100 µW to 500 µW.
Received Average Optical Input PR ±3.0 dB Average Power coupled from 50/125 µm multi-mode
Power Accuracy ber. Valid from 77 µW to 500 µW.
Figure 6. Transceiver timing diagrams (module installed and power applied except where noted)
TX_FAULT
VCCT, VCCR > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_init
TX_FAULT
VCCT, VCCR > 2.97 V
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
TX_FAULT
VCCT, VCCR > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_off
TX_FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
INSERTION
t_on
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
TX_FAULT
OCCURANCE OF FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
OPTICAL SIGNAL
LOS
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED t-los-on & t-los-off
t_loss_on
t_init*
t_reset
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t_loss_off
OCCURANCE
OF LOSS
16
Table 13. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h)
Byte #
Decimal
Data
Hex
Notes Byte #
Decimal
Data
Hex
Notes
0 03 SFP physical device 37 00 Hex Byte of Vendor OUI[1]
1 04 SFP function dened by serial ID only 38 17 Hex Byte of Vendor OUI[1]
2 07 LC optical connector 39 6A Hex Byte of Vendor OUI[1]
3 10 10G Base-SR 40 41 “A” - Vendor Part Number ASCII character
4 00 41 46 “F” - Vendor Part Number ASCII character
5 00 42 42 “B” - Vendor Part Number ASCII character
6 00 43 52 “R” - Vendor Part Number ASCII character
7 00 44 2D “-” - Vendor Part Number ASCII character
8 00 45 37 “7” - Vendor Part Number ASCII character
9 00 46 30 “0” - Vendor Part Number ASCII character
10 00 47 39 “9” - Vendor Part Number ASCII character
11 06 64B/66B 48 53 “S” - Vendor Part Number ASCII character
12 67 10312.5 Mbit/sec nominal bit rate
(10.3125 Gbit/s)
49 4D “M” - Vendor Part Number ASCII character
13 00 Unspecied 50 5A “Z” - Vendor Part Number ASCII character
14 00 51 20 “ ” - Vendor Part Number ASCII character
15 00 52 20 “ ” - Vendor Part Number ASCII character
16 08 82 m of OM2 50/125 µm ber 53 20 “ ” - Vendor Part Number ASCII character
17 03 33 m of OM1 62.5/125 µm ber 54 20 “ ” - Vendor Part Number ASCII character
18 00 55 20 “ ” - Vendor Part Number ASCII character
19 1E 300 m of OM3 50/125 µm ber 56 20 “ ” - Vendor Revision Number ASCII character
20 41 “A” - Vendor Name ASCII character 57 20 “ ” - Vendor Revision Number ASCII character
21 56 “V” - Vendor Name ASCII character 58 20 “ ” - Vendor Revision Number ASCII character
22 41 “A” - Vendor Name ASCII character 59 20 “ ” - Vendor Revision Number ASCII character
23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength[2]
24 4F “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength[2]
25 20 “ ” - Vendor Name ASCII character 62 00
26 20 “ ” - Vendor Name ASCII character 63 Checksum for Bytes 0-62[3]
27 20 “ ” - Vendor Name ASCII character 64 00 Receiver limiting output. 1 Watt power class.
28 20 “ ” - Vendor Name ASCII character 65 1A Hardware SFP TX_DISABLE, TX_FAULT,
& RX_LOS
29 20 “ ” - Vendor Name ASCII character 66 00
30 20 “ ” - Vendor Name ASCII character 67 00
31 20 “ ” - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters[4]
32 20 “ ” - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters[5]
33 20 “ ” - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Pwr Avg
34 20 “ ” - Vendor Name ASCII character 93 F0 A/W, Soft SFP TX_DISABLE, TX_FAULT,
& RX_LOS, RATE_SELECT
35 20 “ ” - Vendor Name ASCII character 94 03 SFF-8472 Compliance to revision 10.0
36 00 95 Checksum for Bytes 64-94[3]
96 - 255 00
Notes:
1. The IEEE Organizationally Unique Identier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
2. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
3. Addresses 63 and 95 are checksums calculated (per SFF-8472) and stored prior to product shipment.
4. Addresses 68-83 specify the AFBR-709SMZ ASCII serial number and will vary on a per unit basis.
5. Addresses 84-91 specify the AFBR-709SMZ ASCII date code and will vary on a per date code basis.
17
Table 14. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte # Byte # Byte #
Decimal Notes Decimal Notes Decimal Notes
0 Temp H Alarm MSB[1] 26 Tx Pwr L Alarm MSB[4] 104 Real Time Rx Pwr MSB[5]
1 Temp H Alarm LSB[1] 27 Tx Pwr L Alarm LSB[4] 105 Real Time Rx Pwr LSB[5]
2 Temp L Alarm MSB[1] 28 Tx Pwr H Warning MSB[4] 106 Reserved
3 Temp L Alarm LSB[1] 29 Tx Pwr H Warning LSB[4] 107 Reserved
4 Temp H Warning MSB[1] 30 Tx Pwr L Warning MSB[4] 108 Reserved
5 Temp H Warning LSB[1] 31 Tx Pwr L Warning LSB[4] 109 Reserved
6 Temp L Warning MSB[1] 32 Rx Pwr H Alarm MSB[5] 110 Status/Control
- See Table 15
7 Temp L Warning LSB[1] 33 Rx Pwr H Alarm LSB[5] 111 Reserved
8 Vcc H Alarm MSB[2] 34 Rx Pwr L Alarm MSB[5] 112 Flag Bits - See Table 16
9 Vcc H Alarm LSB[2] 35 Rx Pwr L Alarm LSB[5] 113 Flag Bits - See Table 16
10 Vcc L Alarm MSB[2] 36 Rx Pwr H Warning MSB[5] 114 Reserved
11 Vcc L Alarm LSB[2] 37 Rx Pwr H Warning LSB[5] 115 Reserved
12 Vcc H Warning MSB[2] 38 Rx Pwr L Warning MSB[5] 116 Flag Bits - See Table 16
13 Vcc H Warning LSB[2] 39 Rx Pwr L Warning LSB[5] 117 Flag Bits - See Table 16
14 Vcc L Warning MSB[2] 40-55 Reserved 118-127 Reserved
15 Vcc L Warning LSB[2] 56-94 External Calibration Constants[6] 128-247 Customer Writeable
16 Tx Bias H Alarm MSB[3] 95 Checksum for Bytes 0-94[7] 248-255 Vendor Specic
17 Tx Bias H Alarm LSB[3] 96 Real Time Temperature MSB[1]
18 Tx Bias L Alarm MSB[3] 97 Real Time Temperature LSB[1]
19 Tx Bias L Alarm LSB[3] 98 Real Time Vcc MSB[2]
20 Tx Bias H Warning MSB[3] 99 Real Time Vcc LS[2]
21 Tx Bias H Warning LSB[3] 100 Real Time Tx Bias MSB[3]
22 Tx Bias L Warning MSB[3] 101 Real Time Tx Bias LSB[3]
23 Tx Bias L Warning LSB[3] 102 Real Time Tx Power MSB[4]
24 Tx Pwr H Alarm MSB[4] 103 Real Time Tx Power LSB[4]
25 Tx Pwr H Alarm LSB[4]
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
6. Bytes 56-94 are not intended for use with AFBR-709SMZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
18
Table 15. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Status/
Bit # Control Name Description Notes
7 TX_ DISABLE State Digital state of SFP TX_ DISABLE Input (1 = TX_DISABLE asserted) Note 1
6 Soft TX_ DISABLE Read/write bit for changing digital state of TX_DISABLE function Note 1, 2
5 Reserved
4 Reserved
3 Reserved
2 TX_FAULT State Digital state of the SFP TX_FAULT Output (1 = TX_FAULT asserted) Note 1
1 RX_LOS State Digital state of the SFP RX_LOS Output (1 = RX_LOS asserted) Note 1
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready)
Notes:
1. The response time for soft commands of the AFBR-709SMZ is 100 msec as specied by SFF-8472.
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input on contact 3; either asserted will disable the SFP+ transmitter.
Table 16. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Byte Bit Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold
6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold
5 Vcc High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold
4 Vcc Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold
113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold
6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold
0-5 Reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold
6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold
5 Vcc High Warning Set when transceiver internal supply voltage exceeds high warning threshold
4 Vcc Low Warning Set when transceiver internal supply voltage exceeds low warning threshold
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold
117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold
6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold
0-5 Reserved
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-3399EN - January 25, 2013
Figure 7. Module drawing
Figure 8. Module label
TX
6.25
RX
0.64 UNCOMPRESSED
0.69 UNCOMPRESSED
TCASE REFERENCE POINT
15.14 UNCOMPRESSED
BOTTOM LABEL RECESS
TOP LABEL RECESS
47.5
13.9
25.2
8.9
8.55
±0.1
13.6
13.4
±0.1
12
13
12.2
30.8