Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 1 of 5 June 2005
The Communications Edge
TM
AH22S
High Dynamic Range CATV Amplifier Product Information
Product Features
x 50 – 1000 MHz
x ±0.2 dB Gain Flatness
x +25 dBm P1dB
x-74 dBc CTB / CSO
+39dBmV/channel, 77 channels
x +43 dBm Output IP3
x +77 dBm Output IP2
x Matched amplifiers for a push-
pull configuration
x +5V Single Positive Supply
x MTTF > 1000 years
Applications
x CATV Head End Equipment
x CATV Line Amplifiers
x FTTH Repeaters
Product Description
The AH22S is a high dynamic range amplifier targeting
cable TV markets. The combination of gain flatness,
high linearity, and bandwidth makes it ideal for CATV
distribution, cable modem, and laser diode driver
applications.
The device uses two matched devices and is ideal for
operation in a push-pull configuration to achieve high
second order linearity. A mature and reliable GaAs
MESFET technology is employed to maximize linearity
at low power dissipation. The dual amplifier is housed in
an industry standard surface-mount SOIC-8 package with
all devices being 100% RF and dc tested. This device is
available in a lead-free/green/RoHS-compliant package
with NiPdAu plating material on the leads. It is
compatible with both lead-free and lead soldering
processes.
Functional Diagram
Function Pin No.
Amp 1 Input 1
Amp 2 Input 4
Amp 2 Output 5
Amp 1 Output 8
Ground 2, 3, 6, 7,
Backside
paddle
Single-ended Device Specifications (1)
Parameter Units
Min Typ Max
Operational Bandwidth MHz 50 1000
Test Frequency MHz 800
Gain dB 13 14.5
Output IP3 (2) dBm +37 +40
Device Current mA 120 160 190
Device Voltage V 5
1. Test conditions unless otherwise noted: 25ºC, Vd = +5 V, 800 MHz on each individual single-
branch amplifier in a 50
test fixture.
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Typical parameters reflect performance in a push-pull application circuit as shown on page 3. Note
that the feedback resistance values are R1 = R2 = 560
.
4. Balun, board, and connector losses have not been extracted, but typically account of 0.4 dB loss
midband and 1.1 dB loss at 860 MHz.
5. Measured at +39 dBmV/channel, 77 channels Flat Loading.
6. OIP2 is measured at f1 + f2 at +8 dBm / tone.
7. OIP3 is measured at 8 dBm / tone with 10 MHz spacing.
Typical Performance (3)
Parameter Units
Typical
Frequency MHz 50 250 450 860
Gain (4) dB 11.3 11.1 11.1 11.1
Input Return Loss dB 10.6 10.4 11.6 15.8
Output Return Loss dB 17.1 15.4 15.4 18.2
CTB (5) dBc -75 -74 -74
CSO (5) dBc -73 -86 -77
XMOD (5) dBc -63 -63 -63
Output P1dB dBm +25.9 +26 +25.5 +24.7
Output IP2 (6) dBm +79 +77 +77 +76
Output IP3 (7) dBm +43 +45 +42 +42
Noise Figure dB 6.1 4.6 4.5 4.2
Device Bias V +5 V @ 320 mA
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 qC
Storage Temperature -55 to +150 qC
Supply Voltage +6 V
RF Input Power (continuous) +13 dBm
Junction Temperature +220 qC
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No. Description
AH22S* High Dynamic Range CATV Amplifier
(lead-tin SOIC8 Pkg)
AH22S-G High Dynamic Range CATV Amplifier
(lead-free/green/RoHS-compliant SOIC8 Pkg)
AH22S-PCB Push-pull CATV Evaluation Board
* This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
1
2
3
4
8
7
6
5
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 2 of 5 June 2005
The Communications Edge
TM
AH22S
High Dynamic Range CATV Amplifier Product Information
Typical Device Data – 50: Zo
S-Parameters (Vds = +5 V, Ids = 160 mA, T = 25
C, unmatched 50 ohm system, calibrated to device leads)
This data represents a single-ended amplifier in the AH22S, with there being two matched amplifiers inside the package.
Freq (MHz)
S11 (dB) S11 (ang)
S21 (dB) S21 (ang)
S12 (dB) S12 (ang)
S22 (dB) S22 (ang)
50 -7.94 -19.61 15.23 168.38 -21.82 1.63 -15.80 -30.57
100 -8.21 -19.49 15.08 167.60 -21.70 -2.29 -16.57 -23.98
150 -8.22 -22.08 15.09 165.36 -21.79 -4.14 -16.83 -22.42
200 -8.25 -25.88 15.06 162.70 -21.72 -5.10 -17.08 -22.40
250 -8.21 -29.76 15.07 160.34 -21.71 -6.46 -17.15 -24.78
300 -8.23 -34.25 15.03 157.80 -21.68 -7.08 -17.08 -26.62
350 -8.23 -38.03 14.97 155.21 -21.61 -8.03 -17.41 -28.61
400 -8.26 -42.15 14.91 152.90 -21.62 -8.74 -17.56 -31.59
450 -8.21 -47.04 14.90 150.12 -21.57 -8.94 -17.49 -34.08
500 -8.17 -51.60 14.89 147.43 -21.58 -9.79 -17.75 -36.18
550 -8.11 -55.76 14.92 145.05 -21.53 -10.47 -17.80 -38.05
600 -8.14 -60.10 14.80 142.10 -21.47 -11.19 -18.07 -40.53
650 -8.13 -65.20 14.76 139.29 -21.49 -12.18 -18.25 -43.17
700 -8.02 -69.16 14.70 136.86 -21.41 -12.79 -18.42 -46.67
750 -8.04 -73.20 14.70 134.04 -21.38 -13.38 -18.69 -48.74
800 -8.02 -77.63 14.64 131.89 -21.30 -14.62 -18.86 -51.10
850 -7.98 -82.46 14.59 128.68 -21.26 -15.36 -18.96 -55.03
900 -7.91 -87.02 14.53 125.87 -21.16 -16.42 -19.19 -56.96
950 -7.86 -90.65 14.45 123.67 -21.12 -17.35 -19.48 -59.54
1000 -7.80 -94.58 14.39 121.33 -21.13 -18.12 -19.74 -63.18
Typical Device Data – 37.5: Zo
S-Parameters (Vds = +5 V, Ids = 160 mA, T = 25
C, unmatched 37.5 ohm system, calibrated to device leads)
This data represents a single-ended amplifier in the AH22S, with there being two matched amplifiers inside the package.
Freq (MHz)
S11 (dB) S11 (ang)
S21 (dB) S21 (ang)
S12 (dB) S12 (ang)
S22 (dB) S22 (ang)
50 -4.93 -12.81 14.35 170.16 -22.71 3.41 -9.19 -14.24
100 -5.09 -13.16 14.22 169.21 -22.57 -0.68 -9.40 -11.89
150 -5.12 -15.14 14.24 167.09 -22.64 -2.42 -9.51 -11.83
200 -5.17 -17.82 14.22 164.62 -22.55 -3.18 -9.61 -12.33
250 -5.18 -20.59 14.25 162.52 -22.53 -4.28 -9.66 -13.85
300 -5.23 -23.68 14.24 160.24 -22.47 -4.63 -9.66 -15.12
350 -5.28 -26.40 14.20 157.86 -22.38 -5.38 -9.83 -16.35
400 -5.36 -29.29 14.17 155.77 -22.36 -5.87 -9.95 -17.91
450 -5.39 -32.75 14.19 153.27 -22.28 -5.79 -9.96 -19.42
500 -5.45 -36.09 14.22 150.79 -22.26 -6.43 -10.12 -20.68
550 -5.48 -39.19 14.28 148.61 -22.17 -6.90 -10.17 -21.94
600 -5.58 -42.45 14.20 145.83 -22.07 -7.46 -10.35 -23.33
650 -5.69 -46.33 14.21 143.20 -22.04 -8.27 -10.51 -24.87
700 -5.70 -49.50 14.18 140.95 -21.93 -8.70 -10.66 -26.61
750 -5.81 -52.71 14.22 138.23 -21.86 -9.19 -10.83 -27.82
800 -5.92 -56.28 14.21 136.19 -21.73 -10.32 -10.97 -29.22
850 -6.02 -60.34 14.21 133.11 -21.64 -10.93 -11.15 -31.33
900 -6.10 -64.31 14.21 130.38 -21.49 -11.90 -11.32 -32.62
950 -6.17 -67.57 14.17 128.23 -21.41 -12.79 -11.55 -33.86
1000 -6.26 -71.12 14.16 125.92 -21.37 -13.52 -11.80 -35.45
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 3 of 5 June 2005
The Communications Edge
TM
AH22S
High Dynamic Range CATV Amplifier Product Information
75: Push-Pull Application Circuit
Circuit Board Material: .062” total thickness with a .028” FR4 top RF layer (
r=4.8),
4 total layers (other layers added for rigidity), 1 oz copper
Typical RF Performance at 25qC
Frequency MHz 50 250 450 860
Gain dB 11.3 11.1 11.1 11.1
Input R.L. dB 10.6 10.4 11.6 15.8
Output R.L. dB 17.1 15.4 15.4 18.2
CTB dBc -75 -74 -74
CSO dBc -73 -86 -77
XMOD dBc -63 -63 -63
Output P1dB dBm +25.9
+26 +25.5
+24.7
Output IP2 dBm +79 +77 +77 +76
Output IP3 dBm +43 +45 +42 +42
Noise Figure dB 6.1 4.6 4.5 4.2
Device Current mA 320
Device Voltage V +5
1. Balun, board, and connector losses have not been extracted, but typically account of
0.4 dB loss midband and 1.1 dB loss at 860 MHz.
2. CSO, CTB, & XMOD are measured at +39 dBmV/channel, 77 channels Flat Loading.
3. OIP2 is measured at f1 + f2 at 8 dBm / tone.
4. OIP3 is measured at 8 dBm / tone with 10 MHz spacing.
C=
ID=
1000 pF
C6
C=
ID=
1000 pF
C7
R=
ID=
560 Ohm
R1
R=
ID=
560 Ohm
R2
C=
ID=
100 pF
C3
CAP
C=
ID=
100 pF
C4
L=
ID=
470 nH
L4
L=
ID=
470 nH
L5
C=
ID=
1000 pF
C5
C=
ID=
1000 pF
C8
L=
ID=
5.6 nH
L2
L=
ID=
5.6 nH
L3
C=
ID=
1.5 pF
C1
C=
ID=
1.5 pF
C2
o o
1 : n1
1
2
3
4
XFMR
ID= L1
oo
1:n1
1
2
3
4
XFMR
ID= L6
+5 V
AH22S
+5 V
The transformers, L1 and L6, used on the WJ evaluation board are handwound baluns using these materials: 6
turns bifilar wire (MWS B2383211) around a ferrite core (TDK, H5C2-T3.1-1.3-1.3). An SMT transformer
(M/A Com ETC1-1-13) can also be used.
Gain
7
8
9
10
11
12
0 200 400 600 800 1000
Frequency (MHz)
Return Loss
-30
-25
-20
-15
-10
-5
0
0 200 400 600 800 1000
Frequency (MHz)
S11 S22
Noise Figure
2
3
4
5
6
7
0 200 400 600 800 1000
Frequency (MHz)
CSO, CTB, & XMOD
+39 dBmV / channel, 77 channel flat loading
-90
-80
-70
-60
-50
0 100 200 300 400 500 600
Frequency (MHz)
XMOD CTB CSO
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 4 of 5 June 2005
The Communications Edge
TM
AH22S
High Dynamic Range CATV Amplifier Product Information
AH22S Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C
Thermal Resistance (1), Rth 28q C/W
Junction Temperature (2), Tjc 130q
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab underneath the
device.
2. This corresponds to the typical biasing condition of
+5V, 320 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
C.
Product Marking
The component will be marked with an
“AH22S” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value: Passes from 500 to 1000 V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value Passes greater than 1000 V
Test: Charge Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235
C convection reflow
Standard: JEDEC Standard J-STD-020A
Functional Pin Layout
Pin Function
1 RF input (Amp1 input)
2 Ground
3 Ground
4 RF input (Amp2 input)
5 RF output (Amp2 output)
6 Ground
7 Ground
8 RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010”)
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. To ensure reliable operation, device ground paddle-to-ground
pad solder joint is critical.
4. Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts
the heatsink.
5. For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
9. All dimensions are in mm. Angles are in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60 70 80 90 100 110
Tab Temperature (°C)
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com Page 5 of 5 June 2005
The Communications Edge
TM
AH22S
High Dynamic Range CATV Amplifier Product Information
AH22S-G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260qC reflow temperature) and lead (maximum 245qC reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter Rating
Operating Case Temperature -40 to +85q C
Thermal Resistance (1), Rth 28q C/W
Junction Temperature (2), Tjc 130q
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab underneath the
device.
2. This corresponds to the typical biasing condition of
+5V, 320 mA at an 85
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
C.
Product Marking
The component will be marked with an
“ AH22SG” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value: Passes from 500 to 1000 V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value Passes greater than 1000 V
Test: Charge Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
C convection reflow
Standard: JEDEC Standard J-STD-020A
Functional Pin Layout
Pin Function
1 RF input (Amp1 input)
2 Ground
3 Ground
4 RF input (Amp2 input)
5 RF output (Amp2 output)
6 Ground
7 Ground
8 RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010”)
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. To ensure reliable operation, device ground paddle-to-ground
pad solder joint is critical.
4. Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts
the heatsink.
5. For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
9. All dimensions are in mm. Angles are in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60 70 80 90 100 110
Tab Temperature (°C)
