WF111 Data Sheet: 802.11 B/G/N Module WF111 is a fully integrated single 2.4 GHz band 802.11 b/g/n module, intended for portable and battery powered applications, where Wi-Fi(R) connectivity is needed. WF111 integrates an IEEE 802.11 b/g/n radio, antenna or U.FL antenna connector and SDIO or CSPI host interfaces. WF111 provides a low cost and simple Wi-Fi solution for devices that run an operating system and a TCP/IP stack on-board, but still offers the benefits of a module - small form factor, easy integration and certifications. Target Applications: * PoS terminals * RFID and laser scanners * Wi-Fi internet radios and audio streaming products * Wireless cameras * Portable navigation devices * Portable handheld devices * Wi-Fi medical sensors * Wireless picture frames silabs.com | Building a more connected world. KEY FEATURES * IEEE 802.11 b/g/n radio * Single stream 2.4 GHz band * Bit rates up to 72.2 Mbps * Integrated antenna or U.FL connector * Hardware support for WEP, WPA and WPA2 encryption * Soft-AP support * Temperature range: -40 to +85 C * SDIO or CSPI host interfaces * Fully CE, FCC, IC, Japan and SouthKorea certified * Operating system drivers for Linux Rev. 1.4 WF111 Data Sheet: 802.11 B/G/N Module Ordering Information 1. Ordering Information WF111 Product Numbering WF1 1 1- X Antenna: A = Internal antenna E = External N = RF pin Table 1.1. Confirmed Products and Codes Product code Description WF111-A-v1 WF111 module with internal chip antenna WF111-E-v1 WF111 module with U.FL connector for external antenna WF111-N-v1 WF111 module with 50 RF pin (Please contact Silicon Labs sales at www.silabs.com for availability) DKWF111 WF111-A SDIO evaluation kit silabs.com | Building a more connected world. Rev. 1.4 | 2 Table of Contents 1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Pinout and terminal descriptions . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 Host interfaces . . . . . . . . . . . 3.1.1 Host selection . . . . . . . . . . 3.1.2 SDIO interface . . . . . . . . . 3.1.3 CSR Serial Peripheral Interface (CSPI) . 3.1.4 SDIO/CSPI deep-sleep control schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 . 8 . 8 . 9 .10 3.2 Other interfaces . . . . 3.2.1 Debug SPI interface . 3.2.2 I/O pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 .10 .10 3.3 Power Control and Regulation . . . . . . . . . . . . . . . . . . . . . . . .11 3.4 REGEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.5 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4. Example Application Schematic 5. Wi-Fi radio . . . . . . . . . . . . . . . . . . . . . . . 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1 Wi-Fi receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 5.2 Wi-Fi transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . .16 6.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . .16 6.3 Input/Output terminal characteristics . . . . . . . . . . . . . . . . . . . . . .17 7. RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 8. Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . .20 9. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10. Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 10.1 WF111-A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 10.2 WF111-E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 10.3 WF111-N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 10.4 Thermal considerations . . . . . . . . . . . . . . . . . . . . . . . . . .24 10.5 EMC considerations . . . . . . . . . . . . . . . . . . . . . . . . . .25 . 11. Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 26 12. Product packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 13. Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 13.1 CE . . . . . . . silabs.com | Building a more connected world. . . . . . . . . . . . . . . . . . . . . . . . . . .28 Rev. 1.4 | 3 13.2 FCC and IC . . 13.2.1 FCC et IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 .31 13.3 MIC Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 13.4 KCC (South-Korea) . . . . . . . . . . . . . . . . . . . . . . . . . . .32 13.5 Anatel (Brazil) . . . . . . . . . . . . . . . . . . . . . . . . . . .32 13.6 Qualified Antenna Types for WF111-E . . . . . . . . . . . . . . . . . . . . .32 14. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 . . . . 14.1 Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.2 Revision 1.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.3 Revision 1.1.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.4 Revision 1.1.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.5 Revision 1.1.3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.6 Revision 1.1.4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.7 Revision 1.1.5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.8 Revision 1.1.6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.9 Revision 1.1.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.10 Revision 1.1.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.11 Revision 1.1.9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.12 Revision 1.2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.13 Revision 1.2.1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.14 Revision 1.2.2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 14.15 Revision 1.2.3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.16 Revision 1.2.4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.17 Revision 1.2.5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.18 Revision 1.2.6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.19 Revision 1.2.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.20 Revision 1.2.8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.21 Revision 1.2.9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.22 Revision 1.2.10 . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.23 Revision 1.3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 14.24 Revision 1.4.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 silabs.com | Building a more connected world. Rev. 1.4 | 4 WF111 Data Sheet: 802.11 B/G/N Module Pinout and terminal descriptions 2. Pinout and terminal descriptions Figure 2.1. WF111 pinout Table 2.1. Supply Terminal Descriptions POWER SUPPLIES PIN NUMBER DESCRIPTION VDD_REGIN 17 Input for the internal regulators REGEN 23 Pull high to enable internal voltage regulators (2.0 V max) GND 1, 8, 14, 21, 29, 30, 32 Ground GND_PAD 33 Thermal pad, on bottom of WF111 VDD_ANA 10 Positive supply for PA control VDD_PADS 19 Positive supply for the digital interfaces VDD_SDIO 15 Positive supply for the SDIO interface VDD_PA 28 Positive supply for the power amplifier silabs.com | Building a more connected world. Rev. 1.4 | 5 WF111 Data Sheet: 802.11 B/G/N Module Pinout and terminal descriptions Table 2.2. GPIO Terminal Descriptions PIO PORT PIN NUMBER PIO[0] 22 PIO[1] 24 PIO[2] 16 PIO[3] 20 PIO[4] 18 PIO[5] 27 PAD TYPE DESCRIPTION Bi-directional, programmable strength internal pulldown/pull-up Programmable input/output line. Table 2.3. Host Interface Terminal Descriptions SDIO/CSPI Interfaces PIN NUMBER PAD TYPE SDIO_DATA[0] DESCRIPTION Synchronous data input/output SDIO_SPI_DI 2 SDIO SPI data output CSPI_MISO CSPI data output Bi-directional, tri-state, weak internal pull-up SDIO_DATA[1] 3 SDIO_SPI_INT Synchronous data input/output SDIO SPI interrupt output CSPI_INT CSPI data input SDIO_DATA[2] 4 Synchronous data input/output SDIO_DATA[3] Synchronous data input/output 5 SDIO_SPI_CS# Bi-directional, weak/ strong internal pull-up SDIO SPI chip select, active low CSPI_CS# CSPI chip select, active low SDIO_CLK SDIO clock 6 SDIO_SPI_SCLK Input, weak internal pull-up SDIO SPI clock CSPI_CLK CSPI clock SDIO_CMD SDIO data input 7 SDIO_SPI_MOSI CSPI_MOSI Bi-directional, weak inSDIO SPI data input ternal pull-up CSPI data input Table 2.4. Other Terminal Descriptions OTHER SIGNALS PIN NUMBER PAD TYPE DESCRIPTION RST 25 Input, weak internal pull-up, active low System reset ANT 31 RF, DC blocked Antenna output on N variant, on A and E variants not connected BT 9 RF, DC blocked Bluetooth coexistence antenna sharing pin. Not supported by the firmware. Don't connect. silabs.com | Building a more connected world. Rev. 1.4 | 6 WF111 Data Sheet: 802.11 B/G/N Module Pinout and terminal descriptions Table 2.5. Debug SPI Terminal Descriptions DEBUG SPI INTERFACE PIN NUMBER PAD TYPE SPI_MISO 11 Output, tri-state, weak internal pullSynchronous data output down SPI_CLK 12 Synchronous clock input SPI_MOSI 13 SPI_CS 26 silabs.com | Building a more connected world. Input, weak internal pull-down DESCRIPTION Synchronous data input Chip select, active low Rev. 1.4 | 7 WF111 Data Sheet: 802.11 B/G/N Module Interfaces 3. Interfaces 3.1 Host interfaces WF111 can be interfaced by the host using SDIO in 1bit or 4bit mode, SDIO SPI or CSR proprietary CSPI connection. The host connection buses can be clocked up to 50MHz. Due to the relatively high clock rate, the bus layout should be done carefully. To prevent radiated emissions and bus errors due to reflections, the host bus should be kept short, the signals should run over an uninterrupted ground plane and the clock line should be series terminated with a 22 to 33 ohm resistor as close to the clock output pin of the host processor as possible. 3.1.1 Host selection WF111 will default to 1-bit SDIO mode. The host interface can be set with 1-bit SDIO or SDIO SPI commands to the required mode. After mode selection, it will then remain in that mode until the module is reset either with the RESET pin or the internal power supply supervisor. 3.1.2 SDIO interface This is a host interface which allows a Secure Digital Input Output (SDIO) host to gain access to the internals of the chip. All defined slave modes (SPI, SD 1bit, SD 4bit) are provided. Two functions are supported: * Function 0 is mandatory function used for SDIO slave configuration. This contains CCCR, FBR and CIS. CCCR registers support sleep and wakeup signaling. * Function 1 provides access to the IEEE 802.11 functionality. Command IO_RW_DIRECT (CMD52) is used to directly access internal registers. IO_RW_EXTENDED (CMD53) is used for block transfer to/from module MMU buffers. Table 3.1. Supported Commands per Mode Command SD Mode (1/4 bit) SDIO SPI Mode GO_IDLE_STATE (CMD0) Y Y SEND_RELATIVE_ADDR (CMD3) Y N IO_SEND_OP_COND (CMD5) Y Y SELECT/DESELECT_CARD (CMD7) Y N GO_INACTIVE_STATE (CMD15) Y N IO_RW_DIRECT (CMD52) Y Y IO_RW_EXTENDED (CMD53) Y Y CRC_ON_OFF (CMD59) N Y For more information and detailed descriptions of above functions and commands, see the following specifications: * SD Specifications Part 1 Physical Layer Specification v.1.10 * SD Specification Part E1 SDIO Specification v.1.10 silabs.com | Building a more connected world. Rev. 1.4 | 8 WF111 Data Sheet: 802.11 B/G/N Module Interfaces 3.1.3 CSR Serial Peripheral Interface (CSPI) The CSPI is a host interface which shares pins with the SDIO. It contains a number of modifications on the SDIO SPI specification aimed at increasing the host bus efficiency in hosts supporting SPI but not SDIO. The main advantages compared to SDIO SPI are as follows: * Burst transfer is continuous instead of blocks with CRC * Timings are deterministic (fixed number of clocks) reducing the required interaction * 16 bit registers are transferred as a single command instead of two 8 bit writes MMU buffers are accessed using burst read/writes. The command and address fields are used to select the correct buffer. The CSPI is able to generate an interrupt to the host when a memory access fails. This interrupt line is shared with the SDIO functions. The CSPI Interface is an extension of the basic SPI Interface, with the access type determined by the following fields: * 8-bit command * 24-bit address * 16-bit burst length (optional). Only applicable for burst transfers into or out of the MMU CSPI read/write cycles Register read/write cycles are used to access Function 0, Bluetooth acceleration and MCU registers. Burst read/write cycles are used to access the MMU. CSPI register write cycle The command and address are locked into the slave, followed by 16bits of write data. An Error Byte is returned on the MISO signal indicating whether or not the transfer has been successful. Figure 3.1. CSPI Register Write Cycle CSPI Register Read Cycle The command and address field are clocked into the slave, the slave then returns the following: * Bytes of padding data (MISO held low) * Error byte * 16-bits of read data Figure 3.2. CSPI Register Read Cycle CSPI Register Burst Write Cycle Burst transfers are used to access the MMU buffers. They cannot be used to access registers. Burst read/write cycles are selected by setting the nRegister/Burst bit in the command field to 1. Burst transfers are byte orientated, have a minimum length of 0 bytes and a maximum length of 64kbytes. Setting the length field to 0 results in no data being transferred to or from the MMU. silabs.com | Building a more connected world. Rev. 1.4 | 9 WF111 Data Sheet: 802.11 B/G/N Module Interfaces As with a register access, the command and address fields are transferred first. There is an optional length field transferred after the address. The use of the length field is controlled by the LengthFieldPresent bit in the Function 0 registers, which is cleared on reset. Figure 3.3. CSPI Burst Write Cycle CSPI Register Read Cycle Burst reads have a programmable amount of padding data that is returned by the slave. 0-15 bytes are returned as defined in the BurstPadding register. Following this the Error byte is returned followed by the data. Once the transfer has started, no further padding is needed. A FIFO within SDIO_TOP will pre-fetch the data. The address is not retransmitted, and is auto-updated within the slave. The length field is transmitted if LengthFieldPresent in the Function 0 registers is set. In the absence of a length field the CSB signal is used to indicate the end of the burst. Figure 3.4. CSPI Burst Read Cycle 3.1.4 SDIO/CSPI deep-sleep control schemes The module automatically enters deep sleep to minimize power consumption after a while of idling. Deep sleep is the lowest power mode, where the processor, the internal reference (fast) clock, and much of the digital and analogue hardware are shut down. The SDIO communication system however remains on, and is clocked by the host system. During deep sleep only the function 0 is available, while attempts to access Function 1 will likely result in bus timeouts. Function 0 is also available when the Wi-Fi core is physically powered off, as long as the VDD_SDIO supply is present. Control of when the module is allowed to enter deep sleep is done via Vendor Unique Register in CCCR in function 0. Wake-up is also initiated through this register. The module will initiate an SDIO interrupt when the wake-up is complete. 3.2 Other interfaces 3.2.1 Debug SPI interface A separate SPI bus is provided at the module pads for device access during testing and uploading settings during application development and manufacturing. This interface cannot be used as a host interface. It is recommended to bring these to a connector or test pads in case RF certification measurements that cannot be made through the host connection are required with the finished design. If it is not expected that certification measurements would be needed, the debug SPI pads should be left unconnected. The pads do not need external pull-ups when unconnected. The debug SPI bus has logic levels set by the VDD_PADS reference supply line. 3.2.2 I/O pads A number of programmable bi-directional input/outputs (I/O) are present. Some of these are usable for driving a status LED. The PIO[0:5] logic levels are referred to the VDD_PADS supply line. All the PIO lines have internal pull-downs and should be left unconnected when not used. silabs.com | Building a more connected world. Rev. 1.4 | 10 WF111 Data Sheet: 802.11 B/G/N Module Interfaces 3.3 Power Control and Regulation Figure 3.5. System Block Diagram WF111 contains four linear regulators supplying clean voltages for the different parts of the system. All of them produce a 1.2 V output voltage, and are fed from a common input, VDD_REGIN. This input can be supplied with a voltage between 1.45-2.0 V, typically 1.5 V or 1.8 V. The VDD_REGIN supply should be relatively clean of ripple and switching spikes in order to avoid degrading the RF performance. WF111 also needs four other supply lines connected in addition to VDD_REGIN: * VDD_PADS provides a reference voltage for matching voltage levels of the host system to the GPIO pins and other functions. This can range from 1.7 V to 3.6 V. The current drawn from this supply is negligible. * VDD_SDIO provides a reference voltage for matching voltage levels of the host system to the SDIO connection. This can range from 1.7V to 3.6V. The current drawn from this supply depends on bus usage, but with no active data transfer will be negligible. * VDD_ANA provides a reference voltage for communication between the Wi-Fi chip and the power amplifier. This should be between 1.7 V and 3.6 V. The current drawn from this supply is negligible. * VDD_PA is a separate supply voltage for the Wi-Fi power amplifier. This supply will draw considerable currents in pulses. The power traces should be relatively wide. This voltage can range from 2.7 V to 4.8 V making use directly from a single lithium cell possible. A higher supply voltage will not affect the power amplifiers current draw significantly. The regulator supplying VDD_PA should be capable of reacting to load changes within 5 s. Note: VDD_PA has an internal 2.2 F ceramic bypass capacitor, it should be made certain the regulator feeding VDD_PA is stable with ceramic load capacitors. These voltages are not tied to each other and any combination of supply voltages within the specified limits can be used. In a 3.3 V logic level host system all other supplies would usually be tied to the 3.3 V supply, with a separate regulator providing the 1.45-2.0 V supply for the Wi-Fi core. A switch mode regulator with 1.5 V output is recommended for minimum power consumption. Please see the example schematic in this datasheet. In a 1.8 V logic level host system, all other supplies can be connected to the 1.8V supply rail except VDD_PA which should be connected to a 2.7-4.8 V supply. The higher voltage supplies should be powered before or at the same time as the core supply line (i.e., the VDD_REGIN should be powered up last). Powering the core first may lead to the GPIO and SDIO blocks booting into an inaccessible state. External high frequency bypassing for any the supply lines is not required, all supplies contain internal capacitors. If the VDD_PA line is fed directly from a battery or there are concerns about the speed of the regulator feeding it, a capacitor of around 100 F should be connected close to the module. Note: All supply voltages and ground lines must be connected. silabs.com | Building a more connected world. Rev. 1.4 | 11 WF111 Data Sheet: 802.11 B/G/N Module Interfaces 3.4 REGEN The regulator enable pin REGEN is used to enable the WF111. REGEN enables the regulators of the digital and analog core supply voltages. The pin is active high, with a logic threshold of around 1V, and has a weak pull-down. REGEN can tolerate voltages up to 2.0V, and may be connected directly to the internal voltage regulator input (VDD_REGIN) to permanently enable the device. Part of the regulators can also be disabled by firmware in power saving modes. The VDD_REGIN supply can also be externally switched off while leaving the other supply voltages powered. Cutting power to the core will fully shut down the module internal processors and returning power will cause a power-on reset, requiring a full initialization of the module. The REGEN pin will not disable system blocks not supplied by the core supply, so the SDIO Function 0 are available even when the core is powered off. 3.5 RESET WF111 may be reset from several sources: RESET pin, power-on reset, via software configured watchdog timers as well as through the SDIO/CSPI host interface. The RESET pin is an active low reset and is internally filtered using the internal low frequency clock oscillator. A reset is performed between 1.5 and 4.0ms following RESET being active. It is recommended that RESET be applied for a period greater than 5ms. The power-on reset occurs when the core supply (generated by the internal 1.2V linear regulator) falls below typically 1.05V and is released when core voltage rises above typically 1.10V. At reset regardless of the source the digital I/O pins are set to a high impedance state with weak pull-downs, except RESET and DEBUG_SPI_CS# which have a weak pull-up. The host connection interface is only reset by the RESET pin or a power-on reset. A power-on reset can be achieved through powering down the digital core by either externally cutting the VDD_REGIN supply or giving a low pulse to the REGEN-pad. If REGEN is connected to the host system for powering down the module, or a separate core power switch is implemented, the RESET pin can be tied permanently to a supply voltage line. Following a reset, WF111 automatically generates internally the clocks needed for safe boot-up of the internal processors. The crystal oscillator is then configured by software with the correct input frequency. Note: Holding the RESET line low will not drive the module into a low power consumption mode, it can't be used as a power-off signal. silabs.com | Building a more connected world. Rev. 1.4 | 12 WF111 Data Sheet: 802.11 B/G/N Module Example Application Schematic 4. Example Application Schematic Figure 4.1. Example Application Circuit with SDIO Host Connection, 3.3 V Level Host Logic and 1.5/1.8 V Core Supply, REGEN Hard Wired to the Core Supply and RST Pad Used to Reset the Module Note: With N-variant, ANT-pad and associated grounds would also be connected. silabs.com | Building a more connected world. Rev. 1.4 | 13 WF111 Data Sheet: 802.11 B/G/N Module Example Application Schematic Figure 4.2. Example Application Circuit with SDIO Host Connection, 1.8 V Level Host Logic and a Separate Power Amplifier Supply, RST Hard Wired to the Core Supply and REGEN Pad Used to Power Off and Reset the Module Note: With N-variant, ANT-pad and associated grounds would also be connected. silabs.com | Building a more connected world. Rev. 1.4 | 14 WF111 Data Sheet: 802.11 B/G/N Module Wi-Fi radio 5. Wi-Fi radio 5.1 Wi-Fi receiver The receiver features direct conversion architecture. Sufficient out-of-band blocking specification at the Low Noise Amplifier (LNA) input allows the receiver to be used in close proximity to Global System for Mobile Communications (GSM) and Wideband Code Division Multiple Access (W-CDMA) cellular phone transmitters without being desensitized. High-order baseband filters ensure good performance against in-band interference. 5.2 Wi-Fi transmitter The transmitter features a direct IQ modulator. Digital baseband transmit circuitry provides the required spectral shaping and on-chip trims are used to reduce IQ modulator distortion. Transmitter gain can be controlled on a per-packet basis, allowing the optimization of the transmit power as a function of modulation scheme. The internal Power Amplifier (PA) has a maximum output power of +14dBm for IEEE 802.11g/n and +16dBm for IEEE 802.11b. The module internally compensates for PA gain and reference oscillator frequency drifts with varying temperature and supply voltage. silabs.com | Building a more connected world. Rev. 1.4 | 15 WF111 Data Sheet: 802.11 B/G/N Module Electrical characteristics 6. Electrical characteristics 6.1 Absolute maximum ratings Table 6.1. Absolute Maximum Ratings Rating Min Max Unit Storage temperature -40 85 C VDD_PADS, VDD_ANA, VDD_SDIO -0.4 3.6 V VDD_REGIN, REGEN -0.4 2.5 V VDD_PA -0.4 6 V VSS+0.3 VDD+0.3 V Other terminal voltages 6.2 Recommended Operating Conditions Table 6.2. Recommended Operating Conditions Rating Min Max Unit Operating temperature range1 -40 85 C VDD_PADS, VDD_SDIO, VDD_ANA 1.7 3.6 V VDD_PA 2.7 4.8 V VDD_REGIN 1.45 2 V Note: 1. The module will heat up depending on use, at high transmit duty cycles the maximum operating temperature may need to be derated. See chapter 10.4 Thermal considerations. silabs.com | Building a more connected world. Rev. 1.4 | 16 WF111 Data Sheet: 802.11 B/G/N Module Electrical characteristics 6.3 Input/Output terminal characteristics Table 6.3. Digital Terminal Electrical Characteristics Digital Terminals Min Typ Max Unit VIL input logic level low 1.7 V VDD 3.6 V -0.3 -- 0.25*Vdd V VIH input logic level low 1.7 V VDD 3.6 V 0.625*Vdd -- VDD+0.3 V VOL output logic level low 1.7 V VDD 3.6 V, (Io = 4.0 mA) -- -- 0.4 V VOH output logic level low 1.7V VDD 3.6V, (Io = -4.0 mA) 0.75*Vdd -- Vdd V Strong pull-up -150 -40 -10 A Strong pull-down 10 40 150 A Weak pull-up -5 -1 -0.33 A Weak pull-down 0.33 1 5 A I/O pad leakage current -1 0 1 A Pad input capacitance 1 -- 5 pF Input Voltage Levels Output Voltage Levels Input Tri-state Current with the following: silabs.com | Building a more connected world. Rev. 1.4 | 17 WF111 Data Sheet: 802.11 B/G/N Module RF Characteristics 7. RF Characteristics Table 7.1. Supported Frequencies Min max Unit Channel 1 11 Frequency 2412 2462 MHz Table 7.2. Supported Modulations Standard Supported bit rates 802.11b 1, 2, 5.5, 11 Mbps 802.11g 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n, HT, 20MHz, 800ns 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps 802.11n, HT, 20MHz, 400ns 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2 Mbps Table 7.3. Receiver Sensitivity 802.11b Typ 802.11g Typ 802.11n short GI Typ 802.11n long GI Typ 1 Mbps -97 dBm 6 Mbps -92 dBm 6.5 Mbps -91 dBm 7.2 Mbps -92 dBm 2 Mbps -95 dBm 9 Mbps -91 dBm 13 Mbps -87 dBm 14.4 Mbps -90 dBm 5.5 Mbps -93 dBm 12 Mbps -89 dBm 19.5 Mbps -85 dBm 21.7 Mbps -87 dBm 11 Mbps -89 dBm 18 Mbps -87 dBm 26 Mbps -82 dBm 28.9 Mbps -84 dBm -- -- 24 Mbps -84 dBm 39 Mbps -78 dBm 43.3 Mbps -80 dBm -- -- 36 Mbps -80 dBm 52 Mbps -74 dBm 57.8 Mbps -75 dBm -- -- 48 Mbps -75 dBm 58.5 Mbps -71 dBm 65 Mbps -72 dBm -- -- 54 Mbps -73 dBm 65 Mbps -68 dBm 72.2 Mbps -69 dBm Table 7.4. Transmitter Output Power at Maximum Setting Modulation type Measurement type Typical value Unit Measurement according to 802.11b (1 Mbps) RMS +16 dBm FCC/IC/ETSI 802.11b (1 Mbps) Peak, max hold, 10 MHz RBW +19.6 dBm Anatel 802.11g (54 Mbps) RMS +14 dBm FCC/IC/ETSI 802.11g (54 Mbps) 20 MHz channel power, max hold, 1 MHz RBW +20.6 dBm Anatel 802.11n (72.2 Mbps) RMS +14 dBm FCC/IC/ETSI 802.11n (72.2 Mbps) 20 MHz channel power, max hold, 1 MHz RBW +21.1 dBm Anatel silabs.com | Building a more connected world. Rev. 1.4 | 18 WF111 Data Sheet: 802.11 B/G/N Module RF Characteristics Table 7.5. BT Antenna Sharing Interface Properties Operating mode Min Typ Max Unt Switch loss (TX and RX) -2.5 -3 -3.5 dB Table 7.6. Carrier Frequency Accuracy Description Typ Max 802.11 limit (total error) Unit Variation between individual units 5 10 25 ppm Variation with temperature 5 10 25 ppm silabs.com | Building a more connected world. Rev. 1.4 | 19 WF111 Data Sheet: 802.11 B/G/N Module Power Consumption 8. Power Consumption Table 8.1. Current Consumption During Specific Operating Modes Operating mode VDD_PA/peak VDD_PA/typ VDD_REGIN/peak VDD_REGIN/typ Transmit (802.11b, 1M, +16 dBm) 248 mA 190 mA 240 mA 100 mA Transmit (802.11b, 1M, +8 dBm) -- 144 mA -- 90 mA Transmit (802.11g, 54M, +15 dBm) -- 154 mA -- 104 mA Receive, no data 12 mA 10.5 mA 240 mA 114 mA Deep sleep -- 9 A -- 75 A Table 8.2. Average Current Consumption in Normal Use with Various Constant Throughputs Measured from Evaluation Board Test Point (Preliminary) Operating mode Bit rate Throughput (sw. limited) Current/3.3 V Transmit/802.11n 65 Mbps 12 Mbps 144 mA Transmit/802.11g 18 Mbps 5.9 Mbps 192 mA Transmit/802.11b 11 Mbps 4.8 Mbps 192 mA Transmit/802.11b 1 Mbps 920 kbps 184 mA Transmit/802.11n 72.2 Mbps 1 Mbps 74 mA* Transmit/802.11g 54 Mbps 1 Mbps 78 mA Transmit/802.11g 18 Mbps 1 Mbps 86 mA Transmit/802.11b 11 Mbps 1 Mbps 94 mA Transmit/802.11b 2 Mbps 1 Mbps 158 mA Receive 72 Mbps 16.5 Mbps 88 mA Receive 72 Mbps 1 Mbps 70 mA1 Idle, associated 1.7 mA2 Idle, non-associated 110A Note: 1. The module draws about 70 mA in idle mode without power saves enabled. 2. With 100 ms beacon interval and full power save enabled. Increasing beacon interval will reduce consumption further. silabs.com | Building a more connected world. Rev. 1.4 | 20 WF111 Data Sheet: 802.11 B/G/N Module Physical Dimensions 9. Physical Dimensions Figure 9.1. Physical Dimensions Figure 9.2. WF111 Recommended PCB Land Pattern silabs.com | Building a more connected world. Rev. 1.4 | 21 WF111 Data Sheet: 802.11 B/G/N Module Layout Guidelines 10. Layout Guidelines 10.1 WF111-A Figure 10.1. Recommended Layouts, On-Board Corner and On-Board Edge See figure above for the suggested module layout. The impedance matching of the antenna is designed for a layout similar to the module evaluation board. For an optimal performance of the antenna the layout should strictly follow the layout example shown in Figure 4.1 Example Application Circuit with SDIO Host Connection, 3.3 V Level Host Logic and 1.5/1.8 V Core Supply, REGEN Hard Wired to the Core Supply and RST Pad Used to Reset the Module on page 13 and the thickness of FR4 should be between 1 and 2 mm, preferably 1.6 mm. Any dielectric material close to the antenna will change the resonant frequency and it is recommended not to place a plastic case or any other dielectric closer than 5 mm from the antenna. ANY metal in close proximity of the antenna will prevent the antenna from radiating freely. It is recommended not to place any metal or other conductive objects closer than 20 mm to the antenna except in the directions of the ground planes of the module itself. For optimal performance, place the antenna end of the module outside any metal surfaces and objects in the application, preferably on the device corner. The larger the angle in which no metallic object obstructs the antenna radiation, the better the antenna will work. DO NOT place WF111-A in the middle of the application board. Even with a board cutout around the antenna the range will be bad. The three pads on the antenna end of the WF111-A can be connected to the ground or left unsoldered. 10.2 WF111-E RF output can be taken directly from the U.FL connector of the module, and no antenna clearances need to be made for the module. The three pads on the antenna end of the module can be connected to the ground or left unsoldered. silabs.com | Building a more connected world. Rev. 1.4 | 22 WF111 Data Sheet: 802.11 B/G/N Module Layout Guidelines 10.3 WF111-N Antenna connection is routed to pad 31. Pads 30 and 32 beside the antenna connection should be properly connected to the ground plane. No antenna clearances are needed for the module itself. The antenna trace should be properly impedance controlled and kept short. The figure below shows a typical 50 ohm trace from the RF pin to a SMA connector. Figure 10.2. Typical 50 Trace for WF111-N A transmission line impedance calculator, such as TX-Line made by AWR, can be used to approximate the dimensions for the 50 ohm transmission line. The figure below shows an example for two different 50 ohm transmission lines. silabs.com | Building a more connected world. Rev. 1.4 | 23 WF111 Data Sheet: 802.11 B/G/N Module Layout Guidelines Figure 10.3. Example Cross Section of Two Different 50 ohm Transmission Line 10.4 Thermal considerations The WF111 module may at continuous full power transmit consume up to 1 W of DC power, most of which is drawn by the power amplifier. Most of this will be dissipated as heat. In any application where high ambient temperatures and constant transmissions for more than a few seconds can occur, it is important that a sufficient cooling surface is provided to dissipate the heat. The thermal pad in the bottom of the module must be connected to the application board ground planes by soldering. The application board should provide a number of vias under and around the pad to conduct the produced heat to the board ground planes, and preferably to a copper surface on the other side of the board in order to dissipate the heat into air. The module internal thermal resistance should in most cases be negligible compared to the thermal resistance from the module into air, and common equations for surface area required for cooling can be used to estimate the temperature rise of the module. Only copper planes on the circuit board surfaces with a solid thermal connection to the module ground pad will dissipate heat. For an application with high transmit duty cycles (low bit rate, high throughput, long bursts or constant streaming) the maximum allowed ambient temperature should be reduced due to inherent heating of the module, especially with small fully plastic enclosed applications where heat transfer to ambient air is low due to low thermal conductivity of plastic. The module measured on the evaluation board exhibits a temperature rise of about 25oC above ambient temperature when continuously transmitting IEEE 802.11b at full power with minimal off-times and no collision detection (a worst case scenario regarding power dissipation). An insufficiently cooled module will rapidly heat beyond operating range in ambient room temperature. silabs.com | Building a more connected world. Rev. 1.4 | 24 WF111 Data Sheet: 802.11 B/G/N Module Layout Guidelines 10.5 EMC considerations Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. The following list is aimed to avoid EMC problems caused by RF part of the module. * Do not remove copper from the PCB more than needed. For proper operation the antenna requires a solid ground plane with as much surface area as possible. Use ground filling as much as possible. Connect all grounds together with multiple vias. Do not leave small floating unconnected copper areas or areas connected by just one via, these will act as additional antennas and raise the risk of unwanted radiations. * Do not place a ground plane underneath the antenna. The grounding areas under the module should be designed as shown in Figure 10.1 Recommended Layouts, On-Board Corner and On-Board Edge on page 22. * When using overlapping ground areas use conductive vias separated max. 3 mm apart at the edge of the ground areas. This prevents RF from penetrating inside the PCB. Use ground vias extensively all over the PCB. All the traces in (and on) the PCB are potential antennas. Especially board edges should have grounds connected together at short intervals (stitching) to avoid resonances. * Avoid current loops. Keep the traces with sensitive, high current or fast signals short, and mind the return current path, having a short signal path is not much use if the associated ground path between the ends of the signal trace is long. Remember, ground is also a signal trace. The ground will conduct the same current as the signal path and at the same frequency, power and sensitivity. * Split a ground plane ONLY if you know exactly what you are doing. Splitting the plane may cause more harm than good if applied incorrectly. The ground plane acts as a part of the antenna system. Insufficient ground planes or large separate sensitive signal ground planes will easily cause the coupled transmitted pulses to be AM-demodulated by semiconductor junctions around the board, degrading system performance. Figure 10.4. Use of Stitching Vias to Avoid Emissions from the Edges of the PCB silabs.com | Building a more connected world. Rev. 1.4 | 25 WF111 Data Sheet: 802.11 B/G/N Module Soldering Recommendations 11. Soldering Recommendations WF111 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Silicon Labs will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. * Refer to technical documentations of particular solder paste for reflow profile configurations * Avoid using more than one flow. * Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150m stencil thickness is recommended. * Aperture size of the stencil should be 1:1 with the pad size. * A low residue, "no clean" solder paste should be used due to low mounted height of the component. If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask the via holes at the module side to prevent solder wicking through the via holes. Solders have a habit of filling holes and leaving voids in the thermal pad solder junction, as well as forming solder balls on the other side of the application board which can in some cases be problematic. silabs.com | Building a more connected world. Rev. 1.4 | 26 WF111 Data Sheet: 802.11 B/G/N Module Product packaging 12. Product packaging silabs.com | Building a more connected world. Rev. 1.4 | 27 WF111 Data Sheet: 802.11 B/G/N Module Certifications 13. Certifications WF111 is compliant to the following specifications: 13.1 CE WF111 is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/EC). The product is conformity with the following standards and/or normative documents. EMC (immunity only): EN 301 489 Radiated emissions: EN 300 328 Safety standards: EN 60950 silabs.com | Building a more connected world. Rev. 1.4 | 28 WF111 Data Sheet: 802.11 B/G/N Module Certifications 13.2 FCC and IC This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This transmitter is considered as mobile device and should not be used closer than 20 cm from a human body. To allow portable use in a known host class 2 permissive change is required. Please contact the support at www.silabs.com for detailed information. IC Statements: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. If detachable antennas are used: This radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. See table 22 for the approved antennas for WF111-E and WF111-N. OEM Responsibilities to comply with FCC and Industry Canada Regulations The WF111 Module has been certified for integration into products only by OEM integrators under the following conditions: The antenna(s) must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. End Product Labeling The WF111 Module is labeled with its own FCC ID and IC Certification Number. If the FCC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQWF111" "Contains Transmitter Module IC: 5123A-BGTWF111" or "Contains FCC ID: QOQWF111 "Contains IC: 5123A-BGTWF111" The OEM of the WF111 Module must only use the approved antenna(s) described in table 22, which have been certified with this module. silabs.com | Building a more connected world. Rev. 1.4 | 29 WF111 Data Sheet: 802.11 B/G/N Module Certifications The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. To comply with FCC and Industry Canada RF radiation exposure limits for general population, the antenna(s) used for this transmitter must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times and must not be co-located or operating in conjunction with any other antenna or transmitter. silabs.com | Building a more connected world. Rev. 1.4 | 30 WF111 Data Sheet: 802.11 B/G/N Module Certifications 13.2.1 FCC et IC Cet appareil est conforme a l'alinea 15 des regles de la FCC. Deux conditions sont a respecter lors de son utilisation : cet appareil ne doit pas creer d'interference susceptible de causer un quelconque dommage et, cet appareil doit accepter toute interference, quelle qu'elle soit, y compris les interferences susceptibles d'entrainer un fonctionnement non requis. Declaration de conformite FCC d'exposition aux radiofrequences (RF): Ce materiel respecte les limites d'exposition aux radiofrequences fixees par la FCC dans un environnement non controle. Les utilisateurs finaux doivent se conformer aux instructions d'utilisation specifiees afin de satisfaire aux normes d'exposition en matiere de radiofrequence. Ce transmetteur ne doit pas etre installe ni utilise en concomitance avec une autre antenne ou un autre transmetteur. Ce transmetteur est assimile a un appareil mobile et ne doit pas etre utilise a moins de 20 cm du corps humain. Afin de permettre un usage mobile dans le cadre d'un materiel de categorie 2, il est necessaire de proceder a quelques adaptations. Pour des informations detaillees, veuillez contacter le support technique, www.silabs.com. Declaration de conformite IC : Ce materiel respecte les standards RSS exempt de licence d'Industrie Canada. Son utilisation est soumise aux deux conditions suivantes : l'appareil ne doit causer aucune interference, et l'appareil doit accepter toute interference, quelle qu'elle soit, y compris les interferences susceptibles d'entrainer un fonctionnement non requis de l'appareil. Selon la reglementation d'Industrie Canada, ce radio-transmetteur ne peut utiliser qu'un seul type d'antenne et ne doit pas depasser la limite de gain autorisee par Industrie Canada pour les transmetteurs. Afin de reduire les interferences potentielles avec d'autres utilisateurs, le type d'antenne et son gain devront etre definis de telle facon que la puissance isotrope rayonnante equivalente (EIRP) soit juste suffisante pour permettre une bonne communication. Lors de l'utilisation d'antennes amovibles : Ce radio-transmetteur (identifie par un numero certifie ou un numero de modele dans le cas de la categorie II) a ete approuve par Industrie Canada pour fonctionner avec les antennes referencees ci-dessous dans la limite de gain acceptable et l'impedance requise pour chaque type d'antenne cite. Les antennes non referencees possedant un gain superieur au gain maximum autorise pour le type d'antenne auquel elles appartiennent sont strictement interdites d'utilisation avec ce materiel. Veuillez vous referer au tableau 22 concernant les antennes approuvees pour les WF111. Les responsabilites de l'integrateur afin de satisfaire aux reglementations de la FCC et d'Industrie Canada : Les modules WF111 ont ete certifies pour entrer dans la fabrication de produits exclusivement realises par des integrateurs dans les conditions suivantes : L'antenne (ou les antennes) doit etre installee de facon a maintenir a tout instant une distance minimum de 20cm entre la source de radiation (l'antenne) et toute personne physique. Le module transmetteur ne doit pas etre installe ou utilise en concomitance avec une autre antenne ou un autre transmetteur. Tant que ces deux conditions sont reunies, il n'est pas necessaire de proceder a des tests supplementaires sur le transmetteur. Cependant, l'integrateur est responsable des tests effectues sur le produit final afin de se mettre en conformite avec d'eventuelles exigences complementaires lorsque le module est installe (exemple : emissions provenant d'appareils numeriques, exigences vis-a-vis de peripheriques informatiques, etc.) ; IMPORTANT : Dans le cas ou ces conditions ne peuvent etre satisfaites (pour certaines configurations ou installation avec un autre transmetteur), les autorisations fournies par la FCC et Industrie Canada ne sont plus valables et les numeros d'identification de la FCC et de certification d'Industrie Canada ne peuvent servir pour le produit final. Dans ces circonstances, il incombera a l'integrateur de faire reevaluer le produit final (comprenant le transmetteur) et d'obtenir une autorisation separee de la part de la FCC et d'Industrie Canada. Etiquetage du produit final Chaque module WF111 possede sa propre identification FCC et son propre numero de certification IC. Si l'identification FCC et le numero de certification IC ne sont pas visibles lorsqu'un module est installe a l'interieur d'un autre appareil, alors l'appareil en question devra lui aussi presenter une etiquette faisant reference au module inclus. Dans ce cas, le produit final doit comporter une etiquette placee de facon visible affichant les mentions suivantes : Contient un module transmetteur certifie FCC QOQWF111 Contient un module transmetteur certifie IC 5123A-BGTWF111 silabs.com | Building a more connected world. Rev. 1.4 | 31 WF111 Data Sheet: 802.11 B/G/N Module Certifications ou Inclut la certification FCC QOQWF111 Inclut la certification IC 5123A-BGTWF111 L'integrateur du module WF111 ne doit utiliser que les antennes repertoriees dans le tableau 25 certifiees pour ce module. L'integrateur est tenu de ne fournir aucune information a l'utilisateur final autorisant ce dernier a installer ou retirer le module RF, ou bien changer les parametres RF du module, dans le manuel d'utilisation du produit final. Afin de se conformer aux limites de radiation imposees par la FCC et Industry Canada, l'antenne (ou les antennes) utilisee pour ce transmetteur doit etre installee de telle sorte a maintenir une distance minimum de 20cm a tout instant entre la source de radiation (l'antenne) et les personnes physiques. En outre, cette antenne ne devra en aucun cas etre installee ou utilisee en concomitance avec une autre antenne ou un autre transmetteur. 13.3 MIC Japan WF111 has type approval for Japan with certification ID R 209- J00061 13.4 KCC (South-Korea) WF111 has modular certification for Korean market with certification ID KCC-CRM-BGT-WF111 13.5 Anatel (Brazil) WF111 has type approval in Brazil with identification number 01234-16-03402. 13.6 Qualified Antenna Types for WF111-E This device has been designed to operate with the antennas listed below, and having a maximum gain of 2.14 dBi. Antennas not included in this list or having a gain greater than 2.14 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. Table 13.1. Qualified Antenna Types for WF111-E Qualified Antenna Types for WF111-E Antenna Type Maximum Gain Dipole 2.14 dBi Inverted F-antenna 2.2 dBi Any antenna that is of the same type and of equal or less directional gain as listed in table above can be used without a need for retesting. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. Using an antenna of a different type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. Please, contact the technical support at www.silabs.com for more information. silabs.com | Building a more connected world. Rev. 1.4 | 32 WF111 Data Sheet: 802.11 B/G/N Module Revision History 14. Revision History 14.1 Revision 1.0 * Initial release. 14.2 Revision 1.1 * Product codes updated. 14.3 Revision 1.1.1 * Added sleep clock specifications. 14.4 Revision 1.1.2 * Added frequency variation table. 14.5 Revision 1.1.3 * FCC and IC information added. 14.6 Revision 1.1.4 * WT111-N layout guide. 14.7 Revision 1.1.5 * Some new consumption measurements. 14.8 Revision 1.1.6 * Added CE information, corrected supported channels for default FCC version. 14.9 Revision 1.1.7 * Different coexistence pad bindings, replaced MIB keys with MIB file names. 14.10 Revision 1.1.8 * Listed supported coexistence schemes. 14.11 Revision 1.1.9 * Added tape & reel info. 14.12 Revision 1.2.0 * Removed unnecessary register information, changes to coexistence description, removed references to engineering sample versions. 14.13 Revision 1.2.1 * Repaired broken ToC. 14.14 Revision 1.2.2 * MIC Japan and KCC certification info. silabs.com | Building a more connected world. Rev. 1.4 | 33 WF111 Data Sheet: 802.11 B/G/N Module Revision History 14.15 Revision 1.2.3 * Improved footprint drawing. 14.16 Revision 1.2.4 * EN 300 328 V1.7.1 -> V1.8.1. 14.17 Revision 1.2.5 * Added notes on host bus layout. 14.18 Revision 1.2.6 * Part numbers updated. 14.19 Revision 1.2.7 * Contact and antenna information updated. 14.20 Revision 1.2.8 * TX power table updated. 14.21 Revision 1.2.9 * .11gn power specification fixed. 14.22 Revision 1.2.10 * Anatel measurements. 14.23 Revision 1.3.0 * Removed references to coexistence, CE standard version numbers, replaced contact information, updated Bluegiga references to Silicon Labs. 14.24 Revision 1.4.0 August 3, 2017 * Anatel certification number added. Custom OPN support for 13 channels removed. silabs.com | Building a more connected world. Rev. 1.4 | 34 Smart. Connected. Energy-Friendly. Products Quality www.silabs.com/products www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. 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