DATA SHEET
MPC9229 REVISION 3 AUGUST 6, 2009 1 ©2009 Integrated Device Technology, Inc.
400MHz Low Voltage PECL Clock Synthesizer MPC9229
The MPC9229 is a 3.3 V compatible, PLL based clock synthesizer targeted for high
performance clock generation in mid-range to high-performance telecom, networking and
computing applications. With output frequencies from 25 MHz to 400 MHz and the support of
differential PECL output signals the device meets the needs of the most demanding clock
applications.
Features
25 MHz to 400 MHz Synthesized Clock Output Signal
Differential PECL Output
LVCMOS Compatible Control Inputs
On-Chip Crystal Oscillator for Reference Frequency Generation
3.3-V Power Supply
Fully Integrated PLL
Minimal Frequency Overshoot
Serial 3-Wire Programming Interface
Parallel Programming Interface for Power-Up
32-Lead LQFP and 28-Lead PLCC Packaging
32-Lead and 28-Lead Pb-Free Package Available
SiGe Technology
Ambient Temperature Range 0°C to +70°C
Pin and Function Compatible to the MC12429
Functional Description
The internal crystal oscillator uses the external quartz crystal as the basis of its frequency
reference. The frequency of the internal crystal oscillator is divided by 16 and then multiplied
by the PLL. The VCO within the PLL operates over a range of 800 to 1600 MHz. Its output is
scaled by a divider that is configured by either the serial or parallel interfaces. The crystal
oscillator frequency fXTAL, the PLL feedback-divider M and the PLL post-divider N determine
the output frequency.
The feedback path of the PLL is internal. The PLL adjusts the VCO output frequency to be
4M times the reference frequency by adjusting the VCO control voltage. Note that for some
values of M (either too high or too low) the PLL will not achieve phase lock. The PLL will be
stable if the VCO frequency is within the specified VCO frequency range (800 to 1600 MHz).
The M-value must be programmed by the serial or parallel interface.
The PLL post-divider N is configured through either the serial or the parallel interfaces, and
can provide one of four division ratios (1, 2, 4, or 8). This divider extends performance of the
part while providing a 50% duty cycle. The output driver is driven differentially from the output
divider, and is capable of driving a pair of transmission lines terminated 50 to VCC 2.0 V. The positive supply voltage for the internal PLL
is separated from the power supply for the core logic and output drivers to minimize noise induced jitter.
The configuration logic has two sections: serial and parallel. The parallel interface uses the values at the M[8:0] and N[1:0] inputs to configure
the internal counters. It is recommended on system reset to hold the P_LOAD input LOW until power becomes valid. On the LOW-to-HIGH
transition of P_LOAD, the parallel inputs are captured. The parallel interface has priority over the serial interface. Internal pullup resistors are
provided on the M[8:0] and N[1:0] inputs prevent the LVCMOS compatible control inputs from floating.
The serial interface centers on a fourteen bit shift register. The shift register shifts once per rising edge of the S_CLOCK input. The serial
input S_DATA must meet setup and hold timing as specified in the AC Characteristics section of this document. The configuration latches will
capture the value of the shift register on the HIGH-to-LOW edge of the S_LOAD input. Refer to Programming Interface for more information.
The TEST output reflects various internal node values, and is controlled by the T[2:0] bits in the serial data stream. In order to minimize the
PLL jitter, it is recommended to avoid active signal on the TEST output.
MPC9229
400 MHz LOW VOLTAGE
CLOCK SYNTHESIZER
ORDERING INFORMATION
Device Temp.
Range
Case
No. Package
MPC9229FN 0°C
to +70°C
776-02 PLCC
MPC9229EI 776-02 PLCC
MPC9229FA 873A-03 LQFP
MPC9229AC 873A-03 LQFP
FA SUFFIX
32-LEAD LQFP PACKAGE
CASE 873A-04
AC SUFFIX
32-LEAD LQFP PACKAGE
Pb-FREE PACKAGE
CASE 873A-04
EI SUFFIX
28-LEAD PLCC PACKAGE
Pb-FREE PACKAGE
CASE 776-02
FN SUFFIX
28-LEAD PLCC PACKAGE
CASE 776-02
MPC9229 REVISION 3 AUGUST 6, 2009 2 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Figure 1. MPC9229 Logic Diagram
÷1
÷2
÷4
÷8
XTAL_IN
XTAL_OUT
S_LOAD
÷16
S_DATA
S_CLOCK
M[0:8]
XTAL
PLL
Ref
FB
VCO
800 – 1800 MHz
00
01
10
11
÷0 TO ÷511
9-BIT M-DIVIDER
M-LATCH N-LATCH
10 – 20 MHz
T-LATCH
92
TEST
3
LE
01 01
BITS 5-13 BITS 3-4 BITS 0-2
14-BIT SHIFT REGISTER
SYNC
N[1:0]
OE
P/S
fOUT
TEST
VCC
VCC
÷4
OE
P_LOAD
fOUT
1
4
3
2
28
27
26
25 24 23 22 21 20 19
18
17
16
15
14
13
12
111097865
VCC
XTAL_OUT
P_LOAD
OE
M[0]
M[1]
M[2]
M[3]
fOUT
fOUT
GND
VCC
TEST
GND
S_CLOCK N[1]
N[0]
M[8]
M[7]
M[6]
M[5]
M[4]
S_DATA
S_LOAD
VCC_PLL
NC
NC
XTAL_IN
MPC9229
Figure 2. MPC9229 28-Lead PLCC Pinout
(Top View)
Figure 3. MPC9229 32-Lead LQFP Pinout
(Top View)
GND
TEST
VCC
VCC
GND
fOUT
fOUT
NC
M[3]
M[2]
M[1]
M[0]
P_LOAD
NC
N[1]
N[0]
M[8]
M[7]
M[6]
M[5]
M[4]
S_CLOCK
S_LOAD
VCC_PLL
VCC_PLL
NC
NC
XTAL_IN
25
26
27
28
29
30
31
32
15
14
13
12
11
10
9
12345678
24 23 22 21 20 19 18 17
16
VCC
OE
XTAL_OUT
S_DATA
MPC9229
MPC9229 REVISION 3 AUGUST 6, 2009 3 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Table 1. Pin Configurations
Pin I/O Default Type Function
XTAL_IN, XTAL_OUT Analog Crystal oscillator interface
fOUT, fOUT Output LVPECL Differential clock output
TEST Output LVCMOS Test and device diagnosis output
S_LOAD Input 0LVCMOS Serial configuration control input
This inputs controls the loading of the configuration latches with the contents
of the shift register. The latches will be transparent when this signal is high,
thus the data must be stable on the high-to-low transition
P_LOAD Input 1LVCMOS Parallel configuration control input
This input controls the loading of the configuration latches with the content of
the parallel inputs (M and N). The latches will be transparent when this signal
is low, thus the parallel data must be stable on the low-to-high transition of
P_LOAD. P_LOAD is state sensitive
S_DATA Input 0LVCMOS Serial configuration data input
S_CLOCK Input 0LVCMOS Serial configuration clock input
M[0:8] Input 1LVCMOS Parallel configuration for PLL feedback divider (M).
M is sampled on the low-to-high transition of P_LOAD.
N[1:0] Input 1LVCMOS Parallel configuration for Post-PLL divider (N)
N is sampled on the low-to-high transition of P_LOAD
OE Input 1LVCMOS Output enable (active high).
The output enable is synchronous to the output clock to eliminate the
possibility of runt pulses on the fOUT output. OE = L low stops fOUT in the logic
low state (fOUT = L, fOUT = H)
GND Supply Supply Ground Negative power supply (GND).
VCC Supply Supply VCC Positive power supply for I/O and core. All VCC pins must be connected to
the positive power supply for correct operation.
VCC_PLL Supply Supply VCC PLL positive power supply (analog power supply).
Table 2. Output Frequency Range and Pll Post-Divider N
N
Output Division Output Frequency Range
1 0
0 0 1 200 – 400 MHz
0 1 2 100 – 200 MHz
1 0 4 50 – 100 MHz
1 1 8 25 – 50 MHz
MPC9229 REVISION 3 AUGUST 6, 2009 4 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Table 3. General Specifications
Symbol Characteristics Min Typ Max Unit Condition
VTT Output Termination Voltage VCC –2 V
MM ESD Protection (Machine Model) 200 V
HBM ESD Protection (Human Body Model) 2000 V
LU Latch-Up Immunity 200 mA
CIN Input Capacitance 4.0 pF Inputs
θJA LQFP 32 Thermal Resistance Junction to Ambient
JESD 51-3, Single Layer Test Board
JESD 51-6, 2S2P Multilayer Test Board
83.1
73.3
68.9
63.8
57.4
59.0
54.4
52.5
50.4
47.8
86.0
75.4
70.9
65.3
59.6
60.6
55.7
53.8
51.5
48.8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Natural Convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
Natural Convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
θJC LQFP 32 Thermal Resistance Junction to Case 23.0 26.3 °C/W MIL-SPEC 883E
Method 1012.1
Table 4. Absolute Maximum Ratings(1)
1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated
conditions is not implied.
Symbol Characteristics Min Max Unit
VCC Supply Voltage –0.3 3.9 V
VIN DC Input Voltage –0.3 VCC + 0.3 V
VOUT DC Output Voltage –0.3 VCC + 0.3 V
IIN DC Input Current ±20 mA
IOUT DC Output Current ±50 mA
TSStorage Temperature –65 125 °C
Table 5. DC Characteristics (VCC = 3.3 V ± 5%, TA = 0°C to +70°C)
Symbol Characteristics Min Typ Max Unit Condition
LVCMOS Control Inputs (P_LOAD, S_LOAD, S_DATA, S_CLOCK, M[0:8], N[0:1], OE)
VIH Input High Voltage 2.0 VCC + 0.3 VLVCMOS
VIL Input Low Voltage 0.8 VLVCMOS
IIN Input Current(1)
1. Inputs have pull-down resistors affecting the input current.
±200 µA VIN = VCC or GND
Differential Clock Output fOUT(2)
2. Outputs terminated 50 to VTT = VCC –2 V.
VOH Output High Voltage(3)
3. The MPC9229 TEST output levels are compatible to the MC12429 output levels.
VCC –1.02 VCC –0.74 VLVPECL
VOL Output Low Voltage(3) VCC –1.95 VCC –1.60 VLVPECL
Test and Diagnosis Output TEST
VOH Output High Voltage(3) 2.0 V IOH = –0.8 mA
VOL Output Low Voltage(3) 0.55 V IOL = 0.8 mA
Supply Current
ICC_PLL Maximum PLL Supply Current 20 mA VCC_PLL Pins
ICC Maximum Supply Current 100 mA All VCC Pins
MPC9229 REVISION 3 AUGUST 6, 2009 5 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Table 6. AC Characteristics (VCC = 3.3 V ± 5%, TA = 0°C to +70°C)(1)
1. AC characteristics apply for parallel output termination of 50 to VTT.
Symbol Characteristics Min Typ Max Unit Condition
fXTAL Crystal Interface Frequency Range 10 20 MHz
fVCO VCO Frequency Range(2)
2. The input frequency fXTAL and the PLL feedback divider M must match the VCO frequency range: fVCO = fXTAL M ÷ 4.
800 1600 MHz
fMAX Output Frequency N = 00 (÷1)
N = 01 (÷2)
N = 10 (÷4)
N = 11 (÷8)
200
100
50
25
400
200
100
50
MHz
MHz
MHz
MHz
DC Output Duty Cycle 45 50 55 %
tr, tfOutput Rise/Fall Time 0.05 0.3 ns 20% to 80%
fS_CLOCK Serial Interface Programming Clock Frequency(3)
3. The frequency of S_CLOCK is limited to 10 MHz in serial programming mode. S_CLOCK can be switched at higher frequencies when used
as test clock in test mode 6. Refer to Applications Information for more details.
0 10 MHz
tP,MIN Minimum Pulse Width (S_LOAD, P_LOAD) 50 ns
tSSetup Time S_DATA to S_CLOCK
S_CLOCK to S_LOAD
M, N to P_LOAD
20
20
20
ns
ns
ns
tSHold Time S_DATA to S_CLOCK
M, N to P_LOAD
20
20
ns
ns
tJIT(CC) Cycle-to-Cycle Jitter N = 00 (÷1)
N = 01 (÷2)
N = 10 (÷4)
N = 11 (÷8)
90
130
160
190
ps
ps
ps
ps
tJIT(PER) Period Jitter N = 00 (÷1)
N = 01 (÷2)
N = 10 (÷4)
N = 11 (÷8)
70
120
140
170
ps
ps
ps
ps
tLOCK Maximum PLL Lock Time 10 ms
MPC9229 REVISION 3 AUGUST 6, 2009 6 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
PROGRAMMING INTERFACE
Programming the MPC9229
Programming the MPC9229 amounts to properly configuring the
internal PLL dividers to produce the desired synthesized frequency
at the output. The output frequency can be represented by this
formula:
fOUT = (fXTAL ÷ 16) (4 M) ÷ (4 N) or (1)
fOUT = (fXTAL ÷ 16) M ÷ N(2)
where fXTAL is the crystal frequency, M is the PLL feedback-divider
and N is the PLL post-divider. The input frequency and the selection
of the feedback divider M is limited by the VCO-frequency range.
fXTAL and M must be configured to match the VCO frequency range
of 800 to 1600 MHz in order to achieve stable PLL operation:
MMIN =4fVCO,MIN ÷ fXTAL and (3)
MMAX =4fVCO,MAX ÷ fXTAL (4)
For instance, the use of a 16 MHz input frequency requires the
configuration of the PLL feedback divider between M = 200 and
M = 400. Table 7. shows the usable VCO frequency and M divider
range for other example input frequencies. Assuming that a 16 MHz
input frequency is used, equation (2) reduces to:
fOUT = M ÷ N
Table 7. MPC9229 Frequency Operating Range
M M[8:0] VCO frequency for a crystal interface frequency of Output frequency for fXTAL = 16 MHz and for N =
10 12 14 16 18 20 1 2 4 16
160 010100000 800
170 010101010 850
180 010110100 810 900
190 010111110 855 950
200 011001000 800 900 1000 200 100 50 25
210 011010010 840 945 1050 210 105 52.5 26.25
220 011011100 880 990 1100 220 110 55 27.50
230 011100110 805 920 1035 1150 230 115 57.5 28.75
240 011110000 840 960 1080 1200 240 120 60 30
250 011111010 875 100 1125 1250 250 125 62.5 31.25
260 100000100 910 1040 1170 1300 260 130 65 32.50
270 100001110 810 945 1080 1215 1350 270 135 67.5 33.75
280 100011000 840 980 1120 1260 1400 280 140 70 35
290 100100010 870 1015 1160 1305 1450 290 145 72.5 36.25
300 100101100 900 1050 1200 1350 1500 300 150 75 37.5
310 100110110 930 1085 1240 1395 1550 310 155 77.5 38.75
320 101000000 800 960 1120 1280 1440 1600 320 160 80 40
330 101001010 825 990 1155 1320 1485 330 165 82.5 41.25
340 101010100 850 1020 1190 1360 1530 340 170 85 42.5
350 101011110 875 1050 1225 1400 1575 350 175 87.5 43.75
360 101101000 900 1080 1260 1440 360 180 90 45
370 101110010 925 1110 1295 1480 370 185 92.5 46.25
380 101111100 950 1140 1330 1520 380 190 95 47.5
390 110000110 975 1170 1365 1560 390 195 97.5 48.75
400 110010000 1000 1200 1400 1600 400 200 100 50
410 110011010 1025 1230 1435
420 110100100 1050 1260 1470
430 110101110 1075 1290 1505
440 110111000 1100 1320 1540
450 111000010 1125 1350 1575
510 111111110 1275 1530
MPC9229 REVISION 3 AUGUST 6, 2009 7 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Substituting N for the four available values for N (1, 2, 4, 8) yields: Example Frequency Calculation for an 16 MHz Input Frequency
If an output frequency of 131 MHz was desired the following steps
would be taken to identify the appropriate M and N values.
According to Table 8., 131 MHz falls in the frequency set by an value
of 2 so N[1:0] = 01. For N = 2 the output frequency is fOUT = M ÷ 2
and M = fOUT x 2. Therefore M = 2 x 131 = 262, so M[8:0] =
100000110. Following this procedure a user can generate any whole
frequency between 25 MHz and 400 MHz. Note than for N > 2
fractional values of can be realized. The size of the programmable
frequency steps (and thus the indicator of the fractional output
frequencies achievable) will be equal to:
fSTEP = fXTAL ÷ 16 ÷ N
APPLICATIONS INFORMATION
Using the Parallel and Serial Interface
The M and N counters can be loaded either through a parallel or
serial interface. The parallel interface is controlled via the P_LOAD
signal such that a LOW-to-HIGH transition will latch the information
present on the M[8:0] and N[1:0] inputs into the M and N counters.
When the P_LOAD signal is LOW, the input latches will be
transparent and any changes on the M[8:0] and N[1:0] inputs will
affect the fOUT output pair. To use the serial port, the S_CLOCK
signal samples the information on the S_DATA line and loads it into
a 14-bit shift register. Note that the P_LOAD signal must be HIGH
for the serial load operation to function. The Test register is loaded
with the first three bits, the N register with the next two and the M
register with the final eight bits of the data stream on the S_DATA
input. For each register the most significant bit is loaded first (T2, N1,
and M8). A pulse on the S_LOAD pin after the shift register is fully
loaded will transfer the divide values into the counters. The HIGH-
to-LOW transition on the S_LOAD input will latch the new divide
values into the counters. Figure 3. illustrates the timing diagram for
both a parallel and a serial load of the MPC9229 synthesizer. M[8:0]
and N[1:0] are normally specified once at power-up through the
parallel interface, and then possibly again through the serial
interface. This approach allows the application to come up at one
frequency and then change or fine-tune the clock as the ability to
control the serial interface becomes available.
Using the Test and Diagnosis Output TEST
The TEST output provides visibility for one of the several internal
nodes as determined by the T[2:0] bits in the serial configuration
stream. It is not configurable through the parallel interface. Although
it is possible to select the node that represents fOUT
, the CMOS
output is not able to toggle fast enough for higher output frequencies
and should only be used for test and diagnosis. The T2, T1, and T0
control bits are preset to ‘000' when P_LOAD is LOW so that the
PECL fOUT outputs are as jitter-free as possible. Any active signal
on the TEST output pin will have detrimental affects on the jitter of
the PECL output pair. In normal operations, jitter specifications are
only guaranteed if the TEST output is static. The serial configuration
port can be used to select one of the alternate functions for this pin.
Most of the signals available on the TEST output pin are useful only
for performance verification of the MPC9229 itself. However the PLL
bypass mode may be of interest at the board level for functional
debug. When T[2:0] is set to 110, the MPC9229 is placed in PLL
bypass mode. In this mode the S_CLOCK input is fed directly into
the M and N dividers. The N divider drives the fOUT differential pair
and the M counter drives the TEST output pin. In this mode the
S_CLOCK input could be used for low speed board level functional
test or debug. Bypassing the PLL and driving fOUT directly gives the
user more control on the test clocks sent through the clock tree.
Figure 5. shows the functional setup of the PLL bypass mode.
Because the S_CLOCK is a CMOS level, the input frequency is
limited to 200 MHz. This means the fastest the fOUT pin can be
toggled via the S_CLOCK is 100 MHz as the divide ratio of the
Post-PLL divider is 2 (if N = 1). Note that the M counter output on the
TEST output will not be a 50% duty cycle.
Table 8. Output Frequency Range for fXTAL = 16 MHz
NfOUT fOUT Range fOUT Step
1 0 Value
0 0 1 M 200 – 400 MHz 1 MHz
0 1 2 M ÷2100 – 200 MHz 500 kHz
1 0 4 M ÷450 – 100 MHz 250 kHz
1 1 8 M ÷825 – 50 MHz 125 kHz
Table 9. Test and Debug Configuration for TEST
T[2:0] TEST Output
T2 T1 T0
00014-bit shift register out(1)
1. Clocked out at the rate of S_CLOCK
001Logic 1
0 1 0 fXTAL ÷ 16
011M-Counter out
1 0 0 fOUT
101Logic 0
110M-Counter out in PLL-bypass mode
1 1 1 fOUT ÷ 4
Table 10. Debug Configuration for PLL Bypass(1)
1. T[2:0] = 110. AC specifications do not apply in PLL bypass mode
Output Configuration
fOUT S_CLOCK ÷N
TEST M-Counter out(2)
2. Clocked out at the rate of S_CLOCK ÷(4 N)
MPC9229 REVISION 3 AUGUST 6, 2009 8 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Figure 3. Serial Interface Timing Diagram
Power Supply Filtering
The MPC9229 is a mixed analog/digital product. Its analog
circuitry is naturally susceptible to random noise, especially if this
noise is seen on the power supply pins. Random noise on the
VCC_PLL pin impacts the device characteristics. The MPC9229
provides separate power supplies for the digital circuitry (VCC) and
the internal PLL (VCC_PLL) of the device. The purpose of this design
technique is to try and isolate the high switching noise digital outputs
from the relatively sensitive internal analog phase-locked loop. In a
controlled environment such as an evaluation board, this level of
isolation is sufficient. However, in a digital system environment
where it is more difficult to minimize noise on the power supplies a
second level of isolation may be required. The simplest form of
isolation is a power supply filter on the VCC_PLL pin for the
MPC9229. Figure 4. illustrates a typical power supply filter scheme.
The MPC9229 is most susceptible to noise with spectral content in
the 1 kHz to 1 MHz range. Therefore, the filter should be designed
to target this range. The key parameter that needs to be met in the
final filter design is the DC voltage drop that will be seen between the
VCC supply and the MPC9229 pin of the MPC9229. From the data
sheet the VCC_PLL current (the current sourced through the VCC_PLL
pin) is maximum 20 mA, assuming that a minimum of 2.835 V must
be maintained on the VCC_PLL pin. The resistor shown in Figure 4.
must have a resistance of 10-15 to meet the voltage drop criteria.
The RC filter pictured will provide a broadband filter with
approximately 100:1 attenuation for noise whose spectral content is
above 20 kHz. As the noise frequency crosses the series resonant
point of an individual capacitor its overall impedance begins to look
inductive and thus increases with increasing frequency. The parallel
capacitor combination shown ensures that a low impedance path to
ground exists for frequencies well above the bandwidth of the PLL.
Generally, the resistor/capacitor filter will be cheaper, easier to
implement and provide an adequate level of supply filtering. A higher
level of attenuation can be achieved by replacing the resistor with an
appropriate valued inductor. A 1000 µH choke will show a significant
impedance at 10 kHz frequencies and above. Because of the
current draw and the voltage that must be maintained on the
VCC_PLL pin, a low DC resistance inductor is required (less than
15 ).
Figure 4. VCC_PLL Power Supply Filter
Layout Recommendations
The MPC9229 provides sub-nanosecond output edge rates and
thus a good power supply bypassing scheme is a must. Figure 5.
shows a representative board layout for the MPC9229. There exists
many different potential board layouts and the one pictured is but
one. The important aspect of the layout in Figure 5. is the low
impedance connections between VCC and GND for the bypass
capacitors. Combining good quality general purpose chip capacitors
with good PCB layout techniques will produce effective capacitor
resonances at frequencies adequate to supply the instantaneous
switching current for the MPC9229 outputs. It is imperative that low
inductance chip capacitors are used; it is equally important that the
board layout does not introduce back all of the inductance saved by
using the leadless capacitors. Thin interconnect traces between the
capacitor and the power plane should be avoided and multiple large
vias should be used to tie the capacitors to the buried power planes.
Fat interconnect and large vias will help to minimize layout induced
inductance and thus maximize the series resonant point of the
bypass capacitors. Note the dotted lines circling the crystal oscillator
connection to the device. The oscillator is a series resonant circuit
and the voltage amplitude across the crystal is relatively small. It is
imperative that no actively switching signals cross under the crystal
as crosstalk energy coupled to these lines could significantly impact
the jitter of the device. Special attention should be paid to the layout
of the crystal to ensure a stable, jitter free interface between the
crystal and the on-board oscillator. Although the MPC9229 has
several design features to minimize the susceptibility to power
supply noise (isolated power and grounds and fully differential PLL),
there still may be applications in which overall performance is being
degraded due to system power supply noise. The power supply filter
and bypass schemes discussed in this section should be adequate
to eliminate power supply noise related problems in most designs.
T2
S_CLOCK
S_DATA
S_LOAD
M[8:0]
N[1:0]
P_LOAD
T1 T0 N1 N0 M8 M7 M6 M5 M4 M3 M2 M1 M0
M, N
First
Bit
Last
Bit
VCC_PLL
VCC
MPC9229
C1, C2 = 0.01...0.1 µF
VCC
CF = 22 µF
RF = 10-15
C2
C1
MPC9229 REVISION 3 AUGUST 6, 2009 9 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
Figure 5. PCB Board Layout Recommendation
for the PLCC28 Package
Using the On-Board Crystal Oscillator
The MPC9229 features a fully integrated on-board crystal
oscillator to minimize system implementation costs. The oscillator is
a series resonant, multivibrator type design as opposed to the more
common parallel resonant oscillator design. The series resonant
design provides better stability and eliminates the need for large on
chip capacitors. The oscillator is totally self contained so that the
only external component required is the crystal. As the oscillator is
somewhat sensitive to loading on its inputs the user is advised to
mount the crystal as close to the MPC9229 as possible to avoid any
board level parasitics. To facilitate co-location surface mount
crystals are recommended, but not required. Because the series
resonant design is affected by capacitive loading on the XTAL
terminals loading variation introduced by crystals from different
vendors could be a potential issue. For crystals with a higher shunt
capacitance, it may be required to place a resistance across the
terminals to suppress the third harmonic. Although typically not
required, it is a good idea to layout the PCB with the provision of
adding this external resistor. The resistor value will typically be
between 500 and 1 K.
The oscillator circuit is a series resonant circuit and thus for
optimum performance a series resonant crystal should be used.
Unfortunately most crystals are characterized in a parallel resonant
mode. Fortunately there is no physical difference between a series
resonant and a parallel resonant crystal. The difference is purely in
the way the devices are characterized. As a result a parallel
resonant crystal can be used with the MPC9229 with only a minor
error in the desired frequency. A parallel resonant mode crystal used
in a series resonant circuit will exhibit a frequency of oscillation a few
hundred ppm lower than specified, a few hundred ppm translates to
kHz inaccuracies. In a general computer application this level of
inaccuracy is immaterial. Table 11. below specifies the performance
requirements of the crystals to be used with the MPC9229.
1
C2CF
XTAL
C1 C1
R1 = 10–15
C1 = 0.01 µF
C2 = 22 µF
C3 = 0.01 µF
= VCC
= GND
= Via Table 11. Recommended Crystal Specifications
Parameter Value
Crystal Cut Fundamental AT Cut
Resonance Series Resonance(1)
1. Refer to the accompanying text for series versus parallel
resonant discussion.
Frequency Tolerance ±75 ppm at 25°C
Frequency/Temperature Stability ±150 pm 0 to 70°C
Operating Range 0 to 70°C
Shunt Capacitance 5 7pF
Equivalent Series Resistance (ESR) 50 to 80
Correlation Drive Level 100 µW
Aging 5 ppm/Yr (First 3 Years)
PACKAGE DIMENSIONS
CASE 776-02
ISSUE D
28-LEAD PLCC PACKAGE
S
L-M
M
0.007 (0.180) N
S
T
K1
VIEW S
H
K
F
S
L-M
M
0.007 (0.180) N
S
T
B
S
L-M
S
0.010 (0.250) N
S
T
S
L-M
M
0.007 (0.180) N
S
T
U
S
L-M
M
0.007 (0.180) N
S
T
Z
G1X
VIEW D-D
VIEW S
S
L-M
S
0.010 (0.250) N
S
T
S
L-M
M
0.007 (0.180) N
S
T
0.004 (0.100)
G1
GJ
C
Z
R
E
A
SEATING
PLANE
S
L-M
M
0.007 (0.180) N
S
T
-T-
-N-
-M-
-L-
V
WD
D
Y BRK
28 1
MILLIMETERSINCHES
0.050 BSC 1.27 BSC
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
---
0.410
0.040
MAX
0.495
0.495
0.180
0.110
0.019
0.032
---
---
0.456
0.456
0.048
0.048
0.056
0.020
10˚
0.430
---
MIN
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
---
10.42
1.02
MAX
12.57
12.57
4.57
2.79
0.48
0.81
---
---
11.58
11.58
1.21
1.21
1.42
0.50
10˚
10.92
---
NOTES:
1.
2.
3.
4.
5.
6.
7.
DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXISTS
PLASTIC BODY AT MOLD PARTING LINE.
DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DEMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASITC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
MPC9229 REVISION 3 AUGUST 6, 2009 10 ©2009 Integrated Device Technology, Inc.
PACKAGE DIMENSIONS
12 REF
DIM MIN MAX
MILLIMETERS
A
A1
7.00 BSC
A2
0.80 BSC
b
9.00 BSC
b1 0.30 0.40
c0.09 0.20
c1 0.09 0.16
D
D1
e
E
E1
L
L1 1.00 REF
R1 0.08 0.20
R2
S
1
1.40 1.60
0.05 0.15
1.35 1.45
0.30 0.45
0.08 ---
9.00 BSC
7.00 BSC
0.50 0.70
q
q
0.20 REF
D1
D/2
EE1
1
8
9
17
25
32
D1/2
E1/2
E/2
4X
D
7
A
D
B
A-B0.20 H D
4X
A-B0.20 C D
6
64
4
DETAIL G
PIN 1 INDEX
DETAIL AD
R R2
θ˚
(S) L
(L1)
0.25
GAUGE PLANE
A2
A
A1
(θ1˚)
8X
R R1
e
SEATING
PLANE
DETAIL AD
0.1 C
C
32X
28X
H
DETAIL G
F
F
e/2 A, B, D
3
SECTION F-F
BASE
c1c
b
b1
METAL
A-B
M
0.20 DC
5 8
PLATING
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DATUMS A, B, AND D TO BE DETERMINED AT
DATUM PLANE H.
4. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE C.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED
THE MAXIMUM b DIMENSION BY MORE THAN
0.08-mm. DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD OR
PROTRUSION: 0.07-mm.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25-mm PER SIDE. D1 AND E1 ARE MAXIMUM
PLASTIC BODY SIZE DIMENSIONS INCLUDING
MOLD MISMATCH.
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.1-mm AND
0.25-mm FROM THE LEAD TIP.
CASE 873A-03
ISSUE B
32-LEAD LQFP PACKAGE
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
MPC9229 REVISION 3 AUGUST 6, 2009 11 ©2009 Integrated Device Technology, Inc.
MPC9229 Data Sheet 400MHZ LOW VOLTAGE PECL CLOCK SYNTHESIZER
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT
product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third
party owners.
Copyright 2009. All rights reserved.
6024 Silver Creek Valley Road
San Jose, California 95138
Sales
800-345-7015 (inside USA)
+408-284-8200 (outside USA)
Fax: 408-284-2775
www.IDT.com/go/contactIDT
Technical Support
netcom@idt.com
+480-763-2056