GND
FB
EN
VIN SW
VIN
C1
R3
D1
L1
R2
R1
C2 C3
VOUT
LMR10510
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMR10510
SNVS727C –OCTOBER 2011–REVISED JUNE 2019
LMR10510 5.5-V
IN
, 1-A Step-Down Voltage Regulator
in SOT-23 and WSON Packages
1
1 Features
1• Input Voltage Range of 3 V to 5.5 V
• Output Voltage Range of 0.6 V to 4.5 V
• Output Current up to 1 A
• 1.6-MHz (LMR10510X) and 3-MHz (LMR10510Y)
Switching Frequencies
• Low Shutdown IQ, 30 nA Typical
• Internal Soft Start
• Internally Compensated
• Current-Mode PWM Operation
• Thermal Shutdown
• SOT-23 (2.92 × 2.84 × 1 mm) and WSON
(3 × 3 × 0.8 mm) Packaging
• Tiny Overall Solution Reduces System Cost
• Create a custom design using the LMR10510 with
the WEBENCH®Power Designer
2 Applications
• Point-of-Load Conversions from 3.3-V- and 5-V
Rails
• Space Constrained Applications
• Battery Powered Equipment
• Industrial Distributed Power Applications
• Power Meters
• Portable Hand-Held Instruments
3 Description
The LMR10510 regulator is a monolithic, high
frequency, PWM step-down DC/DC converter in a 5-
pin SOT-23 and a 6-pin WSON package. It provides
all the active functions to provide local DC/DC
conversion with fast transient response and accurate
regulation in the smallest possible PCB area. The
LMR10510 is internally compensated, so it is simple
to use and requires few external components. The
ability to drive 1-A loads with an internal 130-mΩ
PMOS switch results in the best power density
available. The world-class control circuitry allows on-
times as low as 30 ns, thus supporting exceptionally
high frequency conversion over the entire 3-V to 5.5-
V input operating range down to the minimum output
voltage of 0.6 V.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LMR10510 SOT-23 (5) 2.90 mm × 1.60 mm
WSON (6) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
space
space
Simplified Application
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Description, continued.......................................... 3
6 Pin Configuration and Functions......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Recommended Operating Ratings............................ 4
7.3 Electrical Characteristics........................................... 5
7.4 Typical Performance Characteristics ........................ 6
8 Detailed Description.............................................. 9
8.1 Overview................................................................... 9
8.2 Functional Block Diagram....................................... 10
8.3 Feature Description................................................. 11
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Example .................................................... 20
10.3 Thermal Definitions............................................... 20
10.4 WSON Package.................................................... 22
11 Device and Documentation Support................. 23
11.1 Device Support .................................................... 23
11.2 Receiving Notification of Documentation Updates 23
11.3 Community Resources.......................................... 23
11.4 Trademarks........................................................... 23
11.5 Electrostatic Discharge Caution............................ 23
11.6 Glossary................................................................ 23
12 Mechanical, Packaging, and Orderable
Information........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C Page
• Editorial changes only; add WEBENCH links and top navigator icon for reference design................................................... 1
Changes from Revision A (April 2013) to Revision B Page
• Changed layout of National Semiconductor data sheet to TI format...................................................................................... 1
1
2
34
6
5
EN
FB
SW
DAP VINA
VIND
GND
VIN SW
2
1
3
5
4
EN FB
GND
3
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5 Description, continued
The LMR10510 is a constant frequency PWM buck regulator IC that delivers a 1-A load current. The regulator
has a preset switching frequency of 1.6 MHz or 3 MHz. This high frequency allows the LMR10510 to operate
with small surface mount capacitors and inductors, resulting in a DC/DC converter that requires a minimum
amount of board space. Even though the operating frequency is high, efficiencies up to 93% are easy to achieve.
External shutdown is included, featuring an ultra-low stand-by current of 30 nA. The LMR10510 utilizes current-
mode control and internal compensation to provide high-performance regulation over a wide range of operating
conditions. Additional features include internal soft-start circuitry to reduce inrush current, pulse-by-pulse current
limit, thermal shutdown, and output overvoltage protection.
6 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View NGG Package
6-Pin WSON
Top View
Pin Description: 5-Pin SOT-23
PIN DESCRIPTION
NO. NAME
1 SW Switch node. Connect to the inductor and catch diode.
2 GND Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible
to this pin.
3 FB Feedback pin. Connect to external resistor divider to set output voltage.
4 EN Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN
+ 0.3V.
5 VIN Input supply voltage.
Pin Descriptions 6-Pin WSON
PIN DESCRIPTION
NO. NAME
1 FB Feedback pin. Connect to external resistor divider to set output voltage.
2 GND Signal and power ground pin. Place the bottom resistor of the feedback network as close as
possible to this pin.
3 SW Switch node. Connect to the inductor and catch diode.
4 VIND Power Input supply.
5 VINA Control circuitry supply voltage. Connect VINA to VIND on PC board.
6 EN Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than
VINA + 0.3V.
DAP Die Attach Pad Connect to system ground for low thermal impedance, but it cannot be used as a primary GND
connection.
4
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(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for
which the device is intended to be functional, but does not ensure specfic performance limits. For specific specifications and test
conditions, see Electrical Characteristics
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
7 Specifications
7.1 Absolute Maximum Ratings(1)(2)
VIN -0.5V to 7V
FB Voltage -0.5V to 3V
EN Voltage -0.5V to 7V
SW Voltage -0.5V to 7V
ESD Susceptibility 2kV
Junction Temperature(3) 150°C
Storage Temperature −65°C to +150°C
For soldering specifications: http://www.ti.com/lit/SNOA549C
7.2 Recommended Operating Ratings
VIN 3V to 5.5V
Junction Temperature −40°C to +125°C
5
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(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Applies for packages soldered directly onto a 3” × 3” PC board with 2-oz. copper on 4 layers in still air.
7.3 Electrical Characteristics
VIN = 5 V unless otherwise indicated under the Conditions column. Limits in standard type are for TJ= 25°C only; limits in
boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified
through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ= 25°C, and are
provided for reference purposes only.(1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback Voltage 0.588 0.600 0.612 V
ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3V to 5V 0.02 %/V
IBFeedback Input Bias Current 0.1 100 nA
UVLO Undervoltage Lockout VIN Rising 2.73 2.90 V
VIN Falling 1.85 2.3
UVLO Hysteresis 0.43 V
FSW Switching Frequency LMR10510-X 1.2 1.6 1.95 MHz
LMR10510-Y 2.25 3.0 3.75
DMAX Maximum Duty Cycle LMR10510-X 86 94 %
LMR10510-Y 82 90
DMIN Minimum Duty Cycle LMR10510-X 5 %
LMR10510-Y 7
RDS(ON) Switch On Resistance WSON Package 150 mΩ
SOT-23 Package 130 195
ICL Switch Current Limit VIN = 3.3V 1.2 1.75 A
VEN_TH Shutdown Threshold Voltage 0.4 V
Enable Threshold Voltage 1.8
ISW Switch Leakage 100 nA
IEN Enable Pin Current Sink/Source 100 nA
IQQuiescent Current (switching) LMR10510X VFB = 0.55 3.3 5mA
LMR10510Y VFB = 0.55 4.3 6.5 mA
Quiescent Current (shutdown) All Options VEN = 0V 30 nA
θJA Junction to Ambient
0 LFPM Air Flow(3) WSON Package 80 °C/W
SOT-23 Package 118
θJC Junction to Case WSON Package 18 °C/W
SOT-23 Package 80
TSD Thermal Shutdown Temperature 165 °C
-45 -40 -10 20 50 80 110 125 130
TEMPERATURE (ºC)
OSCILLATOR FREQUENCY (MHz)
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
LMR10510Y
LMR10510X
-45 -40 -10 20 50 80 110 125 130
TEMPERATURE (ºC)
OSCILLATOR FREQUENCY (MHz)
1.36
1.41
1.46
1.51
1.56
1.61
1.66
1.71
1.76
1.81
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
1.8Vout
3.3Vout
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
40
50
60
70
80
90
100
EFFICIENCY (%)
LOAD CURRENT (A)
1.8Vout
3.3Vout
6
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7.4 Typical Performance Characteristics
Unless stated otherwise, all curves taken at VIN = 5 V with configuration in typical application circuit shown in Figure 15. TJ=
25°C, unless otherwise specified.
VIN = 5 V VOUT = 1.8 V and 3.3 V
Figure 1. Ηvs Load "X"
VIN = 5 V VOUT = 1.8 V and 3.3 V
Figure 2. Ηvs Load "Y"
VIN = 3.3 V VOUT = 1.8 V
Figure 3. Ηvs Load "X And Y" Figure 4. Oscillator Frequency vs Temperature - "X"
Figure 5. Oscillator Frequency vs Temperature - "Y"
VIN = 3.3 V
Figure 6. Current Limit vs Temperature
-45 -40 -10 20 50 80 110 125 130
TEMPERATURE (ºC)
FEEBACK VOLTAGE (V)
0.590
0.595
0.600
0.605
0.610
-45 -40 -10 20 50 80 110 125 130
TEMPERATURE (ºC)
3.0
3.1
3.2
3.3
3.4
3.5
3.6
IQ (mA)
-45 -40 -10 20 50 80 110 125 130
TEMPERATURE (ºC)
4.0
4.1
4.2
4.3
4.4
4.5
4.6
IQ (mA)
7
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Typical Performance Characteristics (continued)
Unless stated otherwise, all curves taken at VIN = 5 V with configuration in typical application circuit shown in Figure 15. TJ=
25°C, unless otherwise specified.
Figure 7. RDSON vs Temperature (WSON Package) Figure 8. RDSON vs Temperature (Sot-23 Package)
Figure 9. LMR10510X IQ(Quiescent Current) Figure 10. LMR10510Y IQ(Quiescent Current)
Figure 11. VFB vs Temperature
VIN = 5 V VOUT = 1.2 V at 1 A
Figure 12. Gain vs Frequency
8
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Typical Performance Characteristics (continued)
Unless stated otherwise, all curves taken at VIN = 5 V with configuration in typical application circuit shown in Figure 15. TJ=
25°C, unless otherwise specified.
VIN = 5 V VOUT = 1.2 V at 1 A
Figure 13. Phase Plot vs Frequency
0
0
VIN
VD
TON
t
t
Inductor
Current
D = TON/TSW
VSW
TOFF
TSW
IL
IPK
SW
Voltage
9
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8 Detailed Description
8.1 Overview
The following operating description of the LMR10510 refers to Functional Block Diagram and to the waveforms in
Figure 14. The LMR10510 supplies a regulated output voltage by switching the internal PMOS control switch at
constant frequency and variable duty cycle. A switching cycle begins at the falling edge of the reset pulse
generated by the internal oscillator. When this pulse goes low, the output control logic turns on the internal
PMOS control switch. During this on-time, the SW pin voltage (VSW) swings up to approximately VIN, and the
inductor current (IL) increases with a linear slope. ILis measured by the current sense amplifier, which generates
an output proportional to the switch current. The sense signal is summed with the regulator’s corrective ramp and
compared to the error amplifier’s output, which is proportional to the difference between the feedback voltage
and VREF. When the PWM comparator output goes high, the output switch turns off until the next switching cycle
begins. During the switch off-time, inductor current discharges through the Schottky catch diode, which forces the
SW pin to swing below ground by the forward voltage (VD) of the Schottky catch diode. The regulator loop
adjusts the duty cycle (D) to maintain a constant output voltage.
Figure 14. Typical Waveforms
cv
+
-
+
-
S
R
R
Q
+
-
GND
FB
SW
VIN
EN
+
-
+
-
DRIVER
Artificial
Ramp
SHDN
Thermal
SHDN
OVP
1.6 MHz
CompInternal-
SENSE
I
LIMIT
I
LDOInternal-
STARTSOFT-
PFET
SENSE
I
ENABLE and UVLO
15.1 x REF
VControl Logic
VREF = 0.6V
10
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8.2 Functional Block Diagram
11
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8.3 Feature Description
8.3.1 Soft Start
This function forces VOUT to increase at a controlled rate during start up. During soft-start, the error amplifier’s
reference voltage ramps from 0V to its nominal value of 0.6 V in approximately 600 µs. This forces the regulator
output to ramp up in a controlled fashion, which helps reduce inrush current.
8.3.2 Output Overvoltage Protection
The overvoltage comparator compares the FB pin voltage to a voltage that is 15% higher than the internal
reference VREF. Once the FB pin voltage goes 15% above the internal reference, the internal PMOS control
switch is turned off, which allows the output voltage to decrease toward regulation.
8.3.3 Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the LMR10510 from operating until the input voltage exceeds 2.73 V
(typical). The UVLO threshold has approximately 430 mV of hysteresis, so the device operates until VIN drops
below 2.3 V (typical). Hysteresis prevents the part from turning off during power up if VIN is non-monotonic.
8.3.4 Current Limit
The LMR10510 uses cycle-by-cycle current limiting to protect the output switch. During each switching cycle, a
current limit comparator detects if the output switch current exceeds 1.75A (typical), and turns off the switch until
the next switching cycle begins.
8.3.5 Thermal Shutdown
Thermal shutdown limits total power dissipation by turning off the output switch when the IC junction temperature
exceeds 165°C. After thermal shutdown occurs, the output switch doesn’t turn on until the junction temperature
drops to approximately 150°C.
FB
GND
SW
EN VOUT
L1
D1
R1
R2
VINA/VIND
C1 C4
U1
C2
GND
EN
2
6
4, 5
1
3
R3
Chf
2.2 PF
VIN
C3
GND
22 PF
20k
10k 2.2 PF22 PF22 nF
(opt.)
1.0 PH
3.3 PH
(³;´YHUVLRQ)
1.8V
12
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LMR10510 is internally compensated, so it is simple to use and requires few external components. The
regulator has a preset switching frequency of 1.6 MHz or 3 MHz. This high frequency allows the LMR10510 to
operate with small surface mount capacitors and inductors, resulting in a DC/DC converter that requires a
minimum amount of board space
9.2 Typical Application
Figure 15. Typical Application Schematic
9.2.1 Detailed Design Procedure
9.2.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LMR10510 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
TS = 1
fS
x (VIN - VOUT)
L = 2'iL
DTS
VIN - VOUT
L=2'iL
DTS
t
L
i'
OUT
I
S
T
S
DT
L
VOUT
L
- VOUT
VIN
D = VOUT + VD
VIN + VD - VSW
D =VOUT
VIN
13
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Typical Application (continued)
9.2.1.2 Inductor Selection
The duty cycle (D) can be approximated quickly using the ratio of output voltage (VO) to input voltage (VIN):
The catch diode (D1) forward voltage drop and the voltage drop across the internal PMOS must be included to
calculate a more accurate duty cycle. Calculate D by using the following formula:
VSW can be approximated by:
VSW = IOUT x RDSON
The diode forward drop (VD) can range from 0.3 V to 0.7 V depending on the quality of the diode. The lower the
VD, the higher the operating efficiency of the converter. The inductor value determines the output ripple current.
Lower inductor values decrease the size of the inductor, but increase the output ripple current. An increase in the
inductor value will decrease the output ripple current.
One must ensure that the minimum current limit (1.2 A) is not exceeded, so the peak current in the inductor must
be calculated. The peak current (ILPK) in the inductor is calculated by:
ILPK = IOUT +ΔiL
Figure 16. Inductor Current
In general,
ΔiL= 0.1 x (IOUT)→0.2 x (IOUT)
If ΔiL= 20% of 1 A, the peak current in the inductor will be 1.2 A. The minimum specified current limit over all
operating conditions is 1.2 A. One can either reduce ΔiL, or make the engineering judgment that zero margin will
be safe enough. The typical current limit is 1.75 A.
The LMR10510 operates at frequencies allowing the use of ceramic output capacitors without compromising
transient response. Ceramic capacitors allow higher inductor ripple without significantly increasing output ripple.
See the Output Capacitor section for more details on calculating output voltage ripple. Now that the ripple current
is determined, the inductance is calculated by:
where
•
'VOUT = 'ILRESR + 8 x FSW x COUT
1
IRMS_IN = IOUT x D(1 - D)
IRMS_IN D IOUT2 (1-D) + 'i2
3
14
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Typical Application (continued)
When selecting an inductor, make sure that it is capable of supporting the peak output current without saturating.
Inductor saturation will result in a sudden reduction in inductance and prevent the regulator from operating
correctly. Because of the speed of the internal current limit, the peak current of the inductor need only be
specified for the required maximum output current. For example, if the designed maximum output current is 1 A
and the peak current is 1.25 A, then the inductor should be specified with a saturation current limit of > 1.25A.
There is no need to specify the saturation or peak current of the inductor at the 1.75 A typical switch current limit.
The difference in inductor size is a factor of 5. Because of the operating frequency of the LMR10510, ferrite
based inductors are preferred to minimize core losses. This presents little restriction since the variety of ferrite-
based inductors is huge. Lastly, inductors with lower series resistance (RDCR) will provide better operating
efficiency. For recommended inductors see examples in Other System Examples.
9.2.1.3 Input Capacitor
An input capacitor is necessary to ensure that VIN does not drop excessively during switching transients. The
primary specifications of the input capacitor are capacitance, voltage, RMS current rating, and ESL (Equivalent
Series Inductance). The recommended input capacitance is 22 µF.The input voltage rating is specifically stated
by the capacitor manufacturer. Make sure to check any recommended deratings and also verify if there is any
significant change in capacitance at the operating input voltage and the operating temperature. The input
capacitor maximum RMS input current rating (IRMS-IN) must be greater than:
Neglecting inductor ripple simplifies the above equation to:
It can be shown from the above equation that maximum RMS capacitor current occurs when D = 0.5. Always
calculate the RMS at the point where the duty cycle D is closest to 0.5. The ESL of an input capacitor is usually
determined by the effective cross sectional area of the current path. A large leaded capacitor will have high ESL
and a 0805 ceramic chip capacitor will have very low ESL. At the operating frequencies of the LMR10510,
leaded capacitors may have an ESL so large that the resulting impedance (2πfL) will be higher than that required
to provide stable operation. As a result, surface mount capacitors are strongly recommended.
Sanyo POSCAP, Tantalum or Niobium, Panasonic SP, and multilayer ceramic capacitors (MLCC) are all good
choices for both input and output capacitors and have very low ESL. For MLCCs it is recommended to use X7R
or X5R type capacitors due to their tolerance and temperature characteristics. Consult capacitor manufacturer
datasheets to see how rated capacitance varies over operating conditions.
9.2.1.4 Output Capacitor
The output capacitor is selected based upon the desired output ripple and transient response. The initial current
of a load transient is provided mainly by the output capacitor. The output ripple of the converter is:
When using MLCCs, the ESR is typically so low that the capacitive ripple may dominate. When this occurs, the
output ripple will be approximately sinusoidal and 90° phase shifted from the switching action. Given the
availability and quality of MLCCs and the expected output voltage of designs using the LMR10510, there is really
no need to review any other capacitor technologies. Another benefit of ceramic capacitors is their ability to
bypass high frequency noise. A certain amount of switching edge noise will couple through parasitic
capacitances in the inductor to the output. A ceramic capacitor will bypass this noise while a tantalum will not.
Since the output capacitor is one of the two external components that control the stability of the regulator control
loop, most applications will require a minimum of 22 µF of output capacitance. Capacitance often, but not always,
can be increased significantly with little detriment to the regulator stability. Like the input capacitor, recommended
multilayer ceramic capacitors are X7R or X5R types.
D = VOUT + VD + VDCR
VIN + VD + VDCR - VSW
D = VOUT + VD
VIN + VD - VSW
K = POUT
POUT + PLOSS
K =POUT
PIN
x R2
R1 = VREF
VOUT - 1
15
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Typical Application (continued)
9.2.1.5 Catch Diode
The catch diode (D1) conducts during the switch off-time. A Schottky diode is recommended for its fast switching
times and low forward voltage drop. The catch diode should be chosen so that its current rating is greater than:
ID1 = IOUT x (1-D)
The reverse breakdown rating of the diode must be at least the maximum input voltage plus appropriate margin.
To improve efficiency, choose a Schottky diode with a low forward voltage drop.
9.2.1.6 Output Voltage
The output voltage is set using the following equation where R2 is connected between the FB pin and GND, and
R1 is connected between VOand the FB pin. A good value for R2 is 10 kΩ. When designing a unity gain
converter (Vo = 0.6V), R1 must be between 0 Ωand 100 Ω, and R2 must be equal or greater than 10 kΩ.
VREF = 0.60V
9.2.1.7 Calculating Efficiency, and Junction Temperature
The complete LMR10510 DC/DC converter efficiency can be calculated in the following manner.
Or
Calculations for determining the most significant power losses are shown below. Other losses totaling less than
2% are not discussed.
Power loss (PLOSS) is the sum of two basic types of losses in the converter: switching and conduction.
Conduction losses usually dominate at higher output loads, whereas switching losses remain relatively fixed and
dominate at lower output loads. The first step in determining the losses is to calculate the duty cycle (D):
VSW is the voltage drop across the internal PFET when it is on, and is equal to:
VSW = IOUT x RDSON
VDis the forward voltage drop across the Schottky catch diode. It can be obtained from the diode manufactures
Electrical Characteristics section. If the voltage drop across the inductor (VDCR) is accounted for, the equation
becomes:
The conduction losses in the free-wheeling Schottky diode are calculated as follows:
PDIODE = VD× IOUT × (1-D)
Often this is the single most significant power loss in the circuit. Take care to choose a Schottky diode that has a
low forward-voltage drop.
Another significant external power loss is the conduction loss in the output inductor. The equation can be
simplified to:
PIND = IOUT2× RDCR
PCOND= (IOUT2 x D) 1
3
1 + x'iL
IOUT
2RDSON
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Typical Application (continued)
The LMR10510 conduction loss is mainly associated with the internal PFET:
If the inductor ripple current is fairly small, the conduction losses can be simplified to:
PCOND = IOUT2× RDSON x D
Switching losses are also associated with the internal PFET. They occur during the switch on and off transition
periods, where voltages and currents overlap resulting in power loss. The simplest means to determine this loss
is to empirically measuring the rise and fall times (10% to 90%) of the switch at the switch node.
Switching Power Loss is calculated as follows:
PSWR = 1/2(VIN x IOUT x FSW x TRISE)
PSWF = 1/2(VIN x IOUT x FSW x TFALL)
PSW = PSWR + PSWF
Another loss is the power required for operation of the internal circuitry:
PQ= IQx VIN
IQis the quiescent operating current, and is typically around 3.3mA for the 1.6MHz frequency option.
Typical Application power losses are:
Table 1. Power Loss Tabulation
VIN 5 V
VOUT 3.3 V POUT 3.3 W
IOUT 1 A
VD0.45 V PDIODE 150 mW
FSW 1.6 MHz
IQ3.3 mA PQ17 mW
TRISE 4 ns PSWR 16 mW
TFALL 4 ns PSWF 16 mW
RDS(ON) 150 mΩPCOND 100 mW
INDDCR 70 mΩPIND 70 mW
D 0.667 PLOSS 369 mW
η88% PINTERNAL 149 mW
ΣPCOND + PSW + PDIODE + PIND + PQ= PLOSS
ΣPCOND + PSWF + PSWR + PQ= PINTERNAL
PINTERNAL = 149 mW
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9.2.2 Application Curves
VOUT = 1.8 V IOUT = 500 mA
Figure 17. Line Regulation
VIN = 3.3 V VOUT = 1.8 V (All Options)
Figure 18. Load Regulation
VIN = 5 V VOUT = 1.8 V (All Options)
Figure 19. Load Regulation
VIN = 5 V VOUT = 3.3 V (All Options)
Figure 20. Load Regulation
GND
FB
EN
VIN SW
VIN = 5V
C1
R3
D1
L1
LMR10510
R2
R1
C2
VO = 3.3V @ 1.0A
100k
22 PF
10V
1.6 PH
2.0A
1.5A
20V
45.3k
22 PF
6.3V
100k
GND
FB
EN
VIN SW
VIN = 5V
C1
R3
D1
L1
LMR10510
R2
R1
C2
VO = 3.3V @ 1.0A
100k
22 PF
10V
2.2 PH
1.8A
1.5A
20V
45.3k
22 PF
6.3V
100k
GND
FB
EN
VIN SW
VIN = 5V
C1
R3
D1
L1
LMR10510
R2
R1
C2
VO = 1.2V @ 1.0A
100k
22 PF
10V
3.3 PH
1.5A
1.5A
20V
15k
15k 22 PF
6.3V
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9.2.3 Other System Examples
9.2.3.1 LMR10510x Design Example 1
Figure 21. LMR10510X (1.6 MHz): VIN =5V,VOUT =1.2Vat1A
9.2.3.2 Lmr10510X Design Example 2
Figure 22. LMR10510X (1.6 MHz): VIN =5V,VOUT =3.3Vat1A
9.2.3.3 LMR10510Y Design Example 3
Figure 23. LMR10510Y (3 MHz): VIN =5V,VOUT =3.3Vat1A
GND
FB
EN
VIN SW
VIN = 5V
C1
R3
D1
L1
LMR10510
R2
R1
C2
VO = 1.2V @ 1.0A
100k
22 PF
10V
1.6 PH
2.0A
1.5A
20V
10k
10k
22 PF
6.3V
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9.2.3.4 LMR10510Y Design Example 4
Figure 24. LMR10510Y (3 MHz): VIN =5V,VOUT =1.2Vat1A
RT='T
Power
1
2
4
6
5
EN
FB
SW
VINA
VIND
GND GND
PLANE
3
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10 Layout
10.1 Layout Guidelines
When planning layout there are a few things to consider when trying to achieve a clean, regulated output. The
most important consideration is the close coupling of the GND connections of the input capacitor and the catch
diode D1. These ground ends should be close to one another and be connected to the GND plane with at least
two through-holes. Place these components as close to the IC as possible. Next in importance is the location of
the GND connection of the output capacitor, which should be near the GND connections of CIN and D1. There
should be a continuous ground plane on the bottom layer of a two-layer board except under the switching node
island. The FB pin is a high impedance node and care should be taken to make the FB trace short to avoid noise
pickup and inaccurate regulation. Place he feedback resistors as close as possible to the IC, with the GND of R1
placed as close as possible to the GND of the IC. The VOUT trace to R2 should be routed away from the inductor
and any other traces that are switching. High AC currents flow through the VIN, SW and VOUT traces, so they
should be as short and wide as possible. However, making the traces wide increases radiated noise, so the
designer must make this trade-off. Radiated noise can be decreased by choosing a shielded inductor. Place the
remaining componentsas close as possible to the IC. See Application Note AN-1229 for further considerations
and the LMR10510 demo board as an example of a good layout.
10.2 Layout Example
Figure 25. 6-Lead WSON PCB Dog Bone Layout
10.3 Thermal Definitions
TJ= Chip junction temperature
TA= Ambient temperature
RθJC = Thermal resistance from chip junction to device case
RθJA = Thermal resistance from chip junction to ambient air
Heat in the LMR10510 due to internal power dissipation is removed through conduction and/or convection.
Conduction: Heat transfer occurs through cross sectional areas of material. Depending on the material, the
transfer of heat can be considered to have poor to good thermal conductivity properties (insulator vs. conductor).
Heat Transfer goes as:
Silicon →package →lead frame →PCB
Convection: Heat transfer is by means of airflow. This could be from a fan or natural convection. Natural
convection occurs when air currents rise from the hot device to cooler air.
Thermal impedance is defined as:
Thermal impedance from the silicon junction to the ambient air is defined as:
RTJA=165° - Ta
PINTERNAL
RTJC=TJ - TC
Power
RTJA=TJ - TA
Power
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Thermal Definitions (continued)
The PCB size, weight of copper used to route traces and ground plane, and number of layers within the PCB can
greatly effect RθJA. The type and number of thermal vias can also make a large difference in the thermal
impedance. Thermal vias are necessary in most applications. They conduct heat from the surface of the PCB to
the ground plane. Four to six thermal vias should be placed under the exposed pad to the ground plane if the
WSON package is used.
Thermal impedance also depends on the thermal properties of the application operating conditions (Vin, Vo, Io
etc), and the surrounding circuitry.
Silicon Junction Temperature Determination Method 1:
To accurately measure the silicon temperature for a given application, two methods can be used. The first
method requires the user to know the thermal impedance of the silicon junction to case temperature.
RθJC is approximately 18°C/Watt for the 6-pin WSON package with the exposed pad. Knowing the internal
dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically
measured on the bench we have:
where TCis the temperature of the exposed pad and can be measured on the bottom side of the PCB.
Therefore:
Tj= (RθJC x PLOSS)+TC
From the previous example:
Tj= (RθJC x PINTERNAL)+TC
Tj= 18°C/W x 0.149W + TC
The second method can give a very accurate silicon junction temperature.
The first step is to determine RθJA of the application. The LMR10510 has over-temperature protection circuitry.
When the silicon temperature reaches 165°C, the device stops switching. The protection circuitry has a
hysteresis of about 15°C. Once the silicon temperature has decreased to approximately 150°C, the device will
start to switch again. Knowing this, the RθJA for any application can be characterized during the early stages of
the design one may calculate the RθJA by placing the PCB circuit into a thermal chamber. Raise the ambient
temperature in the given working application until the circuit enters thermal shutdown. If the SW-pin is monitored,
it will be obvious when the internal PFET stops switching, indicating a junction temperature of 165°C. Knowing
the internal power dissipation from the above methods, the junction temperature, and the ambient temperature
RθJA can be determined.
Once this is determined, the maximum ambient temperature allowed for a desired junction temperature can be
found.
An example of calculating RθJA for an application using the LMR10510 is shown below.
A sample PCB is placed in an oven with no forced airflow. The ambient temperature was raised to 147°C, and at
that temperature, the device went into thermal shutdown.
From the previous example:
PINTERNAL = 149 mW
RTJA=165°C - 147°C
149 mW = 121°C/W
22
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Thermal Definitions (continued)
Since the junction temperature must be kept below 125°C, then the maximum ambient temperature can be
calculated as:
Tj- (RθJA x PLOSS)=TA
125°C - (121°C/W x 149 mW) = 107°C
10.4 WSON Package
Figure 26. Internal WSON Connection
For certain high power applications, the PCB land may be modified to a "dog bone" shape (see Figure 25). By
increasing the size of ground plane, and adding thermal vias, the RθJA for the application can be reduced.
23
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
11.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the LMR10510 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMR10510XMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH7B
LMR10510XMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH7B
LMR10510XMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH7B
LMR10510YMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH9B
LMR10510YMFE/NOPB ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH9B
LMR10510YMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SH9B
LMR10510YSD/NOPB ACTIVE WSON NGG 6 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L268B
LMR10510YSDE/NOPB ACTIVE WSON NGG 6 250 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L268B
LMR10510YSDX/NOPB ACTIVE WSON NGG 6 4500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L268B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMR10510XMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510XMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510XMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510YMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510YMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510YMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMR10510YSD/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LMR10510YSDE/NOPB WSON NGG 6 250 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
LMR10510YSDX/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Apr-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMR10510XMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMR10510XMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0
LMR10510XMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMR10510YMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMR10510YMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0
LMR10510YMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMR10510YSD/NOPB WSON NGG 6 1000 210.0 185.0 35.0
LMR10510YSDE/NOPB WSON NGG 6 250 210.0 185.0 35.0
LMR10510YSDX/NOPB WSON NGG 6 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Apr-2019
Pack Materials-Page 2
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PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
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EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
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EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
MECHANICAL DATA
NGG0006A
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SDE06A (Rev A)
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