08/2005
PRODUCT DESCRIPTION
As with previous generations, the AWT6171R
integrated CMOS power control scheme simplifies
the design of the transmitter by eliminating the need
for external power control circuitry.
The AWT6171R input and output terminals are
internal matched to 50 ohms and DC blocked at the
AWT6171R
GSM850/GSM900/DCS/PCS
Quad Band Power Amplifier Module
With Integrated Power Control
PRELIMINARY DATA SHEET - Rev 1.0
M15 Package
18 Pin 6 mm x 6 mm x 1.3 mm
Amplifier Module
FEATURES
• Integrated Vreg (regulated supply)
• Harmonic Performance ≤ -20 dBm
• High Efficiency (PAE) at Pmax:
-GSM850, 54 %
-GSM900, 55 %
-DCS, 52 %
-PCS, 52 %
• +34.5 dBm GSM850/900 Output Power at 3.5 V
• +31.5 dBm DCS/PCS Output Power at 3.5 V
• 55 dB Dynamic Range
• GPRS Class 12 Capable
• RoHS Compliant Package, 250°C MSL-3
APPLICATIONS
• Dual/Tri/Quad Band Handsets & PDAs
CMOS BIAS/Integrated Power Control
VCC2
H(s)
VCC2
DCS/PCSIN
GSM850/900IN GSM850/900OU
DCS/PCSOUT
VCC_OUT
BS
TX EN
VBATT
CEXT
VRAMP
MATCH
MATCH MATCH
MATCH
RF outputs, reducing the number of external
components required in the final application. Both
PA die, GSM850/900 and DCS/PCS, are fabricated
using state of the art InGaP HBT technology, known
for it is proven reliability and temperature stability.
Figure 1: Block Diagram
AWT6171R