CC2595 www.ti.com SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 2.4-GHz RF FRONT END Check for Samples: CC2595 FEATURES * 1 * * * Low Cost and Small Package Very Few External Components 2.0-V to 3.6-V Operation * * * Less Than 1-A Current Consumption in Power Down Mode Low Transmit Current Consumption 98 mA at 3 V for +20.7 dBm Out (PAE = 40%) RoHS Compliant 3- x 3-mm QFN-16 Package DESCRIPTION CC2595 is a PA solution that extends the range of any Zigbee or Bluetooth transceiver. It is a cost-effective and high performance RF front end for low-power and low-voltage wireless applications in the 2.4-GHz band. Its single-ended RF input and output make it compatible with any manufacturer's transceiver if appropriate external parts are used. When a transmit/receive (T/R) switch and a balun are used, it can interface with existing and future CC24XX and CC25XX transceiver products. CC2595 extends the link budget by providing a power amplifier for improved output power. It is highly effective for high (+20 dBm) output power making it suitable for battery-operated systems. CC2595 contains PA and RF-matching for simple design of high performance wireless applications. It is packaged in a 3- x 3-mm, 16-lead QFN package with exposed paddle. FUNCTIONAL BLOCK DIAGRAM AVDD_PA1 AVDD_PA2 RF_IN RF_OUT Bias and Logic RBIAS1 RBIAS2 AVDD_BIAS PA_EN 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2010-2011, Texas Instruments Incorporated CC2595 SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. GND 1 RF_IN 2 GND AVDD_PA1 GND GND PIN ASSIGNMENTS 16 15 14 13 12 RF_OUT 11 GND 10 RF_OUT 3 x 3 QFN - 16 9 5 6 7 8 PAEN 4 RBIAS2 GND RBIAS1 3 AVDD_BIAS GND GND Figure 1. CC2595 Pinout Table 1. Pin Descriptions for CC2595 2 PIN NO. PIN NAME TYPE 1 GND GND 2 RF_IN RF in/out 3 GND GND DESCRIPTION RF single-ended input 4 GND GND 5 AVDD_BIAS Power Supply voltage, analog and logic 6 RBIAS1 Analog Bias set resistor, stage 1 7 RBIAS2 Analog Bias set resistor, stage 2 8 PAEN Digital in 9 GND GND 10 RF_OUT RF in/out 11 GND GND 12 RF_OUT RF in/out 13 GND GND 14 GND GND 15 AVDD_PA1 Power 16 GND GND Chip enable: high = PA on RF single-ended output (1 of 2) RF single-ended output (2 of 2) Supply voltage, PA stage 1 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated Product Folder Links: CC2595 CC2595 www.ti.com SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 Table 2. ORDERING INFORMATION (1) (1) (2) TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING -40C to 85C RGT (QFN) CC2595RGTR C2595 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Supply voltage range Voltage on any digital pin VALUE UNIT -0.3 to 3.6 V -0.3 to VDD + 0.3, max 3.6 V +10 dBm RF input power RF_IN TSTG Storage temperature range -50 to 150 C TJ Junction temperature 150 C RF pins 1500 ESD (1) Excluding RF pins HBM (Human Body Model) V 2000 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN Operating supply voltage TA Operating free air temperature range NOM MAX UNIT 2 3.6 V -40 85 C MAX UNIT ELECTRICAL CHARACTERISTICS TJ = 25C, VDD = 3 V (unless otherwise specified) PARAMETER TEST CONDITIONS Current consumption No input signal Power down current EN = LOW MIN 30 High input level (control pin) 1.3 Low input level (control pin) Power down Transmit TYP Time from EN goes HIGH to settled in TX mA 1 A VDD V 0.3 V 1 s Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated Product Folder Links: CC2595 3 CC2595 SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 www.ti.com RF CHARACTERISTICS TJ = 25C, VDD = 3 V (unless otherwise specified) PARAMETER TEST CONDITIONS f Frequency range of operation POUT Output power Pin = 0 dBm PAE Power added efficiency Pin = 0 dBm POUTHI Output power (high) VDD = 3.3 V, Pin = +3 dBm PAEHI Power added efficiency (high) VDD = 3.3 V, Pin = +3 dBm P1dB Output 1-dB compression point IRL Input return loss ORL Output return loss +22 8 Output power variation over supply voltage 2 V to 3.6 V Output power variation over temperature -40C to 85C The harmonics can be further reduced by using an external LC filter and antenna. Stability Load mismatch MAX UNIT 2483.5 MHz +20.7 dBm 40 2400 MHz to 2483.5 MHz 2nd harmonic 4 +20 Output power variation over frequency 3rd harmonic TYP 2400 10 Harmonics K MIN +22.5 % dBm 45 % +17 dBm 15 dB 10 dB 0.5 dB 4 dB 1 dB Compliant with international regulatory standards Compliant with international regulatory standards Unconditionally stable No damage at 10:1 VSWR condition; all phases Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated Product Folder Links: CC2595 CC2595 www.ti.com SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 TYPICAL CHARACTERISTICS PA Output Power, PAE, Current Consumption and Gain vs Input Power (3-V Supply) 60 120 50 100 PA Output Power vs Supply, 0-dBm Input 22 21 40 80 20 60 Gain 19.5 40 I_supply 19 POUT 10 0 -25 20 18.5 18 0 -20 20 -15 -10 PIN - dBm -5 0 5 2 2.2 2.4 2.6 Noise Figure and Gain vs Frequency (3-V Supply) 30 7 28 25 22 Gain 5 24 4 22 POUT - dBm 26 6 3.6 49.0% P OUT (3.3 V) 48.0% 47.0% POUT (3 V) 21 46.0% 20 PAE (3.3 V) 19 18 43.0% PAE (3 V) 20 Noise Figure 16 2 2.44 2.46 2.48 f- Frequency - GHz 2.5 18 2.52 15 2.38 Figure 4. 45.0% 44.0% 17 2.42 3.4 50.0% 23 Gain - dB Noise Figure - dB 24 2.4 3.2 POUT and PAE vs Frequency (3-V Supply, 0-dBm Input and 3.3-V Supply, +3-dBm Input) 8 2.38 3 VSUPPLY - V Figure 3. Figure 2. 3 2.8 PAE - % 30 20.5 Gain - dB PAE Current - mA PAE - %, POUT - dBm, Gain - dB 21.5 42.0% 41.0% 2.4 2.42 2.44 2.46 2.48 f - Frequency - GHz 2.5 40.0% 2.52 Figure 5. Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated Product Folder Links: CC2595 5 CC2595 SWRS090A - SEPTEMBER 2010 - REVISED MARCH 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) POUT and PAE vs Frequency (Three Temperatures and 3-V Supply, 0-dBm Input) 23 POUT (-40C) POUT (27C) 21 Pout - dBm 20 47.0% 46.0% POUT (85C) 19 45.0% PAE (-40C) 44.0% 43.0% 18 PAE (27C) 17 42.0% 16 41.0% PAE (85C) 15 14 13 2.38 2.4 PAE - % 22 48.0% 40.0% 39.0% 2.42 2.44 2.46 2.48 2.5 Frequency - GHz 38.0% 2.52 Figure 6. 6 Submit Documentation Feedback Copyright (c) 2010-2011, Texas Instruments Incorporated Product Folder Links: CC2595 PACKAGE OPTION ADDENDUM www.ti.com 11-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) CC2595RGTR ACTIVE VQFN RGT 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595 CC2595RGTT ACTIVE VQFN RGT 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Aug-2017 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC2595RGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 CC2595RGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2595RGTR VQFN RGT 16 3000 336.6 336.6 28.6 CC2595RGTT VQFN RGT 16 250 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE RGT0016C VQFN - 1 mm max height SCALE 3.600 PLASTIC QUAD FLATPACK - NO LEAD 3.1 2.9 A B PIN 1 INDEX AREA 3.1 2.9 C 1 MAX SEATING PLANE 0.05 0.00 0.08 1.68 0.07 (0.2) TYP 5 12X 0.5 8 EXPOSED THERMAL PAD 4 9 4X 1.5 SYMM 1 12 16X PIN 1 ID (OPTIONAL) 13 16 0.1 0.05 SYMM 16X 0.30 0.18 C A B 0.5 0.3 4222419/B 11/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RGT0016C VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 1.68) SYMM 13 16 16X (0.6) 1 12 16X (0.24) SYMM (0.58) TYP 12X (0.5) (2.8) 9 4 ( 0.2) TYP VIA 5 (R0.05) ALL PAD CORNERS 8 (0.58) TYP (2.8) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4222419/B 11/2016 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN RGT0016C VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 1.55) 16 13 16X (0.6) 1 12 16X (0.24) 17 SYMM (2.8) 12X (0.5) 9 4 METAL ALL AROUND 5 SYMM 8 (R0.05) TYP (2.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 17: 85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X 4222419/B 11/2016 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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