AVDD_PA1
RF_IN
Bias and Logic
RBIAS1
AVDD_BIAS PA_EN
RBIAS2
AVDD_PA2
RF_OUT
CC2595
www.ti.com
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
2.4-GHz RF FRONT END
Check for Samples: CC2595
1FEATURES • Less Than 1-μA Current Consumption in
Power Down Mode
• Low Cost and Small Package • Low Transmit Current Consumption
• Very Few External Components • 98 mA at 3 V for +20.7 dBm Out (PAE = 40%)
• 2.0-V to 3.6-V Operation • RoHS Compliant 3- x 3-mm QFN-16 Package
DESCRIPTION
CC2595 is a PA solution that extends the range of any Zigbee or Bluetooth transceiver. It is a cost-effective and
high performance RF front end for low-power and low-voltage wireless applications in the 2.4-GHz band. Its
single-ended RF input and output make it compatible with any manufacturer’s transceiver if appropriate external
parts are used. When a transmit/receive (T/R) switch and a balun are used, it can interface with existing and
future CC24XX and CC25XX transceiver products. CC2595 extends the link budget by providing a power
amplifier for improved output power. It is highly effective for high (+20 dBm) output power making it suitable for
battery-operated systems. CC2595 contains PA and RF-matching for simple design of high performance wireless
applications. It is packaged in a 3- x 3-mm, 16-lead QFN package with exposed paddle.
FUNCTIONAL BLOCK DIAGRAM
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1
2
3
4
12
11
10
9
5 6 7 8
16 15 14 13
3 x 3 QFN - 16
GND
AVDD_PA1
GND
GND
GND
RF_IN
GND
GND
AVDD_BIAS
RBIAS1
RBIAS2
PAEN
GND
RF_OUT
GND
RF_OUT
CC2595
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PIN ASSIGNMENTS
Figure 1. CC2595 Pinout
Table 1. Pin Descriptions for CC2595
PIN NO. PIN NAME TYPE DESCRIPTION
1 GND GND
2 RF_IN RF in/out RF single-ended input
3 GND GND
4 GND GND
5 AVDD_BIAS Power Supply voltage, analog and logic
6 RBIAS1 Analog Bias set resistor, stage 1
7 RBIAS2 Analog Bias set resistor, stage 2
8 PAEN Digital in Chip enable: high = PA on
9 GND GND
10 RF_OUT RF in/out RF single-ended output (1 of 2)
11 GND GND
12 RF_OUT RF in/out RF single-ended output (2 of 2)
13 GND GND
14 GND GND
15 AVDD_PA1 Power Supply voltage, PA stage 1
16 GND GND
2Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Links: CC2595
CC2595
www.ti.com
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
Table 2. ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
–40ºC to 85ºC RGT (QFN) CC2595RGTR C2595
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted). VALUE UNIT
Supply voltage range -0.3 to 3.6 V
Voltage on any digital pin -0.3 to VDD + 0.3, max 3.6 V
RF input power RF_IN +10 dBm
TSTG Storage temperature range –50 to 150 °C
TJJunction temperature 150 °C
RF pins 1500
ESD HBM (Human Body Model) V
Excluding RF pins 2000
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Operating supply voltage 2 3.6 V
TAOperating free air temperature range –40 85 °C
ELECTRICAL CHARACTERISTICS
TJ= 25°C, VDD = 3 V (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Current consumption No input signal 30 mA
Power down current EN = LOW 1 µA
High input level (control pin) 1.3 VDD V
Low input level (control pin) 0.3 V
Power down →Transmit Time from EN goes HIGH to settled in TX 1 µs
Copyright © 2010–2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: CC2595
CC2595
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
www.ti.com
RF CHARACTERISTICS
TJ= 25°C, VDD = 3 V (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f Frequency range of operation 2400 2483.5 MHz
POUT Output power Pin = 0 dBm +20 +20.7 dBm
PAE Power added efficiency Pin = 0 dBm 40 %
POUTHI Output power (high) VDD = 3.3 V, Pin = +3 dBm +22 +22.5 dBm
PAEHI Power added efficiency (high) VDD = 3.3 V, Pin = +3 dBm 45 %
P1dB Output 1-dB compression point +17 dBm
IRL Input return loss 10 15 dB
ORL Output return loss 8 10 dB
Output power variation over frequency 2400 MHz to 2483.5 MHz 0.5 dB
Output power variation over supply voltage 2 V to 3.6 V 4 dB
Output power variation over temperature -40°C to 85°C 1 dB
Compliant with international
2nd harmonic The harmonics can be further regulatory standards
Harmonics reduced by using an external Compliant with international
LC filter and antenna.
3rd harmonic regulatory standards
K Stability Unconditionally stable
No damage at 10:1 VSWR
Load mismatch condition; all phases
4Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Links: CC2595
18
20
22
24
26
28
30
Gain - dB
2
3
4
5
6
7
8
Noise Figure - dB
2.38 2.4 2.42 2.44 2.46 2.48 2.5 2.52
f- Frequency - GHz
Gain
Noise Figure
15
16
17
18
19
20
21
22
23
24
25
2.38 2.4 2.42 2.44 2.46 2.48 2.5 2.52
f - Frequency - GHz
P - dBm
OUT
40.0%
41.0%
42.0%
43.0%
44.0%
45.0%
46.0%
47.0%
48.0%
49.0%
50.0%
PAE - %
P (3.3 V)
OUT
P (3 V)
OUT
PAE (3.3 V)
PAE (3 V)
18
18.5
19
19.5
20
20.5
21
21.5
22
2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
VSUPPLY - V
Gain - dB
PAE - %, P - dBm, Gain - dB
OUT
PAE
Gain
I_supply
POUT
0
20
40
60
80
100
120
Current - mA
-25 -20 -15 -10 -5 0 5
P - dBm
IN
0
10
20
30
40
50
60
CC2595
www.ti.com
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
TYPICAL CHARACTERISTICS
PA Output Power, PAE, Current Consumption and Gain
vs PA Output Power
Input Power vs
(3-V Supply) Supply, 0-dBm Input
Figure 2. Figure 3.
Noise Figure and Gain POUT and PAE
vs vs
Frequency Frequency
(3-V Supply) (3-V Supply, 0-dBm Input and 3.3-V Supply, +3-dBm Input)
Figure 4. Figure 5.
Copyright © 2010–2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: CC2595
13
14
15
16
17
18
19
20
21
22
23
2.38 2.4 2.42 2.44 2.46 2.48 2.5 2.52
Frequency - GHz
P - dBm
out
38.0%
39.0%
40.0%
41.0%
42.0%
43.0%
44.0%
45.0%
46.0%
47.0%
48.0%
PAE - %
P (27°C)
OUT
P (-40°C)
OUT
P (85°C)
OUT
PAE (27°C)
PAE (-40°C)
PAE (85°C)
CC2595
SWRS090A –SEPTEMBER 2010–REVISED MARCH 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
POUT and PAE
vs
Frequency
(Three Temperatures and 3-V Supply, 0-dBm Input)
Figure 6.
6Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Links: CC2595
PACKAGE OPTION ADDENDUM
www.ti.com 11-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CC2595RGTR ACTIVE VQFN RGT 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595
CC2595RGTT ACTIVE VQFN RGT 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 C2595
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Aug-2017
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CC2595RGTR VQFN RGT 16 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
CC2595RGTT VQFN RGT 16 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Aug-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC2595RGTR VQFN RGT 16 3000 336.6 336.6 28.6
CC2595RGTT VQFN RGT 16 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Aug-2017
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
16X 0.30
0.18
1.68 0.07
16X 0.5
0.3
1 MAX
(0.2) TYP
0.05
0.00
12X 0.5
4X
1.5
A3.1
2.9 B
3.1
2.9
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/B 11/2016
PIN 1 INDEX AREA
0.08
SEATING PLANE
1
49
12
58
16 13
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05
EXPOSED
THERMAL PAD
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 3.600
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
16X (0.24)
16X (0.6)
( 0.2) TYP
VIA
12X (0.5)
(2.8)
(2.8)
(0.58)
TYP
( 1.68)
(R0.05)
ALL PAD CORNERS (0.58) TYP
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/B 11/2016
SYMM
1
4
58
9
12
13
16
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
www.ti.com
EXAMPLE STENCIL DESIGN
16X (0.6)
16X (0.24)
12X (0.5)
(2.8)
(2.8)
( 1.55)
(R0.05) TYP
VQFN - 1 mm max heightRGT0016C
PLASTIC QUAD FLATPACK - NO LEAD
4222419/B 11/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SYMM
ALL AROUND
METAL
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
SYMM
1
4
58
9
12
13
16
17
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