MIC5236-3.3YMM-TR - MICROCHIP TECHNOLOGY

TLP290(SE

TOSHIBA Photocoupler GaAs Ired & Photo-Transistor

TLP290(SE

Programmable Controllers

AC/DC-Input Module

Hybrid ICs

TLP290(SE consist of photo transistor, optically coupl ed to two gallium

arsenide infrared emitting dio de connected inverse parallel, and can operate

directly by AC input current.

The TLP290(SE is housed in the ver y small and thin SO4 package.

Since TLP290(SE are guaranteed wide operating temperature (Ta=-55 to 110

˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density

surface mounting applications such as programmable controllers and hybrid

ICs.

TOSHIBA 11-3C1

Weight: 0.05 g (typ.)

Unit: mm

 Collector-Emitter voltage : 80 V (min)

 Current transfer ratio : 50% (min)

Rank GB : 100% (min)

 Isolation voltage : 3750 Vrms (min)

 Guaranteed performance over -55 to 110 ˚C

 UL recognized : UL1577, File No. E67349

TLP290

1: Anode

Cathode

2: Cathode

Anode

3: Emitter

4: Collector

Pin Configuration

 cUL approved : CSA Component Acceptance Service No.5A,

File No. E67349

 SEMKO conformity : EN 60065: 2002,

EN 60950-1: 2001, EN 60335-1: 2002,

 BSI conformity : BS EN 60065: 2002, BS EN 60950-1: 2006,

 VDE conformity : EN 60747-5-5

Construction Mechanical Rating

Creepage distance: 5.0 mm (min)

Clearance: 5.0 mm (min)

Insulation thickness: 0.4 mm (min)

2013-05-27

TLP290(SE

Current Transfer Ratio (Unless otherwise specified, Ta = 25°C)

Current Transfer Ration (%)

(IC / IF)

IF = 5 mA, VCE = 5 V, Ta = 25°C

TYPE Classification

(Note1)

Min Max

Marking of Classification

Blank 50 600

Blank, YE, GR, BL, GB

Rank Y 50 150 YE

Rank GR 100 300 GR

Rank GB 100 600 GB

TLP290

Rank BL 200 600 BL

Note1: Specify both the part number and a rank in this format when ordering

(e.g.) rank GB: TLP290(GB,SE

For safety standard certification, ho wever, specify the part number alone.

(e.g.) TLP290(GB,SE: TLP290

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)

Characteristic Symbol

Note Rating

Unit

R.M.S. forward current IF(RMS) ±50 mA

Input forward current derating (Ta  90°C) IF /Ta -1.5 mA /°C

Input forward current (pulsed) IFP (Note 2) ±1 A

Input power dissipation PD 100 mW

Input power dissipation derating (Ta  90°C) PD/Ta -3.0 mW/°C

LED

Junction temperature Tj 125 °C

Collector-emitter voltage VCEO 80 V

Emitter-collector voltage VECO 7 V

Collector current IC 50 mA

Collector power dissipation PC 150 mW

Collector power dissipation derating (Ta  25°C) PC /Ta -1.5 mW /°C

Detector

Junction temperature Tj 125 °C

Operating temperature range Topr -55 to 110 °C

Storage temperature range Tstg -55 to 125 °C

Lead soldering temperature Tsol 260 (10s) °C

Total package power dissipation PT 200 mW

Total package power dissipation derating (Ta  25°C) PT /Ta -2.0 mW /°C

Isolation voltage BVS (Note3) 3750 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temp erature/current/voltage and the

significant change in temperature, etc.) ma y cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability up on reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Der ating Concept and Methods”) and individu al reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note2: Pulse width ≤ 100μs, frequency 100Hz

Note3: AC, 1min., R.H. 60%, Device considered a two terminal device: LED side pins shorted together and

detector side pins shorted together.

2013-05-27

TLP290(SE

2013-05-27

Electrical Characteristics (Unless otherwise specified, Ta = 25°C)

Characteristic Symbol Test Condition Min Typ Max Unit

Input forward voltage VF I

F = ±10 mA 1.1 1.25 1.4 V

LED

Input capacitance CT V = 0 V, f = 1 MHz - 60 - pF

Collector-emitter breakdown voltage V(BR) CEO IC = 0.5 mA 80 - - V

Emitter-collector breakdown voltage V(BR) ECO IE = 0.1 mA 7 - - V

VCE = 48 V, - 0.01 0.08 μA

Dark current ICEO VCE = 48 V, Ta = 85°C - 2 50 μA

Detector

Collector-emitter capacitance CCE V = 0 V, f = 1 MHz - 10 - pF

Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)

Characteristic Symbol Test Condition MIn Typ. Max Unit

50 - 600

Current transfer ratio IC / IF IF = ±5 mA, VCE = 5 V Rank GB 100 - 600 %

- 60 -

Saturated CTR IC / IF (sat) IF = ±1 mA, VCE = 0.4 V

Rank GB 30 - - %

IC = 2.4 mA, IF = ±8 mA - - 0.3

- 0.2 -

Collector-emitter

saturation voltage VCE (sat) IC = 0.2 mA, IF = ±1 mA

Rank GB - - 0.3

Off-state collector current IC(off) V

F = ± 0.7 V, VCE = 48 V - - 10 μA

Collector current ratio IC (ratio) IC (IF = -5 mA) / IC (IF = 5 mA)

(Fig.1)

0.33 - 3 -

Fig.1: Collector current ratio test circuit

5V)

I5V)

C(ratio)

I





VCE

IC1

IC2

IF1

IF2

TLP290(SE

Isolation Characteristics (Unless otherwise specified, Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Total capacitance (input to output) CS VS = 0V, f = 1 MHz - 0.8 - pF

Isolation resistance RS VS = 500 V, R.H. 60% 1×1012 1014 - Ω

AC, 1 minute 3750 - -

AC, 1 second, in oil - 10000 - Vrms

Isolation voltage BVS

DC, 1 minute, in oil - 10000 - Vdc

Switching Characteristics (Unless otherwise specified, Ta = 25°C)

Characteristic Symbol Test Condition Min Typ. Max Unit

Rise time tr - 2 -

Fall time tf - 3 -

Turn-on time ton - 3 -

Turn-off time toff

VCC = 10 V, IC = 2 mA

RL = 100 Ω

- 3 -

μs

Turn-on time ton - 0.5 -

Storage time ts - 30 -

Turn-off time toff

RL = 1.9 kΩ (Fig.2)

VCC = 5 V, IF = ±16 mA - 50 -

μs

(Fig. 2): Switching time test circuit

VCE

IF IF

VCE

0.5V

4.5V

toff

ton

2013-05-27

TLP290(SE

IF-Ta PC-Ta

Input forward current IF (mA)

Collector power dissipation PC (mW)

Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)

IFP-DR IF-VF

Input forward current (pulsed)

IFP (mA)

Input forward current IF (mA)

Duty cycle ratio DR Input forward voltage VF (V)

VF/Ta-IF IFP – VFP

Input forward current temperature coefficient

ΔVF /ΔTa (mV/°C)

Input forward current (pulsed) IFP (mA)

Input forward current IF (mA) Input forward voltage (pulsed) VFP (V)

Pules width 100μs

Ta=25˚C

100

1000

10000

10-3 10-2 10-1 100

Pulse width 10μs

Repetitive frequency=100Hz

Ta=25°C

This curve shows the

maximum limit to the input

forward current. This curve shows the maximum

limit to the collector power

dissipation.

Thi

s curve s

ows

maximum limit to the input

forward current (pulsed).

110˚C

85˚C

50˚C

25˚C

0˚C

-25˚C

-55˚C

Note: The above characteristics curves are pr esented for reference only and not guaranteed by production test,

unless otherwise noted.

2013-05-27

TLP290(SE

2013-05-27

IC-VCE IC-VCE

Collector current IC (mA)

Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V)

IC-IF IC/IF -IF

Collector current IC (mA)

Current transfer ratio IC / IF (%)

Input forward voltage IF (mA) Input forward current IF (mA)

ICEO-Ta VCE(sat) - Ta

Dark current ICEO (μA)

Collector-emitter saturation voltage

VCE(sat) (V)

Ambient temperature Ta (°C) Ambient temperature Ta (°C)

Note: The above characteristics curves are pr esented for reference only and not guaranteed by production test,

unless otherwise noted.

VCE=10V

VCE=5V

VCE=0.4V

VCE=10V

VCE=5V

VCE=0.4V

IF=8mA,

IC=2.4mA

Ta=25˚C

IF = 5mA

10 mA

15 mA

20 mA

30 mA

50 mA

PC(max)

5 m

10 mA

15 m

IF = 2

20 m

30 m

50 m

Ta=25˚C

VCE=48

24V

10V

TLP290(SE

IC - Ta

Collector current IC (mA)

Ambient temperature Ta (°C)

Switching time - RL Switching time - Ta

Switching time (μs)

Load resistance RL (kΩ) Ambient temperature Ta (°C)

25 m

10 m

5 m

1 m

=0.5m

IF=16mA

VCC=5V

Ta=25˚C

IF=16mA

VCC=5V RL=1.9k

toff

ton

toff

Ton

VCE=5V

Note: The above characteristics curves are pr esented for reference only and not guaranteed by production test,

unless otherwise noted.

2013-05-27

TLP290(SE

Soldering and Storage

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflo w

·Temperature profile example of lead (Pb) solder

·Temperature profile example of using lead (Pb)-free solder

Reflow soldering must be performed once or twice.

Time (s)

(°C)

240

210

160

60 to 120s less than 30s

Package surface temperature

140

Time

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the sold er paste

type used by the customer within the

described profile.

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the sold er paste

type used by the customer within the

described profile.

(°C)

260

230

190

60 to 120s

30 to 50s

180

Package surface temperature

(s)

The mounting should be com plete d with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for le ad (Pb) solder, or lead (Pb)-free solder)

･Please preheat it at 150°C between 60 and 120 seconds.

･Complete soldering withi n 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iro n

Complete soldering within 10 seconds below 260° C, or within 3 seconds at 350°C. Each pin may

be heated at most once.

2013-05-27

TLP290(SE

2. Storage

1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.

2) Follow the precaution s printed on the packing label of the device for transportation and stora ge.

3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,

respectively.

4) Do not store the products in locations with poisonous gases (especially corrosive gase s ) or in dusty

conditions.

5) Store the products in locations with mi nimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

6) When restoring devices after removal from their packing, use anti-static containers.

7) Do not allow loads to be applied dire ctly to devices while they ar e in storage.

8) If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ea se of soldering prior to use.

2013-05-27

TLP290(SE

2013-05-27

RESTRICTIONS ON PRODUCT USE

 Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

 This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

 Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

 PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

 Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

 Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

 The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

 ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMEN T.

 GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

 Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.