Approval sheet
Page 8 of 10 ASC_WFxxU_V22 Oct.2016
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
TEST PROCEDURE Resistor
DC resistance
Clause 4.5 DC resistance values measured
Within the specified tolerance
Temperature
Coefficient of
Resistance(T.C.
R)
Clause 4.8
Natural resistance change per change in degree
centigrade.
( )
6
121
12 10×
−
ttR RR
(ppm/°C)
R
1
: Resistance at reference temperature
R
2
: Resistance at test temperature
t
1
: 20°C+5°C-1°C
t2 : 125°C+5°C-1°C
Refer to
“ QUICK REFERENCE DATA “
Short time
overload
(S.T.O.L)
Clause 4.13
Permanent resistance change after a 5second
application of a voltage 2.5 times RCWV or the
maximum overload voltage specified in the above list,
whichever is less.
∆R/R max. ±(0.1%+0.05Ω)
Resistance to
soldering
heat(R.S.H)
IEC 60068-2-
58:2004
Un-mounted chips completely immersed for
10±1second in a SAC solder bath at 260℃±5ºC no visible damage
∆ R/R max. ±(0.1%+0.05Ω)
Solderability
IEC 60068-2-
58:2004
Un-mounted chips completely immersed for 2±0.5
second in a SAC solder bath at 235℃±5℃ good tinning (>95% covered)
no visible damage
Temperature
cycling
Clause 4.19
30 minutes at -55°C±3°C, 2~3 minutes at
20°C+5°C-1°C, 30 minutes at +155 °C±3°C, 2~3
minutes at 20°C+5°C-1°C, total 5 continuous
cycles
no visible damage
∆R/R max. ±(0.25%+0.05Ω)
Load life
(endurance)
Clause 4.25
70±2ºC, 1000 hours, loaded with RCWV or
Vmax,1.5 hours on and 0.5 hours off ∆R/R max. ±(0.25%+0.05Ω)
Load life in
Humidity
Clause 4.24
1000 hours, at rated continuous working voltage in
humidity chamber controller at 40°C±2°C and
90~95% relative humidity, 1.5hours on and 0.5 hours
off
∆R/R max. ±(0.25%+0.05Ω)
Bending strength
Clause 4.33 Resistors mounted on a 90mm glass epoxy resin
PCB(FR4); bending : 3 mm, once for 10 seconds. ∆R/R max. ±(0.1%+0.05Ω)
Adhesion
Clause 4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or removal of the
terminations.