1 of 16 June 21, 1999
1999 Integrated Device Technology, Inc.
Features
Dual issue super-scalar execution core
-300 MHz frequency
-Dual issue floating-point ALU operations with other
instruction classes
-Traditional 5-stage pipeline, minimizes load and branch
latencies
Single-cycle repeat rate for most floating point ALU oper-
ations
High level of performance for a variety of applications
-High-performance 64-bit integer unit achieves 400 dhry-
stone MIPS (dhrystone 2.1)
-Ultra high-performance floating-point accelerator,
directly implementing single- and double-precision oper-
ations achieves 600mflops
-Extremely large on-chip primary cache
-On-chip secondary cache controller
MIPS-IV 64-bit ISA for improved computation
-Compound floating-point operations for 3D graphics and
floating-point DSP
-Conditional move operations
Large, efficient on-chip caches
-32KB Instruction Cache, 32KB Data Cache
-2-set associative in each cach
-Virtually indexed and physically tagged to minimize cache
flushes
-Write-back and write-through selectable on a per page
basis
-Critical word first cache miss processing
-Supports back-to-back loads and stores in any combination
at full pipeline rate
High-performance memory system
-Large primary caches integrated on-chip
-Secondary cache control interface on-chip
-High-frequency 64-bit bus interface runs up to 125MHz
-Aggregate bandwidth of on-chip caches, system interface
of 5.6GB/s
-High-performance write protocols for graphics and data
communications
Compatible with a variety of operating systems
-Windows™ CE
-Numerous MIPS-compatible real-time operating systems
Uses input system clock, with processor pipeline clock multi-
plied by a factor of 2-8
Large on-chip TLB
Active power management, including use of WAIT operation
Block diagram
Instruction Tag B
ITLB Physical
Write Buffer
DVA
IVA
Floating-point Control
Integer Control
DBus
Tag AuxTag
IntIBus
FPIBus
ABus
Data Set A
Store Buffer
Phase Lock Loop
Data Tag A Instruction Set A
DTLB Physical
Instruction Select
Integer Instruction Register
FP Instruction Register
Data Set B
Read Buffer
Address Buffer
Instruction Tag A
SysAD
Control
Floating Point Register File
Unpacker/Packer Joint TLB
Coprocessor 0
System/Memory
Control
PC Incrementer
Branch Adder
Instruction TLB Virtual
Program Counter
Load Aligner
Integer Register File
Integer/Address Adder
Data TLB Virtual
Shifter/Store Aligner
Logic Unit
Integer Multiply, Divide
Floating Point
MAdd,Add,Sub, Cvt
Div, SqRt
Instruction Set B
MULTI-ISSUE
64-BITMICROPROCESSOR 79RC5000
The IDT logo is a registered trademark and RC4600, RC4640, RC4650, RC4700, RC5000, RV5000, and RISController are trademarks of Integrated Device Technology, Inc.
MIPS is a registered trademark of MIPS Computer Systems, Inc.
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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DESCRIPTION
The RC5000 serves many performance critical embedded
applications, such as high-end internetworking systems, color
printers, and graphics terminals.
The RC5000 is optimized for high-performance applications,
with special emphasis on system bandwidth and floating point
operations, through integration of high-performance computational
units and a high-performance memory hierarchy. For this class of
application, the result is a relatively low-cost CPU capable of
approximately 400 Dhrystone MIPS.
IDT’s objectives in offering the RC5000 include:
Offering a high performance upgrade path to existing
embedded customers in the internetworking, office auto-
mation and visualization markets.
Providing a significant improvement in the floating- point
performance currently available in a moderately priced
MIPS CPU.
Providing improvements in the memory hierarchy of desk-
top systems by using large primary caches and integrat-
ing a secondary cache controller.
Enabling improvements in performance through the use of
the MIPS-IV ISA.
Instruction issue mechanism
The RC5000 recognizes two general classes of instructions for
multi-issue:
Floating-point ALU
All others
These instruction classes are pre-decoded by the RC5000, as
they are brought on-chip. The pre-decoded information is stored in
the instruction cache.
Assuming that there are no pending resource conflicts, the
RC5000 can issue one instruction per class per pipeline clock
cycle. Note that this broad separation of classes insures that there
are no data dependencies to restrict multi-issue.
However, long-latency resources in either the floating-point ALU
(e.g. DIV or SQRT instructions) or instructions in the integer unit
(such as multiply) can restrict the issue of instructions. Note that
the R5000 does not perform out-of-order or speculative execution;
instead, the pipeline slips until the required resource becomes
available.
There are no alignment restrictions on dual-issue instruction
pairs. The RC5000 fetches two instructions from the cache per
cycle. Thus, for optimal performance, compilers should attempt to
align branch targets to allow dual-issue on the first target cycle,
since the instruction cache only performs aligned fetches.
Instruction set architecture
The RC5000 implements the MIPS-IV 64-bit ISA, including CP1
and CP1X functional units (and their instruction set).
Integer pipeline
The RC5000 is a limited dual-issue machine that utilizes a tradi-
tional 5-stage integer pipeline. This basic integer pipeline of the
RC5000 is illustrated in Figure 1. The integer instruction execution
speed is tabulated (in number of pipeline clocks) as follows:
The RC5000’s short pipeline keeps the load and branch latencies
very low. The caches contain special logic that allows any combina-
tion of loads and stores to execute in back-to-back cycles without
requiring pipeline slips or stalls. (This assumes that the operation
does not miss in the cache.)
Operation Latency Repeat
Load 2 1
Store 2 1
MULT/MULTU 8 8
DMULT/DMULTU 12 12
DIV/DIVU 36 36
DDIV/DDIVU 68 68
Other Integer ALU 1 1
Branch 2 2
Jump 2 2
Table 1: Integer Instruction Execution Speed
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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Figure 1 R5000 Integer Pipeline Stages
I0 1I 2I 1R 2R 1A 2A 1D 2D 1W 2W
I1 1I 2I 1R 2R 1A 2A 1D 2D 1W 2W
I2 1I 2I 1R 2R 1A 2A 1D 2D 1
W
I3 1I 2I 1R 2R 1A 2A 1D
I4 1I 2I 1R 2R 1A
one cycle
Key to Figure
1I-1R Instruction cache access
2I Instruction virtual to physical address translation
2A-
2D Data cache access and load align
1D Data virtual to physical address translation
1D-
2D Virtual to physical address translation
2R Register file read
2R Bypass calculation
2R Instruction decode
2R Branch address calculation
1A Issue or slip decision
1A-
2A Integer add, logical, shift
1A Data virtual address calculation
2A Store align
1A Branch decision
2W Register file write
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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RC5000 Computational Units
The RC5000 contains the following computational units:
Integer ALU. The RC5000 implements a full, single-cycle 64-bit
ALU for all integer ALU functions other than multiply and divide.
Bypassing is used to support back-to-back ALU operations at the
full pipeline rate, without requiring stalls for data dependencies.
Integer Multiply/Divide Unit. This unit is separated from the
primary ALU, to allow these longer latency operations to run in
parallel with other operations. The pipeline stalls only if an attempt
to access the HI or LO registers is made before the operation
completes.
Floating-point ALU. This unit is responsible for all CP1/CP1X
ALU operations other than DIV/SQRT. The unit is pipelined to allow
a single-cycle repeat rate for single-precision operations
Floating-point DIV/SQRT unit. This unit is separated from the
other floating-point ALU, so that these long latency operations do
not prevent the issue of other floating point operations.
In addition, the RC5000 implements separate logical units to
implement loads, stores, and branches.
Operating frequency
The input clock operates in a frequency range of 33MHz to
100MHz. The pipeline frequency for the RC5000 is 2 to 8 times the
input clock (up to the maximum for the speed grade of CPU).
Thermal considerations
The RC5000 utilizes special packaging techniques, to improve
the thermal properties of high-speed processors. The RC5000 is
packaged using cavity down packaging in a 223-pin PGA package
with integral thermal slug, and a 272-pin BGA package. These
packages effectively dissipate the power of the CPU, increasing
device reliability.
The RC5000 utilizes an all-aluminum package with the die
attached to a normal copper lead frame mounted to the aluminum
casing. Due to the heat-spreading effect of the aluminum, the
package allows for an efficient thermal transfer between the die
and the case. The aluminum offers less internal resistance from
one end of the package to the other, reducing the temperature
gradient across the package and therefore presenting a greater
area for convection and conduction to the PCB for a given temper-
ature. Even nominal amounts of airflow will dramatically reduce the
junction temperature of the die, resulting in cooler operation.
The RC5000 is guaranteed in a case temperature range of 0° to
+85° C. The type of package, speed (power) of the device, and
airflow conditions affect the equivalent ambient temperature condi-
tions that will meet this specification.
The equivalent allowable ambient temperature, TA, can be
calculated using the thermal resistance from case to ambient
(CA) of the given package.
The following equation relates ambient and case temperatures:
TA = TC - P * CA
where P is the maximum power consumption at hot temperature,
calculated by using the maximum ICC specification for the device.
Typical values for CA at various airflows are shown in Table 1.
Table 2: Thermal Resistance (CA) at Various Airflows
Note: The RC5000 implements advanced power management to
substantially reduce the average power dissipation of the device. This
operation is described in the IDT79RV5000 RISC Microprocessor
Reference Manual.
Note:
Per the RC5000 Documentation errata, Revicion 1.0, dated
February 1999 and per the RC5000 Device errata, dated February
1999, mode bits 20, 33 and 37 must be set to 1.
Revision history
Changes to version dated January 1996:
Pin Description section:
-Corrected pin list for Clock/Control, Initialization, and
Secondary Cache interfaces.
Advance Pin-Out section:
-Changed pins AA19 and AA21 from Vcc to Vss.
Changes to version dated March 1997:
-Upgraded data sheet status from “Preliminary” to Final.
-Added section on thermal considerations
-Added section on absolute maximum ratings
Changes to version dated June 1997:
-Revised Power Consumption and System Interface Param-
eters
Changes to version dated September 1997:
-Added user notation on Boot Mode Bits 20 and 33 for 200
MHz frequency
Changes to version dated June 1998:
-Added 250 MHz
-Changed naming conventions
Changes to version dated June 1999:
-Added 267 MHz and 300 MHz
CA
Airflow (ft/min) 0200 400 600 800 1000
PGA 16 7532.5 2
BGA 14 6 4 3 2.5 2
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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Logic diagram
Table 3: RC5000 Logic Symbol Diagram
SysAD(63:0)
SysADC(7:0)
SysCmd(8:0)
SysCmdP
ValidIn*
ValidOut*
ExtRqst*
Release*
WrRdy*
BigEndian
SysClock
VccOk
ColdReset*
Reset*
VccP
VssP
Vcc
Vss
ScWord (1:0)
ScTCE*
ScTDE*
ScTOE*
ScCLR*
ScDCE*
ScDOE*
ScLine (15:0)
ScMATCH
Int (5:0)*
NMI*
ModeClock
ModeIN
JTDI
JTDO
JTMS
JTCK
ScCWE*
Initialization
Interface Secondary Cache Interface
Interrupt
System Interface
Clock Interface
RC5000
Logic
Symbol
64
8
9
16
6
RdRdy*
JTAG
Interface Interface
2
34
34
ScVALID
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Pin description
The RC5000 implements a bus similar to that of the RC4700. Table 2 lists and describes the RC5000 signals.
Pin Name Type Description
System interface
ExtRqst* Input External Request.
Signals that the system interface needs to submit an external request.
Release* Output Release Interface.
Signals that the processor is releasing the system interface to slave state
RdRdy* Input Read Ready.
Signals that an external agent can now accept a processor read.
WrRdy* Input Write Ready.
Signals that an external agent can now accept a processor write request.
ValidIn* Input Valid Input.
Signals that an external agent is now driving a valid address or data on the SysAD bus and a
valid com mand or data identifier on the SysCmd bus.
ValidOut* Output Valid Output.
Signals that the processor is now driving a valid address or data on the SysAD bus and a valid
com mand or data identifier on the SysCmd bus.
SysAD(63:0) Input/Output System Address/Data bus.
A 64-bit address and data bus for communication between the processor and an external
agent.
SysADC(7:0) Input/Output System Address/Data check bus.
An 8-bit bus containing parity check bits for the SysAD bus during data bus cycles.
SysCmd(8:0) Input/Output System Command/data identifier bus.
A 9-bit bus for command and data identifier transmission between the processor and an exter-
nal agent.
SysCmdP Input/Output Reserved System Command/data identifier bus parity.
For the RC5000, unused on input and zero on output.
Clock/control interface
SysClock Input Master Clock.
Master clock input at the bus frequency. The pipeline clock is derived by multiplying this clock
up.
VCCP Input Quiet VCC for PLL.
Quiet VCC for the internal phase locked loop.
VSSP Input Quiet VSS for PLL.
Quiet VSS for the internal phase locked loop.
Interrupt interface
Int(5:0)* Input Interrupt.
Six general processor interrupts, bit-wise ORed with bits 5:0 of the interrupt register.
NMI* Input Non-maskable interrupt. Non-maskable interrupt, ORed with bit 6 of the interrupt register.
Table 4: RC5000 Signal Names and Descriptions (Page 1 of 3)
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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JTAG interface:
JTDI Input JTAG Data In.
Connected directly to JTDO. No JTAG implemented; should be pulled High.
JTCK Input JTAG Clock Input.
Unused input; should be pulled High.
JTDO Output JTAG Data Out.
Connected directly to JTDI. If no external scan used, this is a no connect.
JTMS Input JTAG Command.
Unused input. Should be pulled High.
Initialization interface:
VCCOk Input VCC is OK.
When asserted, this signal indicates to the RC5000 that the power supply has been aboveVcc
mini mum for more than 100 milliseconds and will remain stable. The assertion of VCCOk ini-
tiates the read ing of the boot-time mode control serial stream.
ColdReset* Input Cold Reset.
This signal must be asserted for a power on reset or a cold reset. ColdReset must be de-
asserted syn chronously with SysClock.
Reset* Input Reset.
This signal must be asserted for any reset sequence. It may be asserted synchronously or
asynchro nously for a cold reset, or synchronously to initiate a warm reset. Reset must be syn-
chronously de-asserted with SysClock.
ModeClock Output Boot Mode Clock.
Serial boot-mode data clock output at the system clock frequency divided by two hundred and
fifty six.
ModeIn Input Boot Mode Data In.
Serial boot-mode data input.
BigEndian Input Endian mode select.
Allows the system to change the processor addressing mode without rewriting the mode ROM.
If endi anness is to be specified by using the BigEndian pin, program mode ROM bit 8 to 0; if
endianness is to be specified by the mode ROM, ground the BigEndian pin.
Secondary cache interface:
ScCLR* Output Secondary Cache Block Clear.
Clears all valid bits in those Tag RAM’s which support this function.
ScCWE*(1:0) Output Secondary Cache Write Enable.
Asserted during writes to the secondary cache
ScDCE*(1:0) Output Data RAM Chip Enable.
Chip Enable for Secondary Cache Data RAM
ScDOE* Input Data RAM Output Enable.
Asserted by the external agent to enable data onto the SysAD bus
ScLine (15:0) Output Data RAM Output Enable.
Cache line index for secondary cache
Table 4: RC5000 Signal Names and Descriptions (Page 2 of 3)
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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Absolute maximum ratings
NOTES:
1Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2.VIN minimum = –2.0V for pulse width less than 15ns. VIN should not exceed VCC +0.5 Volts.
3.When VIN < 0V or VIN > VCC.
4.Not more than one output should be shorted at a time. Duration of the short should not exceed 30 seconds.
Recommended operation temperature and supply voltage
ScMATCH Input Secondary cache Tag Match.
Asserted by Tag RAM on Secondary cache tag match
ScTCE* Output Secondary cache Tag RAM Chip Enable.
Chip enable for secondary cache tag RAM.
ScTDE* Output Secondary cache Tag RAM Data Enable.
Data Enable for Secondary Cache Tag RAM.
ScTOE* Output Secondary cache Tag RAM Output Enable.
Tag RAM Output enable for Secondary Cache Tag RAM’s
ScWord (1:0) Input/Output Secondary cache Word Index.
Determines correct double-word of Secondary cache Index
ScValid Input/Output Secondary cache Valid.
Always driven by the CPU except during a cache probe operation, when it is driven by the tag
RAM.
Symbol Rating Commercial (3.3V±5%) Unit
VTERM Terminal Voltage with respect to GND –0.5(2) to +4.6 V
TCOperating Temperature (case) 0 to +85 °C
TBIAS Case Temperature Under Bias –55 to +125 °C
TSTG Storage Temperature –55 to +125 °C
IIN DC Input Current 20(3) mA
IOUT DC Output Current 50(4) mA
Grade Temperature GND RV5000
VCC
Commercial 0°C to +85°C (Case) 0V 3.3V±5%
Table 4: RC5000 Signal Names and Descriptions (Page 3 of 3)
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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AC electrical characteristics
(VCC= 3.3V± 5%; Tcase = 0°C to +85°C )
Clock Parameters—RC50001
Capacitive load deration—RC5000
1. Boot Mode Bits 20, 33 and 37 must be set to “1” for all frequencies
Parameter Symbol
180MHz 200MHz 250MHz 267 MHz 300 MHz
Units
Min Max Min Max Min Max Min Max Min Max
Pipeline Clock
Frequency PCLk 100 180 100 200 100 250 100 267 100 300
SysClock HIGH tSCHIGH 33333ns
SysClock LOW tSCLOW 33333ns
SysClock Frequency 33 90 33 100 33 125 33 125 50 125 MHz
SysClock Period tSCP 11.1 30 10 30 830 8 20 8 20 ns
SysClock Rise Time tSCRise 2.5 2222ns
SysClock Fall Time tSCFall 2.5 2222ns
ModeClock Period tMo-
deCKP
256
tSCP
256
tSCP
256
tSCP
256
tSCP
256
tSCP
ns
Parameter Symbol Test Conditions
180MHz 200MHz 250MHz 267MHz 300MHz
UnitsMin Max Min Max Min Max Min Max Min Max
Load Derate CLD 22222ns/25pF
Preliminary
Preliminary
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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System interface parameters—RC5000
Boot time interface parameters—RC5000
Parameter Symbol Test Conditions
180 MHz
pipeline / 90
MHz Bus
Frequency
200 MHz
pipeline /
100MHz Bus
Frequency
250MHz
pipeline /
125 MHz Bus
Frequency
267Mhz
Pipeline /
89MHz Bus
Frequency
300Mhz
pipeline /
100MHz Bus
Frequency
UnitsMin Max Min Max Min Max Min Max Min Max
Data Output tDM= Min
tDO = Max mode14..13 = 10
(fastest) 1.5* 71.5 51.5* 4.7 1.0 4.7 1.0 4.7 ns
mode14..13 = 01
(slowest) 1.5* 11 1.5 11 1.5 777ns
Data Output
Hold tDOH* mode14..13 = 10
(fastest) 1.0 1.0 1.0 1.0 1.0 ns
Data Input tDS trise = 3ns
tfall = 3ns 1.5 1.5 1.5 1.5 1.5 ns
tDH 0.5 0.5 0.5 0.5 0.5 ns
*Guaranteed by design
50 pf loading on external output signals
Parameter Sym
bol Test
Conditions
180MHz / 90
MHz 200MHz / 100
MHz 250MHz / 125
MHz 267 MHz /
89MHz 300 MHz / 100
MHz Units Conditions
Min Max Min Max Min Max Min Max Min Max
Mode Data Setup tDS 44444ns Master Clock Cycle
Mode Data Hold tDH 00000ns Master Clock Cycle
Preliminary
Preliminary
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DC electrical characteristics
(Vcc = 3.3V± 5%; Tcase = 0°C to +85°C)
Power consumption—RC5000
Parameter
180MHz
200MHz
250MHZ
267MHz
300MHz
Conditions
Min Max Min Max Min Max Min Max Min Max
VOL 0.1V 0.1V 0.1V 0.1V 0.1V |IOUT|= 20uA
VOH VCC
- 0.1V VCC
- 0.1V VCC
- 0.1V VCC - 0.1V VCC - 0.1V
VOL 0.4V 0.4V 0.4V 0.4V 0.4V |IOUT|= 4mA
VOH 2.4V 2.4V 2.4V 2.4V 2.4V
VIL –0.5V 0.2VCC –0.5V 0.2VCC –0.5V 0.2VCC –0.5V 0.2VCC –0.5V 0.2VCC
VIH 0.7VCC VCC +
0.5V 0.7VCC VCC +
0.5V 0.7VCC VCC +
0.5V 0.7VCC VCC +
0.5V 0.7VCC VCC +
0.5V
IIN ±10uA ±10uA ±10uA ±10uA ±10uA 0 VIN VCC
CIN 10pF 10pF 10pF 10pF 10pF
CIO 10pF 10pF 10pF 10pF 10pF
Cclk 10pF 10pF 10pF 10pF 10pF
I/OLEAK 20uA 20uA 20uA 20uA 20uA Input/Output
Leakage
Parameter
180MHz 200MHz 250MHz 267MHz 300MHz
ConditionsMax Max Max Max Max
System Condition 180/45MHz 200/50MHz 250/62.5MHz 267/89MHz 300/100MHz
Icc Standby 120mA 120mA 120mA 130mA 130mA CL = 50 pF
Active 1100mA 1300mA 1800mA 3000 3500 CL = 50pF
Pipelined writes or write re-
issue
Tc = 25oC
Preliminary
Preliminary
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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Physical specifications
The RC5000 is available in two packages, the 223-pin CPGA and the 272-ball SBGA. The 223-pin CPGA package is shown in Figure 2
and Table 3; information on the SBGA package is shown in Figure 3 and Table 4.
Figure 2 RC5000 223-pin CPGA Pin Orientation (Bottom View)
A
B
C
D
E
F
G
H
J
K
T
U
L
M
N
P
R
V
1 2345678910 11 12 13 14 15 16 17 18
223-Pin CPGA
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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223-Pin CPGA Pinout
Pin # Function Pin Function Pin Function Pin Function Pin Function Pin Function
A2 Vcc C5 SysADC[6] E18 Vcc K17 VssP R6 SysAD[51] U9 SysAD[63]
A3 Vss C6 SysAD[16] F1 Vcc K18 Vss R7 SysAD[55] U10 SysAD[13]
A4 Vcc C7 SysAD[50] F2 Reserved L1 Vss R8 SysAD[27] U11 SysAD[11]
A5 Vss C8 SysAD[22] F3 ScValid L2 SysCmd[8] R9 SysAD[31] U12 SysAD[9]
A6 Vss C9 SysAD[24] F4 INT[1]* L3 SysCmd[7] R10 SysAD[43] U13 SysAD[37]
A7 Vcc C10 SysAD[28] F15 ScDCE[0]* L4 SysCmd[5] R11 SysAD[39] U14 SysAD[3]
A8 Vss C11 SysAD[62] F16 ScCWE[0]* L15 ScLine[12] R12 SysAD[35] U15 ScWord[0]
A9 Vcc C12 SysAD[44] F17 ScTDE* L16 ScLine[14] R13 SysAD[1] U16 Vcc
A10 Vss C13 SysAD[10] F18 Vss L17 ScLine[15] R14 ScWord[1] U17 Vss
A11 Vcc C14 SysAD[38] G1 Vss L18 Vcc R15 ScLine[0] U18 Vss
A12 Vss C15 SysAD[4] G2 Reserved M1 Vcc R16 ScLine[3] V1 Vss
A13 Vcc C16 SysAD[34] G3 Reserved M2 SysCmd[6] R17 ScLine[6] V2 Vss
A14 Vss C17 SysAD[2] G4 Reserved M3 SysCmd[4] R18 Vss V3 Vcc
A15 Vss C18 Vss G15 ScCLR* M4 SysCmd[1] T1 Vss V4 Vss
A16 Vcc D1 Vss G16 ScTCE* M15 ScLine[8] T2 SysAD[15] V5 Vss
A17 Vss D2I INT3* G17 ModeIn M16 ScLine[10] T3 SysAD[47] V6 Vcc
A18 Vss D3 INT5* G18 Vcc M17 ScLine[13] T4 SysAD[17] V7 Vss
B1 Vss D4 Release* H1 Vcc M18 Vss T5 SysAD[19] V8 Vcc
B2 Vss D5 Vcc H2 Reserved N1 Vss T6 SysAD[23] V9 Vss
B3 Vcc D6 SysADC[2] H3 Reserved N2 SysCmd[3] T7 SysAD[57] V10 Vcc
B4 SysADC[4] D7 SysAD[48] H4 Reserved N3 SysCmd[2] T8 SysAD[29] V11 Vss
B5 SysADC[0] D8 SysAD[52] H15 VccOK N4 SysADC[7] T9 Vcc V12 Vcc
B6] SysAD[18 D9 SysAD[56] H16 ModeClock N15 ScLine[5] T10 SysAD[45] V13 Vss
B7] SysAD[20] D10 SysAD[60] H17 SysClock N16 ScLine[7] T11 SysAD[41] V14 Vcc
B8 SysAD[54] D11 SysAD[14] H18 Vss N17 ScLine[11] T12 SysAD[7] V15 Vss
B9 SysAD[26] D12S SysAD[42] J1 Vss N18 Vcc T13 SysAD[5] V16 Vss
B10 0SysAD[58] D13 SysAD[8] J2 WrRdy* P1 Vcc T14 SysAD[33] V17 Vcc
B11 SysAD[30] D14 SysAD[36] J3 ValidIn* P2 SysCmd[0] T15 Reset* V18 Vss
B12 SysAD[46] D15 ColdReset* J4 ExtReq* P3 SysCmdP T16 ScLine[1]
B13 SysAD[12] D16 SysAD[0] J15 JTDO P4 SysADC[1] T17 Vcc
B14 SysAD[40] D17 ScTOE* J16 JTDI P15 ScLine[2] T18 Vcc
B15 SysAD[6] D18 Vcc J17 JTCK P16 ScLine[4] U1 Vcc
B16 Vss E1 Vss J18 Vcc P17 ScLine[9] U2 Vcc
B17 Vcc E2 INT[0]* K1 Vcc P18 Vss U3 Vss
B18 Vcc E3 INT[2]* K2 ScMatch R1 Vcc U4 SysAD[21]
C1 Vcc E4 NT[4]* K3 RdRdy* R2 SysADC[5] U5 SysAD[53]
C2 Vcc E15 SysAD[32] K4S cDOE* R3 SysADC[3] U6 SysAD[25]
C3 ValidOut* E16 ScDCE[1]* K15 JTMS R4 BigEndian U7 SysAD[59]
C4 NMI* E17 ScCWE[1]* K16 VccP R5 SysAD[49] U8 SysAD[61]
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272-Ball SBGA package
Figure 3 Ball Grid Array Package (Bottom View)
123456789101112131415161718
272-Ball SBGA
192021
A
B
C
D
E
F
G
H
J
K
T
U
L
M
N
P
R
V
W
Y
AA
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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272-Ball SBGA Pinout
Pkg Pin Function Pkg Pin Function Pkg Pin Function Pkg Pin Function Pkg Pin Function Pkg Pin Function
AA1 Vss B5 SysAD0 D9 Vss J2 SysAD46 P21 SysAD55 W1 Vss
AA2 Vcc B6 ScTOE* D10 Vcc J3 SysAD14 R1 Vss W2 Vcc
AA3 Vss B7 ScCLR* D11 Vccp J4 Vss R2 SysAD18 W3 Vcc
AA4 ValidOut* B8 ScTDE* D12 Vcc J18 Vss R3 SysAD48 W4 Vcc
AA5 Vss B9 ModeClock D13 Vss J19 SysAD9 R4 Vcc W5 Int*5
AA6 Int*0 B10 JTDI D14 Vcc J20 SysAD41 R18 Vcc W6 Int*4
AA7 Vss B11 JTCK D15 Vcc J21 Vss R19 SysAD53 W7 Int*1
AA8 Reserved B12 N/C D16 Vss K1 SysAD60 R20 SysAD23 W8 Reserved
AA9 Vss B13 ScLine14 D17 Vcc K2 SysAD30 R21 Vss W9 Reserved
AA10 WrRdy* B14 ScLine10 D18 Vss K3 SysAD62 T1 SysAD16 W10 Reserved
AA11 Vss B15 ScLine9 D19 Vcc K4 Vcc T2 SysADC0 W11 ValidIn*
AA12 ScMatch B16 ScLine6 D20 Vcc K18 Vcc T3 SysADC2 W12 ScDOE*
AA13 Vss B17 ScLine3 D21 Vcc K19 SysAD11 T4 Vss W13 SysCmd7
AA14 SysCmd6 B18 ScLine1 E1 Vss K20 SysAD43 T18 Vss W14 SysCmd4
AA15 Vss B19 Vcc E2 SysAD36 K21 SysAD13 T19 SysAD19 W15 SysCmd1
AA16 SysCmd2 B20 Vcc E3 SysAD4 L1 Vss T20 SysAD51 W16 SysADC7
AA17 Vss B21 Vcc E4 Vcc L2 SysAD58 T21 SysAD21 W17 SysADC5
AA18 SysADC3 C1 Vss E18 Vcc L3 SysAD28 U1 Vss W18 SysAD47
AA19 Vss C2 Vcc E19 ScWord1 L4 Vcc U2 SysADC4 W19 BigEndian
AA20 Vcc C3 ColdReset* E20 ScWord0 L18 Vcc U3 SysADC6 W20 Vcc
AA21 Vss C4 SysAD34 E21 Vss L19 SysAD45 U4 Vcc W21 Vss
A1 Vss C5 ScDCE*1 F1 SysAD8 L20 SysAD63 U18 Vcc Y1 Vcc
A2 Vcc C6 ScDCE*0 F2 SysAD38 L21 Vss U19 SysAD17 Y2 Vcc
A3 Vss C7 ScCWE*0 F3 SysAD6 M1 SysAD26 U20 SysAD49 Y3 Vcc
A4 SysAD32 C8 ScTCE* F4 Vss M2 SysAD56 U21 Vss Y4 Release*
A5 Vss C9 ModeIn F18 Vss M3 SysAD24 V1 Vcc Y5 Int*3
A6 ScCWE*1 C10 JTDO F19 SysAD1 M4 Vcc V2 Vcc Y6 Int*2
A7 Vss C11 Vssp F20 SysAD33 M18 Vcc V3 Vcc Y7 ScValid
A8 VCCOK C12 JTMS F21 SysAD3 M19 SysAD29 V4 Vss Y8 Reserved
A9 Vss C13 ScLine13 G1 Vss M20 SysAd61 V5 NMI* Y9 Reserved
A10 MasterClk C14 ScLine11 G2 SysAD10 M21 SysAD31 V6 Vss Y10 Reserved
A11 Vss C15 ScLine8 G3 SysAD40 N1 Vss V7 Vcc Y11 ExtRqst*
A12 ScLine15 C16 ScLine5 G4 Vcc N2 SysAD54 V8 Vcc Y12 RdRdy*
A13 Vss C17 ScLine4 G18 Vcc N3 SysAD22 V9 Vss Y13 SysCmd8
A14 ScLine12 C18 ScLine0 G19 SysAD35 N4 Vss V10 Vcc Y14 SysCmd5
A15 Vss C19 Reset* G20 SysAD5 N18 Vss V11 Vcc Y15 SysCmd3
A16 ScLine7 C20 Vcc G21 Vss N19 SysAD27 V12 Vcc Y16 SysCmd0
A17 Vss C21 Vss H1 SysAD42 N20 SysAD59 V13 Vss Y17 SysCmdP
A18 ScLine2 D1 Vcc H2 SysAD44 N21 Vss V14 Vcc Y18 SysADC1
A19 Vss D2 Vcc H3 SysAD12 P1 SysAD50 V15 Vcc Y19 SysAD15
79RC5000 MULTI-ISSUE 64-BITMICROPROCESSOR
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Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet, to improve design or performance and to supply the best product possible
Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA 95054-3090 Telephone: (408) 727-6116 Fax (408) 492-8674
Table 5: 272-Ball SBGA Pinout
Ordering information
Valid Combinations
IDT79RV5000 - 180, 200MHz G CPGA package
IDT79RV5000 - 180, 200, 250 ,267, 300MHz BS SBGA package
A20 Vcc D3 Vcc H4 Vcc P2 SysAD52 V16 Vss Y20 Vcc
A21 Vss D4 Vss H18 Vcc P3 SysAD20 V17 Vcc Y21 Vcc
B1 Vcc D5 Vcc H19 SysAD7 P4 Vcc V18 Vss
B2 Vcc D6 Vss H20 SysAD39 P18 Vcc V19 Vcc
B3 Vcc D7 Vcc H21 SysAD37 P19 SysAD25 V20 Vcc
B4 SysAD2 D8 Vcc J1 Vss P20 SysAD57 V21 Vcc
IDT79 YY XXXX 999 A A
Operating
Voltage Device
Type Speed Package Temp range/
Process
180
200
Blank Commercial
(0°C to +85°C Case)
180 MHz Pipeline
200 MHz Pipeline
3.3+/-5%
272-ball SBGA
223-ball CPGAG
BS
RV
250 MHz Pipeline
267 MHz Pipeline
5000 64-bit Microprocessor
Multi-Issue
300 MHz Pipeline
250
267
300