SCOPE: CMOS, COMPLETE, HIGH-SPEED, 12-BIT A/D CONVERTER Device Type 01 02 Generic Number MX7572S(x)12/883B MX7572S(x)05/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter Mil-Std-1835 Q GDIP1-T24 or CDIP2-T24 E CQCC1-N28 Case Outline 24 LEAD CERDIP 28 LCC Package Code J24 L28 Absolute Maximum Ratings: VDD to DGND .................................................................................................. -0.3V to 7V VSS to DGND .............................................................................................. +0.3V to -17V AGND to DGND ................................................................................... -0.3V, (VDD+0.3V) AIN to AGND ............................................................................................... -15V to +15V Digital Input Voltage to DGND ............................................................. -0.3V, (VDD+0.3V) Digital Output Voltage to DGND .......................................................... -0.3V, (VDD+0.3V) Lead Temperature (soldering, 10 seconds) ................................................................... +300C Storage Temperature ...................................................................................... -65C to +150C Continuous Power Dissipation ............................................................................... TA=+70C 24 pin CERDIP(derate 12.5mW/C above +70C) .................................................... 1000mW 28 pin LCC(derate 10.2mW/C above +70C) ............................................................. 816mW Junction Temperature TJ ........................................................................................... +150C Thermal Resistance, Junction to Case, JC 24 pin CERDIP....................................................................................................... 40C/W 28 pin LCC ............................................................................................................ 15C/W Thermal Resistance, Junction to Ambient, JA: 24 pin CERDIP....................................................................................................... 80C/W 28 pin LCC ............................................................................................................. 98C/W Recommended Operating Conditions Ambient Operating Range (TA) ................................................................. -55C to +125C Positive Supply Voltage (VDD) ........................................................ +4.75V dc to +5.25V dc Negative Supply Voltage (VSS) ..................................................... -14.25V dc to +15.75V dc Clock Frequency (fCLK) device 01 ............................................................................. 1.0MHz Clock Frequency (fCLK) device 02 ............................................................................. 2.5MHz Analog Input Voltage Range (AIN) (specifications apply to slow memory mode) .......................................................... 0 to 5.0V Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ---------------------------- Electrical Characteristics of MX7572/883B for SMD 5962-87591 19-0274 Page 2 of Rev. B 8 TABLE 1. ELECTRICAL TESTS: TEST Resolution NOTE 2 Symbol CONDITIONS -55 C TA +125C 1/ VDD=+5V, VSS=-15V Unless otherwise specified Group A Subgroup Device type Limits Min All RES Limits Max 12 Units Bits Integral Nonlinearity INL 1,2,3 All 1.0 LSB Differential Nonlinearity DNL 1,2,3 All 1.0 LSB Offset Error VOS 1 2,3 All 4 6 LSB Full Scale Error AE 1 All 15 LSB Full Scale Temperature Coefficient AE/T Analog Input Current IIN Internal Reference Voltage Output Internal Reference Output Current Sink Capability Digital Input Low Voltage Digital Input High Voltage Digital Input Capacitance VREF Digital Input Current IIN VINL VINH CIN Full Scale = 5V, including internal voltage reference error, (Ideal last code transition=FS-3/2LSB's) Guaranteed by internal reference temperature coefficient tests; includes internal voltage reference drift. AIN=5V Constant external load during conversion VDD=4.75V, VSS=-15V, __ ___ HBEN, CLK IN, CS, RD VDD=4.75V, VSS=-15V, __ ___ HBEN, CLK IN, CS, RD VDD=4.75V, VSS=-15V, __ ___ HBEN, CLK IN, CS, RD VDD=5.25V, VSS=-15V, __ ___ HBEN, CLK IN, CS, RD AIN=0V to VDD 2,3 1,2,3 All 1 All 13,14,15 CLK IN, VDD=5.25V, VSS=-15V, AIN=0V to VDD ISINK=1.6mA, BUSY, CLK OUT, VDD=4.75V, VSS=-15V, D11-D0/8 ISOURCE=200A, BUSY, CLK OUT, VDD=4.75V, VSS=-15V, D11-D0/8 D11-D0/8, VDD=5.25V, VSS=-15V -5.3 550 A 1,2,3 All 0.8 V 1,2,3 All 13 All 2.4 -10 10 -20 20 All 4.0 1,2,3 All -10 COUT 13,14,15 tCONV 13,14,15 tCONV 9,10,11 ---------------------------- VDD=5.25V, VSS=-15.75V, __ __ _____ ____ CS=RD=BUSY=HIGH, AIN=5V Electrical Characteristics of MX7572/883B for SMD 5962-87591 1,2,3 pF A All IDD V 10 1,2,3 ILKG mA All All VOH 3.5 V 1,2,3 VOL ppm/C -5.2 1,2,3 Digital Output Low Voltage Digital Output High Voltage Floating State Leakage Current Floating State Output Capacitance NOTE 2 Conversion Time Using Synchronous Clock Conversion Time Using Asynchronous Clock Positive Supply Current 45 All 0.4 V V 10 A All 15 pF 01 02 01 02 All 12.5 5.0 13.0 5.2 7.0 s 19-0274 Page 3 of 12.0 4.8 Rev. B 8 s mA Negative Supply Current ISS __ ___ CS to RD Setup Time __ _____ RD to BUSY Propagation Delay t1 CONDITIONS -55 C TA +125C 1/ VDD=+5V, VSS=-15V Unless otherwise specified VDD=5.25V, VSS=-15.75V, __ __ _____ ____ CS=RD=BUSY=HIGH, AIN=5V NOTE 3 t2 t3 TEST Symbol Group A Subgroup Device type Limits Min Limits Max Units 1,2,3 All 9,14,15 All NOTE 3 9 14,15 All CL=60pF, NOTE 3, 4, 5 9 14,15 CL=100pF, NOTE 3, 5 All t3 ns 0 ns Data-Access Time __ after RD 12.0 0 mA ns 190 270 ns 110 150 All ns __ RD Pulse Width __ ___ CS to RD Hold Time Data-Setup Time _____ after BUSY Bus-Relinquish Time t4 NOTE 3 9 14,15 9,14,15 125 170 t5 NOTE 3 9,14,15 All t6 CL=60pF, NOTE 3, 5 All t7 NOTE 3, 6 __ HBEN to RD Setup Time __ HBEN to RD Hold Time Delay Between Successive Read Operations t8 NOTE 3 9 14,15 9 14,15 9,14,15 All 35 20 0 t9 NOTE 3 9,14,15 All 0 ns t10 NOTE 3 9,14,15 All 500 ns All NOTE 1: VDD=+5V, VSS=-15V, AIN=0V to +5V, slow-memory mode, fCLK=1.0MHz for -01 and fCLK=2.5MHz for -02, unless otherwise specified. NOTE 2: Characteristics supplied for use as a typical design limit but not production tested. NOTE 3: All input control signals are specified with tr=tf=5ns (10% to 90% of +5V) and timed from a 1.6V voltage level. Times t6 and t10 are measured only for the initial test and after process or design changes which may affect switching parameters. NOTE 4: If not tested, shall be guaranteed to the limits specified in Table 1, herein. NOTE 5: Times t3 and t6 are measured with the load circuits of Figure 2 in the commercial datasheet and defined as the time required for an output to cross 0.8V or 2.4V. NOTE 6: Time t7 is defined as the time required for the data lines to change 0.5V when loaded with the circuits of Figure 3 in the commercial datasheet. ---------------------------- Electrical Characteristics of MX7572/883B for 5962-87591 19-0274 Page 4 of Rev. B 8 70 100 90 90 ns ns ns ORDERING INFORMATION: Package Pkg. Code 01 24 pin CERDIP J24 01 28 pin LCC L28 02 24 pin CERDIP J24 02 28 pin LCC L28 MAXIM PART # MX7572SQ12/883B MX7572SE12/883B MX7572SQ05/883B MX7572SE05/883B SMD Number 5962-8759101LA 5962-87591013C 5962-8759104LA 5962-87591043C TERMINAL CONNECTIONS: J24 L28 Pin 1 AIN NC 2 VREF AIN 3 AGND VREF 4 D11 AGND 5 D10 D11 6 D9 D10 7 D8 D9 8 D7 NC 9 D6 D8 10 D5 D7 11 D4 D6 12 DGND D5 13 D3/11 D4 14 D2/10 DGND 15 D1/9 NC 16 D0/8 D3/11 17 CLK IN D2/10 18 CLK OUT D1/9 19 HBEN D0/8 20 ___ CLK IN RD 21 ___ CLK OUT CS 22 _____ NC BUSY 23 VSS HBEN 24 VDD ___ RD 25 ___ CS 26 _____ BUSY 27 VSS 28 VDD ---------------------------- Electrical Characteristics of MX7572/883B for SMD 5962-87591 19-0274 Page 5 of Rev. B 8 SLOW MEMORY MODE PARALLEL READ DATA-BUS STATUS TWO-BYTE READ DATA-BUS STATUS DATA OUTPUTS READ DATA OUTPUTS FIRST READ SECOND READ D11 DB11 D7 DB7 LOW D10 DB10 D6 DB6 LOW D9 DB9 D5 DB5 LOW D8 DB8 D4 DB4 LOW D7 DB7 D3/D11 DB3 DB11 D6 DB6 D2/D10 DB2 DB10 D5 DB5 D1/D9 DB1 DB9 D4 DB4 D0/D8 DB0 DB8 D3/D11 DB3 D2/D10 DB2 D1/D9 DB1 D0/D8 DB0 PARALLEL READ DATA BUS STATUS DATA FIRST READ SECOND OUTPUTS (OLD DATA) READ D11 DB11 DB11 D10 DB10 DB10 D9 DB9 DB9 D8 DB8 DB8 D7 DB7 DB7 D6 DB6 DB6 D5 DB5 DB5 D4 DB4 DB4 D3/D11 DB3 DB3 D2/D10 DB2 DB2 D1/D9 DB1 DB1 D0/D8 DB0 DB0 ---------------------------- ROM MODE TWO-BYTE READ DATA BUS STATUS DATA FIRST READ SECOND OUTPUTS (OLD DATA) READ D7 DB7 LOW D6 DB6 LOW D5 DB5 LOW D4 DB4 LOW D3/D11 DB3 DB11 D2/D10 DB2 DB10 D1/D9 DB1 DB9 D0/D8 DB0 DB8 Electrical Characteristics of MX7572/883B for SMD 5962-87591 19-0274 Page 6 of THIRD READ DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Rev. B 8 QUALITY ASSURANCE Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in MilStd-883. Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015: 1. Test Condition, A, B, C, or D. 2. TA = +125C minimum. 3. Interim and final electrical test requirements shall be specified in Table 2. Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection. Group A inspection: 1. Tests as specified in Table 2. 2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted. Group C and D inspections: a. End-point electrical parameters shall be specified in Table 1. b. Steady-state life test, Method 1005 of Mil-Std-883: 1. Test condition A, B, C, D. 2. TA = +125C, minimum. 3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883. TABLE 2. ELECTRICAL TEST REQUIREMENTS Mil-Std-883 Test Requirements Interim Electric Parameters Method 5004 Final Electrical Parameters Method 5005 Group A Test Requirements Method 5005 Group C and D End-Point Electrical Parameters Method 5005 * ** Subgroups per Method 5005, Table 1 1 1*, 2, 3, 9, 10, 11 1, 2, 3, 4**, 5, 6 , 9, 10, 11, 13**, 14, 15 1 PDA applies to Subgroup 1 only. Special subgroups 13, 14, 15 shall be measured only for initial test and after process or design changes and shall be guaranteed to the limits specified in Table 1. Subgroup 13 is +25C, Subgroup 14 is +125C and Subgroup 15 is -55C. ---------------------------- Electrical Characteristics of MX7572/883B for SMD 5962-87591 19-0274 Page 7 of Rev. B 8