960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
1
1
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
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Features
Compact Size (14x24 mm2)
GaN on SiC D-Mode Transistor Technology
Fully Matched, de-coupled DC and RF
Typical Bias: 50 V, Class AB
Intended for Pulsed RADAR Applications
Output Power > 90 W, with 30 dB Gain and 60%
Power Added Efficiency
Pulse width up to 600 μs.
MTTF = 600 years (TJ < 200°C)
Thermally Enhanced Laminate LGA Package
RoHS* Compliant. Lead Free Reflow Compatible
MSL-3
Description
The MAMG-000912-090PSM is a 2-stage GaN
power module in a “True SMT” laminate package.
The module is fully matched. Under pulsed
conditions, it can deliver output power greater than
90 W, with 30 dB typical associated gain and 60%
typical power added efficiency.
Flexible design allows for gate and/or drain pulsing.
Additional features include a gate voltage sense port
for use in temperature compensation or pulse droop
compensation. The overall package size is very
small, only 14x24 mm2. The module’s compact size,
combined with excellent RF performance makes this
product an ideal solution for pulsed RADAR
applications where small size, light weight and
performance (SWaP) are the key.
Ordering Information1
Functional Schematic
Pin Configuration
Pin No. Function
1 RF IN
2 VG 3
3 VD1
4 NC 4
5 VG sense 5
6 Ground
7 VD2
8 RF OUT
9 NC 4
Part Number Package
MAMG-000912-090PSM Bulk Packaging
MAMG-0T0912-090PSM 100 Piece Reel
MAMG-A00912-090PSM Evaluation Board2
3. One common gate voltage for both stages in the module.
4. Do not connect.
5. Do not connect to ground if not used.
1. Reference Application Note M513 for reel size information.
2. Includes one module surface mounted onto board.
* Restrictions on Hazardous Substances, European Union
Directive 2002/95/EC.
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
2
2
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
Electrical Specifications 6
Parameter Symbol Min. Typ. Max. Typ. Typ. Units
RF FUNCTIONAL TESTS: Freq. = 960-1215 MHz, VDD = 50 V, IDQ = 300 mA, TA = 25°C, ZL = 50 Ω, Pulse Width = 300 us,
Duty Cycle = 10%, PIN = 19 dBm
Frequency f 960 1090 1215 MHz
Peak Output Power 7 POUT 90 95 - 105 105 W
Power Gain GP - 30 - 31 31 dB
Power Added Efficiency PAE 55 58 - 63 63 %
Pulse Droop 8 Droop - 0.2 0.3 0.2 0.2 dB
2nd Harmonic 2F0 - -30 - -30 -30 dBc
3rd Harmonic 3F0 - -40 - -40 -40 dBc
Load Mismatch Stability VSWR-S - 5:1 - 5:1 5:1 -
Load Mismatch Tolerance VSWR-T - 6:1 - 6:1 6:1 -
6. Typical RF performance measured in RF evaluation board (see layout on page 3).
7. Peak output power measured at center of pulse.
8. Pulse droop measured between 10% and 90% of pulse.
Parameter Absolute Maximum
Input Power 24 dBm
Drain Supply Voltage (pulsed), VDD +55 V
Gate Supply Voltage Range, VGG -9 V to -2.5 V
Supply Current, IDD 4.0 A
Power Dissipation, Pulsed Mode @ 85ºC 80 W
Junction Temperature14 200 °C
Operating Temperature -40°C to +85°C
Storage Temperature -65°C to +150°C
ESD Maximum - Human Body Model (HBM) 600 V
ESD Maximum - Charged Device Model (CDM) 300 V
Absolute Maximum Ratings 9,10,11,12,13
9. Exceeding any one or combination of these limits may cause permanent damage to this device.
10. MACOM does not recommend sustained operation near these survivability limits.
11. For saturated performance it is recommended that the sum of (3 * VDD + abs (VGG)) < 175 V.
12. CW operation is not recommended.
13. Operating at nominal conditions with TJ ≤ 200°C will ensure MTTF > 1 x 106 hours. Junction temperature directly affects device MTTF
and should be kept as low as possible to maximize lifetime.
14. Junction Temperature (TJ) = TC + ӨJC * ((V * I) - (POUT - PIN)).
Typical Transient Thermal Resistance ӨJC = 1.6 °C/W (50V, 600 μs pulses, 10% duty cycle)
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
3
3
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
Parts List
Parts are measured and sampled in the evaluation
board shown on the left. The board is made of
8-mil thick RO4003C and is bolted onto a Ni-plated
Aluminum plate. Electrical and thermal ground is
provided using a Cu-filled via-hole array (pictured
below). Very few external components are used, as
DC blocks are not required.
Evaluation Board Outline
Part Case Style Value
C1 Radial
100 F
C2 0603
10 nF
Turning the device ON
1. Set VG to the pinch-off value (VP), typically -6 V.
2. Turn on VD to nominal voltage (50 V).
3. Increase VG to desired quiescent current.
4. Apply RF power to desired level.
Turning the device OFF
1. Turn off RF power.
2. Decrease VG down to VP.
3. Turn off VD.
4. Turn off VG.
Bias Sequencing
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
4
4
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
Applications Section
Output Power vs. Frequency
Pulse Droop vs. Frequency
Typical Large-Signal Performance Curves Over Temperature:
Pulsed RF, 300 μs Pulses, 10% Duty Cycle, VDD = 45 V, IDQ = 300 mA, PIN = 19 dBm
Power Added Efficiency vs. Frequency
75
80
85
90
95
100
105
110
115
120
125
Peak Output Power (W)
Freq (MHz)
-40
0
+25
+50
+85
50
52
54
56
58
60
62
64
66
68
70
Power Added Eff (%)
Freq (MHz)
-40
0
+25
+50
+85
0.00
0.10
0.20
0.30
0.40
0.50
Pulse Droop (dB)
Freq (MHz)
-40
0
+25
+50
+85
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
5
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
Applications Section
Max. Transient Channel Temp. vs. Pulse Width
(VDD = 35 V)
Maximum Transient Channel Temperature (Based on IR-Scan Measurements)
Pulsed RF, IDQ = 300 mA, PIN = 19 dBm, TC = 80°C
80
85
90
95
100
105
110
115
120
125
130
Channel Temperature (°C)
Pulse Duration (s)
5% duty
10% duty
20% duty
100
105
110
115
120
125
130
135
140
145
150
155
160
165
170
Channel Temperature (°C)
Pulse Duration (s)
5% duty
10% duty
20% duty
115
120
125
130
135
140
145
150
155
160
165
170
175
180
185
190
195
200
Channel Temperature (°C)
Pulse Duration (s)
5% duty
10% duty
Max. Transient Channel Temp. vs. Pulse Width
(VDD = 45 V)
Max. Transient Channel Temp. vs. Pulse Width
(VDD = 50 V)
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Rev. V2
MAMG-000912-090PSM
6
6
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Nitride Devices and Circuits are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these devices.
Package Outline 15,16,18
15. All dimensions are in inches.
16. Reference Application Note S2083 for lead-free solder
reflow recommendations. Plating is Ni/Pd/Au.
17. Landing pattern indicates solder mask opening. Cu-filled
via-holes under the ground are used for optimal thermal
performance. Recommended pattern: 8-mil diameter, 8-mil
spacing.
18. Layout drawing available upon request.
Recommended Landing Pattern 15,16,17,18
