cExpress-SL
COM Express Compact Size Type 6 Module with
6th Gen Intel
®
Core™ and Celeron
®
Processors
Features
●
6th Generation Intel
®
Core™ and Celeron
®
Processors
●
Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
●
Two DDI channels, one LVDS (build option 4 lanes eDP),
supports up to 3 independent displays
●
GbE, up to 6 PCIe x1 (build option)
●
Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
●
Supports Smart Embedded Management Agent (SEMA
®
) functions
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
New
Specications
● Core System
CPU
6th Generation Intel
®
Core™ and Celeron
®
Processors - Mobile 14nm process
(formerly “Skylake-U”)
Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2)
Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2)
Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2)
Celeron
®
3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1)
Supports: Intel
®
VT, Intel
®
TXT, Intel
®
SSE4.2, Intel
®
HT Technology, Intel
®
64
Architecture, Execute Disable Bit, Intel
®
Turbo Boost Technology 2.0, Intel
®
AVX2, Intel
®
AES-NI, PCLMULQDQ Instruction, Intel
®
Secure Key and Intel
®
TSX.
Note: Availability of features may vary between processor SKUs.
Memory
Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual
SODIMM socket
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel
®
AMT 11.0 support
(AMT support available on Core™ i7/i5 only)
Cache
4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron®
Expansion Busses
Up to 6 PCI Express x1 (AB): Lanes 0-5 (congurable to x2, x4, Lane 5 by build
option)
Note: Gen3 for Core™ i7/i5/i3, Gen2 for Celeron® LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller
Supports : Voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, at panel control,
general purpose I
2
C, failsafe BIOS (dual BIOS ), watchdog timer and fan
control
Debug Headers
40-pin multipurpose at cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS ashing, power
testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
● Video
GPU Feature Support
Intel
®
Generation 9 LP Graphics Core Architecture, supporting 3 independent
and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP
outputs
Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX
11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 5.0, 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface
DDI1/2 supporting DisplayPort/HDMI/DVI
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP
4 lane support build option, in place of LVDS
● Audio
Chipset
Intel
®
HD Audio integrated in SOC
Audio Codec
On carrier Express-BASE6 (ALC886 standard support)
● Ethernet
Intel
®
MAC/PHY: i219LM with AMT 11.0 support
Interface: 10/100/1000 GbE connection
● I/O Interfaces
USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron
®
supports two ports
only
Serial: 2 UART ports with console redirection
GPIO: 4 GPO and 4 GPI from BMC
Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.