TECHNICAL DATA SHEET Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803 Website: http://www.microsemi.com - High Reliability controlled devices - Bidirectional (CA) construction - 275 V standoff voltages (VWM) - Fast response SURFACE MOUNT 130 kW Transient Voltage Suppressor DEVICES MPLAD130KP275CA and MPLAD130KP275CV, e3 LEVELS M, MA, MX, MXL FEATURES High reliability controlled devices with wafer fabrication and assembly lot traceability 100 % surge tested devices Low profile surface mount Low package inductance Available as either low clamp with "CV" suffix or normal clamping features with "CA" suffix Optional up screening available by replacing the M prefix with MA, MX or MXL. These prefixes specify various screening and conformance inspection options based on MIL-PRF-19500. Refer to MicroNote 129 for more details on the screening options. Suppresses transients up to 130 kW1 @ 6.4/69 s Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B RoHS compliant devices available by adding an "e3" suffix 3 lot norm screening performed on Standby Current ID MAXIMUM RATINGS Peak Pulse Power dissipation at 25 C: 130,0001 watts @ 6.4/69 s (also see Figure 1) with impulse repetition rate (duty factor) of 0.05% or less tclamping (0 volts to VBR min.): < 5 ns (theoretical) Operating and Storage temperature: -55 C to +150 C Thermal resistance: 0.5 C/W junction to case or 50 C/W junction to ambient when mounted on FR4 PC board with recommended mounting pad (see page 2) and 1oz Cu Steady-State Power dissipation: 250 watts at TC = 25 C with good heat sink, or 2.5 watts at TA = 25 C if mounted on FR4 PC board as described for thermal resistance Temperature Coefficient of voltage: 0.1 %/C Solder temperatures: 260 C for 10 s (maximum) MECHANICAL AND PACKAGING Void-free transfer molded thermosetting epoxy body meeting UL94V-0 Tin-Lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating readily solderable per MIL-STD-750, method 2026 Body marked with part number No Cathode band for Bi-directional devices Available in custom tape-and-reel or bulk packaging TAPE-AND-REEL Standard per EIA-481-B (add "TR" suffix to part number) Weight: 2.2 grams (approximately) RF01020 Rev A, November 2010 High Reliability Product Group Page 1 of 3 _____ TECHNICAL DATA SHEET Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803 Website: http://www.microsemi.com ______________________________________________________________________________________________________________________________ PACKAGE AND MOUNTING PAD DIMENSIONS Inches [mm] SYMBOLS & DEFINITIONS Symbol VWM PPP VBR ID Definition Symbol Working Peak (Standoff) Voltage Peak Pulse Power Breakdown Voltage Standby Current IPP VC IBR Definition Peak Pulse Current Clamping Voltage Breakdown Current for VBR ELECTRICAL CHARACTERISTICS @ 25oC Description Symbol Breakdown Voltage VBR Working Standoff Voltage VWM Conditions IBR = 5mA Standby Current ID VR = VWM Peak Pulse Current 1 IPP tr=6.4us, tp=69us Min 300 Typ Max Unit V 275 V 5 A 292 A 400 445 V V Clamping Voltage PLAD130KP275CV PLAD130KP275CA VC Ic = IPP Note: 1) Also equivalent to 40 kW at a longer pulse of 10/1000 us with clamping voltages shown and Ipp = 90A RF01020 Rev A, November 2010 High Reliability Product Group Page 2 of 3 _____ TECHNICAL DATA SHEET Gort Road Business Park, Ennis, Co. Clare, Ireland. Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803 Website: http://www.microsemi.com ______________________________________________________________________________________________________________________________ Peak Pulse Power (PPP) or continuous Power in Percent of 25oC Rating GRAPHS TL Lead Temperature oC FIGURE 2 Derating Curve RF01020 Rev A, November 2010 High Reliability Product Group Page 3 of 3