TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland. 6 Lake Street, Lawrence, MA 01841
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
RF01020 Rev A, November 2010 High Reliability Product Group Page 1 of 3
DEVICES MPLAD130KP275CA and MPLAD130KP275CV, e3
LEVELS
M, MA, MX, MXL
FEATURES
High reliability controlled devices with wafer fabrication and assembly lot traceability
100 % surge tested devices
Low profile surface mount
Low package inductance
Available as either low clamp with “CV” suffix or normal clamping features with “CA” suffix
Optional up screening available by replacing the M prefix with MA, MX or MXL. These
prefixes specify various screening and conformance inspection options based on MIL-PRF-19500.
Refer to MicroNote 129 for more details on the screening options.
Suppresses transients up to 130 kW1 @ 6.4/69 µs
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current ID
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 °C: 130,0001 watts @ 6.4/69 µs (also see Figure 1) with
impulse repetition rate (duty factor) of 0.05% or less
tclamping (0 volts to VBR min.): < 5 ns (theoretical)
Operating and Storage temperature: -55 °C to +150 °C
Thermal resistance: 0.5 °C/W junction to case or 50 °C/W junction to ambient when mounted
on FR4 PC board with recommended mounting pad (see page 2) and 1oz Cu
Steady-State Power dissipation: 250 watts at TC = 25 °C with good heat sink, or 2.5 watts at
TA = 25 °C if mounted on FR4 PC board as described for thermal resistance
Temperature Coefficient of voltage: 0.1 %/°C
Solder temperatures: 260 °C for 10 s (maximum)
MECHANICAL AND PACKAGING
Void-free transfer molded thermosetting epoxy body meeting UL94V-0
Tin-Lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating
readily solderable per MIL-STD-750, method 2026
Body marked with part number
No Cathode band for Bi-directional devices
Available in custom tape-and-reel or bulk packaging
TAPE-AND-REEL Standard per EIA-481-B (add “TR” suffix to part number)
Weight: 2.2 grams (approximately)
SURFACE MOUNT 130 kW
Transient Voltage Suppressor
- High Reliability controlled devices
- Bidirectional (CA) construction
- 275 V standoff voltages (VWM)
- Fast response
_____
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland. 6 Lake Street, Lawrence, MA 01841
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
______________________________________________________________________________________________________________________________
RF01020 Rev A, November 2010 High Reliability Product Group Page 2 of 3
PACKAGE AND MOUNTING PAD DIMENSIONS Inches [mm]
ELECTRICAL CHARACTERISTICS @ 25oC
Symbol
Conditions
Min
Typ
Max
Unit
VBR
IBR = 5mA
300
V
VWM
275
V
ID
VR = VWM
5
A
IPP
tr=6.4us, tp=69us
292
A
VC
Ic = IPP
400
445
V
V
Note:
1) Also equivalent to 40 kW at a longer pulse of 10/1000 us with clamping voltages shown and Ipp = 90A
SYMBOLS & DEFINITIONS
Symbol
Definition
Symbol
Definition
VWM
Working Peak (Standoff) Voltage
IPP
Peak Pulse Current
PPP
Peak Pulse Power
VC
Clamping Voltage
VBR
Breakdown Voltage
IBR
Breakdown Current for VBR
ID
Standby Current
_____
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland. 6 Lake Street, Lawrence, MA 01841
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298 Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
______________________________________________________________________________________________________________________________
RF01020 Rev A, November 2010 High Reliability Product Group Page 3 of 3
GRAPHS
Peak Pulse Power (PPP) or continuous
Power in Percent of 25oC Rating
TL Lead Temperature oC
FIGURE 2
Derating Curve