MURA115T3G, MURA120T3G, SURA8120T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com ULTRAFAST RECTIFIERS 1 AMPERE, 100-200 VOLTS Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.71 V Max @ 1.0 A, TJ = 150C) AEC-Q101 Qualified and PPAP Capable SURA8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb-Free* SMA CASE 403D PLASTIC MARKING DIAGRAM Mechanical Characteristics: Case: Epoxy, Molded Weight: 70 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) U4x AYWW G U4x = Device Code x = C for MURA115T3 = D for MURA120T3 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package ORDERING INFORMATION Package Shipping MURA115T3G SMA (Pb-Free) 5,000/Tape & Reel MURA120T3G SMA (Pb-Free) 5,000/Tape & Reel SURA8120T3G SMA (Pb-Free) 5,000/Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 - Rev. 7 1 Publication Order Number: MURA115T3/D MURA115T3G, MURA120T3G, SURA8120T3G MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA115T3G MURA120T3G/SURA8120T3G VRRM VRWM VR Average Rectified Forward Current @ TL = 155C @ TL = 135C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Operating Junction Temperature Range TJ Value Unit V 150 200 1.0 2.0 40 -65 to +175 A A C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (TL = 25C) (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR-4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25C) (iF = 1.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25C) (Rated DC Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 Max 0.875 0.71 2.0 50 35 Unit V mA ns MURA115T3G, MURA120T3G, SURA8120T3G 100 1 IR, REVERSE CURRENT (mA) 10 TJ = 100C 0.1 TJ = 25C 0.01 0.001 IF, INSTANTANEOUS FORWARD CURRENT (A) TJ = 175C 0 20 40 60 80 TJ = 25C 1 0 20 40 60 80 100 120 140 160 180 200 Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 100C 25C 1 0.1 0.4 TJ = 100C VR, REVERSE VOLTAGE (VOLTS) TC = 175C 0.3 10 VR, REVERSE VOLTAGE (VOLTS) 10 0.01 TJ = 175C 0.1 100 120 140 160 180 200 0.5 0.6 0.7 0.8 0.9 1 1.1 IF, INSTANTANEOUS FORWARD CURRENT (A) IR, REVERSE CURRENT (mA) 100 10 100C TC = 175C 25C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 0.7 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 3 1.1 MURA115T3G, MURA120T3G, SURA8120T3G 50 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 35 30 25 20 15 10 35 30 25 20 15 10 5 0 0 8 12 16 20 24 28 32 36 40 8 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance dc SQUARE WAVE 2 1 80 90 4 VR, REVERSE VOLTAGE (VOLTS) 4 3 0 VR, REVERSE VOLTAGE (VOLTS) 100 110 120 130 140 150 160 170 180 IF(AV), AVERAGE FORWARD CURRENT (A) 4 5 0 40 5 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 47 pF 45 C, CAPACITANCE (pF) 40 1.25 0.5 0.25 0 20 0 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (C) Figure 8. Current Derating, Ambient (FR-4 Board with Minimum Pad) dc 2 SQUARE WAVE 1 0.5 0.5 180 0.75 SQUARE WAVE 2.5 0 160 1 3 0 40 dc Figure 7. Current Derating, Lead 1.5 36 1.5 TL, LEAD TEMPERATURE (C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) C, CAPACITANCE (pF) 45 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 4 3.5 MURA115T3G, MURA120T3G, SURA8120T3G PACKAGE DIMENSIONS SMA CASE 403D-02 ISSUE F HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L A1 c SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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