LMV651MGX/NOPB - Texas Instruments

CC1

+VOUT

VIN

RB1

V+

RB2

CC2

AV = -

100 k:

1 k:

= -100

120

100 10k 1M 100M

FREQUENCY (Hz)

-40

GAIN (dB)

10M100k

100

-20

PHASE (q)

120

-40

100

-20

PHASE

GAIN

V+ = 5V

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Folder

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMV651

LMV652

LMV654

SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

LMV65x 12-MHz, Low Voltage, Low Power Amplifiers

1 Features

1• Typical 5-V Supply, Unless Otherwise Noted

• Specified 3-V and 5-V Performance

• Low Power Supply Current

– LMV651: 116 μA

– LMV652: 118 μA per Amplifier

– LMV654: 122 μA per Amplifier

• High Unity-Gain Bandwidth: 12 MHz

• Maximum Input Offset Voltage: 1.5 mV

• CMRR: 100 dB

• PSRR: 95 dB

• Input Referred Voltage Noise: 17 nV/√Hz

• Output Swing With 2-kΩLoad, 120 mV from Rail

• Total Harmonic Distortion: 0.003% at 1 kHz, 2 kΩ

• Temperature Range: −40°C to 125°C

2 Applications

• Portable Equipment

• Automotive

• Battery-Powered Systems

• Sensors and Instrumentation

3 Description

TI’s LMV65x devices are high-performance, low-

power operational amplifier ICs implemented with TI's

advanced VIP50 process. This family of parts

features 12 MHz of bandwidth while consuming only

116 μA of current, which is an exceptional bandwidth

to power ratio in this operational amplifier class. The

LMV65x devices are unity-gain stable and provide an

excellent solution for general-purpose amplification in

low-voltage, low-power applications.

This family of low-voltage, low-power amplifiers

provides superior performance and economy in terms

of power and space usage. These operational

amplifiers have a maximum input offset voltage of 1.5

mV, a rail-to-rail output stage, and an input common-

mode voltage range that includes ground. The

LMV65x provide a PSRR of 95 dB, a CMRR of 100

dB, and a total harmonic distortion (THD) of 0.003%

at 1-kHz frequency and 2-kΩload.

The operating supply voltage range for this family of

parts is from 2.7 V and 5.5 V. These operational

amplifiers can operate over a wide temperature range

(−40°C to 125°C), making them ideal for automotive

applications, sensor applications, and portable

equipment applications. The LMV651 is offered in the

ultra-tiny 5-pin SC70 and 5-pin SOT-23 package. The

LMV652 is offered in an 8-pin VSSOP package. The

LMV654 is offered in a 14-pin TSSOP package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LMV651 SOT-23 (5) 2.90 mm × 1.60 mm

SC70 (5) 2.00 mm × 1.25 mm

LMV652 VSSOP (8) 3.00 mm × 3.00 mm

LMV654 TSSOP (14) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

High Gain Wide Bandwidth Inverting Amplifier Open-Loop Gain and Phase vs Frequency

LMV651

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LMV654

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 3-V DC Electrical Characteristics.............................. 5

6.6 5-V DC Electrical Characteristics.............................. 6

6.7 Typical Characteristics.............................................. 7

7 Detailed Description............................................ 13

7.1 Overview................................................................. 13

7.2 Functional Block Diagram....................................... 13

7.3 Feature Description................................................. 13

7.4 Device Functional Modes........................................ 14

8 Application and Implementation ........................ 16

8.1 Application Information............................................ 16

8.2 Typical Applications ................................................ 16

8.3 Dos and Don'ts ....................................................... 18

9 Power Supply Recommendations...................... 18

10 Layout................................................................... 19

10.1 Layout Guidelines ................................................. 19

10.2 Layout Example .................................................... 19

11 Device and Documentation Support................. 20

11.1 Device Support .................................................... 20

11.2 Documentation Support ....................................... 20

11.3 Related Links ........................................................ 20

11.4 Community Resources.......................................... 20

11.5 Trademarks........................................................... 20

11.6 Electrostatic Discharge Caution............................ 20

11.7 Glossary................................................................ 21

12 Mechanical, Packaging, and Orderable

Information........................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision J (March 2013) to Revision K Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

Changes from Revision I (March 2012) to Revision J Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 18

LMV651

LMV652

LMV654

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SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

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5 Pin Configuration and Functions

LMV651 DBV or DCK Package

5-Pin SC70 or SOT-23

Top View LMV652 DGK Package

8-Pin VSSOP

Top View

LMV654 PW Package

14-Pin TSSOP

Top View

Pin Functions: LMV651

PIN I/O DESCRIPTION

NAME NO.

–IN 3 I Inverting Input

+IN 1 I Noninverting Input

OUT 4 O Output

V– 2 P Negative supply input

V+ 5 P Positive Supply Input

Pin Functions: LMV652, LMV654

PIN I/O DESCRIPTION

NAME VSSOP TSSOP

–IN A 2 2 I Inverting input, channel A

+IN A 3 3 I Noninverting input, channel A

–IN B 6 6 I Inverting input, channel B

+IN B 5 5 I Noninverting input, channel B

–IN C — 9 I Inverting input, channel C

+IN C — 10 I Noninverting input, channel C

–IN D — 13 I Inverting input, channel D

+IN D — 12 I Noninverting input, channel D

OUT A 1 1 O Output, channel A

OUT B 7 7 O Output, channel B

OUT C — 8 O Output, channel C

OUT D — 14 O Output, channel D

V– 4 11 P Negative (lowest) power supply

V+ 8 4 P Positive (highest) power supply

LMV651

LMV652

LMV654

SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) The maximum power dissipation is a function of TJ(MAX,θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD= (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT

Differential input VID ±0.3

Supply voltage (VS= V+- V−) 6

Input or output pin voltage V−−0.3 V++ 0.3 V

Soldering information Infrared or convection (20 sec) 235 °C

Wave soldering lead temperature (10 sec) 260

Junction temperature(3) 150 °C

Storage temperature, Tstg −65 150 °C

(1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7

(2) Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-

C101-C (ESD FICDM std. of JEDEC).

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic

discharge Human-body model (HBM)(1) ±2000 V

Machine model(2) ±100

6.3 Recommended Operating Conditions MIN MAX UNIT

Temperature −40 125 °C

Supply voltage 2.7 5.5 V

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMV651 LMV652 LMV653

UNIT

DCK

(SC70) DBV

(SOT-23) DGK

(VSSOP) PW

(TSSOP)

5 PINS 5 PINS 8 PINS 14 PINS

RθJA Junction-to-ambient thermal resistance 303.5 214.2 200.3 134.9 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 135.5 173.3 89.1 60.9 °C/W

RθJB Junction-to-board thermal resistance 81.1 72.5 120.9 77.3 °C/W

ψJT Junction-to-top characterization parameter 8.4 56.7 21.7 11.5 °C/W

ψJB Junction-to-board characterization parameter 80.4 71.9 119.4 76.7 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W

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(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using

Statistical Quality Control (SQC) method.

(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(3) Positive current corresponds to current flowing into the device.

(4) Slew rate is the average of the rising and falling slew rates.

(5) The part is not short-circuit protected and is not recommended for operation with low resistive loads. Typical sourcing and sinking output

current curves are provided in Typical Characteristics and should be consulted before designing for heavy loads.

6.5 3-V DC Electrical Characteristics

Unless otherwise specified, all limits are specified for TA= 25°C, V+= 3 V, V−= 0 V, VO= VCM = V+/2, and RL> 1 MΩ.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VOS Input offset voltage 0.1 ±1.5 mV

Over specified temperature range 2.7

TC VOS Input offset average drift 6.6 μV/°C

IBInput bias current(3) 80 120 nA

IOS Input offset current 2.2 15 nA

CMRR Common-mode rejection ratio 0 ≤VCM≤2 V 87 100 dB

Over specified temperature range 80

PSRR Power supply rejection ratio 3≤V+≤5 V, VCM = 0.5 87 95

Over specified temperature range 81

2.7 ≤V+≤5.5 V,

VCM = 0.5 87 95

Over specified temperature range 81

CMVR Input common-mode voltage

range CMRR ≥75 dB 0 2.1 V

CMRR ≥60 dB, over specified temperature range 0 2.1

AVOL Large signal voltage gain

0.3 ≤VO≤2.7, RL= 2 kΩto V+/2 80 85

0.4 ≤VO≤2.6, RL= 2 kΩto V+/2, over specified temperature range 76

0.3 ≤VO≤2.7, RL= 10 kΩto V+/2 86 93

0.4 ≤VO≤2.6, RL= 10 kΩto V+/2, over specified temperature

range 83

Output swing high RL= 2 kΩto V+/2 80 95

mV from

rail

Over specified temperature range 120

RL= 10 kΩto V+/2 45 50

Over specified temperature range 60

Output swing low RL= 2 kΩto V+/2 95 110

Over specified temperature range 125

RL= 10 kΩto V+/2 60 65

Over specified temperature range 75

ISC Maximum continuous output

current Sourcing(4) 17 mA

Sinking(4) 25

ISSupply current per amplifier

LMV651 115 140

μA

Over specified temperature range 175

LMV652 118 140

Over specified temperature range 175

LMV654 122 140

Over specified temperature range 175

SR Slew rate AV= +1, 10% to 90%(5) 3.0 V/μs

GBW Gain bandwidth product 12 MHz

enInput-referred voltage noise f = 100 kHz 17 nV/√Hz

f = 1 kHz 17

inInput-referred current noise f = 100 kHz 0.1 pA/√Hz

f = 1 kHz 0.15

THD Total harmonic distortion f = 1 kHz, AV= 2, RL= 2 kΩ0.003%

LMV651

LMV652

LMV654

SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

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(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using

Statistical Quality Control (SQC) method.

(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(3) Positive current corresponds to current flowing into the device.

(4) The part is not short-circuit protected and is not recommended for operation with low resistive loads. Typical sourcing and sinking output

current curves are provided in Typical Characteristics and should be consulted before designing for heavy loads.

(5) Slew rate is the average of the rising and falling slew rates.

6.6 5-V DC Electrical Characteristics

Unless otherwise specified, all limits are specified for TJ= 25°C, V+= 5 V, V−= 0 V, VO= VCM = V+/2, and RL> 1 MΩ.

PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT

VOS Input offset voltage 0.1 ±1.5 mV

Over specified temperature range 2.7

TC VOS Input offset average drift 6.6 μV/°C

IBInput bias current See(3) 80 120 nA

IOS Input offset current 2.2 15 nA

CMRR Common-mode rejection ratio 0 ≤VCM≤4 V 90 100 dB

Over specified temperature range 83

PSRR Power supply rejection ratio 3 V ≤V+≤5 V, VCM = 0.5 V 87 95

Over specified temperature range 81

2.7 V ≤V+≤5.5 V, VCM =

0.5 V 87 95

Over specified temperature range 81

CMVR Input common-mode voltage

range CMRR ≥80 dB 0 4.1 V

CMRR ≥68 dB, over specified temperature range 0 4.1

AVOL Large signal voltage gain

0.3 ≤VO≤4.7 V, RL= 2 kΩto V+/2 79 84

0.4 ≤VO≤4.6 V, RL= 2 kΩto V+/2, over specified temperature range 76

0.3 ≤VO≤4.7 V, RL= 10 kΩto V+/2 87 94

0.4 ≤VO≤4.6 V, RL= 10 kΩto V+/2, over specified temperature

range 84

Output swing high RL= 2 kΩto V+/2 120 140

mV from

rail

Over specified temperature range 185

RL= 10 kΩto V+/2 75 90

Over specified temperature range 120

Output swing low RL= 2 kΩto V+/2 110 130

Over specified temperature range 150

RL= 10 kΩto V+/2 70 80

Over specified temperature range 95

ISC Maximum continuous output

current Sourcing(4) 18.5 mA

Sinking(4) 25

ISSupply current per amplifier

LMV651 116 140

μA

Over specified temperature range 175

LMV652 118 140

Over specified temperature range 175

LMV654 122 140

Over specified temperature range 175

SR Slew rate AV= +1, VO= 1 VPP, 10% to 90%(5) 3.0 V/μs

GBW Gain bandwidth product 12 MHz

enInput-referred voltage noise f = 100 kHz 17 nV/√Hz

f = 1 kHz 17

inInput-referred current noise f = 100 kHz 0.1 pA/√Hz

f = 1 kHz 0.15

THD Total harmonic distortion f = 1 kHz, AV= 2, RL= 2 kΩ0.003%

0 1 2 3 4 5

-1

-0.75

-0.5

-0.25

0.25

0.5

0.75

VOS (mV)

VCM (V)

125°C

25°C

-40°C

VS = 5V

-40°C

2.7 3.2 3.7 4.2 4.7 5.2

-1

-0.75

-0.5

-0.25

0.25

VOS (mV)

VS (V)

0.5

0.75 125°C

25°C

5.5

0 0.5 1 1.5 2 2.5

-1

-0.75

-0.5

-0.25

0.25

0.5

0.75

VOS (mV)

VCM (V)

125°C

25°C

-40°C

VS = 3V

2.7 3.2 3.7 4.2 4.7 5.2

VS (V)

100

120

140

160

180

IS (PA)

-40°C

25°C

125°C

5.5

2.7 3.2 3.7 4.2 4.7 5.2

VS (V)

100

120

140

160

180

IS (PA)

-40°C

25°C

125°C

5.5

2.7 3.2 3.7 4.2 4.7 5.2

VS (V)

100

120

140

160

180

IS (PA)

-40°C

25°C

125°C

5.5

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6.7 Typical Characteristics

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 1. Supply Current vs Supply Voltage (LMV651) Figure 2. Supply Current per Channel vs Supply Voltage

(LMV652)

Figure 3. Supply Current per Channel vs Supply Voltage

(LMV654) Figure 4. VOS vs VCM

Figure 5. VOS vs VCM Figure 6. VOS vs Supply Voltage

33.4 3.8 4.2 4.6 5

120

150

VOUT FROM RAIL (mV)

VS (V)

-40°C 25°C

125°C

RL = 2 k:

25°C

33.4 3.8 4.2 4.6 5

100

VOUT FROM RAIL (mV)

VS (V)

-40°C

125°C

RL = 10 k:

33.4 3.8 4.2 4.6 5

120

150

VOUT FROM RAIL (mV)

VS (V)

-40°C

25°C

125°C

RL = 2 k:

2.7 3.2 3.7 4.2 4.7 5.2

VS (V)

100

IBIAS (nA)

-40°C

25°C

125°C

5.5

00.5 11.5 2 2.5

100

IBIAS (nA)

VCM (V)

-40°C

25°C

125°C

VS = 3V

012 3 4 5

100

IBIAS (nA)

VCM (V)

-40°C 25°C

125°C

VS = 5V

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Typical Characteristics (continued)

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 7. IBIAS vs VCM Figure 8. IBIAS vs VCM

Figure 9. IBIAS vs Supply Voltage Figure 10. Positive Output Swing vs Supply Voltage

Figure 11. Negative Output Swing vs Supply Voltage Figure 12. Positive Output Swing vs Supply Voltage

0 0.1 0.2 0.3 0.4 0.5

ISINK (mA)

VOUT FROM RAIL (V)

-40°C

25°C

125°C

VS = 5V

180

100 10k 1M 100M

FREQUENCY (Hz)

-60

GAIN (dB)

10M100k

150

120

-30

180

-60

150

120

-30

PHASE (°)

PHASE

GAIN

CL = 20 pF

CL = 100 pF

RL = 2 k:

CL = 100 pF

CL = 50 pF

00.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4

VOUT FROM RAIL (V)

ISINK (mA)

VS = 5V

125°C

25°C

-40°C

0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45

ISINK (mA)

VOUT FROM RAIL (V)

25°C

-40°C

125°C

VS = 5V

3 3.4 3.8 4.2 4.6 5

VOUT FROM RAIL (mV)

VS (V)

-40°C 25°C

125°C

RL = 10 k:

125°C

-40°C

00.25 0.5 0.75 1 1.25 1.5

VOUT FROM RAIL (V)

ISOURCE (mA)

25°C

VS = 5V

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Typical Characteristics (continued)

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 13. Negative Output Swing vs Supply Voltage Figure 14. Sourcing Current vs Output Voltage

Figure 15. Sinking Current vs Output Voltage (LMV651) Figure 16. Sinking Current vs Output Voltage (LMV652)

Figure 17. Sinking Current vs Output Voltage (LMV654) Figure 18. Open-Loop Gain and Phase With Capacitive Load

3 3.5 4 4.5 5

0.5

1.5

2.5

3.5

SLEW RATE (V/Ps)

VS (V)

RISING

FALLING

0.001 0.01 0.1 1 10

VOUT (V)

0.0001

0.001

0.01

0.1

THD+N (%)

VS = 3V

VIN = 1 kHz

AV = +2

RL = 2 k:

RL = 100 k:

SINE WAVE

110 100 10k 100k

FREQUENCY (Hz)

100

INPUT REFERRED VOLTAGE NOISE

HZ)

(nV/

110 100 1k 100k

FREQUENCY (Hz)

0.01

0.10

10k

INPUT REFERRED CURRENT NOISE

HZ)

(pA/

180

100 10k 1M 100M

FREQUENCY (Hz)

-60

GAIN (dB)

10M100k

150

120

-30

180

-60

150

120

-30

PHASE (°)

PHASE

GAIN

RL = 2 k:

CL = 20 pF

RL = 10:

RL = 2 k:

CL (pF)

10 100 1000

PHASE MARGIN (°)

VS = 3V

VS = 5V

RL = 2 k:

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Typical Characteristics (continued)

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 19. Open-Loop Gain and Phase With Resistive Load Figure 20. Phase Margin vs Capacitive Load (Stability)

Figure 21. Input-Referred Voltage Noise vs Frequency Figure 22. Input-Referred Current Noise vs Frequency

Figure 23. Slew Rate vs Supply Voltage Figure 24. THD+N vs VOUT

-30

-25

-20

-15

-10

-5

VOUT (mV)

TIME (Ps)

020 40 60 70 80

VS = 5V

CL = 125 pF, AV = +1

VIN = 20 mVPP, 20 kHz

0 20 40 60 80 100

-1.5

-1

-0.5

0.5

1.5

VOUT (mV)

TIME (Ps)

VS = 5V

CL = 15 pF, AV = +1

VIN = 2 VPP, 20 kHz

10 100 1k 10k 100k

FREQUENCY (Hz)

0.0001

0.001

0.01

0.1

THD+N (%)

VS = 5V

VIN = 2 VPP

AV = +2 RL = 2 k:

RL = 100 k:

0 20 40 60 80 100

TIME (Ps)

-15

-10

-5

VOUT (mV)

-20

30 VS = 5V

CL = 15 pF, AV = +1

VIN = 20 mVPP, 20 kHz

0.001 0.01 0.1 1 10

VOUT (V)

0.001

0.01

0.1

THD+N (%)

VS = 5V

VIN = 1 kHz

AV = +2

RL = 2 k:

RL = 100 k:

SINE WAVE

10 100 1k 10k 100k

FREQUENCY (Hz)

0.001

0.01

0.1

THD+N (%)

VS = 3V

VIN = 1 VPP

AV = +2

RL = 2 k:

RL = 100 k:

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Typical Characteristics (continued)

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 25. THD+N vs VOUT Figure 26. THD+N vs Frequency

Figure 27. THD+N vs Frequency Figure 28. Small Signal Transient Response

Figure 29. Small Signal Transient Response Figure 30. Large Signal Transient Response

10 1k 1M

0.01

100

1000

ZOUT (W)

10M

10k

100 100M

FREQUENCY (Hz)

100k

0.1

120

10 1k 100k 10M

FREQUENCY (Hz)

PSRR (dB)

10k

100

VS = 3V, -PSRR

VS = 5V, -PSRR

VS = 3V, +PSRR

VS = 5V, +PSRR

10 1k 1M

FREQUENCY (Hz)

120

CMRR (dB)

100k

10k

100

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Typical Characteristics (continued)

Unless otherwise specified, TA= 25°C, VS= 5 V, V+= 5 V, V−= 0 V, VCM= VS/2

Figure 31. PSRR vs Frequency Figure 32. CMRR vs Frequency

Figure 33. Closed-Loop Output Impedance vs Frequency

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7 Detailed Description

7.1 Overview

TI’s LMV65x devices have 12 MHz of bandwidth, are unity-gain stable, and consume only 116 μA of current.

They also have a maximum input offset voltage of 1.5 mV, a rail-to-rail output stage, and an input common-mode

voltage range that includes ground. Lastly, these operational amplifiers provide a PSRR of 95 dB, a CMRR of

100 dB, and a total harmonic distortion (THD) of 0.003% at 1-kHz frequency and 2-kΩload.

7.2 Functional Block Diagram

(Each Amplifier)

7.3 Feature Description

7.3.1 Low Voltage and Low Power Operation

The LMV65x have performance specified at supply voltages of 3 V and 5 V. These parts are specified to be

operational at all supply voltages between 2.7 V and 5.5 V. The LMV651 draws a low supply current of 116 μA,

the LMV652 draws 118 μA/channel and the LMV654 draws 122 μA/channel. This family of operational amplifiers

provides the low voltage and low power amplification that is essential for portable applications.

7.3.2 Wide Bandwidth

Despite drawing the very low supply current of 116 µA, the LMV65x manage to provide a wide unity-gain

bandwidth of 12 MHz. This is easily one of the best bandwidth to power ratios ever achieved, and allows these

operational amplifiers to provide wideband amplification while using the minimum amount of power. This makes

this family of parts ideal for low-power signal processing applications such as portable media players and other

accessories.

7.3.3 Low Input Referred Noise

The LMV65x provides a flatband input referred voltage noise density of 17 nV/√Hz, which is significantly better

than the noise performance expected from a low-power operational amplifiers. These operational amplifiers also

feature exceptionally low 1/f noise, with a very low 1/f noise corner frequency of 4 Hz. This makes these parts

ideal for low power applications which require decent noise performance, such as PDAs and portable sensors.

7.3.4 Ground Sensing and Rail-to-Rail Output

The LMV65x each have a rail-to-rail output stage, which provides the maximum possible output dynamic range.

This is especially important for applications requiring a large output swing. The input common-mode range of this

family of devices includes the negative supply rail which allows direct sensing at ground in a single-supply

operation.

7.3.5 Small Size

The small footprint of the packages for the LMV65x saves space on printed-circuit boards, and enables the

design of smaller and more compact electronic products. Long traces between the signal source and the

operational amplifier make the signal path susceptible to noise. By using a physically smaller package, these

operational amplifiers can be placed closer to the signal source, reducing noise pickup and enhancing signal

integrity.

ROUT

VIN

RIN

UNSTABLE

ROC = 40 dB/decade

STABLE

ROC ± 20 dB/decade

FREQUENCY (Hz)

GAIN

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Product Folder Links: LMV651 LMV652 LMV654

7.4 Device Functional Modes

7.4.1 Stability and Capacitive Loading

If the phase margin of the LMV65x is plotted with respect to the capacitive load (CL) at its output, it is seen that

the phase margin reduces significantly if CLis increased beyond 100 pF. This is because the operational

amplifier is designed to provide the maximum bandwidth possible for a low supply current. Stabilizing it for higher

capacitive loads would have required either a drastic increase in supply current, or a large internal compensation

capacitance, which would have reduced the bandwidth of the operational amplifier. Hence, if these devices are to

be used for driving higher capacitive loads, they would have to be externally compensated.

Figure 34. Gain vs Frequency for an Operational Amplifiers

An operational amplifier, ideally, has a dominant pole close to DC, which causes its gain to decay at the rate of

20 dB/decade with respect to frequency. If this rate of decay, also known as the rate of closure (ROC), remains

the same until the unity-gain bandwidth of the operational amplifiers is stable. If, however, a large capacitance is

added to the output of the operational amplifier, it combines with the output impedance of the operational

amplifier to create another pole in its frequency response before its unity-gain frequency (see Figure 34). This

increases the ROC to 40 dB/decade and causes instability.

In such a case a number of techniques can be used to restore stability to the circuit. The idea behind all these

schemes is to modify the frequency response such that it can be restored to an ROC of 20 dB/decade, which

ensures stability.

7.4.2 In The Loop Compensation

Figure 35 illustrates a compensation technique, known as in-the-loop compensation, that employs an RC

feedback circuit within the feedback loop to stabilize a noninverting amplifier configuration. A small series

resistance, RS, is used to isolate the amplifier output from the load capacitance, CL, and a small capacitance, CF,

is inserted across the feedback resistor to bypass CLat higher frequencies.

Figure 35. In-the-Loop Compensation

CF = ¨

§RF + 2RIN

RF2

CLROUT

RS = ROUTRIN

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Device Functional Modes (continued)

The values for RSand CFare decided by ensuring that the zero attributed to CFlies at the same frequency as the

pole attributed to CL. This ensures that the effect of the second pole on the transfer function is compensated for

by the presence of the zero, and that the ROC is maintained at 20 dB/decade. For the circuit shown in Figure 35

the values of RSand CFare given by Equation 1. Values of RSand CFrequired for maintaining stability for

different values of CL, as well as the phase margins obtained, are shown in Table 1. RFand RIN are taken to be

10 kΩ, RLis 2 kΩ, while ROUT is taken as 340 Ω.

(1)

Table 1. Loop Compensation Values

CL(pF) RS(Ω) CF(pF) PHASE MARGIN (°)

150 340 15 39.4

200 340 20 34.6

250 340 25 31.1

Although this methodology provides circuit stability for any load capacitance, it does so at the price of bandwidth.

The closed-loop bandwidth of the circuit is now limited by RFand CF.

7.4.3 Compensation By External Resistor

In some applications, it is essential to drive a capacitive load without sacrificing bandwidth. In such a case, in the

loop compensation is not viable. A simpler scheme for compensation is shown in Figure 36. A resistor, RISO, is

placed in series between the load capacitance and the output. This introduces a zero in the circuit transfer

function, which counteracts the effect of the pole formed by the load capacitance, and ensures stability. The

value of RISO to be used should be decided depending on the size of CLand the level of performance desired.

Values ranging from 5 Ωto 50 Ωare usually sufficient to ensure stability. A larger value of RISO results in a

system with lesser ringing and overshoot, but it also limits the output swing and the short-circuit current of the

circuit.

Figure 36. Compensation by Isolation Resistor

CC1

+VOUT

VIN

RB1

V+

RB2

CC2

AV = -

100 k:

1 k:

= -100

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Product Folder Links: LMV651 LMV652 LMV654

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

With a low supply current, low power operation, and low harmonic distortion, the LMV65x devices are ideal for

wide-bandwidth, high gain amplification.

8.2 Typical Applications

8.2.1 High Gain, Low Power Inverting Amplifiers

Figure 37. High Gain Inverting Amplifier

8.2.1.1 Design Requirements

The wide unity-gain bandwidth allows these parts to provide large gain over a wide frequency range, while

driving loads as low as 2 kΩwith less than 0.003% distortion.

8.2.1.2 Detailed Design Procedure

Figure 37 is an inverting amplifier, with a 100-kΩfeedback resistor, R2, and a 1-kΩinput resistor, R1, and

provides a gain of −100. With the LMV65x, these circuits can provide gain of −100 with a −3-dB bandwidth of

120 kHz, for a quiescent current as low as 116 μA. Coupling capacitors CC1 and CC2 can be added to isolate the

circuit from DC voltages, while RB1 and RB2 provide DC biasing. A feedback capacitor CFcan also be added to

improve compensation.

CC2 RB1

RB2

CC1

V+

AV = 1 + R2

VIN

1 k:

1 M:

VOUT

= 1001

0 50 100 150 200

Signal Amplitudee

Time (us)

Vout (1V/div)

Vin (10mV/div)

C001

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Typical Applications (continued)

8.2.1.3 Application Curve

Figure 38. High Gain Inverting Amplifier Results

8.2.2 High Gain, Low Power Noninverting Amplifiers

With a low supply current, low power operation, and low harmonic distortion, the LMV65x devices are ideal for

wide-bandwidth, high gain amplification. The wide unity-gain bandwidth allows these parts to provide large gain

over a wide frequency range, while driving loads as low as 2 kΩwith less than 0.003% distortion. Figure 39 is a

noninverting amplifier with a gain of 1001, can provide that gain with a −3-dB bandwidth of 12 kHz, for a similar

low quiescent power dissipation. With the LMV65x, these circuits can provide gain of −100 with a −3-dB

bandwidth of 120 kHz, for a quiescent current as low as 116 μA. Coupling capacitors CC1 and CC2 can be added

to isolate the circuit from DC voltages, while RB1 and RB2 provide DC biasing. A feedback capacitor CFcan also

be added to improve compensation.

Figure 39. High Gain Noninverting Amplifier

8.2.3 Active Filters

With a wide unity-gain bandwidth of 12 MHz, low input-referred noise density, and a low power supply current,

the LMV65x devices are well suited for low-power filtering applications. Active filter topologies, like the Sallen-

Key low-pass filter shown in Figure 40, are very versatile, and can be used to design a wide variety of filters

(Chebyshev, Butterworth, or Bessel). The Sallen-Key topology, in particular, can be used to attain a wide range

of Q, by using positive feedback to reject the undesired frequency range.

m2R

VIN VOUT

LMV651

LMV652

LMV654

SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

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Product Folder Links: LMV651 LMV652 LMV654

Typical Applications (continued)

In the circuit shown in Figure 40, the two capacitors appear as open circuits at lower frequencies and the signal

is simply buffered to the output. At high frequencies the capacitors appear as short circuits and the signal is

shunted to ground by one of the capacitors before it can be amplified. Near the cutoff frequency, where the

impedance of the capacitances is on the same order as Rgand Rf, positive feedback through the other capacitor

allows the circuit to attain the desired Q. The ratio of the two resistors, m2, provides a knob to control the value of

Q obtained.

Figure 40. Sallen-Key Low-Pass Filter

8.3 Dos and Don'ts

Do properly bypass the power supplies.

Do add series resistence to the output when driving capacitive loads, particularly cables, Muxes, and ADC inputs.

Do add series current limiting resistors and external Schottky clamp diodes if input voltage is expected to exceed

the supplies. Limit the current to 1 mA or less (1 kΩper volt).

9 Power Supply Recommendations

For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines, TI

recommends that 10-nF capacitors be placed as close as possible to the operational amplifier power supply pins.

For single supply, place a capacitor between V+and V–supply leads. For dual supplies, place one capacitor

between V+and ground, and one capacitor between V–and ground.

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10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed-circuit board need to be considered. A

6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is

introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power

supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+pin needs to be

bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+and V–pins must

be bypassed.

It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive

ground connection.

Surface mount components in 0805 size or smaller are recommended in the LMV651-N application circuits.

Designers can take advantage of the VSSOP miniature sizes to condense board layout in order to save space

and reduce stray capacitance.

10.2 Layout Example

Figure 41. LMV65x Layout Example

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SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

LMV651 PSPICE Model http://www.ti.com/lit/zip/snom064

LMV652 PSPICE Model http://www.ti.com/lit/zip/snom065

LMV654 PSPICE Model http://www.ti.com/lit/zip/snom066

TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti

DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm

TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm

TI Filterpro Software, http://www.ti.com/tool/filterpro

11.2 Documentation Support

11.2.1 Related Documentation

For additional applications, see the following:

AN-31 Op Amp Circuit Collection,SNLA140

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LMV651 Click here Click here Click here Click here Click here

LMV652 Click here Click here Click here Click here Click here

LMV654 Click here Click here Click here Click here Click here

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

LMV651

LMV652

LMV654

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SNOSAI7K –SEPTEMBER 2005–REVISED MAY 2016

Product Folder Links: LMV651 LMV652 LMV654

11.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 25-Jan-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMV651MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM AY2A

LMV651MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM AY2A

LMV651MG/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A93

LMV651MGX/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 A93

LMV652MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AB3A

LMV652MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AB3A

LMV654MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV65

4MT

LMV654MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMV65

4MT

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM

www.ti.com 25-Jan-2016

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMV651MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LMV651MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LMV651MG/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3

LMV651MGX/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3

LMV652MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV652MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LMV654MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Dec-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMV651MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LMV651MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LMV651MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0

LMV651MGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0

LMV652MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LMV652MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LMV654MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Dec-2016

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

IMPORTANT NOTICE

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Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

described in the published documentation for a particular TI Resource.

Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE

TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or

endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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