LTC2251/LTC2250
1
22510fa
FEATURES
DESCRIPTIO
U
APPLICATIO S
U
TYPICAL APPLICATIO
U
■
Sample Rate: 125Msps/105Msps
■
Single 3V Supply (2.85V to 3.4V)
■
Low Power: 395mW/320mW
■
61.6dB SNR
■
85dB SFDR
■
No Missing Codes
■
Flexible Input: 1V
P-P
to 2V
P-P
Range
■
640MHz Full Power Bandwidth S/H
■
Clock Duty Cycle Stabilizer
■
Shutdown and Nap Modes
■
Pin Compatible Family:
125Msps: LTC2251 (10-Bit), LTC2253 (12-Bit)
105Msps: LTC2250 (10-Bit), LTC2252 (12-Bit)
80Msps: LTC2239 (10-Bit), LTC2229 (12-Bit)
65Msps: LTC2238 (10-Bit), LTC2228 (12-Bit)
40Msps: LTC2237 (10-Bit), LTC2227 (12-Bit)
25Msps: LTC2236 (10-Bit), LTC2226 (12-Bit)
■
32-Pin (5mm × 5mm) QFN Package
10-Bit, 125/105Msps
Low Noise 3V ADCs
The LTC
®
2251/LTC2250 are 10-bit 125Msps/105Msps,
low noise 3V A/D converters designed for digitizing high
frequency, wide dynamic range signals. The LTC2251/
LTC2250 are perfect for demanding imaging and commu-
nications applications with AC performance that includes
61.6dB SNR and 85dB SFDR for signals at the Nyquist
frequency.
DC specs include ±0.1LSB INL (typ), ±0.05LSB DNL (typ)
and ±0.6LSB INL, ±0.6LSB DNL over temperature. The
transition noise is a low 0.08LSB
RMS
.
A single 3V supply allows low power operation. A separate
output supply allows the outputs to drive 0.5V to 3.3V
logic.
A single-ended CLK input controls converter operation. An
optional clock duty cycle stabilizer allows high perfor-
mance at full speed for a wide range of clock duty cycles.
LTC2251: SNR vs Input Frequency,
–1dB, 2V Range, 125Msps
■
Wireless and Wired Broadband Communication
■
Imaging Systems
■
Ultrasound
■
Spectral Analysis
■
Portable Instrumentation
–
+
INPUT
S/H
CORRECTION
LOGIC
OUTPUT
DRIVERS
10-BIT
PIPELINED
ADC CORE
CLOCK/DUTY
CYCLE
CONTROL
FLEXIBLE
REFERENCE
D9
•
•
•
D0
CLK
REFH
REFL
ANALOG
INPUT
22510 TA01
OVDD
OGND
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
INPUT FREQUENCY (MHz)
0
55
SNR (dBFS)
56
58
59
60
65
62
100 200 250
22510 G09
57
63
64
61
50 150 300 350
LTC2251/LTC2250
2
22510fa
LTC2251 LTC2250
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Resolution (No Missing Codes) ●10 10 Bits
Integral Linearity Error Differential Analog Input ●–0.6 ±0.1 0.6 –0.6 ±0.1 0.6 LSB
(Note 5)
Differential Linearity Error Differential Analog Input ●–0.6 ±0.05 0.6 –0.6 ±0.05 0.6 LSB
Offset Error (Note 6) ●–12 ±212–12±212 mV
Gain Error External Reference ●–2.5 ±0.5 2.5 –2.5 ±0.5 2.5 %FS
Offset Drift ±10 ±10 µV/°C
Full-Scale Drift Internal Reference ±30 ±30 ppm/°C
External Reference ±5±5 ppm/°C
Transition Noise SENSE = 1V 0.08 0.08 LSB
RMS
ABSOLUTE AXI U RATI GS
W
WW
U
PACKAGE/ORDER I FOR ATIO
UUW
OVDD = VDD (Notes 1, 2)
Supply Voltage (V
DD
) ................................................. 4V
Digital Output Ground Voltage (OGND) ....... –0.3V to 1V
Analog Input Voltage (Note 3) ..... –0.3V to (V
DD
+ 0.3V)
Digital Input Voltage .................... –0.3V to (V
DD
+ 0.3V)
Digital Output Voltage ................ –0.3V to (OV
DD
+ 0.3V)
Power Dissipation............................................ 1500mW
Operating Temperature Range
LTC2251C, LTC2250C ............................. 0°C to 70°C
LTC2251I, LTC2250I ...........................–40°C to 85°C
Storage Temperature Range ..................–65°C to 125°C
ORDER PART
NUMBER
QFN PART*
MARKING
T
JMAX
= 125°C, θ
JA
= 34°C/W
EXPOSED PAD (PIN 33) IS GND
MUST BE SOLDERED TO PCB
2251
2250
LTC2251CUH
LTC2251IUH
LTC2250CUH
LTC2250IUH
Consult LTC Marketing for parts specified with wider operating temperature ranges.
*The temperature grade is identified by a label on the shipping container.
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
CO VERTER CHARACTERISTICS
U
32 31 30 29 28 27 26 25
9 10 11 12
TOP VIEW
UH PACKAGE
32-LEAD (5mm × 5mm) PLASTIC QFN
13 14 15 16
17
18
19
20
21
22
23
24
8
7
6
5
4
3
2
1AIN
+
AIN
–
REFH
REFH
REFL
REFL
V
DD
GND
D6
D5
D4
OV
DD
OGND
D3
D2
D1
V
DD
V
CM
SENSE
MODE
OF
D9
D8
D7
CLK
SHDN
OE
NC
NC
NC
NC
D0
33
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
LTC2251/LTC2250
3
22510fa
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
Analog Input Range (A
IN+
–A
IN–
) 2.85V < V
DD
< 3.4V (Note 7) ●±0.5V to ±1V V
V
IN,CM
Analog Input Common Mode Differential Input (Note 7) ●1 1.5 1.9 V
I
IN
Analog Input Leakage Current 0V < A
IN+
, A
IN–
< V
DD
●–1 1 µA
I
SENSE
SENSE Input Leakage 0V < SENSE < 1V ●–3 3 µA
I
MODE
MODE Pin Leakage ●–3 3 µA
t
AP
Sample-and-Hold Acquisition Delay Time 0 ns
t
JITTER
Sample-and-Hold Acquisition Delay Time Jitter 0.2 ps
RMS
CMRR Analog Input Common Mode Rejection Ratio 80 dB
Full Power Bandwidth Figure 8 Test Circuit 640 MHz
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4)
LTC2251 LTC2250
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
SNR Signal-to-Noise Ratio 5MHz Input 61.6 61.6 dB
30MHz Input 61.6 61.6 dB
70MHz Input ●60 61.5 60 61.5 dB
140MHz Input 61.4 61.4 dB
SFDR 5MHz Input 85 85 dB
30MHz Input 85 85 dB
70MHz Input ●69 82 69 83 dB
140MHz Input 77 77 dB
SFDR 5MHz Input 85 85 dB
30MHz Input 85 85 dB
70MHz Input ●75 85 75 85 dB
140MHz Input 85 85 dB
S/(N+D) 5MHz Input 61.5 61.6 dB
30MHz Input 61.5 61.6 dB
70MHz Input ●60 61.4 60 61.5 dB
140MHz Input 61.2 61.3 dB
IMD f
IN1
= 28.2MHz, 80 80 dB
f
IN2
= 26.8MHz
A ALOG I PUT
UU
DY A IC ACCURACY
U
W
The ● denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 4)
Signal-to-Noise
Plus Distortion
Ratio
Intermodulation
Distortion
Spurious Free
Dynamic Range
2nd or 3rd
Harmonic
Spurious Free
Dynamic Range
4th Harmonic
or Higher
LTC2251/LTC2250
4
22510fa
I TER AL REFERE CE CHARACTERISTICS
UU U
(Note 4)
PARAMETER CONDITIONS MIN TYP MAX UNITS
V
CM
Output Voltage I
OUT
= 0 1.475 1.500 1.525 V
V
CM
Output Tempco ±25 ppm/°C
V
CM
Line Regulation 2.85V < V
DD
< 3.4V 3 mV/V
V
CM
Output Resistance –1mA < I
OUT
< 1mA 4 Ω
DIGITAL I PUTS A D DIGITAL OUTPUTS
UU
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
LOGIC INPUTS (CLK, OE, SHDN)
V
IH
High Level Input Voltage V
DD
= 3V ●2V
V
IL
Low Level Input Voltage V
DD
= 3V ●0.8 V
I
IN
Input Current V
IN
= 0V to V
DD
●–10 10 µA
C
IN
Input Capacitance (Note 7) 3 pF
LOGIC OUTPUTS
OV
DD
= 3V
C
OZ
Hi-Z Output Capacitance OE = High (Note 7) 3 pF
I
SOURCE
Output Source Current V
OUT
= 0V 50 mA
I
SINK
Output Sink Current V
OUT
= 3V 50 mA
V
OH
High Level Output Voltage I
O
= –10µA 2.995 V
I
O
= –200µA●2.7 2.99 V
V
OL
Low Level Output Voltage I
O
= 10µA 0.005 V
I
O
= 1.6mA ●0.09 0.4 V
OV
DD
= 2.5V
V
OH
High Level Output Voltage I
O
= –200µA 2.49 V
V
OL
Low Level Output Voltage I
O
= 1.6mA 0.09 V
OV
DD
= 1.8V
V
OH
High Level Output Voltage I
O
= –200µA 1.79 V
V
OL
Low Level Output Voltage I
O
= 1.6mA 0.09 V
LTC2251/LTC2250
5
22510fa
TI I G CHARACTERISTICS
UW
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 4)
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to ground with GND and OGND
wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above V
DD
, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above V
DD
without latchup.
Note 4: V
DD
= 3V, f
SAMPLE
= 125MHz (LTC2251) or 105MHz (LTC2250),
input range = 2V
P-P
with differential drive, clock duty cycle stabilizer on,
unless otherwise noted.
Note 5: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –0.5 LSB when
the output code flickers between 00 0000 0000 and 11 1111 1111.
Note 7: Guaranteed by design, not subject to test.
Note 8: V
DD
= 3V, f
SAMPLE
= 125MHz (LTC2251) or 105MHz (LTC2250),
input range = 1V
P-P
with differential drive.
Note 9: Recommended operating conditions.
LTC2251 LTC2250
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
f
s
Sampling Frequency (Note 9) ●1 125 1 105 MHz
t
L
CLK Low Time Duty Cycle Stabilizer Off ●3.8 4 500 4.5 4.76 500 ns
Duty Cycle Stabilizer On ●3 4 500 3 4.76 500 ns
(Note 7)
t
H
CLK High Time Duty Cycle Stabilizer Off ●3.8 4 500 4.5 4.76 500 ns
Duty Cycle Stabilizer On ●3 4 500 3 4.76 500 ns
(Note 7)
t
AP
Sample-and-Hold 0 0 ns
Aperture Delay
t
D
CLK to DATA Delay C
L
= 5pF (Note 7) ●1.4 2.7 5.4 1.4 2.7 5.4 ns
Data Access Time C
L
= 5pF (Note 7) ●4.3 10 4.3 10 ns
After OE↓
BUS Relinquish Time (Note 7) ●3.3 8.5 3.3 8.5 ns
Pipeline 5 5 Cycles
Latency
POWER REQUIRE E TS
WU
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 8)
LTC2251 LTC2250
SYMBOL PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
V
DD
Analog Supply (Note 9) ●2.85 3 3.4 2.85 3 3.4 V
Voltage
OV
DD
Output Supply (Note 9) ●0.5 3 3.6 0.5 3 3.6 V
Voltage
I
VDD
Supply Current ●132 156 107 126 mA
P
DISS
Power Dissipation ●395 468 320 378 mW
P
SHDN
Shutdown Power SHDN = H, 2 2 mW
OE = H, No CLK
P
NAP
Nap Mode Power SHDN = H, 15 15 mW
OE = L, No CLK
LTC2251/LTC2250
6
22510fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
LTC2251: 8192 Point FFT,
fIN = 70MHz, –1dB, 2V Range,
125Msps
LTC2251: 8192 Point FFT,
fIN = 140MHz, –1dB, 2V Range,
125Msps
LTC2251: Grounded Input
Histogram, 125Msps
LTC2251: SNR vs Input Frequency,
–1dB, 2V Range, 125Msps
LTC2251: 8192 Point 2-Tone FFT,
fIN = 28.2MHz and 26.8MHz,
–1dB, 2V Range, 125Msps
LTC2251: 8192 Point FFT,
fIN = 5MHz, –1dB, 2V Range,
125Msps
LTC2251: 8192 Point FFT,
fIN = 30MHz, –1dB, 2V Range,
125Msps
LTC2251: Typical DNL,
2V Range, 125Msps
LTC2251: Typical INL,
2V Range, 125Msps
CODE
0
INL ERROR (LSB)
768
22510 G01
256 512 1024
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
CODE
0
DNL ERROR (LSB)
768
22510 G02
256 512 1024
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
FREQUENCY (MHz)
0
AMPLITUDE (dB)
22510 G04
10 20 30 40 50 60
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
0
AMPLITUDE (dB)
22510 G03
10 20 30 40 50 60
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
0
AMPLITUDE (dB)
22510 G05
10 20 30 40 50 60
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
0
AMPLITUDE (dB)
22510 G06
10 20 30 40 50 60
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
0
AMPLITUDE (dB)
22510 G07
10 20 30 40 50 60
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
CODE
70000
60000
50000
40000
30000
20000
10000
0511
65528
512
22510 G08
510
0
0
COUNT
INPUT FREQUENCY (MHz)
0
55
SNR (dBFS)
56
58
59
60
65
62
100 200 250
22510 G09
57
63
64
61
50 150 300 350
LTC2251/LTC2250
7
22510fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
LTC2251: SNR and SFDR vs
Sample Rate, 2V Range,
fIN = 5MHz, –1dB
LTC2251: SNR vs Input Level,
fIN = 70MHz, 2V Range, 125Msps
LTC2251: IOVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB,
OVDD = 1.8V
LTC2251: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB
LTC2251: SFDR vs Input Level,
fIN = 70MHz, 2V Range, 125Msps
LTC2251: SFDR vs Input Frequency,
–1dB, 2V Range, 125Msps
INPUT FREQUENCY (MHz)
0
SFDR (dBFS)
85
90
95
150 250
55210 G10
80
75
50 100 200 300 350
70
65
SAMPLE RATE (Msps)
0
50
SNR AND SFDR (dBFS)
60
70
80
90
20 40 60 80
22510 G11
100 120 140 160
SFDR
SNR
INPUT LEVEL (dBFS)
–50
SNR (dBc AND dBFS)
30
40
50
–20 0
22510 G12
20
10
0–40 –30
dBFS
dBc
–10
60
70
80
INPUT LEVEL (dBFS)
–50
SFDR (dBc AND dBFS)
60
80
100
–10
22510 G13
40
20
50
70
90
30
10
0–40 –30 –20 0
dBFS
dBc
SAMPLE RATE (Msps)
0
IVDD (mA)
130
140
80
22510 G14
120
110
125
135
145
115
105
100
95
20 40 60 100 140120
2V RANGE
1V RANGE
SAMPLE RATE (Msps)
0
I
OVDD
(mA)
7
60
22510 G15
4
2
20 40 80
1
0
8
6
5
3
100 120 140
LTC2251: SNR vs SENSE,
fIN = 5MHz, –1dB
SENSE PIN (V)
0.4
SNR (dBFS)
61.6
0.7
22510 G31
61.0
60.6
0.5 0.6 0.8
60.4
60.2
61.8
61.4
61.2
60.8
0.9 1 1.1
LTC2251/LTC2250
8
22510fa
TYPICAL PERFOR A CE CHARACTERISTICS
UW
LTC2250: 8192 Point FFT,
fIN = 30MHz, –1dB, 2V Range,
105Msps
LTC2250: 8192 Point FFT,
fIN = 70MHz, –1dB, 2V Range,
105Msps
LTC2250: 8192 Point FFT,
fIN = 140MHz, –1dB, 2V Range,
105Msps
LTC2250: 8192 Point 2-Tone FFT,
fIN = 28.2MHz and 26.8MHz,
–1dB, 2V Range, 105Msps
LTC2250: SNR vs Input Frequency,
–1dB, 2V Range, 105Msps
FREQUENCY (MHz)
AMPLITUDE (dB)
22510 G19
0 1020304050
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
LTC2250: 8192 Point FFT,
fIN = 5MHz, –1dB, 2V Range,
105Msps
FREQUENCY (MHz)
AMPLITUDE (dB)
22510 G18
0 1020304050
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
LTC2250: Grounded Input
Histogram, 105Msps
FREQUENCY (MHz)
AMPLITUDE (dB)
22510 G20
0 1020304050
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
AMPLITUDE (dB)
22510 G21
0 1020304050
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
FREQUENCY (MHz)
AMPLITUDE (dB)
22510 G22
0 1020304050
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
CODE
70000
60000
50000
40000
30000
20000
10000
0511
65528
512
22510 G23
510
0
0
COUNT
INPUT FREQUENCY (MHz)
0
55
SNR (dBFS)
56
58
59
60
65
62
100 200 250
22510 G24
57
63
64
61
50 150 300 350
LTC2250: Typical INL,
2V Range, 105Msps
LTC2250: Typical DNL,
2V Range, 105Msps
CODE
0
INL ERROR (LSB)
768
22510 G16
256 512 1024
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
CODE
0
DNL ERROR (LSB)
768
22510 G17
256 512 1024
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1.0
LTC2251/LTC2250
9
22510fa
LTC2250: IOVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB,
OVDD = 1.8V
LTC2250: IVDD vs Sample Rate,
5MHz Sine Wave Input, –1dB
TYPICAL PERFOR A CE CHARACTERISTICS
UW
LTC2250: SFDR vs Input Level,
fIN = 70MHz, 2V Range, 105Msps
LTC2250: SNR vs Input Level,
fIN = 70MHz, 2V Range, 105Msps
INPUT LEVEL (dBFS)
–50
SNR (dBc AND dBFS)
30
40
50
–20 0
22510 G27
20
10
0–40 –30
dBFS
dBc
–10
60
70
80
INPUT LEVEL (dBFS)
–50
SFDR (dBc AND dBFS)
60
80
100
–10
22510 G28
40
20
50
70
90
30
10
0–40 –30 –20 0
dBFS
dBc
SAMPLE RATE (Msps)
0
80
75
I
VDD
(mA)
85
95
100
105
80
22510 G29
90
40
20 100
60 120
110
115
120
2V RANGE
1V RANGE
SAMPLE RATE (Msps)
0
7
6
5
4
3
2
1
060 100
22510 G30
20 40 80 120
I
OVDD
(mA)
LTC2250: SNR vs SENSE,
fIN = 5MHz, –1dB
SENSE PIN (V)
0.4
SNR (dBFS)
61.6
0.7
22510 G32
61.0
60.6
0.5 0.6 0.8
60.4
60.2
61.8
61.4
61.2
60.8
0.9 1 1.1
LTC2250: SFDR vs Input Frequency,
–1dB, 2V Range, 105Msps
LTC2250: SNR and SFDR vs
Sample Rate, 2V Range,
fIN = 5MHz, –1dB
INPUT FREQUENCY (MHz)
0
SFDR (dBFS)
85
90
95
150 250
55210 G25
80
75
50 100 200 300 350
70
65
SAMPLE RATE (Msps)
0
50
SNR AND SFDR (dBFS)
60
70
80
90
20 40 60 80
22510 G26
100 120 140
SFDR
SNR
LTC2251/LTC2250
10
22510fa
UU
U
PI FU CTIO S
A
IN
+ (Pin 1): Positive Differential Analog Input.
A
IN
- (Pin 2): Negative Differential Analog Input.
REFH (Pins 3, 4): ADC High Reference. Short together and
bypass to pins 5, 6 with a 0.1µF ceramic chip capacitor as
close to the pin as possible. Also bypass to pins 5, 6 with
an additional 2.2µF ceramic chip capacitor and to ground
with a 1µF ceramic chip capacitor.
REFL (Pins 5, 6): ADC Low Reference. Short together and
bypass to pins 3, 4 with a 0.1µF ceramic chip capacitor as
close to the pin as possible. Also bypass to pins 3, 4 with
an additional 2.2µF ceramic chip capacitor and to ground
with a 1µF ceramic chip capacitor.
V
DD
(Pins 7, 32): 3V Supply. Bypass to GND with 0.1µF
ceramic chip capacitors.
GND (Pin 8): ADC Power Ground.
CLK (Pin 9): Clock Input. The input sample starts on the
positive edge.
SHDN (Pin 10): Shutdown Mode Selection Pin. Connect-
ing SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to V
DD
results in normal operation with the
outputs at high impedance. Connecting SHDN to V
DD
and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to V
DD
and OE to V
DD
results in sleep mode with the outputs at high impedance.
OE (Pin 11): Output Enable Pin. Refer to SHDN pin
function.
NC (Pins 12, 13, 14, 15): Do Not Connect These Pins.
D0-D9 (Pins 16, 17, 18, 19, 22, 23, 24, 25, 26, 27):
Digital Outputs. D9 is the MSB.
OGND (Pin 20): Output Driver Ground.
OV
DD
(Pin 21): Positive Supply for the Output Drivers.
Bypass to ground with 0.1µF ceramic chip capacitor. OV
DD
can be set from 0.5V to 3.6V.
OF (Pin 28): Over/Under Flow Output. High when an over
or under flow has occurred.
MODE (Pin 29): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to GND selects
offset binary output format and turns the clock duty cycle
stabilizer off. 1/3 V
DD
selects offset binary output format
and turns the clock duty cycle stabilizer on. 2/3 V
DD
selects
2’s complement output format and turns the clock duty
cycle stabilizer on. V
DD
selects 2’s complement output
format and turns the clock duty cycle stabilizer off.
SENSE (Pin 30): Reference Programming Pin. Connecting
SENSE to V
CM
selects the internal reference and a ±0.5V
input range. V
DD
selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±V
SENSE
. ±1V is the largest valid input range.
V
CM
(Pin 31): 1.5V Output and Input Common Mode Bias.
Bypass to ground with 2.2µF ceramic chip capacitor.
GND (Exposed Pad) (Pin 33): ADC Power Ground. The
exposed pad on the bottom of the package must be
soldered to ground.
LTC2251/LTC2250
11
22510fa
FUNCTIONAL BLOCK DIAGRA
UU
W
Figure 1. Functional Block Diagram
TI I G DIAGRA
UWW
t
AP
N + 1
N + 2 N + 4
N + 3 N + 5
N
ANALOG
INPUT
t
H
t
D
t
L
N – 4 N – 3 N – 2 N – 1
CLK
D0-D9, OF
22510 TD01
N – 5 N
SHIFT REGISTER
AND CORRECTION
DIFF
REF
AMP
REF
BUF
2.2µF
1µF1µF
0.1µF
INTERNAL CLOCK SIGNALSREFH REFL
CLOCK/DUTY
CYCLE
CONTROL
RANGE
SELECT
1.5V
REFERENCE
FIRST PIPELINED
ADC STAGE
FIFTH PIPELINED
ADC STAGE
SIXTH PIPELINED
ADC STAGE
FOURTH PIPELINED
ADC STAGE
SECOND PIPELINED
ADC STAGE
REFH REFL
CLK OEMODE
OGND
OV
DD
22510 F01
INPUT
S/H
SENSE
V
CM
A
IN–
A
IN+
2.2µF
THIRD PIPELINED
ADC STAGE
OUTPUT
DRIVERS
CONTROL
LOGIC
SHDN
OF
D9
D0
•
•
•
LTC2251/LTC2250
12
22510fa
DYNAMIC PERFORMANCE
Signal-to-Noise Plus Distortion Ratio
The signal-to-noise plus distortion ratio [S/(N + D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band limited
to frequencies above DC to below half the sampling
frequency.
Signal-to-Noise Ratio
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC.
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum of all
harmonics of the input signal to the fundamental itself. The
out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency. THD is
expressed as:
THD = 20Log (√(V2
2
+ V3
2
+ V4
2
+ . . . Vn
2
)/V1)
where V1 is the RMS amplitude of the fundamental fre-
quency and V2 through Vn are the amplitudes of the
second through nth harmonics. The THD calculated in this
data sheet uses all the harmonics up to the fifth.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused by
the presence of another sinusoidal input at a different
frequency.
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer func-
tion can create distortion products at the sum and differ-
ence frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3,
etc. The 3rd order intermodulation products are 2fa + fb,
2fb + fa, 2fa – fb and 2fb – fa. The intermodulation
APPLICATIO S I FOR ATIO
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distortion is defined as the ratio of the RMS value of either
input tone to the RMS value of the largest 3rd order
intermodulation product.
Spurious Free Dynamic Range (SFDR)
Spurious free dynamic range is the peak harmonic or
spurious noise that is the largest spectral component
excluding the input signal and DC. This value is expressed
in decibels relative to the RMS value of a full scale input
signal.
Input Bandwidth
The input bandwidth is that input frequency at which the
amplitude of the reconstructed fundamental is reduced by
3dB for a full scale input signal.
Aperture Delay Time
The time from when CLK reaches mid-supply to the instant
that the input signal is held by the sample and hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion to
conversion. This random variation will result in noise
when sampling an AC input. The signal to noise ratio due
to the jitter alone will be:
SNR
JITTER
= –20log (2π • f
IN
• t
JITTER
)
CONVERTER OPERATION
As shown in Figure 1, the LTC2251/LTC2250 is a CMOS
pipelined multistep converter. The converter has six
pipelined ADC stages; a sampled analog input will result in
a digitized value five cycles later (see the Timing Diagram
section). For optimal AC performance the analog inputs
should be driven differentially. For cost sensitive applica-
tions, the analog inputs can be driven single-ended with
slightly worse harmonic distortion. The CLK input is
single-ended. The LTC2251/LTC2250 has two phases of
operation, determined by the state of the CLK input pin.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage residue amplifier.
In operation, the ADC quantizes the input to the stage and
LTC2251/LTC2250
13
22510fa
the quantized value is subtracted from the input by the
DAC to produce a residue. The residue is amplified and
output by the residue amplifier. Successive stages operate
out of phase so that when the odd stages are outputting
their residue, the even stages are acquiring that residue
and vice versa.
When CLK is low, the analog input is sampled differentially
directly onto the input sample-and-hold capacitors, inside
the “Input S/H” shown in the block diagram. At the instant
that CLK transitions from low to high, the sampled input is
held. While CLK is high, the held input voltage is buffered
by the S/H amplifier which drives the first pipelined ADC
stage. The first stage acquires the output of the S/H during
this high phase of CLK. When CLK goes back low, the first
stage produces its residue which is acquired by the
second stage. At the same time, the input S/H goes back
to acquiring the analog input. When CLK goes back high,
the second stage produces its residue which is acquired
by the third stage. An identical process is repeated for the
third, fourth and fifth stages, resulting in a fifth stage
residue that is sent to the sixth stage ADC for final
evaluation.
Each ADC stage following the first has additional range to
accommodate flash and amplifier offset errors. Results
from all of the ADC stages are digitally synchronized such
that the results can be properly combined in the correction
logic before being sent to the output buffer.
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC2251/
LTC2250 CMOS differential sample-and-hold. The analog
inputs are connected to the sampling capacitors (C
SAMPLE
)
through NMOS transistors. The capacitors shown
attached to each input (C
PARASITIC
) are the summation of
all other capacitance associated with each input.
During the sample phase when CLK is low, the transistors
connect the analog inputs to the sampling capacitors and
they charge to and track the differential input voltage.
When CLK transitions from low to high, the sampled input
voltage is held on the sampling capacitors. During the hold
phase when CLK is high, the sampling capacitors are
disconnected from the input and the held voltage is passed
to the ADC core for processing. As CLK transitions from
high to low, the inputs are reconnected to the sampling
capacitors to acquire a new sample. Since the sampling
capacitors still hold the previous sample, a charging glitch
proportional to the change in voltage between samples will
be seen at this time. If the change between the last sample
and the new sample is small, the charging glitch seen at
the input will be small. If the input change is large, such as
the change seen with input frequencies near Nyquist, then
a larger charging glitch will be seen.
Single-Ended Input
For cost sensitive applications, the analog inputs can be
driven single-ended. With a single-ended input the har-
monic distortion and INL will degrade, but the SNR and
DNL will remain unchanged. For a single-ended input, A
IN+
should be driven with the input signal and A
IN–
should be
connected to 1.5V or V
CM
.
Common Mode Bias
For optimal performance the analog inputs should be
driven differentially. Each input should swing ±0.5V for
the 2V range or ±0.25V for the 1V range, around a
common mode voltage of 1.5V. The V
CM
output pin (Pin
31) may be used to provide the common mode bias level.
APPLICATIO S I FOR ATIO
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Figure 2. Equivalent Input Circuit
V
DD
V
DD
V
DD
15Ω
15Ω
C
PARASITIC
1pF
C
PARASITIC
1pF
C
SAMPLE
3.5pF
C
SAMPLE
3.5pF
LTC2251/LTC2250
A
IN
+
A
IN
–
CLK
22510 F02
LTC2251/LTC2250
14
22510fa
V
CM
can be tied directly to the center tap of a transformer
to set the DC input level or as a reference level to an op amp
differential driver circuit. The V
CM
pin must be bypassed to
ground close to the ADC with a 2.2µF or greater capacitor.
Input Drive Impedance
As with all high performance, high speed ADCs, the
dynamic performance of the LTC2251/LTC2250 can be
influenced by the input drive circuitry, particularly the
second and third harmonics. Source impedance and reac-
tance can influence SFDR. At the falling edge of CLK, the
sample-and-hold circuit will connect the 3.5pF sampling
capacitor to the input pin and start the sampling period.
The sampling period ends when CLK rises, holding the
sampled input on the sampling capacitor. Ideally the input
circuitry should be fast enough to fully charge
the sampling capacitor during the sampling period
1/(2F
ENCODE
); however, this is not always possible and the
incomplete settling may degrade the SFDR. The sampling
glitch has been designed to be as linear as possible to
minimize the effects of incomplete settling.
For the best performance, it is recommended to have a
source impedance of 100Ω or less for each input. The
source impedance should be matched for the differential
inputs. Poor matching will result in higher even order
harmonics, especially the second.
Input Drive Circuits
Figure 3 shows the LTC2251/LTC2250 being driven by an
RF transformer with a center tapped secondary. The
secondary center tap is DC biased with V
CM
, setting the
ADC input signal at its optimum DC level. Terminating on
the transformer secondary is desirable, as this provides a
common mode path for charging glitches caused by the
sample and hold. Figure 3 shows a 1:1 turns ratio trans-
former. Other turns ratios can be used if the source
impedance seen by the ADC does not exceed 100Ω for
each ADC input. A disadvantage of using a transformer is
the loss of low frequency response. Most small RF trans-
formers have poor performance at frequencies below
1MHz.
Figure 4 demonstrates the use of a differential amplifier to
convert a single ended input signal into a differential input
signal. The advantage of this method is that it provides low
APPLICATIO S I FOR ATIO
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frequency input response; however, the limited gain band-
width of most op amps will limit the SFDR at high input
frequencies.
Figure 5 shows a single-ended input circuit. The imped-
ance seen by the analog inputs should be matched. This
circuit is not recommended if low distortion is required.
The 25Ω resistors and 12pF capacitor on the analog inputs
serve two purposes: isolating the drive circuitry from the
Figure 3. Single-Ended to Differential
Conversion Using a Transformer
25Ω
25Ω
25Ω
25Ω
0.1µF
A
IN+
A
IN–
12pF
2.2µF
V
CM
LTC2251/
LTC2250
ANALOG
INPUT
0.1µFT1
1:1
T1 = MA/COM ETC1-1T
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
22510 F03
Figure 4. Differential Drive with an Amplifier
25Ω
25Ω
12pF
2.2µF
VCM
22510 F04
––
++
CM
ANALOG
INPUT
HIGH SPEED
DIFFERENTIAL
AMPLIFIER AIN+
AIN–
LTC2251/
LTC2250
Figure 5. Single-Ended Drive
25Ω
0.1µF
ANALOG
INPUT
VCM
AIN
+
AIN
–
1k
12pF
22510 F05
2.2µF
1k
25Ω
0.1µF
LTC2251/
LTC2250
LTC2251/LTC2250
15
22510fa
APPLICATIO S I FOR ATIO
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sample-and-hold charging glitches and limiting the
wideband noise at the converter input.
For input frequencies above 70MHz, the input circuits of
Figure 6, 7 and 8 are recommended. The balun transformer
gives better high frequency response than a flux coupled
center tapped transformer. The coupling capacitors allow
the analog inputs to be DC biased at 1.5V. In Figure 8, the
series inductors are impedance matching elements that
maximize the ADC bandwidth.
Reference Operation
Figure 9 shows the LTC2251/LTC2250 reference circuitry
consisting of a 1.5V bandgap reference, a difference am-
plifier and switching and control circuit. The internal volt-
age reference can be configured for two pin selectable input
ranges of 2V (±1V differential) or 1V (±0.5V differential).
Tying the SENSE pin to V
DD
selects the 2V range; tying the
SENSE pin to V
CM
selects the 1V range.
Figure 6. Recommended Front End Circuit for
Input Frequencies Between 70MHz and 170MHz
25Ω
25Ω12Ω
12Ω
0.1µF
A
IN+
A
IN–
8pF
2.2µF
V
CM
ANALOG
INPUT
0.1µF
0.1µF
T1
T1 = MA/COM, ETC 1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
22510 F06
LTC2251/
LTC2250
Figure 8. Recommended Front End Circuit for
Input Frequencies Above 300MHz
25Ω
25Ω
0.1µF
A
IN+
A
IN–
2.2µF
V
CM
ANALOG
INPUT
0.1µF
0.1µF
T1
T1 = MA/COM, ETC 1-1-13
RESISTORS, CAPACITORS, INDUCTORS
ARE 0402 PACKAGE SIZE
22510 F08
8.2nH
8.2nH
LTC2251/
LTC2250
Figure 7. Recommended Front End Circuit for
Input Frequencies Between 170MHz and 300MHz
25Ω
25Ω
0.1µF
A
IN+
A
IN–
2.2µF
V
CM
ANALOG
INPUT
0.1µF
0.1µF
T1
T1 = MA/COM, ETC 1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
22510 F07
LTC2251/
LTC2250
The 1.5V bandgap reference serves two functions: its
output provides a DC bias point for setting the common
mode voltage of any external input circuitry; additionally,
the reference is used with a difference amplifier to gener-
ate the differential reference levels needed by the internal
ADC circuitry. An external bypass capacitor is required for
the 1.5V reference output, V
CM
. This provides a high
frequency low impedance path to ground for internal and
external circuitry.
V
CM
REFH
SENSE
TIE TO V
DD
FOR 2V RANGE;
TIE TO V
CM
FOR 1V RANGE;
RANGE = 2 • V
SENSE
FOR
0.5V < V
SENSE
< 1V
1.5V
REFL
2.2µF
2.2µF
INTERNAL ADC
HIGH REFERENCE
BUFFER
0.1µF
22510 F09
4Ω
DIFF AMP
1µF
1µF
INTERNAL ADC
LOW REFERENCE
1.5V BANDGAP
REFERENCE
1V 0.5V
RANGE
DETECT
AND
CONTROL
LTC2251/LTC2250
Figure 9. Equivalent Reference Circuit
LTC2251/LTC2250
16
22510fa
APPLICATIO S I FOR ATIO
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The difference amplifier generates the high and low refer-
ence for the ADC. High speed switching circuits are
connected to these outputs and they must be externally
bypassed. Each output has two pins. The multiple output
pins are needed to reduce package inductance. Bypass
capacitors must be connected as shown in Figure 9.
Other voltage ranges in-between the pin selectable ranges
can be programmed with two external resistors as shown
in Figure 10. An external reference can be used by applying
its output directly or through a resistor divider to SENSE.
It is not recommended to drive the SENSE pin with a logic
device. The SENSE pin should be tied to the appropriate
level as close to the converter as possible. If the SENSE pin
is driven externally, it should be bypassed to ground as
close to the device as possible with a 1µF ceramic capacitor.
VCM
SENSE
1.5V
0.75V
2.2µF
12k
1µF
12k
22510 F10
LTC2251/
LTC2250
Figure 10. 1.5V Range ADC
In applications where jitter is critical, such as when digitiz-
ing high input frequencies, use as large an amplitude as
possible. Also, if the ADC is clocked with a sinusoidal
signal, filter the CLK signal to reduce wideband noise and
distortion products generated by the source.
Figures 12 and 13 show alternatives for converting a
differential clock to the single-ended CLK input. The use of
Input Range
The input range can be set based on the application. The
2V input range will provide the best signal-to-noise perfor-
mance while maintaining excellent SFDR. The 1V input
range will have better SFDR performance, but the SNR will
degrade by 0.9dB.
Driving the Clock Input
The CLK input can be driven directly with a CMOS or TTL
level signal. A sinusoidal clock can also be used along with
a low-jitter squaring circuit before the CLK pin (see
Figure 11).
The noise performance of the LTC2251/LTC2250 can
depend on the clock signal quality as much as on the
analog input. Any noise present on the clock signal will
result in additional aperture jitter that will be RMS summed
with the inherent ADC aperture jitter.
Figure 11. Sinusoidal Single-Ended CLK Drive
CLK
50Ω
0.1µF
0.1µF
4.7µF
1k
1k
FERRITE
BEAD
CLEAN
SUPPLY
SINUSOIDAL
CLOCK
INPUT
22510 F11
NC7SVU04
LTC2251/
LTC2250
CLK
100Ω
0.1µF
4.7µF
FERRITE
BEAD
CLEAN
SUPPLY
IF LVDS USE FIN1002 OR FIN1018.
FOR PECL, USE AZ1000ELT21 OR SIMILAR
22510 F12
LTC2251/
LTC2250
CLK
5pF-30pF
ETC1-1T
0.1µF
VCM
FERRITE
BEAD
DIFFERENTIAL
CLOCK
INPUT
22510 F13
LTC2251/
LTC2250
Figure 12. CLK Drive Using an LVDS or PECL to CMOS Converter
Figure 13. LVDS or PECL CLK Drive Using a Transformer
LTC2251/LTC2250
17
22510fa
a transformer provides no incremental contribution to
phase noise. The LVDS or PECL to CMOS translators
provide little degradation below 70MHz, but at 140MHz
will degrade the SNR compared to the transformer solu-
tion. The nature of the received signals also has a large
bearing on how much SNR degradation will be experi-
enced. For high crest factor signals such as WCDMA or
OFDM, where the nominal power level must be at least 6dB
to 8dB below full scale, the use of these translators will
have a lesser impact.
The transformer shown in the example may be terminated
with the appropriate termination for the signaling in use.
The use of a transformer with a 1:4 impedance ratio may
be desirable in cases where lower voltage differential
signals are considered. The center tap may be bypassed to
ground through a capacitor close to the ADC if the differ-
ential signals originate on a different plane. The use of a
capacitor at the input may result in peaking, and depend-
ing on transmission line length may require a 10Ω to 20Ω
ohm series resistor to act as both a low pass filter for high
frequency noise that may be induced into the clock line by
neighboring digital signals, as well as a damping mecha-
nism for reflections.
Maximum and Minimum Conversion Rates
The maximum conversion rate for the LTC2251/LTC2250
is 125Msps (LTC2251) and 105Msps (LTC2250). The
lower limit of the LTC2251/LTC2250 sample rate is deter-
mined by droop of the sample-and-hold circuits. The
pipelined architecture of this ADC relies on storing analog
signals on small valued capacitors. Junction leakage will
discharge the capacitors. The specified minimum
operating frequency for the LTC2251/LTC2250 is 1Msps.
Clock Duty Cycle Stabilizer
An optional clock duty cycle stabilizer circuit ensures high
performance even if the input clock has a non 50% duty
cycle. Using the clock duty cycle stabilizer is recom-
mended for most applications. To use the clock duty cycle
stabilizer, the MODE pin should be connected to 1/3V
DD
or
2/3V
DD
using external resistors.
This circuit uses the rising edge of the CLK pin to sample
the analog input. The falling edge of CLK is ignored and the
APPLICATIO S I FOR ATIO
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internal falling edge is generated by a phase-locked loop.
The input clock duty cycle can vary from 40% to 60% and
the clock duty cycle stabilizer will maintain a constant
50% internal duty cycle. If the clock is turned off for a long
period of time, the duty cycle stabilizer circuit will require
a hundred clock cycles for the PLL to lock onto the input
clock.
For applications where the sample rate needs to be changed
quickly, the clock duty cycle stabilizer can be disabled. If
the duty cycle stabilizer is disabled, care should be taken
to make the sampling clock have a 50% (±5%) duty cycle.
DIGITAL OUTPUTS
Table 1 shows the relationship between the analog input
voltage, the digital data bits, and the overflow bit.
Table 1. Output Codes vs Input Voltage
A
IN+
– A
IN–
D9 – D0 D9 – D0
(2V Range) OF (Offset Binary) (2’s Complement)
>+1.000000V 1 11 1111 1111 01 1111 1111
+0.998047V 0 11 1111 1111 01 1111 1111
+0.996094V 0 11 1111 1110 01 1111 1110
+0.001953V 0 10 0000 0001 00 0000 0001
0.000000V 0 10 0000 0000 00 0000 0000
–0.001953V 0 01 1111 1111 11 1111 1111
–0.003906V 0 01 1111 1110 11 1111 1110
–0.998047V 0 00 0000 0001 10 0000 0001
–1.000000V 0 00 0000 0000 10 0000 0000
<–1.000000V 1 00 0000 0000 10 0000 0000
Digital Output Buffers
Figure 14 shows an equivalent circuit for a single output
buffer. Each buffer is powered by OV
DD
and OGND, iso-
lated from the ADC power and ground. The additional
N-channel transistor in the output driver allows operation
down to low voltages. The internal resistor in series with
the output makes the output appear as 50Ω to external
circuitry and may eliminate the need for external damping
resistors.
As with all high speed/high resolution converters, the
digital output loading can affect the performance. The
digital outputs of the LTC2251/LTC2250 should drive a
minimal capacitive load to avoid possible interaction
between the digital outputs and sensitive input circuitry.
LTC2251/LTC2250
18
22510fa
APPLICATIO S I FOR ATIO
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to the same power supply as for the logic being driven. For
example if the converter is driving a DSP powered by a 1.8V
supply, then OV
DD
should be tied to that same 1.8V supply.
OV
DD
can be powered with any voltage from 500mV up to
3.6V. OGND can be powered with any voltage from GND up
to 1V and must be less than OV
DD
. The logic outputs will
swing between OGND and OV
DD
.
Output Enable
The outputs may be disabled with the output enable pin, OE.
OE high disables all data outputs including OF. The data ac-
cess and bus relinquish times are too slow to allow the
outputs to be enabled and disabled during full speed op-
eration. The output Hi-Z state is intended for use during long
periods of inactivity.
Sleep and Nap Modes
The converter may be placed in shutdown or nap modes
to conserve power. Connecting SHDN to GND results in
normal operation. Connecting SHDN to V
DD
and OE to V
DD
results in sleep mode, which powers down all circuitry
including the reference and typically dissipates 1mW. When
exiting sleep mode it will take milliseconds for the output
data to become valid because the reference capacitors have
to recharge and stabilize. Connecting SHDN to V
DD
and OE
to GND results in nap mode, which typically dissipates
15mW. In nap mode, the on-chip reference circuit is kept
on, so that recovery from nap mode is faster than that from
sleep mode, typically taking 100 clock cycles. In both sleep
and nap modes, all digital outputs are disabled and enter
the Hi-Z state.
Grounding and Bypassing
The LTC2251/LTC2250 requires a printed circuit board
with a clean, unbroken ground plane. A multilayer board
with an internal ground plane is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the V
DD
, OV
DD
, V
CM
, REFH, and REFL pins. Bypass capaci-
tors must be located as close to the pins as possible. Of
For full speed operation the capacitive load should be kept
under 10pF.
Lower OV
DD
voltages will also help reduce interference
from the digital outputs.
Data Format
Using the MODE pin, the LTC2251/LTC2250 parallel
digital output can be selected for offset binary or 2’s
complement format. Connecting MODE to GND or
1/3V
DD
selects offset binary output format. Connecting
MODE to 2/3V
DD
or V
DD
selects 2’s complement output
format. An external resistor divider can be used to set the
1/3V
DD
or 2/3V
DD
logic values. Table 2 shows the logic
states for the MODE pin.
Table 2. MODE Pin Function
Clock Duty
MODE Pin Output Format Cycle Stablizer
0 Offset Binary Off
1/3V
DD
Offset Binary On
2/3V
DD
2’s Complement On
V
DD
2’s Complement Off
Figure 14. Digital Output Buffer
22510 F14
OVDD
VDD VDD
0.1µF
43ΩTYPICAL
DATA
OUTPUT
OGND
OVDD 0.5V
TO VDD
PREDRIVER
LOGIC
DATA
FROM
LATCH
OE
LTC2251/LTC2250
Overflow Bit
When OF outputs a logic high the converter is either
overranged or underranged.
Output Driver Power
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OV
DD
, should be tied
LTC2251/LTC2250
19
22510fa
particular importance is the 0.1µF capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2µF
capacitor between REFH and REFL can be somewhat
further away. The traces connecting the pins and bypass
capacitors must be kept short and should be made as wide
as possible.
The LTC2251/LTC2250 differential inputs should run par-
allel and close to each other. The input traces should be as
short as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2251/LTC2250 is
transferred from the die through the bottom-side exposed
pad and package leads onto the printed circuit board. For
good electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
Clock Sources for Undersampling
Undersampling raises the bar on the clock source and the
higher the input frequency, the greater the sensitivity to
clock jitter or phase noise. A clock source that degrades
SNR of a full-scale signal by 1dB at 70MHz will degrade
SNR by 3dB at 140MHz, and 4.5dB at 190MHz.
In cases where absolute clock frequency accuracy is
relatively unimportant and only a single ADC is required,
a 3V canned oscillator from vendors such as Saronix or
Vectron can be placed close to the ADC and simply
connected directly to the ADC. If there is any distance to
the ADC, some source termination to reduce ringing that
may occur even over a fraction of an inch is advisable. You
must not allow the clock to overshoot the supplies or
performance will suffer. Do not filter the clock signal with
APPLICATIO S I FOR ATIO
WUUU
a narrow band filter unless you have a sinusoidal clock
source, as the rise and fall time artifacts present in typical
digital clock signals will be translated into phase noise.
The lowest phase noise oscillators have single-ended
sinusoidal outputs, and for these devices the use of a filter
close to the ADC may be beneficial. This filter should be
close to the ADC to both reduce roundtrip reflection times,
as well as reduce the susceptibility of the traces between
the filter and the ADC. If you are sensitive to close-in phase
noise, the power supply for oscillators and any buffers
must be very stable, or propagation delay variation with
supply will translate into phase noise. Even though these
clock sources may be regarded as digital devices, do not
operate them on a digital supply. If your clock is also used
to drive digital devices such as an FPGA, you should locate
the oscillator, and any clock fan-out devices close to the
ADC, and give the routing to the ADC precedence. The
clock signals to the FPGA should have series termination
at the source to prevent high frequency noise from the
FPGA disturbing the substrate of the clock fan-out device.
If you use an FPGA as a programmable divider, you must
re-time the signal using the original oscillator, and the re-
timing flip-flop as well as the oscillator should be close to
the ADC, and powered with a very quiet supply.
For cases where there are multiple ADCs, or where the
clock source originates some distance away, differential
clock distribution is advisable. This is advisable both from
the perspective of EMI, but also to avoid receiving noise
from digital sources both radiated, as well as propagated
in the waveguides that exist between the layers of multi-
layer PCBs.
The differential pairs must be close together, and dis-
tanced from other signals. The differential pair should be
guarded on both sides with copper distanced at least 3x
the distance between the traces, and grounded with vias
no more than 1/4 inch apart.
LTC2251/LTC2250
20
22510fa
APPLICATIO S I FOR ATIO
WUUU
1
2
C8
0.1µF
C11
0.1µF
3
4
5
VDD
7
VDD
VDD GND
9
32
VCM
31
30
29
33
JP2
OE
10
11
8
C7
2.2µF
C6
1µF
C9
1µF
C4
0.1µF
C2
12pF
VDD
VDD
VDD GND
JP1
SHDN
C15
2.2µFC16
0.1µF
C18
0.1µF
C25
4.7µF
E2
VDD
3V
E4
PWR
GND
VDD VCC
22510 AI01
C17 0.1µF
C20
0.1µF
C19
0.1µF
C14
0.1µF
R10
33Ω
E1
EXT REF
R14
1k
R15
1k
R16
1k
R7
1k
R8
49.9Ω
R3
24.9Ω
R2
24.9Ω
R6
24.9Ω
R1
OPT
R4
24.9Ω
R5
50Ω
T1
ETC1-1T
C1
0.1µF
C3
0.1µF
J3
CLOCK
INPUT
NC7SVU04
NC7SVU04
C13
0.1µF
C10
0.1µF
C5
4.7µF
6.3V
L1
BEAD
VDD
C12
0.1µF
R9
1k
J1
ANALOG
INPUT
AIN+
AIN–
REFH
REFH
6REFL
REFL
VDD
CLK
SHDN
VDD
VCM
SENSE
MODE
GND
LTC2251/
LTC2250
OE
D8
D7
GND
NC
NC
NC
NC
D1
D0
D2
D4
D5
D9
OF
OVDD VCC
OGND
D6
D3
26
25
12
13
14
15
17
16
18
22
23
27
28
21
20
24
19
OE1
I0
OE2
LE1
LE2
VCC
VCC
VCC
GND
GND
GND
I1
I2
I4
I3
I5
I7
I8
I12
I11
I10
I13
I14
I15
I9
O11
O10
I6
VCC
O0
GND
GND
GND
VCC
VCC
GND
34
45
39
42
25
48
24
1
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
VCC
28
74VCX16373MTD
31
21
15
18
10
4
7
RN1C 33Ω
2
3
5
6
8
9
11
12
13
14
16
17
19
20
22
23
GND
O1
O2
O4
O3
O5
O7
O8
O12
O13
O14
O15
O9
O6
25
23
27
29
31
33
35
37
39
21
19
15
17
13
9
7
1
3
5
2
4
11
26
24
30
28
34
32
38
40
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
40
3201S-40G1
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
36
A3
A2
A1
A0
SDA
WP
VCC
1
2
3
4
8
24LC025
7
6
5
SCL
22
20
16
18
14
10
8
6
12
1
2
3
5
••
4
VCM
12
VDD
VDD
34
2/3VDD
56
1/3VDD
78
GND
JP4 MODE
12
VDD
34
VCM
VDD
VCM
56
EXT REF
JP3 SENSE
RN1B 33Ω
RN1A 33Ω
RN2D 33Ω
RN2C 33Ω
RN2B 33Ω
RN2A 33Ω
RN3D 33Ω
RN3C 33Ω
RN3B 33Ω
RN3A 33Ω
RN4D 33Ω
RN4B 33Ω
RN4A 33Ω
R13
10k
R11
10k
R12
10k
RN4C 33Ω
RN1D 33Ω
C28
1µF
C27
0.01µF
VCC
VDD
NC7SV86P5X
BYP
GND
ADJ
OUT
SHDN
GND
IN
1
2
3
4
8
LT1763
7
6
5
GND
R18
100k
R17
105k
C26
10µF
6.3V
E3
GND C21
0.1µF
C22
0.1µF
C23
0.1µF
C24
0.1µF
Evaluation Circuit Schematic
LTC2251/LTC2250
21
22510fa
APPLICATIO S I FOR ATIO
WUUU
Silkscreen Top Topside
Inner Layer 2 GND
LTC2251/LTC2250
22
22510fa
APPLICATIO S I FOR ATIO
WUUU
Inner Layer 3 Power Bottomside
Silkscreen Bottom
LTC2251/LTC2250
23
22510fa
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
PACKAGE DESCRIPTIO
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45 ± 0.10
(4-SIDES)
0.75 ± 0.05 R = 0.115
TYP
0.25 ± 0.05
(UH32) QFN 1004
0.50 BSC
0.200 REF
0.00 – 0.05
0.70 ±0.05
3.45 ±0.05
(4 SIDES)
4.10 ±0.05
5.50 ±0.05
0.25 ± 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
LTC2251/LTC2250
24
22510fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005
LT 0306 • PRINTED IN USA
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