CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 1 OF 14 1005 Series Thin Film Chip Resistor 1. Scope This specification applies to fixed metal film chip resistors rectangular type.High precision and reliability 2. Type Designation RG1005 (1) Where - (3) - (4) N (5) - T* (6) (2) (1) Series No. RG : Fixed metal film chip resistors rectangular type (Reliability type) 1005 : 1.0 x 0.5mm (2) Temperature coefficient of resistanceT.C.R. V : 5ppm/ N : 10ppm/ P : 25ppm/ R : 100ppm/ (3) Resistance value: For example-Three digits of number (E-24 Series) 103 = 10 x103=10k Four digits of number (E-96 Series) 4992 = 499x102 =49.9k (4) Resistance tolerance: P = 0.02% W = 0.05% B = 0.1% C = 0.25% D = 0.5% (5) N=Sn plating (Lead free , RoHS Compliant) (6) Quantity in taping T1 : 1,000pcs/reel T5 : 5,000pcs/reel T10 : 10,000pcs/reel Note: however following resistance value in E96 series are appropriated as value of E24 series. 10x10x 11x10x 13x0x 15x10x 20x10x 75x0x CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 2 OF 14 3. Physical Dimensions Code Letter L L a a W t b b Figure 1. Dimensions Dimensions (mm) 1.00 0.05 W 0.5 0.05 t 0.35 0.05 a 0.20 0.10 b 0.25 0.05 Note : Resistive clement Electrode Protective coat Substrate Nickel alloy film plating Sn100%(Lead-Free) Epoxy Resin coating Alumina ceramic 4. Ratings 4-1 Specification Type Temperature coefficient of resistance RG1005 Resistance rang and Ratings (R: Rated resistance) 0.02%(Code:P) 0.05%(Code:W) 0.5%(Code:D) 0.1%(Code:B) 0.25%(Code:C) 5 ppm/(Code:V) 100 R<3k 10 ppm/(Code:N) 100 R<3k 47 R100k 25 ppm/(Code:P) 100 R<3k 47 R100k 100 ppm/(Code:R) 10 R47 4-2 Rated dissipation at 85 1/3W Rated dissipation is based on continuous full load operation at rated ambient temperature of 85. For the resistor operated at ambient temperature in excess of 85, the maximum load shall be derated in accordance with the following curve. Rated dissipation Stability A B Type :1005 0.063W 0.032W Pcrccnt of the ratcd dissipation CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 3 OF 14 100 0 -55 85 155 AMBIENT TEMPERATURE() 4-3 Rated voltage The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression. Where ERated voltage (V) E = RxP RNominal resistance value () PRated dissipation (W) Limiting element voltage: 25V Maximum overload voltage: 50V 4-4 Category temperature range (1) Upper category temperature : (2) Lower category temperature : + 125 -55 5. Marking Type E24 series RG 1005 No marking on the resistor E96 series and Except for the preferred number series No marking on the resistor CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 4 OF 14 6. Performance The test method shall be as specified in IEC 60115-1.or JIS C 5201-1. Standard atmospheric conditions Unless otherwise specified, the standard range of atmospheric conditions for marking measurements tests is as follows; Temperature 5 to 35 Relative humidity 45 to 85%RH Air pressure 86 to 106kPa If there is any doubt about results, measurements shall be made within the following limits; Temperature 20 2 Relative humidity 60 to 70%RH Air pressure 86 to 106kPa 6-1 Electrical Item Conditions Specifications Resistance and tolerance Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.5 Temperature characteristic of resistance Resistance shall be measured under standard atmospheric conditions. When the temperature reaches and is maintained at 100 higher than the temperature of standard atmospheric conditions, resistance shall be measured again. The measurement shall be made after a period of 30 minutes, after each specified temperature is reached. Not exceed the specified tolerance on rated resistance in paragraph 4.1 . (2). Not exceed the specified temperature coefficient of resistance in paragraph 4.1. (3). Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.8 Overload A d.c. or a.c. r.m.s. voltage of 2.5 times the rated voltage shall be applied for 5 sec. For other procedures, Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.13. Change in resistance: Under 47 (0.1%+0.01) 47 and more (0.05%+0.01) Without damage by flash over (spark, arcing), burning or breakdown etc. CYNTEC CO., LTD. Item DOCUMENT : RGA00000N REVISION : A0 PAGE : 5 OF 14 Conditions Specifications (1) Between Electrode Place the specimen on the groove of metal plate so and insulating that the edge of metal block positions almost center enclosure. of both electrodes, with the surface of insulation 100M or more enclosure located downward or upward and (2) Between Electrode pressurize the block by a force or 1.0 0.2N. The test voltage shall be 100 15Vdc, and maintain and base material this voltage for about 1 minute. The insulation 1,000M or more resistance shall then be measured while applying the voltage. Insulation Resistance Insulation plate Measurement Point A on metallic block Measurement Point B on metallic plate R0.25mm~R0.5mm Insulating enclosure surface Spring Specimen Figure 2 : Measurement Setup Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.6 Voltage Proof The specimen shall be tested as Figure 2. The test voltage shall be a voltage of 100V (a.c. r.m.s.) between both electrode. The voltage is gradually increased at a rate of about 100 V/s. from almost 0 V to the specified voltage and maintained as it is for 60 5 seconds, then gradually decreased to almost 0 V. Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.7 Change in resistance: Under 47 (0.1%+0.01) 47 and more (0.05%+0.01) Without damage by flash over (spark, arcing), burning or breakdown etc. CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 6 OF 14 6-2 Mechanical Item Specifications Pressurizing jig:12 in IEC 60115-1(JIS C 5201-1), Sub-clause 4.33. The amount of bend: 3 mm The board A shall be used. For other procedures , Testing board A Specimen Unit : mm Within 2mm Solder Supports 45 45 20 Press Jig R230 50 Refer to IEC 60115-1, Sub-clause 4.33 Amplitude of bend 3mm ( 5) Pressure Substrate bending test Conditions Change in resistance: Under 47 (0.1%+0.01) 47 and more (0.05%+0.01) Without damage by flash over (spark, arcing), burning or breakdown etc. CYNTEC CO., LTD. Item Solderability Resistance to Soldering Heat Conditions Temperature of solder 235 5 (Solder alloy:Sn-37Pb) 245 5 (Solder alloy:Sn-3Ag-0.5Cu) Duration of immersion : 2 0.5 seconds For other procedures, refer to IEC 60115-1, (JIS C 5201-1) Sub-clause 4.17. (1) Solder bath method Pre-heat : 100 to 110 30 seconds Temperature : 270 5 10 1seconds DOCUMENT : RGA00000N REVISION : A0 PAGE : 7 OF 14 Specifications A new uniform coating of 95% of the surface being immersed. Change in resistance: Under 47 (0.1%+0.01) 47 and more (2) Reflow Soldering method (0.05%+0.01) Peak temperature : 260 5 10seconds or less Without damage by flash Temperature : 220 5 60 seconds max. over (spark, arcing), 2cycles or less burning or breakdown The temperature shall be board surface etc. temperature (3) Soldering iron method Bit temperature : 350 5 Time : 3 +1/-0 seconds The specimen shall be stored at standard atmospheric conditions for 1hour after which the measurement shall be made. For other procedures, refer to IEC 60115-1, (JIS C 5201-1)Sub-clause 4.18. Endurance at upper category temperature The specimen shall be placed in test chamber at 155 2 with no load for 1,000 + 48 / - 0 hours. For other procedures, refer to IEC 60115-1, (JIS C 5201-1)Sub-clause 4.25.3. Change in resistance: Under 47 (0.25%+0.05) 47 and more (0.1%+0.01) Without mechanical damage in appearance. CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 8 OF 14 6-3 Endurance Item Rapid change of temperature Endurance (Rated load) Endurance (Temperature Humidity Bias) Conditions The specimen shall be subjected to 3 continuous cycles, each as shown in the figure below. Temperature Time 1 55 3 30 minutes 2 Room temperature 2 3minutes 3 125 2 30 minutes 4 Room temperature 2 3minutes Use for Testing board B For other procedures, refer to IEC 60115-1, (JIS C 5201-1)Sub-clause 4.19 Temperature : 85 2 Stability(*1) Subjected to a voltage cycle A consisting of rated d.c. voltage application of 1 hr 30 min and rest of 30 min repeatedly for 1,000 + 48 / - 0 hours. B However the applied voltage shall not exceed the limited element voltage. Specifications Change in resistance: Under 47 (0.1%+0.01) 47 and more (0.05%+0.01) Without damage by flash over (spark, arcing), burning or breakdown etc. Change in resistance: Under 47 (0.5%+0.05) 47 and more (0.25%+0.05) Under 47 (0.25%+0.05) 47 and more (0.1%+0.01) For other procedures, refer to IEC 60115-1, (JIS C 5201-1)Sub-clause 4.25. Temperature : 85 2 Stability(*1) Humidity: 85 5%RH A Subjected to a voltage cycle consisting of 10% rated d.c. voltage application of 1 hr 30 min and rest of 30 min repeatedly B for 1,000 + 48 / - 0 hours. However the applied voltage shall not exceed the limited element voltage. Without mechanical damage in appearance. For other procedures, refer to IEC 60115-1, (JIS C 5201-1)Sub-clause 4.24. Without mechanical damage in appearance. (*1) : See Para.4.2 Ratings Change in resistance: Under 47 (0.5%+0.05) 47 and more (0.25%+0.05) Under 47 (0.25%+0.05) 47 and more (0.1%+0.01) CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 9 OF 14 Mounting Method (1) Mounting method according to solder bath method Epoxy based adhesive agent shall be applied in the middle of two lands of the test board. The specimen shall be mounted in such a way that the electrode of specimen will be evenly placed in the land area and then adhesive agent shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260 5 for 3 to 5 seconds (2) Mounting method according to reflow soldering method About 100~150 m of Sn-3Ag-0.5Cu solder cream is applied in the land portion of the test boards and the resistor shall be mounted in such a way so that the resistor's electrodes will be evenly placed on the land. It is soldered under the conditions of board surface temperature d 240 5(peak temperature) for 5 to 10 seconds in an upper-portion heated oven. Test Board Test Board A (For substrate banding, adhesion test, see Fig.3) Material :Glass fabric base epoxy resin 1.6mm Copper foil ,thickness 0.035mm, Solder resist coated Solder resist b Land 40 c 4.5 f a 100 Unit : mm (1) Test board A (For substrate bending test) a b c f 0.5 1.6 0.6 (1.5) CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 10 OF 14 (2) Test board B ( For another test ) Material :Glass fabric base epoxy resin 1.6mm Copper foil ,thickness 0.035mm, Solder resist coated a b c f 0.5 1.6 0.6 (5) 25 7.5 5.5 a b f 3.5 3 c 2.5 5.08 5.08 3 58.5 Unit : mm CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 11 OF 14 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions +- 1.5 0.43 0.05 0.1 0.0 4.0 0.1 Sprocket hole 3.5 0.05 A Chip 1.75 0.1 8.0 0.3 B Carrier cavity 4.0 0.1 2.0 0.05 Pull Direction Unit : mm Code letter T a b RG 1005 0.430.05 0.630.05 1.130.05 Pre-emptied holes150 holes (or 30cm) or more. CYNTEC CO., LTD. 7-1-2. Tape packaging dimensions 7-2. Quantity per reel Type Tolerance 0.02% 0.05%,0.1% 0.25%,0.5% Code RG 1005 T1 1,000 pcs T1 1,000 pcs T5 5,000 pcs T5 - T10 10000 pcs DOCUMENT : RGA00000N REVISION : A0 PAGE : 12 OF 14 CYNTEC CO., LTD. 7-3. DOCUMENT : RGA00000N REVISION : A0 PAGE : 13 OF 14 Label Making The label indicated following items shall be marked on single side of the reel. (1) Type designation . (2) Quantity (3) (4) (5) (6) Manufacturing date code Manufacturer's name The country of origin Shipping number 8. Precautions in use 8-1 Storage (1) The product shall be stored in a room temperature and humidity must be controlled. ( temperature 5 to 35, humidity 45 to 85%RH ) (2) The product shall be stored as direct sunshine doesn't hit on it. (3) The product shall be stored with no moisture, dust, a material that will make Solder ability inferior, and a harmful gas (hydrogen chloride, sulfurous acid gas, and hydrogen sulfide). (4) Resistor shall be stored with keeping the minimum package unit with uncivilized sealed ( Keep the state of the taping). 8-2 Time limit to storage (1) The storage time limit of the product is reckoned on the day when product was shipped by our company and made within one year. (2) Confirm solder ability beforehand when you use the one that the time limit was passed. 8-3 Chip mounting (1) When chip are mounted on the PC board, the protective coat of the product must not be scratched. If it will be scratched, it will make characteristic inferior. (2) In case that product will be soldered by soldering iron, heating shall be done on the land, and soldering iron must not hit in the product itself. (3) In case that resin coating or resin seal will be made for a PC board after chip mounting, do washing and drying it enough before coating or sealing. If ion bear or moisture will be sealed in resin coating, it will make characteristic inferior. For resinous use, it is necessary to set up enough the curing conditions. As it gets improper for the condition, changes of a resistance value are large and are a case. (4) According to shape, material, and pressure of clamping in chip mounting machine, there is the case that crack will be appeared on the product. Control a shock energy for clamping the product under 7 x 10-4 J With a shock energy around clamping that says here, it is suited to a potential energy, in case that iron block of 25g is dropped naturally to the product placed on iron plate for the height of 2.8mm. (5) The glue to fix the product on the PC board around chip mounting, it is needed high insulation resistance and great performance or moisture. And it is needed that these characteristic are not inferior in using temperature range and a hot spot temperature to be acting. CYNTEC CO., LTD. DOCUMENT : RGA00000N REVISION : A0 PAGE : 14 OF 14 8-4.Using and Handling (1) Use under the special environment Performance and reliability are fully researched in advance, and it must be confirmed when a use part under the special environment is used with the special environment .There is the following thing in the special environment. 1Water, salt water, oil, the inside of acid, alkali, the liquid such as an organic solvent or the place where it reaches it 2The place where direct sunlight hits it, an exposure in the open air, the inside of the dust 3The condensation 4The place where harmful gas(in such cases as the sea breeze,HCl,Cl2,SO2,NH3,NOX) is abundant. Water or ion quality sometimes reaches even a body and an electrode by the protection material of the resistor being eroded gradually under the above environment. Then investigation confirmation is necessary because resistance value may change due to the chemical reaction such as electrolysis. (2) Use under the high temperature environment When components are used under the high temperature environment, load electric power must be reduced based on the reduction curve prescribed in every kind. (3) Investigate the performance and reliability enough when using under harsh environment. (4) Protect the edge and protection coat of resistors from mechanical stress. (5) Handle with care when PC board is divided or fixed on support body, because bending of PC board after chip mounting will make mechanical stress for resistors. (6) Resistors shall be used with in rated range shown in specification. Especially. If voltage more than specified value will be loaded to resistor, there is a case it will make damage for machine because of temperature rise depending on generation of heat, and increase value or breaks. (7) In case that resistors is loaded voltage, it is necessary to confirm temperature of resistor and to reduce a load power according to load reduction curve, because a temperature rise of a resistor depends on influence of heat from mounting density and neighboring element. (8) Observe Limiting element voltage and maximum overload voltage specified in each specification. (9) If there is a possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, If is necessary that operating condition shall be set up before use, because performance of thin film resistor is affected by a large shock voltage.