CM150DX-24A
Dual IGBTMOD™ NX-Series Module
150 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272
3Rev. 3/09
Electrical and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Inverter Sector
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector Cutoff Current ICES V
CE = VCES, VGE = 0V — — 1.0 mA
Gate-Emitter Threshold Voltage VGE(th) I
C = 15mA, VCE = 10V 6 7 8 Volts
Gate Leakage Current IGES V
GE = VGES, VCE = 0V — — 0.5 µA
Collector-Emitter Saturation Voltage VCE(sat) IC = 150A, VGE = 15V, Tj = 25°C*5 — 2.0 2.6 Volts
I
C = 150A, VGE = 15V, Tj = 125°C*5 — 2.2 — Volts
IC = 150A, VGE = 15V, Chip — 1.9 — Volts
Input Capacitance Cies — — 23.0 nF
Output Capacitance Coes V
CE = 10V, VGE = 0V — — 2.0 nF
Reverse Transfer Capacitance Cres — — 0.45 nF
Total Gate Charge QG V
CC = 600V, IC = 150A, VGE = 15V — 675 — nC
Inductive Turn-on Delay Time td(on) — — 130 ns
Load Turn-on Rise Time tr V
CC = 600V, IC = 150A, — — 100 ns
Switch Turn-off Delay Time td(off) V
GE = ±15V, — — 450 ns
Time Turn-off Fall Time tf R
G = 2.2Ω, IE = 150A, — — 600 ns
Reverse Recovery Time trr*2 Inductive Load Switching Operation — — 150 ns
Reverse Recovery Charge Qrr*2 — 6 — µC
Emitter-Collector Voltage VEC*2 I
E = 150A, VGE = 0V, Tj = 25°C*5 — 2.6 3.4 Volts
I
E = 150A, VGE = 0V, Tj = 125°C*5 — 2.16 — Volts
I
E = 150A, VGE = 0V, Chip — 2.5 — Volts
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Module Lead Resistance Rlead Main Termnals-Chip (Per Switch) — 1.6 — mΩ
Thermal Resistance, Junction to Case** Rth(j-c)Q Per IGBT*1 — — 0.13 °C/W
Thermal Resistance, Junction to Case** Rth(j-c)D Per FWDi*1 — — 0.23 °C/W
Contact Thermal Resistance** Rth(c-f) Case to Heatsink (Per 1 Module) — 0.015 — °C/W
Thermal Grease Applied*1*7
Internal Gate Resistance RGint T
C = 25°C — 0 — Ω
External Gate Resistance RG 2 — 21 Ω
NTC Thermistor Sector, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance RTH T
C = 25°C*1 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R TC = 100°C, R100 = 493Ω*1 –7.3 — +7.8 %
B Constant B(25/50) B = (InR1 – InR2) / (1/T1 – 1/T2)*6 — 3375 — K
Power Dissipation P25 T
C = 25°C*1 — — 10 mW
**Thermal resistance values are per 1 element.
*1 Case temperature (TC) and heatsink temperature (Tf) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 IE, IEM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*6 R1: Resistance at Absolute Temperature T1(K), R2: Resistance at Absolute Temperature T2(K), T(K) = T(°C) + 273.15
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].