MOC3051 / MOC3052 DESCRIPTION The MOC3051 and MOC3052 are optically coupled isolators consisting of a Gallium Arsenide infrared emitting diode coupled with a light activated silicon bilateral switch performing the functions of a triac. These photocouplers provide random phase control of high current triacs or thyristors. The MOC3051 and MOC3052 feature greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads. These devices are mounted in a standard 6 pin dual-in-line package. 1 Anode 2 Cathode 3 NC 4 Main Terminal 5 Substrate (Do not Connect) 6 Main Terminal FEATURES * * * * * * High Repetitive Peak Off-state Voltage VDRM : minimum 600V High Critical Rate of Rise of Off-state Voltage dv/dt : minimum 1000V/s ) High Isolation Voltage between Input and Output Viso : 5000Vrms Lead Free and RoHS Compliant UL File No. E91231 VDE File No. 40028086 APPLICATIONS * * * * * * * * Solenoid / Valve Controls Lamp Ballasts Static AC Power Switch lnterfacing Microprocessors to 115 and 240Vac Peripherals Solid State Relays Incandescent Lamp Dimmers Temperature Controls Motor Controls ORDER INFORMATION * * * * Add Suffix "X" for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail : sales@isocom.co.uk http://www.isocom.com 1 09/10/2017 ABSOLUTE MAXIMUM RATINGS (TA = 25C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Reverse Voltage Power dissipation 50mA 6V 100mW Output Peak Repetitive Surge Current 1A (Pulse width = 1ms, 120pps) Off State Output Terminal Voltage 600V Power Dissipation 300mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) 5000VRMS 330mW -40 to 100 C -55 to 150 C 260C ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel : +852 2995 9217 Fax : +852 8161 6292 e-mail : sales@isocom.com.hk DD93210 MOC3051 / MOC3052 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified) INPUT Parameter Symbol Test Condition Forward Voltage VF Reverse Current Min Typ. Max Unit IF = 20mA 1.2 1.5 V IR VR = 6V 0.05 10 A Symbol Test Condition Typ. Max Unit IDRM VDRM = 600V IF = 0mA 100 nA 3.0 V OUTPUT Parameter Peak Off-state Current Either Direction Min Note 1 On-State Voltage Either Direction VTM ITM = 100mA (peak) Critical Rate of Rise of Off-State Voltage dv/dt IF = 0mA 1000 Symbol Test Condition Min IFT VTM = 3V V/s COUPLED Parameter Input Trigger Current Either Direction Holding Current Either Direction Typ. Max Unit mA Note 2 MOC3051 15 MOC3052 10 A 200 IH ISOLATION Parameter Insulation Voltage Symbol Test Condition Min VISO AC 1 minute, RH 40 to 60% 5000 Typ. Max Unit VRMS Note 3 Note 1 : Test Voltage must be applied within static dv/dt rating. Note 2 : Guaranteed to trigger at an IF value less than or equal to max IFT, recommended IF lies between Rated IFT to Absolute Max IF. Note 3 : Measured with input leads shorted together and output leads shorted together. 2 09/10/2017 DD93210 MOC3051 / MOC3052 Fig 1 Forward Current vs Ambient Temperature Fig 2 On-State Current vs Ambient Temperature Fig 3 On-State Voltage vs Ambient Temperature Fig 4 On-State Current vs On-State Voltage Fig 5 Minimum Trigger Current vs Ambient Temperature Fig 6 Holding Current vs Ambient Temperature 3 09/10/2017 DD93210 MOC3051 / MOC3052 Fig 7 Forward Current vs Forward Voltage 4 09/10/2017 Fig 8 Repetitive Peak Off-State Current vs Ambient Temperature DD93210 MOC3051 / MOC3052 ORDER INFORMATION MOC3051 / MOC3052 (UL Approval) PN After PN Description Packing quantity None MOC3051, MOC3052 Standard DIP6 65 pcs per tube G MOC3051G, MOC3052G 10mm Lead Spacing 65 pcs per tube SM MOC3051SM, MOC3052SM Surface Mount 65 pcs per tube SMT&R MOC3051SMT&R, MOC3052SMT&R Surface Mount Tape & Reel 1000 pcs per reel MOC3051X / MOC3052X (UL Approval and VDE Approvals) PN After PN Description Packing quantity None MOC3051X, MOC3052X Standard DIP6 65 pcs per tube G MOC3051XG, MOC3052XG 10mm Lead Spacing 65 pcs per tube SM MOC3051XSM, MOC3052XSM Surface Mount 65 pcs per tube SMT&R MOC3051XSMT&R, MOC3052XSMT&R Surface Mount Tape & Reel 1000 pcs per reel DEVICE MARKING Example : MOC3052 MOC3052 I YWW MOC3052 denotes Device Part Number I denotes Isocom Y denotes 1 digit Year code WW denotes 2 digit Week code 5 09/10/2017 DD93210 MOC3051 / MOC3052 PACKAGE DIMENSIONS in mm (inch) DIP G Form SMD 6 09/10/2017 DD93210 MOC3051 / MOC3052 RECOMMENDED PAD LAYOUT FOR SMD (mm) TAPE AND REEL PACKAGING Symbol Dimension mm (inch) Tape Width W 16 0.3 (0.63) Pitch of Sprocket Holes P0 4 0.1 (0.15) F 7.5 0.1 (0.295) P2 2 0.1 (0.079) P1 12 0.1 (0.472) Description Distance of Compartment to Sprocket Holes Distance of Compartment to Compartment 7 09/10/2017 DD93210 MOC3051 / MOC3052 IR REFLOW SOLDERING TEMPERATURE PROFILE Note : One Time Reflow Soldering is Recommended. Do Not Immerse Device Body in Solder Paste. TP 260C TP - 5C Max Ramp Up Rate 3C/s TEMP (C) TL Tsmax Tsmin tP Max Ramp Down Rate 6C/s 217C TL 200C 150C ts Preheat 60s - 120s 25C TIME (s) Time 25C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150C 200C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5C of Actual Peak Temperature (TP 5C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260C 10s max 217C 30s max 60s - 100s 3C/s max 6C/s max Average Ramp Up Rate (Tsmax to TP) 3C/s max Time 25C to Peak Temperature 8 minutes max 8 09/10/2017 DD93210 DISCLAIMER Isocom Components is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Isocom Components products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such Isocom Components products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that Isocom Components products are used within specified operating ranges as set forth in the most recent Isocom Components products specifications. The Isocom Components products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Isocom Components products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc... Unintended Usage of Isocom Components products listed in this document shall be made at the customer's own risk. Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by Isocom Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of Isocom Components or others. The information contained herein is subject to change without notice. 9 09/10/2017 DD93210