T6817
Preliminary Information
Rev. A2, 10-Jul-01 1 (14)
Dual Triple DMOS Output Driver with Serial Input Control
Description
The T6817 is a fully protected driver interface designed
in 0.8-µm BCDMOS technology. It is used to control up
to 6 different loads by a microcontroller in automotive
and industrial applications.
Each of the 3 high-side and 3 Low-side drivers is capable
to drive currents up to 600 mA. The drivers are freely con-
figurable and can be controlled separately from a standard
serial data interface. Therefore, all kinds of loads such as
bulbs, resistors, capacitors and inductors can be com-
bined. The IC design especially supports the applications
of H-bridges to drive DC motors.
Protection is guaranteed in terms of short-circuit condi-
tions, overtemperature, under- and overvoltage. Various
diagnosis functions and a very low quiescent current in
standby mode open a wide range of applications. Auto-
motive qualification referring to conducted interferences,
EMC protection and 2 kV ESD protection gives added
value and enhanced quality for the exacting requirements
of automotive applications.
Features
DThree high-side and three low-side drivers
DOutputs freely configurable as switch, half bridge or
H-bridge
DCapable to switch all kinds of loads such as DC
motors, bulbs, resistors, capacitors and inductors
D0.6 A continuous current per switch
DLow-side: RDSon < 1.5 vs. total temperature range
DHigh-side: RDSon < 2.0 vs. total temperature range
DVery low quiescent current Is < 20 µA in standby
mode
DOutputs short-circuit protected
DOvertemperature prewarning and protection
DUndervoltage and overvoltage protection
DVarious diagnosis functions such as s h o r t e d o u t p u t ,
o p e n l o a d, overtemperature and power supply fail
DSerial data interface
DDaisy chaining possible
DLoss of ground protection
DSSO20 package
Ordering Information
Extended Type Number Package Remarks
T6817-FP SSO20 Power package
T6817
Rev. A2, 10-Jul-01
Preliminary Information
2 (14)
Block Diagram
HS1HS2HS3
DI
CLK
INH
DO
CS
OV
protection
UV
protection
VS
VSVcc
Serial interface
Input Register
Output Register
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
S
I
S
T
CO
L
Dn.
u.
P
S
F
I
N
H
S
C
D
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
T
P
Fault
Detect
Fault
Detect Fault
Detect Fault
Detect
GND
GND
GND
GND
Vs
Fault
Detect Fault
Detect
LS1LS2LS3
Vs
Vcc
Thermal
protection
Osc
Control
logic
Vcc
P ower-on
Reset
n.
u. n.
u. n.
u. n.
u. n.
u.
n.
u. n.
u. n.
u. n.
u. n.
u. n.
u.
2
4
3
5
18
12 14 16
815 17
13
1
10
11
19
6
7
GND
20
Figure 1. Block diagram
T6817
Preliminary Information
Rev. A2, 10-Jul-01 3 (14)
Pin Description
1234567810
9
19 18 17 16 1415 13 12 1120
CLK INH VS VS LS3 n.c.
DI CS
LS1 HS1 LS2 HS2 GND HS3VCC DO
GND
GND
GND
GND
T6817
Leadframe
Figure 2. Pinning
Pin Description
Pin Symbol Function
1 GND Ground; reference potential; internal connection to Pin 10, 1 1, 13 and 20; cooling tab
2 DI Serial data input; 5-V CMOS logic level input with internal pull-down; receives serial data from the
control device, DI expects a 16-bit control word with LSB being transferred first
3 CS Chip-select input; 5-V CMOS logic level input with internal pull-up;
low = serial communication is enabled, high = disabled
4 CLK Serial clock input; 5-V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2 MHz)
5 INH Inhibit input; 5-V logic input with internal pull-down; low = standby,
high = normal operating
6, 7 VS Power supply output stages HS1, HS2 and HS3
8 LS3 Low-side driver output 3; power-MOS open drain with internal reverse diode: overvoltage protection by
active zenering; short-circuit protection; diagnosis for short and open load
9 n.c. Not connected
10 GND Ground, see Pin 1
11 GND Ground, see Pin 1
12 HS3 High-side driver output 3; power-MOS open drain with internal reverse diode: overvoltage protection by
active zenering; short-circuit protection; diagnosis for short and open load
13 GND Ground, see Pin 1
14 HS2 High-side driver output 2; see Pin 12
15 LS2 Low-side driver output 2; see Pin 8
16 HS1 High-side driver output 1; see Pin 12
17 LS1 Low-side driver output 1; see Pin 8
18 DO Serial data output; 5-V CMOS logic level tristate output for output (status) register data; sends 16-bit sta-
tus information to the mC (LSB is transferred first); output will remain tristated unless device is selected by
CS = low, therefore, several ICs can operate on one data output line only.
19 VCC Logic supply voltage (5 V)
20 GND Ground, see Pin 1
T6817
Rev. A2, 10-Jul-01
Preliminary Information
4 (14)
Functional Description
Serial Interface
SRR LS1 HS1 LS2 HS2 LS3 HS3 n.u. n.u. n.u. n.u. n.u. n.u. OLD SCT SI
CS
DI
CLK
DO TP SLS1 SHS1 SLS2 SHS2 SLS3 SHS3 n.u. n.u. n.u. n.u. n.u. n.u. SCD INH PSF
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Figure 3 . Data transfer
Data transfer starts with the falling edge of the CS signal.
Data must appear at DI synchronized to CLK and are
accepted on the falling edge of the CLK signal. LSB
(bit 0, SRR) has to be transferred first. Execution of new
input data is enabled on the rising edge of the CS signal.
When CS is high, Pin DO is in tristate condition. This
output is enabled on the falling edge of CS. Output data
will change their state with the rising edge of CLK and
stay stable until the next rising edge of CLK appears. L S B
(bit 0, TP) is transferred first.
Input Data Protocol
Bit Input Register Function
0 SRR Status register reset (high = reset; the bits PSF, SCD and overtemperature shutdown in the
output data register are set to low)
1 LS1 Controls output LS1 (high = switch output LS1 on)
2 HS1 Controls output HS1 (high = switch output HS1 on)
3 LS2 See LS1
4 HS2 See HS1
5 LS3 See LS1
6 HS3 See HS1
7 n.u. Not used
8 n.u. Not used
9 n.u. Not used
10 n.u. Not used
11 n.u. Not used
12 n.u. Not used
13 OLD Open load detection (low = on)
14 SCT Programmable time delay for short circuit and overvoltage shutdown (short circuit shutdown
delay high / low = 100 ms / 12.5 ms, overvoltage shutdown delay high / low = 14 ms / 3.5 ms
15 SI Software inhibit; low = standby, high = normal operation
(data transfer is not af fected by standby function because the digitalpart is still powered)
After power-on reset, the input register has the following status:
T6817
Preliminary Information
Rev. A2, 10-Jul-01 5 (14)
Bit 15
(SI) Bit 14
(SCT) Bit 13
(OLD) Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6
(HS3) Bit 5
(LS3) Bit 4
(HS2) Bit 3
(LS2) Bit 2
(HS1) Bit 1
(LS1) Bit 0
(SRR)
H H H n.u. n.u. n.u. n.u. n.u. n.u. L L L L L L L
Output Data Protocol
Bit Output (Status) Register Function
0 TP Temperature prewarning: high = warning (overtemperature shut down see remark below)
1Status LS1 Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load (correct load condition is detected
if the corresponding output is switched off)
2Status HS1 Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load (correct load condition is detected
if the corresponding output is switched off)
3Status LS2 Description see LS1
4Status HS2 Description see HS1
5Status LS3 Description see LS1
6Status HS3 Description see HS1
7 n.u. Not used
8 n.u. Not used
9 n.u. Not used
10 n.u. Not used
11 n.u. Not used
12 n.u. Not used
13 SCD Short circuit detected: set high, when at least one output is switched off by a short circuit
condition
14 INH Inhibit: this bit is controlled by software (bit SI in input register) and hardware inhibit
(Pin 17). High = standby, low = normal operation
15 PSF Power supply fail: over- or undervoltage at Pin VS detected
Remark: Bit 0 to 15 = high: overtemperature shutdown
Power Supply Fail
In case of over- or undervoltage at Pin VS, an internal
timer is started. When the over- or undervoltage delay
time (tdOV/tdUV) programmed by the SCT bit is reached,
the power supply fail bit (PSF) in the output register is set
and all outputs are disabled. When normal voltage is pres-
ent again the outputs are enabled immediately. The PSF
bit remains high until it is reset by the SRR bit in the input
register.
Open-Load Detection
If the open-load detection bit (OLD) is set to low, a
pull-up current for each high-side switch and a pull-down
current for each low-side switch is turned on (open-load
detection current IHS1–3, ILS1–3). If VVS–VHS1–3 or
VLS1–3 is lower than the open-load detection threshold
(open-load condition), the corresponding bit of the output
in the output register is set to high. Switching on an output
stage with OLD bit set to low disables the open-load
function for this output. If bit SI is set to low, the open-
load function is also switched off.
Overtemperature Protection
If the junction temperature exceeds the thermal
prewarning threshold, TjPW set, the temperature
prewarning bit (TP) in the output register is set. When the
temperature falls below the thermal prewarning
threshold, TjPW reset, the bit TP is reset. The TP bit can be
read without transferring a complete 16-bit data word:
with CS = high to low, the state of TP appears at Pin DO.
After the mC has read this information, CS is set high and
the data transfer is interrupted without affecting the state
of input and output registers.
If the junction temperature exceeds the thermal shutdown
threshold, Tj switch off, the outputs are disabled and all bits
in the output register are set high. The outputs can be
enabled again when the temperature falls below the
thermal shutdown threshold, Tj switch on, and when a high
has been written to the SRR bit in the input register.
T6817
Rev. A2, 10-Jul-01
Preliminary Information
6 (14)
Thermal prewarning and shutdown threshold have
hysteresis.
Short-Circuit Protection
The output currents are limited by a current regulator.
Current limitation takes place when the overcurrent
limitation and shutdown threshold (IHS13, ILS13) are
reached. Simultaneously, an internal timer is started. The
shorted output is disabled when during a permanent short
the delay time (tdSd) programmed by the short-circuit
timer bit (SCT) is reached. Additionally, the short-circuit
detection bit (SCD) is set. If the temperature prewarning
bit TP in the output register is set during a short, the
shorted output is disabled immediately and SCD bit is set.
By writing a high to the SRR bit in the input register, the
SCD bit is reset and the disabled outputs are enabled.
Inhibit
There are two ways to inhibit the T6817:
1. Set bit SI in the input register to zero
2. Switch Pin 5 (INH) to 0 V
In both cases, all output stages are turned off but the serial
interface stays active. The output stages can be activated
again by bit SI = 1 and by Pin 5 (INH) switched back to
5 V.
Absolute Maximum Ratings
All values refer to GND pins
Parameters Symbol Value Unit
Supply voltage Pins 6, 7 VVS 0.3 to 40 V
Supply voltage tt0.5 s; ISu2 A Pins 6, 7 VVS 1 V
Supply voltage difference |VS_Pin6 VS_Pin7|DVVS 150 mV
Supply current Pins 6, 7 IVS 1.4 A
Supply current t < 200 ms Pins 6,7 IVS 2.6 A
Logic supply voltage Pin 19 VVCC 0.3 to 7 V
Input voltage Pin 5 VINH 0.3 to 17 V
Logic input voltage Pins 2 to 4 VDI, VCS, VCLK 0.3 to VVCC + 0.3 V
Logic output voltage Pin 18 VDO 0.3 to VVCC + 0.3 V
Input current Pins 5, 2 to 4 IINH, IDI, ICS, ICLK 10 to +10 mA
Output current Pin 18 IDO 10 to +10 mA
Output current Pins 8, 12, 14 to 17 ILS1 to ILS3
IHS1 to IHS3
Internal limited, see
output specification
Reverse conducting current Pins 12, 14, 16,
(tPulse = 150 ms) towards Pins 6, 7 IHS1 to IHS3 17 A
Junction temperature range Tj40 to 150 °C
Storage temperature range TSTG 55 to 150 °C
Operating Range
All values refer to GND pins
Parameters Test Conditions /
Pins Symbol Min. Typ. Max. Unit
Supply voltage Pins 6, 7 VVS VUV 1) 40 2) V
Logic supply voltage Pin 19 VVCC 4.5 5 5.5 V
Logic input voltage Pin 2 to 4 and 5 VINH, VDI, VCLK, VCS 0.3 VVCC V
Serial interface clock frequency Pin 4 fCLK 2 MHz
Junction temperature range Tj40 150 °C
1) Threshold for undervoltage detection 2) Outputs disabled for VVS > VOV (threshold for overvoltage detection)
T6817
Preliminary Information
Rev. A2, 10-Jul-01 7 (14)
Thermal Resistance
All values refer to GND pins
Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit
Junction pin Measured to GND
Pins 1, 10, 11, 13 and 20 RthJP 25 K/W
Junction ambient RthJA 65 K/W
Noise and Surge Immunity
Parameters Test Conditions Value
Conducted interferences ISO 7637-1 Level 4 1)
Interference Suppression VDE 0879 Part 2 Level 5
ESD (Human Body Model) ESD STM 5.1 1998 2 kV
ESD (Machine Model) JEDEC EIA / JESD 22 A115-A 150 V
1) Test pulse 5: VSmax = 40 V
Electrical Characteristics
7.5 V < VVS < VOV; 4.5 V < VVCC < 5.5 V; INH = High; 40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit
Current Consumption
Quiescent current (VS) VVSt16 V, INH or
bit SI = low Pins 6, 7 IVS 40 mA
Quiescent current (VCC) 4.5 VtVVCC t5.5 V,
INH or bit SI = low Pin 19 IVCC 20 mA
Supply current (VS) VVSt16 V normal operat-
ing, all output stages off,
Pins 6, 7
IVS 0.8 1.2 mA
Supply current (VS) VVS < 16 V normal operat-
ing, all output stages on, no
load Pins 6, 7
IVS 10 mA
Supply current (VCC) 4.5 V < VVCC < 5.5 V,
normal operating Pin 19 IVCC 150 mA
Internal Oscillator Frequency
Frequency (time-base for delay
timers) fOSC 19 45 kHz
Over- and Undervoltage Detection, Power-On Reset
Power-on reset threshold Pin 19 VVCC 3.4 3.9 4.4 V
Power-on reset delay time After switching on VVCC tdPor 30 95 160 ms
Undervoltage detection thresh-
old Pins 6, 7 VUV 5.5 7.0 V
T6817
Rev. A2, 10-Jul-01
Preliminary Information
8 (14)
Electrical Characteristics (continued)
7.5 V < VVS < VOV; 4.5 V < VVCC < 5.5 V; INH = High; 40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
UnitMax.Typ.Min.SymbolTest Conditions / PinsParameters
Undervoltage detection hyste-
resis Pins 6, 7 DVUV 0.4 V
Undervoltage detection delay tdUV 7 21 ms
Overvoltage detection threshold Pins 6, 7 VOV 18.0 22.5 V
Overvoltage detection hysteresis Pins 6, 7 DVOV 1 V
Overvoltage detection delay Input register
bit 14 (SCT) = high
bit 14 (SCT) = low tdOV
tdOV
7
1.75 21
5.25 ms
ms
Thermal Prewarning and Shutdown
Thermal prewarning TjPWset 125 145 165 °C
Thermal prewarning TjPWreset 105 125 145 °C
Thermal prewarning hysteresis DTjPW 3 20 K
Thermal shutdown Tj switch off 150 170 190 °C
Thermal shutdown Tj switch on 130 150 170 °C
Thermal shutdown hysteresis DTj switch 3 20 K
Ratio thermal shutdown / ther-
mal prewarning Tj switch off/
TjPW set 1.05 1.17
Ratio thermal shutdown / ther-
mal prewarning Tj switch on/
TjPW reset 1.05 1.2
Output Specification (LS1 LS3, HS1 HS3) 7.5 V < VVS < VOV
On resistance IOut = 600 mA
Pins 8, 15 and 17 RDS OnL 1.5 W
On resistance IOut = 600 mA
Pins 12, 14 and 16 RDS OnH 2.0 W
Output clamping voltage ILS13 = 50 mA
Pins 8, 15 and 17 VLS1340 60 V
Output leakage current VLS1-3 = 40 V
all output stages off
Pins 8, 15 and 17 ILS1-3 10 mA
Output leakage current VHS13 = 0 V
all output stages off
Pins 12, 14 and 16 IHS1-3 10 mA
Inductive shutdown energy Pins 8, 12, 14 to 17 Woutx 15 mJ
Output voltage edge steepness Pins 8, 12, 14 to 17 dVLS1-3/dt
dVHS1-3/dt 50 200 400 mV/ms
Overcurrent limitation and shut-
down threshold Pins 8, 15 and 17 ILS1-3 650 950 1250 mA
T6817
Preliminary Information
Rev. A2, 10-Jul-01 9 (14)
Electrical Characteristics (continued)
7.5 V < VVS < VOV; 4.5 V < VVCC < 5.5 V; INH = High; 40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
UnitMax.Typ.Min.SymbolTest Conditions / PinsParameters
Overcurrent limitation and shut-
down threshold Pins 12, 14 and 16 IHS1-3 1250 950 650 mA
Overcurrent shutdown delay
time Input register
bit 14 (SCT) = high
bit 14 (SCT) = low tdSd
tdSd
70
8.75 100
12.5 140
17.5 ms
ms
Open load detection current Input register bit 13 (OLD)
=low, output off
Pins 8, 15 and 17
ILS1-3 60 200 mA
Open load detection current Input register bit 13 (OLD)
=low, output off
Pins 12, 14 and 16
IHS1-3 150 30 mA
Open load detection current ra-
tio ILS1-3 /
IHS1-3
1.2
Open load detection threshold Input register bit 13 (OLD)
=low, output off
Pins 8, 15 and 17
VLS1-3 0.6 4 V
Open load detection threshold Input register bit 13 (OLD)
=low, output off
Pins 12, 14 and 16
VVS-
VHS1-3
0.6 4 V
Output Switch on delay 1) RLoad = 1 kWtdon 0.5 ms
Output Switch off delay 1) RLoad = 1 kWtdoff 1 ms
Inhibit Input
Input voltage low level thresh-
old Pin 5 VIL 0.3
VVCC
V
Input voltage high level thresh-
old Pin 5 VIH 0.7
VVCC
V
Hysteresis of input voltage Pin 5 VI100 700 mV
Pull-down current VINH = VVCC Pin 5 IPD 10 80 mA
Serial Interface Logic Inputs DI, CLK, CS
Input voltage low level thresh-
old Pins 24VIL 0.3
VVCC
V
Input voltage high level thresh-
old Pins 24VIH 0.7
VVCC
V
Hysteresis of input voltage Pins 24VI50 500 mV
Pull-down current Pin DI, CLK VDI, VCLK = VVCC
Pins 2 and 4 IPDSI 2 50 mA
Pull-up current Pin CS VCS= 0 V Pin 3 IPUSI 50 2mA
1) Delay time between rising edge of CS after data transmision and switch on/off output stages to 90% of final level
T6817
Rev. A2, 10-Jul-01
Preliminary Information
10 (14)
Electrical Characteristics (continued)
7.5 V < VVS < VOV; 4.5 V < VVCC < 5.5 V; INH = High; 40°C < Tj < 150°C; unless otherwise specified,
all values refer to GND pins.
Parameter Test Conditions / Pins Symbol Min. Typ. Max. Unit
Serial Interface Logic Output DO
Output voltage low level IOL = 3 mA Pin 18 VDOL 0.5 V
Output voltage high level IOL = 2 mA Pin 18 VDOH VVCC1V V
Leakage current
(tristate) VCS = VVCC, 0 VtVDOtVVCC
Pin 18 IDO 10 10 mA
Parameters Test
Conditions Timing
Chart No. Symbol Min. Typ. Max. Unit
Serial Interface timing
DO enable after CS falling edge CDO = 100 pF 1 tENDO 200 ns
DO disable after CS rising edge CDO = 100 pF 2 tDISDO 200 ns
DO fall time CDO = 100 pF tDOf 100 ns
DO rise time CDO = 100 pF tDOr 100 ns
DO valid time CDO = 100 pF 10 tDOVal 200 ns
CS setup time 4 tCSSethl 225 ns
CS setup time 8 tCSSetlh 225 ns
CS high time Input register
Bit 14 (SCT) =
high
9 tCSh 140 ms
CS high time Input register
Bit 14 (SCT) =
low
9 tCSh 17.5 ms
CLK high time 5 tCLKh 225 ns
CLK low time 6 tCLKl 225 ns
CLK period time tCLKp 500 ns
CLK setup time 7 tCLKSethl 225 ns
CLK setup time 3 tCLKSetlh 225 ns
DI setup time 11 tDIset 40 ns
DI hold time 12 tDIHold 40 ns
T6817
Preliminary Information
Rev. A2, 10-Jul-01 11 (14)
CS
DO
1 2
CS
CLK
4
5
6
7
9
83
DI
CLK
DO
10 12
11
Inputs DI, CLK, CS: High level = 0.7 × VCC, Low level = 0.3 × VCC
Output DO: High level = 0.8 × VCC, Low level = 0.2 × VCC
Figure 4. Serial interface timing diagram with chart numbers
T6817
Rev. A2, 10-Jul-01
Preliminary Information
12 (14)
Application Circuit
V
BATT
13V
U5021M
WATCHDOG
Vcc
Vcc
Reset
Trigger
Enable
Vcc
5V
Vcc
++
BYT41D
Vs
+
HS1HS2HS3
DI
CLK
INH
DO
CS
OV
protection
UV
protection
VS
VS Vcc
Serial interface
Input Register
Output Register
H
S
3L
S
3H
S
2L
S
2H
S
1L
S
1S
R
R
S
IS
T
CO
L
Dn.
u.
P
S
FI
N
HS
C
DH
S
3L
S
3H
S
2L
S
2H
S
1L
S
1T
P
Fault
Detect
Fault
Detect Fault
Detect Fault
Detect
GND
GND
GND
GND
Vs
Fault
Detect Fault
Detect
LS1LS2LS3
Vs
Vcc
Thermal
protection
Osc
Control
logic
Vcc
P ower-on
Reset
n.
u. n.
u. n.
u. n.
u. n.
u.
n.
u. n.
u. n.
u. n.
u. n.
u. n.
u.
2
4
3
5
18
12 14 16
81517
13
1
10
11
19
6
7
GND
20
mC
Figure 5. Application circuit
Application Notes
It is strongly recommended to connect the blocking
capacitors at V CC and VS as close as possible to the power
supply and GND pins.
Recommended value for capacitors at VS:
electrolythic capacitor C > 22 µF in parallel with a
ceramic capacitor C = 100 nF. Value for electrolytic
capacitor depends on external loads, conducted interfer-
ences and reverse conducting current IHSX (see: Absolut
Maximum Ratings).
Recommended value for capacitors at VCC:
electrolythic capacitor C > 10 µF in parallel with a
ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended to place
cooling areas on the PCB as close as possible to GND
pins.
T6817
Preliminary Information
Rev. A2, 10-Jul-01 13 (14)
Package Information
technical drawings
according to DIN
specifications
Package SSO20
Dimensions in mm 6.75
6.50
0.25
0.65 5.85
1.30
0.15
0.05
5.7
5.3
4.5
4.3
6.6
6.3
0.15
20 11
110
T6817
Rev. A2, 10-Jul-01
Preliminary Information
14 (14)
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