Heatsink
For isolated power
modules
P 3
Features
   
    
!"# $ %
%    &
%  ' 
()  ( %'
*   + , -.$-/./
% )  () 
01'
 ) 3 4 "'' "''
%'  1% ' , , -.$-/./
 35 35 0%
-3$/ $/ /66 //5 /78 $
- /- 6/5 /8
-39/ $ $/ /-: 6/5 /-$ -
- /-7 9/5 /$
7 /-- $//5 //9
- /
- /9
-3-// - - //98 6-
Dimensions in mm
- %    ; 87 0%3
Dimensions in mm
-  11
P 3
1 17-03-2005 ADR © by SEMIKRON
Fig.3a Total thermal resistance vs. length Fig.3b Total thermal resistance vs. length
Fig.6 Total thermal resistance versus length Fig.7 Total thermal resistance vs.air velocity
Fig.8 Pressure drop vs air flow, and associated fan SKF3 Fig.10 Total transient thermal impedance vs.time
P 3
2 17-03-2005 ADR © by SEMIKRON
Dimensions in mm
<1 = % '0 -39/     %( ' ' )%
Dimensions in mm
$<1 = % !"#   %( *7 1%
P 3
3 17-03-2005 ADR © by SEMIKRON