PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) 5962-8670405PA 5962-8670405XA 5962-8670406PA 5962-8670406XA Pins Package Eco Plan (2) Qty Package Type Package Drawing ACTIVE CDIP JG 8 1 TBD ACTIVE LCCC FK 20 1 TBD ACTIVE CDIP JG 8 1 TBD ACTIVE LCCC FK 20 1 TBD 5962-8670407PA ACTIVE CDIP JG 8 1 TBD 5962-8670407XA ACTIVE LCCC FK 20 1 TBD 5962-8670408PA ACTIVE CDIP JG 8 1 TBD 5962-8670408XA ACTIVE LCCC FK 20 1 TBD Lead/Ball Finish A42 MSL Peak Temp (3) N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type UC1842AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1842AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1842AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1843AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1843AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1843AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type UC1844AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1844AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1844AL883B ACTIVE LCCC FK 20 1 TBD UC1845AJ ACTIVE CDIP JG 8 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type A42 N / A for Pkg Type UC1845AJ883B ACTIVE CDIP JG 8 1 TBD UC1845AL883B ACTIVE LCCC FK 20 1 TBD UC2842AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2842ADW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2842AJ OBSOLETE CDIP JG 8 UC2842AN ACTIVE PDIP P 8 50 50 Addendum-Page 1 POST-PLATE N / A for Pkg Type TBD Call TI Green (RoHS & CU NIPDAU Call TI N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2842ANG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2843AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2843AJ OBSOLETE CDIP JG 8 UC2843AN ACTIVE PDIP P 8 UC2843ANG4 ACTIVE PDIP P UC2843AQ ACTIVE PLCC UC2843AQG3 ACTIVE UC2844AD Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 50 TBD Call TI 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AN ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2844ANG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2844AQD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AQD8 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM 50 Addendum-Page 2 Call TI PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC2844AQD8R ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2844AQDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC2845ADW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2845ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2845AN ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2845ANG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3842AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3842ADW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3842AN ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 50 50 Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 Orderable Device Status (1) Package Type Package Drawing UC3842ANG4 ACTIVE PDIP P Pins Package Eco Plan (2) Qty 8 50 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU N / A for Pkg Type N / A for Pkg Type UC3842J ACTIVE CDIP JG 8 1 TBD A42 UC3843AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3843ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3843AN ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3843ANG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3844AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844ADG4 ACTIVE SOIC D 14 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844ADTR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3844AN ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3844ANG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3845AD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845AD8 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM UC3845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 50 Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UC3845AD8TRG4 ACTIVE SOIC D 8 UC3845ADG4 ACTIVE SOIC D 14 UC3845ADTR ACTIVE SOIC D UC3845ADTRG4 ACTIVE SOIC UC3845AN ACTIVE UC3845ANG4 ACTIVE 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 50 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A, UC3845A : UC3842, UC3845AM * Catalog: UC2843A-Q1 * Automotive: Product: UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP * Enhanced * Space: UC1842A-SP, UC1843A-SP, UC1844A-SP, UC1845A-SP NOTE: Qualified Version Definitions: - TI's standard catalog product * Catalog - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Automotive * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 5 PACKAGE OPTION ADDENDUM www.ti.com 29-Oct-2009 * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 6 PACKAGE MATERIALS INFORMATION www.ti.com 4-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing UC2842AD8TR SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) D 8 2500 330.0 12.4 6.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 5.2 2.1 8.0 12.0 Q1 UC2842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC2842ADWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC2843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC2843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC2844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC2844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC2845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC2845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC3842AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC3842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC3843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC3843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC3844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC3844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 UC3845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC3845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2842AD8TR SOIC UC2842ADTR SOIC D 8 2500 340.5 338.1 20.6 D 14 2500 333.2 345.9 28.6 UC2842ADWTR UC2843AD8TR SOIC DW 16 2000 346.0 346.0 33.0 SOIC D 8 2500 340.5 338.1 20.6 UC2843ADTR SOIC D 14 2500 333.2 345.9 28.6 UC2844AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC2844ADTR SOIC D 14 2500 333.2 345.9 28.6 UC2845AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC2845ADTR SOIC D 14 2500 333.2 345.9 28.6 UC3842AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC3842ADTR SOIC D 14 2500 333.2 345.9 28.6 UC3843AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC3843ADTR SOIC D 14 2500 333.2 345.9 28.6 UC3844AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC3844ADTR SOIC D 14 2500 333.2 345.9 28.6 UC3845AD8TR SOIC D 8 2500 340.5 338.1 20.6 UC3845ADTR SOIC D 14 2500 333.2 345.9 28.6 Pack Materials-Page 2 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPLC004A - OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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