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EYSGCNZXX, EYSGCNZWY
Bluetooth ® low energy Module
Bluetooth® 4.2 low energy
EYSGCNZXX (16kB RAM)
EYSGCNZWY (32kB RAM)
Data Report
The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of
such marks by TAIYO YUDEN CO., LTD. is under license.
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Document constituent list
Control name
Control No.
Document Page
General Items
HD-AG-A150046
1/5 - 5/5
Absolute maximum ratings
HD-AM-A150046
1/1
Electrical characteristics
HD-AE-A150046
1/8 - 8/8
Circuit schematic
HD-MC-A150046
1/3 - 3/3
Outline / Appearance
HD-AD-A150046
1/3 - 3/3
Pin Layout
HD-BA-A150046
1/2 - 2/2
Handling Precaution
HQ-BA-537
1/2 - 2/2
Packaging Specification
HD-BB-A150046
1/3 - 3/3
Antenna application note
1/3 - 3/3
Design guide
1/1
Notes
1/1
Precautions
HQ-BK-002_02
1/2 - 2/2
Revision History
14-Sep.-2015 > Ver.1.00 Release
21-Dec.-2015 > Ver.1.01 Update
18-Mar.-2016 > Ver.1.1 Update
12-Jul.-2016 > Ver.1.2 Update
09-Aug.-2016 Ver.1.3 Update
06-Feb.-2017 Ver.1.4 Update
25-May-2017 Ver.1.5 Update
30-Jun.-2017 Ver.1.6 Update
25-Sep.-2017 Ver.1.7 Update
11-May -2018 Ver.1.8 Update
27-Feb. -2019 Ver.1.9 Update
27-Feb.2019 Ver.1.9
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EYSGCNZXX, EYSGCNZWY
Control No.
HD-AG-A150046 (1/5)
Control name
General Items
Scope
This specification (“Specification”) applies to the hybrid IC “EYSGCNZXX” and “EYSGCNZWY”, a
Bluetooth® 4.2※ low energy module (“Product”) manufactured by TAIYO YUDEN Co., Ltd. (“TAIYO
YUDEN”)
1. Type: EYSGCN
User Code: EYSGCNZXX (16kB RAM), EYSGCNZWY (32kB RAM)
*User Code may be changed for mass production or other cases.
2. Function:
Radio frequency module. Bluetooth® standard Ver 4.2※ low energy conformity
3. Application: Health & Fitness Equipment, Sensor, Toys
4. Structure:
Hybrid IC loaded with silicon monolithic semiconductor
Compatible with industrial standard reflow profile for Pb-free solders
Can meet with RoHS compliance (Pb, Cd, Hg, Cr+6, PBB, PBDE)
5. Outline: 12.9x 9.6 x 2.0 mm
49-pin Land Grid Array
6. Marking: Part number, Lot number, Japan ID, FCC ID, IC ID
7. Features:
- Small outline by PCB substrate
- Low power consumption
- Integrated antenna
- Integrated system and sleep clock
- Bluetooth® 4.2※ low energy conformity
- Slave or Master Role
8. Packaging:
Packaging method: Tape & reel + aluminum moisture barrier bag
Packaging unit: 1000
*It might be provided as tray at sample stage.
※Supported by S130 SoftDevice
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Control No.
HD-AG-A150046 (2/5)
Control name
General Items
9. Note:
a. Any question arising from this Specification shall be solved through mutual discussion by the
parties hereof.
b. This Product is not designed to be radiation durable and should not be used under the
circumstance of radiation.
c. The operating conditions of this Product are as shown in this Specification. Please note that
TAIYO YUDEN shall not be liable for a failure and/or abnormality which is caused by use under
the conditions other than the operating conditions hereof.
d. The Product mentioned in this Specification is manufactured for use in Health & Fitness
Equipment, Sensor and Toys. Before using this Product in any special equipment (such as
medical equipment, space equipment, air craft, disaster prevention equipment), where higher
safety and reliability are duly required, the applicability and suitability of this Product must be
fully evaluated by the customer at its sole risk to ensure correct and safe operation of these
special equipments. Also, evaluation of the safety function of this Product even for use in
general electronics equipment shall be thoroughly made and when necessary, a protective
circuit shall be added during the design stage, all at the customer’s sole risk.
e. a) You are requested to fully check and confirm by the start of mass production of this Product
that (1) no bug, defect or other failure is included in firmware incorporated in this Product
(“Incorporated Software”), (2) no bug defect or other failure arising from installation of this
Product in which is contained Incorporated Software into your products is included in
Incorporated Software, and that Incorporated Software fully meets your intended use, although
TAIYO YUDEN sufficiently inspects or verifies quality of Incorporated Software.
b) Please note that TAIYO YUDEN is not responsible for any failure arising out of bugs or
defects in Incorporated Software.
f. TAIYO YUDEN warrants only that this Product is in conformity with this Specification for one
year after purchase and shall in no event give any other warranty.
g. Communication between this Product and others might not be established nor maintained
depending on radio environment or operating conditions of this Product and other Bluetooth®
products.
h. In order to test for Radio Law certification with a device incorporating this module, the Host
Software must be able to put the module into test mode. Please contact TAIYO YUDEN for
further details.
i. This Product operates in the unlicensed ISM band at 2.4GHz. In case this Product is used
around the other wireless devices which operate in same frequency band of this Product, there
is a possibility that interference may occur between this Product and such other devices. If
such interference occurs, please stop the operation of other devices or relocate this Product
before using this Product or do not use this Product around the other wireless devices.
j. Please thoroughly evaluate our module with your products before going mass production.
k. User Code Modification Notice.
User Code for sample modules or part numbers in this Specification are TAIYO YUDEN
standard part numbers. When any modification is made to a module to meet requested
specifications, the part number will be changed. Please contact TAIYO YUDEN to confirm
whether your part number needs to be modified.
Please see the following examples for cases when part numbers are modified:
- for specific firmware version (our standard item firmware will be upgraded occasionally)
- for other relevant cases (specific or different setting, form, sizes, or display etc..)
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Control No.
HD-AG-A150046 (3/5)
Control name
General Items
l. Alternative components may used to this module. The intended components is used within the
warranty written in this document (characteristics, size, operating condition, reliability, public
regulation such as radio type approval) and Taiyo Yuden confirmed there are not any
problems with the replacement. The traceability of the components is secured each production
lot.
m. Caution for Export Control
This Product may be subject to governmental approvals, consents, licenses, authorizations,
declarations, filings, and registrations for export or re-export of the Product, required by
Japanese Foreign Exchange and Foreign Trade Law (including related laws and regulations)
and/or any other country’s applicable laws or regulations related to export control.
If you plan to export or re-export this Product, it is strongly recommended that you check and
confirm, the necessary procedures to export or re-export of this Product as required by
applicable laws and regulations, and if necessary, you have to obtain necessary and
appropriate approvals or licenses from governmental authority at your own risk and expense.
n. Japan Regulatory Information
This module is approved with the specific antenna on this module.
a) Please ensure that your product can bear a label with the following information. If the
product is so small that it is not practicable to place the label, please place it in the
instruction manual and package.
This product installs a radio system which has been approved as a radio station in a
low power data communication system based on the Radio Law.
EYSGCN : 001-A06158
o. Canada Regulatory Information
a) This device complies with Industry Canada license-exempt RSS standards. Operation
is subject to the following two conditions: (1) this device may not cause interference,
and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
L'utilisation de ce dispositif est autorisée seulement aux conditions suivantes: (1) il ne
doit pas produire de brouillage et (2) l'utilisateur du dispositif doit être prêt à accepter
tout brouillage radioélectrique reçu, même si ce brouillage est susceptible de
compromettre le fonctionnement du dispositif.
b) This product is certified as type of the portable device with Industry Canada Rules. To
maintain compliance with RF Exposure requirement,please use within specification of
this product.
Ce produit est certifié comme type de l'appareil portable avec Industrie Règles de
Canada. Pour maintenir l'acquiescement avec exigence Exposition de RF, veuillez
utiliser dans spécification de ce produit.
- IC: 4389B-EYSGCN
c) Please notify certified ID by either one of the following method on your product.
Specifiez ID certifiée dans votre produit par une de méthode suivante.
-Contains Transmitter module IC : 4389B-EYSGCN
-Contains IC : 4389B-EYSGCN
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EYSGCNZXX, EYSGCNZWY
Control No.
HD-AG-A150046 (4/5)
Control name
General Items
p. FCC Regulatory Information
a) This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
b) Please notify certified ID by either one of the following method on your product.
-Contains Transmitter Module FCC ID: RYYEYSGCN
-Contains FCC ID: RYYEYSGCN
c) CAUTION: changes or modifications not expressly approved by the party responsible
for compliance could void the use’s authority to operate the equipment.
d) This product is certified as type of the portable device with FCC Rules. To maintain
compliance with RF Exposure requirement, please use within specification of this
product.
e) The antenna used for this transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
q. CE Regulatory Information
a) When your end product installs this module, it is required to proceed additional
certification processes before placing on the market in EU member states to make your
products fully comply with relative EU standards.
b) TAIYO YUDEN can provide you the test reports of conducted measurement portion for
the radio module. You can utilize the test reports for the certification processes of your
end product as it requires radio testing.
r. This Product is designed for use in products which comply with Bluetooth® Specifications.
TAIYO YUDEN disclaims and is not responsible for any liability concerning infringement by
this Product under any intellectual property right owned by third party in case the customer
uses this Product in any product which does not comply with Bluetooth Specifications (the
“non-complying products”). Furthermore, TAIYO YUDEN warrants only that this Product
complies with this Specification and does not grant any other warranty including warranty for
application of the non-complying products.
s. Taiyo Yuden writes firmware for fixed SoftDevice (EYSGCNZXX : S110 V8.0.0,
EYSGCNZWY : S120 V2.1.0) to this product. Customer writes firmware that is match the
customer applications including SoftDevice at the customer's own responsibility.
t. The Electrical Characteristics defined in this Specification are of the module with above
SoftDevice. If other firmware is installed, the characteristics may differ from the defined
value in the Electrical Characteristics. Bluetooth qualification and radio type approval may
become invalid.
u. EYSGCN series module is qualified as PHY only with Component category by Bluetooth SIG.
The QDID of this module is 72109.The final product needs to get qualification as End
product combining with PHY (module), SoftDevice and Profile before selling the product.
The combination of Link and Host layer is differ with SoftDevice. Please refer to following
combination and consult with your qualification body and BQC.
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Control No.
HD-AG-A150046 (5/5)
Control name
General Items
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Control No.
HD-AM-A150046 (1/1)
Control name
Absolute maximum ratings
Absolute maximum ratings
Symbol
Parameter
Min.
Max.
Units
VCC_NRF
-0.3
+3.6
V
GND
0
V
VIO
-0.3
VCC_NRF+ 0.3
V
Storage temperature
-40
+85
Deg-C
MSL
Moisture Sensitivity Level
3
ESD HBM
Human Body Model
1
kV
ESD MM
Machine Model
100
V
Endurance
Flash Memory Endurance
20000
write/erase
cycles
Retention
Flash Memory Retention
10 years
At 40 deg-C
Number of times an
address can be written
between erase cycles
2
times
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Control No.
HD-AE-A150046 (1/8)
Control name
Electrical characteristics
Electrical characteristics
Recommendation operating range
Symbol
Parameter
Min.
Typ.
Max.
Units
VCC_NRF
Supply voltage, normal mode
1.8
3.0
3.6
V
VCC_NRF
Supply voltage, normal mode,
DC/DC converter output voltage 1.9 V
2.1
3.0
3.6
V
tR_VCC_NRF
Supply rise time (0V to 1.8V)*1
100
ms
TA
Operation
temperature
EYSGCNZXX
-40
25
85
Deg-C
EYSGCNZWY
-25
25
85
Deg-C
*1 The on-chip power-on reset circuitry may not function properly for rise times outside the
specified interval. Also after power off, it must start up from below 0.3V. The on-chip power-on
reset circuitry may not function properly.
DC Specifications
The Specification applies for Topr.= 25 degrees C, VCC_NRF = 3.0V
Symbol
Parameter (condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.7 VCC_NRF
VCC_NRF
V
VIL
Input low voltage
GND
0.3 VCC_NRF
V
VOH
Output high voltage (std. drive, 0.5 mA)
VCC_NRF-0.3
VCC_NRF
V
VOH
Output high voltage (high-drive, 5 mA)
VCC_NRF-0.3
VCC_NRF
V
VOL
Output low voltage (std. drive, 0.5 mA)
GND
0.3
V
VOL
Output low voltage (high-drive, 5 mA)
GND
0.3
V
RPU
Pull-up resistance
11
13
16
kohm
RPD
Pull-down resistance
11
13
16
kohm
ITX,+4dBm
TX only run current @ POUT =+4 dBm
16
mA
ITX,0dBm
TX only run current @ POUT = 0 dBm
10.5
mA
IRX
RX only run current
13
mA
IOFF
Current in SYSTEM-OFF, no RAM
retention
0.6
uA
ION,16k
SYSTEM-ON base current
with 16kB RAM enabled
2.6
uA
ION,32k
SYSTEM-ON base current
with 32kB RAM enabled
3.8
uA
Note that when you use the RC oscillator, it will increase around 10uA of average power
consumption compared to a 32.768kHz crystal.
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Control No.
HD-AE-A150046 (2/8)
Control name
Electrical characteristics
UART specifications
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Control No.
HD-AE-A150046 (3/8)
Control name
Electrical characteristics
SPI Slave specifications
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Control No.
HD-AE-A150046 (4/8)
Control name
Electrical characteristics
SPI Master specifications
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Control No.
HD-AE-A150046 (5/8)
Control name
Electrical characteristics
TWI specifications
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Control No.
HD-AE-A150046 (6/8)
Control name
Electrical characteristics
GPIOTE specifications
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Control No.
HD-AE-A150046 (7/8)
Control name
Electrical characteristics
RF Specifications
Symbol
Description
Min.
Typ.
Max.
Units
Fop
Operating frequencies
2402
2480
MHz
PLLres
PLL programming resolution
1
MHz
Df
Frequency deviation
+/-225
+/-250
+/-275
kHz
PRF
Maximum output power
4
dBm
PRFC
RF power control range
20
24
dB
PRFCR
RF power accuracy
+/-4
dB
PWHISP
RF power whisper mode
-30
dBm
PBW
20 dB bandwidth for modulated carrier
950
1100
kHz
PRF1
1st Adjacent Channel Transmit Power 1 MHz
-20
dBc
PRF2
2nd Adjacent Channel Transmit Power 2 MHz
-45
dBc
PRXMAX
Maximum received signal strength at < 0.1% PER
0
dBm
PSENS IT
Receiver sensitivity (0.1% BER) Ideal transmitter
-93
dBm
PSENS DT
Receiver sensitivity (0.1% BER) dirty transmitter
-91
dBm
Many documents of nRF51822, such as product specification and the anomaly notification,
can be found at the link below. Please be sure to check these latest documents when using
our module.
nRF51822_Product Specification
https://www.nordicsemi.com/-/media/DocLib/Other/Product_Spec/nRF51822PSv33.pdf?la=en
nRF51 Reference Manual
https://www.nordicsemi.com/-/media/DocLib/Other/Product_Spec/nRF51RMv301.pdf?la=en
nRF51822 Product Anomaly Notification
https://www.nordicsemi.com/-/media/DocLib/Other/Errata/nRF51822panv33.pdf?la=en
SoftDevice Specification
https://www.nordicsemi.com/DocLib
For more information
https://www.nordicsemi.com/DocLib
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Control No.
HD-AE-A150046 (8/8)
Control name
Electrical characteristics
DFU Specifications
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Control No.
HD-MC-A150046 (1/3)
Control name
Circuit Schematic
Block Diagram
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Control No.
HD-MC-A150046 (2/3)
Control name
Circuit Schematic
Sample circuits
Internal LDO setup
DC/DC converter setup
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Control No.
HD-MC-A150046 (3/3)
Control name
Circuit Schematic
Reference Circuits
Internal LDO setup
"P0.00-0.25" and "P0.28-0.30" are
GPIOs. By setting in the application
software, it is assigned to pin any
such as UART, etc. Please make
Open Status about unused pins.
VIO is connected to VCC in a
module. Please use IO voltage
under the following conditions.
Input high(V): 0.7VCC to VCC
Input low(V): GND to 0.3VCC
VCC: 1.8V to 3.6V
It can operate by a single supply. In case of
the operation with the battery, we recommend
that you add a capacitor of about 100uF in
view of the voltage drop during TX/RX.
In case of the power supply voltage
fluctuation by the load change is large, the
module may not function properly.
If an external regulator is used, the load
change characteristic should be good in order
to keep stable voltage as possible when the
current is change.
SWDIO pad is assigned as (Active low)
reset pad of the module. When you do not
want to use the reset function, [150Ω]
[Push SW] on the left figure are not
required.
SWD (Serial Wire Debug) is a high-performance
2-pin debug port low-pin-count alternative to JTAG. It
can write the application software and firmware by
those pins through the J-Link Lite.
When the customers use the cable in Nordic DK to
use J-LINK Lite, it will need to implement the socket
on the customers main board side. The socket will
be "10-pin connector two rows of 1.27mm pitch (Ex:
PSS-720153-05, Hirosugi instrument). The cable in
Nordic DK has a protection to avoid reverse
connection. In order to use this cable, please
remove the pin 7 of the socket on main board.
J-Link Lite is working with 3.3V. It does not work with
1.8V.
In order to use the
built-in antenna on
the module, please
connect PAD22 and
PAD23.
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Control No.
HD-AD-A150046 (1/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit : (mm)
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Control No.
HD-AD-A150046 (2/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit: mm
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Control No.
HD-AD-A150046 (3/3)
Control name
Outline/Appearance
LAND PATTERN EXAMPLE
Recommended metal mask for solder printing
Pad size
Mask opening
Signal pad 43 – 0.6 x 1.0 mm
0.5 x 0.9 mm
Corner pad 4 – 1.5 x 1.0 mm
1.0 x 0.7 mm
Center pad 2 – 3.0 x 3.4 mm
2.6 x 3.0 mm
The center of each mask opening is same as the pad center.
The metal mask thickness: t=0.1mm
The solder volume should be same by changing the mask opening if different metal mask thickness
is used.
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Control No.
HD-BA-A150046 (1/2)
Control name
Pin Layout
Pin Descriptions
Pin
Pin name
Pin
function
Description
1
DCC
Power
DC/DC output (built-in LC for DC/DC)
2
AVDD
Power
Analog Power supply
3
GND
Ground
Ground (0 V)
4
VCC_NRF
Power
Power supply
5
GND
Ground
Ground (0 V)
6
P0.00
AREF0
Digital I/O
Analog input
General purpose I/O pin
ADC Reference voltage
7
P0.01
AIN2
Digital I/O
Analog input
General purpose I/O pin
ADC input 2
8
P0.02
AIN3
Digital I/O
Analog input
General purpose I/O pin
ADC input 3
9
P0.06
AIN7
AREF1
Digital I/O
Analog input
Analog input
General purpose I/O pin
ADC input 7
ADC Reference voltage
10
P0.05
AIN6
Digital I/O
Analog input
General purpose I/O pin
ADC input 6
11
P0.04
AIN5
Digital I/O
Analog input
General purpose I/O pin
ADC input 5
12
P0.03
AIN4
Digital I/O
Analog input
General purpose I/O pin
ADC input 4
13
GND
Ground
Ground (0 V)
14
SWDIO
Digital I/O
System reset (active low). Also HW debug and flash programming
I/O
15
SWDCLK
Digital input
HW debug and flash programming I/O
16
P0.17
Digital I/O
General purpose I/O pin
17
P0.19
Digital I/O
General purpose I/O pin
18
P0.21
Digital I/O
General purpose I/O pin
19
P0.23
Digital I/O
General purpose I/O pin
20
P0.25
Digital I/O
General purpose I/O pin
21
GND
Ground
Ground (0 V)
22
OUT_MOD
RF In/Out
RF I/O pin. It should be connected to Pin 23 OUT_ANT for normal
operation.
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Control No.
HD-BA-A150046 (2/2)
Control name
Pin Layout
Pin
Pin name
Pin
function
Description
23
OUT_ANT
Antenna
In/Out
Internal antenna. It should be connected to Pin 22 OUT_MOD for
normal operation.
24
P0.28
Digital I/O
General purpose I/O pin
25
P0.29
Digital I/O
General purpose I/O pin
26
P0.30
Digital I/O
General purpose I/O pin
27
P0.07
Digital I/O
General purpose I/O pin
28
P0.11
Digital I/O
General purpose I/O pin
29
P0.10
Digital I/O
General purpose I/O pin
30
P0.09
Digital I/O
General purpose I/O pin
31
P0.08
Digital I/O
General purpose I/O pin
32
P0.12
Digital I/O
General purpose I/O pin
33
P0.13
Digital I/O
General purpose I/O pin
34
P0.14
Digital I/O
General purpose I/O pin
35
P0.15
Digital I/O
General purpose I/O pin
36
P0.16
Digital I/O
General purpose I/O pin
37
P0.18
Digital I/O
General purpose I/O pin
38
P0.20
Digital I/O
General purpose I/O pin
39
P0.22
Digital I/O
General purpose I/O pin
40
P0.24
Digital I/O
General purpose I/O pin
41 to 45
GND
Ground
Ground (0 V)
46
NC
Not
Connected
Isolated pad on PCB for mechanical stability
47 to 48
GND
Ground
Ground (0 V)
49
NC
Not
Connected
Isolated pad on PCB for mechanical stability
27-Feb.2019 Ver.1.9
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This specification describes desire and conditions especially for mounting.
Desire/Conditions
(1) Environment conditions for use and storage
1. Store the components in an environment of < 40deg-C/90％RH if they are in a moisture
barrier bag packed by TAIYO YUDEN.
2. Keep the factory ambient conditions at < 30deg-C/60％RH .
3. Store the components in an environment of < 25±5deg-C/10%RH after the bag is opened.
(The condition is also applied to a stay in the manufacture process).
(2) Conditions for handling of products
Make sure all of the moisture barrier bags have no holes, cracks or damages at receiving. If
an abnormality is found on the bag, its moisture level must be checked in accordance with 2
in (2).
Refer to the label on the bag.
1. All of the surface mounting process (reflow process) must be completed in 12 months
from the bag sea date.
2. Make sure humidity in the bag is less than 10%RH immediately after open, using a
humidity indicator card sealed with the components.
3. All of the surface mounting process (reflow process including rework process) must be
completed in 168 hours after the bag is opened (inclusive of any other processes).
4. If any conditions in (1) or condition 2 and 3 in (2) are not met, bake the components in
accordance with the conditions at 125deg-C 24hours
5. As a rule, baking the components in accordance with conditions 4 in (2) shall be once.
6. Since semi-conductors are inside of the components, they must be free from static
electricity while handled.(<100V) Use ESD protective floor mats, wrist straps, ESD
protective footwear, air ionizers etc. , if necessary.
7. Please make sure that there are lessen mechanical vibration and shock for this module,
and do not drop it.
8. Please recognize pads of back side at surface mount.
9. Washing the module is not recommended. If washing cannot be avoided, please
test module functionality and performance after thoroughly drying the module.
We cannot be held responsible for any failure due washing the module.
10. Please perform temperature conditions of module at reflow within the limits of the
following.
Please give the number of times of reflow as a maximum of 2 times.
Control No.
HQ-BA-537 (1/2)
Control name
Handling Precaution
27-Feb.2019 Ver.1.9
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Control No.
HQ-BA-537 (2/2)
Control name
Handling Precaution
0
50
100
150
200
250
300
IN OUT
Temp(deg)
130-180deg Pre-heat
: 60~120sec
Peak Temp:250deg Max
230deg up : 40secMax
Recommented Reflow Profile
27-Feb.2019 Ver.1.9
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Packaging Specification
梱包仕様
(1) Packaging Material 梱包材料
Name Outline Materials Note
部材名 概要 材質 備考
Emboss 24mm wide - 12mmPitch Conductive PS
エンボス 24mm幅 - 12mmピッチ
導電性 PS
Cover Tape
カバーテープ
Reel φ330 mm Conductive PS
リール
導電性 PS
Desiccant 30g×1
乾燥剤
Humidity indicator card
湿度インジケータ
Aluminum moisture barrier bag
420×460(mm)
(AS)PET/AL/NY/PE(AS)
アルミ防湿袋
Label
ラベル
Corrugated cardboard box(Inner) 339×351×74(mm)
個装箱
Corrugated cardboard box(Outer) 369×369×277(mm)
外装箱
(2) Packaging Unit
梱包数量
Max pieces/Reel Max pieces/Box(Outer)
(3) Packaging Figure
Label-1
ﾗﾍﾞﾙ-1
(4) Label
ラベル
Label-1
・CAMPANY NAME 御社名
・PURCHASE ORDER 注文番号
・DESCRIPITON 品名
・QUANTITY 数量
・ＬｏｔNo. ロット番号
Label-2
ＣＡＵＴＩＯＮ LABEL
注意ラベル
・MSL Level3
1000
3000
Desiccant
乾燥剤
Humidity indicator card
湿度インジケータ
Aluminum moisture
barrier bag
アルミ防湿袋
Corrugated cardboard box(Inner)
個装箱
Corrugated cardboard box(Outer)
外装箱
Corrugated cardboard
box(Inner)
個装箱
Label-1
ﾗﾍﾞﾙ-1
Label-2
ﾗﾍﾞﾙ-2
Control No.
HD-BB-A150046 (1/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.9
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Tape specification
テーピング仕様
The direction of a tape drawer
End part Module receipt part Leader part
The direction of a tape drawer
テープ引き出し方向
キャリアエンボス図面
160mm以上
300mm以上
100mm以上
リーダー部
More than300mm
製品部終端部
More than100mmMore than160mm
テープ引出し方向
１ピンマーク
First Pin Mark
Control No.
HD-BB-A150046 (2/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.9
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Reel specification
リール仕様
(Unit:mm)
Taping performance
テーピング性能
Both of an embossing tape top cover tape bear this, when the power of 10N is applied in the direction of a drawer.
・エンボステープ、トップカバーテープともに、引き出し方向に１０Nの力を加えた場合に、これに耐えうること．
The exfoliation adhesion of a top cover tape is the intensity of 0.1～1.3N.
(The angle to pull is 165～180 degrees. The speed to pull is 300 mm/min.)
・トップカバーテープの剥離強度は、角度165～180度に保ち、300mm/minのスピードでトップカバーテープを引っ張ったとき、
0.1～1.3Nとする．
Note
備考
Lack of the parts in 1 reel is with two or less pieces.
１リール中の部品の欠落は2個までとします。（ラベル表示数量と梱包数は同じです。欠落とはテープ内でのモジュール抜け
が2個まで許容させていただくという意味になります。）
MSL Level 3 Under control
MSL はレベル３ で管理しています。
Tape wide
W
12ｍｍ
13.4mm
８ｍｍ
9.4mm
32ｍｍ
44ｍｍ
17.4mm
25.4mm
33.4mm
16ｍｍ
45.4mm
φ330±2
24ｍｍ
φ13±0.2
W-1.5/+2
Control No.
HD-BB-A150046 (3/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.9
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Recommended module mounting example
*1 Please do not place any metal components in blue shaded space,(*1) such as signal line and
metal chassis as possible except for main board while mounting the components in *1 space on
the main board is allowed except for no copper plating area. (*2).
*2 This area is routing prohibited area on the main board. Please do not place copper on any layer.
Please remain use of FR-4 dielectric material. The antenna is tuned with the FR-4.
*3 Characteristics may deteriorate when GND pattern length is less than 30mm. It should be 30 mm
or more as possible.
Even when above mentioned condition is satisfied, communication performance may be
significantly deteriorated depending on the structure of the product.
Control No. (1/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.9
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Other module mounting examples
Placement of resin or plastic parts
Control No. (2/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.9
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Directional characteristics example (when mounted on evaluation board)
About this Application Note
・This Application Note has been prepared as a reference material to help obtaining the antenna
performance mounted on BLE module better while it is not guaranteed or assured to obtain better
communication performance and distance.
・This product “BLE module” has been certified and matching circuit constant for antenna within
module cannot be changed when ambient environment condition changes. The product must be
re-certified when matching circuit constant is changed.
Control No. (3/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.9
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1. Power Up Sequence
VCC_NRF power supply rise time (0V to 1.8V) must not exceed 100ms.
2. Recommended Power Circuit
VCC_NRF is the main power supply (1.8 – 3.6V) for this module. The supply voltage range of
VCC_NRF is 1.8V to 3.6V in LDO mode and 2.1V to 3.6V in DCDC mode. For more information of
internal DC/DC converter operation, please refer to chapter 12.1.3 of "nRF51
_Series_Reference_Manual v3.0" by Nordic Semiconductor. In case of the power supply voltage
fluctuation by the load change is large, the module may not function properly. If an external
regulator is used, the load change characteristic should be good in order to keep stable voltage as
possible when the current is change.
3. Battery operation
When using a small battery (e.g. CR2032), a large capacitor (e.g.100uF low leakage capacitor)
should be placed near the battery. This will reduce the voltage drop especially when the module is
operated at low temperatures
4. Pattern Design Guide
4-1. Power Supply System
Power supply bypass capacitors should be placed close to the VCC_NRF pin of the module. The
VCC_NRF trace should be greater than 0.5mm and a bigger a via diameter is recommended.
4-2. Bypass Capacitor Layout
A parallel combination of a small capacitance (about 10pF) and a large capacitance (1uF to 10uF) is
recommended for bypass capacitors. The GND of the bypass capacitor should be placed close to an
adjacent module GND to ensure the shortest closed loop.
4-3. GND Pattern
Power supply bypass capacitor GND should be placed in proximity of module GND. Wide GND
area must be provided to ensure isolation for each layer.
GND pattern of each layer should be connected to GND area with large number of via.
Control No. (1/1)
Control name
Design guide
* If it is difficult to place a bigger via, please increase
the number of vias.
* Bypass capacitors with smaller capacitance must
be placed closer to module.
Line width greater than 0.5mm is recommended.
Via diameter greater than 0.2mm is recommended.
Module
GND area
Surface layer
High frequency line
VCC_NRF
Module
27-Feb.2019 Ver.1.9
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The evaluation board included with the Nordic Development Kit uses a 16MHz clock. Therefore the
sample code from Nordic is designed to be used with a 16MHz clock. On the other hand, the
EYSGCN series module uses a 32MHz system clock, making it incompatible with the Nordic sample
code (i.e. sample code does not configure HFCLK: XTALFREQ register for 32MHz). To fix this issue,
we need to write the value 0xFFFFFF00 to the UICR (User Information Configuration Register) at
address 0x10001008. Please note that the UICR is erased whenever you download a SoftDevice.
The UICR can be written by using the debug tools:
nrfjprog.exe --snr <your_jlink_debugger_serial_number> --memwr 0x10001008 --val 0xFFFFFF00
Or the following code can be added to the SystemInit function in the system_nRF51.c file, right
before launching the TASK_HFCLKSTART task:
if (*(uint32_t *)0x10001008 == 0xFFFFFFFF)
{
NRF_NVMC->CONFIG = NVMC_CONFIG_WEN_Wen << NVMC_CONFIG_WEN_Pos;
while (NRF_NVMC->READY == NVMC_READY_READY_Busy){}
*(uint32_t *)0x10001008 = 0xFFFFFF00;
NRF_NVMC->CONFIG = NVMC_CONFIG_WEN_Ren << NVMC_CONFIG_WEN_Pos;
while (NRF_NVMC->READY == NVMC_READY_READY_Busy){}
NVIC_SystemReset();
while (true){}
}
Control No. (1/1)
Control name
Notes
