BGM781N11
GPS Front-End Module
Data Sheet, Rev.3.2, Oct. 2010
RF & Protection Devices
Edition 2010-10-28
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2010.
All Rights Reserved.
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BGM781N11
Data Sheet 3 Rev.3.2, 2010-10-28
Oct. 2010
Revision History: GPS Front-End Module, Rev.3.2
Previous Version: 2009-10-30, Rev.3.1
Page Subjects (major changes since last revision)
10 Package pin tolerances changed from 35µm to 50µm
Data Sheet 4 Rev.3.2, 2010-10-28
GPS Front-End Module
BGM781N11
1 GPS Front-End Module
Figure 1 Blockdiagram with main external components
Features
Operating frequency: 1575.42 MHz
High Gain: 18.6 dB
Low Noise Figure: 1.7 dB
Low current consumption: 3.3 mA
Out-of-band rejection in cellular bands: 80 dBc
Input compression point in cellular bands: 20 dBm
Supply voltage: 1.5 V to 3.6 V
Tiny TSNP-11-2 leadless package
RF input internally pre-matched to 50 Ω
RF output internally matched to 50 Ω
HBM ESD capability of all pins: 2 kV
IEC ESD contact discharge of RF input pin: 8 kV
Only 2 external SMD parts
RoHS compliant package (Pb-free)
Application
1575.42 MHz GPS, Galileo, GPS phones, personal navigaton
devices
TSNP-11-2 Package top view
(2.5x2.5x0.73mm³)
TSNP11-2.vsd
BGM781_Blockdiagram_with_external.vsd
BIAS
RFIN
PON VCC
BIASAIBO1
GND
BGM781N11
BG1
LNA
Post-FilterPre-Filter
BG2
BGM781N11
Description
Data Sheet 5 Rev.3.2, 2010-10-28
2 Description
The BGM781N11 is a combination of a low-insertion-loss pre-filter with Infineon’s high performance low noise
amplifier (LNA) and a high-attenuation post-filter for Global Positioning System (GPS) applications. Through the
low insertion loss of the filters, the BGM781N11 provides 18.6 dB gain, 1.7 dB noise figure and high linearity
performance. In addition BGM781N11 provides very high out-of-band attenuation in conjunction with a high input
compression point. Its current consumption is as low as 3.3 mA. It operates over the 1.5 V to 3.6 V supply voltage
range.
Pin Definition and Function
Maximum Ratings
Type Package Marking
BGM781N11 TSNP-11-2 M781
Table 1 Pin Definition and Function
Pin No. Symbol Function
1 BG2 Optional Output-Filter GND
2 PON Power On/Off
3 VCC Power Supply
4 n.c. not used
5 RFIN RF Input
6 BG1 Input-Filter GND
7 BO1 Input-Filter Output
8 AI LNA Input
9BIASBIAS
10 RFOUT RF Output
11 GND Package Middle Island
Table 2 Maximum Ratings
Parameter1) Symbol Value Unit Note / Test Condition
Voltage at pin BG2 to GND VBG2 -1...1 V
Voltage at pin PON to GND VPON -0.3...3.6 V
Voltage at pin VCC to GND VCC -0.3...3.6 V
Voltage at pin RFIN to GND VRFIN -3...3 V
Voltage at pin BG1 to GND VBG1 -3...3 V
Voltage at pin B01 to GND VBO1 -3...3 V
Voltage at pin AI to GND VAI -0.3...0.9 V
Voltage at pin BIAS to GND VBIAS -0.3...0.9 V
Voltage at pin RFOUT to GND VRFOUT -3...3 V
Current into pin VCC IVCC 25 mA
RF input power inband PIN 3 dBm Continuous wave signal
f= 1575.42 MHz
50 ohm source and load
impedances
Data Sheet 6 Rev.3.2, 2010-10-28
BGM781N11
Description
RF input power out of band PIN,OOB 21 Continuous wave signal
f= 50 - 1460 MHz and
1710 - 4000 MHz
50 ohm source and load
impedances
Total power dissipation Ptot 90 mW
Junction temperature TJ150 °C
Ambient temperature range TA-40... 85 °C
Storage temperature range TSTG -65... 85 °C
ESD capability HBM of all pins, with
pin 6 and GND middle island pin 11
tied together
VESD1 2 kV according to JESD22A-114
ESD contact discharge capability of
RF input pin 5
VESD2 8 kV according to IEC61000-4-2
1) All voltages refer pin-to-pin, unless otherwise specified.
Table 2 Maximum Ratings (cont’d)
Parameter1) Symbol Value Unit Note / Test Condition
BGM781N11
Electrical Characteristics
Data Sheet 7 Rev.3.2, 2010-10-28
3 Electrical Characteristics
Table 3 Electrical Characteristics: TA=2C, VCC =1.8V, VPON,ON =1.8V, VPON,OFF =0V
1)
1) Specification based on performance as measured on BGM781N11application board shown in Figure 3 and including PCB
losses (unless noted otherwise)
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply Voltage VCC 1.51.83.6V
Supply Current ICC -3.3-mAON-Mode
-0.23μA OFF-Mode
Power On Control Voltage Vpon 1.0 - Vcc V ON-Mode
0 - 0.4 V OFF-Mode
Power On Control Current Ipon -5-μAON-Mode
--1μA OFF-Mode
Power Gain Settling Time2)
2) To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode
tS-5-μs OFF- to ON-Mode
-5-μs ON- to OFF-mode
Passband Parameters @
f= 1575.42 MHz
Insertion Power Gain |S21|217.1 18.6 - dB
Noise Figure3)
3) PCB and connector losses subtracted, verified on AQL base
NF -1.72.3dBZS=50Ω
Input Return Loss RLin -12-dB
Output Return Loss RLout -15-dB
Reverse Isolation 1/|S12|2-40-dB
Inband Input 3rd Order
Intercept Point
IIP3--7-dBmf1= 1575.42 MHz
f2=f1+1MHz
Inband Input 1 dB
Compression Point
IP1dB --15-dBmf1= 1575.42 MHz
Out-of-band Input 1 dB
Compression Point
IP1dB_900M -20- f1=900MHz
Out-of-band Input 1 dB
Compression Point
IP1dB_1710M -20- f1= 1710 MHz
Stopband Parameters
Rejection4)
4) Rejection=|(1/|S21|2 at stopband frequency)|+|(1/|S21|2 at 1575.42 MHz)|
Rej900M -90-dBcf= 806 MHz - 928 MHz
Rejection4) Rej1800M -80-dBcf= 1710 MHz - 1980 MHz
Rejection4) Rej2400M -72-dBcf= 2400 MHz - 2500 MHz
Stability k->1- f=20MHz-20GHz
Data Sheet 8 Rev.3.2, 2010-10-28
BGM781N11
Application Information
4 Application Information
4.1 Application Circuit
Figure 2 Application circuit with external components
Table 4 Bill of Materials
Name Value Package Manufacturer Function
C1 1 μF 0402 Various Supply voltage filtering (optional)
L1 3.6 nH 0402 muRata LQG15HS Input matching
L2 33 nH 0402 muRata LQG15HS Bias
N1 BGM781N11 TSNP-11-2 Infineon GPS FE Module
BGM781_Application_circuit_with_external.vsd
BGM781N11
(Topview)
1
GND
BG1
AI
BO1
BIAS
RFOUT
n.c.
RFIN
VCC
PON
C1
L2
L1
BG2
BGM781N11
Application Information
Data Sheet 9 Rev.3.2, 2010-10-28
4.2 Application Board
Figure 3 Top view of application board
Figure 4 Cross section view of application board
BGM781_AppBoard_Layout_top.vsd
BGM781_AppBoard_Cross_Section.vsd
Copper, 35μm, gold plated
Rogers RO4003C, 0.2mm
Copper, 35μm
FR4, 0.8mm
Copper, 35μm
Data Sheet 10 Rev.3.2, 2010-10-28
BGM781N11
Package Information
5 Package Information
Figure 5 Side and bottom views of TSNP-11-2 package
Figure 6 Marking layout
TSNP11_Marking_Layout_BGM781.vsd
M
781
1025
BGM781N11
Type code
2010, CW 25
Date code (YYW
W)
Pin 1 marking
Laser marking
BGM781N11
Package Information
Data Sheet 11 Rev.3.2, 2010-10-28
Figure 7 Recommended TSNP-11-2 footprint for optimum RF performance
Figure 8 Alternative TSNP-11-2 footprint for low cost PCB designs
Data Sheet 12 Rev.3.2, 2010-10-28
BGM781N11
Packing Information
6 Packing Information
Figure 9 TSNP-11-2 carrier tape
Figure 10 TSNP-11-2 pin 1 orientation in tape