TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 1 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
TABLE OF CONTENTS
Introduction ............................................................................................................................................................................................. 2
Description .......................................................................................................................................................................................... 2
Features and Benefits ......................................................................................................................................................................... 2
Product Applications ............................................................................................................................................................................ 2
Industry Protocols ................................................................................................................................................................................ 2
Technical Documents .......................................................................................................................................................................... 2
Part Numbers .......................................................................................................................................................................................... 3
Table 1. Part Number Selection Guide ................................................................................................................................................ 3
Product Specifications ............................................................................................................................................................................ 4
Table 2. Material Specifications .......................................................................................................................................................... 4
Table 3. Electrical/Mechanical Specifications ..................................................................................................................................... 4
Table 4. Environmental Specifications ................................................................................................................................................ 4
Table 5. Discrete Primary Pair Cable Specifications ........................................................................................................................... 5
Pin Configurations ................................................................................................................................................................................... 6
IFPA 2-Port Configuration ................................................................................................................................................................... 6
IFPB 1-Port Configuration ................................................................................................................................................................... 7
ChipConnect Cable Assembly Mechanical Schematics ......................................................................................................................... 7
IFPB 1-Port Flat Right Exit .................................................................................................................................................................. 9
IFPB 1-Port Inverted Right Exit ......................................................................................................................................................... 10
IFPB 1-Port Flat Left Exit ................................................................................................................................................................... 10
IFPB 1-Port Inverted Left Exit ............................................................................................................................................................ 11
Signal Integrity Performance ................................................................................................................................................................. 12
TEPN 2821719-1 ............................................................................................................................................................................... 12
TEPN 2821720-1 ............................................................................................................................................................................... 12
TEPN 2821721-1 ............................................................................................................................................................................... 12
TEPN 2821722-1 ............................................................................................................................................................................... 13
LEC A – Differential Impedance ........................................................................................................................................................ 13
IFP A – Differential Impedance ......................................................................................................................................................... 13
LEC B – Differential Impedance ........................................................................................................................................................ 14
IFP B – Differential Impedance ......................................................................................................................................................... 14
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 2 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
INTRODUCTION
Description
TE Connectivity’s (TE) ChipConnect passive copper cable assembly is a robust and flexible cable assembly based on the Intel®
Omni-Path Internal Faceplate-to-Processor (IFP) cable assembly with support of up to 2 ports, at 100Gbps per port. The IFP cable
assembly is composed of discrete twinax pairs with a 54-position Linear Edge Connector (LEC) that mates with CPU substrate, and
paddle card connectors that mate internally with Intel® Omni-Path Internal Faceplate Transition (IFT) connector and cage. Due to
the lower loss characteristics of copper cable, ChipConnect internal cabling extends the reach for high data rate signals. TE's
cabling solution helps lower overall costs by eliminating re-timers required to compensate for lossy PCB traces as well as costlier,
lower loss PCB laminates.
ChipConnect assemblies are offered with 85 ohm impedance 30AWG twinax pairs. The cable design is available in a broad range of
standard configurations. Standard cabling options include:
IFPA - mates with 1.587mm thick microprocessor substrate
IFPB - mates with 1.102mm thick microprocessor substrate
Straight, right and left turn exit configurations
1-port (8 diff pair) and 2-port (16 diff pair) I/O paddle card connector configurations
Inverted and non-inverted I/O paddle card connectors
Various standard cable lengths through 439mm
In addition to these standard IFP cable configurations, TE can develop customized versions based on individual customer
requirements.
Features and Benefits
Internal copper cable solution for use with Intel® Xeon® Phi™ Processor 7200F Series with integrated Intel® Omni-Path
Architecture
Supports 25Gbps channel speeds utilizing Intel Omni-Path Architecture
Enables less expensive PCB material and electronics, with higher channel performance
Optimized construction to minimize insertion loss and cross talk
High density 0.7 mm LEC contact pitch
30AWG 85 Ohm low loss 25GHz primary pairs
Toolless connector insertion and extraction
Molded plastic strain-relief isolates solder joints from external stresses
Straight, left-turn or right-turn exit LEC termination support different system designs
Active press to release stainless steel IFT latching
Torsional spring latch LEC termination connects to retention features on socket bolster plate
RoHS compliant
Product Applications
High performance computing
Servers and routers
Data Center and Enterprise networks
Industry Protocols
Intel Omni-Path Architecture (100Gbps)
Technical Documents
Product Specification
108-130015
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 3 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
PART NUMBERS
Table 1. Part Number Selection Guide
IFP Style Number of
Ports
LEC
Configuration
IFP
Configuration
Assembly
Length (mm)
Breakout
Length (mm)
Part
Number Remark
A 2 Straight
Flat
142 75 2821719-3
208 104.5 2821719-1
405 104.5 2821719-2
460 104.5 2821719-4 *
Inverted
208 104.5 2821720-1
405 104.5 2821720-2
B 1
Straight
Flat 150 N/A 2821721-1
Inverted
160 N/A 2821722-1
205 N/A 2821722-2
242 N/A 2821722-3
465 N/A 2821722-4 *
Left Angle
Flat
142 N/A 2821723-4
335 N/A 2821723-1
371 N/A 2821723-2
460 N/A 2821723-5 *
515 N/A 2821723-3 *
Inverted
178 N/A 2821724-1
235 N/A 2821724-2
318 N/A 2821724-3
419 N/A 2821724-4
439 N/A 2821724-5
500 N/A 2821724-6 *
Right Angle
Flat
142 N/A 2821778-1
460 N/A 2821778-2 *
Inverted
235 N/A 2821725-1
370 N/A 2821725-2
500 N/A 2821725-3 *
*Cable lengths exceeding 439 mm are not standard offer and have not been qualified by Intel
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 4 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
PRODUCT SPECIFICATIONS
Table 2. Material Specifications
PCB
Halogen Free low loss laminate
IPC Class 3
Contact Gold plated contact pads
Connector housing PBT thermoplastic
Active latches
Stainless steel wire bail lock (LEC)
Stamped Stainless steel (I/O)
Discrete cable
Silver plated copper conductor
Fluoropolymer dielectric
Metallic tape pair shield
Polyester tape jacket
Table 3. Electrical/Mechanical Specifications
Impedance 85Ω ±5 ohm (avg), ±10% (instantaneous)
Data Rate 25Gbps per channel
Within Pair Skew 5 ps max
Rated Voltage 30V
Connector Insertion 1.13 kgf
Connector Detraction 1.22 kgf
Latch Engagement 1.59 kgf
Connector Extraction 1.22 kgf
28-Pin Plug Insertion 4.1 kgf
28-Pin Plug Extraction 3.1 kgf
28-Pin Plug Retention 9.2 kgf
Durability 30 mating cycles
Residual Load Limit 0 kgf
Static Cable Strain Relief 5.0 kgf
Dynamic Cable Strain Relief TBD
LEC54 from housing to back-shell retention 5.0 kgf
Minimum Cable Bend Radius 2-Port, 7.5 mm dia bundle: R=37.5 mm
1-Port, 5.5 mm dia bundle: R=25 mm
Table 4. Environmental Specifications
Non-Operating Condition 24°C
Operating Condition -40C to 70C, 6%RH
Flammability Rating VW-1
Safety Certificates RoHS II compliant
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 5 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
Table 5. Discrete Primary Pair Cable Specifications
Bend Radius 7x minor diameter
Cable Dimensions
Minor Diameter = 0.89 mm
Major Diameter = 1.55 mm
Attenuation
5 GHz = 3.8 dB/m
12.89 GHz = 6.0 dB/m
20 GHz = 8.0 dB/m
25 GHz = 10.0 dB/m
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 6 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
PIN CONFIGURATIONS
IFPA 2-Port Configuration
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 7 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
IFPB 1-Port Configuration
CHIPCONNECT CABLE ASSEMBLY MECHANICAL SCHEMATICS
IFPA 2-Port Flat Straight
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 8 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
IFPA 2-Port Inverted Straight
IFPB 1-Port Flat Straight
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 9 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
IFPB 1-Port Inverted Straight
IFPB 1-Port Flat Right Exit
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 10 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
IFPB 1-Port Inverted Right Exit
IFPB 1-Port Flat Left Exit
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 11 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
IFPB 1-Port Inverted Left Exit
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 12 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
SIGNAL INTEGRITY PERFORMANCE
TEPN 2821719-1
TEPN 2821720-1
TEPN 2821721-1
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 13 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
TEPN 2821722-1
LEC A – Differential Impedance
IFP A – Differential Impedance
TE Connectivity Technical Datasheet
ChipConnect Cable Assemblies
Page 14 of 14
1-1773930-1 Rev 08/17
© 2017 TE Connectivity Family of Companies. All Rights Reserved.
ChipConnect, TE Connectivity, TE and TE connectivity (logo) are trademarks of the TE Connectivity family of companies.
Other logos, products and/or company names may be trademarks of their respective owners.
LEC B – Differential Impedance
IFP B – Differential Impedance
While TE has made every reasonable effort to ensure the accuracy of the information in this document, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained
herein at any time without notice. TE EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES REGARDING THE INFORMATION CONTAINED HEREIN, INCLUDING, BUT
NOT LIMITED TO, ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. In no event will TE be liable for any direct, indirect,
incidental, special or consequential damages arising from or related to recipient’s use of the information. It is the sole responsibility of recipient of this information to verify the
results of this information using their engineering and product environment. Recipient assumes any and all risks associated with the use of the information.
