1
FEATURES
DESCRIPTION
BLOCK DIAGRAM
10
11
6
8
15
1
16
ENA
VSENSE
IAC
VRMS
VCC
GND
GTDRV
2.65 V / 2.15 V
3 V
7
VAO
13
SS
X2
A
B
C
(A) 16 V / 10 V
(B) 10.5 V / 10 V
5
MOUT
4
ISENSE
3
CAO
14
CT
OSC
12
RSET
S Q
R
R
2
PKLMT
20 V
IC
POWER
7.5 V REF
9
REF
RUN
7.1 V
RUN
VCC
14 µA
IMOUT +A B
C
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008www.ti.com
ADVANCED HIGH-POWER FACTOR PREREGULATOR
•Controls Boost PWM to Near-Unity PowerFactor
The UC3854A/B products are pin compatibleenhanced versions of the UC3854. Like the UC3854,•Limits Line Current Distortion To <3%
these products provide all of the functions necessary•World-Wide Operation Without Switches
for active power factor corrected preregulators. The•Accurate Power Limiting
controller achieves near unity power factor by•Fixed-Frequency Average Current-Mode shaping the ac input line current waveform tocorrespond to the ac input line voltage. To do this theControl
UC3854A/B uses average current mode control.•High Bandwidth (5 MHz), Low-Offset Current
Average current mode control maintains stable, lowAmplifier
distortion sinusoidal line current without the need for•Integrated Current- and Voltage-Amplifier
slope compensation, unlike peak current modeOutput Clamps
control.•Multiplier Improvements: Linearity, 500 mV V
AC
A 1%, 7.5-V reference, fixed frequency oscillator,Offset (Eliminates External Resistor), 0 V to
PWM, voltage amplifierwith soft-start, line voltage5 V Multout Common-Mode Range
feedforward (V
RMS
squarer), input supply voltageclamp, and over current comparator round out the lilst•V
REF
GOOD Comparator
of feataures.•Faster and Improved Accuracy ENABLEComparator Available in the 16-pin N (PDIP), DW (SOIC Wide),and J (CDIP) and 20-pin Q (PLCC) package. See•UVLO Options (16 V/10 V or 10.5 V/10 V)
Ordering Information table for availability by•300- µA Start-Up Supply Current
temperature range.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
DESCRIPTION (CONTINUED)
ABSOLUTE MAXIMUM RATINGS
UC1854A
UC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
The UC3854A/B products improve upon the UC3854 by offering a wide bandwidth, low offset current amplifier, afaster responding and improved accuracy enable comparator, a VREF GOOD comparator, UVLO thresholdoptions (16 V/10 V for offline, 10.5 V/10 V for startup from an auxiliary 12-V regulator), lower startup supplycurrent, and an enhanced multiply/divide circuit. New features like the amplifier output clamps, improved amplifiercurrent sinking capability, and low offset VAC pin reduce the external component count while improvingperformance. Improved common mode input range of the multiplier output/current amplifier input allow thedesigner greater flexibility in choosing amethod for current sensing. Unlike its predecessor, R
SET
controls onlyoscillator charging current and has no effect on clamping the maximum multiplier output current. This current isnow clamped to a maximum of 2 ×I
AC
at all times which simplifies the design process and provides foldbackpower limiting during brownout and extreme low line conditions.
ORDERING INFORMATION
UVLO UVLO PART NUMBERSTURN-ON TURN-OFFT
A
CDIP-16 PDIP-16 SOIC-16 PLCC-20(V) (V)
(V) (N) (DW) (Q)
16 10 – – – –– 55 °C to 125 °C
10.5 10 UC1854BJ – – –16 10 UC2854AJ UC2854AN UC2854ADW UC2854AQ– 40 °C to 85 °C
10.5 10 UC2854BJ UC2854BN UC2854BDW UC2854BQ16 10 – UC2854AN UC2854ADW –0°C to 70 °C
10.5 10 – UC2854BN UC2854BDW –
over operating free-air temperature range (unless otherwise noted)
(1)
UCX854A, UCX854B UNIT
V
CC
Supply voltage 22 VContinuous 0.5I
GTDRV
GTDRV current A50% duty cycle 1.5VSENSE, VRMS, ISENSE MOUT 11Input voltage VPKLMT 5Input current RSET, IAC, PKLMT, ENA 10 mAPower dissipation 1 WT
J
Junction temperature – 55 to 150T
stg
Storage temperature – 65 to 150 °CT
sol
Lead temperataure, 1,6 mm (1/16 inch) from case for 10 seconds 300
(1) Stresses beyond those listed under absolutemaximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periodsmayaffect device reliability. All voltagesarewith respect to GND. Currents are positive into and negative out of, the specified terminal. ENA input is internally clamped toapproximately 10 V.
2Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
RECOMMENDED OPERATING CONDITIONS
THERMAL RESISTANCE
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage 10 20 VUC1854X – 55 125T
J
Operating junction temperature UC2854X – 40 85 °CUC3854X 0 70
PACKAGED DEVICESRESISTANCES
CDIP-16 PDIP-16 SOP-16 PLCC-20(J) (N) (DW) (Q)
θ
JC
(°C/W) 28
(1)
45 27 34θ
JA
(°C/W) 80 – 120 90
(2)
50 – 130
(2)
43 – 75
(2)
(1) θ
JC
data values stated are derived from MIL-STD-1835B which states gthe baseline values shown are worst case (mean +2s) for a 60 ×60 mil microcircuit device silicon die and applicable for devices with die sizes up to 14,400 square mils. For device die sizes greater than14,400 square mils use the following values, dual-in-line, 11 °C/W; flat pack and pin grid array, 10 °C/W.are at the end of each trace.(2) θ
JA
(junction-to-ambient) applies to devices mounted to five square inch FR4 PC board with one ounce copper where noted. Whenresitance range is given, lower values are for five square inch aluminum PC board. Test PWB is 0.062 inches thick and typically uses0,635 mm trace widths for power packages and 1,3 mm trace widths for non-power packages with a 100 ×100 mil probe land are at theend of each trace.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
ELECTRICAL CHARACTERISTICS
UC1854A
UC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
V
CC
= 18 V, R
T
= 8.2 k Ω, C
T
= 1.5 nF, V
PKLMT
= 1 V, V
VRMS
= 1.5 V, I
IAC
= 100 µA, I
ISENSE
= 0 V, V
CAO
= 3.5 V, V
VAO
= 5 V,V
VSENSE
= 3 V, – 40 °C < T
A
< 85 °C for the UC2854A and UC2854B, and 0 °C < T
A
< 70 °C for the UC3854A and UC3854B,and T
A
= T
J
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OVERALL
CAO = 0 V, VAO = 0 V,Supply current, off 250 400 µAV
CC
= V
UVLO
– 0.3 VSupply current, on 12 18 mAUCx854A 15.0 16.0 17.5V
CC
turn-on threshold voltage
UCx854B 8.0 10.5 11.2UCx854A 9 10 12V
CC
turn-off threshold voltage
UCx854B 7.8 10.3 11.0 VUCx854A 5 6 7V
CC
hysteresis
UCx854B 0.10 0.22 0.50V
CC
clamp I
VCC
= I
VCC(on)
+ 5 mA 18 20 22
VOLTAGE AMPLIFIER
Input voltage 2.9 3.0 3.1 VV
SENSE
bias current – 500 — 25 500 nAOpen loop gain 2 V ≤V
OUT
≤5 V 70 100 dBV
OH
High-level output voltage I
LOAD
= – 500 µA 6
VV
OL
Low-level output voltage I
LOAD
= 500 µA 0.3 0.5I
SC
Output short-circuit current V
OUT
= 0 V 1.5 3.5 mAGain bandwidth product
(1)
f
IN
= 100 kHz, 10 mVp-p 1 MHz
CURRENT AMPLIFIER
V
CM
= 0 V, T
A
= 25 °C – 4 0Input offset voltage mVV
CM
= 0 V, Overtemperature – 5.5 0I
SENSE
Input bias current V
CM
= 0 V – 500 500 nAOpen loop gain 2 V ≤V
OUT
= 6 V 80 110 dBV
OH
High-level output voltage I
LOAD
= – 500 µA 8
VV
OL
Low-level output voltage I
LOAD
= 500 µA 0.3 0.5I
SC
Output short-circuit current V
OUT
= 0 V 1.5 3.5 mACMRR Common mode rejection range – 0.3 5.0 VGain bandwidth product
(1)
f
IN
= 100 kHz, 10 mVp-p 3 5 MHz
REFERENCE
I
REF
= 0 mA, T
A
= 25 °C 7.4 7.5 7.6Output voltage VI
REF
= 0 mA 7.35 7.50 7.65Load regulation 1 mA ≤I
REF
≤10 mA 0 8 20
mVLine regulation 12 V ≤V
CC
≤18 V 0 14 25I
SC
Short circuit current V
REF
= 0 V 25 35 60 mA
(1) Ensured by design. Not production tested.
4Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
ELECTRICAL CHARACTERISTICS (Continued)
(2) Gain constant.
( ) ( )
( )2
1 5
IAC VAO
VRMS MOUT
I V . V
K
V I
´ -
=é ù
´
ë û
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
V
CC
= 18 V, R
T
= 8.2 k Ω, C
T
= 1.5 nF, V
PKLMT
= 1 V, V
VRMS
= 1.5 V, I
IAC
= 100 µA, I
ISENSE
= 0 V, V
CAO
= 3.5 V, V
VAO
= 5 V,V
VSENSE
= 3 V, – 40 °C < T
A
< 85 °C for the UC2854A and UC2854B, and 0 °C < T
A
< 70 °C for the UC3854A and UC3854B,and T
A
= T
J
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OSCILLATOR
Initial accuracy T
A
= 25 °C 85 100 115 kHzVoltage stability 12 V ≤V
CC
≤18 V 1%Total variation Line, temperature 80 120 kHzRamp amplitude (peak-to-peak) 4.9 5.9 VRamp valley voltage 0.8 1.3 V
ENABLE/SOFT-START/CURRENT LIMIT
Enable threshold voltage 2.35 2.55 2.80 VEnaable hysteresis V
FAULT
= 2.5 V 500 600 mVEnable input bias current V
ENA
= 0 V – 2 – 5 µAPropagation delay to disable time
(1)
Enable overdrive = 100 mV 300 nsSoft-start charge current V
SS
= 2.5 V 10 14 24 µAPeak limit offset voltage – 15 15 mVPeak limit offset current V
PKLMIT
= – 0.1 V – 200 – 100 µAPeak limit propagation delay time
(1)
150 ns
MULTIPLIER
I
AC
= 100 µA, V
RMS
= 1 V,Output current, I
A
limited – 220 – 200 – 170 µAR
SET
= 10 k Ω
Output current, zero I
AC
= 0 µA, R
SET
= 10 k Ω– 2.0 – 0.2 2.0 µAOutput current, power limited V
RMS
= 1.5 V Va = 6 V – 230 – 200 – 170 µAV
RMS
= 1.5 V Va = 2 V – 22V
RMS
= 1.5 V Va = 5 V – 156Output current µAV
RMS
= 5 V Va = 2 V – 2V
RMS
= 5 V Va = 5 V – 14Gain constant
(2)
V
RMS
= 1.5 V Va = 6 V, T
A
= 25 °C – 1.1 – 1.0 – 0.9 A/A
GATE DRIVER
V
OH
High-level output voltage I
OUT
= – 200 mA, V
CC
= 15 V 12.0 12.8 VV
OL
Low-level output voltage I
OUT
= 200 mA 1.0 2.2 VI
OUT
= 10 mA 300 500 mVLow-level UVLO voltage I
OUT
= 50 mA, V
CC
= 0 V 0.9 1.5 VOutput rise time
(1)
C
LOAD
= 1 nF 35 nsOutput fall time
(1)
C
LOAD
= 1 nF 35 nsOutput peak current
(1)
C
LOAD
= 10 nF 1.0 A
(1) Ensured by design. Not production tested.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
PACKAGE DESCRIPTION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
PKLMT
CAO
ISENSE
MOUT
IAC
VAO
VRMS
GTDRV
VCC
CT
SS
RSET
VSENSE
ENA
VREF
J, N and DW PACKAGES
(TOP VIEW)
5
4
6
7
8
18
17
16
15
14
ISENSE
CAOUT
N/C
MOUT
IAC
CT
SS
N/C
RSET
VSENSE
3 2 1 20 19
9 10 11 12 13
PKLMT
GND
N/C
GTDRV
VCC
VAO
VRMS
NC
VREF
ENA
Q PACKAGE
(TOP VIEW)
N/C − No connection
UC1854A
UC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
6Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
TERMINAL FUNCTIONS
TERMINAL
PACKAGES I/O DESCRIPTIONNAME
J/N/DW Q/L
Output of the wide bandwidth current amplifier and one of the inputs to the PWM duty-cycleCAO 3 4 O comparator. The output signal generated by this amplifier commands the PWM to force the correctinput current. The output can swing from 0.1 V to 7.5 V.CT 14 18 I Capacitor from CT to GND sets the PWM oscillator frequency.A nominal voltage above 2.65 V on this pin allows the device to begin operating. Once operating,ENA 10 13 I
the device shuts off if this pin goes below 2.15 V nominal.All bypass and timing capacitors connected to GND should have leads as short and direct asGND 1 2 –
possible. All voltages are measured with respect GND.Output of the PWM is a 1.5-A peak totem-pole MOSFET gate driver on GTDRV. Use a series gateresistor of at least 5 Ωto prevent interaction between the gate impedance and the GTDRV outputGTDRV 16 20 O
driver that might cause the GTDRV output to overshoot excessively. Some overshoot of theGTDRV output is always expected when driving a capacitive load.Current input to the multiplier, proportional to the instantaneous line voltage. This input to theanalog multiplier is a current. The multiplier is tailored for very low distortion from this current inputIAC 6 8 I
(IAC) to MOUT, so this is the only multiplier input that should be used for sensing instantaneousline voltage.
Switch current sensing input. This is the inverting input to the current amplifier. This input and theISENSE 4 5 I non-inverting input MOUT remain functional down to and below GND. Care should be taken toavoid taking these inputs below – 0.5 V, because they are protected with diodes to GND.Multiplier output and current sense plus. The output of the analog multiplier and the non-invertinginput of the current amplifier are connected together at MOUT. The cautions about taking ISENSEMOUT 5 7 I/O below – 0.5 V also apply to MOUT. As the multiplier output is a current, this is a high-impedanceinput similar to I
SENSE
, so the current amplifier can be configured as a differential amplifier to rejectGND noise. I
MOUT
≤2×I
AC
Peak limit. The threshold for PKLMT is 0.0 V. Connect this input to the negative voltage on thePKLMT 2 3 I
current sense resistor. Use a resistor to REF to offset the negative current sense signal up to GND.Oscillator charging current and multiplier limit set. A resistor from RSET to ground programsRSET 12 15 I
oscillator charging current.Soft-start. SS remains at GND as long as the device is disabled or V
CC
is too low. SS pulls up toover 3 V by an internal 14- µA current source when both V
CC
becomes valid and the device isenabled. SS acts as the reference input to the voltage amplifier if SS is below VREF. With a largeSS 13 17 I
capacitor from SS to GND, the reference to the voltage regulating amplifier rises slowly, andincrease the PWM duty cycle slowly. In the event of a disable command or a supply dropout, SSwill quickly discharge to ground and disable the PWM.VAO 7 9 I Voltage amplifier outputVCC 15 19 I Positive supply railUsed to set the peak limit point and as an internal reference for various device functions. ThisVREF 9 12 O
voltage must be present for the device to operate.One of the inputs into the multiplier. This pin provides the input RMS voltage to the multiplierVRMS 8 10 I
circuitry.
This pin provides the feedback from the output. This input goes into the voltage error amplifier andVSENSE 11 14 I
the output of the error amplifier is another of the inputs into the multiplier circuit.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
FUNCTIONAL DESCRIPTION
Multiply/Square and Divide
The UC3854A/B multiplier design maintains the same gain constant
1
K
V
-
æ ö
=
ç ÷
è ø
as the UC3854. The
( )
( )2
1 5
VAO
MOUT IAC
VRMS
V . V
I I
K V
-
= ´ ´
(1)
270 1 414 1 53
250
IAC
.
R . M
Am
´
= = W
(2)
UC1854A
UC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
The UC3854A and UC3854B family of products are designed as pin compatible upgrades to the industrystandard UC3854 active power factor correction circuits. The circuit enhancements allow the user to eliminate inmost cases several external components currently required to successfully apply the UC3854. In addition,linearity improvements to the multiply, square and divide circuitry optimizes overall system performance. Detaileddescriptions of the circuit enhancements are provided below. For in-depth design applications reference datarefer to the application notes, UC3854 Controlled Power Factor Correction Circuit Design (SLUA144 ) andUC3854A and UC3854B Advanced Power Factor Correction Control ICs (SLUA177 ).
relationship between the inputs and output current is given as:
This is nearly the same as the UC3854, but circuit differences have improved the performance and application.
The first difference is with the IAC input. The UC3854A/B regulated this pin voltage to the nominal 500 mV overthe full operating temperature range, rather than the 6.0 V used on the UC3854. The low offset voltageeliminates the need for a line zero crossing compensating resistor to VREF from IAC that UC3854 designsrequire. The maximum current at high line into IAC should be limited to 250 µA for best performance.
Therefore, if V
VAC(max)
= 270 V,
The V
RMS
pin linear operating range is improved with the UC3854A/B as well. The input range for VRMS extendsfrom 0 V to 5.5 V. Since the UC3854A squaring circuit employs an analog multiplier, rather than a linearapproximation, accuracy is improved, and discontinuities are eliminated. The external divider network connectedto VRMS should produce 1.5 V at low line (85 VAC). This puts 4.77 V on VRMS at high line (270 VAC) which iswell within its operating range.
The voltage amplifier output forms the third input to the multiplier and is internally clamped to 6.0 V. Thiseliminated an external zener clamp often used in UC3854 designs. The offset voltage at this input to themultiplier has been raised on the UC3854A/B to 1.5 V.
The multiplier output pin, which is also common to the current amplifier non-inverting input, has a – 0.3 V to 5.0 Voutput range, compared to the – 0.3 V to 2.5 V range of the UC3854. This improvement allows the UC3854A/B tobe used in applications where the current sense signal amplitude is very large.
8Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
Voltage Amplifier
Current Amplifier
Miscellaneous
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
The UC3854A/B voltage amplifier design is essentially similar to the UC3854 with two exceptions. The first iswith the internal connection. The lower voltage reduces the amount of charge on the compensation capacitors,which provides improved recovery form large signal events, such as line dropouts, or power interruption. It alsominimizes the dc current flowing through the feedback. The output of the voltage amplifier is also changed. Inaddition to a 6.0-V temperature compensated clamp, the output short circuit current has been lowered to 2 mAtypical, and an active pull down has replaced the passive pull down of the UC3854.
The current amplifier for an average current PFC controller needs a low offset voltage in order to minimize ac linecurrent distortion. With this in mind, the UC3854A/B current amplifier has improved the input offset voltage from± 4 mV to 0 V to ± 3 mV. The negative offset of the UC3854A/B assures that the PWM circuit will not drive theMOSFET is the current command is zero (both current amplifier inputs zero.) Previous designs required anexternal offset cancellation network to implement this key feature. The bandwidth of the current amplifier hasbeen improved as well to 5 MHz typical. While this is not generally an issue at 50 Hz or 60 Hz inputs, it isessential for 400 Hz input avionics applications.
Several other important enhancements have been implemented in the UC3854A/B. AV
CC
supply voltage clamp at20 V allows the controller to be current fed if desired. The lower startup supply current (250 µA typical),substantially reduces the power requirements of an offline startup resistor. The 10.5 V/10 V UVLO option(UC3854B) enables the controller to be powered off of an auxiliary 12-V supply.
The VREF GOOD comparator assures that the MOSFET driver output remains low if the supply of the 7.5 Vreference are not yet up. This improvement eliminates the need for external Schottky diodes on the PKLMT andMult Out pins that some UC3854 designs require. The propagation delay of the disable feature has beenimproved to 300 ns typical. This delay was proportional to the size of the VREF capacitor on the UC3854, and istypically several orders of magnitude slower.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
TYPICAL CHARACTERISTICS
0
0
100
300
400
500
600
800
200
700
0.01 0.02 0.03 0.04 0.05
GATE DRIVE TIMING
vs
LOAD CAPACITANCE
CLOAD − Load Capacitance − µF
t− Time − ns
Rise Time
Fall Time
0
0.84
0.80 50 100
0.88
0.96
0.92
1.00
1.04
1.08
1.16
1.12
1.20
150 200 250
MULTIPLIER GAIN CONSTANT
vs
SUPPLY CURRENT
IAC − Supply Current − µA
K− Multiplier Gain Constant− V
VRMS = 3 V
VRMS = 5 V
VRMS = 1.5 V
VA Out = 3.5 V
MULTIPLIER GAIN CONSTANT
vs
SUPPLY CURRENT
IAC − Supply Current − µA
0
0.84
0.80 50 100
0.88
0.96
0.92
1.00
1.04
1.08
1.16
1.12
1.20
150 200 250
VRMS = 1.5 V
VRMS = 1.5 V
VRMS = 5 V
K− Multiplier Gain Constant− V
VA Out = 5 V
UC1854A
UC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
Figure 1. Figure 2.
Figure 3. Figure 4.
10 Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
www.ti.com
0
−20
40
20
60
80
100
120
100 1000 10 k 100 k 1 M 10 M
VOLTAGE AMPLIFIER GAIN
vs
FREQUENCY
GAIN
PHASE
f − Frequency − Hz
Gain − dB
0
−20
40
20
60
80
100
120
Phase − °
10 k
−60 100 k
−40
0
20
60
80
100
120
1 M 10 M
−20
40
140
CURRENT AMPLIFIER GAIN
vs
FREQUENCY
GAIN
fCO = 5.992 MHz
f − Frequency − Hz
Gain − dB
PHASE
−90
−45
−0
Phase − °
OSCILLATOR FREQUENCY
vs
LIMIT SET RESISTANCE AND
TIMING CAPACITANCE
RSET − Multiplier Limit Set Resistance − kΩ
fOSC − Oscillator Frequency − kHz
1
010 100
10
100
1 k
10 nF
5 nF 2 nF
3 nF
1 nF
500 pF
200 pF 100 pF
UC1854AUC2854A, UC2854BUC3854A, UC3854B
SLUS329E – MONTH 2003 – REVISED JANUARY 2008
TYPICAL CHARACTERISTICS (continued)
Figure 5. Figure 6.
Figure 7.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): UC1854A UC2854A, UC2854B UC3854A, UC3854B
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9326102M2A OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125
5962-9326102MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9326102ME
A
UC1854BJ/883B
UC1854BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1854BJ
UC1854BJ883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9326102ME
A
UC1854BJ/883B
UC1854BL OBSOLETE TO/SOT L 20 TBD Call TI Call TI -55 to 125
UC1854BL883B OBSOLETE TO/SOT L 20 TBD Call TI Call TI -55 to 125
UC2854ADW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854ADW
UC2854ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854ADW
UC2854ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854ADW
UC2854ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854ADW
UC2854AN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2854AN
UC2854ANG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2854AN
UC2854BDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854BDW
UC2854BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854BDW
UC2854BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854BDW
UC2854BDWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2854BDW
UC2854BN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2854BN
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
UC2854BNG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2854BN
UC2854BQ ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2854BQ
UC2854BQG3 ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2854BQ
UC2854J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2854J
UC3854ADW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854ADW
UC3854ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854ADW
UC3854ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854ADW
UC3854ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854ADW
UC3854AN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3854AN
UC3854ANG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3854AN
UC3854BDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854BDW
UC3854BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854BDW
UC3854BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854BDW
UC3854BDWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3854BDW
UC3854BN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3854BN
UC3854BNG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3854BN
UC3854BQ OBSOLETE UTR 20 TBD Call TI Call TI 0 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1854B, UC2854B, UC2854M, UC3854A, UC3854B :
•Catalog: UC3854B, UC2854
•Enhanced Product: UC2854B-EP
•Military: UC2854BM, UC1854A, UC1854B
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC3854ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC3854ADWTR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Mar-2013
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated