512K x 32 SRAM MODULE PUMA 2/77S16000/A - 020/025/35 11403 West Bernado Court, Suite 100, San Diego, CA 92127. Tel No: (619) 674 2233, Fax No: (619) 674 2230 Issue 4.2 : November 1998 Description 16,777,216 bit CMOS High Speed Static RAM Available in PGA (PUMA 2 ) and Gullwing (PUMA 77) Features footprints, the PUMA **S16000 is a 16 MBit SRAM * 16MBit Fast SRAM Module. module user configurable as 512K x 32, 1M x 16 or 2M * Fast Access times of 20/25/35ns. x 8. The device is available with fast access times of * Configurable as 8 / 16 / 32 bit wide output. 20,25 and 30ns. A low power standby and Data Retention mode is available. The device may be * Operating Power 2130 / 2800 / 4150 mW (max). Standby CMOS 220mW (max). screened in accordance with MIL-STD-883. * Low voltage data retention. * Single 5V10% Power supply. * TTL compatible inputs and outputs. * May be screened in accordance with MIL-STD-883. * PUMA 2 - 66 pin ceramic PGA * PUMA77 - 68 pin ceramic Gullwing Block Diagram Block Diagram PUMA 2S16000 and 77S16000A PUMA 77S16000 A0~A18 A0~A18 OE WE OE WE4 WE3 WE2 WE1 512K x 8 512K x 8 SRAM 512K x 8 512K x 8 512K x 8 SRAM SRAM SRAM CS1 CS2 CS3 CS4 D0~7 D8~15 D16~23 D24~31 SRAM 512K x 8 SRAM 512K x 8 512K x 8 SRAM SRAM CS1 CS2 CS3 CS4 D0~7 D8~15 D16~23 D24~31 Pin Functions A0~A18 CS1~4 WE1~4 VCC Address Inputs Chip Select Write Enable Power (+5V) D0~D31 OE NC GND Data Inputs/Outputs Output Enable No Connect Ground ISSUE 4.2 : November 1998 PUMA 2/77S16000/A - 020/025/35 DC OPERATING CONDITIONS Absolute Maximum Ratings (1) Voltage on any pin relative to Vss (2) Power Dissipation Storage Temperature Notes VT -0.5V to +7.0 PD 4 TSTG -55 to +150 V W C (1) Stresses above those listed may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (2) Pulse width:- 3.0V for less than 10ns. Recommended Operating Conditions Parameter Symbol min Supply Voltage VCC 4.5 Input High Voltage VIH 2.2 Input Low Voltage VIL -0.5 Operating Temperature TA 0 TAI -40 TAM -55 typ 5.0 - max 5.5 VCC+0.5 0.8 70 85 125 units V V V C C (Suffix I) C (Suffix M, MB) DC Electrical Characteristics (VCC=5V10%,TA=-55C to +125C) Parameter Symbol Test Condition Input Leakage Current Address,OE WE, CS Output Leakage Current ILI1 ILI2 ILO VIN = 0V to VCC VIN = 0V to VCC CS(2) = VIH or OE = VIH, VI/O = 0V to VCC min typ(1) max Unit -8 -2 -8 - 8 2 8 A A A - - 720 480 360 mA mA mA - - 240 40 mA mA 2.4 - 0.4 - V V WE(2) = VIL Average Supply Current 32 bit ICC32 CS(2)=VIL, Minumum cycle, II/O = 0mA WE(2)=VIL or WE(2)=OE=VIH, 100% duty. 16 bit 8 bit ICC16 ICC8 As above Standby Supply Current TTL levels CMOS levels ISB ISB1 CS(2) = VIH ,VCC=5.5V Output Voltage Low Output Voltage High VOL VOH IOL = 8.0 mA As above CS(2) VCC-0.2V, 0.2V VIN VCC-0.2V IOH = -4.0 mA Notes: (1) Typical values are at VCC=5.0V,TA=25C and specified loading. (2) CS and WE above are accessed through CS1~4 and WE1~4 respectively. These inputs must be operated simultaneously for 32 bit mode, in pairs for 16 bit mode and singly for 8 bit mode. 2 PUMA 2/77S16000 - 020/025/35 ISSUE 4.2 : November 1998 Capacitance (VCC=5V10%,TA=25C) Note: These parameters are calculated and not measured. Parameter Symbol Input Capacitance Address, OE WE1~4, CS1~4 I/O Capacitance D0~31 CIN1 CIN2 CI/O Test Condition typ VIN =0V VIN =0V VI/O=0V - max Unit 34 6 42 pF pF pF (8 bit mode) Operating Modes The Table below shows the logic inputs required to control the operating modes of each of the SRAMs on the device. Mode CS OE WE Not Selected 1 X X Output Disable 0 1 Read 0 Write 0 VCC Current I/O Pin Reference Cycle ISB1,ISB2 High Z Power Down 1 ICC High Z 0 1 ICC DOUT Read cycle X 0 ICC DIN Write Cycle 1 = VIH, 0 = VIL, X = Don't Care Note: CS above is accessed through CS1~4 and WE is accessed through WE1~4. For correct operation, CS1~ 4 and WE1~4 must operate simultaneously for 32 bit operation, in pairs for 16 bit operation, or singly for 8 bit operation. Low Vcc Data Retention Characteristics - L Version Only (TA=-55C to +125oC) Parameter VCC for Data Retention Data Retention Current Symbol Test Condition VDR ICCDR min typ max Unit 2.0 - 5.5 V 0 5 - 28 - mA ns ms CS1~4 VCC-0.2V VCC = 3.0V, CS1~4 VCC-0.2V, 0.2V VIN VCC-0.2V Chip Deselect to Data Retention tCDR Operation Recovery Time tR See Retention Waveform See Retention Waveform AC Test Conditions Output Load I/O Pin *Input pulse levels: 0.0V to 3.0V *Input rise and fall times: 3 ns *Input and Output timing reference levels: 1.5V *Vcc=5V10% *PUMA module is tested in 32 bit mode. 166 1.76V 30pF 3 ISSUE 4.2 : November 1998 PUMA 2/77S16000/A - 020/025/35 AC OPERATING CONDITIONS Read Cycle Parameter Symbol Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Output Hold from Address Change Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z(3) Output Disable to Output in High Z(3) tRC tAA tACS tOE tOH tCLZ tOLZ tCHZ tOHZ 020 min max 025 min max min 20 5 5 5 0 25 5 5 0 0 0 35 5 5 0 0 0 20 20 10 10 10 25 25 15 10 10 35 max 35 35 15 10 10 Units ns ns ns ns ns ns ns ns ns Write Cycle Parameter Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Active from End of Write 020 Symbol min max tWC tCW tAW tAS tWP tWR tWHZ tDW tDH tOW 20 15 15 0 15 0 0 10 0 5 10 - 4 025 min max min 25 15 15 0 15 0 0 10 0 5 35 15 15 0 15 0 0 10 0 5 10 - 35 max Unit 10 - ns ns ns ns ns ns ns ns ns ns PUMA 2/77S16000 - 020/025/35 ISSUE 4.2 : November 1998 Read Cycle Timing Waveform (1,2) t RC Address t AA OE t OE t OH t OLZ t CLZ CS1~4 t ACS t CHZ(3) t OHZ(3) High-Z D0~31 Data Valid Notes: (1) During the Read Cycle, WE is high for the module. (2) Address valid prior to or coincident with CS transition Low. (3) tCHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. These parameters are sampled and not 100% tested. Write Cycle No.1 Timing Waveform t WC A0~A18 OE t AS(3) t AW tWR t CW(4) (2) (6) CS1~4 t WP(1) WE1~4 t OHZ(3,9) D0~31out D0~31in t OW High-Z t DW High-Z 5 t DH ISSUE 4.2 : November 1998 PUMA 2/77S16000/A - 020/025/35 Write Cycle No.2 Timing Waveform (5) t WC A0~A18 tCW CS1~4 (4) (6) t AW t WP(1) WE1~4 t WR(2) t AS(3) t OH t WHZ(3,9) t OW (8) (7) High-Z D0~31out t DW tDH High-Z D0~31in AC Characteristics Notes (1) A write occurs during the overlap (tWP) of a low CS and a low WE. (2) tWR is measured from the earlier of CS or WE going high to the end of write cycle. (3) During this period, I/O pins are in the output state. Input signals out of phase must not be applied. (4) If the CS low transition occurs simultaneously with the WE low transition or after the WE low transition, outputs remain in a high impedance state. (5) OE is continuously low. (OE=VIL) (6) DOUT is in the same phase as written data of this write cycle. (7) DOUT is the read data of next address. (8) If CS is low during this period, I/O pins are in the output state. Input signals out of phase must not be applied. (9) tWHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. These parameters are sampled and not 100% tested. Low VCC Data Retention Timing Waveform DATA RETENTION MODE Vcc 4.5V 4.5V t CDR tR 2.2V 2.2V V DR CS1~4 Vcc-0.2V CS1~4 0V 6 PUMA 2/77S16000 - 020/025/35 ISSUE 4.2 : November 1998 Package Details PUMA 77S16000 25.15 (0.990) sq. 24.67 (0.970) sq. 24.13 (0.950) sq. 23.62 (0.930) sq. 1.27 (0.050) 0.43 (0.017) 20.57 (0.810) sq. 20.10 (0.790) sq. 0.76 (0.030) 1.78 (0.070) 22.61 (0.890) sq. 22.10 (0.870) sq. 5.44 (0.214) max 0.10 (0.004) PUMA 2S16000 27.69 (1.090) square 2.54 (0.010) 4.83 (0.190) 4.32 (0.170) 27.08 (1.066) square 15.24 (0.60) typ 3.81 (0.150) ref 0.53 (0.021) 0.38 (0.015) 1.27 (0.050) 1.27 (0.050) 1.66 (0.026) LEAD FINISH IS 300 INCH MINIMUM SOLDER OVER 50 TO 350 INCH NICKEL 6.86 (0.270) max 1.52 (0.060) 1.02 (0.040) 7 2.54 (0.010) 10.67 (0.420) 10.16 (0.400) Pin Definitions 57 D19 D4 14 56 D20 D5 15 D21 D6 16 VIEW 55 54 D22 D7 17 53 D23 GND FROM 18 52 GND D8 19 51 D24 D9 20 50 D25 D10 21 49 D26 D11 22 48 D27 D12 23 47 D28 D13 24 46 D29 D14 25 45 D30 D15 26 44 D31 D20 D5 15 55 D21 54 53 D22 52 GND 51 D24 D23 D9 20 50 D25 D10 21 49 D26 D11 22 48 D27 D12 23 47 D28 D13 24 46 D29 D14 25 45 D30 D15 26 44 D31 1 12 23 34 45 56 D8 2 WE2 13 D15 24 D24 35 VCC 46 D31 57 D9 3 CS2 14 D14 25 D25 36 D10 4 GND 15 D13 26 D26 37 CS4 47 WE4 48 D30 58 D29 59 A13 5 D11 16 D12 27 A6 38 D27 49 D28 60 A14 6 A10 17 OE 28 A7 39 A3 50 A0 61 A15 A11 18 A17 29 NC 40 A4 51 A1 62 A16 8 A12 WE1 19 30 A8 41 A5 52 A18 9 VCC 20 31 A9 42 WE3 53 A2 63 D23 64 D0 10 CS1 21 D1 NC D5 D16 43 D17 CS3 54 GND D22 65 D21 11 22 33 D2 D3 D4 44 D18 55 D19 66 D20 D6 32 NC GND A18 WE3 WE4 A17 WE2 OE CS2 CS1 A16 Vcc A11 PUMA 2S16000 D7 ABOVE 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 NC GND A18 NC NC NC A17 OE CS2 CS1 A16 A15 A14 A13 A12 Vcc A11 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 7 A10 13 56 VIEW FROM ABOVE Vcc D18 D3 14 ABOVE A9 58 D4 19 A8 12 D19 D8 A7 D17 D2 57 18 CS4 59 13 GND WE1 A6 11 D3 FROM GND D16 D1 58 D7 A5 60 59 12 16 17 CS3 10 D18 D6 A4 D0 D17 D2 VIEW A2 D16 A15 11 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 60 A14 D1 A13 10 A3 NC A0 A1 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 D0 A12 A10 Vcc A9 A8 A7 CS4 PUMA 77S16000A WE A6 GND A5 CS3 A4 A2 A3 NC A0 A1 PUMA 77S16000 Military Screening Procedure MultiChip Screening Flow for high reliability product in accordance with Mil-883 method 5004 shown below MB MULTICHIP MODULE SCREENING FLOW SCREEN TEST METHOD LEVEL 2017 Condition B or manufacturers equivalent 1010 Condition B (10 Cycles,-55C to +125C) 2001 Condition E (Y1 only) (10,000g) 100% 100% 100% Pre-Burn-in electrical Burn-in Per applicable device specifications at TA=+25C Method 1015,Condition D,TA=+125C,160hrs min 100% 100% Final Electrical Tests Per applicable Device Specification Static (dc) a) @ TA=+25C and power supply extremes b) @ temperature and power supply extremes 100% 100% Functional a) @ TA=+25C and power supply extremes b) @ temperature and power supply extremes 100% 100% Switching (ac) a) @ TA=+25C and power supply extremes b) @ temperature and power supply extremes 100% 100% Percent Defective allowable (PDA) Calculated at post burn-in at TA=+25C 10% Visual and Mechanical Internal visual Temperature cycle Constant acceleration Burn-In Hermeticity 1014 Fine Gross Condition A Condition C 100% 100% Quality Conformance Per applicable Device Specification Sample External Visual 2009 Per vendor or customer specification 100% ISSUE 4.2 : November 1998 PUMA 2/77S16000/A - 020/025/35 Ordering Information PUMA 2S16000AMB-020 Speed 020 025 35 = = = 20 ns 25 ns 35 ns Temp. range/screeningBlank I M MB = = = = Commercial Temperature Industrial Temperature Military Temperature May be processed in accordance with MIL-STD-883 WE Option Blank = A = Single WE (PUMA 77 only) WE1~4 (PUMA 2 only) WE1~4(PUMA 77 only) 16000 = 512Kx 32, user confiurable as 1M x 16 and 2M x 8 S = SRAM MEMORY PUMA 2 = JEDEC 66 Pin Ceramic PGA package PUMA 77 = JEDEC 68 Leaded Gull Wing Ceramic Surface Mount package Organisation Technology Package Note : Although this data is believed to be accurate, the information contained herein is not intended to and does not create any warranty of merchantibility or fitness for a particular purpose. Our products are subject to a constant process of development. Data may be changed at any time without notice. Products are not authorised for use as critical components in life support devices without the express written approval of a company director. 10