TBD62783APG/FG/FNG/FWG
2016-05-11
1
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TBD62783APG, TBD62783AFG, TBD62783AFNG, TBD62783AFWG
8channel source type DMOS transistor array
TBD62783A series are DMOS transistor array with 8
circuits. It has a clamp diode for switching inductive loads
built-in in each output. Please be careful about thermal
conditions during use.
Features
• 8 circuits built-in
• High voltage : VOUT = 50 V (MAX)
• High current : IOUT = -500 mA
(MAX for each channel)
• Input voltage(output on) : 2.0 V (MIN)
• Input voltage(output off) : 0.6 V (MAX)
• Package : PG type P-DIP18-300-2.54-001
FG type SOP18-P-375-1.27
FNG type SSOP18-P-225-0.65
FWG type P-SOP18-0812-1.27-001
Pin connection (top view)
Pin connection may be simplified for explanatory purpose.
TBD62783APG
P-DIP18-300-2.54-001
TBD62783AFG
TBD62783AFNG
TBD62783AFWG
P-SOP18-0812-1.27-001
Weight
P
-DIP18-300-2.54-001 : 1.3g (Typ.)
SOP18
-P-375-1.27 : 0.41g (Typ.)
SSOP18
-P-225-0.65 : 0.09g (Typ.)
P-SOP18-0812-1.27-001
: 0.48g (Typ.)
© 2016 TOSHIBA Corporation
TBD62783APG/FG/FNG/FWG
2016-05-11
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Pin explanations
Pin No. Pin name Function
1
I1
Input pin
2
I2
Input pin
3
I3
Input pin
4
I4
Input pin
5
I5
Input pin
6
I6
Input pin
7
I7
Input pin
8
I8
Input pin
9
VCC
Power supply pin
10
GND
GND pin
11
O8
Output pin
12
O7
Output pin
13
O6
Output pin
14
O5
Output pin
15
O4
Output pin
16
O3
Output pin
17
O2
Output pin
18
O1
Output pin
Equivalent circuit (each driver)
Equivalent circuit may be simplified for explanatory purpose.
VCC
OUTPUT
Clamp
diode
Clamp
INPUT
Clamp
TBD62783APG/FG/FNG/FWG
2016-05-11
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Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Power supply voltage
V
CC
−0.5 to 50
V
Output current
(for each channel) IOUT −500 mA
Input voltage
V
IN
−0.5 to 30
V
Clamp diode reverse voltage
V
R
50
V
Clamp diode forward current
I
F
500
mA
Power
dissipation
PG (Note1)
PD
1.47
W
FG (Note2)
0.96
FNG (Note3)
0.96
FWG (Note4)
1.31
Operating temperature
T
opr
−40 to 85
°C
Storage temperature
T
stg
−55 to 150
°C
Note1: Device alone. When Ta exceeds 25°C, it is necessary to do the derating with 11.8 mW/°C.
Note2: Device alone. When Ta exceeds 25°C, it is necessary to do the derating with 7.7 mW/°C.
Note3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).
When Ta exceeds 25°C, it is necessary to do the derating with 7.7 mW/°C.
Note4: On PCB (Size: 75 mm × 114 mm × 1.6 mm, Cu area: 20%, single-side glass epoxy).
When Ta exceeds 25°C, it is necessary to do the derating with 10.48 mW/°C.
TBD62783APG/FG/FNG/FWG
2016-05-11
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Operating Ranges (Ta = −40 to 85°C)
Characteristics Symbol Condition Min Typ. Max Unit
Power supply voltage
V
CC
I
OUT
= -100 mA
2.0
―
50
V
Output
current
(for each
channel)
PG
(Note1)
IOUT
1 circuits ON, Ta = 25°C
0
―
-400
mA
tpw = 25 ms
8 circuits ON
Ta = 85°C
Tj = 120°C
Duty = 10%
0
―
-390
Duty = 50% 0 ― -170
FG
(Note1)
1 circuits ON, Ta = 25°C
0
―
-400
tpw = 25 ms
8 circuits ON
Ta = 85°C
Tj = 120°C
Duty = 10%
0
―
-320
Duty = 50% 0 ― -140
FNG
(Note2)
1 circuits ON, Ta = 25°C
0
―
-400
tpw = 25 ms
8 circuits ON
Ta = 85°C
Tj = 120°C
Duty = 10%
0
―
-320
Duty = 50% 0 ― -140
FWG
(Note3)
1 circuits ON, Ta = 25°C
0
―
-400
t
pw
= 25 ms
8 circuits ON
Ta = 85°C
Tj = 120°C
Duty = 10%
0
―
-370
Duty = 50% 0 ― -160
Input voltage
(Output on) VIN (ON) IOUT = -100 mA or upper, VDS = 2.0 V 2.0 ― 25 V
Input voltage
(Output off) VIN (OFF) IOUT = -100 μA or less, VDS = 2.0 V 0 ― 0.6 V
Clamp diode
forward current IF ― ― ― 400 mA
Note1: Device alone.
Note2: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).
Note3: On PCB (Size: 75 mm × 114 mm × 1.6 mm, Cu area: 20%, single-side glass epoxy).
TBD62783APG/FG/FNG/FWG
2016-05-11
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Electrical Characteristics (Ta = 25°C unless otherwise noted)
Characteristics Symbol
Test
Circuit
Condition Min Typ. Max Unit
Output leakage current Ileak 1 VCC = 50 V, VIN = 0 V
Ta = 85°C ― ― 1.0 μA
Output voltage
(Output ON-resistance)
VDS
(RON) 2
IOUT = -350 mA
VIN = 5.0 V, VCC = 5.0 V ― 0.56
(1.6)
1.14
(3.25)
V
(Ω)
IOUT = -200 mA
VIN = 5.0 V, VCC = 5.0 V ― 0.32
(1.6) 0.65
(3.25)
IOUT = -100 mA
VIN = 5.0 V, VCC = 5.0 V ― 0.16
(1.6) 0.325
(3.25)
Input current (Output on) IIN (ON) 3 VIN = 2.0 V ― ― 0.1 mA
Input current (Output off) IIN (OFF) 4 VIN = 0 V, Ta = 85°C ― ― 1.0 μA
Input voltage (Output on) VIN (ON) 5 IOUT = -100 mA or upper
VDS = 2.0 V ― ― 2.0 V
Supply current
(for each channel) ICC 3 VIN = 2.0 V, VCC = 50 V
Output open ― ― 1.5 mA
Clamp diode
reverse current
IR 6 VR = 50 V, Ta = 85°C ― ― 1.0 μA
Clamp diode
forward voltage
VF 7 IF = 350 mA ― ― 2.0 V
Turn−on delay tON
8
VCC = 50 V
RL = 125 Ω
CL = 15 pF
― 0.4 ―
μs
Turn−off delay tOFF ― 2.0 ―
TBD62783APG/FG/FNG/FWG
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Test circuit
1. Ileak 2. VDS (RON)
3. IIN (ON), ICC 4. IIN (OFF)
5. VIN (ON) 6. IR
7. VF
Test circuit may be simplified for explanatory purpose.
Ileak
OUTPUT
INPUT
GND
VCC
VCC
IOUT
OUTPUT
INPUT
GND
VCC
VCC
VIN
RON = VDS / IOUT
VDS
VCC
OUTPUT
INPUT
GND
VCC
VIN
IIN(ON)
ICC
IF
OUTPUT
INPUT
GND
VCC
VF
VCC
VCC
OUTPUT
INPUT
GND
VIN
IIN(OFF)
VCC
OUTPUT
INPUT
GND
VCC
VIN
IOUT
VDS
VCC
IR
OUTPUT
INPUT
GND
VCC
VR
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8. tON, tOFF
Note 1: Pulse width 50 μs, Duty cycle 10%
Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns, VIH = 5.0 V
Note 2: CL includes the probe and the test board capacitance.
Test circuit and timing chart may be simplified for explanatory purpose.
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage. Therefore, if the
short−circuit between adjacent pins or between outputs, the short-to-power or ground fault has
occurred, the current or voltage beyond the absolute maximum rating is impressed, and IC destroys.
When designing, please consider enough in power supply line, output line and GND line. In addition, so
as not to continue to flow a current that exceeds the absolute maximum rating of the IC, please insert
the appropriate fuse in the power supply line.
(注2)
(注1)
Input
C
L
(
Note2)
(Note1)
Pulse
generator
VCC
RL
Output
tON
tOFF
VIH
VOH
VOL
Input
50%
50 μs
Output
50%
50%
50%
0
TBD62783APG/FG/FNG/FWG
2016-05-11
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Package Dimensions
P-DIP18-300-2.54-001 Unit: mm
Weight: 1.3 g (Typ.)
SOP18-P-375-1.27 Unit: mm
Weight: 0.41 g (Typ.)
TBD62783APG/FG/FNG/FWG
2016-05-11
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Package Dimensions
SSOP18-P-225-0.65 Unit: mm
Weight: 0.09 g (Typ.)
P-SOP18-0812-1.27-001 Unit: mm
Weight: 0.48 g (Typ.)
TBD62783APG/FG/FNG/FWG
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Notes on Contents
1. Pin connection
Pin connection may be simplified for explanatory purpose.
2. Equivalent Circuits
Equivalent circuit may be simplified for explanatory purpose.
3. Timing chart
Timing charts may be simplified for explanatory purposes.
4. Test circuit
Test circuit may be simplified for explanatory purpose.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage
or deterioration, and may result in injury by explosion or combustion.
(2) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals
of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute
maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may
result in injury by explosion or combustion.In addition, do not use any device inserted in the wrong orientation
or incorrectly to which current is applied even just once.
(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of
overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To
minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power
supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as
from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is
connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition.
(The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using
a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the
effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction,stops or slows abruptly, current flows back to the motor’s power supply
owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power
supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem,
take the effect of back-EMF into consideration in system design.
TBD62783APG/FG/FNG/FWG
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RESTRICTIONS ON PRODUCT USE
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and
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