IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Motion Processing Unit Product Specification Rev 1.1 1 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 CONTENTS 1 DOCUMENT INFORMATION .............................................................................................................................. 4 1.1 1.2 1.3 1.4 2 FEATURES ............................................................................................................................................................... 7 2.1 2.2 2.3 2.4 2.5 2.6 3 REVISION HISTORY ............................................................................................................................................. 4 PURPOSE AND SCOPE ........................................................................................................................................... 5 PRODUCT OVERVIEW .......................................................................................................................................... 5 APPLICATIONS ..................................................................................................................................................... 6 SENSORS.............................................................................................................................................................. 7 DIGITAL OUTPUT................................................................................................................................................. 7 MOTION PROCESSING .......................................................................................................................................... 7 CLOCKING ........................................................................................................................................................... 7 POWER ................................................................................................................................................................ 7 PACKAGE ............................................................................................................................................................ 7 ELECTRICAL CHARACTERISTICS .................................................................................................................. 8 3.1 SENSOR SPECIFICATIONS ..................................................................................................................................... 8 GYRO MECHANICAL FREQUENCIES....................................................................................................................... 8 3.2 3.3 3.4 3.5 3.6 4 APPLICATIONS INFORMATION ..................................................................................................................... 14 4.1 4.2 4.3 4.4 5 BLOCK DIAGRAM .............................................................................................................................................. 17 OVERVIEW ........................................................................................................................................................ 17 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ......................................... 17 DIGITAL MOTION PROCESSOR ........................................................................................................................... 17 PRIMARY I2C SERIAL COMMUNICATIONS INTERFACE ....................................................................................... 18 SECONDARY I2C SERIAL INTERFACE FOR THIRD-PARTY ACCELEROMETER ....................................................... 18 CLOCKING ............................................................................................................................................................ 19 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 7 PIN OUT AND SIGNAL DESCRIPTION .................................................................................................................. 14 TYPICAL OPERATING CIRCUIT ........................................................................................................................... 15 BILL OF MATERIALS FOR EXTERNAL COMPONENTS .......................................................................................... 15 RECOMMENDED POWER-ON PROCEDURE .......................................................................................................... 16 FUNCTIONAL OVERVIEW ................................................................................................................................ 17 5.1 5.2 5.3 5.4 5.5 5.6 6 ELECTRICAL SPECIFICATIONS.............................................................................................................................. 9 ELECTRICAL SPECIFICATIONS, CONTINUED ....................................................................................................... 10 ELECTRICAL SPECIFICATIONS, CONTINUED ....................................................................................................... 11 I2C TIMING CHARACTERIZATION ...................................................................................................................... 12 ABSOLUTE MAXIMUM RATINGS ........................................................................................................................ 13 INTERNAL CLOCK GENERATION ........................................................................................................................ 19 CLOCK OUTPUT ................................................................................................................................................. 19 SENSOR DATA REGISTERS ................................................................................................................................. 19 FIFO ................................................................................................................................................................. 19 INTERRUPTS ...................................................................................................................................................... 19 DIGITAL-OUTPUT TEMPERATURE SENSOR ........................................................................................................ 20 BIAS AND LDO.................................................................................................................................................. 20 CHARGE PUMP .................................................................................................................................................. 20 DIGITAL INTERFACE ........................................................................................................................................ 21 7.1 7.2 7.3 I2C SERIAL INTERFACE ...................................................................................................................................... 21 SUPPORTED INTERFACES ................................................................................................................................... 24 LOGIC LEVELS ................................................................................................................................................... 24 2 of 56 IMU-3000 Product Specification 8 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 MOTION PROCESSING LIBRARY (MPL) ...................................................................................................... 27 8.1 9 DEMO SOFTWARE .............................................................................................................................................. 28 REGISTER MAP ................................................................................................................................................... 29 10 REGISTER DESCRIPTION ............................................................................................................................. 30 10.1 10.2 10.3 10.4 10.5 10.6 10.7 10.8 10.9 10.10 10.11 10.12 10.13 10.14 10.15 10.16 11 ASSEMBLY ........................................................................................................................................................ 43 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 11.9 11.10 11.11 11.12 11.13 11.14 12 12.1 12.2 13 REGISTER 0 - WHO AM I ................................................................................................................................... 30 REGISTERS 12 TO 17 - GYRO OFFSETS .............................................................................................................. 30 REGISTER 18 - FIFO ENABLE ........................................................................................................................... 31 REGISTERS 19 - AUX (ACCEL) VDDIO............................................................................................................ 31 REGISTER 20 - AUX (ACCEL) SLAVE ADDRESS................................................................................................ 32 REGISTER 21 - SAMPLE RATE DIVIDER ............................................................................................................. 32 REGISTER 22 - DLPF, FULL SCALE ................................................................................................................... 33 REGISTER 23 - INTERRUPT CONFIGURATION ..................................................................................................... 35 REGISTER 24 - AUX (ACCEL) BURST READ ADDRESS / SECONDARY I2C BUS I/O LEVEL ................................ 35 REGISTER 26 - INTERRUPT STATUS ............................................................................................................... 36 REGISTERS 27 TO 40 - SENSOR REGISTERS ................................................................................................... 37 REGISTERS 53 TO 57 - DMP REGISTERS........................................................................................................ 38 REGISTERS 58 TO 59 - FIFO COUNT.............................................................................................................. 38 REGISTER 60 - FIFO DATA ........................................................................................................................... 39 REGISTER 61 - USER CONTROL ..................................................................................................................... 41 REGISTER 62 - POWER MANAGEMENT .......................................................................................................... 42 ORIENTATION .................................................................................................................................................... 43 PCB LAYOUT GUIDELINES ................................................................................................................................ 44 TRACE ROUTING ............................................................................................................................................... 46 COMPONENT PLACEMENT ................................................................................................................................. 46 PCB MOUNTING AND CROSS-AXIS SENSITIVITY ............................................................................................... 47 MEMS HANDLING INSTRUCTIONS .................................................................................................................... 48 ESD CONSIDERATIONS...................................................................................................................................... 48 GYROSCOPE SURFACE MOUNT GUIDELINES...................................................................................................... 48 REFLOW SPECIFICATION .................................................................................................................................... 49 STORAGE SPECIFICATIONS ............................................................................................................................ 50 PACKAGE MARKING SPECIFICATION ............................................................................................................. 51 TAPE & REEL SPECIFICATION ........................................................................................................................ 51 LABEL ........................................................................................................................................................... 53 PACKAGING ................................................................................................................................................... 53 RELIABILITY ................................................................................................................................................... 54 QUALIFICATION TEST POLICY ........................................................................................................................... 54 QUALIFICATION TEST PLAN .............................................................................................................................. 54 ENVIRONMENTAL COMPLIANCE ............................................................................................................. 55 3 of 56 IMU-3000 Product Specification 1 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Document Information 1.1 Revision History Revision Date Revision Description 05/26/2010 1.0 Initial Release 08/19/2010 1.1 * Changes for readability (multiple sections) * Modified following specifications (Section 3.1) o ZRO Tolerance o ZRO Variation over Temperature o Total RMS Noise o Noise spectral density o Temperature Sensor Operating Range * Modified following specifications (Section 3.2) o Operating Current o Digital Input: Input Capacitance * Modified Capacitance for each IO Pin for Secondary I2C (Section 3.3) * Modified Clock Frequency Initial Tolerance for CLKSEL=0, 25C (Section 3.4). * Modified I2C Timing: Capacitive Load for Each Bus Line (Section 3.5) * Added Latch-up specification (Section 3.6). * Modified 3rd party accel /CS connection in diagram. (Section 7.3.1) * Added AUX register listing (Section 9). * Added AUX register description (Section 10.12). * Modified PCB Design Guidelines (Section 11.2.2). * Modified Reflow Specification (Section 11.9) * Added Environmental Compliance information (Section 13). 4 of 56 IMU-3000 Product Specification 1.2 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Purpose and Scope This document is a preliminary product specification, providing a description, specifications, and design related information for the IMU-3000TM Inertial Measurement Unit (IMUTM). The IMU-3000 MPL Functional Specification describes in detail the Motion Processing Library: API and System Layer routines needed for interfacing to the IMU-3000. Electrical characteristics are based upon simulation results and limited characterization data of advanced samples only. Specifications are subject to change without notice. Final specifications will be updated based upon characterization of final silicon. 1.3 Product Overview The IMU-3000 is the world's first IMU solution with 6-axis sensor fusion for consumer applications. The IMU-3000 has an embedded 3-axis gyroscope and Digital Motion ProcessorTM (DMPTM) hardware accelerator engine with a secondary I2C port that interfaces to third party digital accelerometers to deliver a complete 6-axis sensor fusion output to its primary I2C port. This combines both linear and rotational motion into a single data stream for the application. The device is ideally suited for a wide variety of consumer products requiring a rugged, low-cost motion processing solution for applications in game controllers, remote controls for broadband connected TVs and set top boxes, sports, fitness, medical and other applications. By providing an integrated sensor fusion output, the IMU-3000 offloads the intensive motion processing computation requirements from the host processor, reducing the need for frequent polling of the motion sensor output and enabling use of low cost, low power microcontrollers. The IMU-3000 features a 3-axis digital gyro with programmable full-scale ranges of 250, 500, 1000, and 2000 degrees/sec (dps), which is useful for precision tracking of both fast and slow motions. Rate noise performance sets the industry standard at 0.01 dps/Hz, providing the highestquality user experience in pointing and gaming applications. Factory-calibrated initial sensitivity reduces production-line calibration requirements. The part's on-chip FIFO and dedicated I2C-master accelerometer sensor bus simplify system timing and lower system power consumption; the sensor bus allows the IMU-3000 to directly acquire data from the off-chip accelerometer without intervention from an external processor, while the FIFO allows a system microcontrollers to burst read the sensor data and then go to sleep while the IMU collects more data. Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% variation from -40C to 85C, an embedded temperature sensor, programmable interrupts, and a low 13mW power consumption. Parts are available with an I2C serial interface, a VDD operating range of 2.1 to 3.6V, and a VLOGIC interface voltage from 1.71V to 3.6V. By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the IMU-3000 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging to address a wide range of handheld consumer electronic devices. The device provides the highest robustness by supporting 10,000g shock in operation. The highest cross-axis isolation is achieved by design from its single silicon integration. The IMU-3000 was designed to connect directly with a third-party 3-axis digital accelerometer, which slaves directly to the IMU-3000 master and can be clocked from the internal phase locked loop of the IMU-3000 device, providing highly accurate timing for a true 6-axis motion processing solution previously only available in costly and bulky inertial measurement units. 5 of 56 IMU-3000 Product Specification 1.4 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Applications * * * * * Game controllers 3D Remote controls for Internet connected TVs and Set Top Boxes Health and sports monitoring Motion tracking Gesture recognition and advanced user interfaces 6 of 56 IMU-3000 Product Specification 2 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Features The IMU-3000 Motion Processing Unit includes a wide range of features: 2.1 Sensors * X-, Y-, Z-Axis angular rate sensors (gyros) on one integrated circuit * Digital-output temperature sensor * 6-axis motion processing capability using secondary I2C interface to directly connect to a digital 3axis third-party accelerometer * Factory-calibrated scale factor * High cross-axis isolation via proprietary MEMS design * 10,000g shock tolerant 2.2 Digital Output * Fast Mode (400kHz) I2C serial interface * 16-bit ADCs for digitizing sensor outputs * Angular rate sensors (gyros) with applications-programmable full-scale-range of 250/sec, 500/sec, 1000/sec, or 2000/sec. 2.3 Motion Processing * Embedded Digital Motion ProcessingTM (DMPTM) engine supports 3D motion processing. When used together with a digital 3-axis third party accelerometer, the IMU-3000 collects the accelerometer data via a dedicated interface, while synchronizing data sampling at a user defined rate. The total data set obtained by the IMU-3000 includes 3-axis gyroscope data, 3-axis accelerometer data, and temperature data. * FIFO buffers complete data set, reducing timing requirements on the system processor and saving power by letting the processor burst read the FIFO data, and then go into a low-power sleep mode while the IMU collects more data. * Data collection polled or interrupt driven with on-chip programmable interrupt functionality * Programmable low-pass filters 2.4 Clocking * On-chip timing generator clock frequency 2% variation over full temperature range * Optional external clock inputs of 32.768kHz or 19.2MHz * 1MHz clock output to synchronize with digital 3-axis accelerometer 2.5 Power * VDD analog supply voltage range of 2.1V to 3.6V * Flexible VLOGIC reference voltage allows for I2C interface voltages from 1.71V to VDD * Power consumption with all three axis active: 6.1mA * Sleep mode: 5A * Each axis can be individually powered down 2.6 Package * 4x4x0.9mm QFN plastic package * MEMS structure hermetically sealed and bonded at wafer level * RoHS and Green compliant 7 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 3 Electrical Characteristics 3.1 Sensor Specifications Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V, TA=25C. Parameter GYRO SENSITIVITY Full-Scale Range Conditions Min Max Notes /s 2 % % Best fit straight line; 25C 0.2 2 % % 6 6 Power-Supply Sensitivity (1-10Hz) Power-Supply Sensitivity (10 - 250Hz) Power-Supply Sensitivity (250Hz 100kHz) Linear Acceleration Sensitivity 25C -40C to +85C Sine wave, 100mVpp; VDD=2.2V Sine wave, 100mVpp; VDD=2.2V Sine wave, 100mVpp; VDD=2.2V 20 0.1 0.2 0.2 4 /s /s/C /s /s /s 1 7 5 5 5 Static 0.1 /s/g 6 GYRO NOISE PERFORMANCE Total RMS Noise Rate Noise Spectral Density FS_SEL=0 DLPFCFG=2 (100Hz) At 10Hz 0.1 /s-rms 1 0.01 /s/Hz 3 kHz kHz kHz 1 1 1 50 ms 5 -30 to 85 280 -13200 1 C LSB/C LSB C 2 2 1 2 C 2 Sensitivity Scale Factor Tolerance Sensitivity Scale Factor Variation Over Temperature Nonlinearity Cross-Axis Sensitivity GYRO ZERO-RATE OUTPUT (ZRO) Initial ZRO Tolerance ZRO Variation Over Temperature 250 500 1000 2000 16 131 65.5 32.8 16.4 Unit 4 4 4 4 3 1 3 3 3 1 7 Gyro ADC Word Length Sensitivity Scale Factor FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3 Typical FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3 25C -3 GYRO MECHANICAL FREQUENCIES X-Axis Y-Axis Z-Axis GYRO START-UP TIME ZRO Settling TEMPERATURE SENSOR Range Sensitivity Room-Temperature Offset Linearity 30 27 24 DLPFCFG=0 to 1/s of Final Untrimmed o 35 C Best fit straight line (-30C to +85C) TEMPERATURE RANGE Specified Temperature Range Notes: 1. 2. 3. 4. 5. 6. 7. -40 Bits LSB/(/s) +3 33 30 27 36 33 30 85 Tested in production Based on characterization of 30 parts over temperature on evaluation board or in socket Based on design, through modeling and simulation across PVT Typical. Randomly selected part measured at room temperature on evaluation board or in socket Based on characterization of 5 parts over temperature Tested on 5 parts at room temperature Based on characterization of 48 parts on evaluation board or in socket 8 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 3.2 Electrical Specifications Typical Operating Circuit of Section 4.2, VDD = 2.5V, TA = 25C. Parameters VDD POWER SUPPLY Operating Voltage Range Ramp Rate Conditions Min Monotonic ramp. Ramp rate is 10% to 90% of the final value (see Figure in Section 4.4) Typical 2.1 0 Normal Operating Current Max Units Notes 3.6 5 V ms 2 2 mA mA A 1 1 4 6.1 5.9 5 DMP disabled Sleep Mode Current VLOGIC REFERENCE VOLTAGE (Must be regulated) Voltage Range Ramp Rate VLOGIC must be VDD at all times Monotonic ramp. Ramp rate is 10% to 90% of the final value (see Figure in Section 4.4) 1.71 Normal Operating Current 100 START-UP TIME FOR REGISTER READ/WRITE 20 VDD V 1 ms 3, 5 A 100 ms 4 2 I C ADDRESS AD0 = 0 AD0 = 1 1101000 1101001 1 1 DIGITAL INPUTS (AD0, CLKIN) VIH, High Level Input Voltage VIL, Low Level Input Voltage CI, Input Capacitance 0.7*VDD V V pF 5 5 V V V 2 2 2 100 nA 4 50 s 4 0.3*VDD <5 DIGITAL OUTPUT (INT) VOH, High Level Output Voltage VOL1, LOW-Level Output Voltage VOL.INT1, INT Low-Level Output Voltage Output Leakage Current RLOAD=1M RLOAD=1M OPEN=1, 0.3mA sink current OPEN=1 tINT, INT Pulse Width LATCH_INT_EN=0 Notes: 1. 2. 3. 4. 5. 0.9*VLOGIC 0.1*VLOGIC 0.1 Tested in production Based on characterization of 30 parts over temperature on evaluation board or in socket Typical. Randomly selected part measured at room temperature on evaluation board or in socket Based on characterization of 5 parts over temperature Refer to Section 4.4 for the recommended power-on procedure 9 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 3.3 Electrical Specifications, continued Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V, TA=25C. Parameters Conditions Typical Units Notes -0.5V to 0.3*VLOGIC 0.7*VLOGIC to VLOGIC + 0.5V 0.1*VLOGIC 0 to 0.4 3 5 100 20+0.1Cb to 250 < 10 V V 1 1 V V mA mA nA ns pF 1 1 1 1 2 1 V V 1 2 Primary I C I/O (SCL, SDA) VIL, LOW-Level Input Voltage VIH, HIGH-Level Input Voltage Vhys, Hysteresis VOL1, LOW-Level Output Voltage IOL, LOW-Level Output Current Output Leakage Current tof, Output Fall Time from VIHmax to VILmax CI, Capacitance for Each I/O pin 2 Secondary I C I/O (AUX_CL, AUX_DA) VIL, LOW-Level Input Voltage VIH, HIGH-Level Input Voltage Vhys, Hysteresis VOL1, LOW-Level Output Voltage VOL3, LOW-Level Output Voltage IOL, LOW-Level Output Current 3mA sink current VOL = 0.4V VOL = 0.6V Cb bus capacitance in pF AUX_VDDIO=0 VLOGIC > 2V; 1mA sink current VLOGIC < 2V; 1mA sink current VOL = 0.4V VOL = 0.6V Output Leakage Current tof, Output Fall Time from VIHmax to VILmax CI, Capacitance for Each I/O pin 2 Secondary I C I/O (AUX_CL, AUX_DA) VIL, LOW-Level Input Voltage VIH, HIGH-Level Input Voltage Vhys, Hysteresis VOL1, LOW-Level Output Voltage IOL, LOW-Level Output Current Output Leakage Current tof, Output Fall Time from VIHmax to VILmax CI, Capacitance for Each I/O pin Cb bus capacitance in pF -0.5V to 0.3*VLOGIC 0.7*VLOGIC to VLOGIC + 0.5V 0.1*VLOGIC 0 to 0.4 0 to 0.2*VLOGIC 1 V V V mA 1 100 20+0.1Cb to 250 < 10 mA nA ns pF 1 2 1 -0.5 to 0.3*VDD 0.7*VDD to VDD+0.5V 0.1*VDD 0 to 0.4 1 1 100 20+0.1Cb to 250 < 10 V V V V mA mA nA ns pF 1 1 1 1 1 AUX_VDDIO=1 1mA sink current VOL = 0.4V VOL = 0.6V Cb bus capacitance in pF 1 1 1 2 1 Notes: 1. Based on characterization of 5 parts over temperature 2. Typical. Randomly selected part measured at room temperature on evaluation board or in socket 10 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 3.4 Electrical Specifications, continued Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 2.5V, TA=25C. Parameters Conditions INTERNAL CLOCK SOURCE CLKSEL=0,1,2,3 Sample Rate, Fast DLPFCFG=0 SAMPLERATEDIV = 0 Sample Rate, Slow DLPFCFG=1,2,3,4,5, or 6 SAMPLERATEDIV = 0 Reference Clock Output Clock Frequency Initial Tolerance Frequency Variation over Temperature PLL Settling Time EXTERNAL 32.768kHz CLOCK External Clock Frequency External Clock Jitter Min CLKOUTEN = 1 CLKSEL=0, 25C CLKSEL=1,2,3; 25C CLKSEL=0 CLKSEL=1,2,3 CLKSEL=1,2,3 Typical Max Units Notes 8 kHz 3 1 kHz 3 -15 to +10 1 1 MHz % % % % ms 3 1 1 2 2 32.768 1 to 2 kHz s 1.024 -5 -1 +5 +1 CLKSEL=4 Cycle-to-cycle rms Sample Rate, Fast DLPFCFG=0 SAMPLERATEDIV = 0 8.192 kHz Sample Rate, Slow DLPFCFG=1,2,3,4,5, or 6 SAMPLERATEDIV = 0 1.024 kHz 1.0486 1 MHz ms 19.2 MHz Reference Clock Output PLL Settling Time CLKOUTEN = 1 EXTERNAL 19.2MHz CLOCK External Clock Frequency CLKSEL=5 Sample Rate, Fast DLPFCFG=0 SAMPLERATEDIV = 0 8 kHz Sample Rate, Slow DLPFCFG=1,2,3,4,5, or 6 SAMPLERATEDIV = 0 1 kHz 1.024 1 MHz ms Reference Clock Output PLL Settling Time CLKOUTEN = 1 Notes: 1. Tested in production 2. Based on characterization of 30 parts over temperature on evaluation board or in socket 3. Typical. Randomly selected part measured at room temperature on evaluation board or in socket 11 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 3.5 I2C Timing Characterization Typical Operating Circuit of Section 4.2, VDD = 2.5V, VLOGIC = 1.8V5%, 2.5V5%, 3.0V5%, or 3.3V5%, TA=25C. Parameters 2 I C TIMING fSCL, SCL Clock Frequency tHD.STA, (Repeated) START Condition Hold Time Conditions Min Typical Max Units Notes 400 kHz s 1 1 I2C FAST-MODE 0 0.6 tLOW, SCL Low Period tHIGH, SCL High Period tSU.STA, Repeated START Condition Setup Time 1.3 0.6 0.6 s s s 1 1 1 tHD.DAT, SDA Data Hold Time tSU.DAT, SDA Data Setup Time 0 100 s ns 1 1 300 ns 1 300 ns 1 s 1 s 1 pF s s 1 1 tr, SDA and SCL Rise Time tf, SDA and SCL Fall Time Cb bus cap. from 10 to 400pF Cb bus cap. from 10 to 400pF tSU.STO, STOP Condition Setup Time tBUF, Bus Free Time Between STOP and START Condition Cb, Capacitive Load for each Bus Line tVD.DAT, Data Valid Time tVD.ACK, Data Valid Acknowledge Time 20 +0.1Cb 20 +0.1Cb 0.6 1.3 < 400 0.9 0.9 Notes: 1. Based on characterization of 5 parts over temperature on evaluation board or in socket I2C Bus Timing Diagram 12 of 56 IMU-3000 Product Specification 3.6 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Absolute Maximum Ratings Stress above those listed as "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. Absolute Maximum Ratings Parameter Rating Supply Voltage, VDD -0.5V to +6V VLOGIC Input Voltage Level REGOUT -0.5V to VDD + 0.5V -0.5V to 2V Input Voltage Level (CLKIN, AUX_DA, AD0, INT, SCL, SDA) CPOUT (2.1V VDD 3.6V ) Acceleration (Any Axis, unpowered) -0.5V to VDD + 0.5V -0.5V to 30V 10,000g for 0.3ms Operating Temperature Range -40C to +105C Storage Temperature Range -40C to +125C Electrostatic Discharge (ESD) Protection 1.5kV (HBM); 200V (MM) 60mA @ 125C JEDEC Condition "B" Latch-up 13 of 56 IMU-3000 Product Specification 4 4.1 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Applications Information Pin Out and Signal Description Pin Number Pin Name 1 CLKIN Pin Description External reference clock input rd 6 AUX_DA Interface to a 3 party accelerometer, SDA pin. Logic levels are set to be either VDD or VLOGIC. See Section 7 for more details. 7 AUX_CL Interface to a 3 party accelerometer, SCL pin. Logic levels are set to be either VDD or VLOGIC. See Section 7 for more details. 8 VLOGIC 9 AD0 10 REGOUT Regulator filter capacitor connection 11 RESV-G Reserved - Connect to Ground. 12 INT Interrupt digital output (totem pole or open-drain) 13 VDD Power supply voltage and Digital I/O supply voltage 18 GND Power supply ground 19 RESV Reserved. Do not connect. 20 CPOUT 21 RESV 22 CLKOUT 23 SCL I C serial clock 24 SDA I C serial data 2, 3, 4, 5, 14, 15, 16, 17 NC rd Digital I/O supply voltage. VLOGIC must be VDD at all times. 2 I C Slave Address LSB Charge pump capacitor connection Reserved. Do not connect. 1MHz clock output for third-party accelerometer synchronization 2 2 Not internally connected. May be used for PCB trace routing. 14 of 56 IMU-3000 Product Specification 4.2 Typical Operating Circuit 4.3 Bill of Materials for External Components Component Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Label Specification Quantity VDD Bypass Capacitor C1 Ceramic, X7R, 0.1F 10%, 4V 1 Regulator Filter Capacitor C2 Ceramic, X7R, 0.1F 10%, 2V 1 Charge Pump Capacitor C3 Ceramic, X7R, 2.2nF 10%, 50V 1 VLOGIC Bypass Capacitor C4 Ceramic, X7R, 10nF 10%, 4V 1 15 of 56 IMU-3000 Product Specification 4.4 Recommended Power-on Procedure 16 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 5 5.1 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Functional Overview Block Diagram 5.2 Overview The IMU-3000 is comprised of the following key blocks / functions: * Three-axis MEMS rate gyroscope sensors with 16-bit ADCs and signal conditioning * Digital Motion Processor (DMP) * Primary I2C serial communications interface * Secondary I2C serial interface for 3rd party accelerometer * Clocking * Sensor Data Registers * FIFO * Interrupts * Digital-Output Temperature Sensor * Bias and LDO * Charge Pump 5.3 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning The IMU-3000 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X, Y, and Z axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors may be digitally programmed to 250, 500, 1000, or 2000 degrees per second (dps). ADC sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable lowpass filters enable a wide range of cut-off frequencies. 5.4 Digital Motion Processor The embedded Digital Motion Processor (DMP) is located within the IMU-3000 and offloads computation of motion processing algorithms from the host processor. The DMP acquires and processes data from the on17 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 chip gyroscopes and an external accelerometer. The resulting data can be read from IMU-3000's FIFO. The DMP has access to certain of the IMU's external pins, which can be used for synchronizing external devices to the motion sensors, or generating interrupts for the application. The purpose of the DMP is to offload both timing requirements and processing power from the host processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order to provide accurate results with low latency. This is required even if the application updates at a much lower rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should still run at 200Hz. The DMP can be used as a tool in order to minimize power, simplify timing and software architecture, and save valuable MIPS on the host processor for use in the application. 5.5 Primary I2C Serial Communications Interface The IMU-3000 communicates to a system processor using the I2C serial interface; the device always acts as a slave when communicating to the system processor. The logic level for communications to the master is set by the voltage on the VLOGIC pin. The LSB of the of the I2C slave address is set by pin 9 (AD0). 5.6 Secondary I2C Serial Interface for Third-Party Accelerometer The IMU-3000 has a secondary I2C bus for communicating to an off-chip 3-axis digital output accelerometer. This bus has two operating modes: I2C Master Mode, where the IMU-3000 acts as a master to an external accelerometer connected to the secondary I2C bus; and Pass-Through Mode, where the IMU-3000 directly connects the primary and secondary I2C buses together, to allow the system processor to directly communicate with the external accelerometer. Secondary I2C Bus Modes of Operation: * I2C Master Mode: allows the IMU-3000 to directly access the data registers of an external digital accelerometer. In this mode, the IMU-3000 directly obtains sensor data from an accelerometer thus allowing the on-chip DMP to generate sensor fusion data without intervention from the system applications processor. In I2C master mode, the IMU-3000 can be configured to perform burst reads, returning the following data from the accelerometer: X accelerometer data (2 bytes) Y accelerometer data (2 bytes) Z accelerometer data (2 bytes) * Pass-Through Mode: allows an external system processor to act as master and directly communicate to the external accelerometer connected to the secondary I2C bus pins (AUX_DA and AUX_CL). This is useful for configuring the accelerometer, or for keeping the IMU-3000 in a lowpower mode, when only the accelerometer is to be used. In this mode, the secondary I2C bus control logic (third-party accelerometer Interface block) of the IMU-3000 is disabled, and the secondary I2C pins AUX_DA and AUX_CL (Pins 6 and 7) are connected to the main I2C bus (Pins 23 and 24) through analog switches. Secondary I2C Bus I/O Logic Levels The logic levels of the secondary I2C bus can be programmed to be either VDD or VLOGIC (see Sections 7 and 8). 18 of 56 IMU-3000 Product Specification 6 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Clocking 6.1 Internal Clock Generation The IMU-3000 has a flexible clocking scheme, allowing for a variety of internal or external clock sources for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for generating this clock. Allowable internal sources for generating the internal clock are: * An internal relaxation oscillator * Any of the X, Y, or Z gyros (MEMS oscillators with a variation of 1% over temperature range) Allowable external clocking sources are: * 32.768kHz square wave * 19.2MHz square wave Which source to select for generating the internal synchronous clock depends on the availability of external sources and the requirements for power consumption and clock accuracy. Most likely, these requirements will vary by mode of operation. For example, in one mode, where the biggest concern is power consumption, one may wish to operate the Digital Motion Processor of the IMU-3000 to process accelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a moreaccurate clock source. Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed by the Digital Motion Processor (or by extension, by any processor). There are also start-up conditions to consider. When the IMU-3000 first starts up, the device operates off of its internal clock, until programmed to operate from another source. This allows the user, for example, to wait for the MEMS oscillators to stabilize before they are selected as the clock source. 6.2 Clock Output In addition, the IMU-3000 provides a clock output, which allows the device to operate synchronously with an external digital 3-axis accelerometer. Operating synchronously provides for higher-quality sensor fusion data, since the sampling instant for the sensor data can be set to be coincident for all sensors. 6.3 Sensor Data Registers The sensor data registers contain the latest gyro and temperature data. They are read-only registers, and are accessed via the Serial Interface. Data from these registers may be read anytime, however, the interrupt function may be used to determine when new data is available. 6.4 FIFO The IMU-3000 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO configuration register determines what data goes into it, with possible choices being gyro data, accelerometer data, temperature readings, and auxiliary ADC readings. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst reads. The interrupt function may be used to determine when new data is available. 6.5 Interrupts Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock sources); (2) Digital Motion Processor Done (programmable function); (3) new data is available to be read (from the FIFO and Data registers); and (4) the IMU-3000 did not receive an acknowledge from the accelerometer on the Secondary I2C bus. The interrupt status can be read from the Interrupt Status register. 19 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 6.6 Digital-Output Temperature Sensor An on-chip temperature sensor and ADC are used to measure the IMU-3000 die temperature. The readings from the ADC can be read from the FIFO or the Sensor Data registers. 6.7 Bias and LDO The bias and LDO section generates the internal supply and the reference voltages and currents required by the IMU-3000. Its inputs are an unregulated VDD of 2.1V to 3.6V and a VLOGIC - logic reference supply voltage - of 1.71V to VDD. The LDO output is bypassed by a 0.1F capacitor at REGOUT. 6.8 Charge Pump An on-board charge pump generates the high voltage required for the MEMS oscillators. Its output is bypassed by a 2.2nF capacitor at CPOUT. 20 of 56 IMU-3000 Product Specification 7 7.1 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Digital Interface I2C Serial Interface The internal registers of the IMU-3000 can be accessed using I2C at up to 400kHz. Serial Interface Pin Number Pin Name Pin Description 8 VLOGIC Digital I/O supply voltage. VLOGIC must be VDD at all times. 9 AD0 I2C Slave Address LSB 23 SCL I2C serial clock 24 SDA I2C serial data 7.1.1 I2C Interface I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are open-drain and bi-directional. In a generalized I2C interface implementation, attached devices can be a master or a slave. The master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. The IMU-3000 always operates as a slave device when communicating to the system processor, which thus acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400kHz. The slave address of the IMU-3000 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is determined by the logic level on pin ADO. This allows two IMU-3000s to be connected to the same I2C bus. When used in this configuration, the address of the one of the devices should be b1101000 (pin ADO is logic low) and the address of the other should be b1101001 (pin AD0 is logic high). The I2C address is stored in the WHO_AM_I register. I2C Communications Protocol START (S) and STOP (P) Conditions Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while SCL is HIGH (see figure below). Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition. START and STOP Conditions 21 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Data Format / Acknowledge I2C data bytes are defined to be 8 bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse. If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and releases the clock line (refer to the following figure). Acknowledge on the I2C Bus Communications After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an 8th bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line. Data transmission is always terminated by the master with a STOP condition (P), thus freeing the communications line. However, the master can generate a repeated START condition (Sr), and address another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the exception of start and stop conditions. Complete I2C Data Transfer 22 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification To write the internal IMU-3000 registers, the master transmits the start condition (S), followed by the I2C address and the write bit (0). At the 9th clock cycle (when the clock is high), the IMU-3000 acknowledges the transfer. Then the master puts the register address (RA) on the bus. After the IMU-3000 acknowledges the reception of the register address, the master puts the register data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the IMU-3000 automatically increments the register address and loads the data to the appropriate register. The following figures show single and two-byte write sequences. Single-Byte Write Sequence Master Slave S AD+W RA ACK DATA P ACK ACK Burst Write Sequence Master Slave S AD+W RA ACK DATA ACK DATA ACK P ACK To read the internal IMU-3000 registers, the master sends a start condition, followed by the I2C address and a write bit, and then the register address that is going to be read. Upon receiving the ACK signal from the IMU-3000, the master transmits a start signal followed by the slave address and read bit. As a result, the IMU-3000 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK condition is defined such that the SDA line remains high at the 9th clock cycle. The following figures show single and two-byte read sequences. Single-Byte Read Sequence Master Slave S AD+W RA ACK S AD+R ACK NACK ACK DATA ACK DATA P Burst Read Sequence Master Slave S AD+W RA ACK S AD+R ACK ACK NACK DATA I2C Terms Signal S Description Start Condition: SDA goes from high to low while SCL is high AD Slave I2C address W Write bit (0) R Read bit (1) ACK NACK RA DATA P Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle Not-Acknowledge: SDA line stays high at the 9th clock cycle IMU-3000 internal register address Transmit or received data Stop condition: SDA going from low to high while SCL is high 23 of 56 P IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Serial Interface Considerations 7.2 Supported Interfaces The IMU-3000 supports I2C communications on both its primary (microprocessor) serial interface and its secondary (accelerometer) interface. 7.3 Logic Levels The IMU-3000 accelerometer bus I/O logic levels are set to be either VDD or VLOGIC, as shown in the table below. I/O Logic Levels vs. AUX_VDDIO bit MICROPROCESSOR LOGIC LEVELS ACCELEROMETER LOGIC LEVELS (Pins: SDA, SCL, AD0, CLKIN, INT) (Pins: AUX_DA, AUX_CL) 0 VLOGIC VLOGIC 1 VLOGIC VDD AUX_VDDIO Notes: 1. CLKOUT has logic levels that are always referenced to VDD 2. The power-on-reset value for AUX_VDDIO is 0. VLOGIC may be set to be equal to VDD or to another voltage, such that at all times VLOGIC is VDD. When AUX_VDDIO is set to 0 (its power-on-reset value), VLOGIC is the reference voltage for both the microprocessor system bus and the accelerometer secondary bus, as shown in the figure of Section 8.2.1. When AUX_VDDIO is set to 1, VLOGIC is the reference voltage for the microprocessor system bus and VDD is the reference voltage for the accelerometer secondary bus, as shown in the figure of Section 8.2.2. 24 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 7.3.1 AUX_VDDIO = 0 The figure below shows logic levels and voltage connections for AUX_VDDIO = 0. Note that the actual configuration will depend on the type of third-party accelerometer used. I/O Levels and Connections for AUX_VDDIO = 0 25 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 7.3.2 AUX_VDDIO = 1 When AUX_VDDIO is set to 1 by the user, VLOGIC is the reference voltage for the microprocessor system bus and VDD is the reference voltage for the accelerometer secondary bus, as shown in the figure below. This is useful when interfacing to a third-party accelerometer where there is only one supply for both the logic and analog sections of the 3rd party accelerometer. I/O Levels and Connections for Two Example Power Configurations (AUX_VDDIO = 1) 26 of 56 IMU-3000 Product Specification 8 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Motion Processing Library (MPL) To assist in the rapid development and deployment of products using the IMU-3000, InvenSense provides a Motion Processing Library (MPL) software development kit that has been verified to work in the hardware and software environment shown in the figure below. IMU3000 Evaluation Board DMP Accel USB FIFO Gyro Accel InvenSense ARM Evaluation Board 2 USB to I C IMU3000 WinXP PC MinuUSB connector 20pin connector The MPL contains the core algorithm engines for motion processing, and includes an API layer which provides a simple interface into using these engines (see figure below). 27 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 The MPL communicates with the System Layer, which is a platform-specific interface into the hardware and software environment; this System Layer software must be implemented by the customer for his particular environment. The software development kit includes shell functions to speed up the development of this System Layer software. The MPL is independent of the Operating System (OS) since the System Layer software handles OS-specific requirements. The purpose of the DMP is to offload both timing requirements and processing requirements from the host processor. Typically, raw data integration (sensor fusion) should be run at a high rate, often around 200Hz, in order to provide accurate results with low latency. This is required even if the application updates at a much lower rate; for example, a low power user interface may update as slowly as 5Hz, but the sensor fusion should still run at 200Hz. The DMP can be used to minimize power, simplify timing and software architecture, and saving valuable MIPS on the host processor for use in the application. The IMU-3000 MPL Functional Specification describes in detail the API and System Layer routines needed for interfacing to the IMU-3000. 8.1 Demo Software InvenSense provides demonstration software in the form of source code and a compiled demonstration that runs on a PC running Windows XP. This software works in conjunction with the hardware shown in the figure at the top of Section 8. The PC demo software provides the functionality that allows a user to become familiar with the use of gyros and accelerometers. 28 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 9 Addr (Hex) Register Map Addr (Decimal) Register Name R/W Bit7 0 0 0 WHO_AM_I R/W C 12 X_OFFS_USRH R/W Bit6 Bit5 Bit4 Bit3 ID 13 X_OFFS_USRL R/W X_OFF_L 14 Y_OFFS_USRH R/W Y_OFFS_H F 15 Y_OFFS_USRL R/W Y_OFFS_L 10 16 Z_OFFS_USRH R/W Z_OFFS_H 11 17 Z_OFFS_USRL R/W Z_OFFS_L 12 18 FIFO_EN R/W TEMP_ OUT 13 19 AUX_VDDIO R/W 0 14 20 AUX_SLV_ ADDR R/W CLKOUT EN 15 21 SMPLRT_DIV R/W 16 22 DLPF_FS R/W INT_CFG R/W 18 24 AUX_BURST_AD DR R/W 1A 26 INT_STATUS R Bit0 - E 23 Bit1 X_OFF_H D 17 Bit2 GYRO_ XOUT GYRO_ YOUT GYRO_ ZOUT AUX_ XOUT AUX_ YOUT AUX_ ZOUT FIFO_ FOOTER 0 0 0 0 AUX_ VDDIO 0 0 AUX_ID SMPLRT_DIV 0 ACTL 0 OPEN 0 LATCH_ INT_EN FS_SEL INT_ ANYRD_ 2CLEAR DLPF_CFG I2C_MST _ERR_E N IMU_ RDY_ EN DMP_ DONE _EN RAW_ RDY_ EN IMU_ RDY DMP_ DONE RAW_ DATA_ RDY BURST_ADDR FIFO_FU LL - I2C_MST _ERR - 1B 27 TEMP_OUT_H R 1C 28 TEMP_OUT_L R TEMP_OUT_H TEMP_OUT_L 1D 29 GYRO_XOUT_H R GYRO_XOUT_H 1E 30 GYRO_XOUT_L R GYRO_XOUT_L 1F 31 GYRO_YOUT_H R GYRO_YOUT_H 20 32 GYRO_YOUT_L R GYRO_YOUT_L 21 33 GYRO_ZOUT_H R GYRO_ZOUT_H 22 34 GYRO_ZOUT_L R GYRO_ZOUT_L 23 35 AUX_XOUT_H R AUX_XOUT_H 24 36 AUX_XOUT_L R AUX_XOUT_L 25 37 AUX_YOUT_H R AUX_YOUT_H 26 38 AUX_YOUT_L R AUX_YOUT_L 27 39 AUX_ZOUT_H R AUX_ZOUT_H 28 40 AUX_ZOUT_L R AUX_ZOUT_L 35 53 DMP_REG1 R/W RESERVED1 36 54 DMP_REG2 R/W RESERVED2 37 55 DMP_REG3 R/W RESERVED3 38 56 DMP_REG4 R/W RESERVED4 39 57 DMP_REG5 R/W 3A 58 FIFO_COUNTH R 3B 59 FIFO_COUNTL R RESERVED5 - - - - - - FIFO_COUNT_H FIFO_COUNT_L 3C 60 FIFO_R R 3D 61 USER_CTRL R/W DMP_EN FIFO_EN AUX_IF_EN - FIFO_DATA 3E 62 PWR_MGM R/W H_RESET SLEEP STBY_XG STBY_YG 29 of 56 AUX_IF_RST DMP_RST STBY_ZG FIFO_RST GYRO_RST CLK_SEL Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10 Register Description This section details each register within the InvenSense IMU-3000 gyroscope. Note that any bit that is not defined should be set to zero in order to be compatible with future InvenSense devices. The register space allows single-byte reads and writes, as well as burst reads and writes. When performing burst reads or writes, the memory pointer will increment until either (1) reading or writing is terminated by the master, or (2) the memory pointer reaches registers 57 or 60. 10.1 Register 0 - Who Am I Type: Read/Write Register (Hex) Register (Decimal) Bit7 0 0 0 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 ID Bit0 - Description: This register is used to verify the identity of the device. Parameters: Contains the I2C address of the device, which can be changed by writing to this register. This register bit must be set to 0 when writing to this register. ID 0 The Power-On-Reset value of Bit6: Bit1 is 110 100. The Power-On-Reset value of Bit7 is 0. 10.2 Registers 12 to 17 - Gyro Offsets Type: Read/Write Register (Hex) Register (Decimal) C D 12 13 X_OFFS_H X_OFFS_L E 14 Y_OFFS_H F 15 Y_OFFS_L 10 16 Z_OFFS_H 11 17 Z_OFFS_L Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Description: These registers are used to remove DC bias from the sensor outputs. The values in these registers are subtracted from the gyro sensor values before going into the sensor registers (see registers 29 to 34). Parameters: X_OFFS_H/L Y_OFFS_H/L Z_OFFS_H/L 16-bit offset (high and low bytes) of X gyro offset (2's complement) 16-bit offset (high and low bytes) of Y gyro offset (2's complement) 16-bit offset (high and low bytes) of Z gyro offset (2's complement) 30 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.3 Register 18 - FIFO Enable Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 12 18 TEMP_ OUT GYRO_ XOUT GYRO_ YOUT GYRO_ ZOUT AUX_ XOUT AUX_ YOUT AUX_ ZOUT FIFO_ FOOTER 00h Description: This register determines what data goes into the IMU-3000 FIFO, which is a 512 byte First-In-FirstOut buffer (see register 60). Sensor data is automatically placed into the FIFO after each ADC sampling period is complete. The ADC sample rate is controlled by register 21. The order at which the data is put into the FIFO is from MSB to LSB, which means that it will match the order shown in the parameter detail below. Two bytes are used for each reading. For example, if Gyro X, Gyro Y, Gyro Z, and FIFO_FOOTER are configured to go into the FIFO, then each sample period the following 8 bytes would be inserted into the FIFO, as shown below: Gyro X High byte Gyro X Low byte Parameters: TEMP_OUT GYRO_XOUT GYRO_YOUT GYRO_ZOUT AUX_XOUT AUX_YOUT AUX_ZOUT FIFO_FOOTER Gyro Y High byte Gyro Y Low byte Gyro Z High byte Gyro Z Low byte FIFO_FOOTER High byte FIFO_FOOTER Low byte Setting this inserts the Temperature reading into FIFO Setting this inserts the X Gyro reading into FIFO Setting this inserts the Y Gyro reading into FIFO Setting this inserts the Z Gyro reading into FIFO Setting this inserts the X Accelerometer reading into FIFO Setting this inserts the Y Accelerometer reading into FIFO Setting this inserts the Z Accelerometer reading into FIFO Last word (2 bytes) for FIFO read. Described in more detail in Section 60 10.4 Registers 19 - AUX (Accel) VDDIO Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 13 19 0 0 0 0 0 AUX_ VDDIO 0 0 00h Description: This register determines the I/O logic levels for the secondary I2C bus clock and data lines (AUX_CL, AUX_DA). 1=VDD, 0=VLOGIC. Parameters: AUX_VDDIO 0 I/O logic levels for the secondary I2C bus clock and data lines (AUX_CL, AUX_DA). 1=VDD, 0=VLOGIC. Load zeros into Bits 0, 1, 3-7. 31 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.5 Register 20 - AUX (Accel) Slave Address Type: Read/Write Register (Hex) Register (Decimal) Bit7 14 20 CLKOUTEN Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 00h AUX_ID Description: This register contains the enable bit for the reference clock output and the 7-bit slave address of the external 3rd party accelerometer. The CLKOUTEN bit is used to enable (1) or disable (0) the reference clock output at the CLKOUT pin. AUX_ID, the 7-bit accelerometer slave address, is used to access the accelerometer so that its sensor reading can be automatically read during each sample period at the same time as the gyro sensors. When reading the external accelerometer registers, the IMU-3000 takes over the secondary I2C bus, as a master to the accel, performing a burst read of the sensor registers. For this interface to be active, the AUX_IF_EN flag in the User Control register (61) must be set (set to 1). Whenever changing this register, the secondary accel interface must be reset with AUX_IF_RST to take effect. Refer to the User Control register (61). Parameters: CLKOUTEN AUX_ID The enable bit for the reference clock output that is provided at the CLKOUT pin. 1=clock output enabled; 0=clock output disabled. Contains the I2C address of the external accelerometer. The address can be changed by writing to this register. 10.6 Register 21 - Sample Rate Divider Type: Read/Write Register (Hex) Register (Decimal) 15 21 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 SMPLRT_DIV Bit1 Bit0 Default Value 00h Description: This register determines the sample rate of the IMU-3000 gyros. The analog gyros are sampled internally at either 1kHz or 8kHz, determined by the DLPF_CFG setting (see register 22). This sampling is then filtered digitally and delivered into the sensor registers after the number of cycles determined by this register. The sample rate is given by the following formula: Fsample = Finternal / (divider+1), where Finternal is either 1kHz or 8kHz As an example, if the internal sampling is at 1kHz, then setting this register to 7 would give the following: Fsample = 1kHz / (7 + 1) = 125Hz, or 8ms per sample Parameters: SMPLRT_DIV Sample rate divider: 0 to 255 32 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.7 Register 22 - DLPF, Full Scale Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 16 22 0 0 0 Bit4 Bit3 Bit2 FS_SEL Bit1 Bit0 DLPF_CFG Description: This register configures parameters related to the sensor acquisition. The FS_SEL parameter allows setting the full-scale range of the gyro sensors, as described in the table below. FS_SEL FS_SEL Gyro Full-Scale Range 0 1 2 3 250/sec 500/sec 1000/sec 2000/sec The DLPF_CFG parameter sets the digital low pass filter configuration. It also determines the internal analog sampling rate used by the device as shown in the table below. DLPF_CFG Parameters: FS_SEL DLPF_CFG 0 DLPF_CFG Low Pass Filter Bandwidth Analog Sample Rate 0 1 2 3 4 5 6 7 256Hz 188Hz 98Hz 42Hz 20Hz 10Hz 5Hz Reserved 8kHz 1kHz 1kHz 1kHz 1kHz 1kHz 1kHz Reserved Full scale selection for gyro sensor data Digital low pass filter configuration Load zeros into Bits 5-7 of the DLPF, Full Scale register 33 of 56 Default Value 00h Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification DLPF Characteristics: The gain and phase responses of the digital low pass filter settings (DLPF_CFG) are shown below: Bode Diagram Magnitude (dB) 0 -10 6 -20 5 4 3 21 0 -30 -40 -50 Phase (deg) 0 -45 6 5 4 3 2 1 0 -90 0 1 10 2 10 3 10 10 Frequency (Hz) Gain and Phase vs. Digital Filter Setting Bode Diagram 2 Magnitude (dB) 0 -2 6 5 4 3 2 1 0 -4 -6 Phase (deg) 0 -5 -10 -15 6 0 10 5 4 3 2 1 0 1 2 10 10 3 10 Frequency (Hz) Gain and Phase vs. Digital Filter Setting, Showing Passband Details 34 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.8 Register 23 - Interrupt Configuration Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 17 23 ACTL OPEN LATCH_ INT_EN INT_ ANYRD_ 2CLEAR I2C_MST _ERR_E N IMU_ RDY_ EN DMP_ DONE _EN RAW_ RDY_ EN 00h Description: This register configures the interrupt operation of the IMU-3000. The interrupt output pin (INT) configuration can be set, the interrupt latching/clearing method can be set, and the triggers for the interrupt can be set. If LATCH_INT_EN = 1, the INT pin is held active until the interrupt status register is cleared. Note that if the application requires reading every sample of data from the IMU-3000, it is best to enable the raw data ready interrupt (RAW_RDY_EN). This allows the application to know when new sample data is available. Parameters: ACTL OPEN LATCH_INT_EN INT_ANYRD_2CLEAR I2C_MST_ERR_EN IMU_RDY_EN DMP_DONE_EN RAW_RDY_EN Logic level for INT output pin - 1=active low, 0=active high Drive type for INT output pin - 1=open drain, 0=push-pull Latch mode - 1=latch until interrupt is cleared, 0=50s pulse Interrupt status register clear method - 1=clear by reading any register, 0=clear by reading interrupt status register (26) only Enable interrupt when accelerometer on secondary I2C bus does not acknowledge IMU-3000 Enable interrupt when device is ready (PLL ready after changing clock source) Enable interrupt when DMP is done (programmable functionality) Enable interrupt when data is available 10.9 Register 24 - AUX (Accel) Burst Read Address / Secondary I2C Bus I/O Level Type: Read/Write Register (Hex) Register (Decimal) 18 24 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 BURST_ADDR Default Value 00h Description: This register configures the burst-mode-read starting address for an accelerometer attached to the secondary I2C bus of the IMU-3000, and determines the I/O logic levels of the secondary I2C bus clock and data lines (AUX_CL, AUX_DA). Parameters: AUX_VDDIO BURST_ADDR I/O logic levels for the secondary I2C bus clock and data lines (AUX_CL, AUX_DA; 1=VDD, 0=VLOGIC) Burst-mode-read starting address for external accelerometer attached to secondary I2C bus of the IMU-3000. 35 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.10 Register 26 - Interrupt Status Type: Read only Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 1A 26 FIFO_FULL - - - I2C_MST _ERR IMU_ RDY DMP_ DONE RAW_ DATA_ RDY 00h Description: This register is used to determine the status of the IMU-3000 interrupt. Whenever one of the interrupt sources is triggered, the corresponding bit will be set. The polarity of the interrupt pin (active high/low) and the latch type (pulse or latch) has no affect on these status bits. In normal use, the RAW_DATA_RDY interrupt is used to determine when new sensor data is available in either the sensor registers (27 to 34) or in the FIFO (60). Interrupt Status bits get cleared as determined by INT_ANYRD_2CLEAR in the interrupt configuration register (23). Parameters: FIFO_FULL FIFO has overflowed. Cleared when Register 26 is read and when FIFO_RST (register 61) is set. I2C_MST_ERR The IMU-3000 did not receive an acknowledge from the accelerometer on the secondary I2C bus when the IMU-3000 was acting as a master IMU_RDY PLL ready DMP_DONE Digital Motion Processor (DMP) is done RAW_DATA_RDY Raw data or FIFO data is ready 36 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.11 Registers 27 to 40 - Sensor Registers Type: Read only Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value* 1B 27 TEMP_OUT_H 00h 1C 28 TEMP_OUT_L 00h 1D 29 GYRO_XOUT_H 00h 1E 30 GYRO_XOUT_L 00h 1F 20 31 32 GYRO_YOUT_H GYRO_YOUT_L 00h 00h 21 33 GYRO_ZOUT_H 00h 22 34 GYRO_ZOUT_L 00h 23 35 AUX_XOUT_H 00h 24 25 36 37 AUX_XOUT_L AUX_YOUT_H 00h 00h 26 38 AUX_YOUT_L 00h 27 39 AUX_ZOUT_H 00h 28 40 AUX_ZOUT_L 00h *Default Value applies if sensor is disabled. Description: These registers contain the gyro, temperature sensor, and accelerometer (aux) data for the IMU3000. At any time, these values can be read from the device; however it is best to use the interrupt function to determine when new data is available. If the FIFO is used, the contents of these registers are automatically copied into the FIFO at each sample period, and then this data can be read from the FIFO (register 60). Before being placed into these registers, the gyro sensor data is first manipulated by the full scale setting (register 22) and the offset settings (registers 12 to 17). Parameters: TEMP_OUT_H/L GYRO_XOUT_H/L GYRO_YOUT_H/L GYRO_ZOUT_H/L AUX_XOUT_H/L AUX_YOUT_H/L AUX_ZOUT_H/L 16-bit temperature data (2's complement data format) 16-bit X gyro output data (2's complement data format) 16-bit Y gyro output data (2's complement data format) 16-bit Z gyro output data (2's complement data format) 16-bit X aux (accel) output data (as available from aux) 16-bit Y aux (accel) output data (as available from aux) 16-bit Z aux (accel) output data (as available from aux) 37 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.12 Registers 53 to 57 - DMP Registers Type: Read/Write Register (Hex) Register (Decimal) 35 53 RESERVED1 36 54 RESERVED2 37 55 RESERVED3 38 56 RESERVED4 38 57 RESERVED5 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Description: The data for these registers is included in a source code file supplied by InvenSense, and is used for the Digital Motion Processor (DMP) operation. This data is only necessary if the DMP is enabled using the User Control register (register 61). Parameters: RESERVED1 RESERVED2 RESERVED3 RESERVED4 RESERVED5 Reserved data1 for the DMP Reserved data2 for the DMP Reserved data3 for the DMP Reserved data4 for the DMP Reserved data5 for the DMP 10.13 Registers 58 to 59 - FIFO Count Type: Read only Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 3A 58 - - - 3B 59 Bit4 Bit3 Bit2 - - - FIFO_COUNT_L Bit1 Bit0 FIFO_COUNT_H Default Value 00h 00h Description: These registers indicate how many bytes of valid data are contained in the FIFO. The FIFO can contain up to 512 bytes of data If the FIFO gets filled up completely, the length will read 512. In this state, the IMU-3000 continues to put new sensor data into the FIFO, thus overwriting old FIFO data. Note, however, that the alignment of sensor data can change in this overflow condition. InvenSense recommends resetting the FIFO if an overflow condition occurs (use register 61), which will clear out the FIFO. Parameters: FIFO_COUNT_H/L Number of bytes currently in FIFO 38 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.14 Register 60 - FIFO Data Type: Read only Register (Hex) Register (Decimal) 3C 60 Parameters: FIFO_DATA Bit7 Bit6 Bit5 Bit4 Bit3 FIFO_DATA Bit2 Bit1 Bit0 Default Value 00h Contains the FIFO data Description: This is the output register of the FIFO. Each read of this register gets the oldest contents of the IMU3000 FIFO buffer; thus the data is read out in the same order that the IMU-3000 put the data in. If the FIFO operation is enabled, the IMU-3000 puts new data into the FIFO at each sample interval. The data that goes in is determined by the FIFO enable register (18). A burst read or write is required for reading or writing multiple bytes to or from this register, since any read or write on this register causes an auto increment and a prefetch to occur. Proper operation of the FIFO requires that at least one word (2 bytes) of data be left in the FIFO during any read operation. To implement this, it is recommended that one extra two byte word (FIFO_FOOTER) be added to the end of the FIFO data so that all desired data can be read at each cycle, leaving the extra word remaining in the FIFO. This extra word will be read out (first) during the next read operation on the FIFO. Data is read into the FIFO in the following order: TEMP_OUT GYRO_XOUT GYRO_YOUT GYRO_ZOUT AUX_XOUT AUX_YOUT AUX_ZOUT FIFO_FOOTER Temperature high and low bytes (2 bytes) X Gyro high and low bytes (2 bytes) Y Gyro high and low bytes (2 bytes) Z Gyro high and low bytes (2 bytes) X Accelerometer high and low bytes (2 bytes) Y Accelerometer high and low bytes (2 bytes) Z Accelerometer high and low bytes (2 bytes) Last word for FIFO read (2 bytes) For example, if it is desired to obtain temperature, gyro, and accelerometer data from the FIFO, then one should also add FIFO_FOOTER into the FIFO enable register (18) in addition to the desired data. As shown in the figure below, the first time data is written to the FIFO, the FIFO will contain: TEMP_OUT, GYRO_XOUT, GYRO_YOUT, GYRO_ZOUT, AUX_XOUT, AUX_YOUT, AUX_ZOUT, and FIFO_FOOTER. The first FIFO read will read all but the FIFO_FOOTER data, which will be read in the 2nd FIFO read. In the 2nd FIFO read, the FIFO_FOOTER data that was left over from the previous read is read out first, followed by all but the last FIFO_FOOTER data in the FIFO. This pattern of reading is continued, as shown in the figure. Note that the first FIFO read is similar to the subsequent reads in that one word of data is always left in the FIFO. It differs, though, in that the in subsequent reads the leftover data from the previous read is read first; however, for the first read there is no leftover data from a previous read. If the FIFO is allowed to overflow, it operates as a circular buffer in which at any time it contains the most recent 512 bytes. Recommended operation in this mode is to disable data going into the FIFO prior to reading the FIFO to avoid pointer conflicts. After halting the FIFO input, the 512 bytes in the FIFO should be read out in a single burst read. The first byte read will not be valid. 39 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Reading from the FIFO (Note that AUX_XOUT, AUX_YOUT, and AUX_ZOUT are the X, Y, and Z accelerometer outputs, respectively.) 40 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.15 Register 61 - User Control Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Default Value 3D 61 DMP_ EN FIFO_ EN AUX_IF_ EN - AUX_IF_ RST DMP_ RST FIFO_ RST GYRO_ RST 00h Description: This register is used to enable various modes on the IMU-3000, as well as reset these functions. For each of the functions that can be enabled, the function should be reset at the same time to assure it works properly. Note that the reset bits in the register are automatically cleared after the function is reset. For example, to enable the FIFO set both the FIFO_EN and the FIFO_RST bits. This will start the FIFO storage on the next sample period. As an additional example, for an external processor to communicate directly to the external accelerometer (i.e. have the secondary I2C bus be directly connected to the primary I2C bus), the AUX_IF_EN bit should be cleared and the AUX_IF_RST bit should be set. This will allow the I2C bus to pass through the IMU-3000 and allow the processor to control the accelerometer device (as well as the IMU). Pass through mode is useful for allowing the processor to configure the accelerometer, since the IMU-3000 can perform burst reads on the accelerometer, but is not set up to configure the device. Parameters: DMP_EN FIFO_EN AUX_IF_EN AUX_IF_RST DMP_RST FIFO_RST GYRO_RST Enable Digital Motion Processor (DMP) Enable FIFO operation for sensor data Enable IMU as master to accelerometer interface via secondary I2C (clear bit to configure primary I2C bus to pass through directly to the secondary I2C bus) Reset secondary accelerometer interface function; set this whenever changing AUX_IF_EN Reset DMP function; set this whenever changing DMP_EN Reset FIFO function; set this to clear FIFO or when changing FIFO_EN Reset gyro analog and digital functions 41 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 10.16 Register 62 - Power Management Type: Read/Write Register (Hex) Register (Decimal) Bit7 Bit6 Bit5 Bit4 Bit3 3E 62 H_RESET SLEEP STBY _XG STBY _YG STBY _ZG Bit2 Bit1 Bit0 Default Value CLK_SEL 00h Description: This register is used to manage the power control, select the clock source, and to issue a master reset to the device. H_RESET is used to reset the device and set the internal registers to the power-up default settings. STBY_XG, STBY_YG, and STBY_ZG are used to place the gyros into a standby or active mode (1=standby; 0=normal operating mode). Setting the SLEEP bit in the register puts the device into a low power sleep mode. In this mode, only the serial interface and internal registers remain active, allowing for a very low standby current. Clearing this bit puts the device back into normal mode. The individual standby selections for each of the gyros should be used if any of them are not used by the application. The CLK_SEL setting determines the device clock source as follows: CLK_SEL CLK_SEL 0 1 2 3 4 5 6 7 Clock Source Internal oscillator PLL with X Gyro reference PLL with Y Gyro reference PLL with Z Gyro reference PLL with external 32.768kHz reference PLL with external 19.2MHz reference Reserved Stop clock and synchronous reset clock state On power up, the IMU-3000 defaults to the internal oscillator. It is highly recommended that the device is configured to use one of the gyros (or an external clock) as the clock reference, due to the improved stability. Parameters: H_RESET SLEEP STBY_XG STBY_YG STBY_ZG CLK_SEL Reset device and internal registers to the power-up-default settings Enable low power sleep mode Put gyro X in standby mode (1=standby, 0=normal) Put gyro Y in standby mode (1=standby, 0=normal) Put gyro Z in standby mode (1=standby, 0=normal) Select device clock source 42 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 11 Assembly This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits. The following six best practices will ensure higher quality in assembly. 1. Do not leave parts out of the original moisture-sealed bags for more than 48 hours before assembly 2. Do not solder the center pad 3. Do not place large insertion components, such as buttons, switches, connectors, or shielding boxes at a distance of less than 6 mm from the MEMS gyro 4. Do use Electrostatic Discharge (ESD) protection at or better than 200V, preferably 150V, to prevent Machine Model (MM) type ESD damage 5. Do use ESD protection measures to ensure that personnel prevent Human Body Model (HBM) type ESD damage 6. Do not mechanically impact or shock the package in any of the production processes 11.1 Orientation The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. 43 of 56 IMU-3000 Product Specification 11.2 PCB Layout Guidelines 11.2.1 Package Dimensions 44 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 11.2.2 PCB Design Guidelines The Pad Diagram is shown in Figure 2 using a JEDEC type extension with solder rising on the outer edge. The Pad Dimensions Table shows pad sizing (mean dimensions) for the IMU-3000 product. JEDEC type extension with solder rising on outer edge PIN 1 INDENT EXPOSED PAD NO SOLDER Pad Diagram Nominal Package I/O Pad Dimensions (mm) Pad Pitch (a) 0.50 Pad Width (b) 0.25 Pad Length (L1) 0.40 Pad Length (L3) 0.35 Exposed Pad Width (X) 2.80 Exposed Pad Length (Y) 3.00 I/O Land Design Dimensions Guidelines (mm) Land Width (c) 0.35 Outward Extension (Tout) 0.40 Inward Extension (Tin) 0.05 Land Length (L2) 0.80 Land Length (L4) 0.75 Pad Dimensions Table (for figure above) 45 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 InvenSense MEMS Gyros sense rate of rotation. In addition, gyroscopes sense mechanical stress coming from the PCB. This PCB stress is minimized with simple design rules: 1. Component Placement - Testing indicates that there are no specific design considerations other than generally accepted industry design practices for component placement near the IMU-3000 gyroscope to prevent noise coupling and thermo-mechanical stress. 2. The area below the MEMS gyro (on the same side of the board) must be defined as a keep-out area. It is strongly recommended to not place any structure in top metal layer underneath the keep-out area. 3. Traces connected to pads should be as much symmetric as possible. Symmetry and balance for pad connection will help component self alignment and will lead to better control of solder paste reduction after reflow. 4. Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the package of frequencies from DC to 1MHz do not affect the operation of the MEMS gyro. However, routing traces or vias under the MEMS gyro package such that they run under the exposed die pad is prohibited. 5. To achieve best performance over temperature and to prevent thermo-mechanical package stress, do not place large insertion components like buttons, connectors, or shielding boxes at a distance of less than 6 mm from the MEMS gyro. 11.2.3 Exposed Die Pad Precautions The IMU-3000 has very low active and standby current consumption. The exposed die pad is not required for heat sinking, and should not be soldered to the PCB since soldering to it contributes to performance changes due to package thermo-mechanical stress. There is no electrical connection between the pad and the die. 11.2.4 Gyro Removal from PCB Never apply high mechanical force while removing MEMS gyros from PCB. Otherwise, the QFN package leads can be removed and failure analysis of the gyro unit will be impossible. Tweezers are practical. Do not apply a pulling force upward. Instead apply a gentle force sideward while heating. When sufficient heat has been applied, the unit will start to slide sideways and can now be pulled gently upwards with the tweezers. In any case, mechanical or thermo-mechanical overstress during manual handling and soldering, (especially contact between the soldering iron or hot air gun and the package) has to be avoided. If safe removal of the suspected component is not possible or deemed too risky, send the whole PCB or the part of the PCB containing the defective component back to InvenSense. If requested, we will return the PCB after we have removed the gyro. 11.3 Trace Routing Testing indicates that 3-Volt peak-to-peak signals run under the gyro package or directly on top of the package of frequencies from DC to 1MHz do not affect the operation of the MEMS gyro. However, routing traces or vias under the MEMS gyro package such that they run under the exposed die pad is prohibited. 11.4 Component Placement Do not place large insertion components such as keyboard or similar buttons, connectors, or shielding boxes at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practices for component placement near the IMU-3000 to prevent noise coupling and thermo-mechanical stress. 46 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification 11.5 PCB Mounting and Cross-Axis Sensitivity Orientation errors of the gyroscope mounted to the printed circuit board can cause cross-axis sensitivity in which one gyro responds to rotation about another axis, for example, the X-axis gyroscope responding to rotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below. The table below shows the cross-axis sensitivity as a percentage of the specified gyroscope's sensitivity for a given orientation error. Cross-Axis Sensitivity vs. Orientation Error Orientation Error Cross-Axis Sensitivity ( or ) (sin or sin) 0 0% 0.5 0.87% 1 1.75% The specification for cross-axis sensitivity in Section 3 includes the effect of the die orientation error with respect to the package. 47 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 11.6 MEMS Handling Instructions MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical structures. They differ from conventional IC products even though they can be found in similar packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to mounting onto printed circuit boards (PCBs). The IMU-3000 gyroscope has a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it deems proper for protection against normal handling and shipping. It recommends the following handling precautions to prevent potential damage. * Individually packaged or trays of gyroscopes should not be dropped onto hard surfaces. Components placed in trays could be subject to g-forces in excess of 10,000g if dropped. * Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart. This could also create g-forces in excess of 10,000g. 11.7 ESD Considerations Establish and use ESD-safe handling precautions when unpacking and handling ESD-sensitive devices. * The Tape-and-Reel moisture-sealed bag is an ESD approved barrier. The best practice is to keep the units in the original moisture sealed bags until ready for assembly. * Restrict all device handling to ESD protected work areas that measure less than 200V static charge, or better, to less than 150V. Ensure that all workstations are properly grounded. * Store ESD sensitive devices in ESD safe containers until ready for use. * Ensure that personnel are properly grounded to prevent ESD. 11.8 Gyroscope Surface Mount Guidelines Any material used in the surface mount assembly process of the MEMS gyroscope should be free of restricted RoHS elements or compounds. Pb-free solders should be used for assembly. In order to assure gyroscope performance, several industry standard guidelines need to be considered for surface mounting. These guidelines are for both printed circuit board (PCB) design and surface mount assembly and are available from packaging and assembly houses. When using MEMS gyroscope components in plastic packages, package stress due to PCB mounting and assembly could affect the output offset and its value over a wide range of temperatures. This is caused by the mismatch between the Coefficient Temperature Expansion (CTE) of the package material and the PCB. Care must be taken to avoid package stress due to mounting. 48 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 11.9 Reflow Specification The IMU-3000 gyroscope was qualified in accordance with IPC/JEDEC J-STD-020C. This standard classifies proper packaging, storage and handling to avoid subsequent thermal and mechanical damage during assembly solder reflow attachment. Classification specifies a bake cycle, moisture soak cycle in a temperature humidity oven, followed by three solder reflow cycles and functional testing for qualification. All temperatures refer to the topside of the QFN package, as measured on the package body surface. The peak solder reflow classification temperature requirement is (260 +5/-0C) for lead-free soldering of components less than 1.6 mm thick. Lower Production solder-reflow temperatures are recommended to use. Check the recommendations of the solder manufacturer. For optimum results, production solder reflow processes should use lower temperatures, reduce exposure to high temperatures, and use lower ramp-up and ramp-down rates than those listed in the qualification profile shown below. Production reflow should never exceed the maximum constraints listed in the table and figure below for the qualification profile, as these represent the maximum tolerable ratings for the device. Approved IR/Convection Solder Reflow Curve Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above Step Setting A B C D E F G H I Troom TSmin TSmax TLiquidus TPmin [255C, 260C] TPmax [ 260C, 265C] TPmin [255C, 260C] TLiquidus Troom CONSTRAINTS Temp (C) 25 150 200 217 255 260 255 217 25 Time (sec) Rate (C/sec) 60 < tBC < 120 tAF < 480 10< tEG < 30 60 < tDH < 120 r(TLiquidus-TPmax) < 3 r(TLiquidus-TPmax) < 3 r(TLiquidus-TPmax) < 3 r(TPmax-TLiquidus) < 4 Note: TPmax must not exceed the Classification temperature (260C). 49 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 11.10 Storage Specifications The storage specification of the IMU-3000 gyroscope conforms to IPC/JEDEC J-STD-020C Moisture Sensitivity Level (MSL) 3. Storage Specifications for IMU-3000 Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: <40C and <90% RH After opening moisture-sealed bag 168 hours -- Storage conditions: ambient 30C at 60% RH 50 of 56 IMU-3000 Product Specification 11.11 Package Marking Specification Package Marking Specification 11.12 Tape & Reel Specification Tape Dimensions 51 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 Reel Outline Drawing Reel Dimensions and Package Size PACKAGE SIZE 4x4 REEL (mm) L V W Z 330 100 13.2 2.2 User Direction of Feed Package Orientation Cover Tape (Anti-Static) Carrier Tape (Anti-Static) Label Pin 1 Terminal Tape Reel Tape and Reel Specification Reel Specifications Quantity Per Reel 5,000 Reels per Box 1 Boxes Per Carton (max) 3 Pieces per Carton (max) 15,000 52 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 11.13 Label Location of Label 11.14 Packaging Anti-static Label Moisture-Sensitive Caution Label Tape & Reel Label Moisture Barrier Bag With Labels Reel in Box Moisture-Sensitive Caution Label Box with Tape & Reel Label 53 of 56 IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 12 Reliability 12.1 Qualification Test Policy InvenSense's products complete a Qualification Test Plan before being released to production. The Qualification Test Plan follows the JEDEC 47D Standards, "Stress-Test-Driven Qualification of Integrated Circuits," with the individual tests described below. 12.2 Qualification Test Plan Accelerated Life Tests TEST High Temperature Operating Life (HTOL/LFR) Steady-State Temperature Humidity Bias Life (1) High Temperature Storage Life Method/Condition JEDEC JESD22-A108C, Dynamic, 3.63V biased, Tj>125C [read-points 168, 500, 1000 hours] JEDEC JESD22-A101C, 85C/85%RH [read-points 168, 500 hours], Information Only 1000 hours] JEDEC JESD22-A103C, Cond. A, 125C Non-Bias Bake [read-points 168, 500, 1000 hours] Lot Sampl Quantity e / Lot Acc / Reject Criteria 3 77 (0/1) 3 77 (0/1) 77 (0/1) 3 Device Component Level Tests Method/Condition Lot Sampl Quantity e / Lot Acc / Reject Criteria ESD-HBM JEDEC JESD22-A114F, Class 2 (1.5KV) 1 3 (0/1) ESD-MM JEDEC JESD22-A115-A, Class B (200V) 1 3 (0/1) Latch Up JEDEC JESD78B Level 2, 125C, 100mA 1 6 (0/1) 3 5 (0/1) 3 5 (0/1) 3 77 (0/1) TEST Mechanical Shock Vibration Temperature Cycling (1) JEDEC JESD22-B104C, Mil-Std-883, method 2002, Cond. D, 10,000g's, 0.3ms, X,Y,Z - 6 directions, 5 times/direction JEDEC JESD22-B103B, Variable Frequency (random), Cond. B, 5-500Hz, X,Y,Z - 4 times/direction JEDEC JESD22-A104D Condition N, -40C to +85C, Soak Mode 2, 100 cycles Board Level Tests TEST Board Mechanical Shock Board T/C Lot Sampl Quantity e / Lot Method/Condition/ JEDEC JESD22-B104C,Mil-Std-883, method 2002, Cond. D, 10,000g's, 0.3ms, +-X,Y,Z - 6 directions, 5 times/direction JEDEC JESD22-A104D Condition N, -40C to +85C, Soak Mode 2, 100 cycles 1 5 1 40 (1) - Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F 54 of 56 Acc / Reject Criteria (0/1) (0/1) IMU-3000 Product Specification Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 13 Environmental Compliance The IMU-3000 is RoHS and Green compliant. The IMU-3000 is in full environmental compliance as evidenced in report HS-IMU-3000, Materials Declaration Data Sheet. Environmental Declaration Disclaimer: InvenSense believes this environmental information to be correct but cannot guarantee accuracy or completeness. Conformity documents for the above component constitutes are on file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. 55 of 56 Document Number: PS-IMU-3000A-00-01.1 Revision: 1.1 Release Date: 08/19/2010 IMU-3000 Product Specification This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. TM TM TM InvenSense , IMU , IMU-3000 , Motion Processing Unit Inc. TM TM , Digital Motion Processing , and DMP (c)2010 InvenSense, Inc. All rights reserved. 56 of 56 TM are trademarks of InvenSense,