5962-9958501QXC - Actel Corporation

February 2001 1

5.0

40MX and 42MX FPGA Families

Features

High Capacity

• Single-Chip ASIC Alternative

• 3,000 to 54,000 System Gates

• Up to 2.5 kbits Configurable Dual-Port SRAM

• Fast Wide-Decode Circuitry

• Up to 202 User-Programmable I/O Pins

High Performance

•5.6 ns Clock-to-Out

• 250 MHz Performance

• 5 ns Dual-Port SRAM Access

• 100 MHz FIFOs

• 7.5 ns 35-Bit Address Decode

HiRel Features

• Commercial, Industrial, and Military Temperature Plastic

Packages

• Commercial, Military Temperature and MIL-STD-883

Ceramic Packages

• QML Certification

• Ceramic Devices Available to DSCC SMD

Ease of Integration

• Mixed Voltage Operation (5.0V or 3.3V I/O)

• Synthesis-Friendly Architecture to Support ASIC Design

Methodologies

• Up to 100% Resource Utilization and 100% Pin Fixing

• Deterministic, User-Controllable Timing

• Unique In-System Diagnostic and Verification Capability

with Silicon Explorer II

• Low Power Consumption

• IEEE Standard 1149.1 (JTAG) Boundary Scan Testing

• 5.0V and 3.3V Programmable PCI-Compliant I/O

Product Profile

Device A40MX02 A40MX04 A42MX09 A42MX16 A42MX24 A42MX36

Capacity

System Gates

SRAM Bits 3,000

N/A 6,000

N/A 14,000

N/A 24,000

N/A 36,000

N/A 54,000

2,560

Logic Modules

Sequential

Combinatorial

Decode

—

295

—

547

—

348

336

N/A

624

608

N/A

954

912

1,230

1,184

Clock-to-Out 9.5 ns 9.5 ns 5.6 ns 6.1 ns 6.1 ns 6.3 ns

SRAM Modules

(64x4 or 32x8) N/A N/A N/A N/A N/A 10

Dedicated Flip-Flops — — 348 624 954 1,230

Maximu m Fli p-Flops 147 273 516 928 1,410 1,822

Clocks 112 226

User I/O (Maximum) 57 69 104 140 176 202

PCI No No No No Yes Yes

Boundary Scan Test (BST) No No No No Yes Yes

Packages (by pin coun t)

PLCC

PQFP

VQFP

TQFP

CQFP

PBGA

44, 68

100

—

44, 68, 84

100

—

100, 160

100

176

—

100, 160, 208

100

176

—

160, 208

—

176

—

208, 240

—

208, 256

272

v5.0

40MX and 42MX FPGA Families

2v5.0

General Description

Actel’s 40MX and 42MX families provide a

high-performance, single-chip solution for shortening the

system design and development cycle, offering a

cost-effective alternative to ASICs. The 40MX and 42MX

devices are excellent choices for integrating logic that is

currently implemented in multiple PALs, CPLDs, and

FPGAs. Example applications include high-speed

controllers and address decoding, peripheral bus interfaces,

DSP, and co-processor functions.

The MX device architecture is based on Actel’s patented

antifuse technology implemented in a 0.45µ triple-metal

CMOS process. With capacities ranging from 3,000 to 54,000

system gates, the synthesis-friendly MX devices provide

performance up to 250 MHz, are live on power-up, and

require up to five times lower stand-by power consumption

than any other FPGA device. Actel’s MX FPGAs provide up

to 202 user I/Os and are available in a wide variety of

packages and speed grades.

Actel’s 42MX devices also feature MultiPlex I/Os, which

support mixed voltage systems, enable programmable PCI,

deliver high-performance operation at both 5.0V and 3.3V,

and provide a low-power mode.

The MX PCI-Compliant devices are fully compliant with the

PCI Local Bus Specification (version 2.1). They deliver 200

MHz on-chip operation and 6.1 ns clock-to-output

performance with capacities spanning from 36,000 to 54,000

system gates. MX devices comply 100 percent to the

electrical and timing specifications detailed in the PCI

specification. However, as with all programmable logic

devices, the performance of the final product depends upon

the user's design and optimization techniques.

The MX24 and MX36 devices also include system-level

features such as IEEE Standard 1149.1 (JTAG) Boudary

Scan Testing, dual-port SRAM, and fast wide-decode

modules. The A42MX36 device offers dual-port SRAM for

implementing fast FIFOs, LIFOs, and temporary data

storage. The large number of storage elements can

efficiently address applications requiring wide datapath

manipulation and can perform transformation functions

such as those required for telecommunications, networking,

and DSP.

All products in the 40MX and 42MX families are available

100 percent tested over the military temperature range. In

addition, the largest member of the family, the A42MX36, is

available in both CQ208 and CQ256 ceramic packages

screened to MIL-STD-883 levels. For easy prototyping and

conversion from plastic to ceramic, the CQ208 and PQ208

devices are pin compatible.

Ordering Information

Application (Temperature Range)

Blank = Commercial (0 to +70°C)

I = Industrial (–40 to +85°C)

M = Military (–55 to +125°C)

B = MIL-STD-883

Package Type

PL = Plastic Leaded Chip Carrier

PQ = Plastic Quad Flat Pack

TQ = Thin (1.4 mm) Quad Flat Pack

VQ = Very Thin (1.0 mm) Quad Flat Pack

BG = Ball Grid Array

CQ = Ceramic Quad Flat Pack

Speed Grade

Blank = Standard Speed

–1 = Approximately 15% Faster than Standard

–2 = Approximately 25% Faster than Standard

–3 = Approximately 35% Faster than Standard

–F = Approximately 40% Slower than Standard

Part Number

A40MX02= 3,000 System Gates

A40MX04= 6,000 System Gates

A42MX09= 14,000 System Gates

A42MX16= 24,000 System Gates

A42MX24= 36,000 System Gates

A42MX36= 54,000 System Gates

Package Lead Count

A42MX16 – PQ 100

v5.0 3

40MX and 42MX FPGA Families

Product Plan

Speed Grade1 Application

Std –1–2–3–F2CIMB

A40MX02 Device

44-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

68-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

100-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

80-Pin Very Thin Plastic Quad Flat Pack (VQFP) ✔✔✔✔✔ ✔✔✔—

A40MX04 Device

44-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

68-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

84-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

100-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

80-Pin Very Thin Plastic Quad Flat Pack (VQFP) ✔✔✔✔✔ ✔✔✔—

A42MX09 Device

84-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

100-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

160-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

176-Pin Thin Plastic Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔✔—

100-Pin Very Thin Plastic Quad Flat Pack (VQFP) ✔✔✔✔✔ ✔✔✔—

A42MX16 Device

84-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

100-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

160-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

176-Pin Thin Plastic Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔✔—

100-Pin Very Thin Plastic Quad Flat Pack (VQFP) ✔✔✔✔✔ ✔✔✔—

A42MX24 Device

84-Pin Plastic Leaded Chip Carrier (PLCC) ✔✔✔✔✔ ✔✔✔—

160-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

176-Pin Thin Plastic Quad Flat Pack (TQFP) ✔✔✔✔✔ ✔✔✔—

A42MX36 Device

208-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

240-Pin Plastic Quad Flat Pack (PQFP) ✔✔✔✔✔ ✔✔✔—

272-Pin Plastic Ball Grid Array (PBGA) ✔✔✔✔✔ ✔✔✔—

208-Pin Ceramic Quad Flat Pack (CQFP) ✔✔✔—— ✔—✔3✔3

256-Pin Ceramic Quad Flat Pack (CQFP) ✔✔✔—— ✔—✔3✔3

Contact your Actel sales representative for product availability.

Applications: C = Commercial Availability: ✔= Available *Speed Grade: –1 = Approx. 15% faster than

Standard I = Industrial P = Planned –2 = Approx. 25% faster than

Standard M = Military — = Not Planned –3 = Approx. 35% faster than

Standard –F = Approx. 40% slower than

Standard † Only Std, –1, –2 Speed Grade

• Only Std, –1 Speed Grade

40MX and 42MX FPGA Families

4v5.0

Development Tool Support

The MX devices are fully supported by Actel’s line of FPGA

development tools, including the Actel DeskTOP series and

Designer Series tools. The Actel DeskTOP series is an

integrated design environment for PCs that includes design

entry, simulation, synthesis, and place-and-route tools.

Designer Series, Actel’s suite of FPGA development point

tools for PCs and Workstations, includes the ACTgen Macro

Builder, timing-driven place-and-route and analysis tools,

and device programming software.

In addition, the MX devices contain ActionProbe circuitry

that provides built-in access to every node in a design,

enabling 100 percent real-time observation and analysis of a

device's internal logic nodes without design iteration. The

probe circuitry is accessed by Silicon Explorer II, an

easy-to-use integrated verification and logic analysis tool

that can sample data at 100 MHz (asynchronous) or 66 MHz

(synchronous). Silicon Explorer II attaches to a PC’s

standard COM port, turning the PC into a fully functional

18-channel logic analyzer. Silicon Explorer II allows

designers to complete the design verification process at

their desks and reduces verification time from several hours

per cycle to only a few seconds.

Plastic Device Resources

User I/Os

Device PLCC

44-Pin PLCC

68-Pin PLCC

84-Pin PQFP

100-Pin PQFP

160-Pin PQFP

208-Pin PQFP

240-Pin VQFP

80-Pin VQFP

100-Pin TQFP

176-Pin PBGA

272-Pin

A40MX02 34 57 —57 ———57 ———

A40MX0434576969———69 ———

A42MX09 ——72 83 101 ———83 104 —

A42MX16 ——72 83 125 140 ——83 140 —

A42MX24 ——72 —125 176 ———150 —

A42MX36 —————176 202 ———202

Package Definitions (Contact your Actel sales representative for product availability.)

PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad Flat Pack,

PBGA = Plastic Ball Grid Array

Ceramic Device Resources

User I/Os

Device CQFP

208-Pin CQFP

256-Pin

A42MX36 176 202

Package Definitions (Contact your Actel sales representative for product availability.)

CQFP = Ceramic Quad Flat Pack

v5.0 5

40MX and 42MX FPGA Families

Power Requirements

40MX

The 40MX FPGAs will operate in 5.0V-only systems or

3.3V-only systems.

VCC Input Output

5.0V 5.0V 5.0V

3.3V 3.3V 3.3V

42MX

The 42MX FPGAs will operate in 5.0V-only systems,

3.3V-only systems, or mixed 5.0V/3.3V systems.

VCCA VCCI Input Output

5.0V 5.0V 5.0V 5.0V

3.3V 3.3V 3.3V 3.3V

5.0V 3.3V 3.3V, 5.0V 3.3V

Mixed Voltage Power Up and Power

Down

When powering up the device in the mixed voltage mode

(VCCA = 5.0V and VCCI = 3.3V), VCCA must be greater than or

equal to VCCI throughout the power-up sequence. If VCCI is

0.5V greater than VCCA when both are above 1.5V, then the

I/Os’ input protection junction on the I/Os will be forward

biased, causing them to draw large amounts of current.

When VCCA and VCCI are in the 1.5V to 2.0V region and VCCI

is greater than VCCA, all I/Os would momentarily behave as

outputs that are in a logical high state, and ICC rises to high

levels. For power down, any sequence with VCCA and VCCI

can be implemented.

Low Power Mode

The 42MX devices have a power-saving feature enabled by a

special Low Power pin (LP). In this mode, the device

consumes very minimal power, with standby current as low

as 15µA (see “Electrical Specifications” on page 13 and 14).

All µ I/Os are tristated, all input buffers are turned off, and

the core of the device is turned off. Since the core is turned

off, the state of the registers and the contents of the SRAM

are lost. The device enters low power mode 800ns after the

LP pin is set High. It will resume normal operation 200µs

after the LP pin is driven to a logic Low.

MX Architectural Overview

The 40MX and 42MX devices are composed of fine-grained

building blocks that enable fast, efficient logic designs. All

devices within these families are composed of logic

modules, I/O modules, routing resources, and clock

networks, which are the building blocks for designing fast

logic designs. In addition, the A42MX36 device contains

embedded dual-port SRAM and wide decode modules. The

dual-port SRAM modules are optimized for high-speed

datapath functions such as FIFOs, LIFOs, and scratchpad

memory. The “Product Profile” on page 1 lists the specific

logic resources contained within each device.

Logic Modules

The 40MX logic module is an eight-input, one-output logic

circuit designed to implement a wide range of logic

functions with efficient use of interconnect routing

resources (Figure 1).

The logic module can implement the four basic logic

functions (NAND, AND, OR, and NOR) in gates of two, three,

or four inputs. Each function may have many versions with

different combinations of active LOW inputs. The logic

module can also implement a variety of D-latches,

exclusivity functions, AND-ORs, and OR-ANDs. No dedicated

hard-wired latches or flip-flops are required in the array,

since latches and flip-flops can be constructed from logic

modules wherever needed in the application.

Figure 1 • 40MX Logic Module

40MX and 42MX FPGA Families

6v5.0

The 42MX devices contain three types of logic modules:

combinatorial (C-modules), sequential (S-modules), and

decode (D-modules).

The C-module, shown in Figure 2, implements the following

function:

Y=!S1*!S0*D00+!S1*S0*D01+S1*!S0*D10+S1*S0*D11

where

S0=A0*B0

S1=A1+B1

The S-module, shown in Figure 3, is designed to implement

high-speed sequential functions within a single logic

module. The S-module implements the same combinatorial

logic function as the C-module while adding a sequential

element. The sequential element can be configured as

either a D flip-flop or a transparent latch. To increase

flexibility, the S-module register can be bypassed so that it

implements purely combinatorial logic.

Figure 2 •C-Module Implementation

D00

D01

D10

D11

Figure 3 •S-Module Implementation

D11

D01

D00

D10 YOUT

S1 S0

Up to 7-Input Function Plus D-Type Flip-Flop with Clear

D11

D01

D00

D10 Y

S1 S0

Up to 7-Input Function Plus Latch

Up to 4-Input Function Plus Latch with Clear

D11

D01

D00

D10 YOUT

Up to 8-Input Function Same as C-Module)

CLR

OUT

CLR

OUT

GATE

v5.0 7

40MX and 42MX FPGA Families

Some of the 42MX devices contain D-modules, which are

arranged around the periphery of the devices. D-modules

contain wide-decode circuitry, which provides a fast,

wide-input AND function similar to that found in

product-term architectures (Figure 4). The D-module

allows 42MX devices to perform wide-decode functions at

speeds comparable to CPLDs and PALs. The output of the

D-module has a programmable inverter for active HIGH or

LOW assertion. The D-module output is hard-wired to an

output pin, but it can also be fed back into the array to be

incorporated into other logic.

Dual-Port SRAM Modules

The A42MX36 device contains dual-port SRAM modules that

have been optimized for synchronous or asynchronous

applications. The SRAM modules are arranged in 256-bit

blocks that can be configured as 32x8 or 64x4. SRAM

modules can be cascaded together to form memory spaces

of user-definable width and depth. A block diagram of the

42MX dual-port SRAM block is shown in Figure 5.

The 42MX SRAM modules are true dual-port structures

containing independent read and write ports. Each SRAM

module contains six bits of read and write addressing

(RDAD[5:0] and WRAD[5:0], respectively) for 64x4-bit

blocks. When configured in byte mode, the highest order

address bits (RDAD5 and WRAD5) are not used. The read

and write ports of the SRAM block contain independent

clocks (RCLK and WCLK) with programmable polarities

offering active HIGH or LOW implementation. The SRAM

block contains eight data inputs (WD[7:0]), and eight

outputs (RD[7:0]) which are connected to segmented

vertical routing tracks.

The 42MX dual-port SRAM blocks provide an optimal

solution for high-speed buffered applications requiring fast

FIFO and LIFO queues. Actel’s ACTgen Macro Builder

provides the capability to quickly design memory functions,

such as FIFOs, LIFOs, and RAM arrays. In addition, unused

SRAM blocks can be used to implement registers for other

logic within the design.

Figure 4 •D-Module Implementation

7 Inputs

Hard-Wire to I/O

Feedback to Array

Programmable

Inverter

Figure 5 •42MX Dual-Port SRAM Block

SRAM Module

32 x 8 or 64 x 4

(256 Bit s)

Read

Port

Logic

Write

Port

Logic

RD[7:0]

Routing Tracks

Latches

Read

Logic

[5:0] RDAD[5:0]

REN

RCLK

LatchesWD[7:0]

Latches

WRAD[5:0]

Write

Logic

MODE

BLKEN

WEN

WCLK

[5:0]

[7:0]

40MX and 42MX FPGA Families

8v5.0

MultiPlex I/O Modules

MultiPlex I/O supports the most common voltage standards

today: pure 5.0V operation, pure 3.3V operation, and mixed

3.3V operation with 5.0V I/O tolerance for maximum

performance. Internal array performance is retained in 3.3V

systems by using complimentary pass gates that operate as

fast as they do at 5.0V at 3.3V.

MultiPlex I/O includes selectable PCI output drives in

certain 42MX devices, enabling 100% PCI-compliance for

both 5.0V and 3.3V systems. For low-power systems,

MultiPlex I/O is used to turn off all inputs and outputs to cut

current consumption to below 100µA.

The MultiPlex I/O modules provide the interface between

the device pins and the logic array. The top of Figure 6 is a

block diagram of the 42MX I/O module. A variety of user

functions, determined by a library macro selection, can be

implemented in the module. (Refer to the Macro Library

Guide for more information.) All 42MX I/O modules contain

tristate buffers, with input and output latches that can be

configured for input, output, or bi-directional operation.

All 42MX devices contain flexible I/O structures (Figure 7 on

page 9), where each output pin has a dedicated

output-enable control. The I/O module can be used to latch

input or output data, or both, providing a fast set-up time. In

addition, the Actel Designer Series software tools can build

a D-type flip-flop using a C-module to register input and

output signals. To achieve 5.0V or 3.3V PCI-compliant output

drives on A42MX24 and A42MX36 devices, a chip-wide PCI

fuse is programmed. When the PCI fuse is not programmed,

the output drive is standard. (See the bottom portion of

Figure 6.)

Actel’s Designer Series development tools provide a design

library of I/O macrofunctions that can implement all I/O

configurations supported by the MX FPGAs.

Routing Structure

The MX architecture uses vertical and horizontal routing

tracks to interconnect the various logic and I/O modules.

These routing tracks are metal interconnects that may be

either of continuous length or broken into pieces called

segments. Varying segment lengths allows the interconnect

of over 90% of design tracks to occur with only two antifuse

connections. Segments can be joined together at the ends

using antifuses to increase their lengths up to the full length

of the track. All interconnects can be accomplished with a

maximum of four antifuses.

Horizontal Routing

Horizontal channels are located between the rows of

modules and are composed of several routing tracks. The

horizontal routing tracks within the channel are divided

into one or more segments. The minimum horizontal

segment length is the width of a module pair, and the

maximum horizontal segment length is the full length of the

channel. Any segment that spans more than one-third at the

row length is considered a long horizontal segment. A

typical channel is shown in Figure 8 on page 9.

Non-dedicated horizontal routing tracks are used to route

signal nets; dedicated routing tracks are used for global

clock networks and for power and ground tie-off tracks.

Vertical Routing

Another set of routing tracks run vertically through the

module. There are three types of vertical tracks: input,

output, and long, which are also divided into one or more

segments. Each segment in an input track is dedicated to

the input of a particular module; each segment in an output

track is dedicated to the output of a particular module. Long

segments are uncommitted and can be assigned during

Figure 6 •42MX I/O Module

G/CLK*

PAD

* Can be Configured as a Latch or D Flip-Flop

From Array

To Array

(Using C-Mo dul e)

G/CLK*

Signal

PCI Enable

PCI

Schematic

Fuse

Drive

STD

Output

v5.0 9

40MX and 42MX FPGA Families

routing. Each output segment spans four channels (two

above and two below), except near the top and bottom of

the array, where edge effects occur. Long vertical tracks

contain either one or two segments. An example of vertical

routing tracks and segments is shown in Figure 8.

Antifuse Structures

An antifuse is a “normally open” structure as opposed to the

normally connected fuse structure used in PROMs or PALs.

The use of antifuses to implement a programmable logic

device results in highly testable structures as well as

efficient programming algorithms. The structure is

highly-testable because there are no pre-existing

connections; therefore, temporary connections can be made

using pass transistors. These temporary connections can

isolate individual antifuses to be programmed and

individual circuit structures to be tested, which can be done

before and after programming. For example, all metal

tracks can be tested for continuity and shorts between

adjacent tracks, and the functionality of all logic modules

can be verified.

Clock Networks

The 40MX devices have one global clock distribution

network (CLK). Two low-skew, high-fanout clock

distribution networks are provided in each 42MX device.

These networks are referred to as CLK0 and CLK1. Each

network has a clock module (CLKMOD) that selects the

source of the clock signal and may be driven as follows:

•Externally from the CLKA pad

•Externally from the CLKB pad

•Internally from the CLKINTA input

•Internally from the CLKINTB input

The clock modules are located in the top row of I/O

modules. Clock drivers and a dedicated horizontal clock

track are located in each horizontal routing channel.

The user controls the clock module by selecting one of two

clock macros from the macro library. The macro CLKBUF is

used to connect one of the two external clock pins to a clock

network, and the macro CLKINT is used to connect an

internally-generated clock signal to a clock network. Since

both clock networks are identical, it does not matter

whether CLK0 or CLK1 is being used. The clock input pads

can also be used as normal I/Os, bypassing the clock

networks (Figure 9).

The A42MX36 device has four additional register control

resources, called quadrant clock networks (Figure 10 on

page 10). Each quadrant clock provides a local, high-fanout

resource to the contiguous logic modules within its

quadrant of the device. Quadrant clock signals can originate

from specific I/O pins or from the internal array and can be

used as a secondary register clock, register clear, or output

enable.

Figure 7 •40MX I/O Module

From Internal Logic

To Internal Logic

Figure 8 • Routing Structure

Figure 9 •Clock Networks

Vertical Routing Tracks

Antifuses

Logic

Segmented

Horizontal

Routing

Tracks

Modules

CLKB

CLKA

From

Pads

Clock

Drivers

CLKMOD

CLKINB

CLKINA

S1 Internal

Signal

CLKO(17)

CLKO(16)

CLKO(15)

CLKO(2)

CLKO(1)

Clock T racks

40MX and 42MX FPGA Families

10 v5.0

Test Circuitry

All devices contain Actel’s ActionProbe test circuitry which

test and debug a design once it is programmed into a device.

Once a device has been programmed, the ActionProbe test

circuitry allows the designer to probe any internal node

during device operation to aid in debugging a design. In

addition, 42MX devices contain IEEE Standard 1149.1

boundary scan test circuitry.

IEEE Standard 1149.1 Boundary Scan Testing (BST)

IEEE Standard 1149.1 defines a four-pin Test Access Port

(TAP) interface for testing integrated circuits in a system.

The 42MX family provides five BST pins: Test Data In (TDI),

Test Data Out (TDO), Test Clock (TCK), and Test Mode

Select Test Reset (TRST) (42MX24A only). Devices are

configured in a test “chain” where BST data can be

transmitted serially between devices via TDO-to-TDI

interconnections. The TMS and TCK signals are shared

among all devices in the test chain so that all components

operate in the same state.

The 42MX family implements a subset of the IEEE Standard

1149.1 BST instruction in addition to a private instruction,

which allows the use of Actel’s ActionProbe facility with

BST. Refer to the IEEE Standard 1149.1 specification for

detailed information regarding BST.

Boundary Scan Circuitry

The 42MX boundary scan circuitry consists of a Test Access

Port (TAP) controller, test instruction register, a JPROBE

Figure 11 on page 11 shows a block diagram of the 42MX

boundary scan circuitry.

Figure 10 •Quadrant Clock Network

Quad

Clock

Module

QCLKA

QCLKB

*QCLK1IN

S0 S1

QCLK1

Quad

Clock

Module

*QCLK2IN

S0 S1

QCLK2

Quad

Clock

Module

QCLKC

QCLKD

*QCLK3IN

S0S1

QCLK3

Quad

Clock

Module *QCLK4IN

S0S1

QCLK4

*QCLK1IN, QCLK2IN, QCLK3IN, and QCLK4IN are internally-generated signals.

v5.0 11

40MX and 42MX FPGA Families

When a device is operating in BST mode, four I/O pins are

used for the TDI, TDO, TMS, and TCK signals. An active

reset (nTRST) pin is not supported; however, the 42MX

device contain power-on circuitry that resets the boundary

scan circuitry upon power-up. Table 1 summarizes the

functions of the IEEE 1149.1 BST signals.

JTAG

All SX-A devices are IEEE 1149.1 (JTAG) compliant. SX-A

devices offer superior diagnostic and testing capabilities by

providing JTAG and probing capabilites. These functions

are controlled through the special JTAG pins in conjunction

with the program fuse.

JTAG fuse programmed:

•TCK must be terminated—logical high or low doesn’t

matter (to avoid floating input)

•TDI, TMS may float or at logical high (internal pull-up is

present)

•TDO may float or connect to TDI of another device (it’s an

output)

JTAG fuse not programmed:

•TCK, TDI, TDO, TMS are user I/O. If not used, they will be

configured as tristated output.

BST Instructions

Boundary scan testing within the 42MX devices is controlled

by a Test Access Port (TAP) state machine. The TAP

controller drives the three-bit instruction register, a bypass

device. The TAP controller uses the TMS signal to control

the testing of the device. The BST mode is determined by

the bitstream entered on the TMS pin. Table 2 describes the

test instructions supported by the 42MX devices.

Reset

The TMS pin is equipped with an internal pull-up resistor.

This allows the TAP controller to remain in or return to the

Test-Logic-Reset state when there is no input or when a

logical 1 is on the TMS pin. To reset the controller, TMS

must be HIGH for at least five TCK cycles.

Figure 11 •42MX IEEE 1149.1 Boundary Scan Circuitry

JPROBE Register

Boundary Scan Register

Instruction

Decode

Control Logic

TAP Controller

Instruction

Bypass

TMS

TCK

TDI

Output

MUX TDO

JTAG

Table 1 •IEEE 1149.1 BST Signals

Signal Name Function

TDI Test Data In Serial data input for BST

instructions and data. Data is

shifted in on the rising edge of

TCK.

TDO Test Data

Out Serial data output for BST

instructions and test data.

TMS Test Mode

Select Serial data inpu t for BST mode .

Data is shifted in on the rising

edge of TCK.

TCK Test Clock Clock signal to shift the BST

data into the device.

40MX and 42MX FPGA Families

12 v5.0

Table 2 •BST Instructions

Test Mode Code Description

EXTEST 000 Allows the e xtern al ci rcu itry an d

board-level interconnections to

be tested by forcing a test

pattern at the output pins and

capturing test results at the

input pins.

SAMPLE/

PRELOAD 001 Allows a snap shot of th e signals

at the device pins to be

captured and examined during

device operation.

JPROBE 01 1 A private instruction allowing the

user to connect Actel’s Micro

Probe registers to the test

chain.

USER

INSTRUCTION 100 Allows the user to build

application-specific instructions

such as RAM READ and RAM

WRITE.

HIGH Z 101 Refer to the IEEE Standard

1149.1 specification.

CLAMP 110 Refer to the IEEE Standard

1149.1 specification.

BYPASS 111 Enables the bypass register

between the TDI an d TD O pins.

The test data passes through

the selected device to adjacent

devices in the test chai n.

v5.0 13

40MX and 42MX FPGA Families

5.0V Operating Conditionsand Mixed 5.0V/3.3V Operating Conditions

Absolute Maximum Ratings1

Free Air Temperature Range

Symbol Parameter Limits Units

VCCA/

VCCI DC Supply Voltage –0.5 to +7.0 V

VIInput Voltage –0.5 to VCC +0.5 V

VOOutput Voltage –0.5 to VCC +0.5 V

TSTG Storage Tempe rature –65 to +150 °C

Notes:

1. Stresses beyond those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

Exposure to absolute maximum rated conditions for extended

periods may affect device reliability. Devices should not be

operated outside the Recommended Operating Conditions.

2. Device inputs are normally high impedance and draw

extremely low current. However, when input voltage is greater

than VCCA + 0.5V or less than GND – 0.5V, the internal

protection diode will be forward-biased and can draw

excessive current.

Recommended Operating Conditions

Parameter Commercial Industrial Military Units

Temperature

Range10 to +70 –40 to +85 –55 to +125 °C

Power Supply

Tolerance ±5 ±10 ±10 %VCC

VCCI 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

VCCA 4.75 to 5.25 4.5 to 5.5 4.5 to 5.5 V

VCCI23.14 to 3.47 3.0 to 3.6 3.0 to 3.6 V

Notes:

1. Ambient temperature (TA) is used for commercial and

industrial; case temperature (TC) is used for military.

2. Operating condition for I/Os in mixed voltage mode.

Electrical Specifications

Symbol Parameter Commercial Commercial ‘–F’Industrial Military Units

Min. Max. Min. Max. Min. Max. Min. Max.

VOH1(IOH = –10 mA) 2 TTL 2.4 2.4 V

(IOH = –6 mA) TTL V

(IOH = –4 mA) TTL 3.7 3.7 V

VOL1(IOL = 10 mA) 2 TTL 0.5 0.5 V

(IOL = 6 mA) TTL 0.40 0.40 V

VIL –0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8 V

VIH 2.0 VCCI + 0.3 2.0 VCCI + 0.3 2.0 VCCI + 0.3 2.0 VCCI + 0.3 V

IIL (VIN = 0.5) –10 –10 –10 –10 µA

IIH (VIN = 2.7) –10 –10 –10 –10 µA

Input Transition Time tR, tF2500 500 500 500 ns

CIO I/O Capacitance2, 3 10 10 10 10 pF

Standby Current, ICC4

Not e s 5 & 6

25.0

Notes 6 & 7

25 mA

ICC(D) Dynamic VCCI Supply Current See the “Power Dissipation” section on page 18.

Low Power Mode Standby Current Note 8 ICC – 0.5 ICC – 0.5 ICC – 0.5 mA

Notes:

1. Only one output tested at a time. VCCI = min.

2. Not tested, for information only.

3. Includes worst-case 84-pin PLCC package capacitance. VOUT = 0 V, f = 1 MHz.

4. All outputs unloaded. All inputs = VCCI or GND. ICC limit includes IPP and ISV during normal operation.

5. A40MX02 and A40MX04 ICC = 3 mA, A42MX09 ICC = 5 mA, A42MX16 ICC = 6 mA, A42MX24, A42MX24A, and A42MX36 ICC = 25 mA.

6. ICC Max = 2 mA is available by special request. Contact your local Actel Sales representative for additional information.

7. A40MX02 and A40MX04 ICC = 10 mA, A42MX09, A42MX16, A42MX24, A42MX24A, and A42MX36 ICC = 25 mA.

8. In Low Power Mode, A42MX09 ICC = 50 µA; A42MX16, A42MX24, and A42MX36 ICC = 100 µA. A40MX02 and A40MX04 = N/A.

40MX and 42MX FPGA Families

14 v5.0

3.3V Operating Conditions

Absolute Maximum Ratings1

VCC = VCCA and VCCI

Free Air Temperature Range

Recommended Operating Conditions

Symbol Parameter Limits Units

VCC DC Supply Voltage –0.5 to +7.0 V

VIInput Voltage –0.5 to VCC +0.5 V

VOOutput Voltage –0.5 to VCC +0.5 V

IIO I/O Source Sink

Current2±20 mA

TSTG Storage Temperature –65 to +150 °C

Notes:

1. Stresses beyond those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

Exposure to absolute maximum rated conditions for extended

periods may affect device reliability. Devices should not be

operated outside the Recommended Operating Conditions.

2. Device inputs are normally high impedance and draw

extremely low current. However, when input voltage is greater

than VCC + 0.5V or less than GND – 0.5V, the internal protection

diodes will forward-bias and can draw excessive current.

Parameter Commercial Industrial Military Units

Temperature

Range10 to

+70 –40 to

+85 –55 to

+125 °C

Power Supply

Tolerance ±5 ±10 ±10 %V

VCCI 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 V

VCCA 3.0 to 3.6 3.0 to 3.6 3.0 to 3.6 V

Note:

1. Ambient temperature (TA) is used for commercial, and

industrial; case temperature (TC) is used for military.

Electrical Specifications

Parameter Commercial Commercial ‘–F’Industrial Military Units

Min. Max. Min. Max. Min. Max. Min. Max.

VOH1(IOH = –4 mA) 2.15 2.15 2.4 2.4 V

(IOH = –3.2 mA) 2.4 2.4 V

VOL1(IOL = 6 mA) 0.4 0.4 0.48 0.48 V

VIL –0.3 0.8 –0.3 0.8 –0.3 0.8 –0.3 0.8 V

VIH 2.0 VCC + 0.3 2.0 VCC + 0.3 2.0 VCC + 0.3 2.0 VCC + 0.3 V

IIL –10 –10 –10 –10 µA

IIH –10 –10 –10 –10 µA

Input Transition Time tR, tF2500 500 500 500 ns

CIO I/O Capacitance2, 3 10 10 10 10 pF

Standby Current, ICC4

Notes 5 & 6 2 5 N otes 6 & 7

25 mA

ICC(D) Dynamic VCC Supply Current See the “Power Dissipation” section on page 18.

Low Power Mode Standby Current Note 8 ICC – 5.0 ICC – 5.0 ICC – 5.0 mA

Notes:

1. Only one output IV curve tested at a time. VCC = min.

2. Not tested, for information only.

3. Includes worst-case 84-pin PLCC package capacitance. VOUT = 0 V, f = 1 MHz.

4. All outputs unloaded. All inputs = VCC or GND.

5. A40MX02 and A40MX04 ICC = 3 mA, A42MX09 ICC = 5 mA, A42MX16 ICC = 6 mA, A42MX24 and A42MX36 ICC = 25 mA.

6. ICC Max = 1.5mA is available by special request. Contact your Actel Sales representative for additional information.

7. A40MX02 and A40MX04 ICC = 10 mA, A42MX09, A42MX16, A42MX24, and A42MX36 ICC = 25 mA.

8. In Low Power Mode, A42MX09 ICC = 15 µA; A42MX16, A42MX24, A42MX36 ICC = 50 µA. A40MX02 and A40MX04 = N/A.

v5.0 15

40MX and 42MX FPGA Families

Output Drive Characteristics for

5.0V PCI Signaling

MX PCI device I/O drivers were designed specifically for

high-performance PCI systems. Figure 12 on page 17 shows

the typical output drive characteristics of the MX devices.

MX output drivers are compliant with the PCI Local Bus

Specification.

DC Specification (5.0V PCI Signaling)1

PCI MX

Symbol Parameter Condition Minimum Maximum Minimum Maximum Units

VCC Supply Voltage 4.75 5.25 4.75 5.252V

VIH Input High Voltage 2.0 VCC + 0.5 2.0 VCC + 0. 3 V

VIL Input Low Voltage –0.5 0.8 –0.3 0.8 V

IIH Input High Leakage Current VIN = 2.7 70 —10 µA

IIL Input Low Leakage Current VIN=0.5 –70 —–10 µA

VOH Output High Voltage IOUT = –2 mA

IOUT = –6 mA 2.4 3.84 V

VOL Output Low Voltage IOUT = 3 mA,

6 mA 0.55 —0.33 V

CIN Input Pin Capacitance 10 —10 pF

CCLK CLK Pin Capacitance 5 12 —10 pF

LPIN Pin Inductance 20 —< 8 nH3nH

Notes:

1. PCI Local Bus Specification Section 4.2.1.1.

2. Maximum rating for VCC –0.5V to 7.0V.

3. Dependent upon the chosen package. PCI recommends QFP and BGA packaging to reduce pin inductance and capacitance.

AC Specifications (5.0V PCI Signaling)1

PCI MX

Symbol Parameter Condition Minimum Maximum Minimum Maximum Units

ICL Low Clamp Current –5 < VIN ≤ –1–25 + (VIN +1)

/0.015 –60 –10 mA

Slew (r) Output Rise Slew Rate 0.4V to 2.4V load 1 5 1.8 2.8 V/ns

Slew (f) Output Fall Slew Rate 2.4V to 0.4V load 1 5 2.8 4.3 V/ns

Note:

1. PCI Local Bus Specification Section 4.2.1.2.

40MX and 42MX FPGA Families

16 v5.0

Output Drive Characteristics for 3.3V PCI Signaling

DC Specification (3.3V PCI Signaling)1

PCI MX

Symbol Parameter Condition Minimum Maximum Minimum Maximum Units

VCC Supply Voltage 3.0 3.6 3.0 3.6 V

VIH Input High Voltage 0.5 VCC + 0.5 0.5 VCC + 0.3 V

VIL Input Low Voltage –0.5 0.8 –0.3 0.8 V

IIH Input High Leakage Current VIN = 2.7 70 10 µA

IIL Input Leakage Current –70 –10 µA

VOH Output High Voltage IOUT = –2 mA 0.9 3.3 V

VOL Output Low Voltage IOUT = 3 mA,

6 mA 0.1 0.1 VCC V

CIN Input Pin Capacitance 10 10 pF

CCLK CLK Pin Capacitance 5 12 10 pF

LPIN Pin Inductance 20 < 8 nH3nH

Notes:

1. PCI Local Bus Specification Section 4.2.2.1.

2. Maximum rating for VCC –0.5V to 7.0V.

3. Dependent upon the chosen package. PCI recommends QFP and BGA packaging to reduce pin inductance and capacitance.

AC Specifications for (3.3V PCI Signaling)1

PCI MX

Symbol Parameter Condition Minimum Maximum Minimum Maximum Units

ICL Low Clamp Current –5 < VIN ≤ –1–25 + (VIN +1)

/0.015 –60 –10 mA

Slew (r) Output Rise Slew Rate 0.2V to 0.6V load 1 4 1.8 2.8 V/ns

Slew (f) Output Fall Slew Rate 0.6V to 0.2V load 1 4 2.8 4.0 V/ns

Note:

1. PCI Local Bus Specification Section 4.2.2.2.

v5.0 17

40MX and 42MX FPGA Families

Figure 12 •Typical Output Drive Characteristics (Based upon measured data)

–0.20

–0.15

–0.10

–0.05

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0123456

Voltage Out (V)

Current (A)

MX PCI I

PCI I

Maximum

PCI I

Minimum

PCI I

Minimum

PCI I

Maximum

40MX and 42MX FPGA Families

18 v5.0

Package Thermal Characteristics

The device junction-to-case thermal characteristic is θjc,

and the junction-to-ambient air characteristic is θja. The

thermal characteristics for θja are shown with two different

air flow rates. Ambient temperature (TA) is used for

commercial and industrial; case temperature (TC) is used

for military.

Maximum junction temperature is 150°C.

A sample calculation of the absolute maximum power

dissipation allowed for a PQFP 160-pin package at

commercial temperature is as follows:

Power Dissipation

General Power Equation

P = [ICCstandby + ICCactive] * VCCI + IOL* VOL* N

+ IOH * (VCCI – VOH) * M

where:

ICCstandby is the current flowing when no inputs or

outputs are changing.

ICCactive is the current flowing due to CMOS switching.

IOL, IOH are TTL sink/source currents.

VOL, VOH are TTL level output voltages.

N equals the number of outputs driving TTL loads to VOL.

M equals the number of outputs driving TTL loads to VOH.

Accurate values for N and M are difficult to determine

because they depend on the family type, on design details,

and on the system I/O. The power can be divided into two

components: static and active.

Static Power Component

Actel FPGAs have small static power components that

result in power dissipation lower than PALs or CPLDs. By

integrating multiple PALs/CPLDs into one FPGA, an even

greater reduction in board-level power dissipation can

be achieved.

The power due to standby current is typically a small

component of the overall power. Standby power is

calculated for commercial, worst-case conditions:

ICC VCCA Power

2 mA 5.25 V 10.5 mW

The static power dissipation by TTL loads depends on the

number of outputs driving HIGH or LOW, and on the DC load

current. Again, this number is typically small. For instance,

a 32-bit bus sinking 4 mA at 0.33V will generate 42 mW with

all outputs driving LOW, and 140 mW with all outputs driving

HIGH. The actual dissipation will average somewhere in

between, as I/Os switch states with time.

Plastic Packages Pin Count θjc

θja

S till Air 300 ft/min

Plastic Quad Flat Pack 100 12 34°C/W 31°C/W

Plastic Quad Flat Pack 160 10 32°C/W 24°C/W

Plastic Quad Flat Pack 208 8 30°C/W 23°C/W

Plastic Quad Flat Pack 240 3.5 19°C/W 16°C/W

Plastic Leaded Chip Carrier 44 16 43°C/W 31°C/W

Plastic Leaded Chip Carrier 68 13 36°C/W 25°C/W

Plastic Leaded Chip Carrier 84 12 32°C/W 22°C/W

Thin Plastic Quad Flat Pack 176 11 28°C/W 21°C/W

Very Thin Plastic Quad Flat Pack 80 12 39°C/W 33°C/W

Very Thin Plastic Quad Flat Pack 100 10 38°C/W 32°C/W

Plastic Ball Grid Array 272 3 20°C/W 14.5°C/W

Ceramic Packages Pin Count θjc

θja

Still Air

Ceramic Quad Flat Pack 208 6.3 22°C/W

Ceramic Quad Flat Pack 256 6.2 20°C/W

Max. junction temp. (°C) – Max. commercial temp.

θja (°C/W)

----------------------------------------------------------------------------------------------------------------------------- 150°C – 70°C

32°C/W

--------------------------------- 2.5W==

v5.0 19

40MX and 42MX FPGA Families

Active Power Component

Power dissipation in CMOS devices is usually dominated by

the active (dynamic) power dissipation. This component is

frequency-dependent and a function of the logic and the

external I/O. Active power dissipation results from charging

internal chip capacitances of the interconnect,

unprogrammed antifuses, module inputs, and module

outputs, plus external capacitance due to PC board traces

and load device inputs. An additional component of the

active power dissipation is the totem pole current in the

CMOS transistor pairs. The net effect can be associated

with an equivalent capacitance that can be combined with

frequency and voltage to represent active power dissipation.

Equivalent Capacitance

The power dissipated by a CMOS circuit can be expressed by

the equation:

Power (µW) = CEQ * VCCA2 * F (1)

where:

CEQ = Equivalent capacitance expressed in picofarads

(pF)

VCCA = Power supply in volts (V)

F = Switching frequency in megahertz (MHz)

Equivalent capacitance is calculated by measuring

ICCactive at a specified frequency and voltage for each

circuit component of interest. Measurements have been

made over a range of frequencies at a fixed value of VCC.

Equivalent capacitance is frequency-independent, so the

results can be used over a wide range of operating

conditions. Equivalent capacitance values are shown below.

CEQ Values for Actel MX FPGAs

Modules (CEQM)3.5

Input Buffers (CEQI)6.9

Output Buffers (CEQO) 18.2

Routed Array Clock Buffer Loads (CEQCR)1.4

To calculate the active power dissipated from the complete

design, the switching frequency of each part of the logic

must be known. The equation below shows a piece-wise

linear summation over all components.

Power = VCCA2 * [(m x CEQM * fm)Modules +

(n * CEQI * fn)Inputs + (p * (CEQO + CL) * fp)outputs +

0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 * fq1)routed_Clk1 +

0.5 * (q2 * CEQCR * fq2)routed_Clk2 + (r2 * fq2)routed_Clk2 (2)

where:

Fixed Capacitance Values

for MX FPGAs (pF)

m = Number of logic modules switching at frequency fm

n = Number of input buffers switching at frequency fn

p = Number of output buffers switching at frequency fp

q1= Number of clock loads on the first routed array

clock

q2= Number of clock loads on the second routed array

clock

r1= lFixed capacitance due to first routed array clock

r2= Fixed capacitance due to second routed array

clock

CEQM = Equivalent capacitance of logic modules in pF

CEQI = Equivalent capacitance of input buffers in pF

CEQO = Equivalent capacitance of output buffers in pF

CEQCR = Equivalent capacitance of routed array clock in pF

CL= Output load capacitance in p

fm= Average logic module switching rate in MHz

fn= Average input buffer switching rate in MHz

fp= Average output buffer switching rate in MHz

fq1 = Average first routed array clock rate in MHz

fq2 = Average second routed array clock rate in MHz

Device Type

routed_Clk1

routed_Clk2

A40MX02 41.4 N/A

A40MX04 68.6 N/A

A42MX09 118 118

A42MX16 165 165

A42MX24 185 185

A42MX36 220 220

40MX and 42MX FPGA Families

20 v5.0

Determining Average Switching Frequency

To determine the switching frequency for a design, the data

input values to the circuit must be clearly understood. The

following guidelines represent worst-case scenarios; these

can be used to generally predict the upper limits of power

dissipation.

Logic Modules (m) = 80% of

Combinatorial

Modules

Inputs Switching (n) = # of Inputs/4

Outputs Switching (p) = # of Outputs/4

First Routed Array Clock Loads

(q1)

= 40% of Sequential

Modules

Second Routed Array Clock

Loads (q2)

= 40% of Sequential

Modules

Load Capacitance (CL) = 35 pF

Average Logic Module Switching

Rate (fm)

=F/10

Average Input Switching Rate

(fn)

=F/5

Average Output Switching Rate

(fp)

=F/10

Average First Routed Array

Clock Rate (fq1)

Average Second Routed Array

Clock Rate (fq2)

=F/2

Logic Modules (m) = 80% of

Combinatorial

Modules

40MX Timing Model*

* Values are shown for 40MX ‘–3’ speed devices at 5.0V worst-case commercial conditions.

Output DelayInput Delay

I/O ModuletINYL = 0.62 ns tIRD2 = 2.5 9 ns

Logic Module

tPD = 1.24 ns

I/O Module

tRD1 = 1.28 ns

tDLH = 3.32 ns

Array

Clock

FMAX = 180 MHz

tRD4 = 2.33 ns

tRD8 = 4.93 ns

Predicted

Routing

Delays

tCKH = 4.55 ns FO = 128

tIRD1 = 2.09 ns

tIRD4 = 3.64 ns

tIRD8 = 5.73 ns tCO = 1.24 ns tENHZ = 7.92 ns

tRD2 = 1.80 ns

Internal Delays

v5.0 21

40MX and 42MX FPGA Families

42MX Timing Model*

*Values are shown for A42MX09 ‘–2’ at 5.0V worst-case commercial conditions

† Input module predicted routing delay

Output DelaysInternal DelaysInput Delays

tINH = 0.00 ns

tINSU = 0.54 ns

I/O Module

tINGL = 1.40 ns

tINYL = 1.16 ns tIRD1 =

Combinatorial

Logic Modul e

tPD = 1.55 ns

Sequential

Logic Module

I/O Module

tRD1 = 0.80 ns tDLH = 2.70 ns

I/O Module

Array

Clocks

FMAX = 245 MHz

Combin-

atorial

Logic

included

in tSUD

DQDQ

tOUTH = 0.00 ns

tOUTSU = 0.30 ns

tGLH = 2.90 ns

tDLH = 2.70 ns

tENHZ = 5.40 ns

tRD1 = 0.80 ns

tCO = 1.37 ns

tSUD = 0.36 ns

tHD = 0.00 ns

tRD4 = 1.50 ns

tRD8 = 2.50 ns

Predicted

Routing

Delays

tCKH = 2.70 ns

FO = 32

tRD2 = 1.00 ns

tLCO = 5.60 ns (light loads, pad-to-pad)

2.24 ns†

40MX and 42MX FPGA Families

22 v5.0

42MX Timing Model (Logic Functions using Quadrant Clocks)*

* Preliminary values are shown for A42MX36 ‘–2’ at 5.0V worst-case commercial conditions

** Load-dependent

Output DelaysInternal DelaysInput Delays

tINH = 0.00 ns

tINSU = 0.53 ns

I/O Module

tINGO = 1.55 ns

tINPY = 1.14 ns tIRD1 = 2.18 ns Combinatorial

Module

tPD = 1.46 ns

Sequential

Logic Module

I/O Module

tRD1 = 1.04 ns tDLH = 2.84 ns

I/O Module

Quadrant

Clocks

FMAX = 163 MHz

Combin-

atorial

Logic

included

in tSUD

DQDQ

tLH = 0.00 ns

tLSU = 0.53 ns

tGHL= 3.27 ns

tDLH = 2.84 ns

tENHZ = 5.80 ns

tRD1 = 1.04 ns

tCO = 1.43 ns

tSUD = 0.30 ns

tHD = 0.00 ns

Predicted

Routing

Delays

Decode

Module

tPDD = 1.78 ns

tRDD = 0.38 ns

tRD2 = 1.42 ns

tRD4 = 2.18 ns

tCKH = 3. 03 ns**

v5.0 23

40MX and 42MX FPGA Families

42MX Timing Model (SRAM Functions)*

*Values are shown for A42MX36 ‘–2’ at 5.0V worst-case commercial conditions.

tINH = 0.00 ns

tINSU = 0.53 ns

Input Delays

I/O Module

tINGO = 1.55 ns

tINPY = 1.14 ns tIRD1 = 2.18 ns

Array

Clocks

FMAX = 151 MHz

tGHL= 5.50 ns

tLSU = 0.30 ns

I/O Module

tLH = 0.00 ns

tDLH = 2.84 ns

WD [7:0]

WRAD [5:0]

BLKEN

WEN

WCLK

tADSU = 1.80 ns

tADH = 0.00 ns

tWENSU = 2.90 ns

tBENS = 2.90 ns

RD [7:0]

RDAD [5:0]

REN

RCLK

tADSU = 1.80 ns

tADH = 0.00 ns

tRENSU = 0.80 ns

tRD1 = 1.04 ns

Predicted

Routing

Delays

tRCO = 3.80 ns

40MX and 42MX FPGA Families

24 v5.0

Parameter Measurement

Output Buffer Delays

AC Test Loads

Input Buffer Delays Module Delays

To AC test loads (shown below)PAD

TRIBUFF

In 50%

PAD

VOL

VOH

1.5V

tDLH

50%

1.5V

tDHL

E50%

PAD VOL

1.5V

tENZL

50%

10%

tENLZ

E50%

PAD

GND

VOH

1.5V

tENZH

50%

90%

tENHZ

VCCI

Load 1

(Used to measure propagation delay) Load 2

(Used to measure rising/falling edges)

35 pF

To the output under test VCCI GND

35 pF

To the output under test

R to VCCI for tPLZ/tPZL

R to GND for tPHZ/tPZH

R = 1 kΩ

PAD Y

INBUF

PAD 3V 0V

1.5V

GND

VCCI

50%

tINYH

1.5V

50%

tINYL

S, A or B

50%

tPLH

50%

50% 50%

tPHL

tPLH

v5.0 25

40MX and 42MX FPGA Families

Sequential Module Timing Characteristics

Flip-Flops and Latches

Note: D represents all data functions involving A, B, and S for multiplexed flip-flops.

(Positive Edge-Triggered)

CLK CLR

PRE Y

G, CLK

PRE, CLR

tWCLKA

tWASYN

tHD

tSUENA

tSUD

tRS

tWCLKI

tCO

tHENA

40MX and 42MX FPGA Families

26 v5.0

Sequential Timing Characteristics (continued)

Input Buffer Latches

Output Buffer Latches

PAD

CLK

DATA

CLK

tINH

CLKBUF

tINSU

tSUEXT

tHEXT

IBDL

DATA

tOUTSU

tOUTH

PAD

OBDLHS

v5.0 27

40MX and 42MX FPGA Families

Decode Module Timing

SRAM Timing Characteristics

A–G, H

tPLH

50%

tPHL

WRAD [5:0]

BLKEN

WEN

WCLK

RDAD [5:0]

LEW

REN

RCLK

RD [7:0]

WD [7:0]

Write Port Read Port

RAM Array

32x8 or 64x4

(256 Bits)

40MX and 42MX FPGA Families

28 v5.0

Dual-Port SRAM Timing Waveforms

42MX SRAM Write Operation

42MX SRAM Synchronous Read Operation

Note: Identical timing for falling edge clock.

WCLK

WD[7:0]

WRAD[5:0]

WEN

BLKEN Valid

Valid

tRCKHL

tWENSU

tBENSU

tWENH

tBENH

tADSU tADH

Note: Identical timing for falling edge clock.

RCLK

REN

RDAD[5:0]

RD[7:0] Old Data

Valid

tRCKHL

tCKHL

tRENH

tRCO

tADH

tDOH

tADSU

New Data

tRENSU

v5.0 29

40MX and 42MX FPGA Families

42MX SRAM Asynchronous Read Operation—Type 1

42MX SRAM Asynchronous Read Operation—Type 2

(Read Address Controlled)

(Write Address Controlled)

RDAD[5:0]

RD[7:0] Data 1

tRDADV

tDOH

ADDR2ADDR1

Data 2

tRPD

WEN

WD[7:0]

WCLK

RD[7:0] Old Data

Valid

tWENH

tRPD

tWENSU

New Data

tDOH

tADSU

WRAD[5:0]

BLKEN

tADH

40MX and 42MX FPGA Families

30 v5.0

Predictable Performance:

Tight Delay Distributions

Propagation delay between logic modules depends on the

resistive and capacitive loading of the routing tracks, the

interconnect elements, and the module inputs being driven.

Propagation delay increases as the length of routing tracks,

the number of interconnect elements, or the number of

inputs increases.

From a design perspective, the propagation delay can be

statistically correlated or modeled by the fanout (number of

loads) driven by a module. Higher fanout usually requires

some paths to have longer routing tracks.

The MX FPGAs deliver a tight fanout delay distribution,

which is achieved in two ways: by decreasing the delay of the

interconnect elements and by decreasing the number of

interconnect elements per path.

Actel’s patented antifuse offers a very low

resistive/capacitive interconnect. The antifuses, fabricated

in 0.45 µ lithography, offer nominal levels of 100 ¾

resistance and 7.0 femtofarad (fF) capacitance per antifuse.

MX fanout distribution is also tight due to the low number of

antifuses required for each interconnect path. The

proprietary architecture limits the number of antifuses per

path to a maximum of four, with 90 percent of interconnects

using only two antifuses.

Timing Characteristics

Device timing characteristics fall into three categories:

family-dependent, device-dependent, and design-dependent.

The input and output buffer characteristics are common to

all MX devices. For mixed voltage of the A42MX devices, the

timing numbers are defined in the 3.3V section for I/Os while

for the internal logic resources, the timing numbers are

defined in the 5.0V section. Internal routing delays are

device-dependent. Design dependency means actual delays

are not determined until after place-and-route of the user’s

design is complete. Delay values may then be determined by

using the Designer Series utility or by performing simulation

with post-layout delays.

Critical Nets and Typical Nets

Propagation delays in this data sheet apply to typical nets.

The abundant routing resources in the MX architecture

allows for deterministic timing using Actel’s Designer Series

development tools, which include TDPR, a timing-driven

place-and-route tool. Using Timer, the designer can specify

timing-critical nets and system clock frequency. Using these

timing specifications, the place-and-route software

optimizes the layout of the design to meet the user’s

specifications.

Long Tracks

Some nets in the design use long tracks, which are special

routing resources that span multiple rows, columns, or

modules. Long tracks employ three and sometimes four

antifuse connections, which increase capacitance and

resistance, resulting in longer net delays for macros

connected to long tracks. Typically, up to 6 percent of

nets in a fully utilized device require long tracks. Long

tracks add approximately a 3 ns to a 6 ns delay, which is

represented statistically in higher fanout (FO=8) routing

delays in the data sheet specifications section, beginning on

page 34.

Timing Derating

A timing derating factor of 0.45 is used to reflect best-case

processing. Note that this factor is relative to the standard

speed timing parameters and must be multiplied by the

appropriate voltage and temperature derating factors for a

given application.

Timing Derating Factors

Commercial to Industrial

Commercial Worst-Case to Typical

Industrial

Min. Max.

(Commercial Specification) x 0 .69 1.11

Commerical Typical

(TJ = 25°C, VCC = 5.0V)

(Commercial, Worst-Case

Condition) x 0.85

Note: This derating factor applies to all routing and propagation

delays.

v5.0 31

40MX and 42MX FPGA Families

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

4.50 4.75 5.00 5.25 5.50

Voltage (V)

Derating Factor

–55 C

–40 C

0 C

25 C

70 C

85 C

125 C

42MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCCA/VCCI = 5.0V)

42MX

Voltage

Temperature

–55°C–40°C0°C25°C 70°C 85°C125°C

4.50 0.93 0.95 1.05 1.09 1.25 1.29 1.41

4.75 0.88 0.90 1.00 1.03 1.18 1.22 1.34

5.00 0.85 0.87 0.96 1.00 1.15 1.18 1.29

5.25 0.84 0.86 0.95 0.97 1.12 1.14 1.28

5.50 0.83 0.85 0.94 0.96 1.10 1.13 1.26

Note: This derating factor applies to all routing and propagation delays.

(Normalized to TJ = 25°C, VCCA/VCCI = 5.0V)

40MX and 42MX FPGA Families

32 v5.0

40MX Temperature and Voltage Derating Factors

(Normalized to TJ = 25°C, VCCA/VCCI = 5.0V)

40MX

Voltage

Temperature

–55°C–40°C0°C 25°C70°C 85°C 125°C

4.50 0.89 0.93 1.02 1.09 1.25 1.31 1.45

4.75 0.84 0.88 0.97 1.03 1.18 1.24 1.37

5.00 0.82 0.85 0.94 1.00 1.15 1.20 1.33

5.25 0.80 0.82 0.91 0.97 1.12 1.16 1.29

5.50 0.79 0.82 0.90 0.96 1.10 1.15 1.28

Note: This derating factor applies to all routing and propagation delays.

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

1.50

4.50 4.75 5.00 5.25 5.50

Voltage (V)

Derating Factor

–55 C

–40 C

0 C

25 C

70 C

85 C

125 C

40MX Junction Temperature and Voltage Derating Curves

(Normalized to TJ = 25 °C, VCCA/VCCI = 5.0V)

v5.0 33

40MX and 42MX FPGA Families

PCI System Timing Specification

Table 3 and Table 4 list the critical PCI timing parameters

and the corresponding timing parameter for the MX

PCI-compliant devices.

PCI Models

Actel provides synthesizable VHDL and Verilog-HDL models

for a PCI Target interface, a PCI Target and Target+DMA

Master interface. Contact your Actel sales representative

for more details.

Table 3 •Clock Specification for 33 MHz PCI

PCI A42MX24 A42MX36

Symbol Parameter Min. Max. Min. Max. Min. Max. Units

TCYC CLK Cycle Time 30 —4.0 —4.0 —ns

THIGH CLK High Time 11 —1.9 —1.9 —ns

TLOW CLK Low Time 11 —1.9 —1.9 —ns

Table 4 •Timing Parameters for 33 MHz PCI

PCI A42MX24 A42MX36

SymbolParameter Min.Max.Min.Max.Min.Max.Units

TVAL CLK to Signal Valid—Bused Signals 2 11 2.0 9.0 2.0 9.0 ns

TVAL(PTP) CL K to Signal Valid—Point-to-Point 2 12 2.0 9.0 2.0 9.0 ns

TON Float to Active 2 —2.0 4.0 2.0 4.0 ns

TOFF Active to Float —28 —8.31—8.31ns

TSU Input Set-Up Time to CLK—Bused Signals 7 —1.5 —1.5 —ns

TSU(PTP) Input Set-Up Time to CLK—Point-to-Point 10, 12 —1.5 —1.5 —ns

THInput Hold to CLK 0 —0—0—ns

Note:

1. TOFF is system dependent. MX PCI devices have 7.4 ns turn-off time, reflection is typically an additional 10 ns.

40MX and 42MX FPGA Families

34 v5.0

A40MX02 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Spee d ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays

tPD1 Single Module 1.2 1.4 1.6 1.9 2.7 ns

tPD2 Dual-Module Macros 2.7 3.1 3.5 4.1 5.7 ns

tCO Sequenti al C l ock-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tGO Latc h G-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tRS Flip-Flop (Latch) Re se t-to-Q 1.2 1.4 1.6 1. 9 2.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 1.3 1.5 1.7 2.0 2.8 ns

tRD2 FO=2 Routing Delay 1.8 2.1 2.4 2.8 3.9 ns

tRD3 FO=3 Routing Delay 2.3 2.7 3.0 3.6 5.0 ns

tRD4 FO=4 Routing Delay 2.9 3.3 3.7 4.4 6.1 ns

tRD8 FO=8 Routing Delay 4.9 5.7 6.5 7.6 10.6 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Data Input Set - U p 3.1 3. 5 4.0 4 .7 6.6 ns

tHD3Flip-Flop (Latch ) Da ta Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA F l ip-Flop (Latch) Enabl e Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHENA F l i p-Flop (Latch) Enable H old 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Fli p-Flop (Latch) Clock Active Pulse

Width 3.3 3.8 4.3 5.0 7.0 ns

tWASYN Flip -F lop (Latch)

Asynchronous Pulse Width 3.3 3.8 4.3 5.0 7.0 ns

tAFlip-Flop C l ock Input Perio d 4.8 5.6 6.3 7.5 10.4 ns

fMAX Flip-Flop (Latch ) Clock

Fre quency (FO = 128) 181 168 154 134 80 MHz

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Series or later Timer to check the hold time for this macro.

v5.0 35

40MX and 42MX FPGA Families

A40MX02 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 0.7 0.8 0 .9 1 .1 1 .5 ns

tINYL Pad-to-Y LOW 0.6 0.7 0.8 1 .0 1.3 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.1 2.4 2.2 3.2 4.5 ns

tIRD2 FO=2 Routing Delay 2.6 3.0 3.4 4.0 5.6 ns

tIRD3 FO=3 Routing Delay 3.1 3.6 4.1 4.8 6.7 ns

tIRD4 FO=4 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD8 FO=8 Rout i ng Delay 5.7 6.6 7 .5 8.8 12.4 ns

Global Clock Network

tCKH Input Low to HIGH FO = 16

FO = 128 4.6

4.6 5.3

5.3 6.0

6.0 7.0

7.0 9.8

9.8 ns

tCKL Input High to LOW FO = 16

FO = 128 4.8

4.8 5.6

5.6 6.3

6.3 7.4

7.4 10.4

10.4 ns

tPWH Minimum Pulse Width HIGH FO = 16

FO = 128 2.2

2.4 2.6

2.7 2.9

3.1 3.4

3.6 4.8

5.1 ns

tPWL Minimum Pu ls e Width LOW FO = 16

FO = 128 2.2

2.4 2.6

2.7 2.9

3.01 3.4

3.6 4.8

5.1 ns

tCKSW Maximum Skew FO = 16

FO = 128 0.4

0.5 0.5

0.6 0.5

0.7 0.6

0.8 0.8

1.2 ns

tPMinimum Period FO = 16

FO = 128 4.7

4.8 5.4

5.6 6.1

6.3 7.2

7.5 10.0

10.4 ns

fMAX Max i mum Frequency FO = 16

FO = 128 188

181 175

168 160

154 139

134 83

80 MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

40MX and 42MX FPGA Families

36 v5.0

A40MX02 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Spee d ‘Std’ Speed ‘–F’ Sp eed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.3 3.8 4.3 5.1 7.2 ns

tDHL Data- to -Pa d LO W 4.0 4.6 5.2 6.1 8. 6 ns

tENZH Enable Pad Z to HIGH 3.7 4.3 4.9 5.8 8.0 ns

tENZL Enab l e Pad Z to LOW 4.7 5.4 6.1 7.2 10.1 ns

tENHZ Enabl e Pad HIGH t o Z 7.9 9.1 10.4 12.2 17.1 ns

tENLZ Enable Pad LOW to Z 5.9 6. 8 7. 7 9.0 12.6 ns

dTLH2Delta LOW to HIGH 0.02 0.02 0.03 0.03 0.04 ns/ pF

dTHL2De lta HIGH to L OW 0.03 0.03 0.03 0. 0 4 0.06 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.9 4.5 5.1 6.05 8.5 ns

tDHL Data- to -Pa d LO W 3.4 3.9 4.4 5.2 7. 3 ns

tENZH Enable Pad Z to HIGH 3.4 3.9 4.4 5.2 7.3 ns

tENZL Enab l e Pad Z to LOW 4.9 5.6 6.4 7.5 10.5 ns

tENHZ Enabl e Pad HIGH t o Z 7.9 9.1 10.4 12.2 17.0 ns

tENLZ Enable Pad LOW to Z 5.9 6. 8 7. 7 9.0 12.6 ns

dTLH2Delta LOW to HIGH 0.03 0.04 0.04 0.05 0.07 ns/ pF

dTHL2De lta HIGH to L OW 0.02 0.02 0.03 0. 0 3 0.04 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

v5.0 37

40MX and 42MX FPGA Families

A40MX02 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Spee d ‘–1’ Speed ‘Std’ Spe ed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays

tPD1 Sing l e Module 1.7 2.0 2.3 2 .7 3 .7 ns

tPD2 Dual-Module Macros 3.7 4.3 4.9 5.7 8.0 ns

tCO Sequential Clock-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tGO Latc h G-to-Q 1.7 2.0 2.3 2.7 3.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.7 2.0 2.3 2.7 3.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 2.0 2.2 2.5 3.0 4.2 ns

tRD2 FO=2 Routing Delay 2.7 3.1 3.5 4.1 5.7 ns

tRD3 FO=3 Routing Delay 3.4 3.9 4.4 5.2 7.3 ns

tRD4 FO=4 Routing Delay 4.2 4.8 5.4 6.3 8.9 ns

tRD8 FO=8 Routin g De l ay 7.1 8.2 9.2 10.9 15. 2 n s

Logic Module Sequential Timing2

tSUD Flip - Fl op (La tc h ) Da ta In put Se t- U p 4. 3 4.9 5.6 6 .6 9.2 ns

tHD3Flip-Flop (Latch) Data Input Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 4.3 4.9 5.6 6.6 9.2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 4.6 5.3 6.0 7.0 9.8 ns

tWASYN Flip-Flop (Latch)

Async hronous Pulse Width 4 .6 5 .3 6.0 7.0 9.8 ns

tAFlip-F l op Clock Inpu t Period 6.8 7.8 8.9 10.4 14.6 ns

fMAX Flip-Flop (Latch) Clock

Frequency (FO = 128) 109 101 92 80 48 MHz

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Series or later Timer to check the hold time for this macro.

40MX and 42MX FPGA Families

38 v5.0

A40MX02 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Spee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Spee d ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.1 1.3 1.5 2.1 ns

tINYL P ad -to - Y LO W 0.9 1.0 1.1 1.3 1.9 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.9 3.4 3.8 4.5 6.3 ns

tIRD2 FO=2 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD3 FO=3 Routing Delay 4.4 5.0 5.7 6.7 9.4 ns

tIRD4 FO=4 Routing Delay 5.1 5.9 6.7 7.8 11.0 ns

tIRD8 FO=8 Routing Delay 8.0 9.26 10.5 12.6 17.3 ns

Global Clock Network

tCKH Input LOW to HI GH FO = 16

FO = 128 6.4

6.4 7.4

7.4 8.3

8.3 9.8

9.8 13.7

13.7 ns

tCKL Input HIGH to LOW FO = 16

FO = 128 6.7

6.7 7.8

7.8 8.8

8.8 10.4

10.4 14.5

14.5 ns

tPWH Minimum Pulse Width

HIGH FO = 16

FO = 128 3.1

3.3 3.6

3.8 4.1

4.3 4.8

5.1 6.7

7.1 ns

tPWL Minimum Pulse Width

LOW FO = 16

FO = 128 3.1

3.3 3.6

3.8 4.1

4.3 4.8

5.1 6.7

7.1 ns

tCKSW Maximum Skew FO = 16

FO = 128 0.6

0.8 0.6

0.9 0.7

1.0 0.8

1.2 1.2

1.6 ns

tPMinimum Period FO = 16

FO = 128 6.5

6.8 7.5

7.8 8.5

8.9 10.1

10.4 14.1

14.6 ns

fMAX Maximum Frequency FO = 16

FO = 128 113

109 105

101 96

92 83

80 50

48 MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 39

40MX and 42MX FPGA Families

A40MX02 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 4.7 5.4 6 .1 7.2 10.0 ns

tDHL Data-to-Pad LOW 5.6 6.4 7.3 8. 6 12.0 ns

tENZH Enable Pad Z to HI GH 5.2 6.0 6.8 8.1 11.3 ns

tENZL Enable Pad Z to LOW 6.6 7.6 8.6 10.1 14.1 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH2Del ta LOW to HIGH 0.03 0.03 0.04 0.04 0.06 n s/pF

dTHL2Delta HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 5.5 6.4 7.2 8.5 11.9 ns

tDHL Data-to-Pad LOW 4.8 5.5 6.2 7. 3 10.2 ns

tENZH Enable Pad Z to HI GH 4.7 5.5 6.2 7.3 10.2 ns

tENZL Enable Pad Z to LOW 6.8 7.9 8.9 10.5 14.7 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH2Del ta LOW to HIGH 0.05 0.05 0.06 0.07 0.10 n s/pF

dTHL2Delta HIGH to LOW 0.03 0.03 0.04 0.04 0.06 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

40 v5.0

A40MX04 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays

tPD1 Si ngle Module 1.2 1.4 1.6 1.9 2.7 ns

tPD2 Dual-Module Macros 2.3 3.1 3.5 4.1 5.7 ns

tCO Sequenti al C l ock-to-Q 1.2 1.4 1.6 1.9 2.7 ns

tGO Latc h G-to - Q 1.2 1 .4 1.6 1.9 2.7 ns

tRS Flip-Flop (Latch) Reset-to-Q 1.2 1.4 1.6 1.9 2.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO = 1 R outing Delay 1.2 1.6 1.8 2.1 3.0 ns

tRD2 FO = 2 R outing Delay 1.9 2.2 2.5 2.9 4.1 ns

tRD3 FO = 3 R outing Delay 2.4 2.8 3.2 3.7 5.2 ns

tRD4 FO = 4 R outing Delay 2.9 3.4 3.9 4.5 6.3 ns

tRD8 FO = 8 R outing Delay 5.0 5.8 6.6 7.8 10.9 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latc h) D ata Input Set-Up 3.1 3.5 4.0 4.7 6.6 ns

tHD3Flip-Flop (Latc h) Data I nput Hold 0.0 0.0 0 .0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 3.1 3.5 4 .0 4.7 6.6 ns

tHENA Flip-Flop (Latch) Enable Hold 0. 0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 3.3 3.8 4.3 5.0 7.0 ns

tWASYN Flip-Flop (Latch)

As ynchron ous Pulse Wi dth 3.3 3.8 4.3 5.0 7.0 ns

tAFlip-Flop Clock Input Period 4.8 5.6 6.3 7.5 10.4 ns

fMAX Flip-Flop (Latch) Clock Frequency

(FO = 128) 181 16 7 154 134 80 MHz

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Series or later Timer to check the hold time for this macro.

v5.0 41

40MX and 42MX FPGA Families

A40MX04 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 0.7 0.8 0 .9 1 .1 1 .5 ns

tINYL Pad-to-Y LOW 0.6 0.7 0.8 1 .0 1.3 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.1 2.4 2.2 3.2 4.5 ns

tIRD2 FO=2 Routing Delay 2.6 3.0 3.4 4.0 5.6 ns

tIRD3 FO=3 Routing Delay 3.1 3.6 4.1 4.8 6.7 ns

tIRD4 FO=4 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD8 FO=8 Rout i ng Delay 5.7 6.6 7 .5 8.8 12.4 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 16

FO = 128 4.6

4.6 5.3

5.3 6.0

6.0 7.1

7.1 9.9

9.9 ns

tCKL Input HIGH to LOW FO = 16

FO = 128 4.8

4.8 5.6

5.6 6.3

6.3 7.5

7.5 10.4

10.4 ns

tPWH Minimum Pulse Width HIGH FO = 16

FO = 128 2.2

2.4 2.6

2.7 2.9

3.1 3.4

3.6 4.8

5.1 ns

tPWL Minimum Pu ls e Width LOW FO = 16

FO = 128 2.2

2.4 2.6

2.7 2.9

3.1 3.4

3.6 4.8

5.1 ns

tCKSW Maximum Skew FO = 16

FO = 128 0.4

0.5 0.5

0.6 0.5

0.7 0.6

0.8 0.8

1.2 ns

tPMinimum Period FO = 16

FO = 128 4.7

4.8 5.4

5.6 6.1

6.3 7.2

7.5 10.1

10.4 ns

fMAX Max i mum Frequency FO = 16

FO = 128 188

181 175

168 160

154 139

134 83

80 MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

40MX and 42MX FPGA Families

42 v5.0

A40MX04 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Spee d ‘Std’ Speed ‘–F’ Sp eed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.3 3.8 4.3 5.1 7.2 ns

tDHL Data- to -Pa d LO W 4.0 4.6 5.2 6.1 8. 6 ns

tENZH Enable Pad Z to HIGH 3.7 4.3 4.9 5.8 8.1 ns

tENZL Enab l e Pad Z to LOW 4.7 5.4 6.1 7.2 10.1 ns

tENHZ Enabl e Pad HIGH t o Z 7.9 9.1 10.4 12.2 17.1 ns

tENLZ Enable Pad LOW to Z 5.9 6. 8 7. 7 9.0 12.6 ns

dTLH2Delta LOW to HIGH 0.02 0.02 0.03 0.03 0.04 ns/ pF

dTHL2De lta HIGH to L OW 0.02 0.03 0.03 0. 0 4 0.06 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.9 4.5 5.1 6.1 8.5 ns

tDHL Data- to -Pa d LO W 3.4 3.9 4.4 5.2 7. 3 ns

tENZH Enable Pad Z to HIGH 3.4 3.9 4.4 5.2 7.3 ns

tENZL Enab l e Pad Z to LOW 4.9 5.6 6.4 7.5 10.5 ns

tENHZ Enabl e Pad HIGH t o Z 7.9 9.1 10.4 12.2 17.1 ns

tENLZ Enable Pad LOW to Z 5.0 6. 8 7. 7 9.0 12.6 ns

dTLH2Delta LOW to HIGH 0.03 0.04 0.04 0.05 0.07 ns/ pF

dTHL2De lta HIGH to L OW 0.02 0.02 0.03 0. 0 3 0.04 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

v5.0 43

40MX and 42MX FPGA Families

A40MX04 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays

tPD1 Single Module 1.7 2.0 2.3 2.7 3.7 ns

tPD2 Dual-Module Macros 3.7 4.3 4.9 5.7 8.0 ns

tCO Sequenti al C l ock-t o-Q 1.7 2.0 2.3 2.7 3.7 ns

tGO Lat c h G- t o - Q 1.7 2.0 2.3 2. 7 3. 7 ns

tRS Flip-Flop (Lat ch ) Reset-to-Q 1.7 2.0 2.3 2.7 3.7 ns

Logic Module Predicted Routing Delays1

tRD1 FO=1 Routing Delay 1.9 2.2 2 .5 3 .0 4 .2 ns

tRD2 FO=2 Routing Delay 2.7 3.1 3 .5 4 .1 5 .7 ns

tRD3 FO=3 Routing Delay 3.4 3.9 4 .4 5 .2 7 .3 ns

tRD4 FO=4 Routing Delay 4.1 4.8 5 .4 6 .3 8 .9 ns

tRD8 FO=8 Routing Delay 7.1 8.1 9 .2 10.9 15.2 ns

Logic Module Sequential Timing2

tSUD Flip-Flop (Latch) Dat a Inpu t Set-Up 4.3 5.0 5.6 6.6 9.2 ns

tHD3Flip-Fl op (Lat ch) Data I nput Hold 0.0 0.0 0.0 0.0 0.0 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 4.3 5.0 5.6 6. 6 9. 2 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Fl op (Lat ch ) Clock Acti ve Pulse

Width 4.6 5.3 5.6 7.0 9.8 ns

tWASYN Flip-Flop (Latch)

Asynchronous Pulse Width 4.6 5.3 5.6 7.0 9.8 ns

tAFlip-Flop C l ock Input Period 6.8 7.8 8.9 10.4 14.6 ns

fMAX Flip-F l op (Latch) Clock Frequen cy

(FO = 128) 109 101 92 80 48 MHz

Notes:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Set-up times assume fanout of 3. Further testing information can be obtained from the Timer utility.

3. The hold time for the DFME1A macro may be greater than 0 ns. Use the Series or later Timer to check the hold time for this macro.

40MX and 42MX FPGA Families

44 v5.0

A40MX04 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Spee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Spee d ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.1 1.3 1.5 2.1 ns

tINYL P ad -to - Y LO W 0.9 1.0 1.1 1.3 1.9 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.9 3.34 3.8 4.5 6.3 ns

tIRD2 FO=2 Routing Delay 3.6 4.2 4.8 5.6 7.8 ns

tIRD3 FO=3 Routing Delay 4.4 5.0 5.7 6.7 9.4 ns

tIRD4 FO=4 Routing Delay 5.1 5.9 6.7 7.8 11.0 ns

tIRD8 FO=8 Routing Delay 8.0 9.3 10.5 12.4 17.2 ns

Global Clock Network

tCKH Input LOW to HI GH FO = 16

FO = 128 6.4

6.4 7.4

7.4 8.4

8.4 9.9

9.9 13.8

13.8 ns

tCKL Input HIGH to LOW FO = 16

FO = 128 6.8

6.8 7.8

7.8 8.9

8.9 10.4

10.4 14.6

14.6 ns

tPWH Minimum Pulse Width

HIGH FO = 16

FO = 128 3.1

3.3 3.6

3.8 4.1

4.3 4.8

5.1 6.7

7.1 ns

tPWL Minimum Pulse Width

LOW FO = 16

FO = 128 3.1

3.3 3.6

3.8 4.1

4.3 4.8

5.1 6.7

7.1 ns

tCKSW Maximum Skew FO = 16

FO = 128 0.6

0.8 0.6

0.9 0.7

1.0 0.8

1.2 1.2

1.6 ns

tPMinimum Period FO = 16

FO = 128 6.5

6.8 7.5

7.8 8.5

8.9 10.1

10.4 14.1

14.6 ns

fMAX Maximum Frequency FO = 16

FO = 128 113

109 105

101 96

92 83

80 50

48 MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 45

40MX and 42MX FPGA Families

A40MX04 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 4.7 5.4 6 .1 7.2 10.0 ns

tDHL Data-to-Pad LOW 5.6 6.4 7.3 8. 6 12.0 ns

tENZH Enable Pad Z to HI GH 5.2 6.0 6.9 8.1 11.3 ns

tENZL Enable Pad Z to LOW 6.6 7.6 8.6 10.1 14.1 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH2Del ta LOW to HIGH 0.03 0.03 0.04 0.04 0.06 n s/pF

dTHL2Delta HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 5.5 6.4 7.2 8.5 11.9 ns

tDHL Data-to-Pad LOW 4.8 5.5 6.2 7. 3 10.2 ns

tENZH Enable Pad Z to HI GH 4.7 5.5 6.2 7.3 10.2 ns

tENZL Enable Pad Z to LOW 6.8 7.9 8.9 10.5 14.7 ns

tENHZ Enable Pad HIGH to Z 11.1 12.8 14.5 17.1 23.9 ns

tENLZ Enable Pad LOW to Z 8.2 9.5 10.7 12.6 17.7 ns

dTLH2Del ta LOW to HIGH 0.05 0.05 0.06 0.07 0.10 n s/pF

dTHL2Delta HIGH to LOW 0.03 0.03 0.04 0.04 0.06 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

46 v5.0

A42MX09 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays1

tPD1 Single Module 1.2 1.3 1.5 1.8 2.5 ns

tCO Sequenti al C l ock-to-Q 1.3 1.4 1.6 1.9 2.7 ns

tGO La tch G-to-Q 1.2 1.4 1.6 1.8 2.6 ns

tRS Flip-Flop (Latch) Reset-to- Q 1.2 1.6 1.8 2 .1 2.9 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.7 0.8 0.9 1.0 1 .4 ns

tRD2 FO=2 Routing Delay 0.9 1.0 1.2 1.4 1 .9 ns

tRD3 FO=3 Routing Delay 1.2 1.3 1.5 1.7 2 .4 ns

tRD4 FO=4 Routing Delay 1.4 1.5 1.7 2.0 2 .9 ns

tRD8 FO=8 Routing Delay 2.3 2.6 2.9 3.4 4 .8 ns

Logic Module Sequential Timing3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.3 0.4 0.4 0 .5 0.7 ns

tHD Flip-Flop (Latch) Dat a Input H ol d 0.0 0.0 0.0 0.0 0. 0 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 0.4 0.5 0.5 0.6 0.8 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 3.4 3.8 4.3 5.0 7.0 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 4.5 4.9 5.6 6.6 9.2 ns

tAFlip-Flop C l ock Input Perio d 3.5 3.8 4.3 5.1 7.1 ns

tINH Input Buffer Latch Hold 0.0 0. 0 0.0 0.0 0.0 ns

tINSU Input Buffer Latc h Set-Up 0.3 0.3 0.4 0.4 0.6 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Bu ffe r La tc h Se t- U p 0.3 0.3 0 .4 0. 4 0 .6 ns

fMAX Flip-Flop (Latch) Clock

Frequency 268 244 224 195 117 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 47

40MX and 42MX FPGA Families

A42MX09 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Spe e d ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.0 1.2 1.3 1.6 2.2 ns

tINYL P ad -to - Y LO W 0.8 0. 9 1 .0 1.2 1.7 n s

tINGH G to Y HIGH 1.3 1.4 1.6 1.9 2.7 ns

tINGL G to Y LOW 1.3 1.4 1.6 1.9 2.7 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.0 2.2 2.5 3.0 4.2 ns

tIRD2 FO=2 Routing Delay 2.3 2.5 2.9 3.4 4.7 ns

tIRD3 FO=3 Routing Delay 2.5 2.8 3.2 3.7 5.2 ns

tIRD4 FO=4 Routing Delay 2.8 3.1 3.5 4.1 5.7 ns

tIRD8 FO=8 Routing Delay 3.7 4.1 4.7 5.5 7.7 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 256 2.4

2.7 2.7

3.0 3.0

3.4 3.6

4.0 5.0

5.5 ns

tCKL Inp ut HIGH to LOW FO = 32

FO = 256 3.5

3.9 3.9

4.3 4.4

4.9 5.2

5.7 7.3

8.0 ns

tPWH Minimum Pulse Width

HIGH FO = 32

FO = 256 1.2

1.3 1.4

1.5 1.5

1.7 1.8

2.0 2.5

2.7 ns

tPWL Minimum Pulse Width

LOW FO = 32

FO = 256 1.2

1.3 1.4

1.5 1.5

1.7 1.8

2.0 2.5

2.7 ns

tCKSW Maximum Skew FO = 32

FO = 256 0.3

0.3 0.3

0.3 0.4

0.4 0.5

0.5 0.6

0.6 ns

tSUEXT Input Latch Externa l

Set-Up FO = 32

FO = 256 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Externa l Hold FO = 32

FO = 256 2.3

2.2 2.6

2.4 3.0

3.3 3.5

3.9 4.9

5.5 ns

tPMinimum Period FO = 32

FO = 256 3.4

3.7 3.7

4.1 4.0

4.5 4.7

5.2 7.8

8.6 ns

fMAX Maximum Frequency FO = 32

FO = 256 296

268 269

244 247

224 215

195 129

117 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

40MX and 42MX FPGA Families

48 v5.0

A42MX09 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 2.5 2.7 3 .1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.9 3.2 3 .6 4.3 6.0 ns

tENZH Enable Pad Z to HI GH 2.6 2.9 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.2 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 4.9 5.4 6.2 7.3 10.2 ns

tENLZ Enable Pad LOW to Z 5.3 5.9 6.7 7.9 11.1 ns

tGLH G-to-Pad HIGH 2.6 2.9 3.3 3.8 5.3 ns

tGHL G-to-Pad LOW 2 .6 2.9 3. 3 3.8 5.3 ns

tLSU I/O La tc h Se t- U p 0.5 0 .5 0 .6 0. 7 1 .0 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ),

64 Clock Loading 5.2 5.8 6.6 7.7 10.8 ns

tACO Array Clock-to -Out (Pad-to-Pad) ,

64 Clock Loading 7.4 8.2 9.3 10.9 15.3 ns

dTLH2Capac i ty Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 n s/pF

dTHL2Capac i ty Loading, HIGH to LO W 0.04 0.04 0.04 0.05 0.07 n s/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 2.4 2.7 3 .1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.9 3.2 3 .6 4.3 6.0 ns

tENZH Enable Pad Z to HI GH 2.7 2.9 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.2 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 4.9 5.4 6.2 7.3 10.2 ns

tENLZ Enable Pad LOW to Z 5.3 5.9 6.7 7.9 11.1 ns

tGLH G-to-Pad HIGH 4.2 4.6 5.2 6.1 8.6 ns

tGHL G-to-Pad LOW 4 .2 4.6 5. 2 6.1 8.6 ns

tLSU I/O La tc h Se t- U p 0.5 0 .5 0 .6 0. 7 1 .0 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ),

64 Clock Loading 5.2 5.8 6.6 7.7 10.8 ns

tACO Array Clock-to -Out (Pad-to-Pad) ,

64 Clock Loading 7.4 8.2 9.3 10.9 15.3 ns

dTLH2Capac i ty Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 n s/pF

dTHL2Capac i ty Loading, HIGH to LO W 0.04 0.04 0.04 0.05 0.07 n s/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

v5.0 49

40MX and 42MX FPGA Families

A42MX09 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays1

tPD1 Single Module 1.6 1.8 2.1 2.5 3.5 ns

tCO Sequenti al C l ock-to-Q 1.8 2.0 2.3 2.7 3.8 ns

tGO La tch G-to-Q 1.7 1.9 2.1 2.5 3.5 ns

tRS Flip-Flop (Latch) Reset-to- Q 2.0 2.2 2.5 2 .9 4.1 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.0 1.1 1.2 1.4 2 .0 ns

tRD2 FO=2 Routing Delay 1.3 1.4 1.6 1.9 2 .7 ns

tRD3 FO=3 Routing Delay 1.6 1.8 2.0 2.4 3 .3 ns

tRD4 FO=4 Routing Delay 1.9 2.1 2.4 2.9 4 .0 ns

tRD8 FO=8 Routing Delay 3.2 3.6 4.1 4.8 6 .7 ns

Logic Module Sequential Timing 3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.5 0.5 0.6 0 .7 0.9 ns

tHD Flip-Flop (Latch) Dat a Input H ol d 0.0 0.0 0.0 0.0 0. 0 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 0.6 0.6 0.7 0.8 1.2 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 4.7 5.3 6.0 7.0 9.8 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 6.2 6.9 7.8 9.2 12.9 ns

tAFlip-Flop C l ock Input Perio d 5.0 5.6 6.2 7.1 9.9 ns

tINH Input Buffer Latch Hold 0.0 0. 0 0.0 0.0 0.0 ns

tINSU Input Buffer Latc h Set-Up 0.3 0.3 0.3 0.4 0.6 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Bu ffe r La tc h Se t- U p 0.3 0.3 0 .3 0. 4 0 .6 ns

fMAX Flip-Flop (Latch) Clock

Frequency 161 146 135 117 70 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

40MX and 42MX FPGA Families

50 v5.0

A42MX09 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Spee d ‘–F’ Sp eed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.5 1.6 1.8 2.17 3.0 ns

tINYL Pad-to-Y LOW 1.2 1.3 1.4 1.7 2.4 ns

tINGH G to Y HIGH 1.8 2.0 2.3 2.7 3.7 ns

tINGL G to Y LOW 1.8 2.0 2.3 2.7 3.7 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.8 3.2 3.6 4.2 5.9 ns

tIRD2 FO=2 Routing Delay 3.2 3.5 4.0 4.7 6.6 ns

tIRD3 FO=3 Routing Delay 3.5 3.9 4.4 5.2 7.3 ns

tIRD4 FO=4 Routing Delay 3.9 4.3 4.9 5.7 8.0 ns

tIRD8 FO=8 Routing Delay 5.2 5.8 6.6 7.7 10.8 ns

Global Clock Network

tCKH Input LOW to HI GH FO = 32

FO = 256 4.1

4.5 4.5

5.0 5.1

5.6 6.0

6.7 8.4

9.3 ns

tCKL Input HIGH to LOW FO = 32

FO = 256 5.0

5.4 5.5

6.0 6.2

6.8 7.3

8.0 10.2

11.2 ns

tPWH Minimum Pulse Width

HIGH FO = 32

FO = 256 1.7

1.9 1.9

2.1 2.1

2.3 2.5

2.7 3.5

3.8 ns

tPWL Minimum Pulse Width

LOW FO = 32

FO = 256 1.7

1.9 1.9

2.1 2.1

2.3 2.5

2.7 3.5

3.8 ns

tCKSW Max imum Skew FO = 32

FO = 256 0.4

0.4 0.5

0.5 0.5

0.5 0.6

0.6 0.9

0.9 ns

tSUEXT Input Latch External

Set-Up FO = 32

FO = 256 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Extern al H ol d FO = 32

FO = 256 3.3

3.7 3.7

4.1 4.2

4.6 4.9

5.5 6.9

7.6 ns

tPMinimum Period FO = 32

FO = 256 5.6

6.1 6.2

6.8 6.7

7.4 7.8

8.5 12.9

14.2 ns

fMAX Maximum Frequen cy FO = 32

FO = 256 177

161 161

146 148

135 129

117 77

70 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 51

40MX and 42MX FPGA Families

A42MX09 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.4 3.8 4 .3 5.1 7.1 ns

tDHL Data-to-Pad LOW 4.0 4.5 5 .1 6.1 8.3 ns

tENZH Enable Pad Z to HI GH 3.7 4.1 4.6 5.5 7.6 ns

tENZL Enable Pad Z to LOW 4.1 4.5 5.1 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 6.9 7.6 8.6 10.2 14.2 ns

tENLZ Enable Pad LOW to Z 7.5 8.3 9.4 11.1 15.5 ns

tGLH G-to-Pad HIGH 5.8 6.5 7.3 8.6 12.0 ns

tGHL G-to-Pad LOW 5 .8 6.5 7. 3 8.6 12.0 ns

tLSU I/O La tc h Se t- U p 0.7 0 .8 0 .9 1. 0 1 .4 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ) ,

64 Clock Loading 8.7 9.7 10.9 12.9 18.0 ns

tACO Array Clock-to-Out (Pad-t o-Pad),

64 Clock Loading 12.2 13.5 15.4 18.1 25.3 ns

dTLH2Capacity Loading, LOW to HIGH 0.00 0.00 0.00 0.10 0.01 ns/pF

dTHL2Capaci ty Lo a din g , HI GH to LOW 0.0 9 0.10 0.10 0 .1 0 0.10 ns/p F

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.4 3.8 5 .5 6.4 9.0 ns

tDHL Data-to-Pad LOW 4.1 4.5 4 .2 5.0 7.0 ns

tENZH Enable Pad Z to HI GH 3.7 4.1 4.6 5.5 7.6 ns

tENZL Enable Pad Z to LOW 4.1 4.5 5.1 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 6.9 7.6 8.6 10.2 14.2 ns

tENLZ Enable Pad LOW to Z 7.5 8.3 9.4 11.1 15.5 ns

tGLH G-to-Pad HIGH 5.8 6.5 7.3 8.6 12.0 ns

tGHL G-to-Pad LOW 5 .8 6.5 7. 3 8.6 12.0 ns

tLSU I/O La tc h Se t- U p 0.7 0 .8 0 .9 1. 0 1 .4 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ) ,

64 Clock Loading 8.7 9.7 10.9 12.9 18.0 ns

tACO Array Clock-to-Out (Pad-t o-Pad),

64 Clock Loading 12.2 13.5 15.4 18.1 25.3 ns

dTLH Capacity Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL Capaci ty Lo a din g , HI GH to LOW 0.0 5 0.05 0.06 0 .0 7 0.10 ns/p F

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

52 v5.0

A42MX16 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays1

tPD1 Single Module 1.4 1.5 1.7 2.0 2.8 ns

tCO Sequenti al C l ock-to-Q 1.4 1.6 1.8 2.1 3.0 ns

tGO La tch G-to-Q 1.4 1.5 1.7 2.0 2.8 ns

tRS Flip-Flop (Latch) Reset-to- Q 1.6 1.7 2.0 2 .3 3.3 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.8 0.9 1.0 1.2 1 .6 ns

tRD2 FO=2 Routing Delay 1.0 1.2 1.3 1.5 2 .1 ns

tRD3 FO=3 Routing Delay 1.3 1.4 1.6 1.9 2 .7 ns

tRD4 FO=4 Routing Delay 1.6 1.7 2.0 2.3 3 .2 ns

tRD8 FO=8 Routing Delay 2.6 2.9 3.2 3.8 5 .3 ns

Logic Module Sequential Timing3,4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.3 0.4 0.4 0 .5 0.7 ns

tHD Flip-Flop (Latch) Dat a Input H ol d 0.0 0.0 0.0 0.0 0. 0 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 3.4 3.8 4.3 5.0 7.1 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 4.5 5.0 5.6 6.6 9.2 ns

tAFlip-Flop C l ock Input Perio d 6.8 7.6 8.6 10.1 14.1 ns

tINH Input Buffer Latch Hold 0.0 0. 0 0.0 0.0 0.0 ns

tINSU Input Buffer Latc h Set-Up 0.5 0.5 0.6 0.7 1.0 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Bu ffe r La tc h Se t- U p 0.5 0.5 0 .6 0. 7 1 .0 ns

fMAX Flip-Flop (Latch) Clock

Frequency 215 1955 1795 1565 94 MHz

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , point and position whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 53

40MX and 42MX FPGA Families

A42MX16 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Spee d ‘–2’ Spee d ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.1 1.2 1.3 1.6 2.2 ns

tINYL Pad-to-Y LOW 0.8 0.9 1.0 1.2 1.7 ns

tINGH G to Y HIGH 1.4 1.6 1.8 2.1 2.9 ns

tINGL G to Y LOW 1.4 1.6 1.8 2.1 2.9 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 1.8 2.0 2.3 2.7 4.0 ns

tIRD2 FO=2 Routing Delay 2.1 2.3 2.6 3.1 4.3 ns

tIRD3 FO=3 Routing Delay 2.3 2.6 3.0 3.5 4.9 ns

tIRD4 FO=4 Routing Delay 2.6 3.0 3.3 3.9 5.4 ns

tIRD8 FO=8 Routing Delay 3.6 4.0 4.6 5.4 7.5 ns

Global Clock Network

tCKH Input LOW to HI GH FO = 32

FO = 384 2.6

2.9 2.9

3.2 3.3

3.6 3.9

4.3 5.4

6.0 ns

tCKL Input HIGH to LOW FO = 32

FO = 384 3.8

4.5 4.2

5.0 4.8

5.6 5.6

6.6 7.8

9.2 ns

tPWH Minimum Pulse Width

HIGH FO = 32

FO = 384 3.2

3.7 3.5

4.1 4.0

4.59 4.7

5.4 6.6

7.6 ns

tPWL Minimum Pul se Width LOW FO = 32

FO = 384 3.2

3.7 3.5

4.1 4.0

4.6 4.7

5.4 6.6

7.6 ns

tCKSW Max imum Skew FO = 32

FO = 384 0.3

0.3 0.4

0.4 0.4

0.4 0.5

0.5 0.7

0.7 ns

tSUEXT Input Latch External Set-Up FO = 32

FO = 384 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Externa l Hold FO = 32

FO = 384 2.8

3.2 3.1

3.5 5.5

4.0 4.1

4.7 5.7

6.6 ns

tPMinimum Period FO = 32

FO = 384 4.2

4.6 4.67

5.1 5.1

5.6 5.8

6.4 9.7

10.7 ns

fMAX Maximum Frequen cy FO = 32

FO = 384 237

215 215

195 198

179 172

156 103

94 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

40MX and 42MX FPGA Families

54 v5.0

A42MX16 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 2.5 2.8 3 .2 3.7 5.2 ns

tDHL Data-to-Pad LOW 3.0 3.3 3 .7 4.4 6.1 ns

tENZH Enable Pad Z to HI GH 2.7 3.0 3.4 4.0 5.6 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.8 4.4 6.2 ns

tENHZ Enable Pad HIGH to Z 5.4 6.0 6.8 8.0 11.2 ns

tENLZ Enable Pad LOW to Z 5.0 5.6 6.3 7.4 10.4 ns

tGLH G-to-Pad HIGH 2.9 3.2 3.6 4.3 6.0 ns

tGHL G-to-Pad LOW 2 .9 3.2 3. 6 4.3 6.0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ),

64 Clock Loading 5.7 6.3 7.1 8.4 11.9 ns

tACO Array Clock-to -Out (Pad-to-Pad) ,

64 Clock Loading 8.0 8.9 10.1 11.9 16.7 ns

dTLH2Capac i tive Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.04 0.04 0.04 0.05 0.07 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.2 3.6 4 .0 4.7 6.6 ns

tDHL Data-to-Pad LOW 2.5 2.7 3 .1 3.6 5.1 ns

tENZH Enable Pad Z to HI GH 2.7 3.0 3.4 4.0 5.6 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.8 4.4 6.2 ns

tENHZ Enable Pad HIGH to Z 5.4 6.0 6.8 8.0 11.2 ns

tENLZ Enable Pad LOW to Z 5.0 5.6 6.3 7.4 10.4 ns

tGLH G-to-Pad HIGH 5.1 5.6 6.4 7.5 10.5 ns

tGHL G-to-Pad LOW 5 .1 5.6 6. 4 7.5 10.5 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ),

64 Clock Loading 5.7 6.3 7.1 8.4 11.9 ns

tACO Array Clock-to -Out (Pad-to-Pad) ,

64 Clock Loading 8.0 8.9 10.1 11.9 16.7 ns

dTLH2Capac i tive Loading, LOW to HIGH 0.03 0.03 0.03 0.04 0.06 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.04 0.04 0.04 0.05 0.07 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

v5.0 55

40MX and 42MX FPGA Families

A42MX16 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Propagation Delays1

tPD1 Single Module 1.9 2.1 2.4 2.8 4.0 ns

tCO Sequenti al C l ock-to-Q 2.0 2.2 2.5 3.0 4.2 ns

tGO La tch G-to-Q 1.9 2.1 2.4 2.8 4.0 ns

tRS Flip-Flop (Latch) Reset-to- Q 2.2 2.4 2.8 3 .3 4.6 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.1 1.2 1.4 1.6 2 .3 ns

tRD2 FO=2 Routing Delay 1.5 1.6 1.8 2.1 3 .0 ns

tRD3 FO=3 Routing Delay 1.8 2.0 2.3 2.7 3 .8 ns

tRD4 FO=4 Routing Delay 2.2 2.4 2.7 3.2 4 .5 ns

tRD8 FO=8 Routing Delay 3.6 4.0 4.5 5.3 7 .5 ns

Logic Module Sequential Timing3, 4

tSUD Flip-Flop (Latch) Data Input Set-Up 0.5 0.5 0.6 0 .7 0.9 ns

tHD Flip-Flop (Latch) Dat a Input H ol d 0.0 0.0 0.0 0.0 0. 0 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 1.0 1.1 1.2 1.4 2.0 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 4.8 5.3 6.0 7.1 9.9 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 6.2 6.9 7.9 9.2 12.9 ns

tAFlip-Flop C l ock Inp ut Period 9.5 10.6 12.0 14.1 19.8 ns

tINH Input Buffer Latch Hold 0.0 0. 0 0.0 0.0 0.0 ns

tINSU Input Buffer Latch Set-Up 0.7 0.8 0.9 1.01 1.4 ns

tOUTH Output Buffer Latch Hold 0.0 0.0 0.0 0.0 0.0 ns

tOUTSU Output Buffer Latch Set-Up 0.7 0.8 0.89 1.01 1.4 ns

fMAX Flip-Flop (Latch) Clock Fr equency 129 117 108 94 56 MHz

Notes:

1. For dual-module macros use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

40MX and 42MX FPGA Families

56 v5.0

A42MX16 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINYH Pad-to-Y HIGH 1.5 1.6 1.9 2.2 3.1 ns

tINYL P ad -to - Y LO W 1.1 1.3 1 .4 1. 7 2 .4 ns

tINGH G to Y HIGH 2.0 2.2 2.5 2.9 4.1 ns

tINGL G to Y LOW 2.0 2.2 2.5 2.9 4.1 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.6 2.9 3.2 3.8 5.3 ns

tIRD2 FO=2 Routing Delay 2.9 3.2 3.7 4.3 6.1 ns

tIRD3 FO=3 Routing Delay 3.3 3.6 4.1 4.9 6.8 ns

tIRD4 FO=4 Routing Delay 3.6 4.0 4.6 5.4 7.6 ns

tIRD8 FO=8 Routing Delay 5.1 5 .6 6.4 7.5 1 0.5 ns

Global Clock Network

tCKH Input LOW to HIGH FO = 32

FO = 384 4.4

4.8 4.8

5.3 5.5

6.0 6.5

7.1 9.0

9.9 ns

tCKL Inp ut HIGH to LOW FO = 32

FO = 384 5.3

6.2 5.9

6.9 6.7

7.9 7.8

9.2 11.0

12.9 ns

tPWH Minimum Pulse Width

HIGH FO = 32

FO = 384 5.7

6.6 6.3

7.4 7.1

8.3 8.4

9.8 11.8

13.7 ns

tPWL Minimum Pulse Width

LOW FO = 32

FO = 384 5.3

6.2 5.9

6.9 6.7

7.9 7.8

9.2 11.0

12.9 ns

tCKSW Maximum Skew FO = 32

FO = 384 0.5

2.2 0.5

2.4 0.6

2.7 0.7

3.2 1.0

4.5 ns

tSUEXT Input Latch External

Set-Up FO = 32

FO = 384 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Extern al H ol d FO = 32

FO = 384 3.9

4.5 4.3

4.9 4.9

5.6 5.7

6.6 8.0

9.2 ns

tPMinimum Period F O = 32

FO = 384 7.0

7.7 7.8

8.6 8.4

9.3 9.7

10.7 16.2

17.8 ns

fMAX Maximum Frequency FO = 32

FO = 384 142

129 129

117 119

108 103

94 62

56 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 57

40MX and 42MX FPGA Families

A42MX16 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.5 3.9 4 .4 5.2 7.3 ns

tDHL Data-to-Pad LOW 4.1 4.6 5 .2 6.1 8.6 ns

tENZH Enable Pad Z to HI GH 3.8 4.2 4.8 5.6 7.8 ns

tENZL Enable Pad Z to LOW 4.2 4.6 5.3 6.2 8.7 ns

tENHZ Enable Pad HIGH to Z 7.6 8.4 9.5 11.2 15.7 ns

tENLZ Enable Pad LOW to Z 7.0 7.8 8.8 10.4 14.5 ns

tGLH G-to-Pad HIGH 4.8 5.3 6.0 7.2 10.0 ns

tGHL G-to-Pad LOW 4 .8 5.3 6. 0 7.2 10.0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ) ,

64 Clock Loading 8.0 8.9 10.1 11.9 16.7 ns

tACO Array Clock-to-Out (Pad-t o-Pad),

64 Clock Loading 11.3 12.5 14.2 16.7 23.3 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.05 0.05 0.06 0.07 0.10 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 4.5 5.0 5 .6 6.6 9.3 ns

tDHL Data-to-Pad LOW 3.4 3.8 4 .3 5.1 7.1 ns

tENZH Enable Pad Z to HI GH 3.8 4.2 4.8 5.6 7.8 ns

tENZL Enable Pad Z to LOW 4.2 4.6 5.3 6.2 8.7 ns

tENHZ Enable Pad HIGH to Z 7.6 8.4 9.5 11.2 15.7 ns

tENLZ Enable Pad LOW to Z 7.0 7.8 8.8 10.4 14.5 ns

tGLH G-to-Pad HIGH 7.1 7.9 8.9 10.5 14.7 ns

tGHL G-to-Pad LOW 7.1 7.9 8.9 10.5 14.7 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d ) ,

64 Clock Loading 8.0 8.9 10.1 11.9 16.7 ns

tACO Array Clock-to-Out (Pad-t o-Pad),

64 Clock Loading 11.3 12.5 14.2 16.7 23.3 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.04 0.04 0.05 0.06 0.08 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.05 0.05 0.06 0.07 0.10 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

58 v5.0

A42MX24 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Funct ions1

tPD Internal Array Module Delay 1.2 1.3 1.5 1.8 2.5 ns

tPDD Int ernal Dec ode Module Delay 1.4 1.6 1.8 2.1 3.0 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.8 0.9 1.0 1.2 1 .7 ns

tRD2 FO=2 Routing Delay 1.0 1.2 1.3 1.5 2 .1 ns

tRD3 FO=3 Routing Delay 1.3 1.4 1.6 1.9 2 .6 ns

tRD4 FO=4 Routing Delay 1.5 1.7 1.9 2.2 3 .1 ns

tRD5 FO=8 Routing Delay 2.4 2.7 3.0 3.6 5 .0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop C l ock-t o-Output 1.3 1.4 1 .6 1.9 2.7 ns

tGO Latch Gate-to-Outp ut 1.2 1.3 1.5 1.8 2.5 ns

tSU Flip-Flop (Latch) Set-Up Time 0.3 0.4 0.4 0.5 0.7 ns

tHFlip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0. 0 ns

tRO Flip-Flop (Latch) Reset-to- Output 1.4 1.6 1.8 2.1 2.9 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 0.4 0.5 0.5 0.6 0.8 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 3.3 3.7 4.2 4.9 6.9 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 4.4 4.8 5.3 6.5 9.0 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 59

40MX and 42MX FPGA Families

A42MX24 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Spee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Sp ee d ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.0 1.1 1.3 1.5 2.1 ns

tINGO Input Latch Gate-to-Output 1.3 1.4 1.6 1.9 2.6 ns

tINH Input Latch Hol d 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Lat ch Set-Up 0.5 0.5 0.6 0.7 1 .0 ns

tILA Latch Active Pul se Width 4.7 5.2 5.9 6.9 9.7 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 1.8 2.0 2.3 2.7 3.8 ns

tIRD2 FO=2 Routing Delay 2.1 2.3 2.6 3.1 4.3 ns

tIRD3 FO=3 Routing Delay 2.3 2.5 2.9 3.4 4.8 ns

tIRD4 FO=4 Routing Delay 2.5 2.8 3.2 3.7 5.2 ns

tIRD8 FO=8 Routing Delay 3.4 3.8 4.3 5.1 7.1 ns

Global Clock Network

tCKH Input LOW to HI GH FO=32

FO=486 2.6

2.9 2.9

3.2 3.3

3.6 3.9

4.3 5.4

5.9 ns

tCKL Input HIGH to LOW FO=32

FO=486 3.7

4.3 4.1

4.7 4.6

5.4 5.4

6.3 7.6

8.8 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=486 2.2

2.4 2.4

2.6 2.7

3.0 3.2

3.5 4.5

4.9 ns

tPWL Minimum Pul se Width LOW FO=32

FO=486 2.2

2.4 2.4

2.6 2.7

3.0 3.2

3.5 4.5

4.9 ns

tCKSW Maximum Skew FO=32

FO=486 0.5

0.5 0.6

0.6 0.7

0.7 0.8

0.8 1.1

1.1 ns

tSUEXT Input Latch External Set-Up FO=32

FO=486 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Externa l Hold FO=32

FO=486 2.8

3.3 3.1

3.7 3.5

4.2 4.1

4.9 5.7

6.9 ns

tPMinimum Period (1/fMAX)FO=32

FO=486 4.7

5.1 5.2

5.7 5.7

6.2 6.5

7.1 10.9

11.9 ns

fMAX Maximum Datapath

Frequency FO=32

FO=486 210

193 191

175 176

161 153

140 92

84 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

40MX and 42MX FPGA Families

60 v5.0

A42MX24 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 2.4 2.7 3 .1 3.6 5.1 ns

tDHL Data-to-Pad LOW 2.8 3.2 3.6 4.2 5.9 n s

tENZH Enable Pad Z to HI GH 2.5 2.8 3.2 3.8 5.3 ns

tENZL Enable Pad Z to LOW 2.8 3.1 3.5 4.2 5.9 ns

tENHZ Enable Pad HIGH to Z 5.2 5.7 6.5 7.6 10.7 ns

tENLZ Enable Pad LOW to Z 4.8 5.3 6.0 7.1 9.9 ns

tGLH G-to-Pad HIGH 2.9 3.2 3.6 4.3 6.0 ns

tGHL G-to-Pad LOW 2 .9 3.2 3. 6 4.3 6.0 ns

tLSU I/O La tc h Ou tp u t Se t- Up 0.5 0.5 0.6 0. 7 1 .0 ns

tLH I/O La tc h Ou tp u t Hol d 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 5.66.16.98.111.4ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 10.6 11.8 13.4 15.7 22.0 ns

dTLH2Capac i tive Loading, LOW to HIGH 0.04 0.04 0.04 0.05 0.07 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.1 3.5 3 .9 4.6 6.4 ns

tDHL Data-to-Pad LOW 2.4 2.6 3.0 3.5 4.9 n s

tENZH Enable Pad Z to HI GH 2.5 2.8 3.2 3.8 5.3 ns

tENZL Enable Pad Z to LOW 2.8 3.1 3.5 4.2 5.8 ns

tENHZ Enable Pad HIGH to Z 5.2 5.7 6.5 7.6 10.7 ns

tENLZ Enable Pad LOW to Z 4.8 5.3 6.0 7.1 9.9 ns

tGLH G-to-Pad HIGH 4.9 5.4 6.2 7.2 10.1 ns

tGHL G-to-Pad LOW 4 .9 5.4 6. 2 7.2 10.1 ns

tLSU I/O La tc h Se t- U p 0.5 0 .5 0 .6 0. 7 1 .0 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 5.56.16.98.111.3ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 10.6 11.8 13.4 15.7 22.0 ns

dTLH2Capac i tive Loading, LOW to HIGH 0.04 0.04 0.04 0.05 0.07 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.03 0.03 0.03 0.04 0.06 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

v5.0 61

40MX and 42MX FPGA Families

A42MX24 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spe e d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Functions1

tPD In tern al Ar ray M o d ul e Delay 2.0 1.8 2.1 2.5 3.4 ns

tPDD Internal Decode Module Delay 1.1 2.2 2.5 3.0 4.2 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.7 1.3 1.4 1.7 2.3 ns

tRD2 FO=2 Routing Delay 2.0 1.6 1.8 2.1 3.0 ns

tRD3 FO=3 Routing Delay 1.1 2.0 2.2 2.6 3.7 ns

tRD4 FO=4 Routing Delay 1.5 2.3 2.6 3.1 4.3 ns

tRD5 FO=8 Routing Delay 1.8 3.7 4.2 5.0 7.0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop Clock-to-Output 2.1 2.0 2.3 2 .7 3.7 ns

tGO Latch Gate-to-Output 3.4 1.9 2.1 2.5 3.4 ns

tSU Flip-Flop (Latch) Se t-Up Time 0.4 0.5 0.6 0.7 0.9 ns

tHFlip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRO Flip-Fl op (La tc h) R eset-t o-Output 2.0 2. 2 2.5 2.9 4.1 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 0.6 0.6 0.7 0.8 1.2 ns

tHENA Flip-Fl op (Latch) Enable Hold 0.0 0.0 0.0 0.0 0. 0 ns

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 4.6 5.2 5.8 6.9 9.6 ns

tWASYN Flip-Flop (Latc h) Asynchrono us Pulse

Width 6.1 6.8 7.7 9.0 12.6 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

40MX and 42MX FPGA Families

62 v5.0

A42MX24 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Spee d ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.4 1.6 1.8 2.2 3.0 ns

tINGO Input Latch Gate -to-Ou tput 1.8 1.9 2. 2 2.6 3.6 ns

tINH Input Latch Hol d 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Lat ch Set-Up 0. 7 0.7 0.8 1. 0 1.4 ns

tILA Latch Active Pul se Width 6.5 7.3 8.2 9.7 13.5 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.6 2.9 3.2 3.8 5.3 ns

tIRD2 FO=2 Routing Delay 2.9 3.2 3.6 4.3 6.0 ns

tIRD3 FO=3 Routing Delay 3.2 3.6 4.0 4.8 6.6 ns

tIRD4 FO=4 Routing Delay 3.5 3.9 4.4 5.2 7.3 ns

tIRD8 FO=8 Routing Delay 4.8 5.3 6.1 7.1 10.0 ns

Global Clock Network

tCKH Input LOW to HI GH FO=32

FO=486 4.4

4.8 4.8

5.3 5.5

6.0 6.5

7.1 9.1

10.0 ns

tCKL Input HIGH to LOW FO=32

FO=486 5.1

6.0 5.7

6.6 6.4

7.5 7.6

8.8 10.6

12.4 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=486 3.0

3.3 3.3

3.7 3.8

4.2 4.5

4.9 6.3

6.9 ns

tPWL Minimum Pul se Width LOW FO=32

FO=486 3.0

3.3 3.4

3.7 3.8

4.2 4.5

4.9 6.3

6.9 ns

tCKSW Maximum Skew F O=32

FO=486 0.8

0.8 0.8

0.8 1.0

1.0 1.1

1.1 1.6

1.6 ns

tSUEXT Input Latch Extern al Set-Up FO=32

FO=486 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch External Hold FO=32

FO=486 3.9

4.6 4.3

5.2 4.9

5.8 5.7

6.9 8.1

9.6 ns

tPMinimum Period (1/fMAX)FO=32

FO=486 7.8

8.6 8.7

9.5 9.47

10.4 10.8

11.9 18.2

19.9 ns

fMAX Maximum Datapath

Frequency FO=32

FO=486 126

116 115

105 106

97 92

84 55

50 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 63

40MX and 42MX FPGA Families

A42MX24 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3 Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spe ed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.4 3.8 4 .3 5.0 7.1 ns

tDHL Data-to-Pad LOW 4.0 4.4 5.0 5.9 8.3 n s

tENZH Enable Pad Z to HI GH 3.6 4.0 4.5 5.3 7.4 ns

tENZL Enable Pad Z to LOW 3.9 4.4 5.0 5.8 8.2 ns

tENHZ Enable Pad HIGH to Z 7.2 8.0 9.07 10.7 14.9 ns

tENLZ Enable Pad LOW to Z 6.7 7.5 8.5 9.9 13.9 ns

tGLH G-to-Pad HIGH 4.8 5.3 6.0 7.2 10.0 ns

tGHL G-to-Pad LOW 4 .8 5.3 6. 0 7.2 10.0 ns

tLSU I/O La tc h Ou tp u t Se t- Up 0.7 0.7 0.8 1. 0 1 .4 ns

tLH I/O La tc h Ou tp u t Hol d 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 7.67 8.5 9.6 11.3 15.9 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 14.8 16.5 18.7 22.0 30.8 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 4.8 5.3 5 .5 6.4 9.0 ns

tDHL Data-to-Pad LOW 3.5 3.9 4.1 4.9 6.8 n s

tENZH Enable Pad Z to HI GH 3.6 4.0 4.5 5.3 7.4 ns

tENZL Enable Pad Z to LOW 3.4 4.0 5.0 5.8 8.2 ns

tENHZ Enable Pad HIGH to Z 7.2 8.0 9.01 10.7 14.9 ns

tENLZ Enable Pad LOW to Z 6.7 7.5 8.5 9.9 13.9 ns

tGLH G-to-Pad HIGH 6.8 7.6 8.6 10.1 14.2 ns

tGHL G-to-Pad LOW 6.8 7.6 8.6 10.1 14.2 ns

tLSU I/O La tc h Se t- U p 0.7 0 .7 0 .8 1. 0 1 .4 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 7.7 8.5 9.6 11.3 15.9 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 14.8 16.5 18.7 22.0 30.8 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.05 0.05 0.06 0.07 0.10 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.04 0.04 0.05 0.06 0.08 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

64 v5.0

A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Funct ions1

tPD Internal Array Module Delay 1.3 1.5 1.7 2.0 2.7 ns

tPDD Int ernal Dec ode Module Delay 1.6 1.8 2.0 2.4 3.3 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 0.9 1.0 1.2 1.4 2 .0 ns

tRD2 FO=2 Routing Delay 1.3 1.4 1.6 1.9 2 .7 ns

tRD3 FO=3 Routing Delay 1.6 1.8 2.0 2.4 3 .4 ns

tRD4 FO=4 Routing Delay 2.0 2.2 2.5 2.9 4 .1 ns

tRD5 FO=8 Routing Delay 3.3 3.7 4.2 4.9 6 .9 ns

tRDD Decod e-to-Output Routing Delay 0.3 0.4 0.4 0.5 0.7 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop C l ock-t o-Output 1.3 1.4 1 .6 1.9 2.7 ns

tGO Latch Gate-to-Outp ut 1.3 1.4 1.6 1.9 2.7 ns

tSU Flip-Flop (Latch) Set-Up Time 0.3 0.34 0.4 0.5 0.7 ns

tHFlip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0. 0 ns

tRO Flip-Flop (Latch) Reset-to- Output 1.6 1.7 2.0 2.3 3.2 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 0.7 0.8 0.9 1.0 1.4 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 3.3 3.7 4.2 4.9 6.9 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 4.4 4.8 5.5 6.4 9.0 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 65

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

Logic Module Timing ‘–3’ Spee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Synchronous SRAM Operations

tRC Read Cyc l e Time 6.8 7.5 8.5 10.0 14.0 ns

tWC Wri te Cycle Time 6.8 7.5 8.5 10.0 14.0 ns

tRCKHL C lock HIGH/LOW Time 3.4 3. 8 4.3 5.0 7.0 ns

tRCO Data Valid After Clock HIGH/LOW 3.4 3.78 4.3 5.0 7.0 ns

tADSU Address/Data Set-Up Time 1.6 1.8 2.0 2.4 3.4 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSU Read Enable Set-Up 0.6 0.7 0.8 0.9 1.3 ns

tRENH Read Enable Hold 3.4 3.8 4.3 5.0 7.0 ns

tWENSU Wr ite Enable Set-Up 2.7 3.0 3.4 4.0 5.6 ns

tWENH Wri te En able Hold 0.0 0.0 0.0 0.0 0.0 ns

tBENS Block Enable Set-Up 2.8 3.1 3.5 4.1 5. 7 ns

tBENH Block Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 8.1 9.0 10.2 12.0 16.8 ns

tRDADV R ead Address Valid 8.8 9.8 11.1 13.0 18.2 ns

tADSU Address/Data Set-Up Time 1.6 1.8 2.0 2.4 3.4 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSUA Re ad Enable Se t-U p to Ad dress Vali d 0.6 0.7 0.8 0 .9 1.3 ns

tRENHA Read Enable Hold 3.4 3.8 4.3 5.0 7.0 n s

tWENSU Wr ite Enable Set-Up 2.7 3.0 3.4 4.0 5.6 ns

tWENH Wri te En able Hold 0.0 0.0 0.0 0.0 0.0 ns

tDOH Data Out Hold Time 1.2 1.34 1.5 1.8 2.5 ns

40MX and 42MX FPGA Families

66 v5.0

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Sp ee d ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.0 1.1 1.3 1.5 2.1 ns

tINGO Input Latch Gate-to-Output 1 .4 1.6 1.8 2.1 2.9 ns

tINH Input Latch Hol d 0.0 0.0 0.0 0.0 0.0 ns

tINSU Input Lat ch Set-Up 0.5 0. 5 0. 6 0.7 1.0 ns

tILA Latch Active Pul se Width 4.7 5.2 5.9 6.9 9.7 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.0 2.2 2.5 2.9 4.1 ns

tIRD2 FO=2 Routing Delay 2.3 2.6 2.9 3.4 4.8 ns

tIRD3 FO=3 Routing Delay 2.6 2.9 3.3 3.9 5.5 ns

tIRD4 FO=4 Routing Delay 3.0 3.3 3.8 4.4 6.2 ns

tIRD8 FO=8 Routing Delay 4.3 4.8 5.5 6.4 9.0 ns

Global Clock Network

tCKH Input LOW to HI GH FO=32

FO=635 2.7

3.0 3.0

3.3 3.4

3.8 4.0

4.4 5.6

6.2 ns

tCKL Input HIGH to LOW FO=32

FO=635 3.8

4.9 4.2

5.4 4.8

6.1 5.6

7.2 7.8

10.1 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=635 1.8

2.0 2.0

2.2 2.2

2.5 2.6

2.9 3.6

4.1 ns

tPWL Minimum Pul se Width LOW FO=32

FO=635 1.8

2.0 2.0

2.2 2.2

2.5 2.6

2.9 3.6

4.1 ns

tCKSW Maximum Skew FO=32

FO=635 0.8

0.8 0.8

0.8 0.9

0.9 1.0

1.0 1.4

1.4 ns

tSUEXT Input Latch Extern al Set-Up FO=32

FO=635 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch External Hold FO=32

FO=635 2.8

3.3 3.2

3.7 3.6

4.2 4.2

4.9 5.9

6.9 ns

tPMinimum Period (1/fMAX)FO=32

FO=635 5.5

6.0 6.1

6.6 6.6

7.2 7.6

8.3 12.7

13.8 ns

fHMAX Maximum Data path

Frequency FO=32

FO=635 180

166 164

151 151

139 131

121 79

73 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 67

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 4.75V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 2.6 2.8 3 .2 3.8 5.3 ns

tDHL Data-to-Pad LOW 3.0 3.3 3.7 4.4 6.2 n s

tENZH Enable Pad Z to HI GH 2.7 3.0 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 3.0 3.3 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 5.3 5.8 6.6 7.8 10.9 ns

tENLZ Enable Pad LOW to Z 4.9 5.5 6.2 7.3 10.2 ns

tGLH G-to-Pad HIGH 2.9 3.3 3.7 4.4 6.1 ns

tGHL G-to-Pad LOW 2.9 3.3 3.7 4.4 6.1 ns

tLSU I/O La tc h Ou tp u t Se t- Up 0.5 0.5 0.6 0. 7 1 .0 ns

tLH I/O La tc h Ou tp u t Hol d 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 5.7 6 .3 7. 1 8.4 11.8 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 7.8 8.6 9.8 11.5 16.1 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.07 0.08 0.09 0.10 0.14 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.07 0.08 0.09 0.10 0.14 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.5 3.9 4 .5 5.2 7.3 ns

tDHL Data-to-Pad LOW 2.5 2.7 3.1 3.6 5.1 n s

tENZH Enable Pad Z to HI GH 2.7 3.0 3.3 3.9 5.5 ns

tENZL Enable Pad Z to LOW 2.9 3.3 3.7 4.3 6.1 ns

tENHZ Enable Pad HIGH to Z 5.3 5.8 6.6 7.8 10.9 ns

tENLZ Enable Pad LOW to Z 4.9 5.5 6.2 7.3 10.2 ns

tGLH G-to-Pad HIGH 5.0 5.6 6.3 7.5 10.4 ns

tGHL G-to-Pad LOW 5 .0 5.6 6. 3 7.5 10.4 ns

tLSU I/O La tc h Se t- U p 0.5 0 .5 0 .6 0. 7 1 .0 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 5.7 6 .3 7. 1 8.4 11.8 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 7.78 8.6 9.8 11.5 16.1 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.07 0.08 0.09 0.10 0.14 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.07 0.08 0.09 0.10 0.14 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

68 v5.0

A42MX36 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Funct ions1

tPD Internal Array Module Delay 1.9 2.1 2.3 2.7 3.8 ns

tPDD Int ernal Dec ode Module Delay 2.2 2.5 2.8 3.3 4.7 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.3 1.5 1.7 2.0 2 .7 ns

tRD2 FO=2 Routing Delay 1.8 2.0 2.3 2.7 3 .7 ns

tRD3 FO=3 Routing Delay 2.3 2.5 2.8 3.4 4 .7 ns

tRD4 FO=4 Routing Delay 2.8 3.1 3.5 4.1 5 .7 ns

tRD5 FO=8 Routing Delay 4.6 5.2 5.8 6.9 9 .6 ns

tRDD Decod e-to-Output Routing Delay 0.5 0.5 0.6 0.7 1.0 ns

Logic Module Sequential Timing3, 4

tCO Flip-Flop C l ock-t o-Output 1.8 2.0 2 .3 2.7 3.7 ns

tGO Latch Gate-to-Outp ut 1.8 2.0 2.3 2.7 3.7 ns

tSU Flip-Flop (Latch) Set-Up Time 0.4 0.5 0.6 0.7 0.9 ns

tHFlip-Flop (Latch) Hold Time 0.0 0.0 0.0 0.0 0. 0 ns

tRO Flip-Flop (Latch) Reset-to- Output 2.2 2.4 2.7 3.2 4.5 ns

tSUENA F l i p-Flop (Latch) Enabl e Set-Up 1.0 1.1 1.2 1.4 2.0 ns

tHENA Flip- Flop (La tc h) Enable Hold 0.0 0.0 0.0 0.0 0.0 n s

tWCLKA Flip-Flop (Latch) Clock Active Pulse

Width 4.6 5.2 5.8 6.9 9.6 ns

tWASYN Flip-Flop (Latch) Asynchronous Pulse

Width 6.1 6.8 7.7 9.0 12.6 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 69

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

Logic Module Timing ‘–3’ Spee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Synchronous SRAM Operations

tRC Read Cyc l e Time 9.5 10.5 11.9 14.0 19.6 ns

tWC Wri te Cycle Time 9.5 10.5 11.9 14.0 19.6 ns

tRCKHL C lock HIGH/LOW Time 4.8 5. 3 6.0 7.0 9.8 ns

tRCO Data Valid After Clock HIGH/LOW 4.8 5.3 6.0 7.0 9.8 ns

tADSU Address/Data Set-Up Time 2.3 2.5 2.8 3.4 4.8 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSU Read Enable Set-Up 0.9 1.0 1.1 1.3 1.8 ns

tRENH Read Enable Hold 4.8 5.3 6.0 7.0 9.8 ns

tWENSU Wr ite Enable Set-Up 3.8 4.2 4.8 5.6 7.8 ns

tWENH Wri te En able Hold 0.0 0.0 0.0 0.0 0.0 ns

tBENS Block Enable Set-Up 3.9 4.3 4.9 5.7 8. 0 ns

tBENH Block Enable Hold 0.0 0.0 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 11.3 12.6 14.3 16.8 23.5 ns

tRDADV R ead Address Valid 12.3 13.7 15.5 18.2 25.5 ns

tADSU Address/Data Set-Up Time 2.3 2.5 2.8 3.4 4.8 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 0.0 ns

tRENSUA Re ad Enable Se t-U p to Ad dress Vali d 0.9 1.0 1.1 1 .3 1.8 ns

tRENHA Read Enable Hold 4.8 5.3 6.0 7.0 9.8 ns

tWENSU Wr ite Enable Set-Up 3.8 4.2 4.8 5.6 7.8 ns

tWENH Wri te En able Hold 0.0 0.0 0.0 0.0 0.0 ns

tDOH Data Out Hold Time 1.8 2.0 2.1 2.5 3.5 ns

40MX and 42MX FPGA Families

70 v5.0

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Speed ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Sp ee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1. 4 1.6 1.8 2.1 3. 0 ns

tINGO Input Latch Gate -to-Output 2.0 2.2 2.5 2.9 4.1 n s

tINH Input Latch Hol d 0.0 0.0 0.0 0. 0 0. 0 ns

tINSU Input Lat ch Set-Up 0.7 0. 7 0.8 1.0 1.4 ns

tILA Latch Active Pul se Width 6 .5 7.3 8 .2 9.7 13.5 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.8 3.1 3.5 4.07 5.7 ns

tIRD2 FO=2 Routing Delay 3.2 3.5 4.1 4.8 6.7 ns

tIRD3 FO=3 Routing Delay 3.7 4.1 4.7 5.5 7.7 ns

tIRD4 FO=4 Routing Delay 4.2 4.6 5.3 6.2 8.7 ns

tIRD8 FO=8 Routing Delay 6.1 6.8 7.7 9.0 12.6 ns

Global Clock Network

tCKH Input LOW to HI GH FO=32

FO=635 4.6

5.0 5.1

5.6 5.7

6.3 6.7

7.4 9.3

10.3 ns

tCKL Input HIGH to LOW FO=32

FO=635 5.3

6.8 5.9

7.6 6.7

8.6 7.8

10.1 11.0

14.1 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=635 2.5

2.8 2.7

3.1 3.1

3.5 3.6

4.1 5.1

5.7 ns

tPWL Minimum Pul se Width LOW FO=32

FO=635 2.5

2.8 2.7

3.1 3.1

3.5 3.6

4.1 5.1

5.7 ns

tCKSW Maximum Skew FO=32

FO=635 1.0

1.0 1.2

1.2 1.3

1.3 1.5

1.5 2.2

2.2 ns

tSUEXT Input Latch Extern al Set-Up FO=32

FO=635 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch External Hold FO=32

FO=635 4.0

4.6 4.4

5.2 5.0

5.9 5.9

6.9 8.2

9.6 ns

tPMinimum Period (1/fMAX)FO=32

FO=635 9.2

9.9 10.2

11.0 11.1

12.0 12.7

13.8 21.2

23.0 ns

fHMAX Maximum Data path

Frequency FO=32

FO=635 108

100 98

91 90

83 79

73 47

44 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 71

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Commercial Conditions, VCC = 3.0V, TJ = 70°C)

‘–3’ Sp ee d ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 3.6 4.0 4 .5 5.3 7.4 ns

tDHL Data-to-Pad LOW 4.2 4.6 5.2 6.2 8.6 n s

tENZH Enable Pad Z to HI GH 3.7 4.2 4.7 5.5 7.7 ns

tENZL Enable Pad Z to LOW 4.1 4.6 5.2 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 7.34 8.2 9.3 10.9 15.3 ns

tENLZ Enable Pad LOW to Z 6.9 7.6 8.7 10.2 14.3 ns

tGLH G-to-Pad HIGH 4.9 5.5 6.2 7.3 10.2 ns

tGHL G-to-Pad LOW 4 .9 5.5 6. 2 7.3 10.2 ns

tLSU I/O La tc h Ou tp u t Se t- Up 0.7 0.7 0.8 1. 0 1 .4 ns

tLH I/O La tc h Ou tp u t Hol d 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 7.9 8.8 10.0 11.8 16.5 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 10.9 12.1 13.7 16.1 22.5 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.10 0.11 0.12 0.14 0.20 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.10 0.11 0.12 0.14 0.20 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 4.9 5.5 6 .2 7.3 10.3 ns

tDHL Data-to-Pad LOW 3.4 3.8 4.3 5.1 7.1 n s

tENZH Enable Pad Z to HI GH 3.7 4.1 4.7 5.5 7.7 ns

tENZL Enable Pad Z to LOW 4.1 4.6 5.2 6.1 8.5 ns

tENHZ Enable Pad HIGH to Z 7.4 8.2 9.3 10.9 15.3 ns

tENLZ Enable Pad LOW to Z 6.9 7.6 8.7 10.2 14.3 ns

tGLH G-to-Pad HIGH 7.0 7.8 8.9 10.4 14.6 ns

tGHL G-to-Pad LOW 7.0 7.8 8.9 10.4 14.6 ns

tLSU I/O La tc h Se t- U p 0.7 0 .7 0 .8 1. 0 1 .4 ns

tLH I/O La tc h H old 0.0 0.0 0.0 0. 0 0 .0 ns

tLCO I/O La tch Clock-t o-O u t (P ad - to -Pa d )

32 I/O 7.9 8.8 10.0 11.8 16.5 ns

tACO Array Latch Clock- to-Out

(Pad-to-Pad)

32 I/O 10.9 12.1 13.7 16.1 22.5 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.10 0.11 0.12 0.14 0.20 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.10 0.11 0.12 0.14 0.20 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

72 v5.0

A42MX36 Timing Characteristics (Nominal 5.0V Operation)

(Worst-Case Military Conditions, VCC = 4.5V, TJ = 125°C)

‘–2’ Speed ‘–1’ Spee d ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Funct ions1

tPD Internal Array Module Delay 1.5 1.7 2. 0 2.7 ns

tPDD Internal Decode Module Delay 1.8 2.0 2.4 3.3 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.0 1.2 1.4 2.0 ns

tRD2 FO=2 Routing Delay 1.4 1.6 1.9 2.7 ns

tRD3 FO=3 Routing Delay 1.8 2.0 2.4 3.4 ns

tRD4 FO=4 Routing Delay 2.2 2.5 2.9 4.1 ns

tRD5 FO=8 Routing Delay 3.7 4.2 4.9 6.9 ns

tRDD Decode-to-Output Routing Delay 0.4 0.4 0.5 0.7 ns

Logic Module Sequential Timing 3, 4

tCO Flip-Flop Clock-to-Output 1.4 1.6 1.9 2.7 ns

tGO Latch Gate-to-Output 1.4 1.6 1.9 2.7 ns

tSU Flip-Flo p (Latch) Set-Up T ime 0.4 0.4 0.5 0.7 ns

tHFlip-Flo p (Latch) Hol d Time 0.0 0.0 0.0 0.0 ns

tRO Flip-Flop (Latch) Reset - to-Output 1.7 2.0 2.3 3.2 ns

tSUENA Flip-Flop (Latc h) Enable Set-Up 0.8 0.9 1.0 1.4 ns

tHENA Fl i p-Flop (Latch) Enable Ho l d 0.0 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch) Clock Active Pulse Width 3.7 4.2 4.9 6.9 ns

tWASYN Flip-Fl op (La tc h) Asynchronous Pulse

Width 4.8 5.5 6.4 9.0 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate..

2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 73

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Military Conditions, VCC = 4.5V, TJ = 125°C)

Logic Module Timing ‘–2’ Spee d ‘–1’ Spee d ‘Std’ Speed ‘–F’ Speed

ParameterDescription Min.Max.Min.Max.Min.Max.Min.Max.Units

Synchronous SRAM Operations

tRC Read Cycle Time 7.5 8.5 10.0 14.0 ns

tWC Wri te Cycle Time 7.5 8.5 10.0 14.0 ns

tRCKHL Clock HIGH/LOW Time 3.8 4.3 5.0 7.0 ns

tRCO Data Valid Af te r C lock HIGH / LO W 3.8 4.3 5. 0 7.0 ns

tADSU Addre ss/Data Set-Up Time 1.8 2.0 2.4 3.4 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 ns

tRENSU Read Enable Set-Up 0.7 0.8 0.9 1.3 ns

tRENH Read Enable Hold 3.8 4.3 5.0 7.0 ns

tWENSU W rit e En abl e Set-Up 3.0 3.4 4 .0 5.6 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 ns

tBENS Block Enable Set-Up 3.1 3.5 4.1 5.7 ns

tBENH Block Enable Hold 0.0 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 9.0 10.2 12.0 16.8 ns

tRDADV Read Address Valid 9.8 11.1 13.0 18.2 ns

tADSU Addre ss/Data Set-Up Time 1.8 2.1 2.4 3.4 ns

tADH Address/Data Hold Time 0.0 0.0 0.0 0.0 ns

tRENSUA Read Enable Set-Up to Address Valid 0.7 0.8 0.9 1.3 ns

tRENHA Read Enable Hold 3.8 4.3 5.0 7.0 ns

tWENSU W rit e En abl e Set-Up 3.0 3.4 4 .0 5.6 ns

tWENH Write Enable Hold 0.0 0.0 0.0 0.0 ns

tDOH Data Ou t H old Time 1.4 1 .5 1 .8 2 .5 ns

40MX and 42MX FPGA Families

74 v5.0

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Military Conditions, VCC = 4.5V, TJ = 125°C)

‘–2’ Speed ‘–1’ Speed ‘Std’ Speed ‘–F’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to-Y 1.1 1.3 1.5 2.1 ns

tINGO Input Latch Gate -to-Output 1.6 1. 8 2.1 2. 9 ns

tINH Input Latch Hol d 0.0 0 .0 0.0 0. 0 ns

tINSU Input Lat ch Set-Up 0.5 0.6 0.7 1. 0 ns

tILA Latch Active Pulse Width 5.2 5.9 6.9 9.7 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 2.2 2.5 2.9 4.1 ns

tIRD2 FO=2 Routing Delay 2.6 2.9 3.4 4.8 ns

tIRD3 FO=3 Routing Delay 2.9 3.3 3.9 5.5 ns

tIRD4 FO=4 Routing Delay 3.3 3.8 4.4 6.2 ns

tIRD8 FO=8 Routing Delay 4.8 5.5 6.4 9.0 ns

Global Clock Network

tCKH Input LOW to HIGH FO=32

FO=635 3.0

3.3 3.4

3.8 4.0

4.4 5.6

6.2 ns

tCKL Input HIGH to LOW FO=32

FO=635 4.2

5.4 4.8

6.1 5.6

7.2 7.8

10.1 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=635 2.0

2.2 2.2

2.5 2.6

2.9 3.7

4.1 ns

tPWL Minimum Pul se Width LOW FO=32

FO=635 2.0

2.2 2.2

2.5 2.6

2.9 3.7

4.1 ns

tCKSW Maximum Skew FO=32

FO=635 0.8

0.8 0.9

0.9 1.0

1.0 1.4

1.4 ns

tSUEXT Input Latch External Set-Up FO=32

FO=635 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch Externa l Hold FO=32

FO=635 3.2

3.7 3.6

4.2 4.2

4.9 5.9

6.9 ns

tPMinimum Period (1/fMAX)FO=32

FO=635 6.1

6.6 6.6

7.2 7.6

8.3 12.7

13.8 ns

fHMAX Maximum Datapath Frequency FO=32

FO=635 164

151 151

139 131

121 79

73 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 75

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 5.0V Operation) (continued)

(Worst-Case Military Conditions, VCC = 4.5V, TJ = 125°C)

‘–2’ Spee d ‘–1’ Spee d ‘Std’ Speed ‘–F’ Speed

ParameterDescription Min.Max.Min.Max.Min.Max.Min.Max.Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 2.8 3.2 3.8 5.3 ns

tDHL Data-to-Pad LOW 3.3 3.7 4.4 6.2 ns

tENZH Enabl e Pa d Z to HIGH 3.0 3.3 3 .9 5.5 ns

tENZL Enable Pad Z to LOW 3.3 3.7 4.3 6.1 ns

tENHZ Enabl e Pa d HIGH to Z 5.8 6.6 7 .8 11.0 ns

tENLZ Enable Pad LOW to Z 5.5 6.2 7 .3 10.2 ns

tGLH G-to-Pad HIGH 3.3 3.7 4.4 6.1 ns

tGHL G- to -Pa d LO W 3.3 3.7 4 .4 6 .1 ns

tLSU I/O La t ch Ou tp u t Se t- Up 0.5 0. 6 0.7 1. 0 ns

tLH I/ O La tch Outp u t H old 0.0 0.0 0. 0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-Pad)

32 I/O 6.3 7.1 8.4 11.8 ns

tACO Array Latch Clock-to-Out (Pad-to-Pad)

32 I/O 8.6 9.8 11.5 16.1 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.08 0.09 0.10 0.14 n s/ pF

dTHL2Capaci tive Loading, HIGH to LOW 0.08 0.09 0.10 0.14 n s/ pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 3.9 4.5 5.2 7.3 ns

tDHL Data-to-Pad LOW 2.7 3.1 3.7 5.1 ns

tENZH Enabl e Pa d Z to HIGH 3.0 3.3 3 .9 5.5 ns

tENZL Enable Pad Z to LOW 3.3 3.7 4.3 6.1 ns

tENHZ Enabl e Pa d HIGH to Z 5.8 6 .6 7.8 10.9 ns

tENLZ Enable Pad LOW to Z 5.5 6.2 7 .3 10.2 ns

tGLH G-to-Pad HIGH 5.6 6.3 7.5 10.4 ns

tGHL G- to -Pa d LO W 5.6 6.3 7 .5 10. 4 ns

tLSU I/ O La tch Se t - Up 0.5 0.6 0. 7 1.0 ns

tLH I/ O La tch H o ld 0.0 0.0 0. 0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-Pad)

32 I/O 6.3 7.1 8.4 11.8 ns

tACO Array Latch Clock-to-Out (Pad-to-Pad)

32 I/O 8.6 9.78 11.5 16.1 ns

dTLH2Capaci tive Loading, LOW to HIGH 0.08 0.09 0.10 0.14 n s/ pF

dTHL2Capaci tive Loading, HIGH to LOW 0.08 0.09 0.10 0.14 n s/ pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

76 v5.0

A42MX36 Timing Characteristics (Nominal 3.3V Operation)

(Worst-Case Military Conditions, VCC = 3.0V, TJ = 125°C)

‘–2’ Spee d ‘–1’ Speed ‘Std’ Spee d

Parameter Description Min. Max. Min. Max. Min. Max. Units

Logic Module Combinatorial Funct ions1

tPD Internal Array Module Delay 2.4 2.7 3.2 ns

tPDD Inte rna l Deco d e M o du le De la y 2.9 3.3 3.9 ns

Logic Module Predicted Routing Delays2

tRD1 FO=1 Routing Delay 1.7 2.0 2.3 ns

tRD2 FO=2 Routing Delay 2.3 2.6 3.1 ns

tRD3 FO=3 Routing Delay 2.9 3.3 3.9 ns

tRD4 FO=4 Routing Delay 3.6 4.0 4.7 ns

tRD5 FO=8 Routing Delay 6.0 6.8 8.0 ns

tRDD Decod e-to-Output Routing Delay 6.7 0 .8 0.9 n s

Logic Module Sequential Timing3, 4

tCO Flip-Flop Cl oc k-to-Output 2.4 2.7 3.1 ns

tGO Latch Gate-to-Out put 2.4 2.7 3.1 ns

tSU Flip-F lop (Latch) Set -Up Time 0.6 0.7 0.8 ns

tHFlip-Flop (Latch) Hold Time 0.0 0.0 0.0 ns

tRO Flip-F lop (Latch) Reset-to-Output 2.9 3.2 3.8 ns

tSUENA Flip-Flop (Latch) Enable Set-Up 1.3 1.4 1.7 ns

tHENA Flip-Flop (Latch) Enable Hold 0.0 0.0 0.0 ns

tWCLKA Flip-Flop (Latch ) Clock Active Pulse Width 6.0 6.8 8.0 ns

tWASYN Flip-Flop (Latch ) Asynchronous Puls e Wi dt h 7.9 8.9 10.5 ns

Notes:

1. For dual-module macros, use tPD1 + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

2. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be obtained from

the Timer utility.

3. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/hold

timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to the G input

subtracts (adds) to the internal setup (hold) time.

v5.0 77

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Military Conditions, VCC = 3.0V, TJ = 125°C)

Logic Module Timing ‘–2’ Speed ‘–1’ Speed ‘Std’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Units

Synchronous SRAM Operations

tRC Read Cycle Time 12.1 13.8 16.2 ns

tWC Wri te Cycle Time 12.1 13.8 16.2 ns

tRCKHL Clock HIGH/L OW Time 6.1 6.9 8.1 ns

tRCO Data Valid After Clock HIGH/LOW 6.2 7.0 8.2 ns

tADSU Addres s /Data Set- Up Time 2 .9 3.2 3.9 ns

tADH Add ress/Da ta H o ld Time 0 .0 0.0 0.0 ns

tRENSU Rea d Enable Set-Up 1.2 1.5 ns

tRENH Read Enable Hold 6.1 6.9 8.1 ns

tWENSU Wr ite Enable Set-U p 4.8 5.5 6.4 ns

tWENH Wri te Enable Hold 0.0 0.0 0.0 ns

tBENS Block Enable Set-U p 4.9 5.6 6.6 ns

tBENH Block Enable Hold 0.0 0.0 0.0 ns

Asynchronous SRAM Operations

tRPD Asynchronous Access Time 14.7 16.6 19.5 ns

tRDADV Read Address Valid 15.9 18.0 21.1 ns

tADSU Addres s /Data Set- Up Time 2 .9 3.2 3.9 ns

tADH Add ress/Da ta H o ld Time 0 .0 0.0 0.0 ns

tRENSUA Rea d Enable Set-Up to Address Va lid 1.1 1.2 1.5 ns

tRENHA Read Enable Hold 6.1 6.9 8.1 ns

tWENSU Wr ite Enable Set-U p 4.8 5.5 6.4 ns

tWENH Wri te Enable Hold 0.0 0.0 0.0 ns

tDOH Data Out Hold Time 2.4 2.5 2.9 ns

40MX and 42MX FPGA Families

78 v5.0

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Military Conditions, VCC = 3.0V, TJ = 125°C)

‘–2’ Sp ee d ‘–1’ Speed ‘Std’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Units

Input Module Propagation Delays

tINPY Input Data Pad-to -Y 1.9 2.1 2.5 ns

tINGO Input Latch Gate-to-Output 2.6 2.9 3.4 ns

tINH Input Latch Hol d 0.0 0.0 0.0 ns

tINSU Input Latch Se t-Up 0.8 0.9 1.1 ns

tILA Latch Active Pul se Width 8.4 9.5 11.2 ns

Input Module Predicted Routing Delays1

tIRD1 FO=1 Routing Delay 3 .6 4.0 4.8 ns

tIRD2 FO=2 Routing Delay 4 .2 4.7 5.6 ns

tIRD3 FO=3 Routing Delay 4 .8 5.4 6.4 ns

tIRD4 FO=4 Routing Delay 5 .4 6.1 7.2 ns

tIRD8 FO=8 Routing Delay 7 .9 8.9 10.5 ns

Global Clock Network

tCKH Input LOW to HI GH FO=32

FO=635 5.9

6.5 6.7

7.3 7.8

8.6 ns

tCKL Inp ut H IGH to LOW FO=32

FO=635 6.9

8.8 7.8

10.0 9.1

11.7 ns

tPWH Minimum Pulse Width HIGH FO=32

FO=635 3.1

3.5 3.5

4.0 4.2

4.7 ns

tPWL Minimum Pulse Width LOW FO=32

FO=635 3.1

3.5 3.5

4.0 4.2

4.7 ns

tCKSW Maximum Skew FO=32

FO=635 1.4

1.4 1.6

1.6 1.8

1.8 ns

tSUEXT Input Latch Extern al Set-Up FO=32

FO=635 0.0

0.0 0.0

0.0 ns

tHEXT Input Latch External Hold FO=32

FO=635 5.1

5.9 5.8

6.7 6.8

7.9 ns

tPMinimum Period (1/f MAX)FO=32

FO=635 11.8

12.7 12.8

13.8 14.7

15.9 ns

fHMAX Maximum Datapath Frequency FO=32

FO=635 85

78 78

71 67

62 MHz

MHz

Note:

1. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device

performance. Post-route timing analysis or simulation is required to determine actual performance.

v5.0 79

40MX and 42MX FPGA Families

A42MX36 Timing Characteristics (Nominal 3.3V Operation) (continued)

(Worst-Case Military Conditions, VCC = 3.0V, TJ = 125°C)

‘–2’ Speed ‘–1’ Speed ‘Std’ Speed

Parameter Description Min. Max. Min. Max. Min. Max. Units

TTL Output Module Timing1

tDLH Data-to-Pad HIGH 4.6 5.2 6.2 ns

tDHL Data-to-Pad LOW 5.3 6.1 7.2 ns

tENZH Enable Pad Z to HIGH 4.8 5.4 6.4 ns

tENZL Enable Pad Z to LOW 5.3 6.0 7.1 ns

tENHZ Enable Pad HIGH to Z 9.5 10.8 12.7 ns

tENLZ Enable Pad LO W to Z 8.9 10.0 11.8 ns

tGLH G-to-Pad HIGH 6.3 7.2 8.4 ns

tGHL G-to-Pad LOW 6.3 7.2 8.4 ns

tLSU I/O La tch Ou tp u t Se t- Up 0.8 0.9 1. 1 ns

tLH I/O La tch Ou tp u t Hol d 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-Pad)

32 I/O 10.2 11.6 13.7 ns

tACO Array Latch Cl ock-to-Out (Pad-to-Pad)

32 I/O 14.0 15.9 18.7 ns

dTLH2Capacitiv e Loading, LOW to HIGH 0.13 0.14 0.16 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.13 0.14 0.16 ns/pF

CMOS Output Module Timing1

tDLH Data-to-Pad HIGH 6.4 7.3 8.5 ns

tDHL Data-to-Pad LOW 4.5 5.1 5.9 ns

tENZH Enable Pad Z to HIGH 4.8 5.5 6.4 ns

tENZL Enable Pad Z to LOW 5.3 6.0 7.1 ns

tENHZ Enable Pad HIGH to Z 9.5 10.8 12.7 ns

tENLZ Enable Pad LO W to Z 8.9 10.0 11.8 ns

tGLH G-to-Pad HI GH 9.1 10.3 12.1 ns

tGHL G-to-Pad LOW 9.1 10.3 12.1 ns

tLSU I/O La tch Se t- U p 0.8 0.9 1. 1 ns

tLH I/O La tch H old 0.0 0.0 0.0 ns

tLCO I/O Latch Clock-to-Out (Pad-to-Pad)

32 I/O 10.2 13.7 13.7 ns

tACO Array Latch Cl ock-to-Out (Pad-to-Pad)

32 I/O 14.0 18.7 18.7 ns

dTLH2Capacitiv e Loading, LOW to HIGH 0.13 0.16 0.16 ns/pF

dTHL2Capacitive Loading, HIGH to LOW 0.13 0.16 0.16 ns/pF

Notes:

1. Delays based on 35 pF loading.

2. Slew rates measured from 10% to 90% VCCI.

40MX and 42MX FPGA Families

80 v5.0

Pin Descriptions

CLK, CLKA,

CLKB Global Clock (Input)

TTL clock inputs for clock distribution networks. The clock

input is buffered prior to clocking the logic modules. This

pin can also be used as an I/O.

DCLK Diagnostic Clock (Input)

TTL clock input for diagnostic probe and device

programming. DCLK is active when the MODE pin is HIGH.

This pin functions as an I/O when the MODE pin is LOW.

GND Ground (Input)

Input LOW supply voltage.

I/O Input/Output (Input, Output)

Input, output, tri-state, or bi-directional buffer. Input and

output levels are compatible with standard TTL and CMOS

specifications. Unused I/O pins are automatically driven

LOW by the Designer Series software.

LP Low Power Mode

Controls the low power mode of all 42MX devices. This pin

must be set HIGH to switch the device to low power mode.

To exit the LOW power mode, the LP pin must be set LOW.

MODE Mode (Input)

Controls the use of multifunction pins (DCLK, PRA, PRB,

SDI, TDO). To provide verification capability, the MODE pin

should be held HIGH. To facilitate this, the MODE pin

should be terminated to GND through a 10K¾ resistor so

that the MODE pin can be pulled HIGH when required.

NC No Connection

This pin is not connected to circuitry within the device.

These pins can be driven to any voltage or can be left

floating with no effect on the operation of the device.

PRA, I/O Probe A (Output)

The Probe A pin is used to output data from any

user-defined design node within the device. This

independent diagnostic pin can be used in conjunction with

the Probe B pin to allow real-time diagnostic output of any

signal path within the device. The Probe A pin can be used

as a user-defined I/O when verification has been completed.

The pin's probe capabilities can be permanently disabled to

protect programmed design confidentiality. PRA is

accessible when the MODE pin is HIGH. This pin functions

as an I/O when the MODE pin is LOW.

PRB, I/O Probe B (Output)

The Probe B pin is used to output data from any

user-defined design node within the device. This

independent diagnostic pin can be used in conjunction with

the Probe A pin to allow real-time diagnostic output of any

signal path within the device. The Probe B pin can be used

as a user-defined I/O when verification has been completed.

The pin’s probe capabilities can be permanently disabled to

protect programmed design confidentiality. PRB is

accessible when the MODE pin is HIGH. This pin functions

as an I/O when the MODE pin is LOW.

QCLKA,B,C,D Quadrant Clock (Input/Output)

Quadrant clock inputs. When not used as a register control

signal, these pins can function as general-purpose I/Os.

SDI Serial Data Input (Input)

Serial data input for diagnostic probe and device

programming. SDI is active when the MODE pin is HIGH.

This pin functions as an I/O when the MODE pin is LOW.

SDO, TDO,

I/O Serial Data (Output)

Serial data output for diagnostic probe and device

programming. SDO is active when the MODE pin is HIGH.

This pin functions as an I/O when the MODE pin is LOW.

SDO is not available for 40MX devices.

TCK Test Clock

Clock signal to shift the Boundary Scan Test (BST) data into

the device. This pin functions as an I/O when the test fuse is

not programmed. BST pins are only available in the

A42MX24, A42MX24A, and A42MX36 devices.

TDI Test Data In

Serial data input for BST instructions and data. Data is

shifted in on the rising edge of TCK. This pin functions as an

I/O when the test fuse is not programmed. BST pins are only

available in the A42MX24 and A42MX36 devices.

TDO Test Data Out

Serial data output for BST instructions and test data. This

pin functions as an I/O when the test fuse is not

programmed. BST pins are only available in the A42MX24

and A42MX36 devices.

TMS Test Mode Select

Serial data input for boundary scan test mode. Data is shifted

in on the rising edge of TCK. This pin functions as an I/O

when the test fuse is not programmed. BST pins are only

available in the A42MX24 and A42MX36 devices.

VCC Supply Voltage (Input)

Input HIGH supply voltage.

VCCA Supply Voltage (Input)

Input HIGH supply voltage, supplies array core only.

VCCI Supply Voltage (Input)

Input HIGH supply voltage, supplies I/O cells only.

WD Wide Decode Output

When a wide decode module is used in a 42MX device, this

pin can be used as a dedicated output from the wide decode

module. This direct connection eliminates additional

interconnect delays associated with regular logic modules.

To implement the direct I/O connection, connect an output

buffer of any type to the output of the wide decode macro

and place this output on one of the reserved WD pins.

v5.0 81

40MX and 42MX FPGA Families

Package Pin Assignments

44-Pin PLCC

44-pin PLCC

Pin Number A40MX02

Function A40MX04

Function Pin Number A40MX02

Function A40MX04

Function

1 I/O I/O 23 I/O I/O

2 I/O I/O 24 I/O I/O

CC VCC 25 VCC VCC

4 I/O I/O 26 I/O I/O

5 I/O I/O 27 I/O I/O

6 I/O I/O 28 I/O I/O

7 I/O I/O 29 I/O I/O

8 I/O I/O 30 I/O I/O

9 I/O I/O 31 I/O I/O

10 GND GND 32 GND GND

11 I/O I/O 33 CLK, I/O CLK, I/O

12 I/O I/O 34 MODE MODE

13 I/O I/O 35 VCC VCC

14 VCC VCC 36 SDI, I/O SDI, I/O

15 I/O I/O 37 DCLK, I/O DCLK, I/O

16 VCC VCC 38 PRA, I/O PRA, I/O

17 I/O I/O 39 PRB, I/O PRB, I/O

18 I/O I/O 40 I/O I/O

19 I/O I/O 41 I/O I/O

20 I/O I/O 42 I/O I/O

21 GND GND 43 GND GND

22 I/O I/O 44 I/O I/O

44-Pin

PLCC

441

40MX and 42MX FPGA Families

82 v5.0

Package Pin Assignments

68-Pin PLCC

Number A40MX02

Function A40MX04

Function Pin

Number A40MX02

Function A40MX04

Function Pin

Number A40MX02

Function A40MX04

Function

1 I/O I/O 24 I/O I/O 47 I/O I/O

2 I/O I/O 25 VCC VCC 48 I/O I/O

3 I/O I/O 26 I/O I/O 49 GND GND

CC VCC 27 I/O I/O 50 I/O I/O

5 I/O I/O 28 I/O I/O 51 I/O I/O

6 I/O I/O 29 I/O I/O 52 CLK, I/O CLK, I/O

7 I/O I/O 30 I/O I/O 53 I/O I/O

8 I/O I/O 31 I/O I/O 54 MODE MODE

9 I/O I/O 32 GND GND 55 VCC VCC

10 I/O I/O 33 I/O I/O 56 SDI, I/O SDI, I/O

11 I/O I/O 34 I/O I/O 57 DCLK, I/O DCLK, I/O

12 I/O I/O 35 I/O I/O 58 PRA, I/O PRA, I/O

13 I/O I/O 36 I/O I/O 59 PRB, I/O PRB, I/O

14 GND GND 37 I/O I/O 60 I/O I/O

15 GND GND 38 VCC VCC 61 I/O I/O

16 I/O I/O 39 I/O I/O 62 I/O I/O

17 I/O I/O 40 I/O I/O 63 I/O I/O

18 I/O I/O 41 I/O I/O 64 I/O I/O

19 I/O I/O 42 I/O I/O 65 I/O I/O

20 I/O I/O 43 I/O I/O 66 GND GND

21 VCC VCC 44 I/O I/O 67 I/O I/O

22 I/O I/O 45 I/O I/O 68 I/O I/O

23 I/O I/O 46 I/O I/O

68-Pin

PLCC

1 68

v5.0 83

40MX and 42MX FPGA Families

Package Pin Assignments (continued)

84-Pin PLCC

184

84-Pin

PLCC

40MX and 42MX FPGA Families

84 v5.0

84-Pin PLCC

Number A40MX04

Function A42MX09

Function A42MX16

Function A42MX24

Function Pin

Number A40MX04

Function A42MX09

Function A42MX16

Function A42MX24

Function

1 I/O I/O I/O I/O 43 I/O VCCA VCCA VCCA

2 I/O CLKB, I/O CLKB, I/O CLKB, I/O 44 I/O I/O I/O I/O (WD)

3 I/O I/O I/O I/O 45 I/O I/O I/O I/O (WD)

CC PRB, I/O PRB, I/O PRB, I/O 46 VCC I/O I/O I/O (WD)

5 I/O I/O I/O I/O (WD) 47 I/O I/O I/O I/O (WD)

6 I/O GND GND GND 48 I/O I/O I/O I/O

7 I/O I/O I/O I/O 49 I/O GND GND GND

8 I/O I/O I/O I/O (WD) 50 I/O I/O I/O I/O (WD)

9 I/O I/O I/O I/O (WD) 51 I/O I/O I/O I/O (WD)

10 I/O DCLK, I/O DCLK, I/O DCLK, I/O 52 I/O SDO, I/O SDO, I/O SDO, TDO (WD)

11 I/O I/O I/O I/O 53 I/O I/O I/O I/O

12 NC MODE MODE MODE 54 I/O I/O I/O I/O

13 I/O I/O I/O I/O 55 I/O I/O I/O I/O

14 I/O I/O I/O I/O 56 I/O I/O I/O I/O

15 I/O I/O I/O I/O 57 I/O I/O I/O I/O

16 I/O I/O I/O I/O 58 I/O I/O I/O I/O

17 I/O I/O I/O I/O 59 I/O I/O I/O I/O

18 GND I/O I/O I/O 60 GND I/O I/O I/O

19 GND I/O I/O I/O 61 GND I/O I/O I/O

20 I/O I/O I/O I/O 62 I/O I/O I/O TCK, I/O

21 I/O I/O I/O I/O 63 I/O GND (LP) GND (LP) GND (LP)

22 I/O VCCA VCCI VCCI 64 CLK, I/O VCCA VCCA VCCA

23 I/O VCCI VCCA VCCA 65 I/O VCCI VCCI VCCI

24 I/O I/O I/O I/O 66 MODE I/O I/O I/O

25 VCC I/O I/O I/O 67 VCC I/O I/O I/O

26 VCC I/O I/O I/O 68 VCC I/O I/O I/O

27 I/O I/O I/O I/O 69 I/O I/O I/O I/O

28 I/O GND GND GND 70 I/O GND GND GND

29 I/O I/O I/O I/O 71 I/O I/O I/O I/O

30 I/O I/O I/O I/O 72 SDI, I/O I/O I/O I/O

31 I/O I/O I/O I/O 73 DCLK, I/O I/O I/O I/O

32 I/O I/O I/O I/O 74 PRA, I/O I/O I/O I/O

33 VCC I/O I/O I/O 75 PRB, I/O I/O I/O I/O

34 I/O I/O I/O TMS, I/O 76 I/O SDI, I/O SDI, I/O SDI, I/O

35 I/O I/O I/O TDI, I/O 77 I/O I/O I/O I/O

36 I/O I/O I/O I/O (WD) 78 I/O I/O I/O I/O (WD)

37 I/O I/O I/O I/O 79 I/O I/O I/O I/O (WD)

38 I/O I/O I/O I/O (WD) 80 I/O I/O I/O I/O (WD)

39 I/O I/O I/O I/O (WD) 81 I/O PRA, I/O PRA , I/O PRA, I/O

40 GND I/O I/O I/O 82 GND I/O I/O I/O

41 I/O I/O I/O I/O 83 I/O CLKA, I/O CLKA, I/O CLKA, I/O

42 I/O I/O I/O I/O 84 I/O VCCA VCCA VCCA

v5.0 85

40MX and 42MX FPGA Families

Package Pin Assignments (continued)

100-Pin PQFP Package (Top View)

100-Pin

PQFP

100

40MX and 42MX FPGA Families

86 v5.0

100-Pin PQFP

Number A40MX02

Function A40MX04

Function A42MX09

Function A42MX16

Function Pin

Number A40MX02

Function A40MX04

Function A42MX09

Function A42MX16

Function

1 NC NC I/O I/O 40 I/O I/O VCCA VCCA

2 NC NC DCLK, I/O DCLK, I/O 41 I/O I/O I/O I/O

3 NC NC I/O I/O 42 I/O I/O I/O I/O

4NCNCMODEMODE 43V

CC VCC I/O I/O

5 NC NC I/O I/O 44 VCC VCC I/O I/O

6 PRB, I/O PRB, I/O I/O I/O 45 I/O I/O I/O I/O

7 I/O I/O I/O I/O 46 I/O I/O GND GND

8 I/O I/O I/O I/O 47 I/O I/O I/O I/O

9 I/O I/O GND GND 48 NC I/O I/O I/O

10 I/O I/O I/O I/O 49 NC I/O I/O I/O

11 I/O I/O I/O I/O 50 NC I/O I/O I/O

12 I/O I/O I/O I/O 51 NC NC I/O I/O

13 GND GND I/O I/O 52 NC NC SDO, I/O SDO, I/O

14 I/O I/O I/O I/O 53 NC NC I/O I/O

15 I/O I/O I/O I/O 54 NC NC I/O I/O

16 I/O I/O VCCA VCCA 55 NC NC I/O I/O

17 I/O I/O VCCI VCCA 56 VCC VCC I/O I/O

18 I/O I/O I/O I/O 57 I/O I/O GND GND

19 VCC VCC I/O I/O 58 I/O I/O I/O I/O

20 I/O I/O I/O I/O 59 I/O I/O I/O I/O

21 I/O I/O I/O I/O 60 I/O I/O I/O I/O

22 I/O I/O GND GND 61 I/O I/O I/O I/O

23 I/O I/O I/O I/O 62 I/O I/O I/O I/O

24 I/O I/O I/O I/O 63 GND GND I/O I/O

25 I/O I/O I/O I/O 64 I/O I/O GND (LP) GND (LP)

26 I/O I/O I/O I/O 65 I/O I/O VCCA VCCA

27 NC NC I/O I/O 66 I/O I/O VCCI VCCI

28 NC NC I/O I/O 67 I/O I/O VCCA VCCA

29 NC NC I/O I/O 68 I/O I/O I/O I/O

30 NC NC I/O I/O 69 VCC VCC I/O I/O

31 NC I/O I/O I/O 70 I/O I/O I/O I/O

32 NC I/O I/O I/O 71 I/O I/O I/O I/O

33 NC I/O I/O I/O 72 I/O I/O GND GND

34 I/O I/O GND GND 73 I/O I/O I/O I/O

35 I/O I/O I/O I/O 74 I/O I/O I/O I/O

36 GND GND I/O I/O 75 I/O I/O I/O I/O

37 GND GND I/O I/O 76 I/O I/O I/O I/O

38 I/O I/O I/O I/O 77 NC NC I/O I/O

39 I/O I/O I/O I/O 78 NC NC I/O I/O

v5.0 87

40MX and 42MX FPGA Families

79 NC NC SDI, I/O SDI, I/O 90 CLK, I/O CLK, I/O VCCA VCCA

80 NC I/O I/O I/O 91 I/O I/O I/O I/O

81 NC I/O I/O I/O 92 MODE MODE CLKB, I/O CLKB, I/O

82 NC I/O I/O I/O 93 VCC VCC I/O I/O

83 I/O I/O I/O I/O 94 VCC VCC PRB, I/O PR B, I/O

84 I/O I/O GND GND 95 NC I/O I/O I/O

85 I/O I/O I/O I/O 96 NC I/O GND GND

86 GND GND I/O I/O 97 NC I/O I/O I/O

87 GND GND PRA, I/O PRA, I/O 98 SDI, I/O SDI, I/O I/O I/O

88 I/O I/O I/O I/O 99 DCLK, I/O DCLK, I/O I/O I/O

89 I/O I/O CLKA, I/O CLKA, I/O 100 PRA, I/O PRA, I/O I/O I/O

100-Pin PQFP (Continued)

Number A40MX02

Function A40MX04

Function A42MX09

Function A42MX16

Function Pin

Number A40MX02

Function A40MX04

Function A42MX09

Function A42MX16

Function

40MX and 42MX FPGA Families

88 v5.0

160

160-Pin

PQFP

Package Pin Assignments (continued)

160-Pin PQFP Package (Top View)

v5.0 89

40MX and 42MX FPGA Families

160-Pin PQFP

Number A42MX09

Function A42MX16

Function A42MX24

Fucntion Pin

Number A42MX09

Function A42MX16

Function A42MX24

Fucntion

1 I/O I/O I/O 41 I/O I/O I/O

2 DCLK, I/O DCLK, I/O DCLK, I/O 42 I/O I/O I/O

3 NC I/O I/O 43 I/O I/O I/O

4 I/O I/O I/O (WD) 44 GND GND GND

5 I/O I/O I/O (WD) 45 I/O I/O I/O

6NCV

CCI VCCI 46 I/O I/O I/O

7 I/O I/O I/O 47 I/O I/O I/O

8 I/O I/O I/O 48 I/O I/O I/O

9 I/O I/O I/O 49 GND GND GND

10 NC I/O I/O 50 I/O I/O I/O

11 GND GND GND 51 I/O I/O I/O

12 NC I/O I/O 52 NC I/O I/O

13 I/O I/O I/O (WD) 53 I/O I/O I/O

14 I/O I/O I/O (WD) 54 NC VCCA VCCA

15 I/O I/O I/O 55 I/O I/O I/O

16 PRB, I/O PRB, I/O PRB, I/O 56 I/O I/O I/O

17 I/O I/O I/O 57 VCCA VCCA VCCA

18 CLKB, I/O CLKB, I/O CLKB, I/O 58 VCCI VCCI VCCI

19 I/O I/O I/O 59 GND GND GND

20 VCCA VCCA VCCA 60 VCCA VCCA VCCA

21 CLKA, I/O CLKA, I/O CLKA, I/O 61 GND (LP) GND (LP) GND (LP)

22 I/O I/O I/O 62 I/O I/O TCK, I/O

23 PRA, I/O PRA, I/O PRA, I/O 63 I/O I/O I/O

24 NC I/O I/O (WD) 64 GND GND GND

25 I/O I/O I/O (WD) 65 I/O I/O I/O

26 I/O I/O I/O 66 I/O I/O I/O

27 I/O I/O I/O 67 I/O I/O I/O

28 NC I/O I/O 68 I/O I/O I/O

29 I/O I/O I/O (WD) 69 GND GND GND

30 GND GND GND 70 NC I/O I/O

31 NC I/O I/O (WD) 71 I/O I/O I/O

32 I/O I/O I/O 72 I/O I/O I/O

33 I/O I/O I/O 73 I/O I/O I/O

34 I/O I/O I/O 74 I/O I/O I/O

35 NC VCCI VCCI 75 NC I/O I/O

36 I/O I/O I/O (WD) 76 I/O I/O I/O

37 I/O I/O I/O (WD) 77 NC I/O I/O

38 SDI, I/O SDI, I/O SDI, I/O 78 I/O I/O I/O

39 I/O I/O I/O 79 NC I/O I/O

40 GND GND GND 80 GND GND GND

40MX and 42MX FPGA Families

90 v5.0

81 I/O I/O I/O 121 I/O I/O I/O

82 SDO, I/O SDO, I/O SDO, TDO, I/O 122 I/O I/O I/O

83 I/O I/O I/O (WD) 123 I/O I/O I/O

84 I/O I/O I/O (WD) 124 NC I/O I/O

85 I/O I/O I/O 125 GND GND GND

86 NC VCCI VCCI 126 I/O I/O I/O

87 I/O I/O I/O 127 I/O I/O I/O

88 I/O I/O I/O (WD) 128 I/O I/O I/O

89 GND GND GND 129 NC I/O I/O

90 NC I/O I/O 130 GND GND GND

91 I/O I/O I/O 131 I/O I/O I/O

92 I/O I/O I/O 132 I/O I/O I/O

93 I/O I/O I/O 133 I/O I/O I/O

94 I/O I/O I/O 134 I/O I/O I/O

95 I/O I/O I/O 135 NC VCCA VCCA

96 I/O I/O I/O (WD) 136 I/O I/O I/O

97 I/O I/O I/O 137 I/O I/O I/O

98 VCCA VCCA VCCA 138 NC VCCA VCCA

99 GND GND GND 139 VCCI VCCI VCCI

100 NC I/O I/O 140 GND GND GND

101 I/O I/O I/O 141 NC I/O I/O

102 I/O I/O I/O 142 I/O I/O I/O

103 NC I/O I/O 143 I/O I/O I/O

104 I/O I/O I/O 144 I/O I/O I/O

105 I/O I/O I/O 145 GND GND GND

106 I/O I/O I/O (WD) 146 NC I/O I/O

107 I/O I/O I/O (WD) 147 I/O I/O I/O

108 I/O I/O I/O 148 I/O I/O I/O

109 GND GND GND 149 I/O I/O I/O

110 NC I/O I/O 150 NC VCCA VCCA

111 I/O I/O I/O (WD) 151 NC I/O I/O

112 I/O I/O I/O (WD) 152 NC I/O I/O

113 I/O I/O I/O 153 NC I/O I/O

114 NC VCCI VCCI 154 NC I/O I/O

115 I/O I/O I/O (WD) 155 GND GND GND

116 NC I/O I/O (WD) 156 I/O I/O I/O

117 I/O I/O I/O 157 I/O I/O I/O

118 I/O I/O TDI, I/O 158 I/O I/O I/O

119 I/O I/O TM S, I/O 159 MODE MODE MODE

120 GND GND GND 160 GND GND GND

160-Pin PQFP (Continued)

Number A42MX09

Function A42MX16

Function A42MX24

Fucntion Pin

Number A42MX09

Function A42MX16

Function A42MX24

Fucntion

v5.0 91

40MX and 42MX FPGA Families

Package Pin Assignments (continued)

208-Pin PQFP Package (Top View)

208-Pin PQFP

1208

40MX and 42MX FPGA Families

92 v5.0

208-Pin PQFP

Number A42MX16

Function A42MX24

Function A42MX36

Function Pin

Number A42MX16

Function A42MX24

Function A42MX36

Function

1 GND GND GND 43 NC I/O I/O

2NCV

CCA VCCA 44 I/O I/O I/O

3 MODE MODE MODE 45 I/O I/O I/O

4 I/O I/O I/O 46 I/O I/O I/O

5 I/O I/O I/O 47 I/O I/O I/O

6 I/O I/O I/O 48 I/O I/O I/O

7 I/O I/O I/O 49 I/O I/O I/O

8 I/O I/O I/O 50 NC I/O I/O

9 NC I/O I/O 51 NC I/O I/O

10 NC I/O I/O 52 GND GND GND

11 NC I/O I/O 53 GND GND GND

12 I/O I/O I/O 54 I/O TMS, I/O TMS, I/O

13 I/O I/O I/O 55 I/O TDI, I/O TDI, I/O

14 I/O I/O I/O 56 I/O I/O I/O

15 I/O I/O I/O 57 I/O I/O (WD) I/O (WD)

16 NC I/O I/O 58 I/O I/O (WD) I/O (WD)

17 VCCA VCCA VCCA 59 I/O I/O I/O

18 I/O I/O I/O 60 VCCI VCCI VCCI

19 I/O I/O I/O 61 NC I/O I/O

20 I/O I/O I/O 62 NC I/O I/O

21 I/O I/O I/O 63 I/O I/O I/O

22 GND GND GND 64 I/O I/O I/O

23 I/O I/O I/O 65 I/O I/O QCLKA, I/O

24 I/O I/O I/O 66 I/O I/O (WD) I/O (WD)

25 I/O I/O I/O 67 NC I/O (WD) I/O (WD)

26 I/O I/O I/O 68 NC I/O I/O

27 GND GND GND 69 I/O I/O I/O

28 VCCI VCCI VCCI 70 I/O I/O (WD) I/O (WD)

29 VCCA VCCA VCCA 71 I/O I/O (WD) I/O (WD)

30 I/O I/O I/O 72 I/O I/O I/O

31 I/O I/O I/O 73 I/O I/O I/O

32 VCCA VCCA VCCA 74 I/O I/O I/O

33 I/O I/O I/O 75 I/O I/O I/O

34 I/O I/O I/O 76 I/O I/O I/O

35 I/O I/O I/O 77 I/O I/O I/O

36 I/O I/O I/O 78 GND GND GND

37 I/O I/O I/O 79 VCCA VCCA VCCA

38 I/O I/O I/O 80 NC VCCI VCCI

39 I/O I/O I/O 81 I/O I/O I/O

40 I/O I/O I/O 82 I/O I/O I/O

41 NC I/O I/O 83 I/O I/O I/O

42 NC I/O I/O 84 I/O I/O I/O

v5.0 93

40MX and 42MX FPGA Families

85 I/O I/O (WD) I/O (WD) 127 I/O I/O I/O

86 I/O I/O (WD) I/O (WD) 128 I/O TCK, I/O TCK, I/O

87 I/O I/O I/O 129 GND (LP) GND (LP) GND (LP)

88 I/O I/O I/O 130 VCCA VCCA VCCA

89 NC I/O I/O 131 GND GND GND

90 NC I/O I/O 132 VCCI VCCI VCCI

91 I/O I/O QCLKB, I/O 133 VCCA VCCA VCCA

92 I/O I/O I/O 134 I/O I/O I/O

93 I/O I/O (WD) I/O (WD) 135 I/O I/O I/O

94 I/O I/O (WD) I/O (WD) 136 VCCA VCCA VCCA

95 NC I/O I/O 137 I/O I/O I/O

96 NC I/O I/O 138 I/O I/O I/O

97 NC I/O I/O 139 I/O I/O I/O

98 VCCI VCCI VCCI 140 I/O I/O I/O

99 I/O I/O I/O 141 NC I/O I/O

100 I/O I/O (WD) I/O (WD) 142 I/O I/O I/O

101 I/O I/O (WD) I/O (WD) 143 I/O I/O I/O

102 I/O I/O I/O 144 I/O I/O I/O

103 SDO, I/O SDO, TDO, I/O SDO, TDO, I/O 145 I/O I/O I/O

104 I/O I/O I/O 146 NC I/O I/O

105 GND GND GND 147 NC I/O I/O

106 NC VCCA VCCA 148 NC I/O I/O

107 I/O I/O I/O 149 NC I/O I/O

108 I/O I/O I/O 150 GND GND GND

109 I/O I/O I/O 151 I/O I/O I/O

110 I/O I/O I/O 152 I/O I/O I/O

111 I/O I/O I/O 153 I/O I/O I/O

112 NC I/O I/O 154 I/O I/O I/O

113 NC I/O I/O 155 I/O I/O I/O

114 NC I/O I/O 156 I/O I/O I/O

115 NC I/O I/O 157 GND GND GND

116 I/O I/O I/O 158 I/O I/O I/O

117 I/O I/O I/O 159 SDI, I/O SDI, I/O SDI, I/O

118 I/O I/O I/O 160 I/O I/O I/O

119 I/O I/O I/O 161 I/O I/O (WD) I/O (WD)

120 I/O I/O I/O 162 I/O I/O (WD) I/O (WD)

121 I/O I/O I/O 163 I/O I/O I/O

122 I/O I/O I/O 164 VCCI VCCI VCCI

123 I/O I/O I/O 165 NC I/O I/O

124 I/O I/O I/O 166 NC I/O I/O

125 I/O I/O I/O 167 I/O I/O I/O

126 GND GND GND 168 I/O I/O (WD) I/O (WD)

208-Pin PQFP (Continued)

Number A42MX16

Function A42MX24

Function A42MX36

Function Pin

Number A42MX16

Function A42MX24

Function A42MX36

Function

40MX and 42MX FPGA Families

94 v5.0

169 I/O I/O (WD) I/O (WD) 189 I/O I/O I/O

170 I/O I/O I/O 190 I/O I/O (WD) I/O (WD)

171 NC I/O QCLKD, I/O 191 I/O I/O (WD) I/O (WD)

172 I/O I/O I/O 192 I/O I/O I/O

173 I/O I/O I/O 193 NC I/O I/O

174 I/O I/O I/O 194 NC I/O (WD) I/O (WD)

175 I/O I/O I/O 195 NC I/O (WD) I/O (WD)

176 I/O I/O (WD) I/O (WD) 196 I/O I/O QCLKC, I/O

177 I/O I/O (WD) I/O (WD) 197 NC I/O I/O

178 PRA, I/O PRA, I/O PRA, I/O 198 NC I/O I/O

179 I/O I/O I/O 199 I/O I/O I/O

180 CLKA, I/O CLKA, I/O CLKA, I/O 200 I/O I/O I/O

181 NC I/O I/O 201 NC I/O I/O

182 NC VCCI VCCI 202 VCCI VCCI VCCI

183 VCCA VCCA VCCA 203 I/O I/O (WD) I/O (WD)

184 GND GND GND 204 I/O I/O (WD) I/O (WD)

185 I/O I/O I/O 205 I/O I/O I/O

186 CLKB, I/O CLKB, I/O CLKB, I/O 206 I/O I/O I/O

187 I/O I/O I/O 207 DCLK, I/O DCLK, I/O DCLK, I/O

188 PRB, I/O PRB, I/O PRB, I/O 208 I/O I/O I/O

208-Pin PQFP (Continued)

Number A42MX16

Function A42MX24

Function A42MX36

Function Pin

Number A42MX16

Function A42MX24

Function A42MX36

Function

v5.0 95

40MX and 42MX FPGA Families

Package Pin Assignments (continued)

240-Pin PQFP Package (Top View)

240-Pin

PQFP

1240

•

40MX and 42MX FPGA Families

96 v5.0

240-Pin PQFP

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function

1 I/O 41 I/O 81 I/O 121 GND

2 DCLK, I/O 42 I/O 82 I/O 122 I/O

3 I/O 43 I/O 83 I/O 123 SDO, TDO, I/O

4 I/O 44 I/O 84 I/O 124 I/O

5 I/O 45 QCLKD, I/O 85 VCCA 125 I/O (WD)

6 I/O (WD) 46 I/O 86 I/O 126 I/O (WD)

7 I/O (WD) 47 I/O (WD) 87 I/O 127 I/O

CCI 48 I/O (WD) 88 VCCA 128 VCCI

9 I/O 49 I/O 89 VCCI 129 I/O

10 I/O 50 I/O 90 VCCA 130 I/O

11 I/O 51 I/O 91 GND (LP) 131 I/O

12 I/O 52 VCCI 92 TCK, I/O 132 I/O (WD)

13 I/O 53 I/O 93 I/O 133 I/O (WD)

14 I/O 54 I/O (WD) 94 GND 134 I/O

15 QCLKC, I/O 55 I/O (WD) 95 I/O 135 QCLKB, I/O

16 I/O 56 I/O 96 I/O 136 I/O

17 I/O (WD) 57 SDI, I/O 97 I/O 137 I/O

18 I/O (WD) 58 I/O 98 I/O 138 I/O

19 I/O 59 VCCA 99 I/O 139 I/O

20 I/O 60 GND 100 I/O 140 I/O

21 I/O (WD) 61 GND 101 I/O 141 I/O

22 I/O (WD) 62 I/O 102 I/O 142 I/O (WD)

23 I/O 63 I/O 103 I/O 143 I/O (WD)

24 PRB, I/O 64 I/O 104 I/O 144 I/O

25 I/O 65 I/O 105 I/O 145 I/O

26 CLKB, I/O 66 I/O 106 I/O 146 I/O

27 I/O 67 I/O 107 I/O 147 I/O

28 GND 68 I/O 108 VCCI 148 I/O

29 VCCA 69 I/O 109 I/O 149 I/O

30 VCCI 70 I/O 110 I/O 150 VCCI

31 I/O 71 VCCI 111 I/O 151 VCCA

32 CLKA, I/O 72 I/O 112 I/O 152 GND

33 I/O 73 I/O 113 I/O 153 I/O

34 PRA, I/O 74 I/O 114 I/O 154 I/O

35 I/O 75 I/O 115 I/O 155 I/O

36 I/O 76 I/O 116 I/O 156 I/O

37 I/O (WD) 77 I/O 11 7 I/O 157 I/O

38 I/O (WD) 78 I/O 11 8 VCCA 158 I/O

39 I/O 79 I/O 119 GND 159 I/O (WD)

40 I/O 80 I/O 120 GND 160 I/O (WD)

v5.0 97

40MX and 42MX FPGA Families

161 I/O 181 VCCA 201 I/O 221 I/O

162 I/O 182 GND 202 I/O 222 I/O

163 I/O (WD) 183 I/O 203 I/O 223 I/O

164 I/O (WD) 184 I/O 204 I/O 224 I/O

165 I/O 185 I/O 205 I/O 225 I/O

166 QCLKA, I/O 186 I/O 206 VCCA 226 I/O

167 I/O 187 I/O 207 I/O 227 VCCI

168 I/O 188 I/O 208 I/O 228 I/O

169 I/O 189 I/O 209 VCCA 229 I/O

170 I/O 190 I/O 210 VCCI 230 I/O

171 I/O 191 I/O 211 I/O 231 I/O

172 VCCI 192 VCCI 212 I/O 232 I/O

173 I/O 193 I/O 213 I/O 233 I/O

174 I/O (WD) 194 I/O 214 I/O 234 I/O

175 I/O (WD) 195 I/O 215 I/O 235 I/O

176 I/O 196 I/O 216 I/O 236 I/O

177 I/O 197 I/O 217 I/O 237 GND

178 TDI, I/O 198 I/O 218 I/O 238 MODE

179 TMS, I/O 199 I/O 219 VCCA 239 VCCA

180 GND 200 I/O 220 I/O 240 GND

240-Pin PQFP (Continued)

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function

40MX and 42MX FPGA Families

98 v5.0

Package Pin Assignments (continued)

80-Pin VQFP

80-Pin

VQFP

v5.0 99

40MX and 42MX FPGA Families

80-Pin VQFP

Pin Number A40MX02

Function A40MX04

Function Pin Number A40MX02

Function A40MX04

Function

1 I/O I/O 41 NC I/O

2 NC I/O 42 NC I/O

3 NC I/O 43 NC I/O

4 NC I/O 44 I/O I/O

5 I/O I/O 45 I/O I/O

6 I/O I/O 46 I/O I/O

7 GND GND 47 GND GND

8 I/O I/O 48 I/O I/O

9 I/O I/O 49 I/O I/O

10 I/O I/O 50 CLK, I/O CLK, I/O

11 I/O I/O 51 I/O I/O

12 I/O I/O 52 MODE MODE

13 VCC VCC 53 VCC VCC

14 I/O I/O 54 NC I/O

15 I/O I/O 55 NC I/O

16 I/O I/O 56 NC I/O

17 NC I/O 57 SDI, I/O SDI, I/O

18 NC I/O 58 DCLK, I/O DCLK, I/O

19 NC I/O 59 PRA, I/O PR A, I/O

20 VCC VCC 60 NC NC

21 I/O I/O 61 PRB, I/O P RB, I/O

22 I/O I/O 62 I/O I/O

23 I/O I/O 63 I/O I/O

24 I/O I/O 64 I/O I/O

25 I/O I/O 65 I/O I/O

26 I/O I/O 66 I/O I/O

27 GND GND 67 I/O I/O

28 I/O I/O 68 GND GND

29 I/O I/O 69 I/O I/O

30 I/O I/O 70 I/O I/O

31 I/O I/O 71 I/O I/O

32 I/O I/O 72 I/O I/O

33 VCC VCC 73 I/O I/O

34 I/O I/O 74 VCC VCC

35 I/O I/O 75 I/O I/O

36 I/O I/O 76 I/O I/O

37 I/O I/O 77 I/O I/O

38 I/O I/O 78 I/O I/O

39 I/O I/O 79 I/O I/O

40 I/O I/O 80 I/O I/O

40MX and 42MX FPGA Families

100 v5.0

Package Pin Assignments (continued)

100-Pin VQFP Package (Top View)

100-Pin

VQFP

100

v5.0 101

40MX and 42MX FPGA Families

100-Pin VQFP Package

Pin Number A42MX09

Function A42MX16

Funct ion Pin Number A42MX09

Function A42MX16

Function

1 I/O I/O 51 I/O I/O

2 MODE MODE 52 I/O I/O

3 I/O I/O 53 I/O I/O

4 I/O I/O 54 I/O I/O

5 I/O I/O 55 GND GND

6 I/O I/O 56 I/O I/O

7 GND GND 57 I/O I/O

8 I/O I/O 58 I/O I/O

9 I/O I/O 59 I/O I/O

10 I/O I/O 60 I/O I/O

11 I/O I/O 61 I/O I/O

12 I/O I/O 62 GND (LP) GND (LP)

13 I/O I/O 63 VCCA VCCA

14 VCCA NC 64 VCCI VCCI

15 VCCI VCCI 65 VCCA VCCA

16 I/O I/O 66 I/O I/O

17 I/O I/O 67 I/O I/O

18 I/O I/O 68 I/O I/O

19 I/O I/O 69 I/O I/O

20 GND GND 70 GND GND

21 I/O I/O 71 I/O I/O

22 I/O I/O 72 I/O I/O

23 I/O I/O 73 I/O I/O

24 I/O I/O 74 I/O I/O

25 I/O I/O 75 I/O I/O

26 I/O I/O 76 I/O I/O

27 I/O I/O 77 SDI, I/O SDI, I/O

28 I/O I/O 78 I/O I/O

29 I/O I/O 79 I/O I/O

30 I/O I/O 80 I/O I/O

31 I/O I/O 81 I/O I/O

32 GND GND 82 GND GND

33 I/O I/O 83 I/O I/O

34 I/O I/O 84 I/O I/O

35 I/O I/O 85 PRA, I/O PRA, I/O

36 I/O I/O 86 I/O I/O

37 I/O I/O 87 CLKA, I/O CLKA, I/O

38 VCCA VCCA 88 VCCA VCCA

39 I/O I/O 89 I/O I/O

40 I/O I/O 90 CLKB, I/O CLKB, I/O

41 I/O I/O 91 I/O I/O

42 I/O I/O 92 PRB, I/O PRB, I/O

43 I/O I/O 93 I/O I/O

44 GND GND 94 GND GND

45 I/O I/O 95 I/O I/O

46 I/O I/O 96 I/O I/O

47 I/O I/O 97 I/O I/O

48 I/O I/O 98 I/O I/O

49 I/O I/O 99 I/O I/O

50 SDO, I/O SDO, I/O 100 DCLK, I/O DCLK, I/O

40MX and 42MX FPGA Families

102 v5.0

Package Pin Assignments (continued)

176-Pin TQFP Package (Top View)

176-Pin

TQFP

176

v5.0 103

40MX and 42MX FPGA Families

176-Pin TQFP

Number A42MX09

Function A42MX16

Function A42MX24

Function Pin

Number A42MX09

Function A42MX16

Function A42MX24

Function

1 GND GND GND 45 GND GND GND

2 MODE MODE MODE 46 I/O I/O TMS, I/O

3 I/O I/O I/O 47 I/O I/O TDI, I/O

4 I/O I/O I/O 48 I/O I/O I/O

5 I/O I/O I/O 49 I/O I/O I/O (WD)

6 I/O I/O I/O 50 I/O I/O I/O (WD)

7 I/O I/O I/O 51 I/O I/O I/O

8 NC NC I/O 52 NC VCCI VCCI

9 I/O I/O I/O 53 I/O I/O I/O

10 NC I/O I/O 54 NC I/O I/O

11 NC I/O I/O 55 NC I/O I/O (WD)

12 I/O I/O I/O 56 I/O I/O I/O (WD)

13 NC VCCA VCCA 57 NC NC I/O

14 I/O I/O I/O 58 I/O I/O I/O

15 I/O I/O I/O 59 I/O I/O I/O (WD)

16 I/O I/O I/O 60 I/O I/O I/O (WD)

17 I/O I/O I/O 61 NC I/O I/O

18 GND GND GND 62 I/O I/O I/O

19 NC I/O I/O 63 I/O I/O I/O

20 NC I/O I/O 64 NC I/O I/O

21 I/O I/O I/O 65 I/O I/O I/O

22 NC I/O I/O 66 NC I/O I/O

23 GND GND GND 67 GND GND GND

24 NC VCCI VCCI 68 VCCA VCCA VCCA

25 VCCA VCCA VCCA 69 I/O I/O I/O (WD)

26 NC I/O I/O 70 I/O I/O I/O (WD)

27 NC I/O I/O 71 I/O I/O I/O

28 VCCI VCCA VCCA 72 I/O I/O I/O

29 NC I/O I/O 73 I/O I/O I/O

30 I/O I/O I/O 74 NC I/O I/O

31 I/O I/O I/O 75 I/O I/O I/O

32 I/O I/O I/O 76 I/O I/O I/O

33 NC NC I/O 77 NC NC I/O (WD)

34 I/O I/O I/O 78 NC I/O I/O (WD)

35 I/O I/O I/O 79 I/O I/O I/O

36 I/O I/O I/O 80 NC I/O I/O

37 NC I/O I/O 81 I/O I/O I/O

38 NC NC I/O 82 NC VCCI VCCI

39 I/O I/O I/O 83 I/O I/O I/O

40 I/O I/O I/O 84 I/O I/O I/O (WD)

41 I/O I/O I/O 85 I/O I/O I/O (WD)

42 I/O I/O I/O 86 NC I/O I/O

43 I/O I/O I/O 87 SDO, I/O SDO, I/O SDO, TDO, I/O

44 I/O I/O I/O 88 I/O I/O I/O

40MX and 42MX FPGA Families

104 v5.0

89 GND GND GND 133 GND GND GND

90 I/O I/O I/O 134 I/O I/O I/O

91 I/O I/O I/O 135 SDI, I/O SDI, I/O SDI, I/O

92 I/O I/O I/O 136 NC I/O I/O

93 I/O I/O I/O 137 I/O I/O I/O (WD)

94 I/O I/O I/O 138 I/O I/O I/O (WD)

95 I/O I/O I/O 139 I/O I/O I/O

96 NC I/O I/O 140 NC VCCI VCCI

97 NC I/O I/O 141 I/O I/O I/O

98 I/O I/O I/O 142 I/O I/O I/O

99 I/O I/O I/O 143 NC I/O I/O

100 I/O I/O I/O 144 NC I/O I/O (WD)

101 NC NC I/O 145 NC NC I/O (WD)

102 I/O I/O I/O 146 I/O I/O I/O

103 NC I/O I/O 147 NC I/O I/O

104 I/O I/O I/O 148 I/O I/O I/O

105 I/O I/O I/O 149 I/O I/O I/O

106 GND GND GND 150 I/O I/O I/O (WD)

107 NC I/O I/O 151 NC I/O I/O (WD)

108 NC I/O TCK, I/O 152 PRA, I/O PRA, I/O PRA, I/O

109 GND (LP) GND (LP) GND (LP) 153 I/O I/O I/O

110 VCCA VCCA VCCA 154 CLKA, I/O CLKA, I/O CLKA, I/O

111 GND GND GND 155 VCCA VCCA VCCA

112 VCCI VCCI VCCI 156 GND GND GND

113 VCCA VCCA VCCA 157 I/O I/O I/O

114 NC I/O I/O 158 CLKB, I/O CLKB, I/O CLKB, I/O

115 NC I/O I/O 159 I/O I/O I/O

116 NC VCCA VCCA 160 PRB, I/O PRB, I/O PRB, I/O

117 I/O I/O I/O 161 NC I/O I/O (WD)

118 I/O I/O I/O 162 I/O I/O I/O (WD)

119 I/O I/O I/O 163 I/O I/O I/O

120 I/O I/O I/O 164 I/O I/O I/O

121 NC NC I/O 165 NC NC I/O (WD)

122 I/O I/O I/O 166 NC I/O I/O (WD)

123 I/O I/O I/O 167 I/O I/O I/O

124 NC I/O I/O 168 NC I/O I/O

125 NC I/O I/O 169 I/O I/O I/O

126 NC NC I/O 170 NC VCCI VCCI

127 I/O I/O I/O 171 I/O I/O I/O (WD)

128 I/O I/O I/O 172 I/O I/O I/O (WD)

129 I/O I/O I/O 173 NC I/O I/O

130 I/O I/O I/O 174 I/O I/O I/O

131 I/O I/O I/O 175 DCLK, I/O DCLK, I/O DCLK, I/O

132 I/O I/O I/O 176 I/O I/O I/O

176-Pin TQFP (Continued)

Number A42MX09

Function A42MX16

Function A42MX24

Function Pin

Number A42MX09

Function A42MX16

Function A42MX24

Function

v5.0 105

40MX and 42MX FPGA Families

Package Pin Assignments

208-Pin CQFP (Top View)

A42MX36

208-Pin

CQFP

Pin #1

Index

208 207 206 205 204 203 202 201 200 164 163 162 161 160 159 158 157

53 54 55 56 57 58 59 60 61 97 98 99 100 101 102 103 104

105

106

107

108

109

110

111

112

113

149

150

151

152

153

154

155

156

40MX and 42MX FPGA Families

106 v5.0

208-Pin CQFP

Pin Number A42MX36

Function Pin Number A42MX36

Function

1GND 40I/O 79V

CCA 118 I/O

CCA 41 I/O 80 VCCI 119 I/O

3 MODE 42 I/O 81 I/O 120 I/O

4 I/O 43 I/O 82 I/O 121 I/O

5 I/O 44 I/O 83 I/O 122 I/O

6 I/O 45 I/O 84 I/O 123 I/O

7 I/O 46 I/O 85 I/O (WD) 124 I/O

8 I/O 47 I/O 86 I/O (WD) 125 I/O

9 I/O 48 I/O 87 I/O 126 GND

10 I/O 49 I/O 88 I/O 127 I/O

11 I/O 50 I/O 89 I/O 128 TCK, I/O

12 I/O 51 I/O 90 I/O 129 GND (LP)

13 I/O 52 GND 91 QCLKB, I/O 13 0 VCCA

14 I/O 53 GND 92 I/O 131 GND

15 I/O 54 TMS, I/O 93 I/O (WD) 132 VCCI

16 I/O 55 TDI, I/O 94 I/O (WD) 133 VCCA

17 VCCA 56 I/O 95 I/O 134 I/O

18 I/O 57 I/O (WD) 96 I/O 135 I/O

19 I/O 58 I/O (WD) 97 I/O 136 VCCA

20 I/O 59 I/O 98 VCCI 137 I/O

21 I/O 60 VCCI 99 I/O 138 I/O

22 GND 61 I/O 100 I/O (WD) 139 I/O

23 I/O 62 I/O 101 I/O (WD) 140 I/O

24 I/O 63 I/O 102 I/O 141 I/O

25 I/O 64 I/O 103 TDO, I/O 142 I/O

26 I/O 65 QCLKA, I/O 104 I/O 143 I/O

27 GND 66 I/O (WD) 105 GND 144 I/O

28 VCCI 67 I/O (WD) 106 VCCA 145 I/O

29 VCCA 68 I/O 107 I/O 146 I/O

30 I/O 69 I/O 108 I/O 147 I/O

31 I/O 70 I/O (WD) 109 I/O 148 I/O

32 VCCA 71 I/O (WD) 110 I/O 149 I/O

33 I/O 72 I/O 111 I/O 150 GND

34 I/O 73 I/O 112 I/O 151 I/O

35 I/O 74 I/O 113 I/O 152 I/O

36 I/O 75 I/O 114 I/O 153 I/O

37 I/O 76 I/O 115 I/O 154 I/O

38 I/O 77 I/O 116 I/O 155 I/O

39 I/O 78 GND 117 I/O 156 I/O

v5.0 107

40MX and 42MX FPGA Families

157 GND 170 I/O 183 VCCA 196 QCLKC, I/O

158 I/O 171 Q CLKD, I/O 184 GND 197 I/O

159 SDI, I/O 172 I/O 185 I/O 198 I/O

160 I/O 173 I/O 186 CLKB, I/O 199 I/O

161 I/O (WD) 174 I/O 187 I/O 200 I/O

162 I/O (WD) 175 I/O 188 PRB, I/O 201 I/O

163 I/O 176 I/O (WD) 189 I/O 202 VCCI

164 VCCI 177 I/O (WD) 190 I/O (WD) 203 I/O (WD)

165 I/O 178 PRA, I/O 191 I/O (WD) 204 I/O (WD)

166 I/O 179 I/O 192 I/O 205 I/O

167 I/O 180 CLKA, I/O 193 I/O 206 I/O

168 I/O (WD) 181 I/O 194 I/O (WD) 207 DCLK, I/O

169 I/O (WD) 182 VCCI 195 I/O (WD) 208 I/O

208-Pin CQFP (Continued)

Pin Number A42MX36

Function Pin Number A42MX36

Function

40MX and 42MX FPGA Families

108 v5.0

Package Pin Assignments (continued)

256-Pin CQFP (Top View)

A42MX36

256-Pin

CQFP

Pin #1

Index

256 255 254 253 252 251 250 249 248 200 199 198 197 196 195 194 193

65 66 67 68 69 70 71 72 73 121 122 123 124 125 126 127 128

129

130

131

132

133

134

135

136

137

185

186

187

188

189

190

191

192

v5.0 109

40MX and 42MX FPGA Families

256-Pin CQFP

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function

1 NC 44 I/O 87 I/O, (WD) 130 NC

2 GND 45 I/O 88 I/O, (WD) 131 GND

3 I/O 46 I/O 89 I/O 132 I/O

4 I/O 47 I/O 90 I/O 133 I/O

5 I/O 48 GND 91 I/O 134 I/O

6 I/O 49 I/O 92 I/O 135 I/O

7 I/O 50 I/O 93 I/O 136 I/O

8 I/O 51 I/O 94 I/O 137 I/O

9 I/O 52 I/O 95 VCCI 138 I/O

10 GND 53 I/O 96 VCCA 139 GND

11 I/O 54 I/O 97 GND 140 I/O

12 I/O 55 I/O 98 GND 141 I/O

13 I/O 56 I/O 99 I/O 142 I/O

14 I/O 57 I/O 100 I/O 143 I/O

15 I/O 58 I/O 101 I/O 144 I/O

16 I/O 59 I/O 102 I/O 145 I/O

17 I/O 60 VCCA 103 I/O 146 I/O

18 I/O 61 GND 104 I/O 147 I/O

19 I/O 62 GND 105 I/O, (WD) 148 I/O

20 I/O 63 NC 106 I/O, (WD) 149 I/O

21 I/O 64 NC 107 I/O 150 I/O

22 I/O 65 NC 108 I/O 151 I/O

23 I/O 66 I/O 109 I/O, (WD) 152 I/O

24 I/O 67 SDO, TDO, I/O 110 I/O, (WD) 153 I/O

25 I/O 68 I/O 111 I/O 154 I/O

26 VCCA 69 I/O (WD) 112 QCLKA, I/O 155 VCCA

27 I/O 70 I/O (WD) 113 I/O 156 I/O

28 I/O 71 I/O 114 GND 157 I/O

29 VCCA 72 VCCI 115 I/O 158 VCCA

30 VCCI 73 I/O 116 I/O 159 VCCI

31 GND 74 I/O 117 I/O 160 GND

32 VCCA 75 I/O 118 I/O 161 I/O

33 GND 76 I/O (WD) 119 VCCI 162 I/O

34 TCK, I/O 77 GND 1 20 I/O 163 I/O

35 I/O 78 I/O, (WD) 121 I/O, (WD) 164 I/O

36 GND 79 I/O 122 I/O, (WD) 165 GND

37 I/O 80 QCLKB, I/O 123 I/O 166 I/O

38 I/O 81 I/O 124 I/O 167 I/O

39 I/O 82 I/O 125 I/O 168 I/O

40 I/O 83 I/O 126 I/O 169 I/O

41 I/O 84 I/O 127 GND 170 VCCA

42 I/O 85 I/O 128 NC 171 I/O

43 I/O 86 I/O 129 NC 172 I/O

40MX and 42MX FPGA Families

110 v5.0

173 I/O 194 I/O 215 I/O (WD) 236 I/O

174 I/O 195 DCLK, I/O 216 I/O (WD) 237 I/O

175 I/O 196 I/O 217 I/O 238 I/O

176 I/O 197 I/O 218 PRB, I/O 239 I/O

177 I/O 198 I/O 219 I/O 240 QCLKD, I/O

178 I/O 199 I/O (WD) 220 CLKB, I/O 241 I/O

179 I/O 200 I/O (WD) 221 I/O 242 I/O (WD)

180 GND 201 VCCI 222 GND 243 GND

181 I/O 202 I/O 223 GND 244 I/O (WD)

182 I/O 203 I/O 224 VCCA 245 I/O

183 I/O 204 I/O 225 VCCI 246 I/O

184 I/O 205 I/O 226 I/O 247 I/O

185 I/O 206 GND 227 CLK A, I/O 248 VCCI

186 I/O 207 I/O 228 I/O 249 I/O

187 I/O 208 I/O 229 PRA, I/O 250 I/O (WD)

188 MODE 209 QCLKC, I/O 230 I/O 251 I/O (WD)

189 VCCA 210 I/O 231 I/O 252 I/O

190 GND 211 I/O (WD) 232 I/O (WD) 253 SDI, I/O

191 NC 212 I/O (WD) 233 I/O (WD) 254 I/O

192 NC 213 I/O 234 I/O 255 GND

193 NC 214 I/O 235 I/O 256 NC

256-Pin CQFP (Continued)

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function Pin

Number A42MX36

Function

v5.0 111

40MX and 42MX FPGA Families

Package Pin Assignments (continued)

272-Pin BGA Package (Top View)

272-Pin PBGA

2019181716151413121110987654321

40MX and 42MX FPGA Families

112 v5.0

272-Pin PBGA

Ball A42MX36

Function Ball A42MX36

Function

A1 GND C4 I/O E19 I/O K10 GND

A2 GND C5 I/O (WD) E20 I/O K11 GND

A3 I/O C6 I/O F1 I/O K12 GND

A4 I/O (WD) C7 QCLKC, I/O F2 I/O K17 I/O

A5 I/O C8 I/O F3 I/O K18 VCCA

A6 I/O C9 I/O F4 VCCI K19 VCCA

A7 I/O (WD) C10 CLKB F17 I/O K20 GND (LP)

A8 I/O (WD) C11 PRA, I/O F18 I/O L1 I/O

A9 I/O C12 I/O (WD) F19 I/O L2 I/O

A10 I/O C13 I/O F20 I/O L3 VCCA

A11 CLKA C14 QCLKD, I/O G1 I/O L4 VCCA

A12 I/O C15 I/O G2 I/O L9 GND

A13 I/O C16 I/O (WD) G3 I/O L10 GND

A14 I/O C17 SDI, I/O G4 VCCI L11 GND

A15 I/O C18 I/O G17 VCCI L12 GND

A16 I/O (WD) C19 I/O G18 I/O L17 VCCI

A17 I/O C20 I/O G19 I/O L18 I/O

A18 I/O D1 I/O G20 I/O L19 I/O

A19 GND D2 I/O H1 I/O L20 TCK, I/O

A20 GND D3 I/O H2 I/O M1 I/O

B1 GND D4 I/O H3 I/O M2 I/O

B2 GND D5 VCCI H4 VCCA M3 I/O

B3 DCLK, I/O D6 I/O H17 I/O M4 VCCI

B4 I/O D7 I/O H18 I/O M9 GND

B5 I/O D8 VCCA H19 I/O M10 GND

B6 I/O D9 I/O (WD) H20 I/O M11 GND

B7 I/O (WD) D10 VCCI J1 I/O M12 GND

B8 I/O D11 I/O J2 I/O M17 I/O

B9 PRB, I/O D12 VCCI J3 I/O M18 I/O

B10 I/O D13 I/O J4 VCCI M19 I/O

B11 I/O D14 VCCI J9 GND M20 I/O

B12 I/O (WD) D15 I/O J10 GND N1 I/O

B13 I/O D16 VCCA J11 GND N2 I/O

B14 I/O D17 GND J12 GND N3 I/O

B15 I/O (WD) D18 I/O J17 VCCA N4 VCCI

B16 I/O D19 I/O J18 I/O N17 VCCI

B17 I/O (WD) D20 I/O J19 I/O N18 I/O

B18 I/O E1 I/O J20 I/O N19 I/O

B19 GND E2 I/O K1 I/O N20 I/O

B20 GND E3 I/O K2 I/O P1 I/O

C1 I/O E4 VCCA K3 I/O P2 I/O

C2 MODE E17 VCCI K4 VCCI P3 I/O

C3 GND E18 I/O K9 GND P4 VCCA

v5.0 113

40MX and 42MX FPGA Families

P17 I/O U6 I/O (WD) V11 I/O W16 I/O (WD)

P18 I/O U7 I/O V12 I/O W17 I/O

P19 I/O U8 I/O V13 I/O (WD) W18 I/O (WD)

P20 I/O U9 I/O (WD) V14 I/O W19 GND

R1 I/O U10 VCCA V15 I/O (WD) W20 GND

R2 I/O U11 VCCI V16 I/O Y1 GND

R3 I/O U12 I/O V17 I/O Y2 GND

R4 VCCI U13 I/O V18 SDO, TDO, I/O Y3 I/O

R17 VCCI U14 QCLKB, I/O V19 I/O Y4 TDI, I/O

R18 I/O U15 I/O V20 I/O Y5 I/O (WD)

R19 I/O U16 VCCI W1 GND Y6 I/O

R20 I/O U17 I/O W2 GND Y7 QCLKA, I/O

T1 I/O U18 GND W3 I/O Y8 I/O

T2 I/O U19 I/O W4 TMS, I/O Y9 I/O

T3 I/O U20 I/O W5 I/O Y10 I/O

T4 I/O V1 I/O W6 I/O Y11 I/O

T17 VCCA V2 I/O W7 I/O Y12 I/O

T18 I/O V3 GND W8 I/O (WD) Y13 I/O

T19 I/O V4 GND W9 I/O (WD) Y14 I/O

T20 I/O V5 I/O W10 I/O Y15 I/O

U1 I/O V6 I/O W11 I/O Y16 I/O

U2 I/O V7 I/O W12 I/O Y17 I/O

U3 I/O V8 I/O (WD) W13 I/O (WD) Y18 I/O (WD)

U4 I/O V9 I/O W14 I/O Y19 GND

U5 VCCI V10 I/O W15 I/O Y20 GND

272-Pin PBGA (Continued)

Ball A42MX36

Function Ball A42MX36

Function

40MX and 42MX FPGA Families

114 v5.0

List of Changes

The following table lists critical changes that were made in the current version of the document.

Data Sheet Categories

In order to provide the latest information to designers, some data sheets are published before data has been fully

characterized. These data sheets are marked as “Advanced” or Preliminary” data sheets. The definition of these categories

are as follows:

Advanced

The data sheet contains initial estimated information based on simulation, other products, devices, or speed grades. This

information can be used as estimates, but not for production.

Preliminary

The data sheet contains information based on simulation and/or initial characterization. The information is believed to be

correct, but changes are possible.

Unmarked (production)

The data sheet contains information that is considered to be final.

Previous version Changes in current version (v6.0) Page

v4.0 Because the changes in this data sheet are extensive and technical in nature, this should

be viewed as a new document. Please read it as you would a data sheet that is published

for the first time.

ALL

Note that the “Package Characteristics and Mechanical Drawings” section has been

elimin ated from the d at a she et. T he m echan ical dr awings ar e no w cont aine d i n a sep ara te

document, “Package Characteristics and Mechanical Drawings,” available on the Actel

web site.

v5.0 115

40MX and 42MX FPGA Families

Actel and the Actel logo ar e regi stered trademarks of Actel Corpora ti on.

All other trademarks are the property of their owners.

http://www.actel.com

Actel Europe Ltd.

Daneshill House, Lutyens Close

Basingstoke, Hampshire RG24 8AG

United Kingdom

Tel: +44 (0)1256 30560 0

Fax: +44 (0)1256 355420

Actel Corporation

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Sunnyvale , California 9 4086

USA

Tel: (408) 739-1010

Fax: (408) 739-1540

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Tel: +81 03-3445-7671

Fax: +81 03-3445-7668

5172136-6/2.01