Hardware User Manual
CM-BF537 V3.x
CM-BF537_HUM_V3.2.docx 1
Contact
Bluetechnix Mechatronische Systeme GmbH
Waidhausenstraße 3/19
A-1140 Vienna
AUSTRIA/EUROPE
office@bluetechnix.at
http://www.bluetechnix.com
Document No.: 100-1221-3.9
Date: 2012-05-24
CM-BF537_HUM_V3.2.docx 2
Table of Contents
Blackfin® Core Modules ............................................................................................................................................................................ 5
Blackfin® Development Boards ............................................................................................................................................................. 7
1 Introduction ....................................................................................................................................................................................... 8
1.1 Overview .................................................................................................................................................................................... 8
1.2 Key Features ............................................................................................................................................................................. 9
1.3 Applications .............................................................................................................................................................................. 9
2 General Description ...................................................................................................................................................................... 10
2.1 Functional Description ....................................................................................................................................................... 10
2.2 Boot Mode ............................................................................................................................................................................... 10
2.3 Memory Map .......................................................................................................................................................................... 11
2.3.1 Core Module Memory ............................................................................................................................................... 11
2.3.2 Externally Addressable Memory (on connector) ............................................................................................ 12
3 Specifications ................................................................................................................................................................................... 13
3.1 Electrical Specifications ...................................................................................................................................................... 13
3.1.1 Operating Conditions ............................................................................................................................................... 13
3.1.2 Maximum Ratings....................................................................................................................................................... 13
3.1.3 ESD Sensitivity ............................................................................................................................................................. 14
4 Connector Description ................................................................................................................................................................. 15
4.1 Connector X1 ......................................................................................................................................................................... 15
4.2 Connector X2 ......................................................................................................................................................................... 16
5 Application Information .............................................................................................................................................................. 18
5.1 Supply Voltage Decoupling ............................................................................................................................................. 18
5.2 Reset circuit ............................................................................................................................................................................ 18
5.3 Application Example Schematics ................................................................................................................................... 19
5.3.1 RJ45 schematic ............................................................................................................................................................ 19
5.4 Sample Schematic ................................................................................................................................................................ 19
5.5 Stand-alone Ethernet based MPEG webcam ............................................................................................................. 20
6 Mechanical Outline ....................................................................................................................................................................... 22
6.1 Top View .................................................................................................................................................................................. 22
6.2 Bottom View ........................................................................................................................................................................... 22
6.3 Side View ................................................................................................................................................................................. 23
6.4 Footprint .................................................................................................................................................................................. 24
6.5 Connectors .............................................................................................................................................................................. 24
7 Support .............................................................................................................................................................................................. 25
7.1 General Support .................................................................................................................................................................... 25
CM-BF537_HUM_V3.2.docx 3
7.2 Board Support Packages ................................................................................................................................................... 25
7.3 Blackfin® Software Support .............................................................................................................................................. 25
7.3.1 BLACKSheep® OS ........................................................................................................................................................ 25
7.3.2 LabVIEW ......................................................................................................................................................................... 25
7.3.3 uClinux ............................................................................................................................................................................ 25
7.4 Blackfin® Design Services ................................................................................................................................................... 25
7.4.1 Upcoming Products and Software Releases .................................................................................................... 25
8 Ordering Information ................................................................................................................................................................... 26
8.1 Predefined mounting options for CM-BF537 ............................................................................................................ 26
9 Dependability .................................................................................................................................................................................. 27
9.1 MTBF .......................................................................................................................................................................................... 27
10 Product History .......................................................................................................................................................................... 28
10.1 Version Information ............................................................................................................................................................. 28
10.1.1 CM-BF537-C-C-Q25S32F4 (CM-BF537E) ............................................................................................................ 28
10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) ........................................................................................................... 28
10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) ................................................................................................ 28
10.2 Anomalies ................................................................................................................................................................................ 29
11 Document Revision History ................................................................................................................................................... 30
12 List of Abbreviations ................................................................................................................................................................ 31
A List of Figures and Tables ............................................................................................................................................................ 32
CM-BF537_HUM_V3.2.docx 4
© Bluetechnix Mechatronische Systeme GmbH 2012
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or fitness for a
particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this board is
responsible by himself for the functionality of his application. He is allowed to use the board only if he has the
qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact Bluetechnix
(http://www.bluetechnix.com).
Warning
Due to technical requirements components may contain dangerous substances.
CM-BF537_HUM_V3.2.docx 5
Blackfin® Core M odul es
TCM-BF518-C-C-Q25S32F2 (TCM-BF518)
The Tiny Core Module TCM-BF518 is powered by Analog Devices' single core ADSP-BF518 processor; up to
400MHz, 32MB SDRAM, up to 8MB flash. The 2x60 pin expansion connectors are backwards compatible with
other Core Modules.
ACM-BF525C-C-C-Q25S64F4N1024
The Core Module ACM-BF525C is optimized for audio applications and performance. It is based on the high
performance ADSPBF525Cfrom Analog Devices. It addresses 64MByte SDRAM via its 16bit wide SDRAM bus, has
an onboard NOR-flash of 4MByte and a NAND-flash with 1024MByte.
CM-BF527-C-C-Q50S32F8 (CM-BF527)
The Core Module CM-BF527 is powered by Analog Devices' single core ADSP-BF527 processor; key features are
USB OTG 2.0 and Ethernet. The 2x60 pin expansion connectors are backwards compatible with other Core
Modules.
CM-BF533-C-C-Q25S32F2 (CM-BF533)
The Core Module CM-BF533 is powered by Analog Devices' single core ADSP-BF533 processor; up to 600MHz,
32MB SDRAM, 2MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
TCM-BF537-C-I-Q25S32F8 (TCM-BF537)
The Tiny Core Module TCM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to
500MHz, 32MB SDRAM, 8MB flash, a size of 28x28mm, 2x60 pin expansion connectors, Ball Grid Array or Border
Pads for reflow soldering, industrial temperature range -40°C to +85°C.
CM-BF537-C-C-Q25S32F4 (CM-BF537E)
The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz,
32MB SDRAM, 4MB flash, integrated TP10/100 Ethernet physical transceiver, 2x60 pin expansion connectors at a
size of 36.5x31.5mm.
CM-BF537-C-C-Q30S32F4-U (CM-BF537U)
The Core Module CM-BF537 is powered by Analog Devices' single core ADSP-BF537 processor; up to 600MHz,
32MB SDRAM, 4MB flash, integrated USB 2.0 Device, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
CM-BF548-C-C-Q25S64F8 (CM-BF548)
The Core Module CM-BF548 is characterized by its numerous peripheral interfaces, its performance in
combination with its high speed memory interface (DDR). Key features are 533MHz, 64MB DDR SD-RAM
(266MHz), and 8MB flash.
CM-BF561-C-C-Q25S64F8 (CM-BF561)
The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz,
64MB SDRAM, 8MB flash, 2x60 pin expansion connectors at a size of 36.5x31.5mm.
eCM-BF561-C-C-Q25S128F32 (eCM-BF561)
The Core Module CM-BF561 is powered by Analog Devices' dual core ADSP-BF561 processor; up to 2x 600MHz,
128MB SDRAM, 8MB flash, 2x100 pin expansion connectors and a size of 44x33mm.
CM-BF537_HUM_V3.2.docx 6
Core Module naming information
The idea is to put more Core Module specific technical information into the product name. New Core Module names
will have following technical information covered in their names.
• Product Family,
• CPU-Type,
• Connection-Type,
• Operating Temperature Range,
• Crystal Frequency [MHz],
• RAM [MB],
• Flash [MB],
• External Controllers
• o Special and/or
o Former name
That expands of course the name but allows the customer to get the most important Core Module specific
information at the first sight. Have a look at the example below to get an idea of the new Core Module names.
Example CM-BF537-C-C-Q25S32F4 (CM-BF537E)
- - - - - -
Product Family Former name
CM = Core Modul e Special
SBC = Single Board Computer Custom Core Modules or specials
CPU-Type uC = uclinux
Equals the name of CPU Extra controllers mounted
Connection-Type E = Ethernet
A = BGA U = USB
B = Border pa d Flash [MB]
C = Connector F = NOR Flash [MB]
S = S
Spec i al N = NAND Fl a s h [MB]
Operating Temperature Range RAM
A = Automoti ve (-40° to +125°) S = SDRAM [MB]
C = Commerci al (0° to +70°)
I = Industry (-40° to +85°)
Crystal Frequency
Notati on: QXX[MHz]
F4
(CM-BF537E)
S32
CM
BF537
C
C
CM-BF537_HUM_V3.2.docx 7
Blackfin® Development Boards
ADEV-BF52xC
Feature rich, low cost embedded audio development platform which supports Audio Core Modules (ACM). The
form factor of the ADEV-BF52xC allows easy integration of the board into OEM products. Dedicated interfaces such
as USB2.0, Line In/Out, headphone out and an onboard silicon microphone turn the ADEV-BF52xC into a full-
featured development platform for most embedded audio applications in commercial areas.
DEV-BF5xxDA-Lite
Get ready to program and debug Bluetechnix Core Modules with this tiny development platform including an USB-
Based Debug Agent. The DEV-BF5xxDA-Lite is a low cost starter development system including a VDSP++
Evaluation Software License.
DEV-BF548-Lite
Low-cost development board with a socket for Bluetechnix’ CM-BF548 Core Module. Additional interfaces are
available, e.g. an SD-Card, USB and Ethernet.
DEV-BF548DA-Lite
Get ready to program and debug Bluetechnix CM-BF548 Core Module with this tiny development platform
including an USB-Based Debug Agent. The DEV-BF548DA-Lite is a low-cost starter development system including a
VDSP++ Evaluation Software License.
eDEV-BF5xx
Feature rich, low cost rapid development platform which provides all interfaces on dedicated connectors and has all
Core Module pins routed to solder pads which easily can be accessed by the developers. The eDEV-BF5xx supports
the latest debugging interface from Analog Devices - ADI-SADA (Analog Devices Stand Alone Debug Agent).
EVAL-BF5xx
Tiny, low cost embedded platform which supports Bluetechnix powerful Blackfin® based Core Modules. The form
factor (75x75mm) of the EVAL-BF5xx allows easy integration of the board into OEM products. Dedicated interfaces
such as USB2.0, SD-card slot, CAN interface connectors and of course Ethernet, turn the EVAL-BF5xx into a full-
featured evaluation platform for most embedded applications.
Extender boards
Extender boards (EXT-BF5xx) are expanding the development and evaluation boards by several interfaces and
functionalities. Targeted application areas are: audio/video processing, security and surveillance, Ethernet access,
positioning, automation and control, experimental development and measuring.
Note! Bluetechnix is offering tailored board developments as well.
CM-BF537_HUM_V3.2.docx 8
1 Introduction
The Core-Module CM-BF537 is characterized by its field of application, performance and configuration possibility.
The module integrates processor, RAM, flash, external peripheral controllers and power supply at a size of
31.5x36.5mm! It is based at the high performance ADSP-BF537 from Analog Devices. The Core-Module is designed
for commercial and industrial usage (depending on temperature range). It addresses up to 64MByte SDRAM via its
16bit wide SDRAM bus, has an onboard NOR-flash of 4MByte and offers a CAN interface. In addition there is an extra
Ethernet physical transceiver (10/100Mbit) onboard.
1.1 Overview
The current hardware version (see Version Information) of Core Module CM-BF537-C-C-Q25S32F4 (CM-BF537E)
consists of the following components. Parts of mounting options of CM-BF537 are listed in addition.
Up to
64MByte
SDRam
60 Pin Expansion Connector A
Up to
8MByte
Flash
ADSP
BF537
up to
600 MHz
Dynamic
Core Voltage
Control
60 Pin Expansion Connector B
Low Voltage
Reset Ethernet
Physical
Figure 1-1: Main components of the CM-BF537 Core Module
• Analog Devices Blackfin Processor BF537
o Industrial version 8.1 (see chapter )
 ADSP-BF537SBBCZ-5A (-40° - 85°C)
o Commercial version 8.1 (see chapter )
 ADSP-BF537SKBCZ-6AV (0° - 70°C)
• SDRAM
o 32MByte SDRAM 8.1 Version (see chapter )
 SDRAM Clock up to 133MHz
 MT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V)
o 64MByte SDRAM 8.1 Version(see chapter )
 SDRAM Clock up to 143MHz
 IS42S16320B-7BL (8M x16x4, 512Mbit at 3.3 V)
• 4 MByte of Addressable Flash
o PF48F2000P0ZBQ0 (4Mx16 32Mbit at 3.3 V; default only 4MByte addressable)
CM-BF537_HUM_V3.2.docx 9
o Additional flash memory can be connected through the expansion board as parallel flash using
asynchronous chip select lines or as an SPI flash.
• Ethernet Physical Transceiver
o Micrel KSZ8041NLI
• Low Voltage Reset Circuit
o Resets module if power supply goes below 2.93 V for at least 140 ms
• Dynamic Core Voltage Control
o Core voltage is adjustable by setting software registers on the Blackfin processor
o Core voltage range: 0.8 – 1.32V
• Expansion Connector A
o Data Bus
o Address Bus
o Control Signals
o Power Supply
o Ethernet Pins
• Expansion Connector B
o SPORT0
o JTAG
o UART0/UART1
o CAN
o TWI (I²C compatible)
o SPI
o PPI (Parallel Port Interface)
o GPIO’s
1.2 Key Features
• The CM-BF537 is very compact and measures only 36.5x31.5mm
• Allows quick prototyping of product that comes very close to the final design
• Reduces development costs, faster time to market
• Very cost effective for small and medium volumes
1.3 Applications
• Robotics
• Video security
• Video surveillance
• Industrial distributed control
• Industrial factory automation
• Remote monitoring devices
• Point-of-sale terminals
• VoIP
• Biometrics/security
• Instrumentation
• Medical appliances
• Consumer appliances
CM-BF537_HUM_V3.2.docx 10
2 General Description
2.1 Functional Description
Up to
64MByte
SDRam
4MByte
Flash
ADSP
BF537
up to
600MHz
Dynamic
Core Voltage
Control
Low Voltage
Reset
20 Bit Address Bus
16 Bit Data Bus
Ethernet
Physical
Clock
Mem. Control, Boot Mode, JTAG, Ethernet
Data & Address Bus
Clock-out PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO
3V3 Power , Reset
Figure 2-1: Detailed block diagram
Figure 2-1 shows a detailed block diagram of the CM-BF537. Other than the SDRAM control pins the CM-BF537 has
all other pins of the Blackfin processor on its two main 60 pin connectors.
A special feature of the Core Module CM-BF537 is the on-board physical Ethernet transceiver from Micrel
(KSZ8041NLI).
Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and the
clock frequency dynamically in accordance to the required processing power. A low voltage reset circuit guarantees
a power on reset and resets the system when the input voltage drops below 2.93V.
2.2 Boot Mode
By default the boot mode = 000 (BMODE2 = low, BMODE1 = low, BMODE0 = low). All BMODE pins have internal pull
down resistors.
Connect BMODE0 to Vcc and leave BMODE1, BMODE2 pins open for boot mode 001 equals to 8 or 16 bit
PROM/FLASH boot mode, this is the default boot mode of BLACKSheep® OS. See Blackfin Datasheets or
Eval/DevBoard manuals for more details.
CM-BF537_HUM_V3.2.docx 11
2.3 Memory Map
2.3.1 Core Module Memory
Memory Type Start Address End Address Size Comment
FLASH Bank0
(PF4 Flag low)
0x20000000 0x201FFFFF 2MB 1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
FLASH Bank1
(PF4 Flag high)
0x20000000 0x201FFFFF 2MB 1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
FLASH Bank2
(PF5 Flag low)*
0x20000000 0x201FFFFF 2MB 1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
FLASH Bank3
(PF5 Flag high)*
0x20000000 0x201FFFFF 2MB 1/8 of 16MB Micron Flash,
PF48F3000P0ZBQ
SD-RAM32 0x00000000 0x01FFFFFF 32MB 16Bit Bus, Micron
MT48LC16M16A2FG
SD-RAM64 0x00000000 0x1FFFFFFF 64MB 16Bit Bus, ISSI
IS42S16320B-7BL
Table 2-1: Memory map
The maximum amount of addressable memory by a single asynchronous memory bank is 2MByte. In order to be
able to use more than 2MByte on a single bank 2 GPIOs are used to select which 2MB section of flash is active in the
memory window of the Blackfin processor. This frees up the remaining banks for the user.
The maximum amount of memory addressable by the processor is 8MByte.
*) PF5 is routed by default to the connector of the Core Module. Nevertheless this pin can be used to select bank2/3
of the flash memory. To realize this, the 0Ω resistor R18 must be removed and a 0Ω resistor R19 must be soldered to
the Core Module. In this case PF5 is routed to the flash memory instead to the connector!
Figure 2-2: Assembly drawing top view
CM-BF537_HUM_V3.2.docx 12
2.3.2 Externally Addressable Memory (on connector)
The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
AMS Line Start Address End Address Max. Size
nAMS2 0x20200000 0x202FFFFF 1MB
nAMS3 0x20300000 0x203FFFFF 1MB
Table 2-2: Externally addressable memory
CM-BF537_HUM_V3.2.docx 13
3 Specifications
3.1 Electrical Specifications
3.1.1 Operating Conditions
Symbol Parameter Min Typical Max Unit
V
IN
Input supply voltage 3.0 3.3 3.6 V
I
3V3
3) 3.3V current - 350 - mA
VOH High level output voltage 2.8 - - V
V
OL
Low level output voltage - - 0.5 V
I
IH
IO input current - - 10 µA
I
OZ
Three state leakage current - - 10 µA
I
DEEPSLEEP
V
IN
current in deep sleep mode - 16 - mA
I
SLEEP
VIN current in sleep mode - 19.5 - mA
IIDLE
VIN current in idle mode
-
24
-
mA
I
TYP
V
IN
current in with core running at 400 MHz - 138 - mA
I
HIBERNATE
1) VIN current in hibernate state at 400 MHz - - 70 mA
I
RTC
V
RTC
current - 20 - µA
f
CCLK
2) Core clock frequency - - 600 MHz
Table 3-1: Electrical characteristics
1) VDDINT=1.10V @ TJ=25°C
2) Commercial grade
3) Average load @ 25°C ambient temperature
3.1.2 Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage
to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than
those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Symbol Parameter Min Max Unit
V
IO
Input or output voltage -0.5 3.6 V
V
IN
Input supply voltage 3.0 5.5 V
I
OH
/I
OL
Current per pin 0 10 mA
T
AMB
Ambient temperature -40 85 °C
T
STO
Storage temperature -55 150 °C
T
SLD
Solder temperature for 10 seconds 260 °C
φ
AMB
Relative ambient humidity 90 %
Table 3-2: Absolute maximum ratings
CM-BF537_HUM_V3.2.docx 14
3.1.3 ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge
without detection. Although this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions
should be taken to avoid performance degradation or loss of functionality.
CM-BF537_HUM_V3.2.docx 15
4 Connector Description
4.1 Connector X1
Pin No. Signal Name Type Function
1 RSCLK0 / TACLK2 I/O
2 DR0PRI / TACLK4 I
3 TSCLK0 / TACLK1 I/O
4 DT0PRI / SSEL2 O
5 CLKBUF O 25MHz buffered clock output
6 SDA I/O
7 PF4 / TMR5 / SSEL6: MO1*
NC: MO2, MO3*
I/O
8 PF5 / TMR4 / SSEL5: MO1, MO2*
NC: MO3*
I/O
9 Vin 3V3 PWR 3V3 +-10% 500mA peak for supply
10 Vin 3V3 PWR 3V3 +-10% 500mA peak for supply
11 PG0 / PPI1D0 I/O
12 PG2 / PPI1D2 I/O
13 PG4 / PPI1D4 I/O
14 PG6 / PPI1D6 I/O
15 PG8 / PPI1D8 / DR1SEC I/O
16 PG10 / PPI1D10 / RSCLK1 I/O
17 PG12 / PPI1D12 / DR1PRI I/O
18 PG14 / PPI1D14 / TFS1 I/O
19 PPI1SY3 / PF7 / TMR2 I/O
20 PPI1SY1 / PF9 / TMR0 I/O
21 PPI1SY1 / PF9 / TMR0 I/O
22 PF3 / Rx1 / TMR6 / TACI6 I/O
23 PF1 / DMAR1 / TACI1 / Rx0 I/O
24 PF11 / MOSI I/O
25 PF13 / SCK I/O
26 BMODE0 I - 10k pull down
27 GND PWR
28 TCK I - 10k pull up
29 TDI I - 10k pull up
30 TRST I - 4k7 pull down
31 EMU O
32 TMS I - 10k pull up
33 TDO O
34 BMODE2 I - 10k pull down
35 N.C. - NC
36 BMODE1 I - 10k pull down
37 PF12 / MISO I/O
38 PF0 / DMAR0 / Tx0 I/O
39 PF14 / SPI_SS I/O
40 PF2 / Tx1 / TMR7 I/O
41 PPI1Clk / PF15 / TMRCLK I/O
42 PPI1Sy2 / PF8 / TMR1 I/O
43 PG15 / PPI1D15 / DT1PRI I/O
44 PG13 / PPI1D13 / TSCLK1 I/O
45 PG11 / PPI1D11 / RFS1 I/O
CM-BF537_HUM_V3.2.docx 16
Pin No. Signal Name Type Function
46 PG9 / PPI1D9 / DT1SEC I/O
47 PG7 / PPI1D7 I/O
48 PG5 / PPI1D5 I/O
49 PG3 / PPI1D3 I/O
50 PG1 / PPI1D1 I/O
51 GND PWR
52 GND PWR
53
PF5 / TMR4 / SSEL5: MO1, MO2*
NC: MO3*
I/O
54 PF6 / TMR3 / SSEL4 I/O
55 PF10 / SSEL1 I/O
56 SCL I/O
57 DT0SEC / SSEL7 / CANTx O
58 TFS0 / SSEL3 I/O
59 DR0SEC / TACI0 / I
60 RFS0 / TACLK3 I/O
Table 4-1: Connector description X1
* For mount option details see chapter 8.1.
Note 1: Pin 8 and 53 as well as pin 20 and 21 are identical.
Note 2: Please mind the mounted pull up and pull down resistors on the Core Module.
4.2 Connector X2
Pin No. Signal Name Type Function
61 A1 O Address Bus
62 A3 O Address Bus
63 A5 O Address Bus
64 A7 O Address Bus
65 A9 O Address Bus
66 A11 O Address Bus
67 A13 O Address Bus
68 A15 O Address Bus
69 A17 O Address Bus
70 A19 O Address Bus
71 ABE1/SDQM1 O
72 LED_ACT O Indicates Ethernet activity
73 GND - AGND use as GND for Ethernet
74 RX+ I – 47R pull up to 3V3 Ethernet receive +
75 RX- I – 47R pull up to 3V3 Ethernet receive -
76 ADRY I - 10k pull up
77 BG O
78 CLK_OUT O CLKOUT Pin of Blackfin
79 GND PWR
80
AMS3
O
81 AWE O
82 NMI I - 10k pull up
83 D0 I/O Data Bus
84 D2 I/O Data Bus
85 D4 I/O Data Bus
CM-BF537_HUM_V3.2.docx 17
Pin No. Signal Name Type Function
86 D6 I/O Data Bus
87 D8 I/O Data Bus
88 D10 I/O Data Bus
89 D12 I/O Data Bus
90 D14 I/O Data Bus
91 D15 I/O Data Bus
92 D13 I/O Data Bus
93
D11
I/O
Data Bus
94 D9 I/O Data Bus
95 D7 I/O Data Bus
96 D5 I/O Data Bus
97 D3 I/O Data Bus
98 D1 I/O Data Bus
99 RESET I – see chapter 5.2
100 AOE O
101 ARE O
102 AMS2 O
103 VDD-RTC PWR
104 BGH O
105 BR I - 10k pull up
106 VA33 PWR
Ethernet transformer voltage
reference
107 TX- O - 47R pull up to 3V3 Ethernet transmit -
108 TX+ O - 47R pull up to 3V3 Ethernet transmit +
109 NC
110 LED_SPEED O Full duplex LED, High = Full duplex
active, Low = inactive
111 ABE0/SDQM0 O
112 A18 O Address Bus
113 A16 O Address Bus
114 A14 O Address Bus
115 A12 O Address Bus
116 A10 O Address Bus
117 A8 O Address Bus
118
A6
O
Address Bus
119 A4 O Address Bus
120 A2 O Address Bus
Table 4-2: Connector description X2
Note: Please mind the mounted pull up and pull down resistors on the Core Module.
CM-BF537_HUM_V3.2.docx 18
5 Application Information
5.1 Supply Voltage Decoupling
For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum
capacitor to the VIN voltage rail next to the module.
5.2 Reset circuit
The reset of the flash and the processor are connected to a power monitoring IC. The output can be used as power
on reset for external devices, see Figure 5-1.
Figure 5-1: Schematic of reset circuit on the Core Module
CM-BF537_HUM_V3.2.docx 19
5.3 Application Example Schematics
5.3.1 RJ45 schematic
Figure 5-2: Schematic for RJ45 Connection
Designator Value Type Description Quantity
X1 RJLBC-060TC1 RJ45 with transformer 1:1 1
C1 10uF Capacitor 1
R8, R9 220R Resistor 2
V1, V2 USBLC6-2P6 TSV-Diode 2
Table 5-1: Parts List RJ45
5.4 Sample Schematic
In this minimum configuration the CM-BF537 is used as a high performance network connected processor module.
CM-BF537_HUM_V3.2.docx 20
Figure 5-3: Configuration with Ethernet and JTAG Connector
Designator Value Type Description Quantity
C1, C2, C4 1uF Capacitor 3
C3, C5 10uF Capacitor 1
CM1 CM-BF537 1
X1 DC-8 Power connector DC-8 1
X2 RJLBC-060TC1 RJ45 with transformer 1
X3 Header, 7-Pin, dual row 1
R3 4k7 Resistor 1
R8, R9 220R Resistor 2
S1 Switch 1
U1 ADP3338 Low dropout regulator 1
Table 5-2: Bill of Material of sample circuit
5.5 Stand-alone Ethernet based MPEG webcam
The CM-BF537 module can be used as a stand-alone module for a camera system requiring only power supply and
the direct attachment of a compatible video camera. An extender board including a camera is available at
Bluetechnix (EXT-BF5xx-CAM).
CM-BF537_HUM_V3.2.docx 21
Figure 5-4: Stand-alone Ethernet based MPEG webcam
Designator Value Type Description Quantity
C3, C4, C5, C6, C8 1uF Capacitor 6
C7, C9 10uF Capacitor 1
Cam1 OV7660FSx Camera module 1
CM1 CM-BF537 1
DS1 green SMD LED 1
X1 DC-8 Power connector DC-8 1
X2 HFJ11-2250E RJ45 with transformer 1
R1,R3 10k Resistor 3
R7, R8, R9 220R Resistor 2
S1, S2 Switch 1
U1 ADP3338 Low dropout regulator 1
U2 XC6204B252MR XC6204 high speed LDO 1
U3 XC6204B182MR XC6204 high speed LDO 1
Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam
Have a look at our DEV-BF5xxDA-lite schematics, which can be found at
http://www.bluetechnix.com/goto/dev-bf5xxda-lite to get application examples.
CM-BF537_HUM_V3.2.docx 22
6 Mechanical Outline
6.1 Top View
Figure 6-1 shows the bottom view of the CM-BF537. All dimensions are given in millimeters.
Figure 6-1: Mechanical outline (top view)
6.2 Bottom View
Figure 6-2 shows the bottom view of the CM-BF537. All dimensions are given in millimeters.
CM-BF537_HUM_V3.2.docx 23
Figure 6-2: Mechanical outline and Bottom Connectors (Top View)
6.3 Side View
Figure 6-3 shows the side view of the CM-BF537. All dimensions are given in millimeters.
36.0
1.1
2.0
2.45
31.0
5.7 5.7
24.5
Figure 6-3: Side view with mounted connectors
The total minimum mounting height including receptacle at the motherboard is 6.1mm.
CM-BF537_HUM_V3.2.docx 24
6.4 Footprint
Figure 6-4: Recommended footprint for the Core Module (top view)
The footprint of the CM-BF537 is available on request. The used connectors can be found in Table 6-1. For detailed
dimensions of the connectors please see the datasheet from the manufacturer’s website.
6.5 Connectors
The Core Module features a Hirose 0.6mm pitch connectors. The base board has to use the complementary
connector.
Board Designator Manufacturer Manufacturer Part No.
Core Module X1, X2 Hirose FX8-60P-SV
Base board X1, X2 Hirose FX8-60S-SV
Table 6-1: Core Module connector types
Hole1
Hole2
Hole1
Hole2
h2
h1
CM-BF537_HUM_V3.2.docx 25
7 Support
7.1 General Support
General support for products can be found at Bluetechnix’ support site https://support.bluetechnix.at/wiki
7.2 Board Support Packages
Board support packages and software downloads are for registered customers
only https://support.bluetechnix.at/software/
7.3 Blackfin® Software Support
7.3.1 BLACKSheep® OS
BLACKSheep® OS stands for a powerfully and multithreaded real-time operating system (RTOS) originally designed
for digital signal processing application development on Analog Devices Blackfin® embedded processors. This high-
performance OS is based on the reliable and stable real-time VDK kernel from Analog Devices that comes with
VDSP++ IDE. Of course BLACKSheep® OS is fully supported by all Bluetechnix Core-Modules and development
hardware.
7.3.2 LabVIEW
You can get LabVIEW embedded support for Bluetechnix Core Modules by Schmid-Engineering
AG http://www.schmid-engineering.ch.
7.3.3 uClinux
You can get uClinux support (boot loader and uClinux) for Bluetechnix Core Modules at http://blackfin.uClinux.org.
7.4 Blackfin® Design Services
Based on more than seven years of experience with Blackfin, Bluetechnix offers development assistance as well as
custom design services and software development.
7.4.1 Upcoming Products and Software Releases
Keep up to date with all product changes, releases and software updates of Bluetechnix
at http://www.bluetechnix.com.
CM-BF537_HUM_V3.2.docx 26
8 Ordering Information
- - - - - -
Product Family Former name
CM = Core Modul e Special
SBC = Single Board Computer Custom Core Modules or specials
CPU-Type uC = uclinux
Equals the name of CPU Extra controllers mounted
Connection-Type E = Ethernet
A = BGA U = USB
B = Border pad Flash [MB]
C = Connector F = NOR Flash [MB]
S = Speci a l N = NAND Fl a s h [MB]
Operating Temperature Range RAM
A = Automoti ve S = SDRAM [MB]
C = Commerci a l
I = Industry
Crystal Frequency
Notati on: QXX[MHz]
CM
BF537
C
C/I
Q25
F4
(CM-BF537E)
S32/64
8.1 Predefined mounting options for CM-BF537
Article Number Name Temperature Range
100-1221-3 CM-BF537-C-C-Q25S32F4 (CM-BF537E) Commercial
100-1229-3 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) Industrial
100-1273-3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) Commercial
Table 8-1: Ordering information
NOTE: Custom Core Modules are available on request! Please contact Bluetechnix (office@bluetechnix.com) if
you are interested in custom Core Modules.
The mount options of the Core Module CM-BF537 are shown in Table 8-2.
Mount Option Flash Comment
MO1 2MB PF4 available on pin 7 on connector X1
MO2 4MB default
MO3 8MB PF5 not available on connector X1
Table 8-2: Mount options
CM-BF537_HUM_V3.2.docx 27
9 Dependability
9.1 MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last before
failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take all the
components into account. The PCB and solder connections are excluded from this estimation. For test conditions
we assume an ambient temperature of 30°C of all Core Module components except the Blackfin® processor (80°C)
and the memories (70°C). We use the MTBF Calculator from ALD (http://www.aldservice.com/) and use the reliability
prediction MIL-217F2 Part Stress standard.
This method resulted in a MTBF of 439232 hours for the CM-BF537E.
CM-BF537_HUM_V3.2.docx 28
10 Product History
10.1 Version Information
10.1.1 CM-BF537-C-C-Q25S32F4 (CM-BF537E)
Version Component Type
3.0.1 Processor
RAM
Flash
ETH-Physical
ADSP-BF537KBCZ-6AV (Rev 0.3)
MT48LC16M16A2BG-75IT:D
PF48F2000P0ZBQ0
KSZ8041
3.0.2 Processor
RAM
Flash
ETH-Physical
ADSP-BF537KBCZ-6AV (Rev 0.3)
IS42S16160D-7BL
PF48F2000P0ZBQ0
KSZ8041
3.0.3 Processor
RAM
Flash
ETH-Physical
ADSP-BF537KBCZ-6AV (Rev 0.3)
IS42S16160D-7BL
PF48F3000P0ZBQ0A
KSZ8041
3.2.1 Processor
RAM
Flash
ETH-Physical
ADSP-BF537KBCZ-6AV (Rev 0.3)
MT48LC16M16A2BG-75IT:D
PF48F3000P0ZBQE
KSZ8041
Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes
10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I)
Version Component Type
3.0.1
Processor
RAM
Flash
ETH-Physical
ADSP-BF537BBCZ-5A (Rev 0.2)
MT48LC16M16A2BG-75IT:D
PF48F2000P0ZBQ0
KSZ8041
3.0.2 Processor
RAM
Flash
ETH-Physical
ADSP-BF537BBCZ-5A (Rev 0.3)
MT48LC16M16A2BG-75IT:D
PF48F2000P0ZBQ0
KSZ8041
3.2.1 Processor
RAM
Flash
ETH-Physical
ADSP-BF537BBCZ-5A (Rev 0.3)
MT48LC16M16A2BG-75IT:D
PF48F3000P0ZBQE
KSZ8041
Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes
10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD)
Version Component Type
3.2.1 Processor
RAM
Flash
ADSP-BF537KBCZ-6AV (Rev 0.3)
IS42S16320B-7BL
PF48F3000P0ZBQE
KSZ8041
Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes
CM-BF537_HUM_V3.2.docx 29
10.2 Anomalies
Version Date Description
3.2 2011 04 27 No anomalies reported yet.
3.0 2010 10 12 No anomalies reported yet.
Table 10-4: Overview product anomalies
CM-BF537_HUM_V3.2.docx 30
11 Document Revision History
Version Date Document Revision
9 2012 05 24 Description of Pin 78 and Pin 5 of Core Module corrected
8 2012 02 07 Dependability added
Memory table update, description for PF5 added
7 2011 11 14 Pin out and connector description corrected
6 2011 10 18 Table 3-1: Electrical characteristics update
5 2011 09 06 Pin out and connector description corrected
4 2011 04 27
Updated HUM to current design. Added industrial version and 64MByte version to
this HUM.
3 2010-02-02 Redesign of Manual
2 2009-11-05 Picture 3-7, 6-1, 6-2, Table 6-1, 6-2 updated
1 2009-08-31 First release V1.0 of the document copied from CM-BF537 V1.2 and updated to
Revision 3.0
Table 11-1: Revision history
CM-BF537_HUM_V3.2.docx 31
12 List of Abbreviations
Abbreviation Description
ADI Analog Devices Inc.
AI Analog Input
AMS Asynchronous Memory Select
AO Analog Output
CM Core Module
DC Direct Current
DSP Digital Signal Processor
eCM Enhanced Core Module
EBI External Bus Interface
ESD Electrostatic Discharge
GPIO General Purpose Input Output
I Input
I²C Inter-Integrated Circuit
I/O Input/Output
ISM Image Sensor Module
LDO Low Drop-Out regulator
MTBF Mean Time Between Failure
NC Not Connected
NFC NAND Flash Controller
O Output
OS
Operating System
PPI Parallel Peripheral Interface
PWR Power
RTOS Real-Time Operating System
RFU Reserved for Future Use
SADA Stand Alone Debug Agent
SD Secure Digital
SoC System on Chip
SPI Serial Peripheral Interface
SPM Speech Processing Module
SPORT Serial Port
TFT Thin-Film Transistor
TISM Tiny Image Sensor Module
TSC Touch Screen Controller
UART Universal Asynchronous Receiver Transmitter
USB Universal Serial Bus
USBOTG USB On The Go
ZIF Zero Insertion Force
Table 12-1: List of abbreviations
CM-BF537_HUM_V3.2.docx 32
A List of Figures and Tables
Figures
Figure 1-1: Main components of the CM-BF537 Core Module ............................................................................................................... 8
Figure 2-1: Detailed block diagram ................................................................................................................................................................ 10
Figure 2-2: Assenbly drowing top view ........................................................................................................................................................ 11
Figure 5-1: Schematic of reset circuit on the Core Module .................................................................................................................. 18
Figure 5-2: Schematic for RJ45 Connection ................................................................................................................................................ 19
Figure 5-3: Configuration with Ethernet and JTAG Connector ........................................................................................................... 20
Figure 5-4: Stand-alone Ethernet based MPEG webcam ....................................................................................................................... 21
Figure 6-1: Mechanical outline (top view) ................................................................................................................................................... 22
Figure 6-2: Mechanical outline and Bottom Connectors (Top View) ................................................................................................ 23
Figure 6-3: Side view with mounted connectors ...................................................................................................................................... 23
Figure 6-4: Recommended footprint for the Core Module (top view) ............................................................................................. 24
Tables
Table 2-1: Memory map ...................................................................................................................................................................................... 11
Table 2-2: Externally addressable memory ................................................................................................................................................. 12
Table 3-1: Electrical characteristics ................................................................................................................................................................ 13
Table 3-2: Absolute maximum ratings .......................................................................................................................................................... 13
Table 4-1: Connector description X1 ............................................................................................................................................................. 16
Table 4-2: Connector description X2 ............................................................................................................................................................. 17
Table 5-1: Parts List RJ45 .................................................................................................................................................................................... 19
Table 5-2: Bill of Material of sample circuit ................................................................................................................................................. 20
Table 5-3: Bill of Materials of a Stand-alone Ethernet based MPEG Webcam ............................................................................... 21
Table 6-1: Core Module connector types ..................................................................................................................................................... 24
Table 8-1: Ordering information ..................................................................................................................................................................... 26
Table 8-2: Mount options ................................................................................................................................................................................... 26
Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes ................................................................................................... 28
Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes .................................................................................................... 28
Table 10-3: Overview CM-BF537-C-C-Q25S64F4 product changes ................................................................................................... 28
Table 10-4: Overview product anomalies .................................................................................................................................................... 29
Table 11-1: Revision history .............................................................................................................................................................................. 30
Table 12-1: List of abbreviations ..................................................................................................................................................................... 31
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