HCC/HCF40102B
HCC/HCF40103B
8-STAGE PRESETTABLESYNCHRONOUS DOWN COUNTERS
DESCRIPTION
.SYNCHRONOUS OR ASYNCHRONOUS
PRESET
.MEDIUM-SPEED OPERATION : fCL = 3.6MHz
(TYP.) @ VDD = 10V
.CASCADABLE
.QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
.5V, 10V AND 15VPARAMETRIC RATINGS
.INPUTCURRENTOF100nAAT18VAND25°C
FOR HCC DEVICE
.100% TESTEDFOR QUIESCENT CURRENT
.MEETSALLREQUIREMENTSOFJEDECTEN-
TATIVE STANDARD No. 13 A, STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIESCMOS DEVICES”
June 1989
The HCC40102B,HCC40103B, (extended tempera-
turerange) and the HCF40102B,HCF40103B (inter-
mediatetemperature range) aremonolithic integrated
circuits,available in 16-lead dual in-line plastic orce-
ramic package. The HCC/HCF40102B,and
HCC/HCF40103B consistofan8-stagesynchronous
downcounterwithasingleoutputwhichisactivewhen
the internal count is zero. The HCC/HCF40102B is
configured as twocascaded 4-bit BCD counters, and
theHCC/HCF40103B contains a single 8-bit binary
counter. Each typehas control inputsforenabling or
disabling the clock, for clearing the counter to its
maximum count, and for presetting the counter
eithersynchronously or asynchronously. All control
inputs and the CARRY-OUT/ZERO-DETECT out-
put are active-low logic. In normal operation, the
counter is decremented by one count on each posi-
tive transition of the CLOCK. Counting is inhibited
when the CARRY-IN/COUNTER ENABLE (CI/CE)
input is high. The CARRY-OUT/ZERO-DETEC
(CO/ZD) output goes low when the count reaches
zero if the CI/CE input is low, and remains low for
one full clock period. When the SYNCHRONOUS
PRESET-ENABLE (SPE) input is low, data at the
JAM input is clocked into the counter on the next
positiveclocktransitionregardless ofthestateofthe
CI/CE input. When the ASYNCHRONOUS
PRESET-ENABLE (APE) input is low, data at the
EY
(Plastic Package) F
(CeramicPackage)
C1
(ChipCarrier)
ORDERCODES :
HCC401XXBF HCF401XXBEY
HCF401XXBC1
PIN CONNECTIONS
40102B 2-DECADE BCD TYPE
40103B 8-BIT BINARY TYPE
1/13
FUNCTIONAL DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDD* Supply Voltage :HCC Types
HCF Types 0.5 to + 20
0.5 to + 18 V
V
ViInput Voltage 0.5 to VDD + 0.5 V
IIDC Input Current (any one input) ±10 mA
Ptot Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package-temperature Range
200
100
mW
mW
Top Operating Temperature : HCC Types
HCF Types –55to+125
–40to+85 °C
°C
T
stg Storage Temperature 65 to + 150 °C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Value Unit
VDD Supply Voltage : HCC Types
HCF Types 3to18
3to15 V
V
V
IInput Voltage 0 to VDD V
Top Operating Temperature : HCC Types
HCF Types 55 to + 125
–40to+85 °C
°C
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.
* All voltages are with respect to VSS (GND).
JAM inputs is asynchronously forced into the
counter regardless of the state of the SPE, CI/CE,
or CLOCK inputs. JAM inputs JO-J7represent two
4-bit BCD words for the HCC/HCF40102B and a
single 8-bit binary word for the HCC/HCF40103B.
When the CLEAR (CLR) input is low, the counter
is asynchronously cleared to its maximum count
(9910 for the HCC/HCF40102B and 25510 for
theHCC/HCF40103B) regardless of the state of
any other input. The precedence relationship be-
tween control input is indicated in the truth table. If
all control inputs are high at the tiemeof zero count,
the counters will jump to themaximum count, giving
a counting sequence of 100 or 256 clock pulses
long.TheHCC/HCF40102B andHCC/HCF40103B
may be cascaded using the CI/CE input and the
HCC/HCF40102B/40103B
2/13
LOGIC DIAGRAMS
40102B
40103B
Detail logic diagram for flip-flops, FF0-FF7 used in logic diagrams for 40102B and 40103B.
HCC/HCF40102B/40103B
3/13
LOGIC DIAGRAMS (continued)
40102B
TRUTH TABLE
Control Inputs
CLR APE SPE CI/CE Preset Mode Action
1 1 1 1 Inhibit Counter
1 1 1 0 Count Down
110X
Synchronous
Preset on Next Positive Clock Transition
1 0 X X Preset Asynchrounously
0XXX Asynchronous Clear to Maximum Count
Timing Diagram for 40102B and 40103B
Notes : 1. 0 = Low level
1 = Highlevel
X = Don’t care
2. Clock connected to clock input.
3. Synchronous operation : changes occur on negative-to-positive clock transitions..
JAM inputs : HCC/HCF010B ;MSD = J7, J6, J5, J4(J7 isMSB)
LSD = J3,J2, J1,J0 (J3is MSB)
HCC/HCF40103B Binary; MSB =J7, LSB =J0
HCC/HCF40102B/40103B
4/13
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Test Conditions Value
VIVO|IO|V
DD TLow*25°CT
High*
Symbol Parameter (V) (V) (µA) (V) Min. Max. Min. Typ. Max. Min. Max.
Unit
ILQuiescent
Current HCC
Types
0/ 5 5 5 0.04 5 150
µA
0/10 10 10 0.04 10 300
0/15 15 20 0.04 20 600
0/20 20 100 0.08 100 3000
HCF
Types
0/ 5 5 20 0.04 20 150
0/10 10 40 0.04 40 300
0/15 15 80 0.04 80 600
VOH Output High
Voltage 0/ 5 < 1 5 4.95 4.95 4.95 V
0/10 < 1 10 9.95 9.95 9.95
0/15 < 1 15 14.95 14.95 14.95
VOL Output Low
Voltage 5/0 < 1 5 0.05 0.05 0.05 V
10/0 < 1 10 0.05 0.05 0.05
15/0 < 1 15 0.05 0.05 0.05
VIH Input High
Voltage 0.5/4.5 < 1 5 3.5 3.5 3.5
V
1/9 < 1 10 7 7 7
1.5/13.5 < 1 15 11 11 11
VIL Input Low
Voltage 4.5/0.5 < 1 5 1.5 1.5 1.5 V
9/1 < 1 10 3 3 3
13.5/1.5 < 1 15 4 4 4
IOH Output
Drive
Current HCC
Types
0/ 5 2.5 5 2 1.6 3.2 1.15
mA
0/ 5 4.6 5 0.64 0.51 1 0.36
0/10 9.5 10 1.6 1.3 2.6 0.9
0/15 13.5 15 4.2 3.4 6.8 2.4
HCF
Types
0/ 5 2.5 5 1.53 1.36 3.2 1.1
0/ 5 4.6 5 0.52 0.44 1 0.36
0/10 9.5 10 1.3 1.1 2.6 0.9
0/15 13.5 15 3.6 3.0 6.8 2.4
IOL Output
Sink
Current HCC
Types
0/ 5 0.4 5 0.64 0.51 1 0.36
mA
0/10 0.5 10 1.6 1.3 2.6 0.9
0/15 1.5 15 4.2 3.4 6.8 2.4
HCF
Types
0/ 5 0.4 5 0.52 0.44 1 0.36
0/10 0.5 10 1.3 1.1 2.6 0.9
0/15 1.5 15 3.6 3.0 6.8 2.4
IIH,I
IL Input
Leakage
Current
HCC
Types 0/18 Any Input 18 ±0.1 ±10–5 ±0.1 ±1µA
HCF
Types 0/15 15 ±0.3 ±10–5 ±0.3 ±1
CIInput Capacitance Any Input 5 7.5 pF
*T
Low=–55°CforHCC device : 40°C for HCF device.
*T
High= + 125°C for HCC device : + 85°C for HCF device.
TheNoise Margin for both ”1” and”0” levelis : 1Vmin.with VDD = 5V, 2V min.with VDD = 10V, 2.5 V min. withVDD =15V.
HCC/HCF40102B/40103B
5/13
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb =25°C, CL= 50pF, RL= 200k,
typical temperature coefficient for all VDD values is 0.3%/°C, all input rise and fall time = 20ns)
Test Conditions Value
Symbol Parameter VDD (V) Min. Typ. Max. Unit
tPHL,
tPLH
Propagation
Delay Time Clock to-out 5 300 600 ns
10 130 260
15 95 190
Carry In/Counter
Enable-to-output 5200400
ns
10 90 180
15 65 130
Asynchronous
Preset
Enable-to-output
5 650 1300
10 300 600
15 200 400
Clear-to-output 5 375 750 ns
10 180 360
15 100 200
tTHL,t
TLH Transition Time 5 100 200
10 50 100 ns
15 40 80
tWPulse Width Clock Pulse
Width 5 300 150 ns
10 180 90
15 80 40
CLR Pulse
Width 5 320 160 ns
10 160 80
15 100 50
APE Pulse Width 5 360 180
10 160 80 ns
15 120 60
tsetup Setup Time SPE Setup Time 5 280 140 ns
10 140 70
15 100 50
JAM Setup Time 5 200 100 ns
10 80 40
15 60 30
fCL Maximum Clock Input Frequency 5 0.7 1.4
10 1.8 3.6 MHz
15 2.4 4.8
HCC/HCF40102B/40103B
6/13
Output Low (sink) Current Characteristics. Output High (source) Current Characteristics.
Typical Transition Timevs. Load Capacitance. Typical Propagation Delay Time vs. Load Capacit-
ance (clock to CO/ZD).
Typical Dynamic Power Dissipation vs. Fre-
quency.
Typical Maximum ClockInput Frequency vs.
Supply Voltage.
HCC/HCF40102B/40103B
7/13
TYPICAL APPLICATIONS
Divide-by-”N” Counter. Programmable Timer.
Microprocessor Interrupt Timer.
Microprocessor Interrupt Timer.
Synchronous Cascading.
*An output spike (160ns @ VDD = 5V) occurs whenever two or
more devices are cascaded in the parallel-clocked mode be-
cause the clock-to-carry out delay is greater than the carry-in-to-
carry out delay. This spike is eliminated by gating the out put
of the last device with the clock as shown.
HCC/HCF40102B/40103B
8/13
Input Current.
Input Voltage.
TEST CIRCUITS
Quiescent Device Current.
Maximum ClockFrequency.
Dynamic Power Dissipation.
HCC/HCF40102B/40103B
9/13
Plastic DIP16 (0.25) MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
I 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
P001C
HCC/HCF40102B/40103B
10/13
Ceramic DIP16/1 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 20 0.787
B 7 0.276
D 3.3 0.130
E 0.38 0.015
e3 17.78 0.700
F 2.29 2.79 0.090 0.110
G 0.4 0.55 0.016 0.022
H 1.17 1.52 0.046 0.060
L 0.22 0.31 0.009 0.012
M 0.51 1.27 0.020 0.050
N 10.3 0.406
P 7.8 8.05 0.307 0.317
Q 5.08 0.200
P053D
HCC/HCF40102B/40103B
11/13
PLCC20 MECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 9.78 10.03 0.385 0.395
B 8.89 9.04 0.350 0.356
D 4.2 4.57 0.165 0.180
d1 2.54 0.100
d2 0.56 0.022
E 7.37 8.38 0.290 0.330
e 1.27 0.050
e3 5.08 0.200
F 0.38 0.015
G 0.101 0.004
M 1.27 0.050
M1 1.14 0.045
P027A
HCC/HCF40102B/40103B
12/13
Information furnished is believed to be accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such informationnor forany infringement of patents orother rights of third parties which mayresults from its use. No
license is granted by implication or otherwiseunder any patent or patent rights ofSGS-THOMSON Microelectronics. Specificationsmentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronicsproductsare notauthorizedforuse ascritical componentsin life supportdevices or systemswithout express
written approvalof SGS-THOMSON Microelectonics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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HCC/HCF40102B/40103B
13/13