OUTA
OUTB
OUTC
OUTD
OUTE
OUTF
OUTG
OUTH
GND
4-wire SPI
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(Master)
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DAC128S085
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DAC128S085 12-Bit Micro-Power OCTAL Digital-to-Analog Converter With Rail-to-Rail
Outputs
1 Features 3 Description
The DAC128S085 is a full-featured, general-purpose
1• Ensured Monotonicity OCTAL 12-bit voltage-output digital-to-analog
• Low Power Operation converter (DAC) that can operate from a single 2.7-V
• Rail-to-Rail Voltage Output to 5.5-V supply and consumes 1.95 mW at 3 V and
4.85 mW at 5 V. The DAC128S085 is packaged in a
• Daisy-Chain Capability 16-lead WQFN package and a 16-lead TSSOP
• Power-on Reset to 0 V package. The WQFN package makes the
• Simultaneous Output Updating DAC128S085 the smallest OCTAL DAC in its class.
The on-chip output amplifiers allow rail-to-rail output
• Individual Channel Power-Down Capability swing, and the 3-wire serial interface operates at
• Wide Power Supply Range (2.7 V to 5.5 V) clock rates up to 40 MHz over the entire supply
• Dual Reference Voltages With Range of 0.5 V to voltage range. Competitive devices are limited to 25-
VAMHz clock rates at supply voltages in the 2.7-V to
• Operating Temperature Range of −40°C to 125°C 3.6-V range. The serial interface is compatible with
standard SPI™, QSPI, MICROWIRE, and DSP
• Smallest Package in the Industry interfaces. The DAC128S085 also offers daisy-chain
• Resolution 12 Bits operation, where an unlimited number of
• INL ±8 LSB (Maximum) DAC128S085s can be updated simultaneously using
a single serial interface.
• DNL 0.75 / −0.4 LSB (Maximum)
• Settling Time 8.5 μs (Maximum) There are two references for the DAC128S085. One
reference input serves channels A through D, while
• Zero Code Error 15 mV (Maximum) the other reference serves channels E through H.
• Full-Scale Error −0.75 %FSR (Maximum) Each reference can be set independently between
• Supply Power 0.5 V and VA, providing the widest possible output
dynamic range. The DAC128S085 has a 16-bit input
– 1.95 mW (3 V) / 4.85 mW (5 V) Typical shift register that controls the mode of operation, the
– Power Down 0.3 μW(3V)/1μW (5 V) Typical power-down condition, and the register/output value
of the DAC channels. All eight DAC outputs can be
2 Applications updated simultaneously or individually.
• Battery-Powered Instruments Device Information(1)
• Digital Gain and Offset Adjustment PART NUMBER PACKAGE BODY SIZE (NOM)
• Programmable Voltage and Current Sources TSSOP (16) 5.00 mm × 4.4 mm
• Programmable Attenuators DAC128S085 WQFN (16) 4.00 mm × 4.00 mm
• Voltage Reference for ADCs (1) For all available packages, see the orderable addendum at
• Sensor Supply Voltage the end of the datasheet.
• Range Detectors
Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC128S085
SNAS407H –AUGUST 2007–REVISED APRIL 2015
www.ti.com
Table of Contents
8.3 Feature Description................................................. 16
1 Features.................................................................. 18.4 Device Functional Modes........................................ 20
2 Applications ........................................................... 18.5 Programming........................................................... 21
3 Description............................................................. 19 Application and Implementation ........................ 22
4 Revision History..................................................... 29.1 Application Information............................................ 22
5 Description (continued)......................................... 39.2 Typical Application ................................................. 22
6 Pin Configuration and Functions......................... 410 Power Supply Recommendations ..................... 23
7 Specifications......................................................... 511 Layout................................................................... 23
7.1 Absolute Maximum Ratings ...................................... 511.1 Layout Guidelines ................................................. 23
7.2 ESD Ratings ............................................................ 511.2 Layout Example .................................................... 24
7.3 Recommended Operating Conditions....................... 512 Device and Documentation Support................. 25
7.4 Thermal Information.................................................. 612.1 Device Support...................................................... 25
7.5 Electrical Characteristics........................................... 612.2 Documentation Support ........................................ 26
7.6 AC and Timing Characteristics ................................. 912.3 Trademarks........................................................... 26
7.7 Typical Characteristics............................................ 11 12.4 Electrostatic Discharge Caution............................ 26
8 Detailed Description............................................ 15 12.5 Glossary................................................................ 26
8.1 Overview................................................................. 15 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram....................................... 15 Information ........................................................... 26
4 Revision History
Changes from Revision G (January 2015) to Revision H Page
• Switched WQFN and TSSOP pinouts to their correct titles .................................................................................................. 4
• Re-drew TSSOP pinout as a square to better reflect mechanical packaging drawings ........................................................ 4
Changes from Revision F (March 2013) to Revision G Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision E (March 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 23
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5 Description (continued)
A power-on reset circuit ensures that the DAC outputs power up to zero volts and remain there until there is a
valid write to the device. The power-down feature of the DAC128S085 allows each DAC to be independently
powered with three different termination options. With all the DAC channels powered down, power consumption
reduces to less than 0.3 µW at 3 V and less than 1 µW at 5 V. The low power consumption and small packages
of the DAC128S085 make it an excellent choice for use in battery-operated equipment.
The DAC128S085 is one of a family of pin-compatible DACs, including the 8-bit DAC088S085 and the 10-bit
DAC108S085. All three parts are offered with the same pinout, allowing system designers to select a resolution
appropriate for their application without redesigning their printed circuit board. The DAC128S085 operates over
the extended industrial temperature range of −40°C to 125°C.
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1
2
3
4
5
6
7
8 13
14
15
16
9
10
11
12
DAC128S085
VOUTA
VOUTB
VOUTC
VOUTD
GND
VA
VREF2
VREF1
VOUTG
VOUTF
VOUTH
VOUTE
DIN
SCLK
DOUT
SYNC
DAC128S085
1
2
3
4
5
6
7
8
13
14
15
16
9
10
11
12
SCLK
SYNC
VOUTG
VOUTF
VOUTH
VOUTE
GND
VREF2
VOUTA
VA
VOUTB
VOUTC
VOUTD
VREF1
DIN
DOUT
DAC128S085
SNAS407H –AUGUST 2007–REVISED APRIL 2015
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6 Pin Configuration and Functions
RGH Package PW Package
16-Pin WQFN 16-Pin TSSOP
(Top View) (Top View)
Pin Functions
PIN TYPE DESCRIPTION
NAME TSSOP NO. WQFN NO.
Serial Data Input. Data is clocked into the 16-bit shift register on the falling
DIN 1 15 Digital Input edges of SCLK after the fall of SYNC.
Serial Data Output. DOUT is utilized in daisy chain operation and is connected
Digital
DOUT 2 16 directly to a DIN pin on another DAC128S085. Data is not available at DOUT
Output unless SYNC remains low for more than 16 SCLK cycles.
GND 10 8 Ground Ground reference for all on-chip circuitry.
Serial Clock Input. Data is clocked into the input shift register on the falling
SCLK 16 14 Digital Input edges of this pin.
Frame Synchronization Input. When this pin goes low, data is written into the
DAC's input shift register on the falling edges of SCLK. After the 16th falling
SYNC 15 13 Digital Input edge of SCLK, a rising edge of SYNC causes the DAC to be updated. If
SYNC is brought high before the 15th falling edge of SCLK, the rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
VA7 5 Supply Power supply input. Must be decoupled to GND.
Analog
VOUTA 3 1 Channel A Analog Output Voltage.
Output
Analog
VOUTB 4 2 Channel B Analog Output Voltage.
Output
Analog
VOUTC 5 3 Channel C Analog Output Voltage.
Output
Analog
VOUTD 6 4 Channel D Analog Output Voltage.
Output
Analog
VOUTE 14 12 Channel E Analog Output Voltage.
Output
Analog
VOUTF 13 11 Channel F Analog Output Voltage.
Output
Analog
VOUTG 12 10 Channel G Analog Output Voltage.
Output
Analog
VOUTH 11 9 Channel H Analog Output Voltage.
Output
Analog Unbuffered reference voltage shared by Channels A, B, C, and D. Must be
VREF1 8 6 Input decoupled to GND.
Analog Unbuffered reference voltage shared by Channels E, F, G, and H. Must be
VREF2 9 7 Input decoupled to GND.
Exposed die attach pad can be connected to ground or left floating. Soldering
PAD — 17 Ground the pad to the PCB offers optimal thermal performance and enhances
(WQFN only) package self-alignment during reflow.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Supply Voltage, VA6.5 V
Voltage on any Input Pin −0.3 6.5 V
Input Current at Any Pin(3) 10 mA
Package Input Current(3) 30 mA
Power Consumption at TA= 25°C See (4)
Junction Temperature 150 °C
Storage Temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recomended Operating Ratings indicate
conditions for which the device is functional, but do not specify specific performance limits. For ensured specifications and test
conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
Absolute Maximum Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(3) When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin should be limited to 10 mA. The 30-mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10
mA to three.
(4) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax −TA) / RθJA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (for example, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
Such conditions should always be avoided.
7.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500
Charged-device model (CDM), per JEDEC specification JESD22- ±1000
V(ESD) Electrostatic discharge V
C101(2)
Machine Model ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Operating Temperature Range −40 ≤TA≤°C
+125
Supply Voltage, VA2.7 5.5 V
Reference Voltage, VREF1,2 0.5 VAV
Digital Input Voltage(1) 0.0 5.5 V
Output Load 0 1500 pF
SCLK Frequency 40 MHz
(1) The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, will not cause errors in the conversion
result. For example, if VAis 3 V, the digital input pins can be driven with a 5-V logic device.
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7.4 Thermal Information DAC128S085
THERMAL METRIC(1) PW (TSSOP) RGH (WQFN) UNIT
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 98 34
RθJA Junction-to-ambient thermal resistance 31 25
RθJA Junction-to-ambient thermal resistance 43 11 °C/W
φJT Junction-to-top characterization parameter 2 0.2
φJB Junction-to-board characterization parameter 43 11
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1 = VREF2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input
code range 48 to 4047. All limits are at TA= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP MAX(1) UNIT
STATIC PERFORMANCE
Resolution TMIN ≤TA≤TMAX 12 Bits
Monotonicity TMIN ≤TA≤TMAX 12 Bits
±2
INL Integral Non-Linearity LSB
TMIN ≤TA≤TMAX ±8
0.15 LSB
TMIN ≤TA≤TMAX 0.75
DNL Differential Non-Linearity −0.09 LSB
TMIN ≤TA≤TMAX −0.4
IOUT = 0 +5
ZE Zero Code Error mV
TMIN ≤TA≤TMAX 15
IOUT = 0 −0.1%
FSE Full-Scale Error FSR
TMIN ≤TA≤TMAX −0.75%
−0.2%
GE Gain Error FSR
TMIN ≤TA≤TMAX −1 %
ZCED Zero Code Error Drift −20 µV/°C
TC GE Gain Error Tempco −1 ppm/°C
OUTPUT CHARACTERISTICS
Output Voltage Range TMIN ≤TA≤TMAX 0 VREF1,2 V
High-Impedance Output
IOZ TMIN ≤TA≤TMAX ±1 µA
Leakage Current(2)
VA= 3 V, IOUT = 200 µA 10 mV
VA= 3 V, IOUT = 1 mA 45 mV
ZCO Zero Code Output VA= 5 V, IOUT = 200 µA 8 mV
VA= 5 V, IOUT = 1 mA 34 mV
VA= 3 V, IOUT = 200 µA 2.984 V
VA= 3 V, IOUT = 1 mA 2.933 V
FSO Full Scale Output VA= 5 V, IOUT = 200 µA 4.987 V
VA= 5 V, IOUT = 1 mA 4.955 V
(1) Test limits are ensured to TI's AOQL (Average Outgoing Quality Level).
(2) This parameter is ensured by design and/or characterization and is not tested in production.
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Electrical Characteristics (continued)
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1 = VREF2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input
code range 48 to 4047. All limits are at TA= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP MAX(1) UNIT
VA= 3 V, VOUT = 0 V, −50 mA
Input Code = FFFh
Output Short Circuit Current
IOS (source)(3) VA= 5 V, VOUT = 0 V, −60 mA
Input Code = FFFh
VA= 3 V, VOUT = 3 V, 50 mA
Input Code = 000h
Output Short Circuit Current
IOS (sink)(3) VA= 5 V, VOUT = 5 V, 70 mA
Input Code = 000h
TA= 105°C 10 mA
TMIN ≤TA≤TMAX
Continuous Output Current per
IOchannel(2) TA= 125°C 6.5 mA
TMIN ≤TA≤TMAX
RL=∞1500 pF
CLMaximum Load Capacitance RL= 2 kΩ1500 pF
ZOUT DC Output Impedance 8 Ω
REFERENCE INPUT
CHARACTERISTICS
0.5
Input Range Minimum V
TMIN ≤TA≤TMAX 2.7
VREF1,2 Input Range Maximum TMIN ≤TA≤TMAX VAV
Input Impedance 30 kΩ
LOGIC INPUT CHARACTERISTICS
IIN Input Current(2) TMIN ≤TA≤TMAX ±1 µA
VA= 2.7 V to 3.6 V 1 V
TMIN ≤TA≤TMAX 0.6
VIL Input Low Voltage VA= 4.5 V to 5.5 V 1.1 V
0.8
VA= 2.7 V to 3.6 V 1.4 V
TMIN ≤TA≤TMAX 2.1
VIH Input High Voltage VA= 4.5 V to 5.5 V 2 V
TMIN ≤TA≤TMAX 2.4
CIN Input Capacitance(2) TMIN ≤TA≤TMAX 3 pF
(3) This parameter does not represent a condition which the DAC can sustain continuously. See the continuous output current specification
for the maximum DAC output current per channel.
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Electrical Characteristics (continued)
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1 = VREF2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input
code range 48 to 4047. All limits are at TA= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP MAX(1) UNIT
POWER REQUIREMENTS
Supply Voltage Minimum TMIN ≤TA≤TMAX 2.7 V
VASupply Voltage Maximum TMIN ≤TA≤TMAX 5.5 V
VA= 2.7 V to 460
3.6 V µA
TMIN ≤TA≤560
Normal Supply Current for fSCLK = 30 MHz, TMAX
supply pin VAoutput unloaded VA= 4.5 V to 650
5.5 V µA
830
INVA= 2.7 V to 95
3.6 V µA
TMIN ≤TA≤130
Normal Supply Current for fSCLK = 30 MHz, TMAX
VREF1 or VREF2 output unloaded VA= 4.5 V to 160
5.5 V µA
220
VA= 2.7 V to 370 µA
3.6 V
Static Supply Current for fSCLK = 0,
supply pin VAoutput unloaded VA= 4.5 V to 440 µA
5.5 V
IST VA= 2.7 V to 95 µA
3.6 V
Static Supply Current for fSCLK = 0,
VREF1 or VREF2 output unloaded VA= 4.5 V to 160 µA
5.5 V
VA= 2.7 V to 0.2
3.6 V µA
fSCLK = 30 MHz, 1.5
SYNC = VAand VA= 4.5 V to
DIN = 0V after PD 0.5
5.5 V
mode loaded µA
TMIN ≤TA≤3
TMAX
Total Power Down Supply
IPD Current for all PD Modes VA= 2.7 V to 0.1
(2) 3.6 V µA
TMIN ≤TA≤
fSCLK = 0, SYNC = 1
TMAX
VAand DIN = 0V
after PD mode VA= 4.5 V to 0.2
loaded 5.5 V µA
TMIN ≤TA≤2
TMAX
VA= 2.7 V to 1.95
3.6 V mW
TMIN ≤TA≤3
TMAX
fSCLK = 30 MHz
output unloaded VA= 4.5 V to 4.85
5.5 V
Total Power Consumption
PNmW
(output unloaded) TMIN ≤TA≤7
TMAX
VA= 2.7 V to 1.68 mW
3.6 V
fSCLK = 0
output unloaded VA= 4.5 V to 3.80 mW
5.5 V
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Electrical Characteristics (continued)
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1 = VREF2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input
code range 48 to 4047. All limits are at TA= 25°C, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN(1) TYP MAX(1) UNIT
VA= 2.7 V to 0.6
3.6 V µW
TMIN ≤TA≤
fSCLK = 30 MHz, 5.4
TMAX
SYNC = VAand
DIN = 0V after PD VA= 4.5V to 2.5
mode loaded 5.5V µW
TMIN ≤TA≤16.5
Total Power Consumption in TMAX
PPD all PD Modes, VA= 2.7 V to
(2) 0.3
3.6 V µW
TMIN ≤TA≤
fSCLK = 0, SYNC = 3.6
TMAX
VAand DIN = 0V
after PD mode VA= 4.5 V to 1
loaded 5.5 V µW
TMIN ≤TA≤11
TMAX
7.6 AC and Timing Characteristics
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1,2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input code range
48 to 4047. All limits are at TA= 25°C, unless otherwise specified. MIN(1) NOM MAX(1) UNIT
40
fSCLK SCLK Frequency MHz
TMIN ≤TA≤TMAX 30
400h to C00h code change 6
Output Voltage Settling Time RL= 2 kΩ, CL= 200 pF
tsµs
(2) TMIN ≤TA≤TMAX 8.5
SR Output Slew Rate 1 V/µs
GI Glitch Impulse Code change from 800h to 7FFh 40 nV-sec
DF Digital Feedthrough 0.5 nV-sec
DC Digital Crosstalk 0.5 nV-sec
CROSS DAC-to-DAC Crosstalk 1 nV-sec
MBW Multiplying Bandwidth VREF1,2 = 2.5 V ± 2 Vpp 360 kHz
Total Harmonic Distortion Plus VREF1,2 = 2.5 V ± 0.5 Vpp
THD+N −80 dB
Noise 100 Hz < fIN < 20 kHz
ONSD Output Noise Spectral Density DAC Code = 800 h, 10 kHz 40 nV/sqrt (Hz)
ON Output Noise BW = 30 kHz 14 µV
VA= 3 V 3 µsec
tWU Wake-Up Time VA= 5 V 20 µsec
25
1/fSCLK SCLK Cycle Time. See Figure 1 ns
TMIN ≤TA≤TMAX 33 7
tCH SCLK High time. See Figure 1 ns
TMIN ≤TA≤TMAX 10 7
tCL SCLK Low Time. See Figure 1 ns
TMIN ≤TA≤TMAX 10 3 1 / fSCLK - 3
SYNC Set-up Time prior to
tSS ns
SCLK Falling Edge. See Figure 1 TMIN ≤TA≤TMAX 10
(1) Test limits are ensured to TI's AOQL (Average Outgoing Quality Level).
(2) This parameter is ensured by design and/or characterization and is not tested in production.
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AC and Timing Characteristics (continued)
The following specifications apply for VA= 2.7 V to 5.5 V, VREF1,2 = VA, CL= 200 pF to GND, fSCLK = 30 MHz, input code range
48 to 4047. All limits are at TA= 25°C, unless otherwise specified. MIN(1) NOM MAX(1) UNIT
1
Data Set-Up Time prior to SCLK
tDS ns
Falling Edge. See Figure 1 TMIN ≤TA≤TMAX 2.5 1
Data Hold Time after SCLK
tDH ns
Falling Edge. See Figure 1 TMIN ≤TA≤TMAX 2.5
SYNC Hold Time after the 16th 0 1 / fSCLK - 3
tSH falling edge of SCLK. See ns
TMIN ≤TA≤TMAX 3
Figure 1 5
tSYNC SYNC High Time. See Figure 1 ns
TMIN ≤TA≤TMAX 15
Figure 1. Serial Timing Diagram
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7.7 Typical Characteristics
VA= 2.7 V to 5.5 V, VREF1,2 = VA, fSCLK = 30 MHz, TA= 25°C, unless otherwise stated
Figure 2. INL vs Code Figure 3. DNL vs Code
Figure 4. INL / DNL vs VREF Figure 5. INL / DNL vs FSCLK
Figure 6. INL / DNL vs VAFigure 7. INL / DNL vs Temperature
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Typical Characteristics (continued)
VA= 2.7 V to 5.5 V, VREF1,2 = VA, fSCLK = 30 MHz, TA= 25°C, unless otherwise stated
Figure 8. Zero Code Error vs VAFigure 9. Zero Code Error vs VREF
Figure 10. Zero Code Error vs FSCLK Figure 11. Zero Code Error vs Temperature
Figure 12. Full-Scale Error vs VAFigure 13. Full-Scale Error vs VREF
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Typical Characteristics (continued)
VA= 2.7 V to 5.5 V, VREF1,2 = VA, fSCLK = 30 MHz, TA= 25°C, unless otherwise stated
Figure 14. Full-Scale Error vs FSCLK Figure 15. Full-Scale Error vs Temperature
Figure 16. IVA vs VAFigure 17. IVA vs Temperature
Figure 18. IVREF vs VREF Figure 19. IVREF vs Temperature
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Typical Characteristics (continued)
VA= 2.7 V to 5.5 V, VREF1,2 = VA, fSCLK = 30 MHz, TA= 25°C, unless otherwise stated
Figure 20. Settling Time Figure 21. Glitch Response
Figure 22. Wake-Up Time Figure 23. DAC-to-DAC Crosstalk
Figure 24. Power-On Reset Figure 25. Multiplying Bandwidth
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POWER-ON
RESET
DAC
REGISTER
INPUT
CONTROL
LOGIC
12
POWER-DOWN
CONTROL
LOGIC
VOUTE
12 BIT DAC
REF
12
SCLK DIN
SYNC
BUFFER
BUFFER
BUFFER
BUFFER
12
12
12
VOUTF
VOUTG
VOUTH
2.5k 100k
2.5k 100k
2.5k 100k
2.5k 100k
12 BIT DAC
REF
12 BIT DAC
REF
12 BIT DAC
REF
VREF1
DAC128S085
VOUTA
12 BIT DAC
REF
12
BUFFER
BUFFER
BUFFER
BUFFER
12
12
12
VOUTB
VOUTC
VOUTD
2.5k 100k
2.5k 100k
2.5k 100k
2.5k 100k
12 BIT DAC
REF
12 BIT DAC
REF
12 BIT DAC
REF
VREF2
DOUT
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8 Detailed Description
8.1 Overview
The DAC128S085 is fabricated on a CMOS process with an architecture that consists of switches and resistor
strings followed by an output buffer. The reference voltages are externally applied at VREF1 for DAC channels A
through D, and VREF2 for DAC channels E through H.
8.2 Functional Block Diagram
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Product Folder Links: DAC128S085
VOUT
12 BIT DAC
REF
12 BUFFER
DAC
REGISTER
VREF
VREF
VOUT
R
R
R
R
R
S0
S1
S2
S2 n
S2 n-1
S2 n-2
DAC128S085
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8.3 Feature Description
8.3.1 DAC Architecture
For simplicity, a single resistor string is shown in Figure 26. This string consists of 4096 equal valued resistors
with a switch at each junction of two resistors, plus a switch to ground. The code loaded into the DAC register
determines which switch is closed, connecting the proper node to the amplifier. The input coding is straight
binary with an ideal output voltage of:
VOUTA,B,C,D = VREF1 × (D / 4096)
where
•Dis the decimal equivalent of the binary code that is loaded into the DAC register. (1)
VOUTE,F,G,H = VREF2 × (D / 4096) (2)
D can take on any value between 0 and 4095. This configuration ensures that the DAC is monotonic.
Figure 26. DAC Resistor String
Because all eight DAC channels of the DAC128S085 can be controlled independently, each channel consists of
a DAC register and a 12-bit DAC. Figure 27 is a simple block diagram of an individual channel in the
DAC128S085. Depending on the mode of operation, data written into a DAC register causes the 12-bit DAC
output to be updated, or an additional command is required to update the DAC output. Further description of the
modes of operation can be found in Serial Interface.
Figure 27. Single-Channel Block Diagram
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SCLK
SYNC
tSS
117
tSH
1615
DAC128S085
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Feature Description (continued)
8.3.2 Output Amplifiers
The output amplifiers are rail-to-rail, providing an output voltage range of 0 V to VAwhen the reference is VA. All
amplifiers, including rail-to-rail types, exhibit a loss of linearity as the output approaches the supply rails (0 V and
VA, in this case). For this reason, linearity is specified over less than the full output range of the DAC. However, if
the reference is less than VA, only the lowest codes experience a loss in linearity.
The output amplifiers can drive a load of 2 kΩin parallel with 1500 pF to ground or to VA. The zero-code and full-
scale outputs for given load currents are available in the Electrical Characteristics.
8.3.3 Reference Voltage
The DAC128S085 uses dual external references, VREF1 and VREF2, which are shared by channels A, B, C, D and
channels E, F, G, H, respectively. The reference pins are not buffered and have an input impedance of 30 kΩ. TI
recommends driving VREF1 and VREF2 by voltage sources with low output impedance. The reference voltage
range is 0.5 V to VA, providing the widest possible output dynamic range.
8.3.4 Serial Interface
The three-wire interface is compatible with SPI, QSPI, and MICROWIRE, as well as most DSPs, and operates at
clock rates up to 40 MHz. A valid serial frame contains 16 falling edges of SCLK. See Table 1 for information on
a write sequence.
A write sequence begins by bringing the SYNC line low. Once SYNC is low, the data on the DIN line is clocked
into the 16-bit serial input register on the falling edges of SCLK. To avoid mis-clocking data into the shift register,
it is critical that SYNC not be brought low on a falling edge of SCLK (see minimum and maximum setup times for
SYNC in AC and Timing Characteristics and Figure 28). On the 16th falling edge of SCLK, the last data bit is
clocked into the register. The write sequence is concluded by bringing the SYNC line high. Once SYNC is high,
the programmed function (a change in the DAC channel address, mode of operation, or register contents) is
executed. To avoid mis-clocking data into the shift register, it is critical that SYNC be brought high between the
16th and 17th falling edges of SCLK (see minimum and maximum hold times for SYNC in AC and Timing
Characteristics and Figure 28).
Figure 28. CS Setup and Hold Times
If SYNC is brought high before the 15th falling edge of SCLK, the write sequence is aborted and the data that
has been shifted into the input register is discarded. If SYNC is held low beyond the 17th falling edge of SCLK,
the serial data presented at DIN will begin to be output on DOUT. More information on this mode of operation can
be found in Daisy-Chain Operation. In either case, SYNC must be brought high for the minimum specified time
before the next write sequence is initiated with a falling edge of SYNC.
Since the DIN buffer draws more current when it is high, it should be idled low between write sequences to
minimize power consumption. On the other hand, SYNC should be idled high to avoid the activation of daisy
chain operation where DOUT is active.
8.3.5 Daisy-Chain Operation
Daisy-chain operation allows communication with any number of DAC128S085s using a single serial interface.
As long as the correct number of data bits are input in a write sequence (multiple of sixteen bits), a rising edge of
SYNC will properly update all DACs in the system.
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Product Folder Links: DAC128S085
DAC 3
DIN1
SYNC
DAC 2 DAC 1
DAC 3 DAC 2
DAC 3
DIN2/DOUT1
DIN3/DOUT2
Data Loaded into the DACs
48 SCLK Cycles (16 X 3)
15th SCLK Cycle 31st SCLK Cycle
DAC 1
SCLK
DIN
SYNC
DOUT
DAC 2
SCLK
DIN
SYNC
DOUT
DAC 3
SCLK
DIN
SYNC
DOUT
SCLK
DIN
SYNC
DAC128S085
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www.ti.com
Feature Description (continued)
To support multiple devices in a daisy chain configuration, SCLK and SYNC are shared across all DAC128S085s
and DOUT of the first DAC in the chain is connected to DIN of the second. Figure 29 shows three DAC128S085s
connected in daisy chain fashion. Similar to a single channel write sequence, the conversion for a daisy chain
operation begins on a falling edge of SYNC and ends on a rising edge of SYNC. A valid write sequence for n
devices in a chain requires n times 16 falling edges to shift the entire input data stream through the chain. Daisy
chain operation is ensured for a maximum SCLK speed of 30 MHz.
Figure 29. Daisy-Chain Configuration
The serial data output pin, DOUT, is available on the DAC128S085 to allow daisy-chaining of multiple
DAC128S085 devices in a system. In a write sequence, DOUT remains low for the first 14 falling edges of SCLK
before going high on the 15th falling edge. Subsequently, the next 16 falling edges of SCLK will output the first
16 data bits entered into DIN.Figure 30 shows the timing of 3 DAC128S085s in Figure 29. In this instance, It
takes 48 falling edges of SCLK followed by a rising edge of SYNC to load all three DAC128S085s with the
appropriate register data. On the rising edge of SYNC, the programmed function is executed in each
DAC128S085 simultaneously.
When connecting multiple devices in a daisy-chain configuration, it is important to note that the DAC128S085 will
update the DOUT signal on the falling edge of SCLK, and this will be sampled by the next DAC in the daisy chain
on the next falling edge of the clock. Ensure that the timing requirements are met for proper operation.
Specifically, pay attention to the data hold time after the SCLK falling (tDH) requirement. Improper layout or
loading may delay the clock signal between devices. If delayed to the point that data changes prior to meeting
the hold time requirement, incorrect data can be sampled. If the clock delay cannot be resolved, an alternative
solution is to add a delay between the DOUT of one device and DIN of the following device in the daisy chain. This
increases the hold time margin and allows for correct sampling. Be aware though, that the tradeoff with this fix is
that too much delay eventually impacts the setup time.
Figure 30. Daisy Chain Timing Diagram
8.3.6 DAC Input Data Update Mechanism
The DAC128S085 has two modes of operation, plus a few special command operations. The two modes of
operation are Write Register Mode (WRM) and Write Through Mode (WTM). For the rest of this document, these
modes will be referred to as WRM and WTM. The special command operations are separate from WRM and
WTM because they can be called upon regardless of the current mode of operation. The mode of operation is
controlled by the first four bits of the control register, DB15 through DB12. See Table 1 for a detailed summary.
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Feature Description (continued)
Table 1. Write Register and Write Through Modes
DB[15:12] DB[11:0] Description of Mode
WRM: The registers of each DAC Channel can be written to without causing
1000 XXXXXXXXXXXX their outputs to change.
1 0 0 1 X X X X X X X X X X X X WTM: Writing data to a channel's register causes the DAC output to change.
When the DAC128S085 first powers up, the DAC is in WRM. In WRM, the registers of each individual DAC
channel can be written to without updating the DAC outputs. This is accomplished by setting DB15 to 0,
specifying the DAC register to be written to in DB[14:12], and entering the new DAC register setting in DB[11:0]
(see Table 2). The DAC128S085 remains in WRM until the mode of operation is changed to WTM. The mode of
operation is changed from WRM to WTM by setting DB[15:12] to 1001. Once in WTM, writing data to a DAC
channel register causes the DAC output to be updated as well. Changing a DAC channel register in WTM is
accomplished in the same manner as in WRM. However, in WTM the DAC register and output are updated at the
completion of the command (see Table 2). Similarly, the DAC128S085 remains in WTM until the mode of
operation is changed to WRM by setting DB[15:12] to 1000.
Table 2. Commands Impacted by WRM and WTM
DB15 DB[14:12] DB[11:0] Description of Mode
WRM: D[11:0] written to ChA's data register only
0 0 0 0 D11 D10 ... D1 D0 WTM: ChA's output is updated by data in D[11:0]
WRM: D[11:0] written to only the data register of ChB
0 0 0 1 D11 D10 ... D1 D0 WTM: ChB's output is updated by data in D[11:0]
WRM: D[11:0] written to only the data register of ChC
0 0 1 0 D11 D10 ... D1 D0 WTM: ChC's output is updated by data in D[11:0]
WRM: D[11:0] written only the data register of ChD
0 0 1 1 D11 D10 ... D1 D0 WTM: ChD's output is updated by data in D[11:0]
WRM: D[11:0] written only the data register of ChE
0 1 0 0 D11 D10 ... D1 D0 WTM: ChE's output is updated by data in D[11:0]
WRM: D[11:0] written only the data register of ChF
0 1 0 1 D11 D10 ... D1 D0 WTM: ChF's output is updated by data in D[11:0]
WRM: D[11:0] written only the data register of ChG
0 1 1 0 D11 D10 ... D1 D0 WTM: ChG's output is updated by data in D[11:0]
WRM: D[11:0] written only the data register of ChH
0 1 1 1 D11 D10 ... D1 D0 WTM: ChH's output is updated by data in D[11:0]
The special command operations can be exercised at any time regardless of the mode of operation. There are
three special command operations. The first command is exercised by setting data bits DB[15:12] to 1010. This
allows the user to update multiple DAC outputs simultaneously to the values currently loaded in their respective
control registers. This command is valuable if the user wants each DAC output to be at a different output voltage,
but still have all the DAC outputs changed to their appropriate values simultaneously (see Table 3).
The second special command allows the user to alter the DAC output of channel A with a single write frame.
This command is exercised by setting data bits DB[15:12] to 1011 and data bits DB[11:0] to the desired control
register value. This command also causes the DAC outputs of the other channels to update to their current
control register values. The user may choose to exercise this command to save a write sequence. For example,
the user may wish to update several DAC outputs simultaneously, including channel A. To accomplish this task
in the minimum number of write frames, the user would alter the control register values of all the DAC channels
except channel A while operating in WRM. The last write frame would be used to exercise the special command
Channel A Write Mode. In addition to updating the control register of channel A and output to a new value, all of
the other channels would be updated as well. At the end of this sequence of write frames, the DAC128S085
would still be operating in WRM (see Table 3).
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OUTPUT
VOLTAGE
DIGITAL INPUT CODE
00 4095
ZE
FSE
GE = FSE - ZE
FSE = GE + ZE
4095 x VA
4096
DAC128S085
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The third special command allows the user to set all the DAC control registers and outputs to the same level.
This command is commonly referred to as "broadcast" mode, as the same data bits are being broadcast to all of
the channels simultaneously. This command is exercised by setting data bits DB[15:12] to 1100 and data bits
DB[11:0] to the value that the user wishes to broadcast to all the DAC control registers. Once the command is
exercised, each DAC output is updated by the new control register value. This command is frequently used to set
all the DAC outputs to some known voltage such as 0 V, VREF/2, or Full Scale. A summary of the commands can
be found in Table 3.
Table 3. Special Command Operations
DB[15:12] DB[11:0] Description of Mode
Update Select: The DAC outputs of the channels selected with a 1 in DB[7:0]
1010 XXXXHGFEDCBA are updated simultaneously to the values in their respective control registers.
Channel A Write: The control register and DAC output of channel A are
1 0 1 1 D11 D10 ... D1 D0 updated to the data in DB[11:0]. The outputs of the other seven channels are
also updated according to their respective control register values.
Broadcast: The data in DB[11:0] is written to all channel control registers and
1 1 0 0 D11 D10 ... D1 D0 DAC output simultaneously.
8.3.7 Power-On Reset
The power-on reset circuit controls the output voltages of the eight DACs during power-up. Upon application of
power, the DAC registers are filled with zeros and the output voltages are set to 0 V. The outputs remain at 0 V
until a valid write sequence is made.
8.3.8 Transfer Characteristic
Figure 31. Input / Output Transfer Characteristic
8.4 Device Functional Modes
8.4.1 Power-Down Modes
The DAC128S085 has three power-down modes, where different output terminations can be selected (see
Table 4). With all channels powered down, the supply current drops to 0.1 µA at 3 V and 0.2 µA at 5 V. By
selecting the channels to be powered down in DB[7:0] with a 1, individual channels can be powered down
separately, or multiple channels can be powered down simultaneously. The three different output terminations
include high output impedance, 100 kΩto ground, and 2.5 kΩto ground.
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Device Functional Modes (continued)
The output amplifiers, resistor strings, and other linear circuitry are all shut down in any of the power-down
modes. The bias generator, however, is only shut down if all the channels are placed in power-down mode. The
contents of the DAC registers are unaffected when in power-down. Therefore, each DAC register maintains its
value prior to the DAC128S085 being powered down unless it is changed during the write sequence that
instructed it to recover from power down. Minimum power consumption is achieved in the power-down mode with
SYNC idled high, DIN idled low, and SCLK disabled. The time to exit power-down (Wake-Up Time) is typically 3
µsec at 3 V and 20 µsec at 5 V.
Table 4. Power-Down Modes
DB[15:12] DB[11:8] 7 6 5 4 3 2 1 0 Output Impedance
1 1 0 1 X X X X H G F E D C B A Hi-Z outputs
1 1 1 0 X X X X H G F E D C B A 100 kΩoutputs
1 1 1 1 X X X X H G F E D C B A 2.5 kΩoutputs
8.5 Programming
8.5.1 Programming the DAC128S085
This section presents the step-by-step instructions for programming the serial input register.
8.5.1.1 Updating DAC Outputs Simultaneously
When the DAC128S085 is first powered on, the DAC is operating in Write Register Mode (WRM). Operating in
WRM allows the user to program the registers of multiple DAC channels without causing the DAC outputs to be
updated. For example, below are the steps for setting Channel A to a full scale output, Channel B to three-
quarters full scale, Channel C to half-scale, Channel D to one-quarter full scale and having all the DAC outputs
update simultaneously.
As stated previously, the DAC128S085 powers up in WRM. If the device was previously operating in Write
Through Mode (WTM), an extra step to set the DAC into WRM is required. First, the DAC registers must be
programmed to the desired values. To set Channel A to an output of full scale, write 0FFF to the control register.
This updates the data register for Channel A without updating the output of Channel A. Second, set Channel B to
an output of three-quarters full scale by writing 1C00 to the control register. This updates the data register for
Channel B. Once again, the output of Channel B and Channel A are not updated, because the DAC is operating
in WRM. Third, set Channel C to half scale by writing 2800 to the control register. Fourth, set Channel D to one-
quarter full scale by writing 3400 to the control register. Finally, update all four DAC channels simultaneously by
writing A00F to the control register. This procedure allows the user to update four channels simultaneously with
five steps.
Because Channel A was one of the DACs to be updated, one command step could have been saved by writing
to Channel A last. Do this by writing to Channel B, C, and D first, and using the the special command Channel A
Write to update the DAC register and output of Channel A. This special command also updates all DAC outputs
while updating Channel A. With this sequence of commands, the user can update four channels simultaneously
using four steps. A summary of this command can be found in Table 3.
8.5.1.2 Updating DAC Outputs Independently
If the DAC128S085 is currently operating in WRM, change the mode of operation to WTM by writing 9XXX to the
control register. Once the DAC is operating in WTM, any DAC channel can be updated in one step. For example,
if a design required Channel G to be set to half scale, the user can write 6800 to the control register to update
the data register and DAC output of Channel G. Similarly, write 5FFF to the control register to set the output of
Channel F to full scale. Channel A is the only channel that has a special command that allows its DAC output to
be updated in one command, regardless of the mode of operation. Write BFFF to the control register to set the
DAC output of Channel A to full scale in one step.
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Product Folder Links: DAC128S085
DAC128C085
VOUTA
VOUTH
SCLK
SYNC
DOUT
DIN
GND
VA
Master
VDD
GND
0.1 µF4.7 µF
3.3 V
5 V
VOUTD
100
100
100
100
GPIOa
GPIOb
GPIOc
GPIOd
VREF1 VREF2
VIN
EN
VREF
GND
LM4132-4.1
4.7 µF
R
C
R
C
R
C
To Load
To Load
To Load
DAC128S085
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Using References as Power Supplies
While the simplicity of the DAC128S085 implies ease of use, it is important to recognize that the path from the
reference input (VREF1,2) to the DAC outputs has a zero Power Supply Rejection Ratio (PSRR). Therefore, the
user must provide a noise-free supply voltage to VREF1,2. To utilize the full dynamic range of the DAC128S085,
the supply pin (VA) and VREF1,2 can be connected together and share the same supply voltage. Because the
DAC128S085 consumes very little power, a reference source can be used as the reference input or the supply
voltage. The advantages of using a reference source over a voltage regulator are accuracy and stability. Some
low-noise regulators can also be used. Listed below are a few reference and power supply options for the
DAC128S085.
9.2 Typical Application
The LM4132, with its ±0.05% accuracy over temperature, is a good choice as a reference source for the
DAC128S085. The 4.096-V version is useful for a 0-V to 4.095-V output range. Bypassing the LM4132 voltage
input pin with a 4.7-µF capacitor and the voltage output pin with a 4.7-µF capacitor improves stability and
reduces output noise. The LM4132 comes in a space-saving 5-pin SOT-23.
Figure 32. The LM4132 as a Power Supply
9.2.1 Design Requirements
There are two references for the DAC128S085. One reference input serves channels A through D, while the
other reference serves channels E through H. The 16-bit input shift register of the DAC128S085 controls the
mode of operation, the power-down condition, and the register/output value of the DAC channels. All eight DAC
outputs can be updated simultaneously or individually.
9.2.2 Detailed Design Procedure
Each reference input pin can be set independently, or the reference pins can be shorted together as shown in
Figure 32. Acceptable reference voltages are 0.5 V to VA. Utilizing an RC filter on the output to roll off output
noise is optional.
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Typical Application (continued)
9.2.3 Application Curve
Figure 33. Typical Performance
10 Power Supply Recommendations
For best performance, the DAC128S085 power supply should be bypassed with at least a 1-µF and a 0.1-µF
capacitor. The 0.1-µF capacitor must be placed right at the device supply pin. The 1-µF or larger valued
capacitor can be a tantalum capacitor, while the 0.1-µF capacitor must be a ceramic capacitor with low ESL and
low ESR. If a ceramic capacitor with low ESL and low ESR is used for the 1-µF value and can be placed right at
the supply pin, the 0.1-µF capacitor can be eliminated. Capacitors of this nature typically span the same
frequency spectrum as the 0.1-µF capacitor, and thus eliminate the need for the extra capacitor. The power
supply for the DAC128S085 should only be used for analog circuits.
Avoid the crossover of analog and digital signals. This helps minimize the amount of noise from the transitions of
the digital signals from coupling onto the sensitive analog signals, such as the reference pins and the DAC
outputs.
11 Layout
11.1 Layout Guidelines
For best accuracy and minimum noise, the printed circuit board containing the DAC128S085 should have
separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes.
Both of these planes should be located in the same board layer. A single ground plane is preferred if digital
return current does not flow through the analog ground area. Frequently a single ground plane design will utilize
a "fencing" technique to prevent the mixing of analog and digital ground current. Separate ground planes should
only be utilized when the fencing technique is inadequate. The separate ground planes must be connected in
one place, preferably near the DAC128S085. Ensure that digital signals with fast edge rates do not pass over
split ground planes. The signals must always have a continuous return path below their traces.
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Product Folder Links: DAC128S085
SYNC
VOUTEVOUTA
VOUTB
VOUTC
VOUTD
VA
VREF1
SCLK
DOUT
DIN
VOUTF
VOUTG
VOUTH
GND
VREF2
GROUND PLANE
To MCU
N.C.
GND
EN
VREF
VIN
VIA to GROUND PLANE
5-V Supply Rail
To loads
To loads
DAC128S085
LM4132
DAC128S085
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11.2 Layout Example
Figure 34. Layout Example
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Specification Definitions
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB, which is VREF / 4096 = VA/ 4096.
DAC-to-DAC CROSSTALK is the glitch impulse transferred to a DAC output in response to a full-scale change
in the output of another DAC.
DIGITAL CROSSTALK is the glitch impulse transferred to a DAC output at mid-scale in response to a full-scale
change in the input register of another DAC.
DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital
inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the
data bus.
FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded
into the DAC and the value of VAx 4095 / 4096.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and
Full-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is
Zero Error.
GLITCH IMPULSE is the energy injected into the analog output when the input code to the DAC register
changes. It is specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line
is measured from the center of that code value. The end point method is used. INL for this product
is specified over a limited range, per the Electrical Tables.
LEAST SIGNIFICANT BIT (LSB) is the bit that has the smallest value or weight of all bits in a word. This value
is
LSB = VREF / 2n
where
• VREF is the supply voltage for this product, and n is the DAC resolution in bits, which is 12 for the
DAC128S085. (3)
MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output
stability maintained.
MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when
the input code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is
1/2 of VA.
MULTIPLYING BANDWIDTH is the frequency at which the output amplitude falls 3 dB below the input sine
wave on VREF1,2 with the DAC code at full-scale.
NOISE SPECTRAL DENSITY is the internally generated random noise. It is measured by loading the DAC to
mid-scale and measuring the noise at the output.
POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from
the power supply. The difference between the supply and output currents is the power consumed
by the device without a load.
SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is
updated.
TOTAL HARMONIC DISTORTION PLUS NOISE (THD+N) is the ratio of the harmonics plus the noise present
at the output of the DACs to the rms level of an ideal sine wave applied to VREF1,2 with the DAC
code at mid-scale.
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Device Support (continued)
WAKE-UP TIME is the time for the output to exit power-down mode. This is the time from the rising edge of
SYNC to when the output voltage deviates from the power-down voltage of 0 V.
ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been
entered.
12.2 Documentation Support
12.2.1 Related Documentation
•LM4132 SOT-23 Precision Low Dropout Voltage Reference,SNVS372
12.3 Trademarks
SPI is a trademark of Motorola, Inc..
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
26 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated
Product Folder Links: DAC128S085
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DAC128S085CIMT/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 X78C
DAC128S085CIMTX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 X78C
DAC128S085CISQ/NOPB ACTIVE WQFN RGH 16 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 128S085
DAC128S085CISQX/NOPB ACTIVE WQFN RGH 16 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 128S085
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DAC128S085CIMTX/NOP
BTSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
DAC128S085CISQ/NOPB WQFN RGH 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
DAC128S085CISQX/NOP
BWQFN RGH 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jul-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DAC128S085CIMTX/NOP
BTSSOP PW 16 2500 367.0 367.0 35.0
DAC128S085CISQ/NOPB WQFN RGH 16 1000 210.0 185.0 35.0
DAC128S085CISQX/NOP
BWQFN RGH 16 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jul-2018
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
SEE TERMINAL
DETAIL
16X 0.3
0.2
2.6 0.1
16X 0.5
0.3
0.8 MAX
(A) TYP
0.05
0.00
12X 0.5
4X
1.5
B4.1
3.9 A
4.1
3.9 0.3
0.2
0.5
0.3
WQFN - 0.8 mm max heightRGH0016A
PLASTIC QUAD FLATPACK - NO LEAD
4214978/B 01/2017
DIM A
OPT 1 OPT 1
(0.1) (0.2)
PIN 1 INDEX AREA
0.08
SEATING PLANE
1
49
12
58
16 13
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05
EXPOSED
THERMAL PAD
17 SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
SCALE 3.000
DETAIL
OPTIONAL TERMINAL
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
16X (0.25)
16X (0.6)
( 0.2) TYP
VIA
12X (0.5)
(3.8)
(3.8)
(1)
( 2.6)
(R0.05)
TYP
(1)
WQFN - 0.8 mm max heightRGH0016A
PLASTIC QUAD FLATPACK - NO LEAD
4214978/B 01/2017
SYMM
1
4
58
9
12
13
16
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
17
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
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EXAMPLE STENCIL DESIGN
16X (0.6)
16X (0.25)
12X (0.5)
(3.8)
(3.8)
4X ( 1.15)
(0.675)
TYP
(0.675) TYP
(R0.05)
TYP
WQFN - 0.8 mm max heightRGH0016A
PLASTIC QUAD FLATPACK - NO LEAD
4214978/B 01/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SYMM
TYP
EXPOSED METAL
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
4
58
9
12
13
16
17
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PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
BNOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
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