2001-2012 Microchip Technology Inc. DS21393D-page 1
TC1426/TC1427/TC1428
Features:
•Low Cost
• Latch-Up Protected: Will Withstand 500 mA
Reverse Outpu t Current
• ESD Protected ±2kV
• High Peak Output Current: 1.2A
• Wide Operating Range:
- 4.5V to 16V
• High Cap aciti ve Load Drive Cap ability : 1000 pF in
38 nsec
• Low Delay Time: 75 nsec Max
• Logic Input Threshold Independent of Supply
Voltage
• Output Voltage Swing to Within 25 mV of Ground
or VDD
• Low Output Impedance: 8
Applications:
• Power MOSFET Drivers
• Switched Mode Power Supplies
• Pulse Transformer Drive
• Small Motor Controls
• Print Head Drive
Device Selection Table
Package Type
General Description:
The TC1 426/TC1427/ TC1428 are a family of 1.2A dual
high-speed drivers. CMOS fabrication is used for low-
power consumpt ion and high efficiency.
These d evices are fabrica ted usin g an epi taxial l ayer to
effectively short out the intrinsic parasitic transistor
responsible for CMOS latch-up. They incorporate a
number of other design and process refinements to
increase their long-term reliability.
The TC1426 is compatible with the bipolar DS0026, but
only draws 1/5 of the quiescent current. The TC1426/
TC1427/TC1428 are also compatible with the TC426/
TC427/ TC428, but wit h 1.2A peak out put current rath er
than the 1.5A of the TC426/TC 42 7/T C428 devices.
Other compatible drivers are the TC4426/TC4427/
TC4428 and the TC4426A/TC4427A/TC4428A. The
TC4426/TC4427/TC4428 have the added feature that
the inp ut s can with sta nd ne gat ive v olt age u p to 5 V wi th
diode protection circuits. The TC4426A/TC4427A/
TC4428A have matched input to output leading edge
and falling edge delays, tD1 and tD2, for processing
short dura tion pulses in t he 25 nanosec on ds rang e. Al l
of the above drivers are pin compatible.
The high-input impedance TC1426/TC1427/TC1428
drive rs are CMO S/TTL input-co mpatible , do not require
the speed-up needed by the bipolar devices, and can
be directly driven by most PWM ICs.
This fam ily of d ev ic es i s av ai la ble in inverting and non-
inverting versions. Specifications have been optimized
to achieve low-cost and high-performance devices,
well-suited for the high-volume manufacturer.
Part Number Package Temp. Range
TC1426COA 8-Pin SOIC 0°C to +70°C
TC1426CPA 8-Pin PDIP 0°C to +70°C
TC1427COA 8-Pin SOIC 0°C to +70°C
TC1427CPA 8-Pin PDIP 0°C to +70°C
TC1428COA 8-Pin SOIC 0°C to +70°C
TC1428CPA 8-Pin PDIP 0°C to +70°C
TC1426CPA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
V
DD
2, 4 7, 5
Inverting
TC1427CPA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
2, 4 7, 5
Noninverting
TC1428CPA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
27
45
V
DD
V
DD
TC1426COA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
V
DD
NC = No connection
2, 4 7, 5
Inverting
TC1427COA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
2, 4 7, 5
Noninverting
TC1428COA
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
27
45
V
DD
V
DD
8-Pin PDIP/SOIC
1.2A Dual High-Speed MOSFET Drivers
TC1426/TC1427/TC1428
DS21393D-page 2 2001-2012 Microchip Technology Inc.
Functional Block Diagram
Input
V+
≈2.5 μA
≈500 μA
NOTE: TC1428 has one inverting and one noninverting driver.
Ground any unused driver input.
Inverting
Output
Noninverting
Output
(TC1426)(TC1427)
GND
TC1426 Inverting
TC1427 Noninverting
TC1428 Inverting/Noninverting
2001-2012 Microchip Technology Inc. DS21393D-page 3
TC1426/TC1427/TC1428
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage.....................................................+18V
Input Voltage, Any Terminal
...................................VDD + 0.3V to GND – 0.3V
Power Dissipation (TA 70°C)
PDIP........................................................730 mW
SOIC .......................................................470 mW
Derating Factor
PDIP.......................................................8 mW/C
SOIC ......................................................4 mW/C
Operating Temperature Range
C Version ........................................0°C to +70°C
Storage Temperature Range..............-65°C to +150°C
*Stresses above those listed under "Absolute
Maximum Ratings" may cause permanent damage to
the devi ce. These are stress ratin gs only and fun ctional
operatio n of the devic e at these or an y other con ditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, with 4.5V VDD16V, unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 3 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Inpu t C u r re n t -1 — 1 A0VVINVDD
Output
VOH High Output V oltage VDD – 0.025 — — V Figure 3-1, Figure 3-2
VOL Low Output Voltage — — 0.025 V Figure 3-1 , Figure 3-2
ROOutput Resistance —
—12
818
12 IOUT = 10 mA, VDD = 16V
IPK Peak Output Current — 1.2 — A
IREV Latch-Up Current
Withstand Reverse Current — >500 — mA
Switching Time (Note 1)
tRRise Time — — 35 nsec Figure 3-1 , Figure 3-2
tFFall Time — — 25 nsec Figure 3-1 , Figure 3-2
tD1 Delay Time — — 75 nsec Figure 3-1 , Figure 3-2
tD2 Delay Time — — 75 nsec Figure 3-1 , Figure 3-2
Power Supply
ISPower Supply Current —
——
—9
0.5 mA VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Note 1: Switching times ensured by design.
TC1426/TC1427/TC1428
DS21393D-page 4 2001-2012 Microchip Technology Inc.
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD16V, unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
Input
VIH Logic 1, High Input Voltage 3 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current -10 — 10 A0VVINVDD
Output
VOH High Output V oltage VDD – 0.025 — — V Figure 3-1, Figure 3-2
VOL Low Output Voltage — — 0.025 V Figure 3-1 , Figure 3-2
ROOutput Resistance —
—15
10 23
18 IOUT = 10 mA, VDD = 16V
IREV Latch-Up Current
Withstand Reverse Current — >500 — mA
Switching Time (Note 1)
tRRise Time — — 60 nsec Figure 3-1 , Figure 3-2
tFFall Time — — 40 nsec Figure 3-1 , Figure 3-2
tD1 Delay Time — — 125 nsec Figure 3-1 , Figure 3-2
tD2 Delay Time — — 125 nsec Figure 3-1 , Figure 3-2
Power Supply
ISPower Supply Current —
——
—13
0.7 mA VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Note 1: Switching times ensured by design.
2001-2012 Microchip Technology Inc. DS21393D-page 5
TC1426/TC1427/TC1428
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-P in PD I P,
SOIC) Symbol Description
1 NC No connecti on.
2 IN A Control input A, TTL/CMOS compatible logic input.
3 GND Ground.
4 IN B Control input B, TTL/CMOS compatible logic input.
5 O UT B Output B, CMOS totem-pole output.
6V
DD Supply input, 4.5V to 16V.
7 O UT A Output A, CMOS totem-pole output.
8 NC No connecti on.
TC1426/TC1427/TC1428
DS21393D-page 6 2001-2012 Microchip Technology Inc.
3.0 APPLICATIONS INFORMATION
3.1 SUPPLY BYPASSING
Large currents are required to charge and discharge
cap acitiv e load s q uickl y. For example , chargi ng a 100 0
pF load to 16V in 25 nsec requires a 0.8A current from
the devic e' s power supply.
To ensure low supply impedance over a wide fre quency
range, a parallel capacitor combination is recom-
mended for supply bypassing . Low-indu ctance c eramic
MLC capacitors with short lead lengths (<0.5-in.)
should be used. A 1.0 F film capacitor in parallel with
one or two 0.1 F ceramic MLC capacitors normally
provides adequate bypassing.
3.2 GROUNDING
The TC1426 and TC1428 contain inverting drivers.
Individual ground returns for the input and output
circuits or a ground plane should be used. This will
reduce negative feedback that causes degradation in
switching speed characteristics.
FIGURE 3-1: Inverting Driver Swit ching
Time
3.3 INPUT STAGE
The input voltage level changes the no-load or
quiescent supply current. The N-channel MOSFET
input stage transistor drives a 2.5 mA current source
load. With a logic ‘1’ input, the maximum quiescent
supply current is 9 mA. Logic ‘0’ input level signals
reduce q uiescent curre nt to 500 A maximum. Unused
driver inputs must be connected to VDD or GND.
Minimum power dissipation occurs for logic ‘0’ inputs
for the TC1426/TC1427/TC1428.
The drivers are designed with 100 mV of hysteresis.
This provides clean transitions and minimizes output
stage current spiking when changing states. Input
voltage thresholds are approximately 1.5V, making a
logic ‘1’ input any voltage greater than 1.5V up to VDD.
Input current is less than 1 A over this range.
The TC1426/TC1427/TC1428 may be directly driven
by the TL494, SG1526/27, TC38C42, TC170 and
similar switch-mode power supply integrated circuits.
FIGURE 3-2: Noninver ti ng Driver
Switching Time
+5V
10%
90%
10%
90%
10%
90%
V
DD
1 μF
WIMA
MKS-2
0V
0V
TC1426
(1/2 TC1428)
1
2
Test Circuit
0.1 μF MLC
Input
V
DD
= 16V
Output
t
R
C
L
= 1000 pF
t
D1
t
F
t
D2
Input
Output
V
DD
0.1 μF MLC
Input
V
DD
= 16V
Output
t
R
C
L
= 1000 pF
t
D1
t
F
t
D2
Input
Output
90%
10%
10% 10%
90%
1 μF
WIMA
MKS-2
TC1427
(1/2 TC1428)
+5V
0V
0V
90%
Test Circuit
1
2
2001-2012 Microchip Technology Inc. DS21393D-page 7
TC1426/TC1427/TC1428
4.0 TYPICAL CHARACTERISTICS
Note: The graphs a nd t a bl es p r ov ide d fo llo w ing thi s n ote are a st a tis tic al summary bas ed on a lim ited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
550
440
330
220
110
0
579111315
TIME (nsec)
V
DD
(V)
10,000 pF
4700 pF
2200 pF
Rise Time vs. Supply Voltage
330
264
198
132
66
0
TIME (nsec)
10,000 pF
2200 pF
4700 pF
57 9111315
Fall Time vs. Supply Voltage
t
D1
TIME (nsec)
57911 13 15
80
70
60
50
40
30
Delay Time vs. Supply Voltage
T
A
= +25°C T
A
= +25°C C
L
= 1000 pF
T
A
= +25°C
V
DD
(V) V
DD
(V)
t
D2
40
32
24
16
8
0
25 45 65 85 105 125
TEMPERATURE (°C)
TIME (nsec)
Rise and Fall Times vs. Temperature
60
54
48
42
36
0
25 45 65 85 105 125
TEMPERATURE (°C)
TIME (nsec)
Delay Time vs. Temperature
30
24
18
12
6
0
100 520 940 1360 1780 2200
SUPPLY CURRENT (mA)
CAPACITIVE LOAD (pF)
500 kHz
200 kHz
20 kHz
Supply Current vs. Capacitive Load
CL = 1000 pF
VDD = +15V
TA = +25°C
CL = 1000 pF
VDD = +15V
CL = 1000 pF
VDD = +15V
tD1
tD2
tFALL
tRISE
CAPACITIVE LOAD (pF)
100 1000 10,000
1000
100
10
10
V
DD
TIME (nsec)
5
V
DD
15
V
DD
Rise Time vs. Capacitive Load
1000
100
10
100 1000 10,000
CAPACITIVE LOAD (pF)
TIME (nsec)
5 V
DD
10 V
DD
Fall Time vs. Capacitive Load
15V
DD
100
80
60
40
20
0
10 100 1000 10,000
V
DD
= 15V
V
DD
= 10V
V = 5V
DD
FREQUENCY (kHz)
SUPPLY CURRENT (mA)
Supply Current vs. Frequency
C
L
= 1000 pF
T
A
= +25°C
T
A
= +25°C T
A
= +25°C
TC1426/TC1427/TC1428
DS21393D-page 8 2001-2012 Microchip Technology Inc.
TYPICAL CHARACTERISTICS (CONTINUED)
100 mA
50 mA
10 mA
15
13
11
9
7
5
579111315
OUT (Ω)R
Low-State Output Resistance
50
42
34
26
18
10
579111315
100 mA
50 mA
10 mA
High-State Output Resistance
ROUT (Ω)
10-8
A (sec)
10-9
10-10
4 6 8 1012141618
Crossover Energy Loss
TA = +25°C TA = +25°C
V
DD
(V) V
DD
(V) V
DD
(V)
20
15
10
5
0
0 50 100 150 200 300 400
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (μA)
Quiescent Power Supply
Current vs. Supply Voltage
BOTH INPUTS LOGIC ‘0’20
15
10
5
0
1234 56
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
BOTH INPUTS LOGIC ‘1’
Quiescent Power Supply
Current vs. Supply Voltage
200
0
400
600
800
1000
1200
1400
1600
0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (°C)
MAX. POWER (mW)
8 Pin DIP
Thermal Derating Curves
8 Pin SOIC
2001-2012 Microchip Technology Inc. DS21393D-page 9
TC1426/TC1427/TC1428
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Pack age marking data not available at th is time.
5.2 Taping Form
TC1426/TC1427/TC1428
DS21393D-page 10 2001-2012 Microchip Technology Inc.
5.3 Package Dimensions
3° Min.
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.040 (1.02)
.020 (0.51) .015 (0.38)
.008 (0.20)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.310 (7.87)
8-Pin Plastic DIP
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21393D-page 11
TC1426/TC1427/TC1428
.050 (1.27) Typ.
8
°
Max.
Pin 1
.244 (6.20)
.228 (5.79)
.157 (3.99)
.150 (3.81)
.197 (5.00)
.189 (4.80)
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.069 (1.75)
.053 (1.35) .010 (0.25)
.007 (0.18)
.050 (1.27)
.016 (0.40)
8-Pin SOIC
Dimensions: inches (mm)
Note: For the most cu rr e nt pac ka ge dr aw i ngs, p le ase se e t he Mi c ro c hi p Pa ck ag ing Specifica t i on lo ca t ed
at http://www.microchip.com/packaging
TC1426/TC1427/TC1428
DS21393D-page 12 2001-2012 Microchip Technology Inc.
6.0 REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc. DS21393D-page 13
TC1426/TC1427/TC1428
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microchip.com. Thi s web site is used as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online dis cu ss io n gr oups, Micro chi p con sul t an t
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of interes t.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is a vailable through the web si te
at: http://microchip.com/support
TC1426/TC1427/TC1428
DS21393D-page 14 2001-2012 Microchip Technology Inc.
READER RESP ONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS21393DTC1426/TC1427/TC1428
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2001-2012 Microchip Technology Inc. DS21393D-page 15
Information contained in this publication regarding device
applications a nd the lik e is provided only f or yo ur convenience
and may be supers ed ed by u pda t es . It is y our responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PI C32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Contr ol Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Stor age Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE, In -Circuit Seria l
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MP LAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germ any II GmbH & C o. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767887
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of t he most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21393D-page 16 2001-2012 Microchip Technology Inc.
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Su pport:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasc a , IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5 511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohs iung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-14 4-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Mad rid
Tel: 34-91-708-08-90
Fax: 34-91-708-08 -91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921- 5820
Worldwide Sales and Service
11/27/12
