G•SiC® Technology
MegaBright LEDs
Cxxx-MB290-S0100
Maximum Ratings at TA = 25°C Notes 1&3 Cxxx-MB290-S0100
DC Forward Current 30mA
Peak Forward Current (1/10 duty cycle @ 1kHz) 100mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -20°C to +80°C
Storage Temperature Range -30°C to +100°C
Electrostatic Discharge Threshold (HBM) Note 2 400 V
Electrostatic Discharge Classification (MIL-STD-883E) Note 2 Class 1
Typical Electrical/Optical Characteristics at TA = 25°C, If = 20mA Note 3
Part Number
Forward Voltage
(Vf, V)
Reverse Current
[I(Vr=5V), µA]
Peak Wavelength
(λp, nm)
Optical Rise Time
(τ, ns)
Typ Max Max Min Typ Max Typ
C395-MB290-S0100 3.7 4.0 10 390 395 400 30
C400-MB290-S0100 3.7 4.0 10 390 400 410 30
C405-MB290-S0100 3.7 4.0 10 400 405 410 30
Mechanical Specifications Note 4 Cxxx-MB290-S0100
Description Dimension Tolerance
P-N Junction Area (µm) 240 x 240 ± 25
Top Area (µm) 300 x 300 ± 25
Bottom Area (µm) 200 x 200 ± 25
Chip Thickness (µm) 250 ± 25
Au Bond Pad Diameter (µm) 114 ± 20
Au Bond Pad Thickness (µm) 1.2 ± 0.5
Back Contact Metal Width (µm) 19.8 -5, +10
Notes:
1) Maximum ratings are package dependent. The above ratings were determ ined using a T-1 3/4 package with Hysol OS1600 epoxy for characterization.
Seller makes no representations regarding ratings for packages other than the T-1 3/4 package used by Seller. The forward currents (DC and Peak) are
not limited by the G•SiC die but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of
the T-1 3/4 package; junction temperatur e should be characterized in a specific package to determine limitations. Assembly processing temperature
must not exceed 325°C (< 5 seconds).
2) Product resistance to electrostatic discharge (ESD) is measured by simulating ESD using a rapid avalanche energy test (RAE T ). The RAET procedures
are designed to approximate the maximum ESD ratings shown. Seller gives no other assurances regarding the ability of Products to withstand ESD.
3) All Products conform to the listed minimum and maximum specifications for electrical and optical characteristics, when assembled and operated at 20
mA within the maximum ratings shown above. Efficiency decreases at higher curr e nts. Typical values given are the average values expected by Seller
in large quantities and are provided for information only. Seller gives no assurances Products shipped will exhibit such typical ratings. All
measurements were ma de using lamps in T-1 3/4 packages with Hysol OS1600 epoxy.
4) All Products conform to the listed mechanical specifications within the tolerances shown.
5) Caution: To obtain optimum output ef ficiency, the maxim um height of die attach epoxy on the side of the chip should not exc eed 80µm.
CPR3BE Rev. -
© Cree, Inc. 2003 All Rights Reserved.