Publication Release Date: April 21, 2005
- 1 - Revision 1.1
ISD1200 SERIES
SINGLE-CHIP,
VOICE RECORD/PLAYBACK DEVICES
10- AND 12-SECOND DURATION
ISD1200 SERIES
- 2 -
1. GENERAL DESCRIPTION
Winbond’s ChipCorder® ISD1200 series provide high-quality, single-chip, Record/Playback solutions
to 10- and 12-second messaging applications. The CMOS devices include an on-chip oscillator,
microphone preamplifier, automatic gain control, antialiasing filter, smoothing filter, and speaker
amplifier. A minimum Record/Playback subsystem can be configured with a microphone, a speaker,
several passive components, two push buttons, and a power source. Recordings are stored into on-
chip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip
solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Voice
and audio signals are stored directly into memory in their natural form, providing high-quality, solid-
state voice reproduction.
2. FEATURES
Single +5 volt power supply
Single-chip with 10 and 12 seconds duration
Easy-to-use single-chip, voice record/playback solution
Push-button interface
o Playback can be edge- or level activated
Fully addressable to handle multiple messages
Automatic power-down mode
o Enters standby automatically following a record or playback cycle
o Standby current 0.5 µA (typical)
Zero-power message storage
o Eliminates battery backup circuits
High-quality, natural voice/audio reproduction
On-chip oscillator
No programmer or development system needed
100,000 record cycles (typical)
100-year message retention (typical)
Available in die, PDIP, and SOIC
Temperature: Commercial - Packaged unit : 0°C to 70°C, Die : 0°C to 50°C
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 3 - Revision 1.1
3. BLOCK DIAGRAM
Internal Clock Timing
Sampling Clock
64K Cell
Nonvolatile
Multilevel Storage
Array
Analog Transceivers
Decoders
Device ControlPower Conditioning
Automatic
Gain Control
(AGC)
5-Pole Active
Antialiasing Filter
5-Pole Active
Smoothing Filter Amp
Pre-
Amp
SP +
SP -
RECLEDPLAYLPLAYEREC
VCCA VSSA VSSD VCCD
AGC
MIC REF
MIC
XCLK
AmpANA IN
ANA OUT
Address Buffers
A0 A1 A2 A3 A4 A5 A6 A7
ISD1200 SERIES
- 4 -
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS ...................................................................................................................... 4
5. PIN CONFIGURATION ....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................12
8. TIMING DIAGRAMS.......................................................................................................................... 13
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 14
9.1 Operating Conditions ................................................................................................................... 15
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 16
10.1. Parameters For Packaged Parts .............................................................................................. 16
10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 19
10.2. Parameters For DIE.................................................................................................................. 20
10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 23
11. TYPICAL APPLICATION CIRCUIT.................................................................................................24
12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 27
12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC)...................................................................... 27
12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 28
12.3. Die Physical Layout[1]................................................................................................................ 29
13. ORDERING INFORMATION........................................................................................................... 31
14. VERSION HISTORY ....................................................................................................................... 32
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 5 - Revision 1.1
5. PIN CONFIGURATION
SOIC / PDIP
A0
A1
A2
A3
A4
A5
NC
NC
A6
A7
NC
VSSD
VSSA
SP +
REC
XCLK
RECLED
PLAYE
PLAYL
NC
ANA OUT
ANA IN
AGC
MIC REF
MIC
VCCA
SP-
VCCD
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Note: NC means must No connect
ISD1200 SERIES
- 6 -
6. PIN DESCRIPTION
PIN NAME PIN NO. FUNCTION
A0-A7 1-6, 9, 10 Address Inputs: The address inputs have two functions,
depending on the level of the two Most Significant Bits (MSB)
of the address (A6 and A7).
If either or both of the two MSBs are LOW, all inputs are
interpreted as address bits and are used as the start address
for the current record or playback cycle. The address pins are
inputs only and do not output internal address information as
the operation progresses. Address inputs are latched by the
falling edge of PLAYE , PLAYL , or REC .
If both A6 & A7 are HIGH, then the device is in special
operational modes. Please refer to operational modes section
for details.
VSSA, VSSD 12, 13
Ground: Similar to VCCA and VCCD, separate analog and digital
ground rails provide independent analog and digital ground
buses internally to minimize noise. These pins should be tied
together as close as possible to the device.
SP+, SP- 14, 15 Speaker Outputs: The differential SP+ and SP- pins are
designed to drive a 16 speaker and no coupling capacitor is
required. Conversely, with single-ended connection, a
coupling capacitor is needed between the SP pin and the
speaker. Besides, the output power is about a quarter of that
from differential output. The speaker outputs are in high-
impedance state during recording and at VSSA during power
down.
VCCA, VCCD 16, 28
Supply Voltages: Separate analog and digital power rails
provide power to internal analog and digital circuits
respectively to minimize internal noises. These power buses
are brought out to separate pads and should be tied together
as close to the supply source as possible. It is important that
the power supplies are decoupled as close to the device as
possible.
MIC 17
Microphone: The microphone input transfers its signal to the
on-chip preamplifier. An on-chip Automatic Gain Control
(AGC) circuit controls the gain of this preamplifier from –15 to
24dB. An external microphone should be AC coupled to this
pin via a series capacitor. The capacitor value, together with
the internal 10 K resistance on this pin, determines the low-
frequency cutoff for the device passband. See Winbond’s
Application Information for additional information on low-
frequency cutoff calculation.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 7 - Revision 1.1
PIN NAME PIN NO. FUNCTION
MIC REF 18 Microphone Reference: The MIC REF input is the inverting
input to the microphone preamplifier. This provides a noise-
canceling or common-mode rejection input to the device when
connected to a differential microphone.
AGC 19
Automatic Gain Control (AGC): The AGC input dynamically
adjusts the gain of the preamplifier to compensate for the wide
range of microphone input levels. The AGC allows the full
range of sound, from whispers to loud sounds, to be recorded
with minimal distortion. The “attack” time is determined by the
time constant of a 5 K internal resistance and an external
capacitor (C6 of Figure 5 in Section 11) connected from the
AGC pin to VSSA. The “release” time is determined by the time
constant of an external resistor (R5) and an external capacitor
(C6) connected in parallel between the AGC pin and VSSA pin.
Nominal values of 470 K and 4.7 µF give satisfactory results
in most cases. Tying this to ground gives maximum gain,
while tying it to VCCA gives minimum gain for the AGC
amplifier.
ANA IN 20 Analog Input: The ANA IN transfers an input signal to the
chip for recording. For microphone usage, this ANA IN pin
should be connected via an external capacitor to the ANA
OUT pin. This capacitor value, together with the 3 K input
impedance of ANA IN, is selected to give additional cutoff at
the low-frequency end of the voice passband. If the desired
input is derived from a source other than a microphone, the
signal can be capacitively coupled into the ANA IN pin directly.
ANA OUT 21 Analog Output: This pin provides the preamplifier output to
the user. The voltage gain of the preamplifier is determined by
the voltage level at the AGC pin.
PLAYL [2] 23 Playback, Level-Activated: When this input signal is held
LOW, a playback cycle is initiated, and playback continues
until PLAYL is pulled HIGH, or an EOM marker is detected.
The device automatically powers down and enters into
standby mode upon completion of a playback cycle.
PLAYE [2] 24 Playback, Edge-Activated: When a LOW-going transition is
detected on this pin, a playback cycle begins. Taking PLAYE
HIGH during a playback cycle will not terminate the current
cycle. Playback continues until an EOM is encountered. Upon
completion of a playback cycle, the device automatically
powers down and enters into standby mode.
ISD1200 SERIES
- 8 -
PIN NAME PIN NO. FUNCTION
RECLED 25 Record LED: The RECLED output is LOW during a record
cycle. It can be used to drive an LED to indicate a record cycle
is in progress. In addition, RECLED pulses LOW
momentarily when an end-of-message is encountered in a
playback operation.
XCLK 26
External Clock: The external clock input has an internal pull-
down resistor. The ISD1100 is configured at the factory with
an internal sampling clock frequency that guarantees its
minimum nominal record/playback time. For instance, an
ISD1110 operating within specification will be observed to
always have a minimum of 10 seconds of recording time. The
sampling frequency is then maintained to a variation of ±2.25
percent over the commercial temperature and operating
voltage ranges while still maintaining the minimum duration
specified. As a result some devices will have a few percent
more than nominal recording time. If greater precision is
required, the device can be clocked through the XCLK pin as
follows:
EXTERNAL CLOCK SAMPLE RATES
Part Number Sample Rate Required Clock
ISD1110 6.4 kHz 819.2 kHz
ISD1112 5.3 kHz 682.7 kHz
These recommended clock rates should not be varied
because the anti-aliasing and smoothing filters are fixed, and
aliasing problems can occur if the sample rate differs from the
one recommended. The duty cycle on the input clock is not
critical, as the clock is immediately divided by two. If the
XCLK is not used, this pin must be grounded. Please see
Application Information for the ISD1100 series for more details
on external clocking.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 9 - Revision 1.1
PIN NAME PIN NO. FUNCTION
REC [1] 27 Record: The REC input is an active-LOW signal. The device
records whenever REC is LOW. This signal must remain
LOW for the duration of the recording. A record cycle is
completed when REC is pulled HIGH or the memory space
is filled up.
REC takes precedence over either playback ( PLAYE or
PLAYL ) signal. If REC is pulled LOW during a playback
cycle, the playback immediately ceases and recording begins.
An end-of-message (EOM) marker is internally recorded,
enabling a subsequent playback cycle to terminate
appropriately. The device automatically powers down into
standby mode when REC goes HIGH.
NC 11
NC: No connect
Notes:
[1] The REC signal is debounced for 50 ms on the rising edge to prevent a false retriggering from a push-
button switch.
[2] During playback, if either PLAYE or PLAYL is held LOW during EOM or OVF, the device will still
enter into standby mode and the internal oscillator and timing generator will stop. However, the rising
edge of PLAYE and PLAYL are not debounced and any subsequent falling edge (particularly switch
bounce) present on the input pins will initiate another playback.
ISD1200 SERIES
- 10 -
7. FUNCTIONAL DESCRIPTION
7.1. DETAILED DESCRIPTION
Speech/Sound Quality
Winbond’s patented ChipCorder® technology provides natural audio record and playback. The
ISD1200 series includes devices offered at 5.3 and 6.4 kHz sampling frequencies, allowing the user a
choice of speech quality options. The input voice signals are stored directly in nonvolatile EEPROM
cells and are reproduced without the synthetic effect often heard with digital solid-state speech
solutions. A complete sample is stored in a single cell, minimizing the memory necessary to store a
recording of a given duration.
Duration
To meet end system requirements, the ISD1200 series offers single-chip solutions at 10 and 12
seconds.
TABLE 1: ISD1200 SERIES SUMMARY
Part Number Duration
(Seconds)
Input Sample
Rate (kHz)
Typical Filter Pass
Band* (kHz)
ISD1210 10 6.4 2.6
ISD1212 12 5.3 2.2
* 3dB roll-off-point….
EEPROM Storage
One of the benefits of Winbond’s ChipCorder® technology is the use of on-chip non-volatile memory,
providing zero-power message storage. The message is retained for up to 100 years typically without
power. In addition, the device can be re-recorded typically over 100,000 times.
Basic Operation
The ISD1200 ChipCorder® series devices are controlled by a single record signal, REC , and either of
two push-button control playback signals, PLAYE (edge-activated playback), and PLAYL (level-
activated playback). The ISD1200 series parts are configured for simplicity of design in a
single/multiple-message application. Using the address lines will allow multiple message applications.
Automatic Power-Down Mode
At the end of a playback or record cycle, the ISD1200 series devices automatically return to a low-
power standby mode, consuming typically 0.5 µA. During a playback cycle, the device powers down
automatically at the end of the message. During a record cycle, the device powers down immediately
after REC is pulled HIGH.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 11 - Revision 1.1
Addressing
In addition to single message application, the ISD1200 series provides a full addressing capability.
The ISD1200 series storage array has 80 distinct addressable segments, providing the following
resolutions per segment. See Application Information for ISD1200 address tables.
TABLE 2: DEVICE PLAYBACK/RECORD DURATIONS
Part Number Minimum Duration (Seconds)
ISD1210 125 ms
ISD1212 150 ms
7.2. OPERATIONAL MODES
The ISD1200 series is designed with several built-in operational modes provided to allow maximum
functionality with a minimum of additional components, described in details below. The operational
modes use the address pins on the ISD1200 devices, but are mapped outside the valid address
range. When the two Most Significant Bits (MSBs) are HIGH (A6 and A7), the remaining address
signals are interpreted as mode bits and not as address bits. Therefore, operational modes and direct
addressing are not compatible and cannot be used simultaneously.
There are two important considerations for using operational modes. Firstly, all operations begin
initially at address 0, which is the beginning address of the ISD1200. Later operations can begin at the
other address locations, depending on the operational mode(s) chosen. In addition, the address
pointer is reset to 0 when the device is changed from record to playback but not from playback to
record when A4 is HIGH in Operational Mode.
Secondly, an Operational Mode is executed when any of the control inputs, PLAYE , PLAYL , or
REC , go LOW and the two MSBs are HIGH. This Operational Modes remains in effect until the next
LOW-going control input signal, at which point the current address/mode levels are sampled and
executed.
Note: The two MSBs (A6 & A7) are pins 9 and 10 for ISD1200 series.
ISD1200 SERIES
- 12 -
7.2.1. Operational Modes Description
The Operational Modes can be used in conjunction with a microcontroller, or they can be hardwired to
provide the desired system operation.
A0 – Message Cueing
Message Cueing allows the user to skip through messages, without knowing the actual physical
address of each message. Each control input LOW pulse causes the internal address pointer to skip
to the next message. This mode should be used for playback only, and is typically used with A4
Operational Mode.
A1 – Delete EOM Markers
The A1 Operational Modes allows sequentially recorded message to be combined into a single
message with only one EOM marker set at the end of the final message. When this operational mode
is configured, messages recorded sequentially are played back as one continuous message.
A2 – Unused
A3 – Message Looping
The A3 Operational Mode allows for the automatic, continuously repeated playback of the message
located at the beginning of the address space.
A Message can completely fill the ISD1200 device and will loop from beginning to end. Pulsing
PLAYE will start the playback and pulsing PLAYL wil end the playback.
A4 – Consecutive Addressing
During normal operations, the address pointer will reset when a message is played through to an
EOM marker. The A4 Operational Mode inhibits the address pointer reset, allowing messages to be
recorded or played back consecutively. When the device is in a static state; i.e., not recording or
playing back, momentarily taking this pin LOW will reset the address counter to zero.
A5 – Unused
TABLE 3: OPERATIONAL MODES TABLE
Address Crtl.
HIGH
Function Typical Use Jointly
Compatible*
A0 Message cueing Fast-forward through messages A4
A1 Delete EOM markers Position EOM marker at the end of the last message A3, A4
A2 Unused
A3 Looping Continuous playback from Address 0 A1
A4 Consecutive addressing Record/play multiple consecutive messages A0, A1
A5 Unused
Note: An asterisk [*] Indicates additional operational modes that can be used simultaneously with the given mode.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 13 - Revision 1.1
8. TIMING DIAGRAMS
A0-A7
THOLD
TSET TSET
THOLD
REC
TREC TREC
RECLED
TLED1 TLED2
MIC
ANA IN
TRPUD TRPDD
FIGURE 1: RECORD
REC
PLAYL
PLAYE
A0-A7
SP+/-
TPLAY
THOLD
TSET
TEOM
TPPUD
RECLED
TSET TSET
THOLD THOLD
TPPDD
TPPDD TPPUD
TEOM
(1)
(2)
1. REC must be HIGH for the entire duration of a playback cycle.
2. RECLED funstions as an EOM playback.
FIGURE 2: PLAYBACK
ISD1200 SERIES
- 14 -
9. ABSOLUTE MAXIMUM RATINGS1
TABLE 4: ABSOLUTE MAXIMUM RATINGS (DIE)
CONDITIONS VALUES
Junction temperature 150ºC
Storage temperature range -65ºC to +150ºC
Voltage applied to any pin (VSS – 0.3V) to (VCC + 0.3V)
Voltage applied to any pin (Input current limited to ±20mA) (VSS – 1.0V) to (VCC + 1.0V)
VCC – VSS -0.3V to +7.0V
TABLE 5: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)
CONDITIONS VALUES
Junction temperature 150ºC
Storage temperature range -65ºC to +150ºC
Voltage applied to any pin (VSS – 0.3V) to (VCC + 0.3V)
Voltage applied to any pin (Input current limited to ±20 mA) (VSS – 1.0V) to (VCC + 1.0V)
Lead temperature (Soldering – 10sec) 300ºC
VCC – VSS -0.3V to +7.0V
1 Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum
ratings may affect device reliability and performance. Functional operation is not implied at these conditions.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 15 - Revision 1.1
9.1 OPERATING CONDITIONS
TABLE 6: OPERATING CONDITIONS (DIE)
CONDITIONS VALUES
Commercial operating temperature range 0ºC to +50ºC
Supply voltage (VCC) [1] +4.5V to +6.5V
Ground voltage (VSS) [2] 0V
TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS)
CONDITIONS VALUES
Commercial operating temperature range (Case temperature) 0ºC to +70ºC
Supply voltage (VCC) [1] +4.5V to +5.5V
Ground voltage (VSS) [2] 0V
1. VCC = VCCA = VCCD
2. VSS = VSSA = VSSD
ISD1200 SERIES
- 16 -
10. ELECTRICAL CHARACTERISTICS
10.1. PARAMETERS FOR PACKAGED PARTS
TABLE 8: DC PARAMETERS
PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Input Low Voltage VIL 0.8 V
Input High Voltage VIH 2.4 V
Output Low Voltage VOL 0.4 V IOL = 4.0 mA
Output High Voltage VOH 2.4 V IOH = -1.6 mA
VCC Current (Operating) ICC 15 30 mA VCC = 5.5V[3],
REXT =
VCC Current (Standby) ISB 0.5 10 µA
[3] [4]
Input Leakage Current IIL +1 µA
Input Current HIGH w/Pull
Down
IILPD 130 µA Force VCC
[5]
Output Load Impedance REXT 16 Speaker Load
Preamp IN Input
Resistance
RMIC 10 K Pins 17, 18
ANA IN Input Resistance RANA IN 3 K
Preamp Gain 1 APRE1 24 dB AGC = 0.0V
Preamp Gain 2 APRE2 -45 -15 dB AGC = 2.5V
ANA IN to SP+/- Gain AARP 22 dB
AGC Output Resistance RAGC 5 K
Preamp Out Source IPREH -2 MA @ VOUT = 1.0V
Preamp In Sink IPREL 0.5 MA @ VOUT = 2.0V
[1] Typical values @ TA = 25º and 5.0V.
[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[3] VCCA and VCCD connected together.
[4] REC , PLAYL , and PLAYE must be at VCCD.
[5] Pin 26.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 17 - Revision 1.1
TABLE 9: AC PARAMETERS
CHARACTERISTICS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Sampling Frequency
ISD1210
ISD1212
FS
6.4
5.3
kHz
kHz
[5]
[5]
Filter Pass Band
ISD1210
ISD1212
FCF
2.6
2.2
kHz
kHz
3 dB Roll-Off Point[3][6]
3 dB Roll-Off Point[3][6]
Record Duration
ISD1210
ISD1212
TREC
10
12
sec
sec
Playback Duration
ISD1210
ISD1212
TPLAY
10
12
sec
sec
[5]
[5]
RECLED ON Delay TLED1 5 msec
RECLED OFF Delay
ISD1210
ISD1212
TLED2
40
50
48.6
58.3
100
105
msec
msec
A0-A7 Setup Time TSET 300 nsec
A0-A7 Hold Time THOLD 0 nsec
Record Power-Up Delay
ISD1210
ISD1212
TRPUD
32
39
msec
msec
Record Power-Down Delay
ISD1210
ISD1212
TRPDD
32
39
msec
msec
Play Power-Up Delay
ISD1210
ISD1212
TPPUD
32
39
msec
msec
Play Power-Down Delay
ISD1210
ISD1212
TPPDD
8.1
9.7
msec
msec
ISD1200 SERIES
- 18 -
CHARACTERISTICS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
EOM Pulse Width
ISD1210
ISD1212
TEOM
15.625
18.75
msec
msec
Total Harmonic Distortion THD 1 % @ 1 kHz
Speaker Output Power POUT 12.2 mW REXT = 16
Voltage Across Speaker Pins VOUT 1.25 2.5 Vp-p REXT = 600
MIC Input Voltage VIN1 20 mV Peak-to-Peak[4]
ANA IN Input Voltage VIN2 50 mV Peak-to-Peak
[1] Typical values @ TA = 25º and 5.0V sample rate.
[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)
[4] With 5.1 K series resistor at ANA IN.
[5] Sampling Frequency and playback Duration can vary as much as +2.25 percent over the commercial
temperature ranges. All devices will meet the maximum sampling frequency and minimum playback
duration parameters. For greater stability, an external clock can be utilized (see Pin Descriptions)
[6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation
with Voltage and Temperature. This parameter is not checked during production testing and may vary
due to process variations and other factors. Therefore, the customer should not rely upon this value for
testing purposes.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 19 - Revision 1.1
10.1.1. Typical Parameter Variation with Voltage and Temperature
-40 25 70 85
Temperature (C)
5.5 Volts 4.5 Volts
Percent Change (%)
-2.0
-1.5
-1.0
-0.5
0
0.5
1.0
Chart 4: Oscillator Stability
-40 25 70 85
Temperature (C)
5.5 Volts 4.5 Volts
0
2
4
6
8
10
Operating Current (mA)
Chart 1: Record Mode Operating
Current (ICC)
-40 25 70 85
Temperature (C)
5.5 Volts 4.5 Volts
Percent Distortion (%)
0.1
0.2
0.3
0.4
0.5
0
Chart 2: Total Harmonic Distortion
-40 25 70 85
Temperature (C)
5.5 Volts 4.5 Volts
Standby Current (mA)
0
0.10
0.15
0.20
0.25
0.30
Chart 3: Standby Current (ISB)
12
14
1.5
ISD1200 SERIES
- 20 -
10.2. PARAMETERS FOR DIE
TABLE 10: DC PARAMETERS
PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Input Low Voltage VIL 0.8 V
Input High Voltage VIH 2.4 V
Output Low Voltage VOL 0.4 V IOL = 4.0 mA
Output High Voltage VOH 2.4 V IOH = -1.6 mA
VCC Current (Operating) ICC 15 30 mA VCC = 5.5V[3],
REXT =
VCC Current (Standby) ISB 0.5 10 µA
[3] [4]
Input Leakage Current IIL +1 µA
Input Current HIGH w/Pull
Down
IILPD 130 µA Force VCC
[5]
Output Load Impedance REXT 16 Speaker Load
Preamp IN Input
Resistance
RMIC 10 K Pads 17,18
ANA IN Input Resistance RANA IN 3 K
Preamp Gain 1 APRE1 24 dB AGC = 0.0V
Preamp Gain 2 APRE2 -45 -15 dB AGC = 2.5V
ANA IN to SP+/- Gain AARP 22 dB
AGC Output Resistance RAGC 5 K
Preamp Out Source IPREH -2 mA @ VOUT = 1.0V
Preamp In Sink IPREL 0.5 mA @ VOUT = 2.0V
[1] Typical values @ TA = 25º and 5.0V.
[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[3] VCCA and VCCD connected together.
[4] REC , PLAYL , and PLAYE must be at VCCD.
[5] Pin 26.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 21 - Revision 1.1
TABLE 11: AC PARAMETERS
CHARACTERISTICS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
Sampling Frequency
ISD1210
ISD1212
FS
6.4
5.3
kHz
kHz
[5]
[5]
Filter Pass Band
ISD1210
ISD1212
FCF
2.6
2.2
kHz
kHz
3 dB Roll-Off Point[3][6]
3 dB Roll-Off Point[3][6]
Record Duration
ISD1210
ISD1212
TREC
10
12
sec
sec
Playback Duration
ISD1210
ISD1212
TPLAY
10
12
sec
sec
[5]
[5]
RECLED ON Delay TLED1 5 msec
RECLED OFF Delay
ISD1210
ISD1212
TLED2
40
50
48.5
58.3
100
105
msec
msec
Address Setup Time TSET 300 nsec
Address Hold Time THOLD 0 nsec
Power-Up Delay
ISD1210
ISD1212
TRPUD
32
39
msec
msec
PD Pulse Width (Record)
ISD1210
ISD1212
TRPDD
32
39
msec
msec
Play Power-Up Delay
ISD1210
ISD1212
TPPUD
32
39
msec
msec
Play Power-Down Delay
ISD1210
ISD1212
TPPDD
8.1
9.7
msec
msec
ISD1200 SERIES
- 22 -
CHARACTERISTICS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS
EOM Pulse Width
ISD1210
ISD1212
TEOM
16.625
18.75
msec
msec
Total Harmonic Distortion THD 1 % @ 1 kHz
Speaker Output Power POUT 12.2 mW REXT = 16 [4]
Voltage Across Speaker Pins VOUT 1.25 2.5 Vp-p REXT = 600
MIC Input Voltage VIN1 20 mV Peak-to-Peak[4]
ANA IN Input Voltage VIN2 50 mV Peak-to-Peak
[1] Typical values @ TA = 25º and 5.0V sample rate.
[2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all
specifications are 100 percent tested.
[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)
[4] With 5.1 K series resistor at ANA IN.
[5] Sampling Frequency and playback Duration can vary as much as +2.25 percent over the commercial
temperature range. All devices will meet the maximum sampling frequency and minimum playback
duration parameters. For greater stability, an external clock can be utilized (see Pin Descriptions)
[6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation
with Voltage and Temperature. This parameter is not checked during production testing and may vary
due to process variations and other factors. Therefore, the customer should not rely upon this value for
testing purposes.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 23 - Revision 1.1
10.2.1. Typical Parameter Variation with Voltage and Temperature
02550
Temperature (C)
Percent Change (%)
-1.5
-1.0
-0.5
0
0.5
1.0
1.5
Chart 8: Oscillator Stability
6.5 Volts 5.5 Volts 4.5 Volts
02550
Temperature (C)
Percent Distortion (%)
0.1
0.2
0.3
0.4
0.5
0
Chart 6: Total Harmonic Distortion
6.5 Volts 5.5 Volts 4.5 Volts
5
10
15
02550
Temperature (C)
0
Operating Current (mA)
Chart 5: Record Mode Operating
Current (ICC)
6.5 Volts 5.5 Volts 4.5 Volts
02550
Temperature (C)
Standby Current (mA)
Chart 7: Standby Current (ISB)
6.5 Volts 5.5 Volts 4.5 Volts
0.10
0.15
0.20
0.25
0.30
0.35
0
2.0
2.5
ISD1200 SERIES
- 24 -
11. TYPICAL APPLICATION CIRCUIT
ISD1400
VCCD
VCCA
VSSD
VSSA
SP+
SP-
MIC REF
MIC
AGC
ANA IN
ANA OUT
A0
A1
A2
A3
A4
A5
A6
A7
PLAYL
PLAYE
REC
RECLED
XCLK
100 K
R8
PLAYL
PLAYE
RECORD
C3
0.1 F
µ
5.1 K
R2
C6
4.7 F
µ
470 K
R5
C1
220 F
µ
10 K
R4
ELECTRET
MICROPHONE
VCC
C2
0.1 F
µ
C5
0.1 F
µ
C7
0.001 F
µ
1 K
R9
1
2
3
4
5
6
9
10
23
24
27
25
26
19
17
18
21
20
15
14
13
12
16
28 1K
R1
SPEAKER
16
10 K
R3
C4
0.1 F
µ
100 K
R6
100 K
R7
S1
S2
S3
D1
REC
LED
FIGURE 5: APPLICATION EXAMPLE
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 25 - Revision 1.1
Functional Description Example
The following example operating sequence demonstrates the functionality of the ISD1200 series
devices.
1. Record a message:
Pulling the REC signal LOW initiates a record cycle from current location. When REC is
held LOW, the recording continues. Until the memory array is filled up or when REC is
pulled HIGH, recording ceases. An EOM marker is written at the end of message. Then the
device will automatically power down.
2. Edge-activated playback:
Pulling the PLAYE signal LOW initiates a playback cycle from the beginning of the message
until the entire message is played. The rising edge of PLAYE has no effect on operation.
When the EOM marker is encountered, the device automatically powers down. A subsequent
falling edge on PLAYE initiates a new playback operation from the beginning of the
message.
3. Level-activated playback:
Holding the PLAYL signal LOW initiates a playback cycle from the beginning of the
message, until PLAYL is pulled HIGH or when the EOM marker is encountered, playback
operation stops and the device automatically powers down.
4. Record (interrupting playback).
The REC signal takes precedence over playback operation. Holding REC LOW initiates a
new record operation from current location, regardless of any current operation in progress.
5. RECLED operation.
During record, the RECLED output pin provides an active-LOW signal, which can be used to
drive an LED as a “record-in-progress” indicator. It returns to a HIGH state when the REC
pin is pulled HIGH or when the recording is completed due to the memory being filled.
However, during playback, this pin also pulses LOW to indicate an EOM at the end of a
message.
ISD1200 SERIES
- 26 -
Applications Note
Some users may experience an unexpected recording taking place when their circuit is powered up,
or the batteries are changed and VCC rises faster than REC . This undesired recording prevents
playback of the previously recorded message. A spurious EOM marker appears at the very beginning
of the memory, preventing access to the original message, and nothing is played.
To prevent this occurrence, place a capacitor (approx. 0.001 µF) between the control pin, REC , and
VCC. This pulls the control pin voltage up with VCC as it rises. Once the voltage is HIGH, the pull-up
device will keep the pin HIGH until intentionally pulled LOW, preventing the false EOM marker.
Since this anomaly depends on factors such as the capacitance of the user’s printed circuit board, not
all circuit designs will exhibit the spurious marker. However, it is recommended, that the capacitor is
included for design reliability. A more detailed explanation and resolution of this occurrence is
described in Application Information.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 27 - Revision 1.1
12. PACKAGE DRAWING AND DIMENSIONS
12.1. 28-LEAD 300MIL PLASTIC SMALL OUTLINE IC (SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
12345 67891011 12 13 14
A
D
E
F
B
G
C
H
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 0.701 0.706 0.711 17.81 17.93 18.06
B 0.097 0.101 0.104 2.46 2.56 2.64
C 0.292 0.296 0.299 7.42 7.52 7.59
D 0.005 0.009 0.0115 0.127 0.22 0.29
E 0.014 0.016 0.019 0.35 0.41 0.48
F 0.050 1.27
G 0.400 0.406 0.410 10.16 10.31 10.41
H 0.024 0.032 0.040 0.61 0.81 1.02
Note: Lead coplanarity to be within 0.004 inches.
ISD1200 SERIES
- 28 -
12.2. 28-LEAD 600MIL PLASTIC DUAL INLINE PACKAGE (PDIP)
INCHES MILLIMETERS
Min Nom Max Min Nom Max
A 1.445 1.450 1.455 36.70 36.83 36.96
B1 0.150 3.81
B2 0.065 0.070 0.075 1.65 1.78 1.91
C1 0.600 0.625 15.24 15.88
C2 0.530 0.540 0.550 13.46 13.72 13.97
D 0.19 4.83
D1 0.015 0.38
E 0.125 0.135 3.18 3.43
F 0.015 0.018 0.022 0.38 0.46 0.56
G 0.055 0.060 0.065 1.40 1.52 1.62
H 0.100 2.54
J 0.008 0.010 0.012 0.20 0.25 0.30
S 0.070 0.075 0.080 1.78 1.91 2.03
q 15° 15°
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 29 - Revision 1.1
12.3. DIE PHYSICAL LAYOUT[1]
ISD1200x
o Die Dimensions
X: 172.2
± 1 mils
Y: 138.2
± 1 mils
o Die Thickness[2]
17.5
± .1 mils
o Pad Opening
88 x 112 microns
3.46 x 4.41 mils
Notes:
[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2] Die thickness is subject to change, please contact Winbond factory for status.
ISD1200X
A3
A2
A1
A0
VCCD
REC
XCLK
RECLED
PLAYE
PLAYL
A4
A5
ANA OUT
ANA IN
AGC
MIC REF
MICSP-
SP+
VSSD
NC
A7
A6
VSSA
VCCA
ISD1200 SERIES
- 30 -
ISD1200 SERIES PAD DESIGNATIONS,
(with respect to die center)
PAD PAD Name X Axis (µm) Y Axis (µm)
A0 Address 0 -1364.0 1589.6
A1 Address 1 -1648.4 1589.6
A2 Address 2 -1816.4 1589.6
A3 Address 3 -2013.6 1515.6
A4 Address 4 -2013.6 1337.6
A5 Address 5 -2013.6 1129.6
A6 Address 6 -2013.6 -831.2
A7 Address 7 -2013.6 -1022.0
NC No Connect -2013.6 -1361.6
VSSD Digital Ground -1893.6 -1588.0
VSSA Analog Ground -357.6 -1588.0
SP+ Speaker Output + -17.2 -1512.8
SP- Speaker Output - 412.4 -1512.8
VCCA Analog Power Supply 780.0 -1552.4
MIC Microphone Input 992.0 -1590.0
MIC REF Microphone Reference 1169.2 -1590.0
AGC Automatic Gain Control 1978.4 -1590.0
ANA IN Analog Input 2005.6 -1196.4
ANA OUT Analog Output 1991.2 -995.2
PLAYL Level-Activated Playback 2014.4 1224.4
PLAYE Edge-Activated Playback 2014.4 1392.8
RECLED Record LED Output 2012.4 1587.6
XCLK External Clock 1581.2 1589.6
REC Record 752.8 1589.6
VCCD Digital Power Supply -48.0 1545.2
Note: Die dimensions and pad positions may be subject to change. Please contact Winbond
Sales Office or Representatives to verify current specifications.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 31 - Revision 1.1
13. ORDERING INFORMATION
Product Number Descriptor Key
When ordering ISD1200 series devices, please refer to the following valid part numbers.
10-Second 12-Second Die / Package
Product P/N Ordering P/N Product P/N Ordering P/N
Die ISD1210X I1210X ISD1212X I1212X
PDIP ISD1210P I1210P ISD1212P I1212P
SOIC ISD1210S I1210S ISD1212S I1212S
For the latest product information, access Winbond’s worldwide website at
http://www.winbond-usa.com
ISD12
Package Type:
ISD1200 Series
Duration:
10 = 10 seconds
12 = 12 seconds
P = 28-Lead 600 mil Plastic Dual Inline
S = 28-Lead 300 mil Small Outline
X = Die
Special Temperature Field:
Blank = Commercial Packaged (0˚C to +70˚)
or Commercial Die (0˚C to +50˚)
Package (PDIP)
(SOIC)
ISD1200 SERIES
- 32 -
14. VERSION HISTORY
VERSION DATE DESCRIPTION
0 Before 2004 Initial issue
1.0 March 2004 Reformat the document.
Add footnote to Filter Passband in Tables 1, 9 & 11.
Revise Functional Description Example section.
Revise die info.
Revise ordering information.
1.1 Apr 2005 Revise the disclaim section.
ISD1200 SERIES
Publication Release Date: April 21, 2005
- 33 - Revision 1.1
Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.
No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,
Science-Based Industrial Park, CA 95134, U.S.A. 200336 China
Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999
TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998
FAX: 886-3-5665577 http://www.winbond-usa.com/
http://www.winbond.com.tw/
Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.
9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,
Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,
Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong
TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100
FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
This product incorporates SuperFlash® technology licensed From SST.
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Winbond for any damages resulting from such improper use or sales.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Winbond has been advised of the possibility of such damages.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in
the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates
SuperFlash®.
Information contained in this ISD® ChipCorder® datasheet supersedes all data for the ISD ChipCorder products
published by ISD® prior to August, 1998.
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information in
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is
subject to change without notice.
Copyright© 2005, Winbond Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of
Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks
are properties of their respective owners.