LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 LP3879 Micropower 800mA Low Noise "Ceramic Stable" Voltage Regulator for Low Voltage Applications Check for Samples: LP3879 FEATURES DESCRIPTION * * The LP3879 is a 800 mA fixed-output voltage regulator designed to provide high performance and low noise in applications requiring output voltages between 1.0V and 1.2V. 1 2 * * * * * * * * * * * Standard Output Voltage: 1.00V, 1.20V Custom Voltages Available from 1.0V to 1.2V (50 mV Increments) Input Voltage: 2.5 to 6V 1% Initial Output Accuracy Designed for Use with Low ESR Ceramic Capacitors Very Low Output Noise Sense Option Improves Load Regulation 8-Lead SO PowerPad and WSON Surface Mount Packages <10 A Quiescent Current in Shutdown Low Ground Pin Current at all Loads High Peak Current Capability Over-Temperature/Over-Current Protection -40C to +125C Junction Temperature Range Using an optimized VIP (Vertically Integrated PNP) process, the LP3879 delivers superior performance: Ground Pin Current: Typically 5.5 mA @ 800 mA load, and 200 A @ 100 A load. Low Power Shutdown: The LP3879 draws less than 10 A quiescent current when shutdown pin is pulled low. Precision Output: Ensured output voltage accuracy is 1% at room temperature. Low Noise: Broadband output noise is only 18 V (typical) with 10 nF bypass capacitor. APPLICATIONS * * * * ASIC Power Supplies In: - Desktops, Notebooks and Graphic Cards - Set Top Boxes, Printers and Copiers DSP and FPGA Power Supplies SMPS Post-Regulator Medical Instrumentation 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated LP3879 SNVS396B - MAY 2006 - REVISED APRIL 2013 www.ti.com Basic Application Circuit OUTPUT 6 *4.7 PF (Ceramic or Tantalum recommended) 4 1 5 + *0.01 PF (See App Hints) + - 2 N/C 7 N/C *10 PF (Ceramic recommended) 8 **S/D + LP3879-X.X 1.23V + 3 *Capacitance values shown are minimum required to assure stability. Larger output capacitor provides improved dynamic response. Output capacitor must meet ESR requirements (see Application Information). **The Shutdown pin must be actively terminated (see Application Information). Tie to INPUT (Pin 4) if not used. Connection Diagram GROUND 3 INPUT 4 GND 8 SHUTDOWN 7 N/C BYPASS 1 N/C 2 GROUND 3 INPUT 4 8 SHUTDOWN 7 N/C 6 SENSE 5 OUTPUT 6 SENSE 5 OUTPUT Figure 1. Top View 8-Lead SO PowerPad See DDA0008B Package GROUND BYPASS 1 N/C 2 Figure 2. Top View 8-Lead WSON See NGT0008A Package PIN DESCRIPTIONS Pin Name 1 BYPASS 2 N/C 3 GROUND 4 INPUT 5 OUTPUT 6 SENSE 7 N/C Function The capacitor connected between BYPASS and GROUND lowers output noise voltage level and is required for loop stability. DO NOT CONNECT. This pin is used for post package test and must be left floating. Device ground. Input source voltage. Regulated output voltage. Remote Sense. Tie directly to output or remotely at point of load for best regulation. No internal connection. 8 SHUTDOWN Output is enabled above turn-on threshold voltage. Pull down to turn off regulator output. SO PowerPad, WSON SUBSTRATE GROUND The exposed die attach pad should be connected to a thermal pad at ground potential. For additional information on using Texas Instruments' Non Pull Back WSON package, please refer to WSON application note SNOA401 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) Storage Temperature Range -65C to +150C Operating Junction Temperature Range -40C to +125C Lead Temperature (Soldering, 5 seconds) 260C ESD Rating (3) 2 kV Shutdown Pin 1kV Power Dissipation (4) Internally Limited -0.3V to +16V Input Supply Voltage (Survival) Input Supply Voltage (Typical Operating) 2.5V to +6V SENSE Pin -0.3V to +6V Output Voltage (Survival) (5) -0.3V to +6V IOUT (Survival) Short Circuit Protected Input-Output Voltage (Survival) (6) (1) (2) (3) (4) (5) (6) -0.3V to +16V Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. ESD testing was performed using Human Body Model, a 100 pF capacitor discharged through a 1.5 k resistor. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, J-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: The value of J-A for the WSON and SO PowerPad packages are specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. If a four layer board is used with maximum vias from the IC center to the heat dissipating copper layers, values of J-A which can be obtained are approximately 60C/W for the SO PowerPad and 40C/W for the WSON package. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. If used in a dual-supply system where the regulator load is returned to a negative supply, the LP3879 output must be diode-clamped to ground. The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Forcing the output above the input will turn on this diode and may induce a latch-up mode which can damage the part (see Application Hints). Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 3 LP3879 SNVS396B - MAY 2006 - REVISED APRIL 2013 www.ti.com Electrical Characteristics Limits in standard typeface are for TJ = 25C, and limits in boldface type apply over the temperature range of -40C to 125C. Limits are ensured through design, testing, or correlation. The limits are used to calculate the Average Outgoing Quality Level (AOQL). Unless otherwise specified: VIN = 3.0V, VOUT = 1V, IL = 1 mA, COUT = 10 F, CIN = 4.7 F, VS/D = 2V, CBYPASS = 10 nF. Symbol Parameter Conditions VO Output Voltage Tolerance 'VOUT 'VIN Output Voltage Line Regulation VIN (min) Minimum Input Voltage Required To Maintain Output Regulation IGND Ground Pin Current 1 mA IL 800 mA, 3.0V VIN 6V Min (1) Typical (2) Max (1) -1.0 1.00 1.0 -2.0 -3.0 1.00 2.0 3.0 Units %Vnom 0.014 3.0V VIN 6V 0.007 0.032 IL = 800 mA, VOUT VOUT(NOM) - 1% 2.5 3.1 IL = 800 mA, VOUT VOUT(NOM) - 1% 0 TJ 125C 2.5 2.8 IL = 750 mA, VOUT VOUT(NOM) - 1% 2.5 IL = 100 A 200 IL = 200 mA 1.5 IL = 800 mA 5.5 %/V V 3.0 250 275 A 2 3.3 8.5 mA 15 IO(PK) Peak Output Current VOUT VOUT(NOM) - 5% 1200 IO(MAX) Short Circuit Current RL = 0 (Steady State) 1400 en Output Noise Voltage (RMS) BW = 100 Hz to 100 kHz CBYPASS = 10 nF 18 V(RMS) 'VOUT 'VIN Ripple Rejection f = 1 kHz 60 dB mA SHUTDOWN INPUT VS/D VH = Output ON S/D Input Voltage IS/D (1) (2) 4 S/D Input Current VL = Output OFF, IIN 10 A 1.4 0.1 1.6 0.50 V VOUT 10 mV, IIN 50 A 0.6 VS/D = 0 0.02 -1 5 15 VS/D = 5V A Limits are ensured through testing, statistical correlation, or design. Typical numbers reperesent the most likely norm for 25C operation. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 Typical Performance Characteristics Unless otherwise specified: VIN = 3.3V, VOUT = 1V, IL = 1 mA, CIN = 4.7 F, COUT = 10 F, VS/D = 2V, CBYP = 10 nF, TJ = 25C. IGND vs Temperature Minimum VIN Over Temperature 10.0 9.0 8.0 IGND (mA) 7.0 IL = 800 mA 6.0 5.0 4.0 3.0 IL = 240 mA 2.0 1.0 IL = 1 mA 0 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (C) Figure 3. Figure 4. IGND vs ILoad VOUT vs Temperature 1.020 1.015 VOUT (V) 1.010 1.005 1.000 0.995 0.990 0.985 0.980 -50 -25 0 25 50 75 100 125 TEMPERATURE (oC) Figure 5. Figure 6. VOUT vs Temperature Ripple Rejection 1.202 100 90 VOUT = 1.2V 80 RIPPLE REJECTION (dB) VOUT (V) 1.201 1.200 1.199 70 60 50 40 30 20 10 1.198 -40 -25 0 25 50 75 100 125 0 10 100 1k 10k 100k 1M JUNCTION TEMPERATURE (C) FREQUENCY (Hz) Figure 7. Figure 8. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 5 LP3879 SNVS396B - MAY 2006 - REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: VIN = 3.3V, VOUT = 1V, IL = 1 mA, CIN = 4.7 F, COUT = 10 F, VS/D = 2V, CBYP = 10 nF, TJ = 25C. Ripple Rejection Line Transient Response 100 90 IL= 800 mA RIPPLE REJECTION (dB) 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k 1M FREQUENCY (Hz) 6 Figure 9. Figure 10. Line Transient Response Line Transient Response Figure 11. Figure 12. Line Transient Response Line Transient Response Figure 13. Figure 14. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: VIN = 3.3V, VOUT = 1V, IL = 1 mA, CIN = 4.7 F, COUT = 10 F, VS/D = 2V, CBYP = 10 nF, TJ = 25C. Line Transient Response Load Transient Response Figure 15. Figure 16. Load Transient Response Turn-On Characteristics 1.2 1 0o C VOUT (V) 0.8 0.6 25oC 0.4 125oC 0.2 0 0 0.5 1 1.5 2 VS/D Figure 17. Figure 18. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 7 LP3879 SNVS396B - MAY 2006 - REVISED APRIL 2013 www.ti.com Block Diagram SENSE BYPASS INPUT OUTPUT 6 1 4 5 Error Amp 2 N/C 8 SHUTDOWN 7 N/C + - LP3879-X.X 1.23V GROUND + 3 APPLICATION INFORMATION PACKAGE INFORMATION The LP3879 is offered in the 8-lead SO PowerPad or WSON surface mount packages to allow for increased power dissipation compared to the SO-8 and Mini SO-8. EXTERNAL CAPACITORS Like any low-dropout regulator, the LP3879 requires external capacitors for regulator stability. These capacitors must be correctly selected for good performance. INPUT CAPACITOR: A capacitor whose value is at least 4.7 F (20%) is required between the LP3879 input and ground. A good quality X5R / X7R ceramic capacitor should be used. Capacitor tolerance and temperature variation must be considered when selecting a capacitor (see Capacitor Characteristics section) to assure the minimum requirement of input capacitance is met over all operating conditions. The input capacitor must be located not more than 0.5" from the input pin and returned to a clean analog ground. Any good quality ceramic or tantalum capacitor may be used, assuming the minimum input capacitance requirement is met. OUTPUT CAPACITOR: The LP3879 requires a ceramic output capacitor whose size is at least 10 F (20%). A good quality X5R / X7R ceramic capacitor should be used. Capacitance tolerance and temperature characteristics must be considered when selecting an output capacitor. The LP3879 is designed specifically to work with ceramic output capacitors, utilizing circuitry which allows the regulator to be stable across the entire range of output current with an ultra low ESR output capacitor. The output capacitor selected must meet the requirement for minimum amount of capacitance and also have an ESR (equivalent series resistance) value which is within the stable range. A curve is provided which shows the stable ESR range as a function of load current (see Figure 19). 8 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 0.4 ESR (:) 0.3 0.2 STABLE REGION 0.1 0 0 200 400 600 800 LOAD CURRENT (mA) Figure 19. Stable Region For Output Capacitor ESR Important: The output capacitor must maintain its ESR within the stable region over the full operating temperature range of the application to assure stability. The output capacitor ESR forms a zero which is required to add phase lead near the loop gain crossover frequency, typically in the range of 50kHz to 200 kHz. The ESR at lower frequencies is of no importance. Some capacitor manufacturers list ESR at low frequencies only, and some give a formula for Dissipation Factor which can be used to calculate a value for a term referred to as ESR. However, since the DF formula is usually at a much lower frequency than the range listed above, it will give an unrealistically high value. If good quality X5R or X7R ceramic capacitors are used, the actual ESR in the 50 kHz to 200 kHz range will not exceed 25 milli Ohms. If these are used as output capacitors for the LP3879, the regulator stability requirements are satisfied. It is important to remember that capacitor tolerance and variation with temperature must be taken into consideration when selecting an output capacitor so that the minimum required amount of output capacitance is provided over the full operating temperature range. (See Capacitor Characteristics section). The output capacitor must be located not more than 0.5" from the output pin and returned to a clean analog ground. NOISE BYPASS CAPACITOR: The 10 nF capacitor on the Bypass pin significantly reduces noise on the regulator output and is required for loop stability. However, the capacitor is connected directly to a highimpedance circuit in the bandgap reference. Because this circuit has only a few microamperes flowing in it, any significant loading on this node will cause a change in the regulated output voltage. For this reason, DC leakage current through the noise bypass capacitor must never exceed 100 nA, and should be kept as low as possible for best output voltage accuracy. The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High-quality ceramic capacitors with either NPO or COG dielectric typically have very low leakage. 10 nF polypropolene and polycarbonate film capacitors are available in small surface-mount packages and typically have extremely low leakage current. CAPACITOR CHARACTERISTICS CERAMIC: The LP3879 was designed to work with ceramic capacitors on the output to take advantage of the benefits they offer: for capacitance values in the 10 F range, ceramics are the least expensive and also have the lowest ESR values (which makes them best for eliminating high-frequency noise). The ESR of a typical 10 F ceramic capacitor is in the range of 5 m to 10 m, which meets the ESR limits required for stability by the LP3879. One disadvantage of ceramic capacitors is that their capacitance can vary with temperature. Many large value ceramic capacitors ( 2.2 F) are manufactured with the Z5U or Y5V temperature characteristic, which results in the capacitance dropping by more than 50% as the temperature goes from 25C to 85C. Another significant problem with Z5U and Y5V dielectric devices is that the capacitance drops severely with applied voltage. A typical Z5U or Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 9 LP3879 SNVS396B - MAY 2006 - REVISED APRIL 2013 www.ti.com For these reasons, X7R and X5R type ceramic capacitors must be used on the input and output of the LP3879. SHUTDOWN INPUT OPERATION The LP3879 is shut off by pulling the Shutdown input low, and turned on by pulling it high. If this feature is not to be used, the Shutdown input should be tied to VIN to keep the regulator output on at all times. To assure proper operation, the signal source used to drive the Shutdown input must be able to swing above and below the specified turn-on/turn-off voltage thresholds listed in the Electrical Characteristics section under VON/OFF. REVERSE INPUT-OUTPUT VOLTAGE The PNP power transistor used as the pass element in the LP3879 has an inherent diode connected between the regulator output and input. During normal operation (where the input voltage is higher than the output) this diode is reverse-biased. However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator output. In such cases, a parasitic SCR can latch which will allow a high current to flow into VIN (and out the ground pin), which can damage the part. In any application where the output may be pulled above the input, an external Schottky diode must be connected from VIN to VOUT (cathode on VIN, anode on VOUT), to limit the reverse voltage across the LP3879 to 0.3V (see Absolute Maximum Ratings). 10 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 LP3879 www.ti.com SNVS396B - MAY 2006 - REVISED APRIL 2013 REVISION HISTORY Changes from Revision A (April 2013) to Revision B * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP3879 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LP3879MR-1.0/NOPB DDA 8 95 RoHS & Green SN Level-3-260C-168 HR SO PowerPAD DDA 8 95 Non-RoHS & Green Call TI Call TI LP3879MR-1.2/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR -40 to 125 LP3879 MR1.2 LP3879MRX-1.0/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 3879 MR1.0 LP3879MRX-1.2/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 LP3879 MR1.2 LP3879SD-1.0/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 79SD1.0 LP3879SD-1.2/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 79SD1.2 LP3879MR-1.2 ACTIVE SO PowerPAD NRND -40 to 125 3879 MR1.0 LP3879 MR1.2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2021 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3879MRX-1.0/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP3879MRX-1.2/NOPB SO Power PAD DDA 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LP3879SD-1.0/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP3879SD-1.2/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3879MRX-1.0/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0 LP3879MRX-1.2/NOPB SO PowerPAD DDA 8 2500 367.0 367.0 35.0 LP3879SD-1.0/NOPB WSON NGT 8 1000 210.0 185.0 35.0 LP3879SD-1.2/NOPB WSON NGT 8 1000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DDA0008B PowerPAD TM SOIC - 1.7 mm max height SCALE 2.400 PLASTIC SMALL OUTLINE C 6.2 TYP 5.8 A SEATING PLANE PIN 1 ID AREA 0.1 C 6X 1.27 8 1 2X 3.81 5.0 4.8 NOTE 3 4 5 8X B 4.0 3.8 NOTE 4 0.51 0.31 0.25 1.7 MAX C A B 0.25 TYP 0.10 SEE DETAIL A 5 4 EXPOSED THERMAL PAD 3.4 2.8 0.25 GAGE PLANE 9 8 1 0 -8 0.15 0.00 1.27 0.40 DETAIL A 2.71 2.11 TYPICAL 4214849/A 08/2016 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MS-012. www.ti.com EXAMPLE BOARD LAYOUT DDA0008B PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.95) NOTE 9 SOLDER MASK DEFINED PAD (2.71) SOLDER MASK OPENING SEE DETAILS 8X (1.55) 1 8 8X (0.6) 9 SYMM (1.3) TYP (3.4) SOLDER MASK OPENING (4.9) NOTE 9 6X (1.27) 5 4 (R0.05) TYP METAL COVERED BY SOLDER MASK SYMM ( 0.2) TYP VIA (1.3) TYP (5.4) LAND PATTERN EXAMPLE SCALE:10X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS PADS 1-8 4214849/A 08/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004). 9. Size of metal pad may vary due to creepage requirement. 10. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DDA0008B PowerPAD TM SOIC - 1.7 mm max height PLASTIC SMALL OUTLINE (2.71) BASED ON 0.125 THICK STENCIL 8X (1.55) (R0.05) TYP 1 8 8X (0.6) (3.4) BASED ON 0.125 THICK STENCIL 9 SYMM 6X (1.27) 5 4 METAL COVERED BY SOLDER MASK SYMM (5.4) SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:10X STENCIL THICKNESS SOLDER STENCIL OPENING 0.1 0.125 0.150 0.175 3.03 X 3.80 2.71 X 3.40 (SHOWN) 2.47 X 3.10 2.29 X 2.87 4214849/A 08/2016 NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE NGT0008A WSON - 0.8 mm max height SCALE 3.000 PLASTIC SMALL OUTLINE - NO LEAD 4.1 3.9 A B PIN 1 INDEX AREA 4.1 3.9 C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD 2.6 0.05 (0.2) TYP 4 2X 2.4 5 SYMM 9 3 0.05 8 1 6X 0.8 PIN 1 ID 8X SYMM 8X 0.5 0.3 0.35 0.25 0.1 0.05 C A B C 4214935/A 08/2020 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT NGT0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (2.6) 8X (0.6) SYMM 1 8 8X (0.3) SYMM 9 (3) (1.25) 6X (0.8) 4 (R0.05) TYP 5 ( 0.2) VIA TYP (1.05) (3.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND EXPOSED METAL SOLDER MASK OPENING METAL EXPOSED METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4214935/A 08/2020 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NGT0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.675) SYMM 8X (0.6) METAL TYP 1 8 8X (0.3) (0.755) 9 SYMM (1.31) 6X (0.8) 5 4 (R0.05) TYP (1.15) (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4214935/A 08/2020 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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