WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans™
1
FEATURES
APPLICATIONS
DESCRIPTION
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
16-A, 4.5-V to 14-V INPUT, NON-ISOLATED,
2
•Up to 16-A Output Current •TurboTrans™ Technology•4.5-V to 14-V Input Voltage •Designed to meet Ultra-Fast TransientRequirements up to 300 A/ µs•Wide-Output Voltage Adjust (0.69 V to 5.5 V)
•SmartSync Technology•± 1.5% Total Output Voltage Variation
•Auto-Track™ Sequencing•Efficiencies up to 96%•Output Overcurrent Protection(Nonlatching, Auto-Reset)
•Complex Multi-Voltage Systems•Operating Temperature: – 40 ° C to 85 ° C
•Microprocessors•Safety Agency Approvals:
•Bus Drivers– UL/IEC/CSA-C22.2 60950-1•Prebias Startup•On/Off Inhibit•Differential Output Voltage Remote Sense•Adjustable Undervoltage Lockout•Ceramic Capacitor Version (PTH08T221W)•POLA™ Compatible
The PTH08T220/221W is a high-performance 16-A rated, non-isolated power module. These modules representthe 2nd generation of the popular PTH series power modules and include a reduced footprint and improvedfeatures. The PTH08T221W is optimized to be used with all ceramic capacitors.
Operating from an input voltage range of 4.5 V to 14 V, the PTH08T220/221W requires a single resistor to setthe output voltage to any value over the range, 0.69 V to 5.5 V. The wide input voltage range makes thePTH08T220/221W particularly suitable for advanced computing and server applications that utilize a looselyregulated 8-V to 12-V intermediate distribution bus. Additionally, the wide input voltage range increases designflexibility by supporting operation with tightly regulated 5-V, 8-V, or 12-V intermediate bus architectures.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdownprotects against most load faults. A differential remote sense ensures tight load regulation. An adjustableunder-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™ sequencing is apopular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in apower system.
The PTH08T220/221W includes new patent pending technologies, TurboTrans™ and SmartSync. TheTurboTrans feature optimizes the transient response of the regulator while simultaneously reducing the quantityof external output capacitors required to meet a target voltage deviation specification. Additionally, for a targetoutput capacitor bank, TurboTrans can be used to significantly improve the regulators transient response byreducing the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiplemodules, thus simplifying EMI noise suppression tasks and reducing input capacitor RMS current requirements.The module uses double-sided surface mount construction to provide a low profile and compact footprint.Package options include both through-hole and surface mount configurations that are lead (Pb) - free and RoHScompatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TurboTrans, POLA, Auto-Track, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
RTT
1%
0.05 W
(Optional)
CO
220 µF
(Required)
VO
RSET [A]
1%
0.05 W
(Required)
CI
330 µF
(Required)
RUVLO
1%
0.05 W
(Opional)
VOAdj
TurboTranst
VI
PTH08T220W
CI2
22 µF
(Required)
VI2
5
9
+
8
Track
GND
TT
43
GND
GND
+Sense 6
L
O
A
D
−Sense
GND
+
11
Inhibit INH/UVLO
Track
10
7
−Sense
+Sense
Vo
SYNC
1
SmartSync
UDG−05098
RTT
1%
0.05 W
(Optional)
CO
300 µF
(Required)
VO
RSET [A]
1%
0.05 W
(Required)
CI
300 µF
(Required)
RUVLO
1%
0.05 W
(Opional)
VOAdj
TurboTranst
VO
VI
PTH08T221W 5
9
8
VI Track
GND
TT
43
GND
GND
+Sense 6
L
O
A
D
−Sense
GND
Inhibit INH/UVLO
Track
10
7
−Sense
+Sense
SYNC
1
SmartSync
2
11
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
PTH08T220W
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.
PTH08T221W - Ceramic Capacitor Version
A. R
SET
required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.B. 300 µ F of ceramic or 330 µ F of electrolytic input capacitance is required for proper operation.
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DATASHEET TABLE OF CONTENTS
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
PTH08T220W , PTH08T221W
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or seethe TI website at www.ti.com.
DATASHEET SECTION PAGE NUMBER
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS 3
ELECTRICAL CHARACTERISTICS TABLE (PTH08T220W) 4
ELECTRICAL CHARACTERISTICS TABLE (PTH08T221W) 6
TERMINAL FUNCTIONS 8
TYPICAL CHARACTERISTICS (V
I
= 12V) 9
TYPICAL CHARACTERISTICS (V
I
= 5V) 10
ADJUSTING THE OUTPUT VOLTAGE 11
INPUT & OUTPUT CAPACITOR RECOMMENDATIONS 13
TURBOTRANS™ INFORMATION 17
UNDERVOLTAGE LOCKOUT (UVLO) 22
SOFT-START POWER-UP 23
OUTPUT INHIBIT 24
OVER-CURRENT PROTECTION 25
OVER-TEMPERATURE PROTECTION 25
REMOTE SENSE 25
SYCHRONIZATION (SMARTSYNC) 26
AUTO-TRACK SEQUENCING 27
PREBIAS START-UP 30
TAPE & REEL AND TRAY DRAWINGS 32
(Voltages are with respect to GND)
UNIT
V
track
Track pin voltage – 0.3 to V
I
+ 0.3 VT
A
Operating temperature range Over V
I
range – 40 to 85AH suffixSurface temperature of module body or pins forT
wave
Wave soldering temperature 2605 seconds maximum.
AD suffix
AS suffix 235
(1)
° CT
reflow
Solder reflow temperature Surface temperature of module body or pins
AZ suffix 260
(1)
T
stg
Storage temperature Storage temperature of module removed from shipping package – 55 to 125T
pkg
Packaging temperature Shipping Tray or Tape and Reel storage or bake temperature 45Mechanical shock Per Mil-STD-883D, Method 2002.3 1 msec, 1/2 AH and AD suffix 500sine, mounted
AS and AZ suffix 125 GMechanical vibration Mil-STD-883D, Method 2007.2 20-2000 Hz 20Weight 5 gramsFlammability Meets UL94V-O
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above thestated maximum.
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ELECTRICAL CHARACTERISTICS
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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PTH08T220W
T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µ F, C
I
2 = 22 µF, C
O
= 220 µ F, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T220W UNIT
MIN TYP MAX
I
O
Output current Over V
O
range 25 ° C, natural convection 0 16 A
0.69 ≤V
O
≤1.2 4.5 14
(1)
V
I
Input voltage range Over I
O
range 1.2 < V
O
≤3.6 4.5 14 V
3.6 < V
O
≤5.5 V
O
+ 2 14
V
OADJ
Output voltage adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 0.5 ± 1
(2)
%V
o
Temperature variation – 40 ° C < T
A
< 85 ° C ± 0.3 %V
o
V
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 ° C ≤T
A
≤85 ° C ± 1.5
(2)
%V
o
R
SET
= 171 Ω, V
I
= 8 V, V
O
= 5.0 V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 94%
R
SET
= 2.38 k Ω, V
O
= 2.5 V 91%
ηEfficiency I
O
= 16 A R
SET
= 4.78 k Ω, V
O
= 1.8 V 88%
R
SET
= 7.09 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V
(1)
84%
R
SET
= 20.8 k Ω, V
O
= 1.0 V
(1)
82%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 15
(1)
mV
PP
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 32 A
t
tr
Recovery time 70 µ sw/o TurboTrans
C
O
= 220 µF, TypeCΔV
tr
2.5 A/ µ s load step V
O
over/undershoot 150 mVTransient response 50 to 100% I
O
maxt
trTT
w/ TurboTrans Recovery time 130 µ sV
O
= 2.5 V
C
O
= 2000 µF, TypeC
mVΔV
trTT
V
O
over/undershoot 30R
TT
= short
I
IL
Track input current (pin 10) Pin to GND – 130
(3)
µ A
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 3.7 4.2 V(pin 11)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(4)
VInhibit control (pin 11) Input low voltage (V
IL
) -0.2 0.8
Input low current (I
IL
), Pin 11 to GND -235 µ A
I
in
Input standby current Inhibit (pin 11) to GND, Track (pin 10) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
Synchronization (SYNC)f
SYNC
240 400 kHzfrequency
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 V
V
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
Nonceramic 330
(5)C
I
External input capacitance µ FCeramic 22
(5)
(1) For output voltages ≤1.2 V, at nominal operating frequency, the output ripple may increase (typically 2 × ) when operating at inputvoltages greater than (V
O
× 11). When using the SmartSync feature to adjust the switching frequency, see the SmartSyncConsiderations section of the datasheet for further guidance.(2) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(3) A low-leakage ( < 100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. Theopen-circuit voltage is less than 8 V
dc
.(4) Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when input power is applied. A small,low-leakage ( < 100 nA) MOSFET is recommended for control. For additional information, see the related application section.(5) A 330 µ F electrolytic and a 22 µF ceramic input capacitor is required for proper operation. The electrolytic capacitor must be rated for aminimum of 700 mA rms of ripple current.
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS
PTH08T220W
(continued)
T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 330 µ F, C
I
2 = 22 µF, C
O
= 220 µ F, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T220W UNIT
MIN TYP MAX
Capacitance Value Nonceramic 220
(6)
5000
(7)
µ Fw/o TurboTrans Ceramic 500
Equivalent series resistance (non-ceramic) 7 m ΩC
O
External output capacitance
see tableCapacitance Value µ F(6) (8)w/ TurboTrans
Capacitance × ESR product (C
O
× ESR) 1000 10000
(8)
µ F × m Ω
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.1
10
6
HrT
A
= 40 ° C, ground benign
(6) A 220 µ F external output capacitor is required for basic operation. The minimum output capacitance requirement increases whenTurboTrans™ (TT) technology is utilized. See related Application Information for more guidance.(7) This is the calculated maximum disregarding TurboTrans™ technology.(8) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESRcapacitors are required for proper operation. See the application notes for further guidance.
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ELECTRICAL CHARACTERISTICS
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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PTH08T221W (ceramic capacitors)T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 300 µ F ceramic, C
O
= 300 µ F ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T221W UNIT
MIN TYP MAX
I
O
Output current Over V
O
range 25 ° C, natural convection 0 16 A
0.69 ≤V
O
≤1.2 4.5 14
(1)
V
I
Input voltage range Over I
O
range 1.2 < V
O
≤3.6 4.5 14 V
3.6 < V
O
≤5.5 V
O
+ 2 14
V
OADJ
Output voltage adjust range Over I
O
range 0.69 5.5 V
Set-point voltage tolerance ± 0.5 ± 1
(2)
%V
o
Temperature variation – 40 ° C < T
A
< 85 ° C ± 0.3 %V
o
V
O
Line regulaltion Over V
I
range ± 3 mV
Load regulation Over I
O
range ± 2 mV
Total output variation Includes set-point, line, load, – 40 ° C ≤T
A
≤85 ° C ± 1.5
(2)
%V
o
R
SET
= 171 Ω, V
I
= 8 V, V
O
= 5.0 V 95%
R
SET
= 1.21 k Ω, V
O
= 3.3 V 94%
R
SET
= 2.38 k Ω, V
O
= 2.5 V 91%
ηEfficiency I
O
= 16 A R
SET
= 4.78 k Ω, V
O
= 1.8 V 88%
R
SET
= 7.09 k Ω, V
O
= 1.5 V 87%
R
SET
= 12.1 k Ω, V
O
= 1.2 V
(1)
84%
R
SET
= 20.8 k Ω, V
O
= 1.0 V
(1)
82%
V
O
Ripple (peak-to-peak) 20-MHz bandwidth 15
(1)
mV
PP
I
LIM
Overcurrent threshold Reset, followed by auto-recovery 32 A
t
tr
Recovery time 70 µ sw/o TurboTrans
C
O
= 300 µF, TypeAΔV
tr
2.5 A/ µ s load step V
O
over/undershoot 150 mVTransient response 50 to 100% I
O
maxt
trTT
w/ TurboTrans Recovery time 200 µ sV
O
= 2.5 V
C
O
= 1500 µF, TypeA
mVΔV
trTT
V
O
over/undershoot 65R
TT
= short
I
IL
Track input current (pin 10) Pin to GND – 130
(3)
µ A
dV
track
/dt Track slew rate capability C
O
≤C
O
(max) 1 V/ms
V
I
increasing, R
UVLO
= OPEN 4.3 4.45Adjustable Under-voltage lockoutUVLO
ADJ
V
I
decreasing, R
UVLO
= OPEN 3.7 4.2 V(pin 11)
Hysteresis, R
UVLO
≤52.3 k Ω0.5
Input high voltage (V
IH
) Open
(4)
VInhibit control (pin 11) Input low voltage (V
IL
) -0.2 0.8
Input low current (I
IL
), Pin 11 to GND -235 µ A
I
in
Input standby current Inhibit (pin 11) to GND, Track (pin 10) open 5 mA
f
s
Switching frequency Over V
I
and I
O
ranges, SmartSync (pin 1) to GND 300 kHz
Synchronization (SYNC)f
SYNC
240 400 kHzfrequency
V
SYNCH
SYNC High-Level Input Voltage 2 5.5 V
V
SYNCL
SYNC Low-Level Input Voltage 0.8 V
t
SYNC
SYNC Minimum Pulse Width 200 nSec
C
I
External input capacitance 300
(5)
µ F
(1) For output voltages ≤1.2 V, at nominal operating frequency, the output ripple may increase (typically 2 × ) when operating at inputvoltages greater than (V
O
× 11). When using the SmartSync feature to adjust the switching frequency, see the SmartSyncConsiderations section of the datasheet for further guidance.(2) The set-point voltage tolerance is affected by the tolerance and stability of R
SET
. The stated limit is unconditionally met if R
SET
has atolerance of 1% with 100 ppm/C or better temperature stability.(3) A low-leakage ( < 100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. Theopen-circuit voltage is less than 8 V
dc
.(4) Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when input power is applied. A small,low-leakage ( < 100 nA) MOSFET is recommended for control. For additional information, see the related application section.(5) 300 µ F of input capacitance is required for proper operation. 300 µ F of ceramic or 330 µ F of electrolytic input capacitance can be used.Electrolytic capacitance must be rated for a minimum of 700 mA rms of ripple current. An additional 22- µF ceramic input capacitor isrecommended to reduce rms ripple current.
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS
PTH08T221W (ceramic capacitors) (continued)T
A
= 25 ° C, V
I
= 5 V, V
O
= 3.3 V, C
I
= 300 µ F ceramic, C
O
= 300 µ F ceramic, and I
O
= I
O
max (unless otherwise stated)
PARAMETER TEST CONDITIONS PTH08T221W UNIT
MIN TYP MAX
w/o TurboTrans Capacitance Value Ceramic 300
(6)
3000
(7)
µ F
see tableC
O
External output capacitance Capacitance Value 5000 µ F(6)w/ TurboTrans
Capacitance × ESR product (C
O
× ESR) 100 1000 µ F × m Ω
Per Telcordia SR-332, 50% stress,MTBF Reliability 6.1
10
6
HrT
A
= 40 ° C, ground benign
(6) A minimum of 300 µ F ceramic external output capacitance is required for basic operation. The minimum output capacitance requirementincreases when TurboTrans™ (TT) technology is utilized. See related Application Information section for more guidance.(7) This is the calculated maximum disregarding TurboTrans™ technology.
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1 10
9
7
6
5
432
11
8
PTH08T220W/221W
(Top View)
PTH08T220W , PTH08T221W
SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009 ...................................................................................................................................................
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TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
V
I
2 The positive input voltage power node to the module, which is referenced to common GND.V
O
5 The regulated positive power output with respect to GND.This is the common ground connection for the V
I
and V
O
power connections. It is also the 0 V
dc
reference for theGND 3, 4
control inputs.The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low levelground signal to this input disables the module ’ s output and turns off the output voltage. When the Inhibit controlis active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, theInhibit
(1)
and
module produces an output whenever a valid input source is applied.11UVLO
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin toGND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For moreinformation, see the Application Information section.A 0.05 W 1% resistor must be directly connected between this pin and pin7 ( – Sense) to set the output voltage toa value higher than 0.69V. The temperature stability of the resistor should be 100 ppm/ ° C (or better). Thesetpoint range for the output voltage is from 0.69V to 5.5V. If left open circuit, the output voltage will default to itsV
o
Adjust 8
lowest value. For further information, on output voltage adjustment see the related application note.The specification table gives the preferred resistor values for a number of standard output voltages.The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.+ Sense 6 The +Sense pin should always be connected to V
O
, either at the load for optimal voltage accuracy, or at themodule (pin 5).The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.– Sense 7
For optimal voltage accuracy – Sense must be connected to GND (pin4) very close to the module (within 10cm).This is an analog control input that enables the output voltage to follow an external voltage. This pin becomesactive typically 20 ms after the input voltage has been applied, and allows direct control of the output voltagefrom 0 V up to the nominal set-point voltage. Within this range the module ' s output voltage follows the voltage atTrack 10
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulatesat its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules poweredfrom the same input bus. If unused, this input should be connected to V
I
.NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltageduring power up. For more information, see the related application note.This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%, 50mWresistor, must be connected between this pin and pin 6 (+Sense) very close to the module. For a given value ofoutput capacitance, a reduction in peak output voltage deviation is achieved by utililizing this feature. If unused,TurboTrans™ 9
this pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans resistor tablein the Application Information section. External capacitance must never be connected to this pin unless theTurboTrans resistor value is a short, 0 Ω.This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSyncfeature can be used to sychronize the switching fequency of multiple PTH08T220/221W modules, aiding EMISmartSync 1
noise suppression efforts. If unused, this pin should be connected to GND (pin3). For more information, pleasereview the Application Information section.
(1) Denotes negative logic: Open = Normal operation, Ground = Function active
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 12 V)
VO − Output Voltage Ripple − VPP (mV)
IO − Output Current − A
0
0
10
20
40
50
30
2 4 6 8 10 12 14 16
VO = 1.2 V
VO = 5 V
VO = 3.3 V
VO = 1.8 V VO = 2.5 V
η − Efficiency − %
IO − Output Current − A
0
90
2
95
70
65
60
75
85
80
468
3.3 V
5 V
2.5 V
1.8 V
1.2 V
10 12 14 16
0
02
1
4
2
3
6
5
4 6 10 12 14 168
PD − OuPower Dissipation − W
IO − Output Current − A
VO = 1.2 V
VO = 5 V
VO = 3.3 V
VO = 1.8 V
VO = 2.5 V
TA − Ambient T emperature − °C
IO − Output Current − A
40
30
20
70
60
50
90
80
0 161284
VO = 3.3 V
Nat Conv
100 LFM
200 LFM
400 LFM
TA − Ambient T emperature − °C
IO − Output Current − A
20
30
40
50
60
70
80
90
0 4 12 168
Nat Conv
100 LFM
200 LFM
400 LFM
VO = 1.2 V
20
30
40
50
60
70
80
90
0 4 12 168
TA − AMbient T emperature − °C
IO − Output Current − A
VO = 5.0 V
Nat Conv
100 LFM
200 LFM
400 LFM
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 1. Figure 2. Figure 3.
AMBIENT TEMPERATURE AMBIENT TEMPERATURE AMBIENT TEMPERATUREvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 4. Safe Operating Area Figure 5. Safe Operating Area Figure 6. Safe Operating Area
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 1 ,Figure 2 , and Figure 3 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for moreinformation. Applies to Figure 5 .
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TYPICAL CHARACTERISTICS
(1) (2)
CHARACTERISTIC DATA ( V
I
= 5 V)
IO − Output Current − A
− Power Dissipation − W
PD
0
0.5
1
1.5
2
2.5
3
3.5
4
0 4 8 12 16
VO = 1.5 V
VO = 0.7 V
VO = 2.5 V
VO = 3.3 V
I − OutputCurrent − A
O
V OutputVoltageRipple − V (mV)
O PP
−
5
10
15
20
4812 16
0
0
VO=3.3V
VO=1.8V
VO=0.7V
VO=1.2V
VO=2.5V
TA − Ambient Temperature − °C
IO − Output Current − A
VO = 1.2 V
20
30
40
50
60
70
80
90
0 4 12 168
Nat Conv
100 LFM
200 LFM
400 LFM
TA − Ambient Temperature − °C
IO − Output Current − A
20
30
40
50
60
70
80
90
0 4 12 168
200 LFM
Nat Conv
VO = 3.3 V
100 LFM
400 LFM
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EFFICIENCY OUTPUT RIPPLE POWER DISSIPATIONvs vs vsLOAD CURRENT LOAD CURRENT LOAD CURRENT
Figure 7. Figure 8. Figure 9.
AMBIENT TEMPERATURE AMBIENT TEMPERATUREvs vsLOAD CURRENT LOAD CURRENT
Figure 10. Safe Operating Area Figure 11. Safe Operating Area
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for theconverter. Applies to Figure 7 ,Figure 8 , and Figure 9 .(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer ' s maximumoperating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for moreinformation. Applies to Figure 10 .
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APPLICATION INFORMATION
ADJUSTING THE OUTPUT VOLTAGE
R =10k x
SET W0.69
V -0.69
O
-1.43kW
(1)
5
3 4
6
7
GND GND
8
GND
+Sense
VO
−Sense
V Adj
O
PTH08T220W/221W
RSET
1%
0.05W
+Sense
VO
−Sense
CO
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The V
o
Adjust control (pin 8) sets the output voltage of the PTH08T220/221W. The adjustment range of thePTH08T220/221W is 0.69 V to 5.5 V. The adjustment method requires the addition of a single external resistor,R
SET
, that must be connected directly between the V
o
Adjust and – Sense pins. Table 1 gives the standard valueof the external resistor for a number of standard voltages, along with the actual output voltage that this resistancevalue provides.
For other output voltages, the value of the required resistor can either be calculated using the following formula,or simply selected from the range of values given in Table 2 .Figure 12 shows the placement of the requiredresistor.
Table 1. Standard Values of R
SET
for Standard Output Voltages
V
O
(Standard) R
SET
(Standard Value) V
O
(Actual)
5.0 V
(1)
169 Ω5.005 V3.3 V 1.21 k Ω3.304 V2.5 V 2.37 k Ω2.506 V1.8 V 4.75 k Ω1.807 V1.5 V 6.98 k Ω1.510 V1.2 V
(2)
12.1 k Ω1.200 V1.0 V
(2)
20.5 k Ω1.004 V0.7 V
(2)
681 k Ω0.700 V
(1) For V
O
> 3.6 V, the minimum input voltage is (V
O
+ 2) V.(2) For output voltages ≤1.2V, at nominal operating frequency, the output ripple may increase (typically2 × ) when operating at input voltages greater than (V
O
× 11). When using the SmartSync feature,review the SmartSync application section for further guidance.
(1) R
SET
:Use a 0.05 W resistor with a tolerance of 1% and temperature stability of 100 ppm/ ° C (or better). Connect theresistor directly between pins 8 and 7, as close to the regulator as possible, using dedicated PCB traces.(2) Never connect capacitors from V
O
Adjust to either + Sense, GND, or V
O
. Any capacitance added to the V
O
Adjust pinaffects the stability of the regulator.
Figure 12. V
O
Adjust Resistor Placement
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Table 2. Output Voltage Set-Point Resistor Values (Standard Values)
V
O
Required R
SET
(Ω) V
O
Required (V) R
SET
(Ω)
0.70
(1)
681 k 2.50 2.37 k0.75
(1)
113 k 2.60 2.15 k0.80
(1)
61.9 k 2.70 2.00 k0.85
(1)
41.2 k 2.80 1.82 k0.90
(1)
31.6 k 2.90 1.69 k0.95
(1)
24.9 k 3.00 1.54 k1.00
(1)
20.5 k 3.10 1.43 k1.05
(1)
17.8 k 3.20 1.33 k1.10
(1)
15.4 k 3.30 1.21 k1.15
(1)
13.3 k 3.40 1.10 k1.20
(1)
12.1 k 3.50 1.02 k1.25 10.7 k 3.60 9311.30 9.88 k 3.70
(2)
8661.35 9.09 k 3.80
(2)
7871.40 8.25 k 3.90
(2)
7151.45 7.68 k 4.00
(2)
6491.50 6.98 k 4.10
(2)
5901.55 6.49 k 4.20
(2)
5361.60 6.04 k 4.30
(2)
4751.65 5.76 k 4.40
(2)
4321.70 5.36 k 4.50
(2)
3831.75 5.11 k 4.60
(2)
3321.80 4.75 k 4.70
(2)
2871.85 4.53 k 4.80
(2)
2491.90 4.22 k 4.90
(2)
2101.95 4.02 k 5.00
(2)
1692.00 3.83 k 5.10
(2)
1332.10 3.40 k 5.20
(2)
1002.20 3.09 k 5.30
(2)
66.52.30 2.87 k 5.40
(2)
34.82.40 2.61 k 5.50
(2)
4.99
(1) For output voltages ≤1.2V, at nominal operating frequency, the output ripple may increase (typically2 × ) when operating at input voltages greater than (V
O
× 11). When using the SmartSync feature,review the SmartSync application section for further guidance.(2) For V
O
> 3.6 V, the minimum input voltage is (V
O
+ 2) V.
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CAPACITOR RECOMMENDATIONS FOR THE PTH08T220/221W POWER MODULE
Capacitor Technologies
Input Capacitor (Required)
Input Capacitor Information
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................................................................................................................................................... SLTS252K – NOVEMBER 2005 – REVISED JUNE 2009
Electrolytic CapacitorsWhen using electrolytic capacitors, high quality, computer-grade electrolytic capacitors are recommended.Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz,and are suitable when ambient temperatures are above -20 ° C. For operation below -20 ° C, tantalum,ceramic, or OS-CON type capacitors are required.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramiccapacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. Theycan be used to reduce the reflected ripple current at the input as well as improve the transient response ofthe output.
Tantalum, Polymer-Tantalum CapacitorsTantalum type capacitors may only used on the output bus, and are recommended for applications where theambient operating temperature is less than 0 ° C. The AVX TPS series and Kemet capacitor series aresuggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are notrecommended for power applications.
The PTH08T221W requires a minimum input capacitance of 300 µF of ceramic type.
The PTH08T220W requires a combination of one 22 µF X5R/X7R ceramic and 330 µF electrolytic type. The ripplecurrent rating of the electrolytic capacitor must be at least 950mArms. The ripple current rating must increase to1500mArms when V
O
>2.1 V and I
O
≥11A.
The size and value of the input capacitor is determined by the converter ’ s transient performance capability. Thisminimum value assumes that the converter is supplied with a responsive, low inductance input source. Thissource should have ample capacitive decoupling, and be distributed to the converter via PCB power and groundplanes.
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. Thiswill reduce the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripplecurrent reflected back to the input source. Additional ceramic capacitors can be added to further reduce the RMSripple current requirement for the electrolytic capacitor.
Increasing the minimum input capacitance to 680 µ F is recommended for high-performance applications, orwherever the input source performance is degraded.
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,and less than 100 m Ωof equivalent series resistance (ESR).
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommendedminimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability.No tantalum capacitors were found with a sufficient voltage rating to meet this requirement.
When the operating temperature is below 0 ° C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
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Output Capacitor (Required)
Output Capacitor Information
TurboTrans Output Capacitance
Non-TurboTrans Output Capacitance
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The PTH08T221W requires a minimum output capacitance of 300 µF of ceramic type.
The PTH08T220W requires a minimum output capacitance of 220 µF of aluminum, polymer-aluminum, tantulum,or polymer-tantalum type.
The required capacitance above the minimum will be determined by actual transient deviation requirements. Seethe TurboTrans Technology application section within this document for specific capacitance selection.
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.When using the TurboTrans feature, the capacitance X ESR product should also be considered (see thefollowing section).
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to theload to be effective. Ceramic capacitor values below 10 µF should not be included when calculating the totaloutput capacitance value.
When the operating temperature is below 0 ° C, the ESR of aluminum electrolytic capacitors increases. For theseapplications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
TurboTrans allows the designer to optimize the output capacitance according to the system transient designrequirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. Whenusing TurboTrans, the capacitor's capacitance ( µF) × ESR (m Ω) product determines its capacitor type; Type A,B, or C. These three types are defined as follows:
Type A = (100 ≤capacitance × ESR ≤1000) (e.g. ceramic)
Type B = (1000 < capacitance × ESR ≤5000) (e.g. polymer-tantalum)
Type C = (5000 < capacitance × ESR ≤10,000) (e.g. OS-CON)
When using more than one type of output capacitor, select the capacitor type that makes up the majority of yourtotal output capacitance. When calculating the C × ESR product, use the maximum ESR value from the capacitormanufacturer's datasheet.
The PTH08T221W should be used when only Type A (ceramic) capacitors are used on the output.
Working Examples:
A capacitor with a capacitance of 330 µF and an ESR of 5m Ω, has a C × ESR product of 1650 µFxm Ω(330 µF ×5m Ω). This is a Type B capacitor. A capacitor with a capacitance of 1000 µF and an ESR of 8m Ω, has a C × ESRproduct of 8000 µFxm Ω(1000 µF × 8m Ω). This is a Type C capacitor.
See the TurboTrans Technology application section within this document for specific capacitance selection.
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
If the TurboTrans feature is not used, minimum ESR and maximum capacitor limits must be followed. Systemstability may be effected and increased output capacitance may be required without TurboTrans.
When using the PTH08T220W, observe the minimum ESR of the entire output capacitor bank. The minimumESR limit of the output capacitor bank is 7m Ω. A list of preferred low-ESR type capacitors, are identified inTable 3 .
When using the PTH08T221W without the TurboTrans feature, the maximum amount of capacitance is 3000 µFof ceramic type. Large amounts of capacitance may reduce system stability.
Utilizing the TurboTrans feature improves system stability, improves transient response, and reduces theamount of output capacitance required to meet system transient design requirements.
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Designing for Fast Load Transients
Capacitor Table
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The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of2.5A/ µ s. The typical voltage deviation for this load transient is given in the Electrical Characteristics table usingthe minimum required value of output capacitance. As the di/dt of a transient is increased, the response of aconverter ’ s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherentlimitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met withadditional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100A/ µs, addingmultiple 10 µF ceramic capacitors plus 10 × 1 µF, and numerous high frequency ceramics ( ≤0.1 µF) is all that isrequired to soften the transient higher frequency edges. The PCB location of these capacitors in relation to theload is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required foroptimum performance. Low impedance buses, unbroken PCB copper planes, and components located as closeas possible to the high frequency devices are essential for optimizing transient performance.
Table 3 identifies the characteristics of acceptable capacitors from a number of vendors. The recommendednumber of capacitors required at both the input and output buses is identified for each capacitor.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparablespecifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are criticalparameters necessary to ensure both optimum regulator performance and long capacitor life.
Table 3. Input/Output Capacitors
(1)
Capacitor Characteristics Quantity
Max Output BusMax.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage ( µ F) at 100 Size (mm) Bus
Turbo- Transat 85 ° CkHz
Trans Cap Type
(2)(Irms)
Panasonic
FC (Radial) 25 V 1000 43m Ω1690mA 16 × 15 1 ≥2
(3)
N/R
(4)
EEUFC1E102S
FC (Radial) 25 V 820 38m Ω1655mA 12 × 20 1 ≥1
(3)
N/R
(4)
EEUFC1E821S
FC (SMD) 35 V 470 43m Ω1690mA 16 × 16,5 1 ≥1
(3)
N/R
(4)
EEVFC1V471N
FK (SMD) 35 V 1000 35m Ω1800mA 16 × 16,5 1 ≥2
(3)
N/R
(4)
EEVFK1V102M
United Chemi-Con
PTB, Poly-Tantalum(SMD) 6.3 V 330 25m Ω2600mA 7,3 × 4,3 × 2.8 N/R
(5)
1 ~ 4
(3)
C≥2
(2)
6PTB337MD6TER (V
O
≤5.1V)
(6)
LXZ, Aluminum (Radial) 35 V 680 38m Ω1660mA 12,5 × 20 1 1 ~ 3
(3)
N/R
(4)
LXZ35VB681M12X20LL
PS, Poly-Alum (Radial) 16 V 330 14m Ω5060mA 10 × 12,5 1 1 ~ 3 B ≥2
(2)
16PS330MJ12
PS, Poly-Alum (Radial) 6.3 V 390 12m Ω5500mA 8 × 12,5 N/R
(5)
1 ~ 2 B ≥1
(2)
6PS390MH11 (V
O
≤5.1V)
(6)
PXA, Poly-Alum (SMD) 16 V 330 14m Ω5050mA 10 × 12,2 1 1 ~ 3 B ≥2
(2)
PXA16VC331MJ12TP
PXA, Poly-Alum (Radial) 10 V 330 14m Ω4420mA 8 × 12,2 N/R
(5)
1 ~ 2 B ≥1
(2)
PXA10VC331MH12
(1) Capacitor Supplier VerificationPlease verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because oflimited availability or obsolete products.RoHS, Lead-free and Material DetailsSee the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.Component designators or part number deviations can occur when material composition or soldering requirements are updated.(2) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance × ESR ≤1000)b. Type B = (1,000 < capacitance × ESR ≤5,000)c. Type C = (5,000 < capacitance × ESR ≤10,000)(3) Total bulk nonceramic capacitors on the output bus with ESR ≥15m Ωto ≤30m Ωrequires an additional 200 µF of ceramic capacitance.(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(6) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
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Table 3. Input/Output Capacitors (continued)Capacitor Characteristics Quantity
Max Output BusMax.Capacitor Vendor,
RippleWorking Value ESR Physical InputType Series (Style)
No Turbo-Current Vendor Part No.Voltage ( µ F) at 100 Size (mm) Bus
Turbo- Transat 85 ° CkHz
Trans Cap Type
(2)(Irms)
Nichicon, Aluminum
PM (Radial) 25 V 1000 43m Ω1520mA 18 × 15 1 ≥2
(7)
N/R
(8)
UPM1E102MHH6
HD (Radial) 35 V 470 23m Ω1820mA 10 × 20 1 ≥2
(7)
N/R
(8)
UHD1V471HR
Panasonic, Poly-Aluminum 2.0 V 390 5m Ω4000mA 7,3 × 4,3 × 4,2 N/R
(9)
N/R
(9)
B≥2
(10)
EEFSE0J391R(V
O
≤1.6V)
(11)
Sanyo
TPE, Poscap (SMD) 10 V 330 25m Ω3300mA 7,3 × 4,3 N/R
(9)
1 ~ 3 C ≥1
(10)
10TPE330MF
(11)
TPE, Poscap (SMD) 2.5 V 470 7m Ω4400mA 7,3 × 4,3 N/R
(9)
1 ~ 2 B ≥2
(10)
2R5TPE470M7(V
O
≤1.8V)
(11)
TPD, Poscap (SMD) 2.5 V 1000 5m Ω6100mA 7,3 × 4,3 N/R
(9)
1 B ≥1
(10)
2R5TPD1000M5(V
O
≤1.8V)
(11)
SEP, OS-CON (Radial) 16 V 330 16m Ω4700mA 10 × 13 1 1 ~ 2 B ≥1
(10)
16SEP330M
SEPC, OS-CON (Radial) 16 V 470 10m Ω6100mA 10 × 13 1 1 ~ 2 B ≥2
(10)
16SEPC470M
SVP, OS-CON (SMD) 16 V 330 16m Ω4700mA 10 × 12,6 1 1 ~ 2
(7)
B≥1
(10) (7)
16SVP330M
AVX, Tantalum
TPM Multianode 10 V 330 23m Ω3000mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 3
(7)
C≥2
(10)
TPME337M010R0035
TPS Series III (SMD) 10 V 330 40m Ω1830mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 6
(7)
N/R
(8)
TPSE337M010R0040 (V
O
≤5V)
(12)
TPS Series III (SMD) 4 V 1000 25m Ω2400mA 7,3 × 6,1 × 3.5 N/R
(9)
1 ~ 5
(7)
N/R
(8)
TPSV108K004R0035 (V
O
≤2.1V)
(12)
Kemet, Poly-Tantalum
T520 (SMD) 10 V 330 25m Ω2600mA 7,3 × 4,3 × 4,1 N/R
(9)
1 ~ 3
(7)
C≥2
(10)
T520X337M010ASE025
(11)
T530 (SMD) 6.3 V 330 15m Ω3800mA 7,3 × 4,3 × 4,1 N/R
(9)
2 ~ 3 B ≥2
(10)
T530X337M010ASE015
(11)
T530 (SMD) 4 V 680 5m Ω7300mA 7,3 × 4,3 × 4,1 N/R
(9)
1 B ≥1
(10)
T530X687M004ASE005 (V
O
≤3.5V)
(11)
T530 (SMD) 2.5 V 1000 5m Ω7300mA 7,3 × 4,3 × 4,1 N/R
(9)
1 B ≥1
(10)
T530X108M2R5ASE005 (V
O
≤2.0V)
(11)
Vishay-Sprague
597D, Tantalum (SMD) 10 V 330 35m Ω2500mA 7,3 × 5,7 × 4,1 N/R
(9)
1 ~ 5 N/R
(8)
597D337X010E2T
94SA, OS-CON (Radial) 16 V 470 20m Ω6080mA 12 × 22 1 1 ~ 3 C ≥2
(10)
94SA477X0016GBP
94SVP OS-CON(SMD) 16 V 330 17m Ω4500mA 10 × 12,7 2 2 ~ 3 C ≥1
(10)
94SVP337X06F12
Kemet, Ceramic X5R 16 V 10 2m Ω– 3225 1 ≥1
(13)
A
(10)
C1210C106M4PAC
(SMD) 6.3 V 47 2m ΩN/R
(9)
≥1
(13)
A
(10)
C1210C476K9PAC
Murata, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(13)
A
(10)
GRM32ER60J107M
(SMD) 6.3 V 47 N/R
(9)
≥1
(13)
A
(10)
GRM32ER60J476M
25 V 22 1 ≥1
(13)
A
(10)
GRM32ER61E226K
16 V 10 1 ≥1
(13)
A
(10)
GRM32DR61C106K
TDK, Ceramic X5R 6.3 V 100 2m Ω– 3225 N/R
(9)
≥1
(13)
A
(10)
C3225X5R0J107MT
(SMD) 6.3 V 47 N/R
(9)
≥1
(13)
A
(10)
C3225X5R0J476MT
16 V 10 1 ≥1
(13)
A
(10)
C3225X5R1C106MT0
16 V 22 1 ≥1
(13)
A
(10)
C3225X5R1C226MT
(7) Total bulk nonceramic capacitors on the output bus with ESR ≥15m Ωto ≤30m Ωrequires an additional 200 µF of ceramic capacitance.(8) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higherESR capacitors can be used in conjunction with lower ESR capacitance.(9) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.(10) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor SelectionCapacitor Types:a. Type A = (100 < capacitance × ESR ≤1000)b. Type B = (1,000 < capacitance × ESR ≤5,000)c. Type C = (5,000 < capacitance × ESR ≤10,000)(11) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.(12) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 50% of the working voltage.(13) Any combination of ceramic capacitor values is limited to 500 µF for PTH08T220W and 5000 µF for PTH08T221W. The totalcapacitance for PTH08T220W is limited to 10,000 µF which includes all ceramic and non-ceramic types.
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