ADSP-BF514BBCZ-4 - Analog Devices

Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.

Blackfin

Embedded Processor

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B

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FEATURES

Up to 400 MHz high performance Blackfin processor

Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,

40-bit shifter

RISC-like register and instruction model for ease of

programming and compiler-friendly support

Advanced debug, trace, and performance monitoring

Wide range of operating voltages. See Operating Conditions

on Page 20

Qualified for Automotive Applications. See Automotive

Products on Page 65

168-ball CSP_BGA or 176-lead LQFP with exposed pad

MEMORY

116K bytes of on-chip memory

External memory controller with glueless support for SDRAM

and asynchronous 8-bit and 16-bit memories

Optional 4M bit SPI flash with boot option

Flexible booting options from internal SPI flash, OTP

memory, external SPI/parallel memories, or from SPI/UART

host devices

Code security with Lockbox secure technology

One-time-programmable (OTP) memory

Memory management unit providing memory protection

PERIPHERALS

IEEE 802.3-compliant 10/100 Ethernet MAC with IEEE 1588

support (ADSP-BF518/ADSP-BF518F only)

Parallel peripheral interface (PPI), supporting ITU-R 656

video data formats

2 dual-channel, full-duplex synchronous serial ports

(SPORTs), supporting 8 stereo I

S channels

12 peripheral DMAs, 2 mastered by the Ethernet MAC

2 memory-to-memory DMAs with external request lines

Event handler with 56 interrupt inputs

2 serial peripheral interfaces (SPI)

Removable storage interface (RSI) controller for MMC, SD,

SDIO, and CE-ATA

2 UARTs with IrDA support

2-wire interface (TWI) controller

Eight 32-bit timers/counters with PWM support

3-phase 16-bit center-based PWM unit

32-bit general-purpose counter

Real-time clock (RTC) and watchdog timer

32-bit core timer

40 general-purpose I/Os (GPIOs)

Debug/JTAG interface

On-chip PLL capable of frequency multiplication

JTAG TEST AND EMULATION

PERIPHERAL

ACCESS BUS

OTP

3-PHASE PWM

WATCHDOG TIMERRTC

TWI

SPORT1-0

RSI (SDIO)

PPI

UART1–0

SPI0

4 Mbit SPI Flash

(See Table 1)

SPI1

TIMER7–0

COUNTER

EMAC

BOOT

ROM

DMA

EXTERNAL

BUS

INTERRUPT

CONTROLLER

DMA

CONTROLLER

DATA

MEMORY

INSTRUCTION

MEMORY

16 DMA CORE BUS

EXTERNAL ACCESS BUS

EXTERNAL PORT

FLASH, SDRAM CONTROL

PORTS

Rev. B | Page 2 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

TABLE OF CONTENTS

Features ................................................................. 1

Memory ................................................................ 1

Peripherals ............................................................. 1

Revision History ...................................................... 2

General Description ................................................. 3

Portable Low Power Architecture ............................. 3

System Integration ................................................ 3

Blackfin Processor Core .......................................... 3

Memory Architecture ............................................ 5

Event Handling .................................................... 6

DMA Controllers .................................................. 7

Processor Peripherals ............................................. 7

Dynamic Power Management ................................ 11

Voltage Regulation Interface .................................. 13

Clock Signals ..................................................... 13

Booting Modes ................................................... 14

Instruction Set Description ................................... 15

Development Tools ............................................. 15

Designing an Emulator-Compatible

Processor Board (Target) ................................... 16

Related Documents ............................................. 16

Related Signal Chains ........................................... 16

Lockbox Secure Technology Disclaimer .................... 16

Signal Descriptions ................................................. 17

Specifications ........................................................ 20

Operating Conditions ........................................... 20

Electrical Characteristics ....................................... 22

Flash Memory Characteristics ................................ 24

Absolute Maximum Ratings ................................... 25

Package Information ............................................ 26

ESD Sensitivity ................................................... 26

Timing Specifications ........................................... 27

Output Drive Currents ......................................... 50

Test Conditions .................................................. 52

Thermal Characteristics ........................................ 56

176-Lead LQFP Lead Assignment ............................... 57

168-Ball CSP_BGA Ball Assignment ........................... 60

Outline Dimensions ................................................ 63

Surface-Mount Design .......................................... 64

Automotive Products .............................................. 65

Ordering Guide ..................................................... 65

REVISION HISTORY

1/11—Rev. A to Rev. B

This data sheet release coincides with the release of the revised

ADSP-BF51x Blackfin Processor Hardware Reference. All

redundant information has been removed.

Revised several specifications in Operating Conditions ... 20

Revised f

VCO

specification in Phase-Locked Loop Operating

Conditions ........................................................... 21

Revised several specifications in Electrical Characteristics 22

Added additional f

CKIN

specification for automotive models in

Clock and Reset Timing .......................................... 27

Changed the parameter V

DDMEM

to V

DDEXT

in Asynchronous

Memory Read Cycle Timing ..................................... 29

SDRAM Interface Timing ........................................ 31

Parallel Peripheral Interface Timing ........................... 33

Serial Ports ........................................................... 37

Revised t

HFSPE

specification in Parallel Peripheral Interface Tim-

ing ..................................................................... 33

Revised t

HFSPE

specification and added the t

PSUD

specification in

Parallel Peripheral Interface Timing ........................... 33

Revised the t

and t

specifications in

RSI Controller Timing ............................................ 35

Revised t

, t

and t

specification in RSI Controller Timing

(High Speed Mode) ................................................. 36

Revised t

MDCIH

and t

MDCOH

specifications in 10/100 Ethernet

MAC Controller Timing: MII Station Management ........ 48

Corrected dimensions in 168-Ball Chip Scale Package Ball Grid

Array [CSP_BGA] (BC-168-1) ................................... 64

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 3 of 68 | January 2011

GENERAL DESCRIPTION

The ADSP-BF512/ADSP-BF512F, ADSP-BF514/ADSP-

BF514F, ADSP-BF516/ADSP-BF516F, ADSP-BF518/ADSP-

BF518F processors are members of the Blackfin

family of prod-

ucts, incorporating the Analog Devices/Intel Micro Signal

Architecture (MSA). Blackfin processors combine a dual-MAC

state-of-the-art signal processing engine, the advantages of a

clean, orthogonal RISC-like microprocessor instruction set, and

single-instruction, multiple-data (SIMD) multimedia capabili-

ties into a single instruction-set architecture.

The processors are completely code compatible with other

Blackfin processors.

By integrating a rich set of industry-leading system peripherals

and memory, Blackfin processors are the platform of choice for

next-generation applications that require RISC-like program-

mability, multimedia support, and leading-edge signal

processing in one integrated package.

PORTABLE LOW POWER ARCHITECTURE

Blackfin processors provide world-class power management

and performance. They are produced with a low power and low

voltage design methodology and feature on-chip dynamic

power management, which is the ability to vary both the voltage

and frequency of operation to significantly lower overall power

consumption. This capability can result in a substantial reduc-

tion in power consumption, compared with just varying the

frequency of operation. This allows longer battery life for

portable appliances.

SYSTEM INTEGRATION

The ADSP-BF51x processors are highly integrated system-on-a-

chip solutions for the next generation of embedded network

connected applications. By combining industry-standard inter-

faces with a high performance signal processing core, cost-

effective applications can be developed quickly, without the

need for costly external components. The system peripherals

include an IEEE-compliant 802.3 10/100 Ethernet MAC with

IEEE-1588 support (ADSP-BF518/ADSP-BF518F only), an RSI

controller, a TWI controller, two UART ports, two SPI ports,

two serial ports (SPORTs), nine general-purpose 32-bit timers

(eight with PWM capability), 3-phase PWM for motor control,

a real-time clock, a watchdog timer, and a parallel peripheral

interface (PPI).

BLACKFIN PROCESSOR CORE

As shown in Figure 1, the Blackfin processor core contains two

16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs,

four video ALUs, and a 40-bit shifter. The computation units

process 8-, 16-, or 32-bit data from the register file.

The compute register file contains eight 32-bit registers. When

performing compute operations on 16-bit operand data, the

operands for compute operations come from the multiported

Each MAC can perform a 16-bit by 16-bit multiply in each

cycle, accumulating the results into the 40-bit accumulators.

Signed and unsigned formats, rounding, and saturation

are supported.

The ALUs perform a traditional set of arithmetic and logical

operations on 16-bit or 32-bit data. In addition, many special

instructions are included to accelerate various signal processing

tasks. These include bit operations such as field extract and pop-

ulation count, modulo 2

multiply, divide primitives, saturation

and rounding, and sign/exponent detection. The set of video

instructions include byte alignment and packing operations,

16-bit and 8-bit adds with clipping, 8-bit average operations,

and 8-bit subtract/absolute value/accumulate (SAA) operations.

The compare/select and vector search instructions are also

provided.

Table 1. Processor Comparison

Feature

ADSP-BF512

ADSP-BF512F

ADSP-BF514

ADSP-BF514F

ADSP-BF516

ADSP-BF516F

ADSP-BF518

ADSP-BF518F

IEEE-1588 ––––––11

Ethernet MAC ––––1111

RSI ––111111

TWI 11111111

SPORTs 22222222

UARTs 22222222

SPIs 22222222

GP Timers 88888888

Watchdog Timers 11111111

RTC 11111111

PPI 11111111

Internal 4Mbit SPI flash –1–1–1–1

Rotary Counter 11111111

3-Phase PWM Pairs 33333333

GPIOs 40 40 40 40 40 40 40 40

Memory (bytes)

L1 Instruction SRAM 32K

L1 Instruction

SRAM/Cache

16K

L1 Data SRAM 32K

L1 Data SRAM/Cache 32K

L1 Scratchpad 4K

L3 Boot ROM 32K

Maximum Speed Grade 400 MHz

Package Options 176-Lead LQFP with Exposed Pad

168-Ball CSP_BGA

Rev. B | Page 4 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

For certain instructions, two 16-bit ALU operations can be per-

formed simultaneously on register pairs (a 16-bit high half and

16-bit low half of a compute register). If the second ALU is used,

quad 16-bit operations are possible.

The 40-bit shifter can perform shifts and rotates and is used to

support normalization, field extract, and field deposit

instructions.

The program sequencer controls the flow of instruction execu-

tion, including instruction alignment and decoding. For

program flow control, the sequencer supports PC relative and

indirect conditional jumps (with static branch prediction), and

subroutine calls. Hardware is provided to support zero-over-

head looping. The architecture is fully interlocked, meaning that

the programmer need not manage the pipeline when executing

instructions with data dependencies.

The address arithmetic unit provides two addresses for simulta-

neous dual fetches from memory. It contains a multiported

length, and base registers (for circular buffering), and eight

additional 32-bit pointer registers (for C-style indexed stack

manipulation).

Blackfin processors support a modified Harvard architecture in

combination with a hierarchical memory structure. Level 1 (L1)

memories are those that typically operate at the full processor

speed with little or no latency. At the L1 level, the instruction

memory holds instructions only. The two data memories hold

data, and a dedicated scratchpad data memory stores stack and

local variable information.

In addition, multiple L1 memory blocks are provided, offering a

configurable mix of SRAM and cache. The memory manage-

ment unit (MMU) provides memory protection for individual

tasks that may be operating on the core and can protect system

registers from unintended access.

The architecture provides three modes of operation: user mode,

supervisor mode, and emulation mode. User mode has

restricted access to certain system resources, thus providing a

protected software environment, while supervisor mode has

unrestricted access to the system and core resources.

The Blackfin processor instruction set has been optimized so

that 16-bit opcodes represent the most frequently used instruc-

tions, resulting in excellent compiled code density. Complex

DSP instructions are encoded into 32-bit opcodes, representing

fully featured multifunction instructions. Blackfin processors

support a limited multi-issue capability, where a 32-bit

Figure 1. Blackfin Processor Core

SEQUENCER

ALIGN

DECODE

LOOP BUFFER

16 16

8888

40 40

A0 A1

BARREL

SHIFTER

DATA ARITHMETIC UNIT

CONTROL

UNIT

R7.H

R6.H

R5.H

R4.H

R3.H

R2.H

R1.H

R0.H

R7.L

R6.L

R5.L

R4.L

R3.L

R2.L

R1.L

R0.L

ASTAT

40 40

32 32

32LD0

LD1

DAG0

DAG1

ADDRESS ARITHMETIC UNIT

DA1

DA0

PREG

RAB

TO MEMORY

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 5 of 68 | January 2011

instruction can be issued in parallel with two 16-bit instruc-

tions, allowing the programmer to use many of the core

resources in a single instruction cycle.

The Blackfin processor assembly language uses an algebraic syn-

tax for ease of coding and readability. The architecture has been

optimized for use in conjunction with the C/C++ compiler,

resulting in fast and efficient software implementations.

MEMORY ARCHITECTURE

The ADSP-BF51x processors view memory as a single unified

4G byte address space, using 32-bit addresses. All resources,

including internal memory, external memory, and I/O control

registers, occupy separate sections of this common address

space. The memory portions of this address space are arranged

in a hierarchical structure to provide a good cost/performance

balance of some very fast, low-latency on-chip memory as cache

or SRAM, and larger, lower-cost and performance off-chip

memory systems. The memory map for both internal and exter-

nal memory space is shown in Figure 2.

The on-chip L1 memory system is the highest-performance

memory available to the Blackfin processor. The off-chip mem-

ory system, accessed through the external bus interface unit

(EBIU), provides expansion with SDRAM, flash memory, and

SRAM, optionally accessing up to 132M bytes of

physical memory.

The memory DMA controller provides high bandwidth data-

movement capability. It can perform block transfers of code or

data between the internal memory and the external

memory spaces.

Internal (On-Chip) Memory

The ADSP-BF51x processors have three blocks of on-chip

memory that provide high bandwidth access to the core.

The first block is the L1 instruction memory, consisting of

48K bytes SRAM, of which 16K bytes can be configured as a

four-way set-associative cache. This memory is accessed at full

processor speed.

The second on-chip memory block is the L1 data memory, con-

sisting of up to two banks of up to 32K bytes each. Each memory

bank is configurable, offering both cache and SRAM functional-

ity. This memory block is accessed at full processor speed.

The third memory block is a 4K byte scratchpad SRAM which

runs at the same speed as the L1 memories, but is only accessible

as data SRAM and cannot be configured as cache memory.

External (Off-Chip) Memory

External memory is accessed via the EBIU. This 16-bit interface

provides a glueless connection to a bank of synchronous DRAM

(SDRAM) as well as up to four banks of asynchronous memory

devices including flash, EPROM, ROM, SRAM, and memory

mapped I/O devices.

The SDRAM controller can be programmed to interface to up

to 128M bytes of SDRAM. A separate row can be open for each

SDRAM internal bank, and the SDRAM controller supports up

to four internal SDRAM banks, improving overall performance.

The asynchronous memory controller can be programmed to

control up to four banks of devices with very flexible timing

parameters for a wide variety of devices. Each bank occupies a

1M byte segment regardless of the size of the devices used, so

that these banks are only contiguous if each is fully populated

with 1M byte of memory.

Flash Memory

The ADSP-BF512F/ADSP-BF514F/ADSP-BF516F/

ADSP-BF518F processors contain a SPI flash memory within

the package of the processor and connected to SPI0.

The SPI flash memory has a 4M bit capacity and 1.8V (nominal)

operating voltage. The program/erase endurance is 100,000

cycles per block, and this memory has greater than 100 years of

data retention capability. Also included are support for software

write protection and for fast erase and byte-program.

Figure 2. ADSP-BF51x Internal/External Memory Map

RESERVED

CORE MMR REGISTERS (2M BYTES)

RESERVED

SCRATCHPAD SRAM (4K BYTES)

INSTRUCTION BANK B SRAM (16K BYTES)

SYSTEM MMR REGISTERS (2M BYTES)

RESERVED

DATA BANK B SRAM / CACHE (16K BYTES)

DATA BANK B SRAM (16K BYTES)

DATA BANK A SRAM / CACHE (16K BYTES)

ASYNCMEMORYBANK3(1MBYTES)

ASYNCMEMORYBANK2(1MBYTES)

ASYNCMEMORYBANK1(1MBYTES)

ASYNCMEMORYBANK0(1MBYTES)

INSTRUCTION BANK C SRAM/CACHE (16K BYTES)

INTERNALMEMORYMAP

EXTERNALMEMORYMAP

0xFFFF FFFF

0xFFE0 0000

0xFFB0 0000

0xFFA1 4000

0xFFA1 0000

0xFF90 8000

0xFF90 4000

0xFF80 8000

0xFF80 4000

0x2040 0000

0x2030 0000

0x2020 0000

0x2010 0000

0x2000 0000

0xEF00 0000

0x0000 0000

0xFFC0 0000

0xFFB0 1000

0xFFA0 0000

DATA BANK A SRAM (16K BYTES)

0xFF90 0000

0xFF80 0000

RESERVED

0xFFA0 8000

INSTRUCTION BANK A SRAM (16K BYTES)

RESERVED

BOOT ROM (32K BYTES)

0xEF00 8000

RESERVED

0x08 00 0000

0xFFA0 4000

SDRAM MEMORY (16M BYTES

128M BYTES)

Rev. B | Page 6 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

The processors internally connect to the flash memory die with

the SPI0SCK, SPI0SEL4 or PH8, SPI0MOSI, and SPI0MISO sig-

nals similar to an external SPI flash. To further provide a secure

processing environment, these internally connected signals are

not exposed outside of the package. For this reason, program-

ming the ADSP-BF51xF flash memory is performed by running

code on the processor andcannot be programmed from external

signals. Data transfers between the SPI flash and the processor

cannot be probed externally. The flash memory has the follow-

ing additional features

• Serial Interface Architecture—SPI compatible with Mode 0

and Mode 3

• Superior Reliability—Endurance of 100,000 cycles and

greater than 100 years data retention

• Flexible Erase Capability—Uniform 4K Byte sectors and

uniform 32 and 64K Byte overlay blocks

• Fast Erase and Byte-Program—Chip-erase time = 125 ms

(typical), Sector-/Block-Erase Time = 62 ms (typical) Byte-

Program Time = 50 S (typical)

• Auto Address Increment (AAI) Programming—Decreases

total chip programming time over byte-program

operations

• End-of-Write Detection—Software polling the BUSY bit in

status register, busy status readout on SO pin

• Software Write Protection—Write protection through

block-protection bits in status register

One-Time Programmable Memory

The processors have 64K bits of one-time programmable non-

volatile memory that can be programmed by the developer only

once. It includes the array and logic to support read access and

programming. Additionally, its pages can be write protected.

The OTP memory allows both public and private data to be

stored on-chip. In addition to storing public and private key

data for applications requiring security, OTP allows developers

to store completely user-definable data such as customer ID,

product ID, and MAC address. Therefore, generic parts can be

supplied which are then programmed and protected by the

developer within this non-volatile memory.

I/O Memory Space

The processors do not define a separate I/O space. All resources

are mapped through the flat 32-bit address space. On-chip I/O

devices have their control registers mapped into memory-

mapped registers (MMRs) at addresses near the top of the

4G byte address space. These are separated into two smaller

blocks, one which contains the control MMRs for all core func-

tions, and the other which contains the registers needed for

setup and control of the on-chip peripherals outside of the core.

The MMRs are accessible only in supervisor mode and appear

as reserved space to on-chip peripherals.

Booting from ROM

The processors contain a small on-chip boot kernel, which con-

figures the appropriate peripheral for booting. If the processors

are configured to boot from boot ROM memory space, the pro-

cessor starts executing from the on-chip boot ROM. For more

information, see Booting Modes on Page 14.

EVENT HANDLING

The event controller handles all asynchronous and synchronous

events to the processor. The processors provide event handling

that supports both nesting and prioritization. Nesting allows

multiple event service routines to be active simultaneously.

Prioritization ensures that servicing of a higher priority event

takes precedence over servicing of a lower priority event. The

controller provides support for five different types of events:

• Emulation—An emulation event causes the processor to

enter emulation mode, allowing command and control of

the processor through the JTAG interface.

• Reset—This event resets the processor.

• Nonmaskable Interrupt (NMI)—The NMI event can be

generated by the software watchdog timer or by the NMI

input signal to the processor. The NMI event is frequently

used as a power-down indicator to initiate an orderly shut-

down of the system.

• Exceptions—Events that occur synchronously to program

flow; that is, the exception is taken before the instruction is

allowed to complete. Conditions such as data alignment

violations and undefined instructions cause exceptions.

•Interrupts—Events that occur asynchronously to program

flow. They are caused by input signals, timers, and other

peripherals, as well as by an explicit software instruction.

Each event type has an associated register to hold the return

address and an associated return-from-event instruction. When

an event is triggered, the state of the processor is saved on the

supervisor stack.

The event controller consists of two stages, the core event con-

troller (CEC) and the system interrupt controller (SIC). The

core event controller works with the system interrupt controller

to prioritize and control all system events. Conceptually, inter-

rupts from the peripherals enter into the SIC, and are then

routed directly into the general-purpose interrupts of the CEC.

Core Event Controller (CEC)

The CEC supports nine general-purpose interrupts (IVG15–7),

in addition to the dedicated interrupt and exception events. Of

these general-purpose interrupts, the two lowest priority

interrupts (IVG15–14) are recommended to be reserved for

software interrupt handlers, leaving seven prioritized interrupt

inputs to support the peripherals of the processors. The inputs

to the CEC, identifies their names in the event vector table

(EVT), and lists their priorities are described in the

ADSP-BF51x Blackfin Processor Hardware Reference Manual

“System Interrupts” chapter.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 7 of 68 | January 2011

System Interrupt Controller (SIC)

The system interrupt controller provides the mapping and rout-

ing of events from the many peripheral interrupt sources to the

prioritized general-purpose interrupt inputs of the CEC.

Although the processors provide a default mapping, the user

can alter the mappings and priorities of interrupt events by

writing the appropriate values into the interrupt assignment

registers (SIC_IARx). See the ADSP-BF51x Blackfin Processor

Hardware Reference Manual “System Interrupts” chapter for the

inputs into the SIC and the default mappings into the CEC.

The SIC allows further control of event processing by providing

three pairs of 32-bit interrupt control and status registers. Each

interrupt events. For more information, see the ADSP-BF51x

Blackfin Processor Hardware Reference Manual “System Inter-

rupts” chapter.

DMA CONTROLLERS

The ADSP-BF51x processors have multiple independent DMA

channels that support automated data transfers with minimal

overhead for the processor core. DMA transfers can occur

between the processor's internal memories and any of its DMA-

capable peripherals. Additionally, DMA transfers can be accom-

plished between any of the DMA-capable peripherals and

external devices connected to the external memory interfaces,

including the SDRAM controller and the asynchronous mem-

ory controller. DMA-capable peripherals include the Ethernet

MAC, RSI, SPORTs, SPIs, UARTs, and PPI. Each individual

DMA-capable peripheral has at least one dedicated DMA

channel.

The processors’ DMA controller supports both one-dimen-

sional (1-D) and two-dimensional (2-D) DMA transfers. DMA

transfer initialization can be implemented from registers or

from sets of parameters called descriptor blocks.

The 2-D DMA capability supports arbitrary row and column

sizes up to 64K elements by 64K elements, and arbitrary row

and column step sizes up to ±32K elements. Furthermore, the

column step size can be less than the row step size, allowing

implementation of interleaved data streams. This feature is

especially useful in video applications where data can be de-

interleaved on the fly.

Examples of DMA types supported by the DMA controller

include:

• A single, linear buffer that stops upon completion

• A circular, auto-refreshing buffer that interrupts on each

full or fractionally full buffer

• 1-D or 2-D DMA using a linked list of descriptors

•2-D DMA using an array of descriptors, specifying only the

base DMA address within a common page

In addition to the dedicated peripheral DMA channels, there are

two memory DMA channels that transfer data between the vari-

ous memories of the processor system. This enables transfers of

blocks of data between any of the memories—including external

SDRAM, ROM, SRAM, and flash memory—with minimal pro-

cessor intervention. Memory DMA transfers can be controlled

by a very flexible descriptor-based methodology or by a stan-

dard register-based autobuffer mechanism.

The processors also have an external DMA controller capability

via dual external DMA request signals when used in conjunc-

tion with the external bus interface unit (EBIU). This

functionality can be used when a high speed interface is

required for external FIFOs and high bandwidth communica-

tions peripherals. It allows control of the number of data

transfers for memory DMA. The number of transfers per edge is

programmable. This feature can be programmed to allow mem-

ory DMA to have an increased priority on the external bus

relative to the core.

PROCESSOR PERIPHERALS

The ADSP-BF51x processors contain a rich set of peripherals

connected to the core via several high bandwidth buses, provid-

ing flexibility in system configuration as well as excellent overall

system performance (see Figure 1 on Page 4). The processors

contain dedicated network communication modules and high

speed serial and parallel ports, an interrupt controller for flexi-

ble management of interrupts from the on-chip peripherals or

external sources, and power management control functions to

tailor the performance and power characteristics of the proces-

sor and system to many application scenarios.

All of the peripherals, except for the general-purpose I/O, rotary

counter, TWI, three-phase PWM, real-time clock, and timers,

are supported by a flexible DMA structure. There are also sepa-

rate memory DMA channels dedicated to data transfers

between the processor's various memory spaces, including

external SDRAM and asynchronous memory. Multiple on-chip

buses provide enough bandwidth to keep the processor core

running along with activity on all of the on-chip and external

peripherals.

Real-Time Clock

The real-time clock (RTC) provides a robust set of digital watch

features, including current time, stopwatch, and alarm. The

RTC is clocked by a 32.768 kHz crystal external to the proces-

sors. The RTC peripheral has a dedicated power supply so that it

can remain powered up and clocked even when the rest of the

processor is in a low power state. The RTC provides several pro-

grammable interrupt options, including interrupt per second,

minute, hour, or day clock ticks, interrupt on programmable

stopwatch countdown, or interrupt at a programmed alarm

time.

The 32.768 kHz input clock frequency is divided down to a 1 Hz

signal by a prescaler. The counter function of the timer consists

of four counters: a 60-second counter, a 60-minute counter, a

24-hour counter, and an 32,768-day counter.

When enabled, the alarm function generates an interrupt when

the output of the timer matches the programmed value in the

alarm control register. There are two alarms: The first alarm is

for a time of day. The second alarm is for a day and time of

that day.

Rev. B | Page 8 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

The stopwatch function counts down from a programmed

value, with one-second resolution. When the stopwatch is

enabled and the counter underflows, an interrupt is generated.

Like the other peripherals, the RTC can wake up the processor

from sleep mode upon generation of any RTC wakeup event.

Additionally, an RTC wakeup event can wake up the processor

from deep sleep mode or cause a transition from the hibernate

state.

Connect RTC signals RTXI and RTXO with external compo-

nents as shown in Figure 3.

Watchdog Timer

The ADSP-BF51x processors include a 32-bit timer that can be

used to implement a software watchdog function. A software

watchdog can improve system availability by forcing the proces-

sor to a known state through generation of a hardware reset,

nonmaskable interrupt (NMI), or general-purpose interrupt, if

the timer expires before being reset by software. The program-

mer initializes the count value of the timer, enables the

appropriate interrupt, then enables the timer. Thereafter, the

software must reload the counter before it counts to zero from

the programmed value. This protects the system from remain-

ing in an unknown state where software, which would normally

reset the timer, has stopped running due to an external noise

condition or software error.

If configured to generate a hardware reset, the watchdog timer

resets both the core and the processor peripherals. After a reset,

software can determine if the watchdog was the source of the

hardware reset by interrogating a status bit in the watchdog

timer control register.

The timer is clocked by the system clock (SCLK) at a maximum

frequency of f

SCLK

Timers

There are nine general-purpose programmable timer units in

the ADSP-BF51x processors. Eight timers have an external sig-

nal that can be configured either as a pulse width modulator

(PWM) or timer output, as an input to clock the timer, or as a

mechanism for measuring pulse widths and periods of external

events. These timers can be synchronized to an external clock

input to the several other associated PF signals, an external

clock input to the PPI_CLK input signal, or to the internal

SCLK.

The timer units can be used in conjunction with the two UARTs

to measure the width of the pulses in the data stream to provide

a software auto-baud detect function for the respective serial

channels.

The timers can generate interrupts to the processor core provid-

ing periodic events for synchronization, either to the system

clock or to a count of external signals.

In addition to the eight general-purpose programmable timers,

a ninth timer is also provided. This extra timer is clocked by the

internal processor clock and is typically used as a system tick

clock for generation of operating system periodic interrupts.

3-Phase PWM

The processors integrate a flexible and programmable 3-phase

PWM waveform generator that can be programmed to generate

the required switching patterns to drive a 3-phase voltage

source inverter for ac induction (ACIM) or permanent magnet

synchronous (PMSM) motor control. In addition, the PWM

block contains special functions that considerably simplify the

generation of the required PWM switching patterns for control

of the electronically commutated motor (ECM) or brushless dc

motor (BDCM). Software can enable a special mode for

switched reluctance motors (SRM).

Features of the 3-phase PWM generation unit are:

• 16-bit center-based PWM generation unit

• Programmable PWM pulse width

• Single/double update modes

• Programmable dead time and switching frequency

• Twos-complement implementation which permits smooth

transition to full ON and full OFF states

• Possibility to synchronize the PWM generation to an exter-

nal synchronization

• Special provisions for BDCM operation (crossover and

output enable functions)

• Wide variety of special switched reluctance (SR) operating

modes

• Output polarity and clock gating control

• Dedicated asynchronous PWM shutdown signal

General-Purpose (GP) Counter

A 32-bit GP counter is provided that can sense 2-bit quadrature

or binary codes as typically emitted by industrial drives or man-

ual thumb wheels. The counter can also operate in general-

purpose up/down count modes. Then, count direction is either

controlled by a level-sensitive input signal or by two edge

detectors.

Figure 3. External Components for RTC

RTXO

C1 C2

SUGGESTED COMPONENTS:

X1 = ECLIPTEK EC38J (THROUGH-HOLE PACKAGE) OR

EPSON MC405 12 pF LOAD (SURFACE-MOUNT PACKAGE)

C1 = 22 pF

C2 = 22 pF

R1 = 10 M:

NOTE: C1 AND C2 ARE SPECIFIC TO CRYSTAL SPECIFIED FOR X1.

CONTACT CRYSTAL MANUFACTURER FOR DETAILS. C1 AND C2

SPECIFICATIONS ASSUME BOARD TRACE CAPACITANCE OF 3 pF.

RTXI

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 9 of 68 | January 2011

A third input can provide flexible zero marker support and can

alternatively be used to input the push-button signal of thumb

wheels. All three signals have a programmable debouncing

circuit.

An internal signal forwarded to the GP timer unit enables one

timer to measure the intervals between count events. Boundary

registers enable auto-zero operation or simple system warning

by interrupts when programmable count values are exceeded.

Serial Ports

The ADSP-BF51x processors incorporate two dual-channel syn-

chronous serial ports (SPORT0 and SPORT1) for serial and

multiprocessor communications. The SPORTs support the fol-

lowing features:

Serial port data can be automatically transferred to and from

on-chip memory/external memory via dedicated DMA chan-

nels. Each of the serial ports can work in conjunction with

another serial port to provide TDM support. In this configura-

tion, one SPORT provides two transmit signals while the other

SPORT provides the two receive signals. The frame sync and

clock are shared.

Serial ports operate in five modes:

• Standard DSP serial mode

• Multichannel (TDM) mode

•I

S mode

•Packed I

S mode

•Left-justified mode

Serial Peripheral Interface (SPI) Ports

The processors have two SPI-compatible ports (SPI0 and SPI1)

that enable the processor to communicate with multiple SPI-

compatible devices.

The SPI interface uses three signals for transferring data: two

data signals (master output-slave input–MOSI, and master

input-slave output–MISO) and a clock signal (serial

clock–SCK). An SPI chip select input signal (SPIxSS) lets other

SPI devices select the processor, and multiple SPI chip select

output signals let the processor select other SPI devices. The SPI

select signals are reconfigured general-purpose I/O signals.

Using these signals, the SPI port provides a full-duplex, syn-

chronous serial interface, which supports both master/slave

modes and multimaster environments.

The SPI port baud rate and clock phase/polarities are program-

mable, and it has an integrated DMA channel, configurable to

support transmit or receive data streams. The SPI’s DMA chan-

nel can only service unidirectional accesses at any given time.

UART Ports

The processors provide two full-duplex universal asynchronous

receiver/transmitter (UART) ports, which are fully compatible

with PC-standard UARTs. Each UART port provides a simpli-

fied UART interface to other peripherals or hosts, supporting

full-duplex, DMA-supported, asynchronous transfers of serial

data. A UART port includes support for five to eight data bits,

and none, even, or odd parity. Optionally, an additional address

bit can be transferred to interrupt only addressed nodes in

multi-drop bus (MDB) systems. A frame is terminates by one,

one and a half, two or two and a half stop bits.

The UART ports support automatic hardware flow control

through the Clear To Send (CTS) input and Request To Send

(RTS) output with programmable assertion FIFO levels.

To help support the Local Interconnect Network (LIN) proto-

cols, a special command causes the transmitter to queue a break

command of programmable bit length into the transmit buffer.

Similarly, the number of stop bits can be extended by a pro-

grammable inter-frame space.

The capabilities of the UARTs are further extended with sup-

port for the Infrared Data Association (IrDA®) serial infrared

physical layer link specification (SIR) protocol.

2-Wire Interface (TWI)

The processors include a TWI module for providing a simple

exchange method of control data between multiple devices. The

TWI is compatible with the widely used I

bus standard. The

TWI module offers the capabilities of simultaneous master and

slave operation, support for both 7-bit addressing and multime-

dia data arbitration. The TWI interface utilizes two signals for

transferring clock (SCL) and data (SDA) and supports the pro-

tocol at speeds up to 400k bits/sec. The TWI interface signals

are compatible with 5 V logic levels.

Additionally, the processor’s TWI module is fully compatible

with serial camera control bus (SCCB) functionality for easier

control of various CMOS camera sensor devices.

Removable Storage Interface (RSI)

The RSI controller, available on the ADSP-BF514, ADSP-

BF516, ADSP-BF518, and ADSP-BF518F acts as the host inter-

face for multi-media cards (MMC), secure digital memory cards

(SD Card), secure digital input/output cards (SDIO), and CE-

ATA hard disk drives. The following list describes the main fea-

tures of the RSI controller.

• Support for a single MMC, SD memory, SDIO card or CE-

ATA hard disk drive

• Support for 1-bit and 4-bit SD modes

• Support for 1-bit, 4-bit and 8-bit MMC modes

• Support for 4-bit and 8-bit CE-ATA hard disk drives

• A ten-signal external interface with clock, command, and

up to eight data lines

• Card detection using one of the data signals

• Card interface clock generation from SCLK

• SDIO interrupt and read wait features

• CE-ATA command completion signal recognition and

disable

Rev. B | Page 10 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

10/100 Ethernet MAC

The ADSP-BF516/ADSP-BF516F and ADSP-

BF518/ADSPBF518F processors offer the capability to directly

connect to a network by way of an embedded fast Ethernet

media access controller (MAC) that supports both 10-BaseT

(10M bits/sec) and 100-BaseT (100M bits/sec) operation. The

10/100 Ethernet MAC peripheral on the processor is fully com-

pliant to the IEEE 802.3-2002 standard and it provides

programmable features designed to minimize supervision, bus

use, or message processing by the rest of the processor system.

Some standard features are:

• Support of MII and RMII protocols for external PHYs

• Full duplex and half duplex modes

• Data framing and encapsulation: generation and detection

of preamble, length padding, and FCS

• Media access management (in half-duplex operation): col-

lision and contention handling, including control of

retransmission of collision frames and of back-off timing

• Flow control (in full-duplex operation): generation and

detection of pause frames

• Station management: generation of MDC/MDIO frames

for read-write access to PHY registers

• Operating range for active and sleep operating modes, see

Table 43 on Page 45 and Table 44 on Page 46

• Internal loopback from transmit to receive

Some advanced features are:

• Buffered crystal output to external PHY for support of a

single crystal system

• Automatic checksum computation of IP header and IP

payload fields of Rx frames

• Independent 32-bit descriptor-driven receive and transmit

DMA channels

• Frame status delivery to memory through DMA, including

frame completion semaphores for efficient buffer queue

management in software

• Tx DMA support for separate descriptors for MAC header

and payload to eliminate buffer copy operations

• Convenient frame alignment modes support even 32-bit

alignment of encapsulated receive or transmit IP packet

data in memory after the 14-byte MAC header

• Programmable Ethernet event interrupt supports any com-

bination of:

• Selected receive or transmit frame status conditions

• PHY interrupt condition

• Wakeup frame detected

• Selected MAC management counter(s) at half-full

• DMA descriptor error

• 47 MAC management statistics counters with selectable

clear-on-read behavior and programmable interrupts on

half maximum value

• Programmable receive address filters, including a 64-bin

address hash table for multicast and/or unicast frames, and

programmable filter modes for broadcast, multicast, uni-

cast, control, and damaged frames

• Advanced power management supporting unattended

transfer of receive and transmit frames and status to/from

external memory via DMA during low power sleep mode

• System wakeup from sleep operating mode upon magic

packet or any of four user-definable wakeup frame filters

• Support for 802.3Q tagged VLAN frames

• Programmable MDC clock rate and preamble suppression

• In RMII operation, seven unused signals may be config-

ured as GPIO signals for other purposes

IEEE 1588 Support

The IEEE 1588 standard is a precision clock synchronization

protocol for networked measurement and control systems. The

ADSP-BF518/ADSP-BF518F processors include hardware sup-

port for IEEE 1588 with an integrated precision time protocol

synchronization engine (PTP_TSYNC). This engine provides

hardware assisted time stamping to improve the accuracy of

clock synchronization between PTP nodes. The main features of

the PTP_SYNC engine are:

• Support for both IEEE 1588-2002 and IEEE 1588-2008 pro-

tocol standards

• Hardware assisted time stamping capable of up to 12.5 ns

resolution

• Lock adjustment

• Programmable PTM message support

• Dedicated interrupts

• Programmable alarm

• Multiple input clock sources (SCLK, MII clock, external

clock)

• Programmable pulse per second (PPS) output

• Auxiliary snapshot to time stamp external events

Ports

Because of the rich set of peripherals, the processors group the

many peripheral signals to four ports—port F, port G, port H,

and port J. Most of the associated pins/balls are shared by multi-

ple signals. The ports function as multiplexer controls.

General-Purpose I/O (GPIO)

The ADSP-BF51x processors have 40 bidirectional, general-

purpose I/O (GPIO) signals allocated across three separate

GPIO modules—PORTFIO, PORTGIO, and PORTHIO, associ-

ated with Port F, Port G, and Port H, respectively. Each

GPIO-capable signal shares functionality with other peripherals

via a multiplexing scheme; however, the GPIO functionality is

the default state of the device upon power-up. Neither GPIO

output nor input drivers are active by default. Each general-pur-

pose port signal can be individually controlled by manipulation

of the port control, status, and interrupt registers.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 11 of 68 | January 2011

Parallel Peripheral Interface (PPI)

The ADSP-BF51x processors provide a parallel peripheral inter-

face (PPI) that can connect directly to parallel analog-to-digital

and digital-to-analog converters, ITU-R-601/656 video encod-

ers and decoders, and other general-purpose peripherals. The

PPI consists of a dedicated input clock signal, up to three frame

synchronization signals, and up to 16 data signals.

In ITU-R-656 modes, the PPI receives and parses a data stream

of 8-bit or 10-bit data elements. On-chip decode of embedded

preamble control and synchronization information

is supported.

Three distinct ITU-R-656 modes are supported:

• Active video only mode—The PPI does not read in any

data between the End of Active Video (EAV) and Start of

Active Video (SAV) preamble symbols, or any data present

during the vertical blanking intervals. In this mode, the

control byte sequences are not stored to memory; they are

filtered by the PPI.

• Vertical blanking only mode—The PPI only transfers verti-

cal blanking interval (VBI) data, as well as horizontal

blanking information and control byte sequences on

VBI lines.

• Entire field mode—The entire incoming bitstream is read

in through the PPI. This includes active video, control pre-

amble sequences, and ancillary data that may be embedded

in horizontal and vertical blanking intervals.

Though not explicitly supported, ITU-R-656 output functional-

ity can be achieved by setting up the entire frame structure

(including active video, blanking, and control information) in

memory and streaming the data out the PPI in a frame sync-less

mode. The processor’s 2-D DMA features facilitate this transfer

by allowing the static frame buffer (blanking and control codes)

to be placed in memory once, and simply updating the active

video information on a per-frame basis.

The general-purpose modes of the PPI are intended to suit a

wide variety of data capture and transmission applications. The

modes are divided into four main categories, each allowing up

to 16 bits of data transfer per PPI_CLK cycle:

• Data receive with internally generated frame syncs

• Data receive with externally generated frame syncs

• Data transmit with internally generated frame syncs

• Data transmit with externally generated frame syncs

These modes support ADC/DAC connections, as well as video

communication with hardware signalling. Many of the modes

support more than one level of frame synchronization. If

desired, a programmable delay can be inserted between asser-

tion of a frame sync and reception/transmission of data.

Code Security with Lockbox Secure Technology

A security system consisting of a blend of hardware and soft-

ware provides customers with a flexible and rich set of code

security features with Lockbox

secure technology. Key features

include:

• OTP memory

• Unique chip ID

• Code authentication

• Secure mode of operation

The security scheme is based upon the concept of authentica-

tion of digital signatures using standards-based algorithms and

provides a secure processing environment in which to execute

code and protect assets.

DYNAMIC POWER MANAGEMENT

The ADSP-BF51x processors provide four operating modes,

each with a different performance/power profile. In addition,

dynamic power management provides the control functions to

dynamically alter the processor core supply voltage, further

reducing power dissipation. When configured for a 0 V core

supply voltage, the processor enters the hibernate state. Control

of clocking to each of the processor peripherals also reduces

power consumption. See Table 2 for a summary of the power

settings for each mode.

Full-On Operating Mode—Maximum Performance

In the full-on mode, the PLL is enabled and is not bypassed,

providing capability for maximum operational frequency. This

is the power-up default execution state in which maximum per-

formance can be achieved. The processor core and all enabled

peripherals run at full speed.

Active Operating Mode—Moderate Power Savings

In the active mode, the PLL is enabled but bypassed. Because the

PLL is bypassed, the processor’s core clock (CCLK) and system

clock (SCLK) run at the input clock (CLKIN) frequency. In this

mode, the CLKIN to CCLK multiplier ratio can be changed,

although the changes are not realized until the full-on mode is

entered. DMA access is available to appropriately configured

L1 memories.

Table 2. Power Settings

Mode/State PLL

PLL

Bypassed

Core

Clock

(CCLK)

System

Clock

(SCLK)

Core

Power

Full On Enabled No Enabled Enabled On

Active Enabled/

Disabled

Yes Enabled Enabled On

Sleep Enabled — Disabled Enabled On

Deep Sleep Disabled — Disabled Disabled On

Hibernate Disabled — Disabled Disabled Off

Rev. B | Page 12 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

In the active mode, it is possible to disable the PLL through the

PLL control register (PLL_CTL). If disabled, the PLL must be

re-enabled before transitioning to the full-on or sleep modes.

Sleep Operating Mode—High Dynamic Power Savings

The sleep mode reduces dynamic power dissipation by disabling

the clock to the processor core (CCLK). The PLL and system

clock (SCLK), however, continue to operate in this mode. Typi-

cally an external event or RTC activity wakes up the processor.

When in the sleep mode, asserting wakeup causes the processor

to sense the value of the BYPASS bit in the PLL control register

(PLL_CTL). If BYPASS is disabled, the processor transitions to

the full on mode. If BYPASS is enabled, the processor transi-

tions to the active mode.

System DMA access to L1 memory is not supported in

sleep mode.

Deep Sleep Operating Mode—Maximum Dynamic Power

Savings

The deep sleep mode maximizes dynamic power savings by dis-

abling the clocks to the processor core (CCLK) and to all

synchronous peripherals (SCLK). Asynchronous peripherals,

such as the RTC, may still be running but cannot access internal

resources or external memory. This powered-down mode can

only be exited by assertion of the reset interrupt (RESET) or by

an asynchronous interrupt generated by the RTC. When in deep

sleep mode, an RTC asynchronous interrupt causes the proces-

sor to transition to the Active mode. Assertion of RESET while

in deep sleep mode causes the processor to transition to the full

on mode.

Hibernate State—Maximum Static Power Savings

The hibernate state maximizes static power savings by disabling

the voltage and clocks to the processor core (CCLK) and system

blocks (SCLK). Any critical information stored internally (for

example memory contents, register contents) must be written to

a non-volatile storage device prior to removing power if the

processor state is to be preserved. Writing b#00 to the FREQ bits

in the VR_CTL register also causes the EXT_WAKE signal to

transition low, which can be used to signal an external voltage

regulator to shut down.

Since V

DDEXT

is still supplied in this mode, all of the external sig-

nals three-state, unless otherwise specified. This allows other

devices that may be connected to the processor to still have

power applied without drawing unwanted current.

The Ethernet module can signal an external regulator to wake

up using the EXT_WAKE signal. If PF15 does not connect as a

PHYINT signal to an external PHY device, it can be pulled low

by any other device to wake the processor up. The processor can

also be woken up by a real-time clock wakeup event or by assert-

ing the RESET pin. All hibernate wakeup events initiate the

hardware reset sequence. Individual sources are enabled by the

VR_CTL register. The EXT_WAKE signal is provided to indi-

cate the occurrence of wakeup events.

With the exception of the VR_CTL and the RTC registers, all

internal registers and memories lose their content in the hiber-

nate state. State variables may be held in external SRAM or

SDRAM. The SCKELOW bit in the VR_CTL register controls

whether or not SDRAM operates in self-refresh mode, which

allows it to retain its content while the processor is in hiberna-

tion and through the subsequent reset sequence.

Power Savings

As shown in Table 3, the processors support up to six different

power domains, which maximizes flexibility while maintaining

compliance with industry standards and conventions. By isolat-

ing the internal logic of the processor into its own power

domain, separate from the RTC and other I/O, the processor

can take advantage of dynamic power management without

affecting the RTC or other I/O devices. There are no sequencing

requirements for the various power domains, but all domains

must be powered according to the appropriate Specifications

table for processor Operating Conditions; even if the fea-

ture/peripheral is not used.

The dynamic power management feature of the processor

allows both the processor’s input voltage (V

DDINT

) and clock fre-

quency (f

CCLK

) to be dynamically controlled.

The power dissipated by a processor is largely a function of its

clock frequency and the square of the operating voltage. For

example, reducing the clock frequency by 25% results in a 25%

reduction in dynamic power dissipation, while reducing the

voltage by 25% reduces dynamic power dissipation by more

than 40%. Further, these power savings are additive, in that if

the clock frequency and supply voltage are both reduced, the

power savings can be dramatic, as shown in the following

equations.

where the variables in the equations are:

CCLKNOM

is the nominal core clock frequency

CCLKRED

is the reduced core clock frequency

DDINTNOM

is the nominal internal supply voltage

DDINTRED

is the reduced internal supply voltage

Table 3. Power Domains

Power Domain V

Range

All internal logic, except RTC, Memory, OTP V

DDINT

RTC internal logic and crystal I/O V

DDRTC

Memory logic V

DDMEM

OTP logic V

DDOTP

Optional internal flash V

DDFLASH

All other I/O V

DDEXT

Power Savings Factor

fCCLKRED

fCCLKNOM

-------------------------- VDDINTRED

VDDINTNOM

--------------------------------





×TRED

TNOM

---------------





×



% Power Savings 1 Power Savings Factor–()100%×=

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 13 of 68 | January 2011

NOM

is the duration running at f

CCLKNOM

RED

is the duration running at f

CCLKRED

VOLTAGE REGULATION INTERFACE

The ADSP-BF51x processors require an external voltage regula-

tor to power the V

DDINT

domain. To reduce standby power

consumption in the hibernate state, the external voltage regula-

tor can be signaled through EXT_WAKE to remove power from

the processor core. The EXT_WAKE signal is high-true for

power-up and may be connected directly to the low-true shut

down input of many common regulators.

The Power Good (PG) input signal allows the processor to start

only after the internal voltage has reached a chosen level. In this

way, the startup time of the external regulator is detected after

hibernation. For a complete description of the PG functionality,

refer to the ADSP-BF51x Blackfin Processor Hardware Reference.

CLOCK SIGNALS

The ADSP-BF51x processors can be clocked by an external crys-

tal, a sine wave input, or a buffered, shaped clock derived from

an external clock oscillator.

If an external clock is used, it should be a TTL compatible signal

and must not be halted, changed, or operated below the speci-

fied frequency during normal operation. This signal is

connected to the processor CLKIN signal. When an external

clock is used, the XTAL pin/ball must be left unconnected.

Alternatively, because the processor includes an on-chip oscilla-

tor circuit, an external crystal may be used. For fundamental

frequency operation, use the circuit shown in Figure 4. A paral-

lel-resonant, fundamental frequency, microprocessor-grade

crystal is connected across the CLKIN and XTAL pins/balls. The

on-chip resistance between the CLKIN pin/ball and the XTAL

pin/ball is in the 500 k range. Further parallel resistors are typ-

ically not recommended. The two capacitors and the series

resistor shown in Figure 4 fine tune phase and amplitude of the

sine frequency.

The capacitor and resistor values shown in Figure 4 are typical

values only. The capacitor values are dependent upon the crystal

manufacturers’ load capacitance recommendations and the PCB

physical layout. The resistor value depends on the drive level

specified by the crystal manufacturer. The user should verify the

customized values based on careful investigations on multiple

devices over temperature range.

A third-overtone crystal can be used for frequencies above 25

MHz. The circuit is then modified to ensure crystal operation

only at the third overtone, by adding a tuned inductor circuit as

shown in Figure 4. A design procedure for third-overtone oper-

ation is discussed in detail in application note (EE-168) Using

Third Overtone Crystals with the ADSP-218x DSP on the Analog

Devices website (www.analog.com)—use site search on

“EE-168.”

The CLKBUF signal is an output signal, which is a buffered ver-

sion of the input clock. This signal is particularly useful in

Ethernet applications to limit the number of required clock

sources in the system. In this type of application, a single

25 MHz or 50 MHz crystal may be applied directly to the pro-

cessor. The 25 MHz or 50 MHz output of CLKBUF can then be

connected to an external Ethernet MII or RMII PHY device.

The Blackfin core runs at a different clock rate than the on-chip

peripherals. As shown in Figure 5, the core clock (CCLK) and

system peripheral clock (SCLK) are derived from the input

clock (CLKIN) signal. An on-chip PLL is capable of multiplying

the CLKIN signal by a programmable 5× to 64× multiplication

factor (bounded by specified minimum and maximum VCO

frequencies). The default multiplier is 6×, but it can be modified

by a software instruction sequence.

On-the-fly frequency changes can be done simply by writing to

the PLL_DIV register. The maximum allowed CCLK and SCLK

rates depend on the applied voltages V

DDINT

, V

DDEXT

, and

DDMEM

, and the VCO is always permitted to run up to the fre-

quency specified by the part’s speed grade. The CLKOUT signal

reflects the SCLK frequency to the off-chip world. It belongs to

the SDRAM interface, but it functions as a reference signal in

other timing specifications as well. While active by default, it

can be disabled using the EBIU_SDGCTL and EBIU_AMGCTL

registers.

Figure 4. External Crystal Connections

Figure 5. Frequency Modification Methods

CLKIN

CLKOUT

XTAL

CLKBUF

TO PLL CIRCUITRY

FOR OVERTONE

OPERATION ONLY:

NOTE: VALUES MARKED WITH * MUST BE CUSTOMIZED, DEPENDING

ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. FOR

FREQUENCIES ABOVE 33 MHz, THE SUGGESTED CAPACITOR VALUE

OF 18 pF SHOULD BE TREATED AS A MAXIMUM, AND THE SUGGESTED

RESISTOR VALUE SHOULD BE REDUCED TO 0 ⍀.

18 pF *

330 ⍀*

BLACKFIN

560 ⍀

PLL

5uto 64u

÷1to15

÷1,2,4,8

VCO

CLKIN

“FINE” ADJUSTMENT

REQUIRES PLL SEQUENCING

“COARSE” ADJUSTMENT

ON-THE-FLY

CCLK

SCLK

Rev. B | Page 14 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

All on-chip peripherals are clocked by the system clock (SCLK).

The system clock frequency is programmable by means of the

SSEL3–0 bits of the PLL_DIV register. The values programmed

into the SSEL fields define a divide ratio between the PLL output

(VCO) and the system clock. SCLK divider values are 1 through

15. Table 4 illustrates typical system clock ratios.

Note that the divisor ratio must be chosen to limit the system

clock frequency to its maximum of f

SCLK

. The SSEL value can be

changed dynamically without any PLL lock latencies by writing

the appropriate values to the PLL divisor register (PLL_DIV).

The core clock (CCLK) frequency can also be dynamically

changed by means of the CSEL1–0 bits of the PLL_DIV register.

Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in

Table 5. This programmable core clock capability is useful for

fast core frequency modifications.

The maximum CCLK frequency not only depends on the part's

speed grade (see Page 65), it also depends on the applied V

DDINT

voltage. See Table 9 for details. The maximal system clock rate

(SCLK) depends on the chip package and the applied V

DDINT

DDEXT

, and V

DDMEM

voltages (see Table 11 on Page 21).

BOOTING MODES

The processor has several mechanisms (listed in Table 6) for

automatically loading internal and external memory after a

reset. The boot mode is defined by three BMODE input bits

dedicated to this purpose. There are two categories of boot

modes. In master boot modes the processor actively loads data

from parallel or serial memories. In slave boot modes the pro-

cessor receives data from external host devices.

The boot modes listed in Table 6 provide a number of mecha-

nisms for automatically loading the processor’s internal and

external memories after a reset. By default, all boot modes use

the slowest meaningful configuration settings. Default settings

can be altered via the initialization code feature at boot time or

by proper OTP programming at pre-boot time. The BMODE

bits of the reset configuration register, sampled during power-

on resets and software-initiated resets, implement the modes

shown in Table 6.

• Idle/no boot mode (BMODE = 0x0)—In this mode, the

processor goes into idle. The idle boot mode helps recover

from illegal operating modes, such as when the user has

mis configured the OTP memory.

• Boot from 8-bit or 16-bit external flash memory

(BMODE = 0x1)—In this mode, the boot kernel loads the

first block header from address 0x2000 0000 and—depend-

ing on instructions containing in the header—the boot

kernel performs 8-bit or 16-bit boot or starts program exe-

cution at the address provided by the header. By default, all

configuration settings are set for the slowest device possible

(3-cycle hold time, 15-cycle R/W access times, 4-cycle

setup).

The ARDY is not enabled by default, but it can be enabled

by OTP programming. Similarly, all interface behavior and

timings can be customized by OTP programming. This

includes activation of burst-mode or page-mode operation.

In this mode, all signals belonging to the asynchronous

interface are enabled at the port muxing level.

• Boot from internal SPI memory (BMODE = 0x2)—The

processor uses the internal PH8 GPIO signal to load code

previously loaded to the 4 Mbit internal SPI flash con-

nected to SPI0. Only available on the ADSP-BF512F/

ADSP-BF514F/ADSP-BF516F/ADSP-BF518F.

• Boot from external SPI EEPROM or flash

(BMODE = 0x3)—8-bit, 16-bit, 24-bit or 32-bit address-

able devices are supported. The processor uses the PG15

GPIO signal (at SPI0SEL2) to select a single SPI

EEPROM/flash device connected to the SPI0 interface;

then submits a read command and successive address bytes

(0x00) until a valid 8-, 16-, 24-, or 32-bit addressable device

is detected. Pull-up resistors are required on the SSEL and

MISO signals. By default, a value of 0x85 is written to the

SPI0_BAUD register.

• Boot from SPI0 host device (BMODE = 0x4)—The proces-

sor operates in SPI slave mode and is configured to receive

the bytes of the LDR file from an SPI host (master) agent.

In the host, the HWAIT signal must be interrogated by the

Table 4. Example System Clock Ratios

Signal Name

SSEL3–0

Divider Ratio

VCO/SCLK

Example Frequency Ratios

(MHz)

VCO SCLK

0010 2:1 100 50

0110 6:1 300 50

1010 10:1 400 40

Table 5. Core Clock Ratios

Signal Name

CSEL1–0

Divider Ratio

VCO/CCLK

Example Frequency Ratios

(MHz)

VCO CCLK

00 1:1 300 300

01 2:1 300 150

10 4:1 400 100

11 8:1 200 25

Table 6. Booting Modes

BMODE2–0 Description

000 Idle - No boot

001 Boot from 8- or 16-bit external flash memory

010 Boot from internal SPI memory

011 Boot from external SPI memory (EEPROM or flash)

100 Boot from SPI0 host

101 Boot from OTP memory

110 Boot from SDRAM

111 Boot from UART0 Host

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 15 of 68 | January 2011

host before every transmitted byte. A pull-up resistor is

required on the SPI0SS input. A pull-down on the serial

clock may improve signal quality and booting robustness.

• Boot from OTP memory (BMODE = 0x5)—This provides

a stand-alone booting method. The boot stream is loaded

from on-chip OTP memory. By default the boot stream is

expected to start from OTP page 0x40 on and can occupy

all public OTP memory up to page 0xDF. This is 2560

bytes. Since the start page is programmable the maximum

size of the boot stream can be extended to 3072 bytes.

• Boot from SDRAM (BMODE = 0x6)—This is a warm boot

scenario, where the boot kernel starts booting from address

0x0000 0010. The SDRAM is expected to contain a valid

boot stream and the SDRAM controller must be configured

by the OTP settings.

• Boot from UART0 host (BMODE = 0x7)—Using an auto-

baud handshake sequence, a boot-stream formatted

program is downloaded by the host. The host selects a bit

rate within the UART clocking capabilities.

When performing the autobaud, the UART expects a “@”

(0x40) character (eight bits data, one start bit, one stop bit,

no parity bit) on the RX0 signal to determine the bit rate.

The UART then replies with an acknowledgement com-

posed of 4 bytes (0xBF—the value of UART0_DLL and

0x00—the value of UART0_DLH). The host can then

download the boot stream. To hold off the host the Blackfin

processor signals the host with the boot host wait

(HWAIT) signal. Therefore, the host must monitor

HWAIT before every transmitted byte.

For each of the boot modes, a 16-byte header is first read from

an external memory device. The header specifies the number of

bytes to be transferred and the memory destination address.

Multiple memory blocks may be loaded by any boot sequence.

Once all blocks are loaded, program execution commences from

the address stored in the EVT1 register.

Prior to booting, the pre-boot routine interrogates the OTP

memory. Individual boot modes can be customized or even dis-

abled based on OTP programming. External hardware,

especially booting hosts may watch the HWAIT signal to deter-

mine when the pre-boot has finished and the boot kernel starts

the boot process. By programming OTP memory, the user can

instruct the preboot routine to also customize the PLL, the

SDRAM Controller, and the Asynchronous Interface.

The boot kernel differentiates between a regular hardware reset

and a wakeup-from-hibernate event to speed up booting in the

later case. Bits 6-4 in the system reset configuration (SYSCR)

nel in case of a software reset. They can also be used to simulate

a wakeup-from-hibernate boot in the software reset case.

The boot process can be further customized by “initialization

code.” This is a piece of code that is loaded and executed prior to

the regular application boot. Typically, this is used to configure

the SDRAM controller or to speed up booting by managing

PLL, clock frequencies, wait states, or serial bit rates.

The boot ROM also features C-callable function entries that can

be called by the user application at run time. This enables sec-

ond-stage boot or boot management schemes to be

implemented with ease.

INSTRUCTION SET DESCRIPTION

The Blackfin processor family assembly language instruction set

employs an algebraic syntax designed for ease of coding and

readability. The instructions have been specifically tuned to pro-

vide a flexible, densely encoded instruction set that compiles to

a very small final memory size. The instruction set also provides

fully featured multifunction instructions that allow the pro-

grammer to use many of the processor core resources in a single

instruction. Coupled with many features more often seen on

microcontrollers, this instruction set is very efficient when com-

piling C and C++ source code. In addition, the architecture

supports both user (algorithm/application code) and supervisor

(O/S kernel, device drivers, debuggers, ISRs) modes of opera-

tion, allowing multiple levels of access to core

processor resources.

The assembly language, which takes advantage of the proces-

sor’s unique architecture, offers the following advantages:

• Seamlessly integrated DSP/MCU features are optimized for

both 8-bit and 16-bit operations.

• A multi-issue load/store modified-harvard architecture,

which supports two 16-bit MACs or four 8-bit ALUs plus

two load/store plus two pointer updates per cycle.

• All registers, I/O, and memory are mapped into a unified

4G byte memory space, providing a simplified program-

ming model.

• Microcontroller features, such as arbitrary bit and bit-field

manipulation, insertion, and extraction; integer operations

on 8-, 16-, and 32-bit data-types; and separate user and

supervisor stack pointers.

• Code density enhancements, which include intermixing of

16-bit and 32-bit instructions (no mode switching, no code

segregation). Frequently used instructions are encoded

in 16 bits.

DEVELOPMENT TOOLS

The ADSP-BF51x processors are supported with a complete set

of CROSSCORE

software and hardware development tools,

including Analog Devices emulators and VisualDSP++® devel-

opment environment. The same emulator hardware that

supports other Blackfin processors also fully emulates the

ADSP-BF51x processors. For more information about develop-

ment tools, visit www.analog.com.

EZ-KIT Lite Evaluation Board

For evaluation of the processors, use the EZ-KIT Lite

board

being developed by Analog Devices. The board comes with on-

chip emulation capabilities and is equipped to enable software

development. Multiple daughter cards are available.

Rev. B | Page 16 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

DESIGNING AN EMULATOR-COMPATIBLE

PROCESSOR BOARD (TARGET)

The Analog Devices family of emulators are tools that every sys-

tem developer needs in order to test and debug hardware and

software systems. Analog Devices has supplied an IEEE 1149.1

JTAG Test Access Port (TAP) on each JTAG processor. The

emulator uses the TAP to access the internal features of the pro-

cessor, allowing the developer to load code, set breakpoints,

observe variables, observe memory, and examine registers. The

processor must be halted to send data and commands, but once

an operation has been completed by the emulator, the processor

system is set running at full speed with no impact on

system timing.

To use these emulators, the target board must include a header

that connects the processor’s JTAG port to the emulator.

For details on target board design issues including mechanical

layout, single processor connections, multiprocessor scan

chains, signal buffering, signal termination, and emulator pod

logic, see (EE-68) Analog Devices JTAG Emulation Technical

Reference on the Analog Devices website (www.analog.com)—

use site search on “EE-68.” This document is updated regularly

to keep pace with improvements to emulator support.

RELATED DOCUMENTS

The following publications that describe the ADSP-BF512/

ADSP-BF514/ADSP-BF516/ADSP-BF518 processors (and

related processors) can be ordered from any Analog Devices

sales office or accessed electronically on our website:

•Getting Started With Blackfin Processors

•ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F,

BF518/BF518F Blackfin Processor Hardware Reference

•ADSP-BF53x/BF56x Blackfin Processor Programming

Reference

•ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F,

BF518/BF518F Blackfin Processor Anomaly List

RELATED SIGNAL CHAINS

A signal chain is a series of signal-conditioning electronic com-

ponents that receive input (data acquired from sampling either

real-time phenomena or from stored data) in tandem, with the

output of one portion of the chain supplying input to the next.

Signal chains are often used in signal processing applications to

gather and process data or to apply system controls based on

analysis of real-time phenomena. For more information about

this term and related topics, see the "signal chain" entry in

Wikipedia or the Glossary of EE Terms on the Analog Devices

website.

Analog Devices eases signal processing system development by

providing signal processing components that are designed to

work together well. A tool for viewing relationships between

specific applications and related components is available on the

www.analog.com website.

The Application Signal Chains page in the Circuits from the

Lab

site (http://www.analog.com/circuits) provides:

• Graphical circuit block diagram presentation of signal

chains for a variety of circuit types and applications

• Drill down links for components in each chain to selection

guides and application information

• Reference designs applying best practice design techniques

LOCKBOX SECURE TECHNOLOGY DISCLAIMER

Analog Devices products containing Lockbox Secure Technol-

ogy are warranted by Analog Devices as detailed in the Analog

Devices Standard Terms and Conditions of Sale. To our knowl-

edge, the Lockbox Secure Technology, when used in accordance

with the data sheet and hardware reference manual specifica-

tions, provides a secure method of implementing code and data

safeguards. However, Analog Devices does not guarantee that

this technology provides absolute security. ACCORDINGLY,

ANALOG DEVICES HEREBY DISCLAIMS ANY AND ALL

EXPRESS AND IMPLIED WARRANTIES THAT THE LOCK-

BOX SECURE TECHNOLOGY CANNOT BE BREACHED,

COMPROMISED, OR OTHERWISE CIRCUMVENTED AND

IN NO EVENT SHALL ANALOG DEVICES BE LIABLE FOR

ANY LOSS, DAMAGE, DESTRUCTION, OR RELEASE OF

DATA, INFORMATION, PHYSICAL PROPERTY, OR INTEL-

LECTUAL PROPERTY.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 17 of 68 | January 2011

SIGNAL DESCRIPTIONS

The processors’ signal definitions are listed in Table 7. In order

to maintain maximum function and reduce package size and

signal count, some signals have dual, multiplexed functions. In

cases where signal function is reconfigurable, the default state is

shown in plain text, while the alternate function is shown in

italics.

All pins are three-stated during and immediately after reset,

with the exception of the external memory interface, asynchro-

nous and synchronous memory control, and the buffered XTAL

output pin (CLKBUF). On the external memory interface, the

control and address lines are driven high, with the exception of

CLKOUT, which toggles at the system clock rate. During hiber-

nate all outputs are three-stated unless otherwise noted in

Table 7.

All I/O signals have their input buffers disabled with the excep-

tion of the signals noted in the data sheet that need pull-ups or

pull downs if unused.

The SDA (serial data) and SCL (serial clock) pins/balls are open

drain and therefore require a pullup resistor. Consult version

2.1 of the I

C specification for the proper resistor value.

It is strongly advised to use the available IBIS models to ensure

that a given board design meets overshoot/undershoot and sig-

nal integrity requirements. If no IBIS simulation is performed, it

is strongly recommended to add series resistor terminations for

all Driver Types A, C and D. The termination resistors should

be placed near the processor to reduce transients and improve

signal integrity. The resistance value, typically 33  or 47 ,

should be chosen to match the average board trace impedance.

Additionally, adding a parallel termination to CLKOUT may

prove useful in further enhancing signal integrity. Be sure to

verify overshoot/undershoot and signal integrity specifications

on actual hardware.

Table 7. Signal Descriptions

Signal Name Type Function

Driver

Type

EBIU

ADDR19–1 O Address Bus A

DATA15–0 I/O Data Bus A

ABE1–0/SDQM1–0 O Byte Enable or Data Mask A

AMS1–0 O Asynchronous Memory Bank Selects (Require pull-ups if hibernate is used) A

ARE O Asynchronous Memory Read Enable A

AWE O Asynchronous Memory Write Enable A

SRAS O SDRAM Row Address Strobe A

SCAS O SDRAM Column Address Strobe A

SWE OSDRAM Write Enable A

SCKE O SDRAM Clock Enable (Requires a pull-down if hibernate with SDRAM self-refresh

is used)

CLKOUT O SDRAM Clock Output B

SA10 O SDRAM A10 Signal A

SMS O SDRAM Bank Select A

Port F: GPIO and Multiplexed Peripherals

PF0/ETxD2/PPI D0/SPI1SEL2/TACLK6 I/O GPIO/Ethernet MII Transmit D2/PPI Data 0/SPI1 Slave Select 2/Timer6 Alternate

Clock

PF1/ERxD2/PPI D1/PWM AH/TACLK7 I/O GPIO/Ethernet MII Receive D2/PPI Data 1/PWM AH Output/Timer7 Alternate Clock C

PF2/ETxD3/PPI D2/PWM AL I/O GPIO/Ethernet Transmit D3/PPI Data 2/PWM AL Output C

PF3/ERxD3/PPI D3/PWM BH/TACLK0 I/O GPIO/Ethernet MII Data Receive D3/PPI Data 3/PWM BH Output/Timer0 Alternate

Clock

PF4/ERxCLK/PPI D4/PWM BL/TACLK1 I/O GPIO/Ethernet MII Receive Clock/PPI Data 4/PWM BL Out/Timer1 Alternate CLK C

PF5/ERxDV/PPI D5/PWM CH/TACI0 I/O GPIO/Ethernet MII Receive Data Valid/PPI Data 5/PWM CH Out

/Timer0 Alternate Capture Input

PF6/COL/PPI D6/PWM CL/TACI1 I/O GPIO/Ethernet MII Collision/PPI Data 6/PWM CL Out/Timer1 Alternate Capture Input C

PF7/SPI0SEL1/PPI D7/PWMSYNC I/O GPIO/SPI0 Slave Select 1/PPI Data 7/PWM Sync C

Rev. B | Page 18 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

PF8/MDC/PPI D8/SPI1SEL4 I/O GPIO/Ethernet Management Channel Clock/PPI Data 8/SPI1 Slave Select 4 C

PF9/MDIO/PPI D9/TMR2 I/O GPIO/Ethernet Management Channel Serial Data/PPI Data 9/Timer 2 C

PF10/ETxD0/PPI D10/TMR3 I/O GPIO/Ethernet MII or RMII Transmit D0/PPI Data 10/Timer 3 C

PF11/ERxD0/PPI D11/PWM AH/TACI3 I/O GPIO/Ethernet MII Receive D0/PPI Data 11/PWM AH output

/Timer3 Alternate Capture Input

PF12/ETxD1/PPI D12/PWM AL I/O GPIO/Ethernet MII Transmit D1/PPI Data 12/PWM AL Output C

PF13/ERxD1/PPI D13/PWM BH I/O GPIO/Ethernet MII or RMII Receive D1/PPI Data 13/PWM BH Output C

PF14/ETxEN/PPI D14/PWM BL I/O GPIO/Ethernet MII Transmit Enable/PPI Data 14/PWM BL Out C

PF15

/RMII PHYINT/PPI D15/PWM_SYNCA I/O GPIO/Ethernet MII PHY Interrupt/PPI Data 15/Alternate PWM Sync C

Port G: GPIO and Multiplexed Peripherals

PG0/MIICRS/RMIICRS/HWAIT

/SPI1SEL3 I/O GPIO/Ethernet MII or RMII Carrier Sense or RMII Data Valid/HWAIT/SPI1 Slave Select3 C

PG1/ERxER/DMAR1/PWM CH I/O GPIO/Ethernet MII or RMII Receive Error/DMA Req 1/PWM CH Out C

PG2/MIITxCLK/RMIIREF_CLK/DMAR0/PWM CL I/O GPIO/Ethernet MII or RMII Reference Clock/DMA Req 0/PWM CL Out C

PG3/DR0PRI/RSI_DATA0/SPI0SEL5/TACLK3 I/O GPIO/SPORT0 Primary Rx Data/RSI Data 0/SPI0 Slave Select 5/Timer3 Alternate CLK C

PG4/RSCLK0/RSI_DATA1/TMR5/TACI5 I/O GPIO/SPORT0 Rx Clock/RSI Data 1/Timer 5/Timer5 Alternate Capture Input D

PG5/RFS0/RSI_DATA2/PPICLK/TMRCLK I/O GPIO/SPORT0 Rx Frame Sync/RSI Data 2/PPI Clock/External Timer Reference C

PG6/TFS0/RSI_DATA3/TMR0/PPIFS1 I/O GPIO/SPORT0 Tx Frame Sync/RSI Data 3/Timer0/PPI Frame Sync1 C

PG7/DT0PRI/RSI_CMD/TMR1/PPIFS2 I/O GPIO/SPORT0 Tx Primary Data/RSI Command/Timer 1/PPI Frame Sync2 C

PG8/TSCLK0/RSI_CLK/TMR6/TACI6 I/O GPIO/SPORT0 Tx Clock/RSI Clock/Timer 6/Timer6 Alternate Capture Input D

PG9/DT0SEC/UART0TX/TMR4 I/O GPIO/SPORT0 Secondary Tx Data/UART0 Transmit/Timer 4 C

PG10/DR0SEC/UART0RX/TACI4 I/O GPIO/SPORT0 Secondary Rx Data/UART0 Receive/Timer4 Alternate Capture Input C

PG11/SPI0SS/AMS2/SPI1SEL5/TACLK2 I/O GPIO/SPI0 Slave Device Select/Asynchronous Memory Bank Select 2/SPI1 Slave

Select 5/Timer2 Alternate CLK

PG12/SPI0SCK/PPICLK/TMRCLK/PTP_PPS I/O GPIO/SPI0 Clock/PPI Clock/External Timer Reference/PTP Pulse Per Second Out D

PG13/SPI0MISO

/TMR0/PPIFS1/

PTP_CLKOUT

I/O GPIO/SPI0 Master In Slave Out/Timer0/PPI Frame Sync1/PTP Clock Out C

PG14/SPI0MOSI/TMR1/PPIFS2/PWM TRIP

/PTP_AUXIN

I/O GPIO/SPI0 Master Out Slave In/Timer 1/PPI Frame Sync2/PWM Trip/PTP Auxiliary

Snapshot Trigger Input

PG15/SPI0SEL2/PPIFS3/AMS3 I/O GPIO/SPI0 Slave Select 2/PPI Frame Sync3/Asynchronous Memory Bank Select 3 C

Port H: GPIO and Multiplexed Peripherals

PH0/DR1PRI/SPI1SS/RSI_DATA4 I/O GPIO/SPORT1 Primary Rx Data/SPI1 Device Select/RSI Data 4 C

PH1/RFS1/SPI1MISO/RSI_DATA5 I/O GPIO/SPORT1 Rx Frame Sync/SPI1 Master In Slave Out/RSI Data 5 C

PH2/RSCLK1/SPI1SCK/RSI DATA6 I/O GPIO/SPORT1 Rx Clock/SPI1 Clock/RSI Data 6 D

PH3/DT1PRI/SPI1MOSI/RSI DATA7 I/O GPIO/SPORT1 Primary Tx Data/SPI1 Master Out Slave In/RSI Data 7 C

PH4/TFS1/AOE/SPI0SEL3/CUD I/O GPIO/SPORT1 Tx Frame Sync/Asynchronous Memory Output Enable/SPI0 Slave

Select 3/Counter Up Direction

PH5/TSCLK1/ARDY/PTP_EXT_CLKIN/CDG I/O GPIO/SPORT1 Tx Clock/Asynchronous Memory Hardware Ready Control/

External Clock for PTP TSYNC/Counter Down Gate

PH6/DT1SEC/UART1TX/SPI1SEL1/CZM I/O GPIO/SPORT1 Secondary Tx Data/UART1 Transmit/SPI1 Slave Select 1

/Counter Zero Marker

PH7/DR1SEC/UART1RX/TMR7/TACI2 I/O GPIO/SPORT1 Secondary Rx Data/UART1 Receive/Timer 7/Timer2 Alternate Clock

Input

Table 7. Signal Descriptions

Signal Name Type Function

Driver

Type

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 19 of 68 | January 2011

Port J

PJ0:SCL I/O 5V TWI Serial Clock (This signal is an open-drain output and requires a pull-up

resistor. Consult version 2.1 of the I

C specification for the proper resistor value.)

PJ1:SDA I/O 5V TWI Serial Data (This signal is an open-drain output and requires a pull-up

resistor. Consult version 2.1 of the I

C specification for the proper resistor value.)

Real Time Clock

RTXI I RTC Crystal Input (This ball should be pulled low when not used.)

RTXO O RTC Crystal Output (Does not three-state during hibernate)

JTAG Port

TCK I JTAG Clock

TDO O JTAG Serial Data Out C

TDI I JTAG Serial Data In

TMS I JTAG Mode Select

TRST I JTAG Reset (This signal should be pulled low if the JTAG port is not used.)

EMU O Emulation Output C

Clock

CLKIN I Clock/Crystal Input

XTAL O Crystal Output (If CLKBUF is enabled, does not three-state during hibernate)

CLKBUF O Buffered XTAL Output (If enabled, does not three-state during hibernate) C

Mode Controls

RESET I Reset

NMI I Non-maskable Interrupt (This signal should be pulled high when not used.)

BMODE2-0 I Boot Mode Strap 2-0

Voltage Regulation Interface

PG I Power Good (This signal should be pulled low when not used.)

EXT_WAKE O Wake up Indication (Does not three-state during hibernate) C

Power Supplies ALL SUPPLIES MUST BE POWERED See Operating Conditions on Page 20.

DDEXT

PI/O Power Supply

DDINT

P Internal Power Supply

DDRTC

P Real Time Clock Power Supply

DDFLASH

P Internal SPI Flash Power Supply

DDMEM

PMEM Power Supply

PPOTP

P OTP Programming Voltage

DDOTP

POTP Power Supply

GND G Ground for All Supplies

See Output Drive Currents on Page 50 for more information about each driver type.

When driven low, the PF15 signal can be used to wake up the processor from the hibernate state, either in normal GPIO mode or in Ethernet mode as PHYINT. If the pin/ball

is used for wake up, enable the feature with the PHYWE bit in the VR_CTL register, and pull-up the signal with a resistor.

Boot host wait is a GPIO signal toggled by the boot kernel. The mandatory external pull-up/pull-down resistor defines the signal polarity.

A pull-up resistor is required for the boot from external SPI EEPROM or flash (BMODE = 0x3).

Table 7. Signal Descriptions

Signal Name Type Function

Driver

Type

Rev. B | Page 20 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

SPECIFICATIONS

Note that component specifications are subject to change

without notice.

OPERATING CONDITIONS

Parameter Conditions Min Nominal Max Unit

DDINT

Internal Supply Voltage Industrial Models 1.14 1.47 V

Internal Supply Voltage Commercial Models 1.10 1.47 V

Internal Supply Voltage Automotive Models 1.33 1.47 V

DDEXT1,

Must remain powered (even if the associated function is not used).

DDEXT

is the supply to the GPIO.

External Supply Voltage 1.8 V I/O, Nonautomotive Models 1.7 1.8 1.9 V

External Supply Voltage 2.5 V I/O, Nonautomotive Models 2.25 2.5 2.75 V

External Supply Voltage 3.3 V I/O, All Models 3.0 3.3 3.6 V

DDMEM3

Pins/balls that use V

DDMEM

are DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AMS1–0, SA10, SWE, SCAS, CLKOUT, SRAS, SMS, SCKE. These pins/balls are not tolerant

to voltages higher than V

DDMEM

. When using any of the asynchronous memory signals AMS3–2, ARDY, or AOE V

DDMEM

and V

DDEXT

must be shorted externally.

MEM Supply Voltage 1.8 V I/O, Nonautomotive Models 1.7 1.8 1.9 V

MEM Supply Voltage 2.5 V I/O, Nonautomotive Models 2.25 2.5 2.75 V

MEM Supply Voltage 3.3 V I/O, All Models 3.0 3.3 3.6 V

DDRTC4

If not used, power with V

DDEXT

RTC Power Supply Voltage 2.25 3.6 V

DDFLASH4

Internal SPI Flash Supply

Voltage

1.7 1.8 1.9 V

DDOTP

OTP Supply Voltage 2.25 2.5 2.75 V

PPOTP

OTP Programming Voltage

For Reads

2.25 2.5 2.75 V

For Writes

The V

PPOTP

voltage for writes must only be applied when programming OTP memory. There is a finite amount of cumulative time that this voltage may be applied (dependent

on voltage and junction temperature) over the lifetime of the part.

6.9 7.0 7.1 V

High Level Input Voltage

6, 7

Bidirectional pins/balls (PF15–0, PG15–0, PH7–0) and input pins/balls (RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE2–0) of the ADSP-BF51x are

3.3 V tolerant (always accept up to 3.6 V maximum V

). Voltage compliance (on outputs, V

) is limited by the V

DDEXT

supply voltage.

Parameter value applies to all input and bidirectional pins/balls except SDA and SCL.

DDEXT

DDMEM

= 1.90 V 1.2 V

High Level Input Voltage

6, 7

DDEXT

DDMEM

= 2.75 V 1.7 V

High Level Input Voltage

6, 7

DDEXT

DDMEM

= 3.6 V 2 V

IHTWI

High Level Input Voltage V

DDEXT

= 1.90 V/2.75 V/3.6 V 0.7 x V

BUSTWI

BUSTWI8

The V

IHTWI

min and max value vary with the selection in the TWI_DT field of the NONGPIO_DRIVE register. See V

BUSTWI

min and max values in Table 8.

Low Level Input Voltage

6, 7

DDEXT

DDMEM

= 1.7 V 0.6 V

Low Level Input Voltage

6, 7

DDEXT

DDMEM

= 2.25 V 0.7 V

Low Level Input Voltage

6, 7

DDEXT

DDMEM

= 3.0 V 0.8 V

ILTWI

Low Level Input Voltage V

DDEXT

= Minimum 0.3 x V

BUSTWI9

SDA and SCL are pulled up to V

BUSTWI

. See Table 8.

Junction Temperature 168-Ball CSP_BGA @ T

AMBIENT

= 0°C to +70°C 0 +95 °C

Junction Temperature 168-Ball CSP_BGA @ T

AMBIENT

= –40°C to +85°C –40 +105 °C

Junction Temperature 176-Lead LQFP @ T

AMBIENT

= 0°C to +70°C 0 +95 °C

Junction Temperature 176-Lead LQFP @ T

AMBIENT

= –40°C to +85°C –40 +105 °C

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 21 of 68 | January 2011

Table 8 shows settings for TWI_DT in the NONGPIO_DRIVE

Clock Related Operating Conditions

Table 9 describes the timing requirements for the processor

clocks. Take care in selecting MSEL, SSEL, and CSEL ratios so as

not to exceed the maximum core clock and system clock.

Table 10 describes phase-locked loop operating conditions.

Table 8. TWI_DT Field Selections and V

DDEXT

BUSTWI

TWI_DT V

DDEXT

Nominal V

BUSTWI

Minimum V

BUSTWI

Nominal V

BUSTWI

Maximum Unit

000 (default) 3.3 2.97 3.3 3.63 V

001 1.8 1.7 1.8 1.98 V

010 2.5 2.97 3.3 3.63 V

011 1.8 2.97 3.3 3.63 V

100 3.3 4.5 5 5.5 V

101 1.8 2.25 2.5 2.75 V

110 2.5 2.25 2.5 2.75 V

111 (reserved)—————

Table 9. Core Clock (CCLK) Requirements

Parameter

Nominal

Voltage Setting Maximum Unit

CCLK

Core Clock Frequency (V

DDINT

=1.33 V Minimum, All Models) 1.400 V 400 MHz

Core Clock Frequency (V

DDINT

=1.23 V Minimum, Industrial/Commercial Models) 1.300 V 300 MHz

Core Clock Frequency (V

DDINT

= 1.14 V Minimum, Industrial Models Only) 1.200 V 200 MHz

Core Clock Frequency (V

DDINT

= 1.10 V Minimum, Commercial Models Only) 1.150 V 200 MHz

Table 10. Phase-Locked Loop Operating Conditions

Parameter Min Max Unit

VCO

Voltage Controlled Oscillator (VCO) Frequency

(Commercial/Industrial Models)

72 Instruction Rate

MHz

Voltage Controlled Oscillator (VCO) Frequency

(Automotive Models)

84 Instruction Rate

MHz

For more information, see Ordering Guide on Page 65.

Table 11. SCLK Conditions

DDEXT

DDMEM

1.8 V Nominal

DDEXT

DDMEM

2.5 V or 3.3 V Nominal

Parameter

Max Max Unit

SCLK

CLKOUT/SCLK Frequency (V

DDINT

≥ 1.230 V

Minimum)

80 100 MHz

SCLK

CLKOUT/SCLK Frequency (V

DDINT

< 1.230 V) 80 80 MHz

SCLK

must be less than or equal to f

CCLK

and is subject to additional restrictions for SDRAM interface operation. See Table 28 on Page 31.

Rev. B | Page 22 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

ELECTRICAL CHARACTERISTICS

Parameter Test Conditions Min Typical Max Unit

High Level Output Voltage V

DDEXT

DDMEM

= 1.7 V,

=–0.5mA

1.35 V

High Level Output Voltage V

DDEXT

DDMEM

= 2.25 V,

=–0.5mA

High Level Output Voltage V

DDEXT

DDMEM

= 3.0 V,

=–0.5mA

2.4 V

Low Level Output Voltage V

DDEXT

DDMEM

1.7/2.25/3.0 V,

=2.0mA

0.4 V

IH1

High Level Input Current V

DDEXT

DDMEM

=3.6 V,

=3.6V

10 µA

IL1

Low Level Input Current V

DDEXT

DDMEM

=3.6 V, V

= 0 V 10 µA

IHP2

High Level Input Current JTAG V

DDEXT

= 3.6 V, V

= 3.6 V 75 µA

OZH3

Three-State Leakage Current V

DDEXT

DDMEM

= 3.6 V,

=3.6V

10 µA

OZHTWI4

Three-State Leakage Current V

DDEXT

=3.0 V, V

= 5.5 V 10 µA

OZL3

Three-State Leakage Current V

DDEXT

DDMEM

= 3.6 V, V

= 0 V 10 µA

IN5, 6

Input Capacitance f

= 1 MHz, T

AMBIENT

= 25°C,

=2.5V

58 pF

INTWI4,

Input Capacitance f

= 1 MHz, T

AMBIENT

= 25°C,

=2.5V

15 pF

DDDEEPSLEEP7

DDINT

Current in Deep Sleep

Mode

DDINT

= 1.3 V, f

CCLK

= 0 MHz,

SCLK

=0MHz, T

= 25°C,

ASF = 0.00

2.1 mA

DDSLEEP

DDINT

Current in Sleep Mode V

DDINT

= 1.3 V, f

SCLK

= 25 MHz,

= 25°C

5.5 mA

DD-IDLE

DDINT

Current in Idle V

DDINT

= 1.3 V, f

CCLK

= 50 MHz,

SCLK

=25MHz, T

= 25°C,

ASF = 0.41

12 mA

DD-TYP

DDINT

Current V

DDINT

= 1.3 V, f

CCLK

= 300 MHz,

SCLK

=25MHz, T

= 25°C,

ASF = 1.00

77 mA

DD-TYP

DDINT

Current V

DDINT

= 1.4 V, f

CCLK

= 400 MHz,

SCLK

=25MHz, T

= 25°C,

ASF = 1.00

108 mA

DDHIBERNATE8

Hibernate State Current V

DDEXT

DDMEM

DDRTC

=3.30

DDOTP

PPOTP

=2.5V,

= 25°C, CLKIN = 0 MHz @ T

= 25°C

40 A

DDRTC

Current V

DDRTC

= 3.3 V, T

= 25°C 20 A

DDSLEEP8,

DDINT

Current in Sleep Mode f

CCLK

= 0 MHz, f

SCLK

> 0 MHz Table 13 +

(0.20 × V

DDINT

× f

SCLK

)

DDDEEPSLEEP8,

DDINT

Current in Deep Sleep

Mode

CCLK

= 0 MHz, f

SCLK

= 0 MHz Table 13 mA

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 23 of 68 | January 2011

Total Power Dissipation

Total power dissipation has two components:

1. Static, including leakage current

2. Dynamic, due to transistor switching characteristics

Many operating conditions can also affect power dissipation,

including temperature, voltage, operating frequency, and pro-

cessor activity. Electrical Characteristics on Page 22 shows the

current dissipation for internal circuitry (V

DDINT

). I

DDDEEPSLEEP

specifies static power dissipation as a function of voltage

DDINT

) and temperature (see Table 13), and I

DDINT

specifies the

total power specification for the listed test conditions, including

the dynamic component as a function of voltage (V

DDINT

) and

frequency (Table 14).

There are two parts to the dynamic component. The first part is

due to transistor switching in the core clock (CCLK) domain.

This part is subject to an Activity Scaling Factor (ASF) which

represents application code running on the processor core and

L1 memories (Table 12).

The ASF is combined with the CCLK Frequency and V

DDINT

dependent data in Table 14 to calculate this part. The second

part is due to transistor switching in the system clock (SCLK)

domain, which is included in the I

DDINT

specification equation.

DDINT10,

DDINT

Current f

CCLK

> 0 MHz, f

SCLK

≥ 0 MHz Table 13 +

(Table 14 × ASF) +

(0.20 × V

DDINT

× f

SCLK

)

DDFLASH1

Flash Memory Supply Current 1

—Asynchronous Read

10 6 mA

DDFLASH2

Flash Memory Supply Current 2

—Standby

412 A

DDFLASH3

Flash Memory Supply Current 3

—Program and Erase

11 16 mA

DDOTP

Current V

DDOTP

= 2.5 V, T

= 25°C,

OTP Memory Read

2mA

DDOTP

Current V

DDOTP

= 2.5 V, T

= 25°C,

OTP Memory Write

2mA

PPOTP

Current V

PPOTP

= 2.5 V, T

= 25°C,

OTP Memory Read

100 A

PPOTP

Current V

PPOTP

= Table 19 V, T

= 25°C,

OTP Memory Write

3mA

Applies to input balls.

Applies to JTAG input balls (TCK, TDI, TMS, TRST).

Applies to three-statable balls.

Applies to bidirectional balls SCL and SDA.

Applies to all signal balls, except SCL and SDA.

Guaranteed, but not tested.

See the ADSP-BF51x Blackfin Processor Hardware Reference Manual for definition of sleep, deep sleep, and hibernate operating modes.

Includes current on V

DDEXT

, V

DDMEM

, V

DDOTP

, and V

PPOTP

supplies. Clock inputs are tied high or low.

Guaranteed maximum specifications.

Unit for V

DDINT

is V (Volts). Unit for f

SCLK

is MHz.

See Table 12 for the list of I

DDINT

power vectors covered.

Parameter Test Conditions Min Typical Max Unit

Table 12. Activity Scaling Factors (ASF)

See Estimating Power for ASDP-BF534/BF536/BF537 Blackfin Processors

(EE-297). The power vector information also applies to the ADSP-BF51x

processors.

DDINT

Power Vector Activity Scaling Factor (ASF)

DD-PEAK

1.29

DD-HIGH

1.25

DD-TYP

1.00

DD-APP

0.85

DD-NOP

0.70

DD-IDLE

0.41

Rev. B | Page 24 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

FLASH MEMORY CHARACTERISTICS

Table 13. Static Current—I

DD-DEEPSLEEP

(mA)

(°C)

Voltage (V

DDINT

)

1.10 V 1.15 V 1.20 V 1.25 V 1.30 V 1.35 V 1.40 V 1.45 V 1.50 V

–40 0.9 1.0 1.0 1.1 1.1 1.2 1.3 1.7 1.9

–20 1.0 1.1 1.2 1.3 1.4 1.6 1.7 1.9 2.0

0 1.2 1.3 1.4 1.6 1.8 2.0 2.2 2.3 2.5

25 1.8 1.9 2.1 2.3 2.5 2.8 3.1 3.3 3.7

40 2.4 2.6 2.8 3.0 3.3 3.7 4.0 4.4 4.9

55 3.3 3.5 3.8 4.3 4.6 5.0 5.5 6.1 6.7

70 4.6 5.0 5.4 6.0 6.4 7.0 7.7 8.4 9.2

85 6.5 7.1 7.7 8.3 9.1 9.9 10.8 11.8 12.8

100 9.2 10.0 10.8 11.7 12.7 13.7 15.0 16.1 17.5

105 10.3 11.1 12.1 13.1 14.2 15.3 16.6 18.0 19.4

Valid frequency and voltage ranges are model-specific. See Operating Conditions on Page 20.

Table 14. Dynamic Current in CCLK Domain (mA, with ASF = 1.0)

CCLK

(MHz)

Voltage (V

DDINT

)

1.10 V 1.15 V 1.20 V 1.25 V 1.30 V 1.35 V 1.40 V 1.45 V 1.50 V

400 N/A N/A N/A N/A 93.4 97.7 102.1 106.5 111.0

350 N/A N/A N/A N/A 82.4 86.2 90.1 94.0 98.0

300 N/A N/A 64.8 68.1 71.4 74.7 78.1 81.5 85.0

250 N/A N/A 54.8 57.5 60.4 63.2 66.1 69.0 71.9

200 40.2 42.5 44.7 47.0 49.4 51.7 54.1 56.5 58.9

150 31.1 32.9 34.7 36.5 38.4 40.2 42.1 44.0 45.9

100 22.0 23.4 24.7 26.0 27.4 28.7 30.1 31.5 33.0

The values are not guaranteed as standalone maximum specifications. They must be combined with static current per the equations of Electrical Characteristics on Page 22.

Valid frequency and voltage ranges are model-specific. See Operating Conditions on Page 20.

Table 15. Reliability Characteristics

Parameter Min Units Test Method

END

Endurance 100,000 Cycles JEDEC Standard A117

Data Retention 100 Years JEDEC Standard A103

Table 16. AC Operating Characteristics

Parameter Min Max Units

CLK1

Serial Clock Frequency 25 MHz

Sector-Erase 75 ms

Block-Erase 75 ms

SCE

Chip-Erase 150 ms

BP2

Byte-Program 60 s

Maximum clock frequency for Read instruction, 0x03, is 20 MHz.

AAI-Word Program TBP maximum specification is also at 60 µs maximum time.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 25 of 68 | January 2011

ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed in Table 17 may cause perma-

nent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other condi-

tions greater than those indicated in the operational sections of

this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

When programming OTP memory on the ADSP-BF51x proces-

sor, the V

PPOTP

pin/ball must be set to the write value specified in

the Operating Conditions on Page 20. There is a finite amount

of cumulative time that the write voltage may be applied

(dependent on voltage and junction temperature) to V

PPOTP

over

the lifetime of the part. Therefore, maximum OTP memory pro-

gramming time for the processor is shown in Table 19.

Table 20 and Table 21 specify the maximum total source/sink

) current for a group of pins. Permanent damage can

occur if this value is exceeded. To understand this specification,

if pins PF9, PF8, PF7, PF6, and PF5 from Group 1 in Table 21

table were sourcing or sinking 2 mA each, the total current for

those pins would be 10 mA. This would allow up to 70 mA total

that could be sourced or sunk by the remaining pins in the

group without damaging the device. Note that the V

and V

specifications have separate per-pin maximum current require-

ments as shown in the Electrical Characteristics table.

Table 17. Absolute Maximum Ratings

Parameter Rating

Internal Supply Voltage (V

DDINT

) –0.3 V to +1.50 V

External (I/O) Supply Voltage

DDEXT

DDMEM

)

–0.3 V to +3.8 V

Input Voltage

1, 2

Applies to 100% transient duty cycle. For other duty cycles see Table 18.

Applies only when V

DDEXT

is within specifications. When V

DDEXT

is outside speci-

fications, the range is V

DDEXT

± 0.2.

–0.5 V to +3.6 V

Input Voltage

1, 3

Applies to signals SCL, SDA.

–0.5 V to +5.5 V

Output Voltage Swing –0.5 V to

DDEXT

DDMEM

+0.5 V

Current per Pin Group

For more information, see the information preceding Table 20 and Table 21.

80 mA (max)

Storage Temperature Range –65°C to +150°C

Junction Temperature While biased +110°C

Table 18. Maximum Duty Cycle for Input Transient Voltage

Applies to all signal pins/balls with the exception of CLKIN, XTAL.

Min (V)

The individual values cannot be combined for analysis of a single instance of

overshoot or undershoot. The worst case observed value must fall within one of

the voltages specified and the total duration of the overshoot or undershoot

(exceeding the 100% case) must be less than or equal to the corresponding duty

cycle.

Max (V)

Maximum Duty Cycle

Duty cycle refers to the percentage of time the signal exceeds the value for the

100% case. The is equivalent to the measured duration of a single instance of

overshoot or undershoot as a percentage of the period of occurrence.

–0.50 +3.80 100%

–0.70 +4.00 40%

–0.80 +4.10 25%

–0.90 +4.20 15%

–1.00 +4.30 10%

Table 19. Maximum OTP Memory Programming Time

Temperature

VPPOTP

Voltage (V) 25°C 85°C 110°C

6.9 6000 sec 100 sec 25 sec

7.0 2400 sec 44 sec 12 sec

7.1 1000 sec 18 sec 4.5 sec

Table 20. Total Current Pin Groups–V

DDMEM

Groups

Group Pins in Group

1 DATA15, DATA14, DATA13, DATA12, DATA11, DATA10

2 DATA9, DATA8, DATA7, DATA6, DATA5, DATA4

3 DATA3, DATA2, DATA1, DATA0, ADDR19, ADDR18

4 ADDR17, ADDR16, ADDR15, ADDR14, ADDR13

5 ADDR12, ADDR11, ADDR10, ADDR9, ADDR8, ADDR7

6 ADDR6, ADDR5, ADDR4, ADDR3, ADDR2, ADDR1

7ABE1

, ABE0, SA10, SWE, SCAS, SRAS

8SMS, SCKE, AMS1, ARE, AWE, AMS0, CLKOUT

Table 21. Total Current Pin Groups–V

DDEXT

Groups

Group Pins in Group

1 PF9, PF8, PF7, PF6, PF5, PF4, PF3, PF2

2 PF1, PF0, PG15, PG14, PG13, PG12, PG11, PG10

3 PG9, PG8, PG7, PG6, PG5, PG4, PG3, PG2, BMODE0,

BMODE1, BMODE2

4PG1, PG0, TDO, EMU

, TDI, TCK, TRST, TMS

5RESET

, NMI, CLKBUF

6 PH7, PH6, PH5, PH4, PH3, PH2, PH1, PH0

7 PF15, PF14, PF13, PF12, PF11, SDA, SCL, PF10

Rev. B | Page 26 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

PACKAGE INFORMATION

The information presented in Figure 6 and Table 22 provides

details about the package branding for the processor. For a com-

plete listing of product availability, see Ordering Guide on

Page 65.

ESD SENSITIVITY

Figure 6. Product Information on Package

Table 22. Package Brand Information

Brand Key Field Description

ADSP-BF51x Product Name

t Temperature Range

pp Package Type

Z Lead Free Option

ccc See Ordering Guide

vvvvvv.x Assembly Lot Code

n.n Silicon Revision

# RoHS Compliance Designator

yyww Date Code

vvvvvv.x n.n

tppZccc

ADSP-BF51x

#yyww country_of_origin

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can discharge

without detection. Although this product features

patented or proprietary protection circuitry, damage

may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to

avoid

performance degradation or loss of functionality.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 27 of 68 | January 2011

TIMING SPECIFICATIONS

Clock and Reset Timing

Table 23 and Figure 7 describe clock and reset operations. Per

the CCLK and SCLK timing specifications in Table 9 , Table 10,

and Table 11 on Page 21, combinations of CLKIN and clock

multipliers must not select core/peripheral clocks in excess of

the processor’s speed grade.

Table 23. Clock and Reset Timing

Parameter Min Max Unit

Timing Requirements

CKIN

CLKIN Frequency (Commercial/Industrial Models

1, 2,

12 50 MHz

CKIN

CLKIN Frequency (Automotive Models)

14 50 MHz

CKINL

CLKIN Low Pulse

10 ns

CKINH

CLKIN High Pulse

10 ns

WRST

RESET Asserted Pulse Width Low

11 × t

CKIN

Switching Characteristic

BUFDLAY

CLKIN to CLKBUF Delay 11 ns

Applies to PLL bypass mode and PLL nonbypass mode.

Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed f

VCO

, f

CCLK

, and f

SCLK

settings discussed in Table 9 through Table 11 on Page 21.

The t

CKIN

period (see Figure 7) equals 1/f

CKIN

If the DF bit in the PLL_CTL register is set, the minimum f

CKIN

specification is 24 MHz for commercial/industrial models and 28 MHz for automotive models.

Applies after power-up sequence is complete. See Table 24 and Figure 8 for power-up reset timing.

Figure 7. Clock and Reset Timing

Table 24. Power-Up Reset Timing

Parameter Min Max Unit

Timing Requirements

RST_IN_PWR

RESET Deasserted after the V

DDINT

, V

DDEXT

, V

DDRTC

, V

DDMEM

, V

DDOTP

, and CLKIN Pins are

Stable and Within Specification

3500 × t

CKIN

CLKIN

tWRST

tCKIN

tCKINL tCKINH

tBUFDLAY

RESET

CLKBUF

Rev. B | Page 28 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Flash Reset Timing

Driving the RESET pin low resets the Flash device. Driving the

RESET pin high puts the device in normal operating mode. The

SO pin is in high impedance state while the device is in reset. A

successful reset will reset the status register to its power-up state.

See Table 25 for default power-up modes. A device reset during

an active Program or Erase operation aborts the operation and

data of the targeted address range may be corrupted or lost due

to the aborted erase or program operation. The device exits AAI

Programming Mode in progress and places the SO pin in high

impedance state.

Figure 8. Power-Up Reset Timing

RESET

tRST_IN_PWR

CLKIN

VDD_SUPPLIES

Table 25. RESET Timing

Parameter Min Max Unit

Timing Requirements

RECR

Reset Recovery from Read 100 ns

RECP

Reset Recovery from Program 10 s

RECE

Reset Recovery from Erase 1ms

Figure 9. Flash Reset Timing

SCK

RST tRECR

tRECP

tRECE

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 29 of 68 | January 2011

Asynchronous Memory Read Cycle Timing

Table 26. Asynchronous Memory Read Cycle Timing

DDMEM

1.8V Nominal

DDMEM

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SDAT

DATA15–0 Setup Before CLKOUT 2.1 2.1 ns

HDAT

DATA15–0 Hold After CLKOUT 1.2 0.8 ns

SARDY

ARDY Setup Before CLKOUT 4 4 ns

HARDY

ARDY Hold After CLKOUT 0.2 0.2 ns

Switching Characteristics

Output Delay After CLKOUT

Output pins/balls include AMS3–0, ABE1– 0, ADDR19–1, AOE, ARE.

66ns

Output Hold After CLKOUT

0.8 0.8 ns

Figure 10. Asynchronous Memory Read Cycle Timing

tHARDY

SETUP

2 CYCLES

PROGRAMMED READ

ACCESS 4 CYCLES

ACCESS EXTENDED

3 CYCLES

HOLD

1 CYCLE

tDO tHO

tDO

tHARDY

tSARDY

tSDAT

tHDAT

tSARDY

CLKOUT

AMSx

ABE1–0

ADDR19–1

AOE

ARE

ARDY

DATA 15–0

tHO

Rev. B | Page 30 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Asynchronous Memory Write Cycle Timing

Table 27. Asynchronous Memory Write Cycle Timing

Parameter Min Max Unit

Timing Requirements

SARDY

ARDY Setup Before CLKOUT 4 ns

HARDY

ARDY Hold After CLKOUT 0.2 ns

Switching Characteristics

DDAT

DATA15–0 Disable After CLKOUT 6 ns

ENDAT

DATA15–0 Enable After CLKOUT 0 ns

Output Delay After CLKOUT

Output pins/balls include AMS3–0, ABE1–0, ADDR19–1, DATA15–0, AOE, AWE.

6ns

Output Hold After CLKOUT

0.8 ns

Figure 11. Asynchronous Memory Write Cycle Timing

SETUP

2 CYCLES

PROGRAMMED

WRITE

ACCESS

2 CYCLES

ACCESS

EXTEND

1 CYCLE

HOLD

1 CYCLE

tDO tHO

CLKOUT

AMSx

ABE1–0

ADDR19–1

AWE

ARDY

DATA 15–0

tSARDY

tDDAT

tENDAT tHARDY

tHO

tDO

tHARDY

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 31 of 68 | January 2011

SDRAM Interface Timing

Table 28. SDRAM Interface Timing

DDMEM

1.8V Nominal

DDMEM

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SSDAT

Data Setup Before CLKOUT 1.5 1.5 ns

HSDAT

Data Hold After CLKOUT 1.3 0.8 ns

Switching Characteristics

SCLK

CLKOUT Period

The t

SCLK

value is the inverse of the f

SCLK

specification discussed in Table 11 on Page 21. Package type and reduced supply voltages affect the best-case value listed here.

12.5 10 ns

SCLKH

CLKOUT Width High 5 4 ns

SCLKL

CLKOUT Width Low 5 4 ns

DCAD

Command, Address, Data Delay After CLKOUT

Command pins/balls include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.

54ns

HCAD

Command, Address, Data Hold After CLKOUT

11ns

DSDAT

Data Disable After CLKOUT 5.5 5 ns

ENSDAT

Data Enable After CLKOUT 0 0 ns

Figure 12. SDRAM Interface Timing

tSCLK

CLKOUT

tSCLKL tSCLKH

tSSDAT tHSDAT

tENSDAT

tDCAD tDSDAT

tHCAD

tDCAD tHCAD

DATA (IN)

DATA (OUT)

COMMAND,

ADDRESS

(OUT)

NOTE: COMMAND = SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE.

Rev. B | Page 32 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

External DMA Request Timing

Table 29 and Figure 13 describe the External DMA Request

operations.

Table 29. External DMA Request Timing

DDMEM

DDEXT

1.8 V Nominal

DDMEM

DDEXT

2.5 V/3.3 V Nominal

Parameter Min Max Min Max Unit

Timing PRequirements

DMARx Asserted to CLKOUT High Setup 9 7.2 ns

CLKOUT High to DMARx Deasserted Hold Time 0 0 ns

DMARACT

DMARx Active Pulse Width t

SCLK

+ 1 t

SCLK

+ 1 ns

DMARINACT

DMARx Inactive Pulse Width 1.75 × t

SCLK

1.75 × t

SCLK

Because the external DMA control pins are part of the V

DDEXT

power domain and the CLKOUT signal is part of the V

DDMEM

power domain, systems in which V

DDEXT

and

DDMEM

are NOT equal may require level shifting logic for correct operation.

Figure 13. External DMA Request Timing

CLKOUT

tDS

DMAR0/1

(ACTIVE LOW)

DMAR0/1

(ACTIVE HIGH)

tDMARACT tDMARINACT

tDH

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 33 of 68 | January 2011

Parallel Peripheral Interface Timing

Table 30 and Figure 15 on Page 33, Figure 21 on Page 38, and

Figure 24 on Page 40 describe parallel peripheral interface

operations.

Table 30. Parallel Peripheral Interface Timing

DDEXT

1.8 V Nominal

DDEXT

2.5 V/3.3 V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

PCLKW

PPI_CLK Width t

SCLK

– 1.5 t

SCLK

– 1.5 ns

PCLK

PPI_CLK Period 2 × t

SCLK

– 1.5 2 × t

SCLK

– 1.5 ns

Timing Requirements - GP Input and Frame Capture Modes

PSUD

External Frame Sync Startup Delay

4 × t

PCLK

4 × t

PCLK

SFSPE

External Frame Sync Setup Before PPI_CLK

(Nonsampling Edge for Rx, Sampling Edge for Tx)

6.7 6.7 ns

HFSPE

External Frame Sync Hold After PPI_CLK 1.75 1.75 ns

SDRPE

Receive Data Setup Before PPI_CLK 4.1 3.5 ns

HDRPE

Receive Data Hold After PPI_CLK 2 1.6 ns

Switching Characteristics - GP Output and Frame Capture Modes

DFSPE

Internal Frame Sync Delay After PPI_CLK 8 8 ns

HOFSPE

Internal Frame Sync Hold After PPI_CLK 1.7 1.7 ns

DDTPE

Transmit Data Delay After PPI_CLK 8.2 8 ns

HDTPE

Transmit Data Hold After PPI_CLK 2.3 1.9 ns

The PPI port is fully enabled 4 PPI clock cycles after the PAB write to the PPI port enable bit. Only after the PPI port is fully enabled are external frame syncs and data words

guaranteed to be received correctly by the PPI peripheral.

Figure 14. PPI with External Frame Sync Timing

Figure 15. PPI GP Rx Mode with External Frame Sync Timing

PPI_CLK

PPI_FS1/2

tPSUD

tPCLK

tSFSPE

DATA SAMPLED /

FRAME SYNC SAMPLED

DATA SAMPLED /

FRAME SYNC SAMPLED

PPI_DATA

PPI_CLK

PPI_FS1/2

tHFSPE

tHDRPE

tSDRPE

tPCLKW

Rev. B | Page 34 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Figure 16. PPI GP Tx Mode with External Frame Sync Timing

Figure 17. PPI GP Rx Mode with Internal Frame Sync Timing

Figure 18. PPI GP Tx Mode with Internal Frame Sync Timing

tHDTPE

tSFSPE

DATA DRIVEN /

FRAME SYNC SAMPLED

PPI_DATA

PPI_CLK

PPI_FS1/2

tHFSPE

tDDTPE

tPCLK

tPCLKW

tHDRPE

tSDRPE

tHOFSPE

FRAME SYNC

DRIVEN

DATA

SAMPLED

PPI_DATA

PPI_CLK

PPI_FS1/2

tDFSPE

tPCLK

tPCLKW

tHOFSPE

FRAME SYNC

DRIVEN

DATA

DRIVEN

PPI_DATA

PPI_CLK

PPI_FS1/2

tDFSPE

tDDTPE tHDTPE

tPCLK

tPCLKW

DATA

DRIVEN

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 35 of 68 | January 2011

RSI Controller Timing

Table 31 and Figure 19 describe RSI controller timing. Table 32

and Figure 20 describe RSI controller (high speed) timing.

Table 31. RSI Controller Timing

Parameter Min Max Unit

Timing Requirements

ISU

Input Setup Time 5.6 ns

Input Hold Time 2 ns

Switching Characteristics

PP1

Clock Frequency Data Transfer Mode 0 25 MHz

Clock Frequency Identification Mode 100

400 kHz

Clock Low Time 10 ns

Clock High Time 10 ns

TLH

Clock Rise Time 10 ns

THL

Clock Fall Time 10 ns

ODLY

Output Delay Time During Data Transfer Mode 14 ns

ODLY

Output Delay Time During Identification Mode 50 ns

= 1/f

Specification can be 0 kHz, which means to stop the clock. The given minimum frequency range is for cases where a continuous clock is required.

Figure 19. RSI Controller Timing

SD_CLK

INPUT

OUTPUT

tISU

NOTES:

1 INPUT INCLUDES SD_Dx AND SD_CMD SIGNALS.

2 OUTPUT INCLUDES SD_Dx AND SD_CMD SIGNALS.

tTHL tTLH

tWL tWH

tPP

tIH

tODLY

VOH (MIN)

VOL (MAX)

Rev. B | Page 36 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Table 32. RSI Controller Timing (High Speed Mode)

Parameter Min Max Unit

Timing Requirements

ISU

Input Setup Time 5.6 ns

Input Hold Time 2 ns

Switching Characteristics

PP1

Clock Frequency Data Transfer Mode 0 50 MHz

Clock Low Time 7 ns

Clock High Time 7 ns

TLH

Clock Rise Time 3ns

THL

Clock Fall Time 3ns

ODLY

Output Delay Time During Data Transfer Mode 4 ns

Output Hold Time 2.75 ns

= 1/f

Figure 20. RSI Controller Timing (High Speed Mode)

SD_CLK

INPUT

OUTPUT

tISU

NOTES:

1 INPUT INCLUDES SD_Dx AND SD_CMD SIGNALS.

2 OUTPUT INCLUDES SD_Dx AND SD_CMD SIGNALS.

tTHL tTLH

tWL tWH

tPP

tIH

tODLY tOH

VOH (MIN)

VOL (MAX)

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 37 of 68 | January 2011

Serial Ports

Table 33 through Table 36 on Page 40 and Figure 21 on Page 38

through Figure 24 on Page 40 describe serial port operations.

Table 33. Serial Ports—External Clock

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SFSE1

TFSx/RFSx Setup Before TSCLKx/RSCLKx 3 3 ns

HFSE1

TFSx/RFSx Hold After TSCLKx/RSCLKx 3 3 ns

SDRE1

Receive Data Setup Before RSCLKx 3 3 ns

HDRE1

Receive Data Hold After RSCLKx 3.5 3 ns

SCLKEW

TSCLKx/RSCLKx Width 7 4.5 ns

SCLKE

TSCLKx/RSCLKx Period 2 × t

SCLK

2 × t

SCLK

SUDTE2

Start-Up Delay From SPORT Enable To First External TFSx 4 × t

SCLKE

4 × t

SCLKE

SUDRE2

Start-Up Delay From SPORT Enable To First External RFSx 4 × t

SCLKE

4 × t

SCLKE

Switching Characteristics

DFSE3

TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated

TFSx/RFSx)

10 10 ns

HOFSE3

TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated

TFSx/RFSx)

00ns

DDTE3

Transmit Data Delay After TSCLKx 10 10 ns

HDTE3

Transmit Data Hold After TSCLKx 0 0 ns

Referenced to sample edge.

Verified in design but untested.

Referenced to drive edge.

Table 34. Serial Ports—Internal Clock

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SFSI1

TFSx/RFSx Setup Before TSCLKx/RSCLKx 11 9.6 ns

HFSI1

TFSx/RFSx Hold After TSCLKx/RSCLKx –1.5 –1.5 ns

SDRI1

Receive Data Setup Before RSCLKx 11 9.6 ns

HDRI1

Receive Data Hold After RSCLKx –1.5 –1.5 ns

Switching Characteristics

DFSI2

TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated

TFSx/RFSx)

33ns

HOFSI2

TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated

TFSx/RFSx)

−2−1ns

DDTI2

Transmit Data Delay After TSCLKx 3 3 ns

HDTI2

Transmit Data Hold After TSCLKx −1.8 −1.5 ns

SCLKIW

TSCLKx/RSCLKx Width 10 8 ns

Referenced to sample edge.

Referenced to drive edge.

Rev. B | Page 38 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Figure 21. Serial Ports

Figure 22. Serial Port Start Up with External Clock and Frame Sync

tSDRI

RSCLKx

DRx

tHDRI

tSFSI tHFSI

tDFSI

tHOFSI

tSCLKIW

tSDRE

RSCLKx

DRx

tHDRE

tSFSE tHFSE

tDFSE

tSCLKEW

tHOFSE

tDDTI

tHDTI

TSCLKx

TFSx

(INPUT)

DTx

tSFSI tHFSI

tSCLKIW

tDFSI

tHOFSI

DATA TRANSMIT—INTERNAL CLOCK

tDDTE

tHDTE

TSCLKx

DTx

tSFSE

tDFSE

tSCLKEW

tHOFSE

DATA TRANSMIT—EXTERNAL CLOCK

DRIVE EDGE SAMPLE EDGE DRIVE EDGE SAMPLE EDGE

tSCLKE

tHFSE

TFSx

(OUTPUT)

TFSx

(INPUT)

TFSx

(OUTPUT)

RFSx

(INPUT)

RFSx

(OUTPUT)

RFSx

(INPUT)

RFSx

(OUTPUT)

TSCLKx

(INPUT)

TFSx

(INPUT)

RFSx

(INPUT)

RSCLKx

(INPUT)

tSUDTE

tSUDRE

FIRST

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 39 of 68 | January 2011

Table 35. Serial Ports—Enable and Three-State

Parameter Min Max Unit

Switching Characteristics

DTENE

Data Enable Delay from External TSCLKx 0 ns

DDTTE

Data Disable Delay from External TSCLKx t

SCLK

+ 1 ns

DTENI

Data Enable Delay from Internal TSCLKx –2.0 ns

DDTTI

Data Disable Delay from Internal TSCLKx t

SCLK

+ 1 ns

Referenced to drive edge.

Figure 23. Enable and Three-State

TSCLKx

DTx

DRIVE EDGE

tDDTTE/I

tDTENE/I

DRIVE EDGE

Rev. B | Page 40 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Table 36. External Late Frame Sync

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Switching Characteristics

DDTLFSE1, 2

Data Delay from Late External TFSx or External RFSx with

MCE = 1, MFD = 0

12 10 ns

DTENLFSE1, 2

Data Enable from Late FS or MCE = 1, MFD = 0 0 0 ns

MCE = 1, TFSx enable and TFSx valid follow t

DDTENFS

and t

DDTLFSE

If external RFSx/TFSx setup to RSCLKx/TSCLKx > t

SCLKE

/2 then t

DDTTE/I

and t

DTENE/I

apply, otherwise t

DDTLFSE

and t

DTENLFS

apply.

Figure 24. External Late Frame Sync

RSCLKx

RFSx

DTx

DRIVE

EDGE

DRIVE

EDGE

SAMPLE

EDGE

EXTERNAL RFSx IN MULTI-CHANNEL MODE

1ST BIT

tDTENLFSE

tDDTLFSE

TSCLKx

TFSx

DTx

DRIVE

EDGE

DRIVE

EDGE

SAMPLE

EDGE

LATE EXTERNAL TFSx

1ST BIT

tDDTLFSE

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 41 of 68 | January 2011

Serial Peripheral Interface (SPI) Port—Master Timing

Table 37 and Figure 25 describe SPI port master operations.

Table 37. Serial Peripheral Interface (SPI) Port—Master Timing

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SSPIDM

Data Input Valid to SCK Edge (Data Input Setup) 11.6 9.6 ns

HSPIDM

SCK Sampling Edge to Data Input Invalid –1.5 –1.5 ns

Switching Characteristics

SDSCIM

SPISELx low to First SCK Edge 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPICHM

Serial Clock High Period 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPICLM

Serial Clock Low Period 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPICLK

Serial Clock Period 4 × t

SCLK

4 × t

SCLK

HDSM

Last SCK Edge to SPISELx High 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPITDM

Sequential Transfer Delay 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

DDSPIDM

SCK Edge to Data Out Valid (Data Out Delay) 6 6 ns

HDSPIDM

SCK Edge to Data Out Invalid (Data Out Hold) –1 –1 ns

Figure 25. Serial Peripheral Interface (SPI) Port—Master Timing

tSDSCIM tSPICLK tHDSM tSPITDM

tSPICLM tSPICHM

tHDSPIDM

tHSPIDM

tSSPIDM

SPIxSELy

(OUTPUT)

SPIxSCK

(OUTPUT)

SPIxMOSI

(OUTPUT)

SPIxMISO

(INPUT)

SPIxMOSI

(OUTPUT)

SPIxMISO

(INPUT)

CPHA = 1

CPHA = 0

tDDSPIDM

tHSPIDM

tSSPIDM

tHDSPIDM

tDDSPIDM

Rev. B | Page 42 of 68 | January 2011

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Serial Peripheral Interface (SPI) Port—Slave Timing

Table 38 and Figure 26 describe SPI port slave operations.

Universal Asynchronous Receiver-Transmitter

(UART) Ports—Receive and Transmit Timing

The UART ports receive and transmit operations are described

in the ADSP-BF51x Hardware Reference Manual.

Table 38. Serial Peripheral Interface (SPI) Port—Slave Timing

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirements

SPICHS

Serial Clock High Period 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPICLS

Serial Clock Low Period 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPICLK

Serial Clock Period 4 × t

SCLK

–1.5 4 × t

SCLK

–1.5 ns

HDS

Last SCK Edge to SPISS Not Asserted 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SPITDS

Sequential Transfer Delay 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SDSCI

SPISS Assertion to First SCK Edge 2 × t

SCLK

–1.5 2 × t

SCLK

–1.5 ns

SSPID

Data Input Valid to SCK Edge (Data Input Setup) 1.6 1.6 ns

HSPID

SCK Sampling Edge to Data Input Invalid 2 1.6 ns

Switching Characteristics

DSOE

SPISS Assertion to Data Out Active 0 12 0 10.3 ns

DSDHI

SPISS Deassertion to Data High Impedance 0 11 0 9 ns

DDSPID

SCK Edge to Data Out Valid (Data Out Delay) 10 10 ns

HDSPID

SCK Edge to Data Out Invalid (Data Out Hold) 0 0 ns

Figure 26. Serial Peripheral Interface (SPI) Port—Slave Timing

tSPICLK tHDS tSPITDS

tSDSCI tSPICLS tSPICHS

tDSOE tDDSPID

tDDSPID tDSDHI

tHDSPID

tSSPID

tDSDHI

tHDSPID

tDSOE

tHSPID

tSSPID

tDDSPID

SPIxSS

(INPUT)

SPIxSCK

(INPUT)

SPIxMISO

(OUTPUT)

SPIxMOSI

(INPUT)

SPIxMISO

(OUTPUT)

SPIxMOSI

(INPUT)

CPHA = 1

CPHA = 0

tHSPID

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 43 of 68 | January 2011

General-Purpose Port Timing

Table 39 and Figure 27 describe general-purpose

port operations.

Timer Clock Timing

Table 40 and Figure 28 describe timer clock timing.

Table 39. General-Purpose Port Timing

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Requirement

WFI

General-Purpose Port Signal Input Pulse Width t

SCLK

+ 1 t

SCLK

+ 1 ns

Switching Characteristics

GPOD

General-Purpose Port Signal Output Delay from CLKOUT Low 0 11 0 8.5 ns

Figure 27. General-Purpose Port Timing

CLKOUT

GPIO OUTPUT

GPIO INPUT

tWFI

tGPOD

Table 40. Timer Clock Timing

Parameter Min Max Unit

Switching Characteristic

TODP

Timer Output Update Delay After PPICLK High 12 ns

Figure 28. Timer Clock Timing

PPI_CLK

TMRx OUTPUT

tTODP

Rev. B | Page 44 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Timer Cycle Timing

Table 41 and Figure 29 describe timer expired operations. The

input signal is asynchronous in “width capture mode” and

“external clock mode” and has an absolute maximum input fre-

quency of (f

SCLK

/2) MHz.

Table 41. Timer Cycle Timing

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter Min Max Min Max Unit

Timing Characteristics

WL1

Timer Pulse Width Input Low (Measured In SCLK Cycles) t

SCLK

WH1

Timer Pulse Width Input High (Measured In SCLK Cycles) t

SCLK

TIS2

Timer Input Setup Time Before CLKOUT Low 10 7 ns

TIH2

Timer Input Hold Time After CLKOUT Low –2 –2 ns

Switching Characteristics

HTO

Timer Pulse Width Output (Measured In SCLK Cycles) t

SCLK

– 1.5 (2

–1)t

SCLK

– 1 (2

–1)t

SCLK

TOD

Timer Output Update Delay After CLKOUT High 6 6 ns

The minimum pulse widths apply for TMRx signals in width capture and external clock modes. They also apply to the PF15 or PPI_CLK signals in PWM output mode.

Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize programmable flag inputs.

Figure 29. Timer Cycle Timing

CLKOUT

TMRx OUTPUT

TMRx INPUT

tTIS tTIH

tWH,tWL

tTOD

tHTO

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Rev. B | Page 45 of 68 | January 2011

Up/Down Counter/Rotary Encoder Timing

10/100 Ethernet MAC Controller Timing

Table 43 through Table 48 and Figure 31 through Figure 36

describe the 10/100 Ethernet MAC Controller operations.

Table 42. Up/Down Counter/Rotary Encoder Timing

Parameter

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Min Max Min Max Unit

Timing Requirements

WCOUNT

Up/Down Counter/Rotary Encoder Input Pulse Width t

SCLK

+ 1 t

SCLK

+ 1 ns

CIS

Counter Input Setup Time Before CLKOUT Low

Either a valid setup and hold time or a valid pulse width is sufficient. There is no need to resynchronize counter inputs.

97 ns

CIH

Counter Input Hold Time After CLKOUT Low

00 ns

Figure 30. Up/Down Counter/Rotary Encoder Timing

CLKOUT

CUD/CDG/CZM

tCIS

tCIH

tWCOUNT

Table 43. 10/100 Ethernet MAC Controller Timing: MII Receive Signal

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter

Min Max Min Max Unit

Timing Requirements

ERXCLKF

ERxCLK Frequency (f

SCLK

= SCLK Frequency) None 25 + 1% None 25 + 1% MHz

ERXCLKW

ERxCLK Width (t

ERxCLK

= ERxCLK Period) t

ERxCLK

x 40% t

ERxCLK

x 60% t

ERxCLK

x 35% t

ERxCLK

x 65% ns

ERXCLKIS

Rx Input Valid to ERxCLK Rising Edge (Data In Setup) 7.5 7.5 ns

ERXCLKIH

ERxCLK Rising Edge to Rx Input Invalid (Data In Hold) 7.5 7.5 ns

MII inputs synchronous to ERxCLK are ERxD3–0, ERxDV, and ERxER.

Figure 31. 10/100 Ethernet MAC Controller Timing: MII Receive Signal

tERXCLKIS tERXCLKIH

ERxD3–0

ERxDV

ERxER

ERx_CLK

tERXCLKW

tERXCLK

Rev. B | Page 46 of 68 | January 2011

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Table 44. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter

Min Max Min Max Unit

Switching Characteristics

ETF

ETxCLK Frequency (f

SCLK

= SCLK Frequency) None 25 + 1% None 25 + 1% MHz

ETXCLKW

ETxCLK Width (t

ETxCLK

= ETxCLK Period) t

ETxCLK

× 40% t

ETxCLK

× 60% t

ETxCLK

× 35% t

ETxCLK

× 65% ns

ETXCLKOV

ETxCLK Rising Edge to Tx Output Valid (Data Out Valid) 20 20 ns

ETXCLKOH

ETxCLK Rising Edge to Tx Output Invalid (Data Out Hold) 0 0 ns

MII outputs synchronous to ETxCLK are ETxD3–0.

Figure 32. 10/100 Ethernet MAC Controller Timing: MII Transmit Signal

Table 45. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal

DDEXT

1.8V Nominal

DDEXT

2.5 V/3.3V Nominal

Parameter

MinMax MinMax Unit

Timing Requirements

EREFCLKF

REF_CLK Frequency (f

SCLK

= SCLK Frequency) None 50 + 1% None 50 + 1% MHz

EREFCLKW

EREF_CLK Width (t

EREFCLK

= EREFCLK Period) t

EREFCLK

× 40% t

EREFCLK

× 60% t

EREFCLK

× 35% t

EREFCLK

× 65% ns

EREFCLKIS

Rx Input Valid to RMII REF_CLK Rising Edge (Data In

Setup)

44ns

EREFCLKIH

RMII REF_CLK Rising Edge to Rx Input Invalid (Data In

Hold)

22ns

RMII inputs synchronous to RMII REF_CLK are ERxD1–0, RMII CRS_DV, and ERxER.

Figure 33. 10/100 Ethernet MAC Controller Timing: RMII Receive Signal

tETXCLKOH

ETxD3–0

ETxEN

MIITxCLK

tETXCLK

tETXCLKOV

tETXCLKW

tREFCLKIS tREFCLKIH

ERxD1–0

ERxDV

ERxER

RMII_REF_CLK

tREFCLKW

tREFCLK

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 47 of 68 | January 2011

Table 46. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal

Parameter

Min Max Unit

Switching Characteristics

EREFCLKOV

RMII REF_CLK Rising Edge to Tx Output Valid (Data Out Valid) 8.1 ns

EREFCLKOH

RMII REF_CLK Rising Edge to Tx Output Invalid (Data Out Hold) 2 ns

RMII outputs synchronous to RMII REF_CLK are ETxD1–0.

Figure 34. 10/100 Ethernet MAC Controller Timing: RMII Transmit Signal

tREFCLKOV

tREFCLKOH

RMII_REF_CLK

ETxD1–0

ETxEN

tREFCLK

Rev. B | Page 48 of 68 | January 2011

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Table 47. 10/100 Ethernet MAC Controller Timing: MII/RMII Asynchronous Signal

Parameter Min Max Unit

Timing Requirements

ECOLH

COL Pulse Width High

ETxCLK

× 1.5

ERxCLK

× 1.5

ECOLL

COL Pulse Width Low

ETxCLK

× 1.5

ERxCLK

× 1.5

ECRSH

CRS Pulse Width High

ETxCLK

× 1.5 ns

ECRSL

CRS Pulse Width Low

ETxCLK

× 1.5 ns

MII/RMII asynchronous signals are COL, CRS. These signals are applicable in both MII and RMII modes. The asynchronous COL input is synchronized separately to both

the ETxCLK and the ERxCLK, and must have a minimum pulse width high or low at least 1.5 times the period of the slower of the two clocks.

The asynchronous CRS input is synchronized to the ETxCLK, and must have a minimum pulse width high or low at least 1.5 times the period of ETxCLK.

Figure 35. 10/100 Ethernet MAC Controller Timing: Asynchronous Signal

Table 48. 10/100 Ethernet MAC Controller Timing: MII Station Management

Parameter

Min Max Unit

Timing Requirements

MDIOS

MDIO Input Valid to MDC Rising Edge (Setup) 11.5 ns

MDCIH

MDC Rising Edge to MDIO Input Invalid (Hold) 0 ns

Switching Characteristics

MDCOV

MDC Falling Edge to MDIO Output Valid 25 ns

MDCOH

MDC Falling Edge to MDIO Output Invalid (Hold) –1.25 ns

MDC/MDIO is a 2-wire serial bidirectional port for controlling one or more external PHYs. MDC is an output clock whose minimum period is programmable as a multiple

of the system clock SCLK. MDIO is a bidirectional data line.

Figure 36. 10/100 Ethernet MAC Controller Timing: MII Station Management

MIICRS, COL

tECRSH

tECOLH

tECRSL

tECOLL

MDIO (INPUT)

MDIO (OUTPUT)

MDC (OUTPUT)

tMDIOS

tMDCOH

tMDCIH

tMDCOV

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 49 of 68 | January 2011

JTAG Test And Emulation Port Timing

Table 49 and Figure 37 describe JTAG port operations.

Table 49. JTAG Port Timing

Parameter Min Max Unit

Timing Requirements

TCK

TCK Period 20 ns

STAP

TDI, TMS Setup Before TCK High 4 ns

HTAP

TDI, TMS Hold After TCK High 4 ns

SSYS1

System Inputs Setup Before TCK High 4 ns

HSYS1

System Inputs Hold After TCK High 5 ns

TRSTW

TRST Pulse Width

(measured in TCK cycles) 4 TCK

Switching Characteristics

DTDO

TDO Delay from TCK Low 10 ns

DSYS3

System Outputs Delay After TCK Low 0 13 ns

System Inputs = DATA15–0, SCL, SDA, TFS0, TSCLK0, RSCLK0, RFS0, DR0PRI, DR0SEC, PF15–0, PG15–0, PH7–0, MDIO, TD1, TMS, RESET, NMI, BMODE2–0.

50 MHz Maximum

System Outputs = DATA15–0, ADDR19–1, ABE1–0, ARE, AWE, AMS1–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, SCL, SDA, TSCLK0, TFS0, RFS0, RSCLK0,

DT0PRI, DT0SEC, PF15–0, PG15–0, PH7–0, MDC, MDIO.

Figure 37. JTAG Port Timing

TCK

TMS

TDI

TDO

SYSTEM

INPUTS

SYSTEM

OUTPUTS

tTCK

tSTAP tHTAP

tDTDO

tSSYS tHSYS

tDSYS

Rev. B | Page 50 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

OUTPUT DRIVE CURRENTS

Figure 38 through Figure 52 show typical current-voltage char-

acteristics for the output drivers of the ADSP-BF51xF

processors.

The curves represent the current drive capability of the output

drivers. See Table 7 on Page 17 for information about which

driver type corresponds to a particular ball.

Figure 38. Driver Type A Current (3.3V V

DDEXT

DDMEM

)

Figure 39. Driver Type A Current (2.5V V

DDEXT

DDMEM

)

Figure 40. Driver Type A Current (1.8V V

DDEXT

DDMEM

)

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

200

120

–200

–120

–40

VOL

VOH

VDDEXT = 3.6V @ – 40

VDDEXT = 3.3V @ 25

–80

–160

160

VDDEXT = 3.0V @ 105

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5

160

120

–160

–120

–40

VOL

VOH

VDDEXT = 2.75V @ – 40

VDDEXT = 2.5V @ 25

–80

VDDEXT = 2.25V @ 105

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5

–80

–60

–20

VOL

VOH

VDDEXT = 1.9V @ – 40

VDDEXT = 1.8V @ 25

–40

VDDEXT = 1.7V @ 105

Figure 41. Driver Type B Current (3.3V V

DDEXT

DDMEM

)

Figure 42. Driver Type B Current (2.5V V

DDEXT

DDMEM

)

Figure 43. Driver Type B Current (1.8V V

DDEXT

DDMEM

)

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

240

120

–240

–120

–40

VOL

VOH

VDDEXT = 3.6V @ – 40

VDDEXT = 3.3V @ 25

–80

–200

160 VDDEXT = 3.0V @ 105

–160

200

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5

160

120

–200

–160

–40

VOL

VOH

VDDEXT = 2.75V @ – 40

VDDEXT = 2.5V @ 25

–80

VDDEXT = 2.25V @ 105

–120

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

00.5 1.0 1.5

–100

–60

–20

VOL

VOH

VDDEXT = 1.9V @ – 40

VDDEXT = 1.8V @ 25

–40

VDDEXT = 1.7V @ 105

–80

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 51 of 68 | January 2011

Figure 44. Driver Type C Current (3.3V V

DDEXT

DDMEM

)

Figure 45. Drive Type C Current (2.5V V

DDEXT

DDMEM

)

Figure 46. Driver Type C Current (1.8V V

DDEXT

DDMEM

)

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

100

–100

–60

–20

VOL

VOH

VDDEXT = 3.6V @ – 40

VDDEXT = 3.3V @ 25

–40

–80

VDDEXT = 3.0V @ 105

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5

–80

–60

–20

VOL

VOH

VDDEXT = 2.75V @ – 40

VDDEXT = 2.5V @ 25

–40

VDDEXT = 2.25V @ 105

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5

–40

–30

–10

VOL

VOH

VDDEXT = 1.9V @ – 40

VDDEXT = 1.8V @ 25

–20

VDDEXT = 1.7V @ 105

Figure 47. Driver Type D Current (3.3V V

DDEXT

DDMEM

)

Figure 48. Driver Type D Current (2.5V V

DDEXT

DDMEM

)

Figure 49. Driver Type D Current (1.8V V

DDEXT

DDMEM

)

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

160

120

–160

–40

VOL

VOH

VDDEXT = 3.6V @ – 40

VDDEXT = 3.3V @ 25

–80

–120

VDDEXT = 3.0V @ 105

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5

120

100

–120

–100

–40

VOL

VOH

VDDEXT = 2.75V @ – 40

VDDEXT = 2.5V @ 25

–60

VDDEXT = 2.25V @ 105

–80

–20

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2

–60

–20

VOL

VOH

VDDEXT = 1.9V @ – 40

VDDEXT = 1.8V @ 25

–40

VDDEXT = 1.7V @ 105

Rev. B | Page 52 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

TEST CONDITIONS

All timing parameters appearing in this data sheet were mea-

sured under the conditions described in this section. Figure 53

shows the measurement point for ac measurements (except out-

put enable/disable). The measurement point V

MEAS

is V

DDEXT

or V

DDMEM

/2 for V

DDEXT

DDMEM

(nominal) = 1.8 V/2.5 V/3.3 V.

Output Enable Time Measurement

Output signals are considered to be enabled when they have

made a transition from a high impedance state to the point

when they start driving.

The output enable time t

ENA

is the interval from the point when

a reference signal reaches a high or low voltage level to the point

when the output starts driving as shown on the right side of

Figure 54.

The time t

ENA_MEASURED

is the interval from when the reference

signal switches to when the output voltage reaches V

TRIP

(high)

or V

TRIP

(low). For V

DDEXT

(nominal) = 1.8 V, V

TRIP

(high) is

0.95 V, and V

TRIP

(low) is 0.85 V. For V

DDEXT

(nominal) = 2.5 V,

TRIP

(high) is 1.3 V and V

TRIP

(low) is 1.2 V. For V

DDEXT

(nomi-

nal) = 3.3 V, V

TRIP

(high) is 1.7 V, and V

TRIP

(low) is 1.6 V. Time

TRIP

is the interval from when the output starts driving to when

the output reaches the V

TRIP

(high) or V

TRIP

(low) trip voltage.

Time t

ENA

is calculated as shown in the equation:

If multiple signals (such as the data bus) are enabled, the mea-

surement value is that of the first signal to start driving.

Figure 50. Driver Type E Current (3.3V V

DDEXT

DDMEM

)

Figure 51. Driver Type E Current (2.5V V

DDEXT

DDMEM

)

Figure 52. Driver Type E Current (1.8V V

DDEXT

DDMEM

)

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

–60

–30

–10

VOL

VDDEXT = 3.6V @ – 40

VDDEXT = 3.3V @ 25

–20

–40

40 VDDEXT = 3.0V @ 105

–50

3.0 3.5

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5 2.0 2.5

–40

–30

–10

VOL

VDDEXT = 2.75V @ – 40

VDDEXT = 2.5V @ 25

–20

VDDEXT = 2.25V @ 105

3.5

SOURCE CURRENT (mA)

SOURCE VOLTAGE (V)

0 0.5 1.0 1.5

–20

–15

–5

VOL

VDDEXT = 1.9V @ – 40

VDDEXT = 1.8V @ 25

–10

VDDEXT = 1.7V @ 105

3.02.52.0

Figure 53. Voltage Reference Levels for AC

Measurements (Except Output Enable/Disable)

Figure 54. Output Enable/Disable

INPUT

OUTPUT

MEAS

REFERENCE

SIGNAL

tDIS

OUTPUT STARTS DRIVING

VOH (MEASURED)

ΔV

VOL (MEASURED) + ΔV

tDIS_MEASURED

VOH

(MEASURED)

VOL

(MEASURED)

VTRIP(HIGH)

VOH(MEASURED

)

VOL(MEASURED)

HIGH IMPEDANCE STATE

OUTPUT STOPS DRIVING

tENA

tDECAY

tENA_MEASURED

tTRIP

VTRIP(LOW)

tENA tENA_MEASURED tTRIP

–=

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 53 of 68 | January 2011

Output Disable Time Measurement

Output signals are considered to be disabled when they stop

driving, go into a high impedance state, and start to decay from

their output high or low voltage. The output disable time t

DIS

the difference between t

DIS_MEASURED

and t

DECAY

as shown on the

left side of Figure 54.

The time for the voltage on the bus to decay by ΔV is dependent

on the capacitive load C

and the load current I

. This decay

time can be approximated by the equation:

The time t

DECAY

is calculated with test loads C

and I

and with

ΔV equal to 0.25 V for V

DDEXT

DDMEM

(nominal) = 2.5 V/3.3 V

and 0.15 V for V

DDEXT

VDDMEM

(nominal) = 1.8 V.

The time t

DIS_MEASURED

is the interval from when the reference

signal switches to when the output voltage decays ΔV from the

measured output high or output low voltage.

Example System Hold Time Calculation

To determine the data output hold time in a particular system,

first calculate t

DECAY

using the equation given above. Choose ΔV

to be the difference between the ADSP-BF51x processor’s out-

put voltage and the input threshold for the device requiring the

hold time. C

is the total bus capacitance (per data line), and I

the total leakage or three-state current (per data line). The hold

time is t

DECAY

plus the various output disable times as specified

in the Timing Specifications on Page 27 (for example t

DSDAT

for

an SDRAM write cycle as shown in SDRAM Interface Timing

on Page 31).

Capacitive Loading

Output delays and holds are based on standard capacitive loads

of an average of 6 pF on all balls (see Figure 55). V

LOAD

is equal

to (V

DDEXT

DDMEM

)/2. The graphs of Figure 56 through

Figure 67 show how output rise time varies with capacitance.

The delay and hold specifications given should be derated by a

factor derived from these figures. The graphs in these figures

may not be linear outside the ranges shown.

tDIS tDIS_MEASURED tDECAY

–=

tDECAY CLVΔ()IL

⁄=

Figure 55. Equivalent Device Loading for AC Measurements

(Includes All Fixtures)

Figure 56. Driver Type A Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (1.8V V

DDEXT

DDMEM

)

ZO = 50:(impedance)

TD = 4.04 ± 1.18 ns

2pF

TESTER PIN ELECTRONICS

50:

0.5pF

70:

400:

45:

4pF

NOTES:

THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED

FOR THE OUTPUT TIMING ANALYSIS TO REFLECT THE TRANSMISSION LINE

EFFECT AND MUST BE CONSIDERED. THE TRANSMISSION LINE (TD) IS FOR

LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS.

ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN

SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE

EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.

LOAD

DUT

OUTPUT

50:

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 1.8V @ 25

tFALL = 1.8V @ 25

Rev. B | Page 54 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Figure 57. Driver Type A Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (2.5V V

DDEXT

DDMEM

)

Figure 58. Driver Type A Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (3.3V V

DDEXT

DDMEM

)

Figure 59. Driver Type B Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (1.8V V

DDEXT

DDMEM

)

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 2.5V @ 25

tFALL = 2.5V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 3.3V @ 25

tFALL = 3.3V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 1.8V @ 25

tFALL = 1.8V @ 25

Figure 60. Driver Type B Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (2.5V V

DDEXT

DDMEM

)

Figure 61. Driver Type B Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (3.3V V

DDEXT

DDMEM

)

Figure 62. Driver Type C Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (1.8V V

DDEXT

DDMEM

)

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 2.5V @ 25

tFALL = 2.5V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 3.3V @ 25

tFALL = 3.3V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 1.8V @ 25

tFALL = 1.8V @ 25

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 55 of 68 | January 2011

Figure 63. Driver Type C Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (2.5V V

DDEXT

DDMEM

)

Figure 64. Driver Type C Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (3.3V V

DDEXT

DDMEM

)

Figure 65. Driver Type D Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (1.8V V

DDEXT

DDMEM

)

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

RISE

FALL

RISE

= 2.5V @ 25

FALL

= 2.5V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 3.3V @ 25

tFALL = 3.3V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 1.8V @ 25

tFALL = 1.8V @ 25

Figure 66. Driver Type D Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (2.5V V

DDEXT

DDMEM

)

Figure 67. Driver Type D Typical Rise and Fall Times (10%–90%) vs.

Load Capacitance (3.3V V

DDEXT

DDMEM

)

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

tRISE

tFALL

tRISE = 2.5V @ 25

tFALL = 2.5V @ 25

RISE AND FALL TIME (ns)

LOAD CAPACITANCE (pF)

0 50 100 150 250

200

RISE

FALL

RISE

= 3.3V @ 25

FALL

= 3.3V @ 25

Rev. B | Page 56 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

THERMAL CHARACTERISTICS

To determine the junction temperature on the application

printed circuit board use:

where:

= Junction temperature (°C)

CASE

= Case temperature (°C) measured by customer at top

center of package.

= From Table 51

= Power dissipation (see Total Power Dissipation on Page 23

for the method to calculate P

)

Values of θ

are provided for package comparison and printed

circuit board design considerations. θ

can be used for a first

order approximation of T

by the equation:

where:

= Ambient temperature (°C)

Values of θ

are provided for package comparison and printed

circuit board design considerations when an external heat sink

is required.

Values of θ

are provided for package comparison and printed

circuit board design considerations.

In Table 51, airflow measurements comply with JEDEC stan-

dards JESD51-2 and JESD51-6, and the junction-to-board

measurement complies with JESD51-8. The junction-to-case

measurement complies with MIL-STD-883 (Method 1012.1).

All measurements use a 2S2P JEDEC test board.

The LQFP_EP package requires thermal trace squares and ther-

mal vias to an embedded ground plane in the PCB. The paddle

must be connected to ground for proper operation to data sheet

specifications. Refer to JEDEC standard JESD51-5 for more

information.

TJTCASE ΨJT PD

×()+=

TJTAθJA PD

×()+=

Table 50. Thermal Characteristics for SQ-176-2 Package

Parameter Condition Typical Unit

0 Linear m/s Airflow 17.4 °C/W

JMA

1 Linear m/s Airflow 14.8 °C/W

JMA

2 Linear m/s Airflow 14.0 °C/W

Not Applicable 7.8 °C/W

0 Linear m/s Airflow 0.28 °C/W

1 Linear m/s Airflow 0.39 °C/W

2 Linear m/s Airflow 0.48 °C/W

Table 51. Thermal Characteristics for BC-168-1 Package

Parameter Condition Typical Unit

0 Linear m/s Airflow 30.5 °C/W

JMA

1 Linear m/s Airflow 27.6 °C/W

JMA

2 Linear m/s Airflow 26.3 °C/W

Not Applicable 11.1 °C/W

0 Linear m/s Airflow 0.20 °C/W

1 Linear m/s Airflow 0.35 °C/W

2 Linear m/s Airflow 0.45 °C/W

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 57 of 68 | January 2011

176-LEAD LQFP LEAD ASSIGNMENT

Table 52 lists the LQFP leads by lead number. Table 53 on Page 58 lists the LQFP by signal mnemonic.

Table 52. 176-Lead LQFP Pin Assignment (Numerical by Lead Number)

Lead No. Signal Lead No. Signal Lead No. Signal Lead No. Signal

1 GND 45 GND 89 GND 133 GND

2 GND 46 GND 90 GND 134 GND

3 PF9 47 PG1 91 A12 135 PG

4 PF8 48 PG0 92 A11 136 V

DDEXT

5PF749V

DDEXT

93 A10 137 GND

6PF650TDO94A9138V

DDINT

DDEXT

51 EMU 95 V

DDMEM

139 GND

PPOTP

52 TDI 96 A8 140 RTXO

DDOTP

53 TCK 97 A7 141 RTXI

10 PF5 54 TRST 98 V

DDINT

142 V

DDRTC

11 PF4 55 TMS 99 GND 143 CLKIN

12 PF3 56 D15 100 V

DDINT

144 XTAL

13 PF2 57 D14 101 A6 145 V

DDEXT

14 V

DDINT

58 D13 102 A5 146 RESET

15 GND 59 V

DDMEM

103 A4 147 NMI

16 V

DDFLASH

60 D12 104 V

DDMEM

148 V

DDEXT

17 V

DDFLASH

61 D11 105 A3 149 GND

18 PF1 62 D10 106 A2 150 CLKBUF

19 PF0 63 V

DDINT

107 A1 151 GND

20 PG15 64 D9 108 ABE1152 V

DDINT

21 PG14 65 D8 109 ABE0153 PH7

22 GND 66 D7 110 SA10 154 PH6

23 V

DDINT

67 GND 111 GND 155 PH5

24 V

DDEXT

68 V

DDMEM

112 V

DDMEM

156 PH4

25 PG13 69 D6 113 SWE 157 GND

26 PG12 70 D5 114 SCAS 158 V

DDEXT

27 PG11 71 D4 115 SRAS 159 PH3

28 PG10 72 D3 116 V

DDINT

160 PH2

29 V

DDFLASH

73 D2 117 GND 161 PH1

30 V

DDINT

74 D1 118 SMS 162 PH0

31 PG9 75 V

DDMEM

119 SCKE 163 GND

32 PG8 76 D0 120 AMS1164 V

DDINT

33 PG7 77 A19 121 ARE 165 PF15

34 PG6 78 A18 122 AWE 166 PF14

35 V

DDEXT

79 V

DDINT

123 AMS0167 PF13

36 PG5 80 A17 124 V

DDMEM

168 PF12

37 PG4 81 A16 125 CLKOUT 169 GND

38 PG3 82 V

DDMEM

126 V

DDFLASH

170 V

DDEXT

39 PG2 83 GND 127 NC

171 PF11

40 BMODE2 84 A15 128 V

DDEXT

172 SDA

41 BMODE1 85 A14 129 V

DDEXT

173 SCL

42 BMODE0 86 A13 130 EXT_WAKE 174 PF10

43 GND 87 GND 131 GND 175 GND

44 GND 88 GND 132 GND 176 GND

GND 177

* Pin no. 177 is the GND supply (see Figure 69) for the processor; this pad must connect to GND.

This pin must not be connected.

Rev. B | Page 58 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Table 53. 176-Lead LQFP Pin Assignment (Alphabetical by Signal Mnemonic)

Lead No. Signal Lead No. Signal Lead No. Signal Lead No. Signal

107 A1 58 D13 5 PF7 113 SWE

106 A2 57 D14 4 PF8 53 TCK

105 A3 56 D15 3 PF9 52 TDI

103 A4 51 EMU 174 PF10 50 TDO

102 A5 130 EXT_WAKE 171 PF11 55 TMS

101 A6 1 GND 168 PF12 54 TRST

97 A7 2 GND 167 PF13 7 V

DDEXT

96 A8 15 GND 166 PF14 24 V

DDEXT

94 A9 22 GND 165 PF15 35 V

DDEXT

93 A10 43 GND 135 PG 49 V

DDEXT

92 A11 44 GND 48 PG0 128 V

DDEXT

91 A12 45 GND 47 PG1 129 V

DDEXT

86 A13 46 GND 39 PG2 136 V

DDEXT

85 A14 67 GND 38 PG3 145 V

DDEXT

84 A15 83 GND 37 PG4 148 V

DDEXT

81 A16 87 GND 36 PG5 158 V

DDEXT

80 A17 88 GND 34 PG6 170 V

DDEXT

78 A18 89 GND 33 PG7 16 V

DDFLASH

77 A19 90 GND 32 PG8 17 V

DDFLASH

109 ABE099GND31PG929V

DDFLASH

108 ABE1 111 GND 28 PG10 126 V

DDFLASH

123 AMS0131GND27PG1114V

DDINT

120 AMS1132GND26PG1223V

DDINT

121 ARE 133 GND 25 PG13 30 V

DDINT

122 AWE 134 GND 21 PG14 63 V

DDINT

42 BMODE0 137 GND 20 PG15 79 V

DDINT

41 BMODE1 139 GND 162 PH0 98 V

DDINT

40 BMODE2 149 GND 161 PH1 100 V

DDINT

150 CLKBUF 151 GND 160 PH2 116 V

DDINT

143 CLKIN 157 GND 159 PH3 138 V

DDINT

125 CLKOUT 163 GND 156 PH4 152 V

DDINT

76 D0 169 GND 155 PH5 164 V

DDINT

74 D1 175 GND 154 PH6 59 V

DDMEM

73 D2 176 GND 153 PH7 68 V

DDMEM

72 D3 117 GND 146 RESET 75 V

DDMEM

71 D4 127 NC

141 RTXI 82 V

DDMEM

70 D5 147 NMI 140 RTXO 95 V

DDMEM

69 D6 19 PF0 110 SA10 104 V

DDMEM

66 D7 18 PF1 114 SCAS 112 V

DDMEM

65 D8 13 PF2 119 SCKE 124 V

DDMEM

64 D9 12 PF3 173 SCL 9 V

DDOTP

62 D10 11 PF4 172 SDA 142 V

DDRTC

61 D11 10 PF5 118 SMS 8V

PPOTP

60 D12 6 PF6 115 SRAS 144 XTAL

GND 177

* Pin no. 177 is the GND supply (see Figure 69) for the processor; this pad must connect to GND.

This pin must not be connected.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 59 of 68 | January 2011

Figure 68 shows the top view of the LQFP_EP lead configura-

tion. Figure 69 shows the bottom view of the LQFP_EP lead

configuration.

Figure 68. 176-Lead LQFP_EP Lead Configuration (Top View)

PIN 1

PIN 44

PIN 132

PIN 89

PIN 176 PIN 133

PIN 45 PIN 88

PIN 1 INDICATOR

ADSP-BF51X

176-LEAD LQFP_EP

TOP VIEW

Figure 69. 176-Lead LQFP_EP Lead Configuration (Bottom View)

PIN 132

PIN 89

PIN 1

PIN 44

PIN 133 PIN 176

PIN 88 PIN 45

PIN 1 INDICATOR

ADSP-BF51X

176-LEAD

LQFP_EP

BOTTOM VIEW

GND PAD

(PIN 177)

Rev. B | Page 60 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

168-BALL CSP_BGA BALL ASSIGNMENT

Table 54 lists the CSP_BGA by ball number. Table 55 on

Page 61 lists the CSP_BGA balls by signal mnemonic.

Table 54. 168-Ball CSP_BGA Ball Assignment (Numerical by Ball Number)

Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name

A1 GND C1 PF4 E10 V

DDINT

H1 PG12 K6 V

DDMEM

N1 BMODE1

A2 SCL C2 PF7 E12 V

DDMEM

H2 PG13 K7 V

DDMEM

N2 PG1

A3 SDA C3 PF8 E13 ARE H3 PG11 K8 V

DDMEM

N3 TDO

A4 PF13 C4 PF10 E14 AWE H5 V

DDEXT

K9 V

DDMEM

N4 TRST

A5 PF15 C5 V

DDEXT

F1 PF0 H6 GND K10 V

DDMEM

N5 TMS

A6 PH2 C6 V

DDEXT

F2 PF1 H7 GND K12 A8 N6 D13

A7 PH1 C7 PF11 F3 V

DDINT

H8 GND K13 A2 N7 D9

A8 PH5 C8 V

DDEXT

F5 V

DDEXT

H9 GND K14 A1 N8 D5

A9 PH6 C9 V

DDINT

F6 GND H10 V

DDINT

L1 PG5 N9 D1

A10 PH7 C10 V

DDEXT

F7 GND H12 A3 L2 PG3 N10 A18

A11 CLKBUF C11 RTXI F8 GND H13 ABE0L3PG2 N11A16

A12 XTAL C12 RTXO F9 GND H14 SCAS L12 A9 N12 A14

A13 CLKIN C13 PG F10 V

DDINT

J1 PG10 L13 A6 N13 A11

A14 GND C14 NC

F12 SMS J2 V

DDFLASH

L14 A4 N14 A7

B1 V

DDOTP

D1 PF3 F13 SCKE J3 PG9 M1 PG4 P1 GND

B2 GND D2 PF5 F14 AMS1J5V

DDMEM

M2 BMODE2 P2 TDI

B3 PF9 D3 VPPOTP G1 PG15 J6 GND M3 BMODE0 P3 TCK

B4 PF12 D12 V

DDFLASH

G2 PG14 J7 GND M4 PG0 P4 D15

B5 PF14 D13 CLKOUT G3 V

DDINT

J8 GND M5 EMU P5 D14

B6 PH0 D14 AMS0G5V

DDEXT

J9 GND M6 D12 P6 D11

B7 PH3 E1 V

DDFLASH

G6 GND J10 V

DDINT

M7 D10 P7 D8

B8 PH4 E2 PF2 G7 GND J12 A15 M8 D2 P8 D7

B9 V

DDEXT

E3 PF6 G8 GND J13 ABE1M9D0 P9D6

B10 RESET E5 V

DDEXT

G9 GND J14 SA10 M10 A17 P10 D4

B11 NMI E6 V

DDEXT

G10 V

DDINT

K1 PG6 M11 A13 P11 D3

B12 V

DDRTC

E7 V

DDINT

G12 SWE K2 PG8 M12 A12 P12 A19

B13 V

DDEXT

E8 V

DDINT

G13 SRAS K3 PG7 M13 A10 P13 GND

B14 EXT_WAKE E9 V

DDINT

G14 GND K5 V

DDMEM

M14 A5 P14 GND

This pin must not be connected.

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 61 of 68 | January 2011

Table 55. 168-Ball CSP_BGA Ball Assignment (Alphabetical by Signal Mnemonic)

Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name

K14 A1 A11 CLKBUF G6 GND C4 PF10 A8 PH5 G5 V

DDEXT

K13 A2 A13 CLKIN G7 GND C7 PF11 A9 PH6 H5 V

DDEXT

H12 A3 D13 CLKOUT G8 GND B4 PF12 A10 PH7 D12 V

DDFLASH

L14 A4 M9 D0 G9 GND A4 PF13 B10 RESET E1 V

DDFLASH

M14 A5 N9 D1 H6 GND B5 PF14 C11 RTXI J2 V

DDFLASH

L13 A6 M8 D2 H7 GND A5 PF15 C12 RTXO C9 V

DDINT

N14 A7 P11 D3 H8 GND C13 PG J14 SA10 E7 V

DDINT

K12 A8 P10 D4 H9 GND M4 PG0 H14 SCAS E8 V

DDINT

L12 A9 N8 D5 J6 GND N2 PG1 F13 SCKE E9 V

DDINT

M13 A10 P9 D6 J7 GND L3 PG2 A2 SCL E10 V

DDINT

N13 A11 P8 D7 J8 GND L2 PG3 A3 SDA F3 V

DDINT

M12 A12 P7 D8 J9 GND M1 PG4 F12 SMS F10 V

DDINT

M11 A13 N7 D9 P1 GND L1 PG5 G13 SRAS G3 V

DDINT

N12 A14 M7 D10 P13 GND K1 PG6 G12 SWE G10 V

DDINT

J12 A15 P6 D11 P14 GND K3 PG7 P3 TCK H10 V

DDINT

N11 A16 M6 D12 G14 GND K2 PG8 P2 TDI J10 V

DDINT

M10 A17 N6 D13 C14 NC

J3 PG9 N3 TDO E12 V

DDMEM

N10 A18 P5 D14 B11 NMI J1 PG10 N5 TMS J5 V

DDMEM

P12 A19 P4 D15 F1 PF0 H3 PG11 N4 TRST K5 V

DDMEM

H13 ABE0M5EMU F2 PF1 H1 PG12 B9 V

DDEXT

K6 V

DDMEM

J13 ABE1 B14 EXT_WAKE E2 PF2 H2 PG13 B13 V

DDEXT

K7 V

DDMEM

D14 AMS0A1GND D1PF3 G2PG14 C5V

DDEXT

K8 V

DDMEM

F14 AMS1 A14 GND C1 PF4 G1 PG15 C6 V

DDEXT

K9 V

DDMEM

E13 ARE B2 GND D2 PF5 B6 PH0 C8 V

DDEXT

K10 V

DDMEM

E14 AWE F6 GND E3 PF6 A7 PH1 C10 V

DDEXT

B1 V

DDOTP

M3 BMODE0 F7 GND C2 PF7 A6 PH2 E5 V

DDEXT

B12 V

DDRTC

N1 BMODE1 F8 GND C3 PF8 B7 PH3 E6 V

DDEXT

D3 V

PPOTP

M2 BMODE2 F9 GND B3 PF9 B8 PH4 F5 V

DDEXT

A12 XTAL

This pin must not be connected.

Rev. B | Page 62 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Figure 70 shows the top view of the CSP_BGA ball configura-

tion. Figure 71 shows the bottom view of the CSP_BGA

ball configuration.

Figure 70. 168-Ball CSP_BGA Ball Configuration (Top View)

Figure 71. 168-Ball CSP_BGA Ball Configuration (Bottom View)

A1 BALL PAD CORNER

TOP VIEW

1 2 3 4 5 6 7 8 9 1011121314

VDDINT

VDDEXT

GND

I/O

KEY

VDDRTC

VDDMEM

VDDFLASH

A1 BALL PAD CORNER

BOTTOM VIEW

1413121110987654321

VDDINT

VDDEXT

GND

I/O

KEY

VDDRTC

VDDMEM

VDDFLASH

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 63 of 68 | January 2011

OUTLINE DIMENSIONS

Dimensions in Figure 72 are shown in millimeters.

Figure 72. 176-Lead Low Profile Quad Flat Package [LQFP_EP]

(SQ-176-2)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD

1.45

1.40

1.35

0.15

0.10

0.05

TOP VIEW

(PINS DOWN)

133

1132

176

0.27

0.22

0.17

0.50

BSC

LEAD PITCH

1.60

MAX

26.20

26.00 SQ

25.80 24.10

24.00 SQ

23.90

VIEW A

PIN 1

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90

CCW

SEATING

PLANE

12°

7°

0°

0.20

0.15

0.09

0.75

0.60

0.45

1.00 REF

BOTTOM VIEW

(PINS UP)

133

132

176

EXPOSED

PAD

EXPOSED PAD IS CENTERED ON

THE PACKAGE.

5.80 REF

NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND

THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY

SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS

THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND

SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN

THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST

PERFORMANCE.

Rev. B | Page 64 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

SURFACE-MOUNT DESIGN

Table 56 is provided as an aid to PCB design. For industry

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-168-1)

Dimensions shown in millimeters

0.80

BSC

10.40

BSC SQ

12.10

12.00 SQ

11.90

COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.

0.80

REF

0.70

REF

0.36

REF

910 81112 7 564231

BOTTOM VIEW

DETAIL A

TOP VIEW

DETAIL A

COPLANARITY

0.20

0.50

0.45

0.40

BALL DIAMETER

SEATING

PLANE

A1 BALL

CORNER

A1 BALL

CORNER

0.34 NOM

0.29 MIN

1.50

1.40

1.30

1.12

1.06

1.00

14 13

Table 56. BGA Data for Use with Surface-Mount Design

Package Package Ball Attach Type

Package Solder Mask

Opening Package Ball Pad Size

168-Ball CSP_BGA Solder Mask Defined 0.35 mm diameter 0.48 mm diameter

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 65 of 68 | January 2011

AUTOMOTIVE PRODUCTS

The ADBF512W and ADBF518 models are available with con-

trolled manufacturing to support the quality and reliability

requirements of automotive applications. Note that these auto-

motive models may have specifications that differ from the

commercial models and designers should review the product

Specifications section of this data sheet carefully. Only the auto-

motive grade products shown in Table 57 are available for use in

automotive applications. Contact your local ADI account repre-

sentative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these

models.

ORDERING GUIDE

Table 57. Automotive Products

Automotive Models

1,2

Temperature

Range

Instruction

Rate (Max) Package Description

Package

Option

ADBF512WBBCZ4xx –40ºC to +85ºC 400 MHz 168-Ball CSP_BGA BC-168-1

ADBF518WBBCZ4xx –40ºC to +85ºC 400 MHz 168-Ball CSP_BGA BC-168-1

ADBF512WBSWZ4xx –40ºC to +85ºC 400 MHz 176-Lead LQFP_EP SQ-176-2

ADBF518WBSWZ4xx –40ºC to +85ºC 400 MHz 176-Lead LQFP_EP SQ-176-2

Z = RoHS Compliant Part.

The use of xx designates silicon revision.

Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 20 for junction temperature (T

)

specification which is the only temperature specification.

Model

Temperature

Range

Processor Instruction

Rate (Max)

Flash

Memory Package Description

Package

Option

ADSP-BF512BBCZ-3 –40ºC to +85ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF512BBCZ-4 –40ºC to +85ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF512BBCZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF512BSWZ-3 –40ºC to +85ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF512BSWZ-4 –40ºC to +85ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF512BSWZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF512KBCZ-3 0ºC to +70ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF512KBCZ-4 0ºC to +70ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF512KBCZ-4F4 0ºC to +70ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF512KSWZ-3 0ºC to +70ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF512KSWZ-4 0ºC to +70ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF512KSWZ-4F4 0ºC to +70ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF514BBCZ-3 –40ºC to +85ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF514BBCZ-4 –40ºC to +85ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF514BBCZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF514BSWZ-3 –40ºC to +85ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF514BSWZ-4 –40ºC to +85ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF514BSWZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF514KBCZ-3 0ºC to +70ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF514KBCZ-4 0ºC to +70ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF514KBCZ-4F4 0ºC to +70ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF514KSWZ-3 0ºC to +70ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

Rev. B | Page 66 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

ADSP-BF514KSWZ-4 0ºC to +70ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF514KSWZ-4F4 0ºC to +70ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF516KSWZ-3 0ºC to +70ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF516KBCZ-3 0ºC to +70ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF516KSWZ-4 0ºC to +70ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF516KBCZ-4 0ºC to +70ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF516KSWZ-4F4 0ºC to +70ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF516KBCZ-4F4 0ºC to +70ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF516BBCZ-3 –40ºC to +85ºC 300 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF516BBCZ-4 –40ºC to +85ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF516BBCZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF516BSWZ-3 –40ºC to +85ºC 300 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF516BSWZ-4 –40ºC to +85ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF516BSWZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

ADSP-BF518BBCZ-4 –40ºC to +85ºC 400 MHz N/A 168-Ball CSP_BGA BC-168-1

ADSP-BF518BBCZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 168-Ball CSP_BGA BC-168-1

ADSP-BF518BSWZ-4 –40ºC to +85ºC 400 MHz N/A 176-Lead LQFP_EP SQ-176-2

ADSP-BF518BSWZ-4F4 –40ºC to +85ºC 400 MHz 4M bit 176-Lead LQFP_EP SQ-176-2

Z = RoHS compliant part.

Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 20 for junction temperature (T

)

specification which is the only temperature specification.

Model

Temperature

Range

Processor Instruction

Rate (Max)

Flash

Memory Package Description

Package

Option

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

Rev. B | Page 67 of 68 | January 2011

Rev. B | Page 68 of 68 | January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

registered trademarks are the property of their respective owners.

D08574-0-1/11(B)