Computer-On-Modules ADLINK We Know COM Express Focus on your Core Competency A Computer-On-Module (COM) provides a convenient solution for OEMs that need computing functionality but are not interested in investing the time and resources into designing a single board computer. There are several COM standards, one of the more popular being COM Express (also referred to as COM.0). COM Express modules contain the CPU, memory, common peripherals (USB, SATA) and an I/O interface (PCI and PCI Express). OEMs that use COM Express modules design a carrier board that contains any required I/O interfaces not found on the COM Express module as well as connectors for external I/O. A COM based solution allows an OEM to focus on their core competency and not the design and maintenance of a single board computer. A COM Express based solution with a custom carrier board offers several advantages: * The carrier can contain more rugged types of connectors for external I/O. It is not limited to traditional connectors such as USB, Ethernet, and video. * The carrier can contain value added silicon such as FPGAs or other types of peripherals. Placing these devices on the carrier eliminates the need for traditional PCI Express or PCI expansion cards and the mechanics associated with them. * The CPU function is decoupled from the I/O so that different processors can be used for different applications, ranging from low power and cost AtomTM based compute modules to CoreTM i7 or other high performance multicore processor modules. * The design and maintenance of the compute module no longer becomes a task for the OEM. * The use of industry standard modules brings with it availability from multiple vendors which provides alternative solutions. 1-1 The COM Express Standard - Adaptable to Your Specific Needs COM Express was developed and is maintained by PICMG (PCI Industrial Computer Manufacturers Group). COM Express was released in the summer of 2005 and is the most widely used COM standard. The standard defines the physical size, interconnect, and thermal interface for a COM. The original COM Express specification was written to support peripherals that were available at the time of release - including USB 2.0, SATA, PATA, Ethernet, VGA, LVDS, SDVO, PCI, and PCI Express Gen 1. Several pinout types were defined by PICMG with each one having a specific combination of peripherals, expansion interfaces and connector layout. The most widely used COM Express module is a type 2, followed by type 1. The table on the following page shows the features for modules defined in revision 1 of the COM Express specification. COM.0 Rev. 2.0 - Future Proof In 2009, PICMG formed a subcommittee to update the COM Express specification based on the changes in peripherals used in modern systems. This included support for Super Speed USB 3.0, PCI Express Gen 2 signaling, as well as additional video interfaces such as DVI, HDMI and DisplayPort. The spec update created two new types to support the I/O changes: type 6 and 10. Backwards compatibility with existing type 2 and 1 modules was a main objective of the specification update. http://www.adlinktech.com/Computer-on-Module COM Express pinout types and supported features Types PCI Express Lanes PEG/ SDVO Type 1 AB connector Up to 6 - Type 2 AB/CD connectors Up to 22 Type 3 AB/CD connectors IDE Ports SATA Ports LAN Ports USB 2.0 / USB 3.0 Display Interfaces - - 4 1 8/0 VGA, LVDS 1/2 32-bit 1 4 1 8/0 VGA, LVDS, PEG/SDVO Up to 22 1/2 32-bit - 4 3 8/0 VGA, LVDS, PEG/SDVO Type 6 AB/CD connectors Up to 24 1/NA - - 4 1 8/4 VGA, LVDS,PEG, 3x DDI Type 10 AB connector Up to 4 -/1 - - 2 1 8/0 1x DDI Rev. 1 Pinouts PCI Rev. 2 Pinouts The Right Size for the Right Job The COM Express specification also defines three module sizes: the Compact Module, Basic Module and the Extended Module. A fourth "Ultra" size module supporting only type 1 and type 10 pinouts has been presented to PICMG for inclusion in a future release of the specification. 95 mm 125 mm 125 x 95 Type 2/6 compatible pinout The release of COM ExpressTM COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and SuperSpeed USB 3.0. The new Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display Interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies. The new Type 10 pinout is based on the Type 1 pinout with only the A-B connector that is used in the "Ultra" form factor. The Type 10 pinout provides additional flexibility for developers by freeing up pins reserved for SATA and PCIe for future technologies and using the second LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both of the new Type 6 and Type 10 pinouts support the SPI Interface, which was unavailable in COM.0 Rev. 1.0. COM Express Type 1 vs. Type 10 comparison COM Express COM.0 rev 1.0 Type 1 B LPC Bus A GbE LAN 4x SATA AB Audio 8x USB2.0 LVDS Channel B 6x PCIe x1 LVDS Channel A Control & Miscella neous CRT TV 12V 5Vsb Control & Miscellaneous 12V Basic 95 mm 95 mm Basic New with COM.0 Rev. 2.0 - Type 6 and Type 10 Pinouts COM Express COM.0 rev 2.0 Type 10 Compact 95 x 95 Type 2/6 compatible pinout B A LPC Bus GbE LAN 2x RS SATA VD AB Audio 8x USB2.0 4x PCIe x1 RS VD SDVO LVDS Channel A Control & Miscella neous FAN & SM select Sing Channel 5Vsb Control & Miscellaneous 12V total amount of pins reduced SPI 2 Serial TPM, Type ID Compact COM Express Type 2 vs. Type 6 comparison 55 mm 84 mm Ultra Ultra 84 x 55 Type 1/10 compatible pinout COM Express COM.0 rev 1.0 Type 2 AB D ADLINK - We Know COM Express Although many companies develop COM Express modules, most are not actively involved in the development of the COM Express specification. In contrast, ADLINK has heavily invested in the development and maintenance of the PICMG COM Express specification over the years. ADLINK recently chaired the PICMG subcommittee that was tasked with defining the specification update known as COM Express COM.0 Revision 2.0. As a leading participant in the creation of the specification, ADLINK is in a unique position to influence its direction. By doing so, ADLINK has a deep understanding of the meaning and intention of the specification and applies this knowledge in the design of our COM Express products. CD C B A PATA IDE LPC Bus GbE LAN PCI Bus 4x SATA Audio 8x USB2.0 PCIe x16 (or SDVO) 6x PCIe x1 LVDS Channel B LVDS Channel A 12V Control & Miscella neous CRT TV 12V 5Vsb Control & Miscellaneous 12V COM Express COM.0 rev 2.0 Type 6 CD AB D C B A USB 3.0 extended signaling to upgrade four USB 2.0 ports LPC Bus GbE LAN 2x PCIe x1 4x SATA DDI 1 DP, HDMI or DDI 2 DP, HDMI DDI 3 DP, HDMI 12V PCIe x16 SDVO Audio 8x USB2.0 6x PCIe x1 LVDS CRT LVDS Control & Miscellaneous Channel B Channel A FAN & SPI select Control & Miscella neous 1-2 5Vsb SPI 2 Serial TPM, Type ID 12V total amount of pins reduced Computer-On-Modules The Economics of Modularity Reusability is key to protection of your investment. Computer-OnModule offer it all, from reusable design, scalability and fast time to the market to a lower total cost of ownership. Drivers and BSP All modules come standard with BSP's for Windows CE, Windows XP Embedded, Linux, and VxWorks. Support for additional components on your application specific carrier board under the above operating systems can be developed on request. Green because we care We provide lead-free designs not only to satisfy future regulatory standards but also to reflect our real concern about the environment - an environment that has to be shared by all of us. Proof of ADLINK's commitment is with ISO-14001 certification. ISO-14001, the international environmental management standard is a voluntary initiative aimed at improving company environmental performance. Expertise for Carrier Board Design Support With product divisions that are front runners in fields such as: Data Acquisition, Test and Measurement, AdvancedTCA, CompactPCI and Video Surveillance, ADLINK can offer you a broad portfolio of technical knowledge to assist you in your application specific carrier board projects. Firmware Support (BIOS) Adding active components to the carrier boards usually requires a BIOS modification. We offer a whole team of BIOS engineers who can extend and tune the firmware on our boards to let them behave exactly the way you want. We use the AMIBIOS8(R) provides us with excellent embedded functions such as: custom logo, OEM CMOS defaults, flat panel control, serial port console redirection, CMOS backup and trusted core support. 1-3 Longevity is Designed in ADLINK's COM modules represent an optimized Total Cost of Ownership. They have longevity designed in by only using components from the embedded roadmaps of strategic suppliers that are backed by value-added technical services such as life cycle management, revision control and end-of-life (EOL) support. Manufacturing and Quality ADLINK has its own SMT production line that supports the production of leadfree products. ADLINK has been ISO-9001 certified since Many 1999. ADLINK also adheres to 6 Sigma, a set of statistics and methods for improving everything a company does, from designing, manufacturing to service. By applying the rigorous practices of 6 Sigma, we've been approved by industry-leading partners, and achieved breakthroughs in quality performance to deliver better services to our customers. http://www.adlinktech.com/Computer-on-Module Selection Guide COM ExpressTM Basic (125 x 95 mm) Type 6 CPU Type CPU Package CPU Models / Speeds FSB Speed Main Chipset Type 2 Express-HR Express-CB/CBE Express-MV Express-MG Intel(R) CoreTM i7/i5 (Sandy Bridge) up 2.53 GHz with 6 MB L3 cache Intel(R) CoreTM i7/i5/i3 (Arrandale) up 2.53 GHz with 4 MB L2 cache Intel(R) CoreTM2 Duo (Penryn) up 2.26 GHz with 6 MB L2 cache Intel(R) CoreTM2 Duo (Penryn) up 2.53 GHz with 6 MB L2 cache BGA1288 BGA1288 BGA956 PGA478 CoreTM i7 (quad core): i7-2715QE; CoreTM i7 (dual core): i7-2655LE, i7-2610UE, i5-2515E CoreTM i3/i5/i7 (Arrandale) i7-610E 620LE 620UE i5-520E i3-330E Celeron(R) M P4505 Celeron(R) M 722, 723 CoreTM2 Duo (Penryn) SP9300, SL9400, SL9380, SU9300 Celeron(R) M 575, T3100 (dual core) CoreTM2 Duo (Penryn) T9400, P8400 1333/1066 1066/800 1066/800 1066/800 Intel(R) PCH QM67 Intel(R) PCH QM57 Intel(R) GS45 with ICH9M (SFF) Intel(R) GM45 with ICH9M System Memory 16 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel 8 GB (max), dual channel Memory Type DDR3 non ECC at 1333 DDR3 non ECC (CB) or ECC (CBE) DDR3 at 1066/800/667 DDR3 at 1066/800/667 - - - - Max 16 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Max 8 GB on two 200-pin SODIMM Cache (L2) L2 depends on processor type 3MB, 4MB or 6MB L2 depends on processor type 2MB, 3MB or 4MB L2 depends on processor type 1MB, 3MB or 6MB L2 depends on processor type 1MB, 3MB or 6MB BIOS Type AMI EFI, American Megatrend AMI EFI, American Megatrend AMIBIOS(R)8, American Megatrend AMIBIOS(R)8, American Megatrend Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Soldered Memory Socket Memory BIOS Features 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller HD Graphics 3000 GMA HD with 12 execution units Intel(R) GMA X4500 at 533/320 MHz Intel(R) GMA X4500 at 533 MHz Graphics Memory Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA Max 829 MB UMA CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) 3 DDI ports for HDMI/DVI/DP & SDVO CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) PCIe x16 Graphics port PCIe x16 Graphics port PCIe x16 Graphics port or SDVO port PCIe x16 Graphics port or SDVO port BIOS Flash Integrated Display Support External Graphics Bus Compatibillity OpenGL 3.0, DirectX 10.1 OpenGL 2.1, DirectX 10 OpenGL 2.0, DirectX 10 OpenGL 2.0, DirectX 10 Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device one channel, one device two SATA 3 Gb/s, two SATA 6 Gb/s four SATA 3 Gb/s three SATA 3 Gb/s three SATA 3 Gb/s Yes Yes optional optional integrated Intel GbE (10/100/1000) integrated Intel GbE (10/100/1000) integrated Intel(R) GbE (10/100/1000) integrated Intel(R) GbE (10/100/1000) USB 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 Audio Intel(R) HD Audio Intel(R) HD Audio Intel(R) HD Audio Intel(R) HD Audio Yes Yes Yes Yes Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 PCI Express Support 6x PCI-Express x1 (or 1 x4) PCIe two x8, x4 or x1 (on PEG) 6x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) 5x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) 5x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) PCI Suport 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz Yes Yes Yes Yes I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) S0 S1 S3 S4 S5 S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption TBD 21 W with CoreTM i7-620UE at 1.2 GHz and 2 GB memory typical 18 W with CoreTM 2 Duo SU9300 at 1.2 GHz and 2 GB memory typical 23 W with CoreTM 2 Duo P8400 at 2.26 GHz and 2 GB memory typical Operating Temperature 0C ~ +60C 0C ~ +60C 0C ~ +60C 0C ~ +60C TBD selected modules: -20C ~ +70C selected modules: -20C ~ +70C - PICMG COM.0 R2.0, Type 6 PICMG COM.0 R2.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) optional SATA SSD 4~16 GB optional SATA SSD 4~16 GB - - Windows(R) XP/Xpe, Windows(R) 7 Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Vista, Windows(R) 7 Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) Vista, Windows(R) 7, Windows(R) CE, Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) Vista, Windows(R) 7, Windows(R) CE, Linux(R) 2.6.x, AIDI library 1-7 1-9 1-11 1-13 Serial ATA Matrix Storage Support Ethernet Watchdog TPM LPC Support Management Bus Power Power States Extended Temperature Compatibillity Dimensions Solid State Disk on Module BSP & Software Support Page Number 1-4 Selection Guide COM ExpressTM Basic (125 x 95 mm) Type 2 Computer-On-Modules CPU Type CPU Package CPU Models / Speeds Express-MC800 Express-NR Express-AT Express-IA533 Intel(R) CoreTM2 Duo (Merom) up 2.2 GHz with 4 MB L2 cache Intel(R) CoreTM2 Duo (Merom/Yonah) up to 2.2 GHz with 4MB L2 cache Intel(R) AtomTM up to 1.6 GHz with 512 KB L2 cache Intel(R) Pentium(R) M Intel(R) Celeron(R) M (3xx series) PPGA478 (socket-P) or PBGA479 FC-PGA (socket-M) or FC-BGA FC-BGA FC-PGA (socket) or FC-BGA Celeron(R) M 550 (socket) CoreTM2 Duo (Meron) U7500, L7500 CoreTM2 Duo T7500 (socket) Celeron(R) M 423, 440/530 CoreTM2 Duo L7400, U7500, U2500 CoreTM2 Duo T7400 (socket) Intel(R) AtomTM N270 at 1.6 GHz Celeron(R) M: 600MHz up to 1.5GHz Pentium(R) M: 1.1GHz up to 2.0GHz 800/667/533 667/533 533 533/400 Intel(R) GME965 with ICH8M Intel(R) 945GME with ICH7M Intel(R) 945GSE with ICH7M Intel(R) 915GM with ICH6-M System Memory 4 GB (max), dual channel 4 GB (max), dual channel 2 GB (max), single channel 2 GB (max), dual channel Memory Type DDR2 at 667/533 DDR2 at 667/533 DDR2 at 533 DDR2 at 400/533 - - - 512MB soldered onboard FSB Speed Main Chipset Soldered Memory Max 4 GB on two 200-pin SODIMM Max 4 GB on two 200-pin SODIMM Max 2 GB on single 200-pin SODIMM Max 1 GB on 200-pin SODIMM Cache (L2) L2 depends on processor type 2MB or 4MB L2 depends on processor type 1MB, 2MB or 4MB L2 cache 512 KB L2 depends on processor type 0KB, 512KB, 1MB or 2MB BIOS Type AMIBIOS(R)8, American Megatrend AMIBIOS(R)8, American Megatrend AMIBIOS(R)8, American Megatrend Phoenix(R) Award Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support FWH, 4 Mbit Flash Socket Memory BIOS Features 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Graphics Controller Intel(R) GMA X3100 Intel(R) GMA 950 Intel(R) GMA 950 Intel(R) GMA 900 Graphics Memory Max 384 MB UMA Max 256 MB UMA Max 256 MB UMA Max 128 MB UMA CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) CRT (QXGA) Dual channel 18-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) optional PCIe x16 Graphics Port, or dual SDVO ports PCIe x16 Graphics Port, or dual SDVO ports Single SDVO port PCIe x16 Graphics Port, or dual SDVO ports Compatibillity OpenGL 2.0, DirectX 10 OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* 9.0c OpenGL 1.4, DirectX* 9.0 Parallel ATA (IDE) one channel, two devices one channel, two devices one channel, two devices one channel, two devices three SATA 3 Gb/s two SATA 1.5 Gb/s two SATA 1.5 Gb/s two SATA 1.5 Gb/s optional (ICH8EM) optional (ICH7MDH) - - integrated Intel(R) GbE (10/100/1000) Intel(R) 82573 GbE Ethernet (10/100/1000) Realtek RTL8111C GbE (10/100/1000) Marvell Yukon GbE (10/100/1000) BIOS Flash Integrated Display Support External Graphics Bus Serial ATA Matrix Storage Support Ethernet USB 8 ports USB 2.0 8 ports USB 2.0 8 ports USB 2.0 6 ports USB 2.0 Audio Intel(R) HD Audio Intel(R) HD Audio and AC'97 Intel(R) HD Audio and AC'97 Intel(R) HD Audio and AC'97 Yes Yes Yes Yes Yes, Ver. 1.2 Yes, Ver. 1.2 Yes, Ver. 1.2 - 5x PCI-Express x1 (or 1 x4) PCI-Express x8, x4 or x1 (on PEG) 5x PCI-Express x1 (or 1 x4) PCI-Express x1 (on PEG) 3x PCI-Express x1 (optional 5 PCI Express x1) 3x PCI-Express x1 1x PCI-Express x1 (on PEG) 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI Ver. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz Yes Yes Yes Yes I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 S0, S1, S3, S4, S5 Power Consumption 19 W with CoreTM2 Duo U7500 at 1.06 GHz and 2 GB memory typical 16 W with CoreTM2 Duo U7500 at 1.06 GHz and 1 GB memory typical 9 W with Atom(R) N270 at 1.6GHz and 1 GB DDR2 typical 12 W with Celeron(R) M 373 at 1.0 GHz and 512 MB DDR2 typical Operating Temperature 0C ~ +60C 0C ~ +60C 0C ~ +60C 0C ~ +60C - selected modules: -20C ~ +70C selected modules: -20C ~ +70C - PICMG(R) COM ExpressTM R1.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) Basic Form Factor (95x125 mm) - - optional PATA SSD 512 MB up to 4 GB - Windows(R) XP/Xpe, Windows(R) Vista Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) Vista Windows(R) CE, Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) Vista Windows(R) CE, Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe Linux(R) 2.6.x, AIDI library 1-15 1-17 1-19 1-21 Watchdog TPM PCI Express Support PCI Suport LPC Support Management Bus Power Power States Extended Temperature Compatibillity Dimensions Solid State Disk on Module BSP & Software Support Page Number 1-5 http://www.adlinktech.com/Computer-on-Module Compact (95 x 95 mm) Type 2 CPU Type CPU Package CPU Models / Speeds Ultra (84 x 55 mm) Type 10 Type 1 Express-LPC Express-ATC nanoX-TC nanoX-ML Single / Dual Intel(R) AtomTM up to 1.8 GHz with 1 MB L2 cache Intel(R) AtomTM up to 1.6 GHz with 512 KB L2 cache Intel(R) AtomTM Processor E6xx from 600 MHz up to 1.6 GHz Intel(R) AtomTM Processor Z5xx from 1.1 GHz up to 1.6 GHz FCBGA559 PBGA437 FC-BGA 676 BGA 441 AtomTM N455 at 1.66 GHz AtomTM D425 at 1.8 GHz AtomTM D525 at 1.8 GHz (dual core) Intel(R) AtomTM N270 at 1.6 GHz E680 at 1.6 GHz, E660 at 1.3 GHz, E640 at 1.1 GHz, E620 at 600 MHz Intel(R) AtomTM Z530 at 1.6 GHz Intel(R) AtomTM Z510 at 1.1 GHz - 533 - 533/400 ICH8M Intel(R) 945GSE with ICH7M Intel(R) PCH EG20T (extended temp) Intel(R) SCH US15W System Memory 4 GB (max), single channel 2 GB (max), single channel 2 GB (max), single channel 1 GB (max), single channel Memory Type DDR3 at 667/800 DDR2 533 DDR2 400/533 DDR2 400/533 - - 512 MB up 2 GB DDR2 at 800 MHz 512 MB or 1 GB DDR2 466/533 MHz FSB Speed Main Chipset Soldered Memory Max 4 GB on two 200-pin SODIMMs Max 2 GB on single 200-pin SODIMM - - Cache (L2) L2 cache 512 KB (N455/D425) L2 cache 1 MB (D525) L2 cache 512 KB L2 cache 512 KB L2 cache 512 KB BIOS Type AMIBIOS(R)8, American Megatrend AMIBIOS(R)8, American Megatrend AMI EFI, American Megatrend AMIBIOS(R)8, American Megatrend Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support Serial Console redirection EEPROM CMOS backup, USB boot/legacy, PXE support FWH, 8 Mbit Flash Socket Memory BIOS Features 8 Mbit Flash SPI 8 Mbit Flash SPI 8 Mbit Flash SPI Intel(R) GMA 3150 Intel(R) GMA 950 Intel(R) GMA 600 Intel(R) GMA 500 Max 384 MB UMA Max 256 MB UMA Max 64 MB UMA Max 256 MB UMA CRT (QXGA) 2048x1536 single 18 LVDS (WXGA) 1366x768 CRT (QXGA) single/dual 18/24-bit LVDS (UXGA) TV-out (PAL/NTSC/HDTV) 18/24-bit LVDS max 1280x768@60Hz Encode : MPEG4, H.263, H.264; Decode : MPEG2/4, VC1, WMV9, H.264 single channel 18/24-bit LVDS (WXGA) supports HDTV/DHD decode and MPEG, H.264, hardware decoding - Single SDVO port Single SDVO max 1920x1080@50Hz Single SDVO port Compatibillity OpenGL 1.5, DirectX 9.0c OpenGL 1.4, DirectX* 9.0c OpenGL 2.1, DirectX 9.0c OpenGL 2.0, DirectX 9.0c Parallel ATA (IDE) one channel, two devices one channel, two devices - one channel, one device two SATA 1.5 Gb/s two SATA 1.5 Gb/s two SATA 1.5 Gb/s one SATA 1.5 Gb/s - - - - Intel(R) 82583V GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) integrated Intel GbE (10/100/1000) Realtek RTL8111C GbE (10/100/1000) BIOS Flash Graphics Controller Graphics Memory Integrated Display Support External Graphics Bus Serial ATA Matrix Storage Support Ethernet USB 6 ports USB 2.0 6 ports USB 2.0 6 ports USB 2.0, 1 client port 8 ports USB 2.0 Audio Intel(R) HD Audio Intel(R) HD Audio and AC'97 Intel(R) HD Audio Intel(R) HD Audio Watchdog Yes Yes Yes Yes TPM Yes Yes Yes Yes 5x PCI-Express x1 3x PCI-Express x1 (optional 5 PCI Express x1) 3x PCIe x1 (optional 4x PCIe without PCH EG20T) 1x PCIe x1 (optional 2x PCIe without LAN function) 4x PCI rev. 2.3, 32-bit, 33MHz 4x PCI rev. 2.3, 32-bit, 33MHz - - Yes Yes Yes Yes PCI Express Support PCI Suport LPC Support Management Bus Power I2C, SMBus I2C, SMBus I2C, SMBus I2C, SMBus 12V only (AT), 12V and 5Vsb (ATX) 12V only (AT), 12V and 5Vsb (ATX) 4.75V - 14V wide range (5Vsb optional for ATX function) 4.75V - 14V wide range (5Vsb optional for ATX function) S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 S0 S1 S3 S4 S5 S0, S1, S3, S4, S5 Power Consumption 8 W with Atom(R) N455 at 1.66 GHz and 1 GB DDR3 typical 9 W with Atom(R) N270 at 1.6GHz and 1 GB DDR2 typical 4.5 W with E620 at 600 MHz and 5 W with Atom(R)Z510 at 1.1 GHz and 512 MB DDR2 typical Operating Temperature 0C ~ +60C 0C ~ +60C 0C ~ +60C 0C ~ +60C selected modules : -20C ~ +70C selected modules: -20C ~ +70C -40C ~ +85C (with CPU "T" versions) selected modules: -20C ~ +70C PICMG(R) COM ExpressTM R2.0, Type 2 PICMG(R) COM ExpressTM R1.0, Type 2 PICMG(R) COM ExpressTM R2.0, Type 10 PICMG(R) COM ExpressTM R1.0, Type 1 Compact Form Factor (95x95 mm) Compact Form Factor (95x95 mm) Ultra Form Factor (84x55 mm) Ultra Form Factor (84x55 mm) optional SSD 4 GB up to 8 GB optional SSD 4 GB up to 8 GB TBD optional SSD 1 GB up to 8 GB Windows(R) XP/Xpe, Windows(R) Vista Windows(R) CE, Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) Vista Windows(R) CE, Linux(R) 2.6.x, AIDI library Windows(R) XP/Xpe, Windows(R) CE, Win7 Embedded, Linux(R), AIDI library Windows(R) XP/Xpe, Windows(R) CE, Linux(R), AIDI library 1-23 1-25 1-31 1-33 Power States Extended Temperature Compatibillity Dimensions Solid State Disk on Module BSP & Software Support Page Number 512 MB DDR2 typical 1-6 Express-HR COM ExpressTM Type 6 Module with Intel(R) CoreTM i7/i5 processor and QM67 Chipset Features Computer-On-Modules Intel(R) Quad or Dual CoreTM i7/i5 Processor Intel(R) QM67 Chipset Up to 16GB Dual Channel DDR3 SDRAM at 1333MHz Three Digital Display Interfaces (DDI) for DisplayPort /HDMI/DVI/SDVO Seven PCIe x1, one PCIe x16 (Gen2) for graphics (or general purpose x8/4/1) Two SATA 3 Gb/s, two SATA 6 Gb/s, Gigabit LAN, eight USB 2.0 Specifications LAN Core System CPU Memory Chipset L3 Cache BIOS Hardware Monitor Debug Interface Watchdog Timer Expansion Busses Sandy Bridge 32 nm process, BGA type Intel(R) CoreTM i7-2715QE 2.1 GHz (3.0 GHz Turbo), 6MB L3 cache, 45W Intel(R) Core i7-2655LE 2.2 GHz (2.9 GHz Turbo), 4MB L3 cache, 25W Intel(R) CoreTM i7-2610UE 1.5 GHz (2.4 GHz Turbo), 4MB L3 cache, 17W Intel(R) CoreTM i5-2515E 2.5 GHz (3.2 GHz Turbo), 3MB L3 cache, 35W Dual channel non-ECC 1066/1333 MHz DDR3 memory up to 16 GB in dual stacked SODIMM socket Intel(R) Mobile QM67 Express Chipset 6MB (i7-2715QE), 4MB(i7-2655LE and i7-2610UE), 3MB (i5-2515E) AMI EFI with CMOS backup in 16 Mbit SPI BIOS Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Programmable timer range to generate RESET PCI Express x16 (Gen2) bus for discrete graphics solution or general purpose PCI Express (2 x8 or 1 x8 with 2 x4) or Embedded DisplayPort (eDP) 8 PCI Express x1: Lanes 0/1/2/3/4/5/6 are free, lane 7 is occupied by GbE LPC bus, SMBus (system) , I2C (user) Video Integrated in Processor Integrated Video Feature Support HD Graphics 3000 at 650-1300 MHz DirectX 10.1 and OpenGL 3.0 Intel Clear Video HD Technology Advanced Scheduler 2.0, 1.0, XPDM support DirectX Video Acceleration (DXVA) support for full AVC/VC1/ MPEG2 hardware decode CRT Interface Analog CRT support with 300 MHz DAC Analog monitor support up to QXGA (2048 x 1536) and CRT hot plug LVDS Interface Dual channel 18/24-bit LVDS Digital Display Interface Three DDI ports supporting HDMI / DVT / DisplayPort or SDVO Audio Chipset Audio Codec 1-7 Integrated on Intel(R) PCH QM67 On Express-BASE6 (ALC888) Chipset Interface Intel(R) Gigabit LAN PHY WG82579LM 10/100/1000 Mbps Ethernet Multi I/O Chipset USB SATA SSD Integrated on QM67 Supports up to eight ports USB 2.0 Supports two SATA ports at 6 Gb/s and two ports at 3 Gb/s with support for RAID 0,1,5,10 Optional SATA based Solid State Disk 8/16/32 GB Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption Smart Battery Support AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 TBD Yes Mechanical and Environmental Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification 0C to 60C -20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88Grms, 5-500Hz, each axis Operating: 0.5Grms, 5-500Hz, each axis COM Express Type 6, Basic form factor 125mm x 95mm CE, FCC, HALT Operating Systems Standard Support Windows(R) XP(e) / Windows(R) 7 Linux(R) Extended Support (BSP) Embedded XP support package Linux(R) 2.6.x BSP VxWorks 6.x AIDI Library for Windows(R) and Linux(R) http://www.adlinktech.com/Computer-on-Module Functional Diagram SODIMM 2 CPU SODIMM 2 XDP SFF26 1066/1333 MHz 1~8 GB DDR3 Core i7-26XX /i5-26XX 1066/1333 MHz 1~8 GB DDR3 PCI Express x16 (Gen2) FDI DMI 2 x8 or 1 x8 + 2 x4 CRT Dual channel 24-bit LVDS DDI 1 DP / HDMI / DVI / SDVO 6x PCIe x1 (port 0~5) GbE LAN 82579 PCIe x1 (port 7) HDA Audio 2x SATA 6 Gb/s (channel 0/1) 2x SATA 3 Gb/s (channel 2/3) DDI 2 DP / HDMI / DVI PCH DDI 3 DP / HDMI / DVI / eDP QM67 PCIe x1 (port 6) 8x USB 2.0 (channel 0/7) TPM Debug Header SLB9635 LPC bus 4x GPI GPIO 4x GP0 PCA9535 SPI 1 BIOS Monitor ADT7490 SMBus I2C SPI 2 BIOS BC SPI Ordering Information Accessories Modules Model Number Description/Configuration Express-HR-i7-2715QE COM ExpressTM Type 6 module with Intel(R) Core i7-2715QE SV processor at 2.1GHz with QM67 chipset Express-HR-i7-2655LE COM ExpressTM Type 6 module with Intel(R) Core i7-2655LE LV processor at 2.2GHz with QM67 chipset Express-HR-i7-2610UE COM ExpressTM Type 6 module with Intel(R) Core i7-2610UE ULV processor at 1.5 GHz with QM67 Chipset Express-HR-i5-2515E COM ExpressTM Type 6 module with Intel(R) Core i5-2515E SV processor at 2.5 GHz with QM67 Chipset Model Number Description/Configuration Passive Heatsinks THSH-HR-BL High Profile Heatsink for Express-HR with threaded standoffs Heat Spreaders HTS-HR-RL Heatspreader for Express-HR with threaded standoffs Heatsink with Active Cooling THSFH-HR-BL High Performance Heatsink with Fan for Express-HR with threaded standoffs 1-8 Express-CB/CBE COM ExpressTM Module with Intel(R) Core i7/i5/i3 Processor and QM57 Chipset Features Computer-On-Modules Intel(R) CoreTM i7/i5/i3 Processor Intel(R) QM57 chipset Up to 8 GB Dual Channel DDR3 SDRAM at 1066 MHz (optional ECC) Six PCIe x1, one PCIe x16 for graphics (or general purpose x8/4/1) 18/24-bit LVDS and Embedded DisplayPort SATA 3 Gb/s IDE (PATA), Gigabit LAN, USB 2.0 Specifications Audio Core System Chipset Audio Codec CPU Memory Chipset L2 Cache BIOS Hardware Monitor Watchdog Timer Expansion Busses Arrandale BGA type Intel(R) CoreTM i7-610E Processor (4M Cache, 2.53 GHz) 35 W Intel(R) CoreTM i5-520E Processor (3M Cache, 2.40 GHz) 35 W Intel(R) CoreTM i7-620LE Processor (4M Cache, 2.00 GHz) 25 W Intel(R) CoreTM i7-620UE Processor (4M Cache, 1.06 GHz) 18 W Intel(R) CoreTM i3-330E Processor (3M Cache, 2.13 GHz) 35W Intel(R) Celeron(R) Processor P4505 (2M Cache, 1.86 GHz) 35 W Dual channel 800/1066 MHz DDR3 memory up to 8 GB in dual stacked SODIMM socket; ECC memory for CBE series only Intel(R) Mobile QM57 2 MB (Celeron(R) M), 4/3 MB (Intel(R) CoreTM i7 / i5) AMI EFI with CMOS backup in 16 Mbit SPI BIOS Supply voltages and CPU temperature Programmable timer ranges to generate RESET PCI Express x16 bus for discrete graphics solution or general purpose PCI Express (2 x8 or 2 x4 or 2 x1) or Embedded Display Port (eDP) 7 PCI Express x1: Lanes 0/1/2/3/4/5 are free, lane 6 is occupied by GbE; can be optionally configured as 1 x4 (on 0/1/2/3) and 2 x1 (4/5) 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters LPC bus, SMBus (system) , I2C (user) Video Integrated in Processor Integrated Video Feature Support CRT Interface LVDS Interface 1-9 Gen 5.75 with 12 execution units DirectX 10 and OpenGL 2.1 Intel(R) Dynamic Video Memory Technology (Intel(R) DVMT 5.0) Video capture via x1 concurrent PCI Express port PAVP (Protected Audio-Video Path) support for Protected Intel HD Audio Playback High performance MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Hardware acceleration for MPEG2 VLD/iDCT Microsoft DirectX 10 support OpenGL 2.1 support Blu-ray support @ 40 Mb/s Hardware motion compensation Intermediate Z in classic rendering Analog CRT support by 300 MHz DAC Analog monitor support up to QXGA ( 2048 X 1536) Single / Dual channel 18- or 24-bit panels Integrated on Intel(R) PCH QM57 On carrier (ALC888) LAN Chipset Interface Integrated on QM57 with 82577LM PHY 10/100/1000 Mbps Ethernet Multi I/O Chipset USB SATA SSD PATA Integrated on Intel(R) PCH QM57 Supports up to eight ports USB v. 2.0 Four ports SATA 3 Gb/s with optional support for RAID 0,1,5,10 Optional SATA based Solid State Disk 8/16/32 GB SATA to PATA bridge on SATA channel 1, Master only Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption Smart Battery Support AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 21 W with CoreTM i7-620UE at 1.2 GHz and 2 GB memory typical Yes Mechanical and Environmental Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification 0C to 60C -20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor 125 mm x 95 mm CE, FCC Operating Systems Standard Support Windows(R) XP(e) / Vista / Windows(R) 7 Linux(R) Extended Support (BSP) Embedded XP support package Linux(R) 2.6.x BSP Vxworks 6.x BSP AIDI Library for Windows(R) and Linux(R) http://www.adlinktech.com/Computer-on-Module Functional Diagram CPU DDR3 Memory Controller with ECC Core i7 / i5 / i3 Channel A DDR3 SODIMM with or without ECC Channel B DDR3 SODIMM with or without ECC 800/1066 MHz 800/1066 MHz PCIe x16 Gfx 2 PCIe x8 Embedded DisplayPort (eDP) Embedded Graphics Core CRT LVDS DMI FDI AB CRT VGA SDVO HDMI (3x) DVI (3x) DisplayPort (3x) LVDS dual 18/24-bit HD Audio LAN Intel PHY 82577LM LAN (occupies PCIe x1 port 6) GbE MAC PCH QM57 PCIe x1 PCIe x1 (port 0/1/2/3/4/5) CD Audio JM330 SATA SSD 6x SATA 2 SATA (1 port) 8x USB 2.0 GPIO SATA (4 ports) SMBus SATA (1 port) PCI 33 MHz v2.3 SPI PATA IDE SATA to PATA PCI LPC USB SMBus GPIO BIOS I2C to GPIO MAX6621 Mon(T) Test Header LM87 Mon(T/V) I 2C TPM BC LPC Ordering Information Accessories Modules Non-ECC Model Number ECC Model Number Description/Configuration Express-CB-i7-610E Express-CBE-i7-610E COM ExpressTM module with Intel(R) Core i7-610E SV processor at 2.53 GHz with QM57 chipset Express-CB-i5-520E Express-CBE-i5-520E COM ExpressTM module with Intel(R) Core i5-520 SV processor at 2.4 GHz with QM57 chipset Model Number Description/Configuration Heat Spreaders HTS-CB-B Heatspreader with threaded standoffs for Express-CB/CBE Heatsink with Active Cooling THSF-CB-B Heatsink with fan and threaded standoffs for Express-CB/ CBE Express-CB-i7-620LE Express-CBE-i7-620LE COM ExpressTM module with Intel(R) Core i7-620LE LV processor at 2.0 GHz with QM57 chipset Express-CB-i7-620UE Express-CBE-i7-620UE COM ExpressTM module with Intel(R) Core i7-620UE ULV processor at 1.07 GHz with QM57 chipset Express-CB-i7-P4505 Express-CBE-i7-P4505 COM ExpressTM module with Intel(R) Celeron(R) P4505 SV processor at 1.86 GHz with QM57 chipset Express-CB-i3-330E Express-CBE-i3-330E COM ExpressTM module with Intel(R) Core i3-330E SV processor at 2.13 GHz with QM57 chipset 1-10 Express-MV COM ExpressTM Module with Intel(R) CoreTM2 Duo Processor and GS45 / ICH9M-SFF Chipset Features Computer-On-Modules Intel(R) CoreTM2 Duo processor (up to 2.26 GHz) Intel(R) GS45 and ICH9M-SFF chipset Dual SODIMM for up to 8 GB DDR3 at 1066 MHz Five PCIe x1, one PCIe x16 for graphics (or general purpose x8, x4 or x1) Single/dual channel 18/24-bit LVDS and TV-out (SDTV and HDTV) SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0 Specifications LAN Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses Penryn SFF BGA type Intel(R) CoreTM2 Duo SP9300, FSB 1066, 2.26 GHz with 6MB L2 cache, 25 Watt Intel(R) CoreTM2 Duo SL9400, FSB 1066, LV 1.86 GHz with 6MB L2 cache, 17 Watt Intel(R) CoreTM2 Duo SU9300, FSB 800, ULV 1.2 GHz with 3MB L2 cache, 10 Watt Intel(R) Celeron(R) M 722, FSB 800, ULV 1.2GHz with 1MB L2 cache, 5.5 Watt Dual stacked SODIMM sockets supporting dual channel memory, up to 8 GB of non-ECC, 800/1066 MHz DDR3 Intel(R) GS45 Express Graphics Memory Controller Hub SFF (Small Form Factor) and Intel(R) I/O Controller Hub ICH9M-SFF AMIBIOS(R)8 with CMOS backup in 16 Mbit SPI Flash Supply voltages and CPU temperature Programmable timer ranges to generate RESET Graphics PCI Express x16 bus for SDVO/HDMI/DisplayPort or general purpose PCI Express (x8 / x4 / x1) 6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE; 0/1/2/3 x1 can be optionally configured as 1 x4 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I2C Video Chipset Integrated Video Feature Support CRT Interface LVDS Interface TV-out GS45 GMCH integrated Mobile Intel(R) Graphics Media Accelerator 4500MHD with core render clock 533 MHz @ 1.05-V core voltage or 266 MHz @ 1.025 L.P. Mode Intel(R) Dynamic Video Memory Technology (Intel(R) DVMT 5.0) Video capture via x1 concurrent PCI Express port PAVP (Protected Audio-Video Path) support for Protected Intel(R) HD Audio Playback High performance MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Hardware acceleration for MPEG2 VLD/iDCT Microsoft DirectX 10 support Blu-ray support @ 40 Mb/s Hardware motion compensation Intermediate Z in classic rendering Analog CRT support by 300MHz DAC Analog monitor support up to QXGA, supports CRT hot plug Single / Dual channel 18/24-bit at 25~112 MHz NTSC/PAL up to 1024x768 resolution supported HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Chipset Interface Multi I/O Chipset USB SATA PATA 1-11 Integrated on Intel(R) ICH9M Supports up to eight ports USB v. 2.0 Four ports SATA 3 Gb/s with (optional) support for RAID 0,1,5,10 SATA to PATA JM20330 controller on SATA channel 3, Master only Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 18 W (with CoreTM2 Duo SU9300 at 1.2 GHz and 2 GB memory typical) Mechanical and Environmental Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications 0C to 60C -20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor, 95 mm x 125 mm CE, FCC Operating Systems Standard Support Extended Support Audio Chipset Audio Codec HDMI Integrated on Intel(R) ICH9M with Intel(R) 82567LM PHY 10/100/1000 Mbps Ethernet Integrated on Intel(R) ICH9M HDA codec on carrier Audio routed to HDMI interface http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32/64-bit Windows(R) Vista 32/64-bit Windows(R) Server 2003/2008 Linux(R) 2.6.x Embedded XP BSP Linux(R) 2.6.x BSP WinCE 6.0 BSP AIDI Library for Win32, WinCE and Linux(R) Functional Diagram CPU Celeron(R) M CoreTM2 Duo Small Form Factor: 22 x 22 mm BGA FSB 800/1066 MHz GMCH Intel(R) GS45 DDR-3 Memory Small Form Factor Controller Graphics Core Analog 4500MHD VGA CRT TV-out SDTV HDTV LVDS LVDS dual 18/24-bit DDR3 Channel A 800/1066 SODIMM socket DDR3 Channel B 800/1066 SODIMM socket PCIe x16 Gfx PCIe x8/x4/x1 SDVO (2) DisplayPort (3) HDMI (2) DMI PCIe x16 (multiplexed) Audio Intel LAN PHY 82567LM Gbe MAC PCIe x1, lane 5 PCIe x1, lane 0/1/2/3/4 or PCIe x4 Six PCIe x1 lanes SATA_0/1/2/3 3x SATA ICH Intel(R) ICH9M Small Form Factor SMBus 8x USB 2.0 PCI SPI SMBus GPIO LM95245 IDE PCI 33 MHz v2.3 LPC BIOS F75111R JM30220 SATA / PATA 1x SATA2 RTC USB_0/1/2/3/4/5/6/7 CD AB Audio Test header LM87 TPM I2C BC LPC Ordering Information Accessories Modules Model Number Description/Configuration Express-MV-SP9300 COM ExpressTM Module with Intel CoreTM2 Duo processor SP9300 at 2.26 GHz Express-MV-SL9400 COM ExpressTM Module with LV Intel(R) CoreTM2 Duo processor SL9400 at 1.86 GHz Express-MV-SU9300 COM ExpressTM Module with ULV Intel(R) CoreTM2 Duo processor SU9300 at 1.20 GHz Express-MV-722 COM ExpressTM Module with ULV Intel Celeron M processor 722 at 1.20 GHz Model Number (R) (R) Description/Configuration Heat Spreaders HTS-MV-B Heatspreader for Express-MV (BGA CPU) with threaded standoffs Passive Heatsinks THS-MV-BL (R) Low Profile Heatsink for Express-MV (BGA CPU) with threaded standoffs for bottom mounting with long cooling fins (incl screws for 5 and 8 mm btb) Heatsink with Active Cooling THSF-MV-B High Performance Heatsink with Fan for Express-MV (BGA CPU) with threaded standoffs 1-12 Express-MG COM ExpressTM Module with Intel(R) CoreTM2 Duo Processor and GM45 / ICH9M Chipset Features Computer-On-Modules Intel(R) CoreTM2 Duo processor (up to 2.53 GHz) Intel(R) GM45 and ICH9M chipset Dual SODIMM for up to 8 GB DDR3 at 1066 MHz Five PCIe x1, one PCIe x16 for graphics (or general purpose x8, x4 or x1) Single/dual channel 18/24-bit LVDS and TV-out (SDTV and HDTV) SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0 Specifications Audio Core System Chipset Audio Codec HDMI CPU Memory Chipset L2 Cache BIOS Hardware Monitor Watchdog Timer Expansion Busses Socket P Intel(R) CoreTM2 Duo T9400, FSB 1067, 2.53 GHz with 6-MByte L2 cache, 35 Watt Intel(R) CoreTM2 Duo P8400, FSB 1067, 2.26 GHz with 3-MByte L2 cache, 25 Watt Intel(R) Dual Celeron(R) M T3100, FSB 800, 1.90 GHz with 1-MByte L2 cache, 35 Watt Intel(R) Celeron(R) M 575, FSB 667, 2.00 GHz with 1-MByte L2 cache, 31 Watt Two SODIMM sockets (one on top, one on bottom) supporting dual channel memory, up to 8 GB of non-ECC, 800/1067 MHz DDR3 Intel(R) GM45 Express Graphics Memory Controller Hub and Intel(R) I/O Controller Hub 82801IEM (ICH9M-E) 1 MB (Celeron(R) M), 6/3 MB (CoreTM2 Duo) AMIBIOS(R)8 with CMOS backup in 16 Mbit SPI Flash Supply voltages and CPU temperature Programmable timer ranges to generate RESET Graphics PCI Express x16 bus or SDVO/HDMI/DisplayPort or general purpose PCI Express (x8/x4/x1) 6 PCI Express x1: Lanes 0/1/2/3/4 are free, lane 5 is occupied by GbE LAN; lanes 0/1/2/3 x1 can be optionally configure as 1 x4 32-bit PCI: PCI Rev. 2.3 at 33MHz, supporting 4 bus masters LPC bus, SMBus (system), I2C (user) Video Chipset Integrated Video Feature Support CRT Interface LVDS Interface TV-out 1-13 GM45 GMCH integrated Mobile Intel(R) Graphics Media Accelerator X4500 with core render clock 533-MHz @ 1.05 Vcore Intel(R) Dynamic Video Memory Technology (Intel(R) DVMT 5.0) Video capture via x1 concurrent PCI Express port PAVP (Protected Audio-Video Path) support for Protected Intel(R) HD Audio Playback High performance MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Hardware acceleration for MPEG2 VLD/iDCT Microsoft DirectX 10 support OpenGL 2.1 support Blu-ray support @ 40 Mb/s Hardware motion compensation Intermediate Z in classic rendering Analog CRT support by 300-MHz DAC Analog monitor support up to QXGA and support for CRT hot plug Single / Dual channel 18- or 24-bit panels NSTC/PAL up to 1024x768 resolution supported HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Integrated on Intel(R) I/O Controller Hub 9 Mobile (ICH9M) On carrier (ALC888) Audio routed to HDMI interface LAN Chipset Interface Integrated on ICH9M with Intel 82567LM PHY 10/100/1000 Mbps Ethernet Multi I/O Chipset USB SATA PATA Integrated on Intel(R) I/O Controller Hub 9 Mobile (ICH9M) Supports up to eight ports USB v. 2.0 Four ports SATA 3 Gb/s with optional support for RAID 0,1,5,10 SATA to PATA JM330 controller on SATA channel 3, Master only (can be removed to free up fourth SATA channel) Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption Smart Battery Support AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 23 W (with CoreTM2 Duo P8400 at 2.26 GHz and 2 GB memory, typical) Yes Mechanical and Environmental Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification 0C to 60C -20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor 125 mm x 95 mm CE, FCC Operating Systems Standard Support Windows(R) XP(e) / Vista / Windows(R) 7 Linux(R) Extended Support (BSP) Embedded XP support package Linux(R) 2.6.x BSP (with Xorg OpenGL setup instructions) Vxworks 6.x BSP (on request) AIDI Library for Windows(R) and Linux(R) http://www.adlinktech.com/Computer-on-Module Functional Diagram CPU CoreTM2 Duo Celeron(R) M Socket P FSB 800/1066 MHz GMCH Intel(R) GM45 DDR3 Memory Controller Analog VGA DDR3 Channel A 800/1066 SODIMM socket DDR3 Channel B 800/1066 SODIMM socket PCIe x16 Gfx PCIe x8/x4/x1 SDVO (2) DisplayPort (3) HDMI (2) SDTV HDTV LVDS dual 18/24-bit HDA only DMI Audio GbE MAC port 5 N/A (Multifunction with LAN) six ports PCI-E x1 PCI-E ports 0 / 1 / 2 / 3 / 4 ICH CD AB Intel PHY 82567LM Intel(R) ICH9M Small Form Factor JM330 SATA / PATA SATA (port 3) SMBus 8x USB 2.0 USB_0/1/2/3/4/5/6/7 GPIO RTC 4x SATA 2 SATA ports 0/1/2 (0/1/2/3 if no PATA support) SMBus GPIO PCI SPI LM95235 Mon(T) LM87 Mon(T/V) IC 2 PCI 33 MHz v2.3 LPC BIOS I2C to GPIO PATA IDE (master only) PATA Test Header TPM BC LPC Ordering Information Accessories Modules Model Number Description/Configuration Express-MG-S COM ExpressTM Module with socket type for Intel CoreTM2 Duo processor with GM45 and ICH9M chipset Express-MG-S/T9400 COM ExpressTM Module with socket type Intel(R) CoreTM2 Duo processor T9400 at 2.53 GHz Express-MG-S/P8400 COM ExpressTM Module with socket type Intel(R) CoreTM2 Duo processor P8400 at 2.26 GHz Express-MG-S/T3100 COM ExpressTM Module with socket type Intel Dual Core Celeron(R) processor T3100 at 1.90 GHz Express-MG-S / 575 COM ExpressTM Module with socket type Intel Celeron(R) processor 575 at 2.00 GHz Model Number (R) (R) (R) Description/Configuration Heat Spreaders HTS-MG-S Heatspreader for Express-MG (socket CPU) with threaded standoffs Passive Heatsinks THS-MG-S Low Profile Heatsink for Express-MG (socket CPU) with threaded standoffs Heatsink with Active Cooling THSF-MG-S High Performance Heatsink with FAN for Express-MG (socket CPU) with threaded standoffs 1-14 Express-MC800 COM ExpressTM Module with Intel(R) CoreTM2 Duo Processor and GME965 / ICH8-M Chipset Features Computer-On-Modules Intel(R) CoreTM2 Duo processor (up to 2.2 GHz) Intel(R) GME965 / ICH8M chipset Dual SODIMM for up to 4 GB DDR2 at 800MHz Five PCIe x1, one PCIe x16 graphic (or x8) Dual-channel 24-bit LVDS, TV-out SATA 3 Gb/s, PATA, Gigabit LAN, USB 2.0 Specifications Multi I/O Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses Socket P type Intel(R) CoreTM2 Duo T7500, FSB 800, 2.2 GHz with 4MB L2 cache, 34 W Intel(R) Celeron(R) M 550, FSB 533, 2.0 GHz, with 1MB L2 cache 27 W BGA type Intel(R) CoreTM2 Duo T7500, FSB 800, 2.2 GHz with 4MB L2 cache, 34 W Intel(R) CoreTM2 Duo L7500, FSB 800, LV 1.5 GHz with 4MB L2 cache, 17 W Intel(R) CoreTM2 Duo U7500, FSB 533, ULV 1.06 GHz with 2MB L2 cache, 10 W Dual stacked SODIMM sockets supporting dual channel memory, up to 4 GB of non-ECC, 533/667 MHz DDR2 Intel(R) GME965 GMCH and ICH8-M AMIBIOS(R)8 with CMOS backup in 8 Mbit SPI BIOS Supply voltages and CPU temperature Programmable timer ranges to generate RESET 6 PCI Express x1 (0 - 4 free, 5 occupied by GbE), optional configurable as x4 Graphics PCI Express x16 or PCI Express x8/x4/x1, or SDVO digital video bus 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I2C Video Chipset CRT Interface LVDS Interface TV-out GME965 integrated Mobile Intel(R) GMA X3100 Analog CRT support up to 2048 x1536 at 60 Hz, 32-bpp Single / Dual channel 18/24-bit at 25~112 MHz NTSC/PAL up to 1024x768 resolution, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type 1-15 Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption AT mode (12 V) and ATX mode (12 V and 5 Vsb) Supports S0, S1, S3, S4, S5 19 W (with CoreTM2 Duo U7500 at 1.06 GHz and 2 GB memory, typical) Mechanical and Environmental Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications Integrated on Intel ICH8-M HDA codec on carrier Standard Support ICH8-M integrated GbE MAC with Intel(R) 82566 PHY 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN support Extended Support (R) LAN Chipset Interface Intel(R) ICH8-M Single channel IDE with Ultra ATA 100/66/33 support Three ports SATA 3 Gb/s Up to eight ports USB 2.0 0C to 60C 20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor, 95 mm x 125 mm CE, FCC Operating Systems Audio Chipset Audio Codec Chipset IDE (PATA) SATA USB http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32/64-bit Windows(R) Vista 32/64-bit Windows(R) Server 2003 Linux(R) 2.6.x Embedded XP BSP Linux(R) 2.6.x BSP AIDI Library for Win32, WinCE and Linux(R) Functional Diagram CPU Celeron(R) M CoreTM2 Duo SMT FCBGA2 or FCPGA2 FSB 533/800 MHz GMCH Intel(R) GME965 Analog VGA CRT SDTV HDTV TV-out Graphic Core X3100 Channel B DDR2 533/667 SODIMM socket DDR2 533/667 SODIMM socket Gfx PCIe x16 PCIe x8/x4/x2/x1 or 2x SDVO LVDS dual 18/24-bit LVDS Channel A DDR-2 Memory Controller DMI PCIe x16 (multiplexed) HDA Audio Audio GbE PHY GbE MAC PCIe x1, lane 5 Intel 82566 ICH Intel(R) ICH8M PCI Express lanes PCIe x1, lane 0/1/2/3/4 or PCIe x4 PATA 1x IDE0 2 IC SATA_0/1/3 3x SATA2 USB 2.0 0/1/2/3/4/5/6/7 8x USB 2.0 SMBus RTC PCI SPI LPC BC SMBus GPIO PCI 33 MHz, v2.3 TPM GPIO F75111R Monitor LM95235 Monitor LM87 BIOS LPC header LPC Ordering Information Accessories Modules Model Number Description/Configuration Express-MC800-S COM ExpressTM Module with socket for Celeron M or CoreTM2 Duo processor (for Intel(R) CoreTM2 Duo T7500 processor at 2.2 GHz or Intel(R) Celeron(R) M 550 processor at 2.0 GHz) Model Number (R) Express-MC800-L7500 COM ExpressTM Module with LV Intel(R) CoreTM2 Duo L7500 processor at 1.6 GHz Express-MC800-U7500 COM ExpressTM Module with ULV Intel CoreTM2 Duo U7500 processor at 1.06 GHz (R) Description/Configuration Heat Spreaders HTS-MC800-B Heatspreader for Express-MC800 (BGA CPU) with threaded standoffs Passive Heatsinks THS-MC800-B Low Profile Heatsink for Express-MC800 (BGA CPU) with threaded standoffs THSH-MC800-B High Heatsink for Express-MC800 (BGA CPU) with threaded standoffs Heatsink with Active Cooling THSF-MC800-S High Performance Heatsink with Fan for Express-MC800 (socket CPU) with threaded standoffs 1-16 Express-NR COM ExpressTM Module with Intel(R) CoreTM2 Duo Processor and 945GME / ICH7-M Chipset Features Computer-On-Modules Intel(R) CoreTM2 Duo processor (up to 2.1 GHz) Intel(R) 945GME / ICH7-M chipset Dual SODIMM for up to 4 GB DDR2 at 667 MHz One PCIe(R) x16, five PCIe(R) x1 (or one x4) Single/dual 18/24-bit LVDS, TV-out SATA, PATA, Gigabit LAN, USB 2.0 Specifications Multi I/O Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses Merom Core socket type Intel(R) CoreTM2 Duo T7400, 2.16GHz with 4MB L2 cache, 34 W Intel(R) Celeron(R) M 530, 1.73GHz with 1MB L2 cache, 27 W Merom Core BGA type Intel(R) CoreTM2 Duo L7400, 1.5 GHz with 4MB L2 cache, 17 W Intel(R) CoreTM2 Duo U7500, 1.06 GHz with 2MB L2 cache, 10 W Yonah Core socket type Intel(R) CoreTM Duo T2500, 2.0 GHz with 2MB L2 cache, 31 W Intel(R) Celeron(R) M 440, 1.86 GHz with 1MB L2 cache, 27 W Yonah Core BGA type Intel(R) CoreTM Duo L2400, 1.66GHz with 2MB L2 cache, 15 W Intel(R) CoreTM Duo U2500, 1.2 GHz with 2MB L2 cache, 9 W Intel(R) Celeron(R) M 423, 1.06GHz with 1MB L2 cache, 5.5 W Dual SODIMM sockets supporting dual channel memory, up to 4 GB of non-ECC, 533/667 MHz DDR2 Intel(R) 945GME Express Graphics Memory Controller Hub Intel(R) I/O Controller Hub 7 Mobile (ICH7-M DH) AMIBIOS(R)8 with CMOS backup in 8 Mbit SPI BIOS Supply voltages and CPU temperature Programmable timer ranges to generate RESET 6 PCI Express x1 (0 - 4 free, 5 occupied by GbE LAN), optional configurable as x4 Graphics PCI Express x16, or SDVO digital video bus 32-bit PCI 2.3 at 33MHz, supporting 6 bus masters LPC, SMBus, I2C Video Chipset CRT Interface LVDS Interface TV-out 945GME GMCH integrated graphics supports dual independent displays Analog VGA support up to 2048 x1536 resolution Single / Dual channel 18/24-bit NTSC/PAL up to 1024x768 resolution, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Audio Chipset Audio Codec Integrated on Intel(R) ICH7-M DH HDA (Azalia) or AC'97 codec on carrier Chipset IDE (PATA) SATA USB Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Input Power Power States Power Consumption AT mode (12 V) and ATX mode (12 V and 5 Vsb) Supports S0, S1, S3, S4, S5 16 W typical (with CoreTM2 Duo U7500 and 1 GB memory) Mechanical and Environmental Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications 0C to 60C -20C to 80C up to 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor, 95 mm x 125 mm CE, FCC Operating Systems Standard Support Extended Support PCIe type Intel(R) 82573L 10/100/1000 Mbps 1-17 Infineon SLB9635TT1.2 TPM 1.2 Power Specifications LAN Chipset Interface Intel(R) ICH7-M Single channel IDE with UDMA 100 support Three SATA 1.5 Gb/s ports Up to eight USB 2.0 ports http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32/64-bit Windows(R) Vista 32/64-bit Windows(R) Server 2003 Linux(R) 2.6.x Embedded XP BSP WinCE BSP Linux(R) 2.6.x BSP AIDI Library for Win32, WinCE and Linux(R) Functional Diagram CPU Celeron(R) M CoreTM Duo CoreTM2 Duo SMT FCBGA2 or FCPGA2 FSB 533/667 MHz GMCH Analog VGA CRT SODIMM socket DDR2 533/667 Channel B SODIMM socket PCIe x16 Gfx PCIe x1 or 2x SDVO LVDS Dual 18/24-bit LVDS DDR-2 Memory Controller Graphic Core 250 MHz SDTV HDTV TV-out DDR2 533/667 Channel A Intel(R) 945GME DMI PCIe x16 (multiplexed) AC97 or HDA Audio Audio GbE LAN Intel 82573L PCIe x1, lane 5 Six PCIe x1 lanes PCIe x1, lane 0/1/2/3/4 or PCIe x4 ICH Intel(R) ICH7-M DH PATA 1x IDE I2C SATA_0/1 2x SATA USB_0/1/2/3/4/5/6/7 8x USB 2.0 SMBus RTC SPI LPC BC SMBus GPIO PCI 33 MHz, v2.3 PCI TPM GPIO LM95235 LM87 BIOS LPC header LPC Ordering Information Modules Accessories Model Number Description/Configuration Express-NR-S COM ExpressTM Module with socket for Celeron(R) M / CoreTM Duo / CoreTM2 Duo processor (for Intel(R) CoreTM2 Duo T7400 processor at 2.16 GHz or Intel(R) Celeron(R) M 440 processor at 1.86 GHz) Model Number Description/Configuration Heat Spreaders HTS-NR-B Heatspreader for Express-NR (BGA CPU) with threaded standoffs Passive Heatsinks Express-NR-L7400 COM ExpressTM Module with LV Intel(R) CoreTM2 Duo L7400 processor at 1.5 GHz THS-NR-B Express-NR-L2400 COM ExpressTM Module with LV Intel(R) CoreTM Duo L2400 processor at 1.66 GHz Low Profile Heatsink for Express-NR (BGA CPU) with threaded standoffs THSH-NR-B Express-NR-U7500 COM ExpressTM Module with ULV Intel(R) CoreTM2 Duo U7500 processor at 1.06 GHz High Heatsink for Express-NR (BGA CPU) with threaded standoffs Heatsink with Active Cooling Express-NR-423 COM ExpressTM Module with ULV Intel(R) Celeron(R) M 423 processor at 1.06 GHz THSF-NR-S High Performance Heatsink with Fan for Express-NR (socket CPU) with threaded standoffs 1-18 Express-AT COM ExpressTM Module with Intel(R) AtomTM Processor N270 and 945GSE/ICH7-M Chipset Features Computer-On-Modules Intel(R) AtomTM processor N270 at 1.6 GHz Intel(R) 945GSE / ICH7-M chipset SODIMM for up to 2 GB DDR2 at 533 MHz Three PCIe x1 (optional 4 x1 or 1 x4) High resolution CRT, single/dual 18-bit LVDS and TV-out (SDTV and HDTV) SATA, IDE (PATA), Gigabit LAN, USB 2.0 Optional 512MB~8GB IDE-based Solid State Disk Specifications Multi I/O Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses BGA type Intel(R) AtomTM N270, FSB 533, 1.6 GHz with 512 KB L2 cache, 2.5 W, on-die primary 32-kB instruction cache and 24 KB write-back data cache Hyper-Threading support (2-threads) Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel(R) SpeedStep(R) Technology Source synchronous double-pumped (2x) Address Source synchronous quad-pumped (4x) Data C0 - C4 low power states supported Single SODIMM socket memory, up to 2 GB of non-ECC, 400/533 MHz DDR2 Intel(R) 945GSE Express Graphic Memory Controller Hub and Intel(R) I/O Controller Hub 7 Mobile (ICH7-M) AMIBIOS(R)8 with CMOS backup in 8 Mbit SPI BIOS Supply voltages and CPU temperature Programmable timer ranges to generate RESET 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN) optionally configured as x4 Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I2C Video Chipset CRT Interface LVDS Interface TV-out Intel(R) Graphics Media Accelerator 950 integrated into 945GSE GMCH supporting dual independent displays Analog CRT support up to 1600 x 1200 Single / Dual channel 18-bit (optional 24-bit on carrier through SDVO) NTSC/PAL up to 1024x768 resolution supported, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Chipset IDE (PATA) SATA USB Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Input Power Power States Power Consumption Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications Extended Support PCIe x1 Realtek RTL8111C 10/100/1000 Mbps 1-19 0C to 60C -20C to 80C Up to 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor, 95 mm x 125 mm CE, FCC Operating Systems LAN Chipset Interface AT mode (12 V) and ATX mode (12 V and 5 Vsb) Supports S0, S1, S3, S4, S5 9 W typical (with AtomTM N270 and 1 GB memory) Mechanical and Environmental Standard Support Integrated on Intel(R) I/O Controller Hub 7 Mobile (ICH7-M) HDA (Azalia) or AC'97 codec on carrier Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Audio Chipset Audio Codec Intel(R) ICH7-M Single IDE channel with UDMA100 with optional 512MB - 8GB IDE-based Solid State Disk Two port SATA 1.5 Gb/s Up to eight ports USB 2.0 http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32-bit Windows(R) Vista 32-bit Linux(R) 2.6.x Embedded XP BSP WinCE BSP Linux(R) 2.6.x BSP AIDI Library for Win32, WinCE and Linux(R) Functional Diagram CPU AtomTM N270 FSB 533 MHz GMCH Channel A (R) Intel 945GSE CRT Analog VGA TV-out SDTV HDTV Graphic Core 250 MHz LVDS dual 18-bit LVDS DDR-2 Memory Controller DDR2 533 SODIMM socket up to 2 GB Single channel SDVO DMI AB Audio GbE LAN Realtek RTL8111C PCIe x1 port 3 PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) Four PCIe x1 lanes ICH CD SDVO HDA Audio Solid State Drive Intel(R) ICH7-M 512MB up to 8 GB PATA 1x IDE I2 C SATA_0/1 2x SATA USB_0/1/2/3/4/5/6/7 8x USB 2.0 SMBus RTC SPI LPC BC SMBus GPIO PCI 33 MHz, v2.3 PCI TPM LM87 GPIO BIOS LPC header LPC Ordering Information Modules Accessories Model Number Description/Configuration Express-AT-N270 COM ExpressTM module with Intel(R) AtomTM N270 processor at 1.6 GHz Express-AT-N270-4G COM ExpressTM module with Intel(R) AtomTM N270 processor at 1.6 GHz 4GB SSD Solid State Disk Model Number Description/Configuration Heat Spreaders HTS-CAT-B Heatspreader for Express-AT (BGA CPU) with threaded standoffs Passive Heatsinks THS-CAT-B Low Profile Heatsink for Express-AT (BGA CPU) with threaded standoffs 1-20 Express-IA533 COM ExpressTM Module with Intel(R) Pentium(R) M Processor and 915GME/ICH6-M Chipset Features Computer-On-Modules Intel(R) Pentium(R) M Processor up to 2.1 GHz Intel(R) 915GME Express chipset Dual-Channel DDR2 533 MHz Three PCI Express(R) x1 lanes and one PCI Express(R) x16 Graphics lane Onboard Gigabit Ethernet SATA, USB 2.0, LVDS, SDVO Specifications Multi I/O Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses Socket 479 type Intel(R) Pentium(R) M 760, 2.0 GHz, with 2MB L2 cache Intel(R) Pentium(R) M 745, 1.8 GHz, with 2MB L2 cache BGA type Intel(R) Pentium(R) M 738, 1.4 GHz, with 2MB L2 cache Intel(R) Celeron(R) M 373, 1.0 GHz, with 1MB L2 cache 400/533 MHz DDR2, non-ECC, unbuffered Channel A: SO-DIMM socket for DDR2 memory, max 1 GB Channel B: soldered DDR2 memory, max 512 MB Intel(R) 915GME Express Graphic Memory Controller Hub and Intel(R) I/O Controller Hub 6 Mobile (ICH6-M) Phoenix AWARD BIOS in 1 MB FWH with console redirection and CMOS EEPROM backup Supply voltages and CPU temperature Programmable timer ranges to generate RESET Four PCI Express x1 lanes (one occupied by GbE LAN) Six 32-bit PCI 2.3 Masters at 33/66 MHz Low Pin Count (LPC) interface for Super I/O on carrier SMBus 2.0 interface support Video Chipset 915GME GMCH integrated chipset supports dual independent displays CRT Interface Analog CRT support up to 2048 x1536 LVDS Interface Dual channel 18-bit Graphic Expansion busses One PCI Express(R) x16 Graphics port Two Serial DVO ports (multiplexed with PCI Express(R) x16) Audio Chipset Audio Codec Integrated on Intel(R) ICH6-M Optional AC'97 codec on carrier Chipset IDE (PATA) SATA USB Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Chipset Interface Input Power Power States Power Consumption AT mode (12 V) and ATX mode (12 V and 5 Vsb) Supports S0, S1, S3, S4, S5 18 W typical (with Pentium(R) M 738 and 1 GB memory) Mechanical and Environmental Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications 0C to 60C -20C to 80C Up to 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Basic form factor, 95 mm x 125 mm CE, FCC Operating Systems Standard Support Yukon-EC 88E8053 PCIe Gigabit Ethernet Controller Triple speed 10/100/1000BASE-T IEEE 802.3 compliant with fully integrated ASF 2.0 functionality 1-21 Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Extended Support LAN Intel(R) ICH6-M One Ultra ATA 100/66/33 IDE port Two SATA 1.5 Gb/s ports Up to eight USB 2.0 ports, supports legacy KB / Mouse http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32-bit Linux(R) 2.6.x Embedded XP BSP Linux(R) 2.6.x BSP AIDI Library for Win32 and Linux(R) Functional Diagram CPU Celeron(R) M Pentium(R) M SMT FCBGA or socket FCPGA FSB 400 /533 MHz GMCH Intel(R) 915GME Channel A DDR-2 Memory Controller VGA CRT Channel B SODIMM Socket DDR2 533 soldered onboard PCIe x16 Gfx PCIe x1 or 2x SDVO LVDS 2x 18-bit LVDS DDR2 400/533 DMI Gigabit Ethernet Marvell Yukon 88E8053 ICH6-M AC97 CD AB PCIe x16 (multiplexed) GPIO RTC PORT 3 PORT 2 four ports PCI-E x1 PORT 1 single PATA PORT 0 2x SATA SATA1 SATA0 8x USB 2.0 LPC IDE0 PCI PCI 33 MHz v2.3 Monitor Temp Voltage EEPROM CMOS Backup Dual Watchdog SMBus/I2C BIOS LPC Ordering Information Accessories Modules Model Number Description/Configuration Model Number Express-IA533-S/0 COM Express module with socket for Intel(R) Celeron(R)/ Pentium(R) M processor Heat Spreaders Express-IA533-760/0 COM Express module with Intel Pentium(R) M 760 at 2.0GHz Express-IA533-745/0 COM Express module with Intel Pentium(R) M 745 at 1.8GHz Passive Heatsinks Express-IA533-738/0 COM Express module with Intel Penium(R) M 738 at 1.4GHz THS-IA533-B Express-IA533-373/0 COM Express module with Intel Celeron(R) M 373 at 1GHz Note: All models optional soldered memory HTS-IA533-B Description/Configuration Heatspreader for Express-IA533 (BGA CPU) with threaded standoffs Low Profile Heatsink for Express-IA533 (BGA CPU) with threaded standoffs Heatsink with Active Cooling THSF-IA533-S High Performance Heatsink with Fan for Express-IA533 (socket CPU) with threaded standoffs 1-22 Express-LPC Compact COM ExpressTM Module with Single/Dual Core Intel(R) AtomTM Processor and ICH8M Chipset Features Computer-On-Modules Single/Dual Core AtomTM processor at 1.8 GHz Intel(R) I/O Controller Hub 8 Mobile Up to 4 GB DDR3 SDRAM at 800 MHz Five free PCIe x1 lanes (optional PCIe x4) CRT and LVDS support SATA 3 Gb/s, IDE (PATA), Gigabit LAN, USB 2.0 DDR3 Specifications Multi I/O and Storage Core System CPU Memory Chipset L2 Cache BIOS Hardware Monitor Debug Interface Embedded Features Expansion Busses Intel(R) AtomTM Processor N455: Single Core Intel(R) AtomTM processor 1.66 GHz at 6.5 W D425: Single Core Intel(R) AtomTM processor 1.80 GHz at 10 W D525: Dual Core Intel(R) AtomTM processor 1.80 GHz at 13 W N570: Dual Core Intel(R) AtomTM processor 1.66 GHz at 8.5 W Dual SODIMM sockets support up to 4 GB of non-ECC 667/800 MHz DDR3 memory Intel(R) I/O Controller Hub 8 Mobile (ICH8-M) 1 MB for D525, 512KB for N455 & D425 AMIBIOS(R) 8 with CMOS backup in 16 Mbit SPI BIOS supports SPI BIOS on carrier (COM.0 R2.0) Supply voltages and CPU temperature XDP SFF-26 extension for ICE debug Instant on with Intel Bootloader support, OEM BIOS settings, Board Info & Statistics, ACPI 3.0, Smart Battery Management support, Watchdog with programmable timer ranges 6 PCI Express x1: 0/1/2/3/4 are free, 5 is occupied by GbE; 0/1/2/3 x1 can be optionally configured as 1 x4 32-bit PCI: PCI rev. 2.3 at 33MHz, supporting 4 bus masters LPC bus, SMBus (system), I2C (user) Video GPU Core Integrated Video Feature Support CRT Interface LVDS Interface Integrated in CPU with Gen3.5+ GFX Core and render core frequency at 200 MHz (N455) and 400 MHz (D425/D525) Intel(R) Dynamic Video Memory Technology 4.0 support DirectX 9 compliant Pixel Shader v2.0 400 MHz render clock frequency 2 display ports: LVDS and RGB Intel(R) Clear Video Technology MPEG2 Hardware Acceleration, ProcAmp Analog RGB display, resolution up to 2048x1536@ 60 Hz Single 18-bit channel, resolution up to 1366x768, 18bpp Integrated in Intel(R) I/O Controller Hub 8 Mobile (ICH8M) On carrier (ALC888) LAN Chipset Interface Intel(R) 82583V Gigabit Ethernet Controller 10/100/1000 Mbps Ethernet 1-23 Intel(R) I/O Controller Hub 8 Mobile (ICH8M) Supports up to eight ports USB 2.0 Three ports SATA 3 Gb/s Single IDE channel (UDMA100) with optional 4GB ~ 8GB IDE-based Solid State Drive Super I/O BIOS support for legacy free or legacy with two types of Super I/O (Winbond W83627HG and W83627DHG) TPM Chipset Type Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Input Power Power States Power Consumption Smart Battery Support AT mode (12 V +/- 5%) and ATX mode (12 V and 5 Vsb +/- 5%) Supports S0, S1, S3, S4, S5 10 W (with N455 CPU and 2 GB memory typical) Yes Mechanical and Environmental Operating Temp Storage Temp Humidity Shock Vibration Compatibility Certification 0C to 60C -20C to 80C 90% at 60C 15G peak-to-peak, 11ms duration, non-operating Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, COM.0 R2.0 Compact form factor 95 mm x 95 mm CE, FCC Operating Systems Audio Chipset Audio Codec Chipset USB SATA IDE (PATA) Standard Support Windows(R) XP(e) / Vista, Windows(R) 7 Linux(R) Extended Support (BSP) Embedded XP / 2009 support package Linux(R) 2.6.x BSP VxWorks 6.x BSP AIDI Library for Windows(R) and Linux(R) http://www.adlinktech.com/Computer-on-Module Functional Diagram Atom AB 18-bit LVDS N455 D425 D525 N570 SODIMM 1 512MB ~ 2GB DDR3 SODIMM 2 512MB ~ 2GB DDR3 XDP SFF-26 5x PCIe x1 (port 0~4) GbE LAN 82583V PCI Bus PCIe x1 (port 5) CD CRT HDA Audio ICH8M 3x SATA (port 0~2) PATA IDE 8x USB LPC bus 4x GPI 4x GP0 SPI GPIO PCA9535 SPI BIOS SMBus 2 IC BC SPI Ordering Information Accessories Modules Model Number Description/Configuration Express-LPC-N455 Compact COM ExpressTM Module with Intel AtomTM Single Core Low Voltage Processor N455 at 1.66 GHz Heat Spreaders Express-LPC-D425 Compact COM ExpressTM Module with Intel(R) AtomTM Single Core Processor D425 at 1.80 GHz Passive Heatsinks Express-LPC-D525 Compact COM ExpressTM Module with Intel(R) AtomTM Dual Core Processor D525 at 1.80 GHz Express-LPC-N570 Compact COM ExpressTM Module with Intel(R) AtomTM Dual Core Low Voltage Processor N570 at 1.66 GHz Model Number (R) HTS-LPC-B THS-LPC-B Description/Configuration Heatspreader for Express-LPC with threaded standoffs Low Profile Heatsink for Express-LPC with threaded standoffs Active Heatsinks THSF-LPC-B Heatsink with Fan for Express-LPC with threaded standoffs 1-24 Express-ATC Compact COM ExpressTM Module with Intel(R) AtomTM Processor N270 and 945GSE/ICH7-M Chipset Features Computer-On-Modules Intel(R) AtomTM processor N270 at 1.6 GHz Intel(R) 945GSE/ICH7-M chipset SODIMM for up to 2 GB DDR2 at 533 MHz Three PCIe x1 (optional 4 x1 or 1 x4) High resolution CRT, single/dual 18-bit LVDS and TV-out (SDTV and HDTV) SATA, IDE (PATA), Gigabit LAN, USB 2.0 Optional 1GB ~ 8GB IDE-based Solid State Drive Specifications Multi I/O Core System CPU Memory Chipset BIOS Hardware Monitor Watchdog Timer Expansion Busses BGA type Intel(R) AtomTM N270, FSB 533, 1.6 GHz with 512 KB L2 cache, 2.5 W, on-die primary 32-kB instruction cache and 24 KB write-back data cache Hyper-Threading support (2-threads) Advanced gunning transceiver logic (AGTL+) bus driver technology Enhanced Intel SpeedStep(R) Technology Source synchronous double-pumped (2x) Address Source synchronous quad-pumped (4x) Data C0 - C4 low power states supported Single SODIMM socket up to 2 GB of non-ECC, 400/533 MHz DDR2 memory Intel(R) 945GSE Express Graphic Memory Controller Hub and Intel(R) I/O Controller Hub 7 Mobile (ICH7-M) AMIBIOS(R)8 with CMOS backup in 8 Mbit SPI BIOS Supply voltages and CPU temperature Programmable timer ranges to generate RESET 4 PCI Express x1 (0/1/2 are free, 3 is occupied by GbE LAN) optionally configured as one PCIe x4 Serial Digital Video Out (SDVO) 32-bit PCI 2.3 at 33MHz, supporting 4 bus masters LPC, SMBus, I2C Video Chipset CRT Interface LVDS Interface TV-out Intel(R) Graphics Media Accelerator 950 integrated into 945GSE GMCH supporting dual independent displays Analog CRT support up to 1600 x 1200 Single / Dual channel 18-bit (optional 24-bit on carrier through SDVO) NTSC/PAL up to 1024x768 resolution supported, HDTV 480p/720p/1080i/1080p modes supported (without Macrovision) Chipset IDE (PATA) SATA USB Super I/O Connected to LPC bus on carrier if needed TPM Chipset Type Input Power Power States Power Consumption Operating Temp. Storage Temp. Humidity Shock Vibration Form Factor Certifications Extended Support PCIe x1 Realtek RTL8111C 10/100/1000 Mbps 1-25 0C to 60C -20C to 80C Up to 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis COM ExpressTM Type 2, Compact form factor, 95 mm x 95 mm CE, FCC Operating Systems LAN Chipset Interface AT mode (12 V) and ATX mode (12 V and 5 Vsb) Supports S0, S1, S3, S4, S5 9 W typical (with AtomTM N270 and 1 GB memory) Mechanical and Environmental Audio Integrated on Intel(R) I/O Controller Hub 7 Mobile (ICH7-M) HDA (Azalia) or AC'97 codec on carrier Infineon SLB9635TT1.2 TPM 1.2 Power Specifications Standard Support Chipset Audio Codec Intel(R) ICH7-M Single IDE channel with UDMA100 with optional 1GB ~ 8GB IDE-based Solid State Drive Two ports SATA 1.5 Gb/s Up to eight ports USB 2.0 http://www.adlinktech.com/Computer-on-Module Windows(R) XP 32-bit Windows(R) Vista 32-bit Linux(R) 2.6.x Embedded XP BSP WinCE BSP Linux(R) 2.6.x BSP AIDI Library for Win32, WinCE and Linux(R) Functional Diagram CPU AtomTM N270 FSB 533 MHz GMCH Channel A (R) Intel 945GSE CRT Analog VGA TV-out SDTV HDTV Graphic Core 250 MHz LVDS dual 18-bit LVDS DDR-2 Memory Controller DDR2 533 SODIMM socket up to 2 GB Single channel SDVO DMI AB Audio GbE LAN Realtek RTL8111C PCIe x1 port 3 PCIe x1 lane 0/1/2 (optional 0/1/2/3 for x4) Four PCIe x1 lanes ICH CD SDVO HDA Audio Solid State Drive Intel(R) ICH7-M 512MB up to 8 GB PATA 1x IDE I2 C SATA_0/1 2x SATA USB_0/1/2/3/4/5/6/7 8x USB 2.0 SMBus RTC SPI LPC BC SMBus GPIO PCI 33 MHz, v2.3 PCI TPM LM87 GPIO BIOS LPC header LPC Ordering Information Modules Accessories Model Number Description/Configuration Express-ATC-N270 Compact COM ExpressTM module with Intel(R) AtomTM N270 processor at 1.6 GHz Express-ATC-N270-4G Compact COM ExpressTM module with Intel(R) AtomTM N270 processor at 1.6 GHz with 4GB SSD Solid State Disk Express-ATC-N270-8G Compact COM ExpressTM module with Intel(R) AtomTM N270 processor at 1.6 GHz with 8GB SSD Solid State Disk Model Number Description/Configuration Heat Spreaders HTS-ATC-B Heatspreader for Express-ATC (BGA CPU) with threaded standoffs Passive Heatsinks THS-ATC-B Low Profile Heatsink for Express-ATC (BGA CPU) with threaded standoffs 1-26 Express-BASE COM ExpressTM Reference Carrier Board in ATX Form Factor Features Specifications Functional Diagram Form Factor Core Module Interface Dimensions Expansion Busses LPT1 PICMG COM ExpressTM Revision 2.0 Supports Type 1 and Type 2 Basic form factor modules 305 mm x 244 mm (AT/ATX) Two 32-bit PCITM v2.3 slots Five PCI Express(R) x1 slots One PCI Express x16 / SDVO slot LPC bus header COM1 (R) W83627HF Secondary BIOS PCI Express x16 LPC (can also be used for SDVO ADD2 card) Debug Header Secondary BIOS POST Code Display IDE Connector PATA Single Channel AB Onboard diagnostics for BIOS POST code data and address on LPC bus Allows single step BIOS execution Onboard sockets for secondary LPC & SPI BIOS KB/MS FDD PCI Express x16 onboard slot BIOS / Debug POST LEDs COM2 Primary Super I/O CD Computer-On-Modules Five PCI Express(R) x1 slots PCI Express x16 Graphic slot / SDVO slot Two Legacy 32-bit PCI slots Dual LPC BIOS, single step execution LPC Super I/O (enable/disable) CF Card or Express Card Integrated POST Code ATX / AT or Battery Powered SATA 4 onboard SATA headers Audio Codec Audio on Rear I/O Gigabit Ethernet Rear I/O Active Components Audio Super I/O ALC880 High Definition Audio Codec Winbond WF83627HG on LPC PATA IDE SATA IDE PCIe Mini Card LAN USB 2.0 Serial Port Parallel Port FDD Smart Battery KB/Mouse Digital I/O Feature Connectors Miscellaneous Power Switches 1-27 LVDS headers PCI 2 slot Connectors COM ExpressTM CRT LVDS Audio CRT VGA Rear I/O Two x 220-pin (Type 2) DB15 on Rear I/O panel for VGA/CRT displays Two onboard headers supporting dual channel LVDS Mic/Line-in/Speakers on rear I/O panel, Mic/Line-in on header, S/PDIF on header One 40-pin header Four SATA connectors One socket onboard 10/100/1000BASE-T compatible RJ45 on rear I/O panel Four + two on rear I/O panel, two on header and one through Mini Express Card One DB-9 on rear I/O panel, one header onboard One DB-25 on rear I/O panel 34-pin header One header for Smart Battery management communications (connects to ADLINK BattMan board) Two 6-pin mini DIN (on rear I/O panel) 8-pin header SMBus, I2C, module control signals, flat panel control signals Reset, Power LED, HDD LED, Buzzer Standard ATX connector Onboard RESET button and ATX mini switch 32-bit PCI Six PCI Express x1 Express Card Eight USB PP CCPP P I I CC C EEI I I 11EE 1E 15 6x USB on Rear I/O 1x USB on header Ordering Information Carrier Model Number Description/Configuration Express-BASE COM ExpressTM Reference Carrier Board in ATX form factor COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE product webpage at www.adlinktech.com http://www.adlinktech.com/Computer-on-Module Express-BASE6 COM ExpressTM Type 6 Reference Carrier Board in ATX Form Factor Features Seven PCI Express x 1 slots PCI Express x16 / SDVO slot Supports three Digital Display Interfaces (DDI) with HDMI/DVI/DisplayPort output LPC based Super I/O Dual BIOS (SPI and LPC) Conforms to COM ExpressTM Carrier Design Guide Specifications Functional Diagram Form Factor Core Module Interface Dimensions Expansion Busses PICMG COM ExpressTM Revision 2.0 Supports Type 6 Basic form factor modules 305 mm x 244 mm (ATX) Seven PCI Express x1 slots One PCI Express Mini Card slot One PCI Express x16 / SDVO slot 34-pin Header 8-pin Header BIOS / Debug POST LEDs Secondary BIOS Onboard diagnostics for BIOS POST code data and address on LPC bus Onboard sockets for secondary LPC & SPI BIOS Realtek ALC888 High Definition Audio Codec Winbond WF83627DHG on LPC bus I2C to GPIO bridge PCA9535 Flat Panel Control Audio SATA PCIe Mini Card LAN USB 2.0 Serial Port Smart Battery LPC Debug KB/Mouse Feature Connectors Miscellaneous Flat Panel Control signals RJ45 Transformer SATA SATA0 SATA SATA1 SATA SATA2 SATA SATA3 Audio Codec ALC888 S/PDIF out PS/2 KB/MS Winbond W83627DHG USB0 USB 2.0/3.0 USB1 USB 2.0/3.0 USB2 USB 2.0/3.0 USB3 USB 2.0/3.0 USB4 4x USB5 USB6 USB7 USB 2.0 PCIe lane 0 PCIe x1 PCIe lane 1 PCIe x1 PCIe lane 2 PCIe x1 PCIe lane 3 PCIe x1 PCIe lane 4 PCIe x1 PCIe lane 5 PCIe x1 LPC LPC Header Two x 220-pin (Type 6) DB15 on Rear I/O panel for VGA/CRT display Onboard 34-pin header Supports three DDI ports to HDMI/DVI/DIsplayPort output by adapter card (PCIe x16 slot with proprietary pinout) Onboard 8-pin header Mic/Line-in/Line-out on I/O panel Four SATA connectors One socket onboard 10/100/1000BASE-T compatible RJ45 on I/O panel Four USB 2.0 on I/O panel, Four USB 2.0/3.0 on I/O panel One DB-9 on I/O panel One onboard 10-pin header One 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board) Onboard 20-pin header Two 6-pin mini DIN (on rear I/O panel) SMBus, I2C, module control signals Reset, Power LED, HDD LED, Buzzer LAN HDA Super I/O COM1 COM2 Connectors COM ExpressTM CRT LVDS Digital Display Interface Dual Channel LVDS Audio 7.1 Channel Active Components Audio Super I/O Digital I/O Analog VGA (CRT) DB15 (R) PCIe x1 PCIe lane 6 Express Card PCIe lane 7 DDI1 4GPI - 4GPO Header SMBus Header DDI3 I2C EEPROM 2 DDI2 PCA9535 Header Header (PCI x16 w/ proprietary pinout) GPIO Header nd DDI Adapter Card slot PCIe x16 slot PCIe x16 Feature / Control Signals SPI BIOS SPI Ordering Information Modules Model Number Description/Configuration Express-BASE6 COM Express Type 6 Reference Carrier Board in ATX form factor COM Express Carrier Design Guide Provides detailed information on designing your own custom carrier board for COM Express modules. Download from the Express-BASE6 product webpage at www.adlinktech.com 1-28 Starter Kit - COM Express This Computer-on-Module Starter Kit gets you going with Carrier Board Design and Software Verification in no time Includes Computer-On-Modules COM ExpressTM Module CPU, Memory Express-BASE Reference Carrier Board Thermal Solution (heatspreader and heatsink) Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, Drivers, BSPs, Libraries The Starter Kit consists of a COM ExpressTM core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, CRT, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included. Contents Optional Items Standard Items * Express-BASE reference carrier board * COM ExpressTM module of your choice * Accessory kit: * Socket-type CPU of your choice - IDE cable * Memory of your choice - SATA cable * Thermal solution of your choice (heatspreader, heatsink) - TV out cable - CF adapter - PCI 2-slot riser card - USB Stick with documentation, drivers, libraries, and BSP for Linux(R), WinCE, Embedded XP - Carrier Design Guide and product manuals COM Express Module 1-29 Carrier Board Memory http://www.adlinktech.com/Computer-on-Module Heatsink PSU Accessories How to order Starter Kit - COM Express ADLINK provides a "tailor made" Starter Kit service. We let you choose your preferred core module and thermal solution to suit your specific application development needs. Select a core module, memory, thermal solution, and CPU (for socket type) according to your needs Contact an ADLINK sales representative in your region Get the specific part number for your starter kit ADLINK also provides a set of Engineering Test Tools to save you time and expedite your application development BattMan Smart Battery Management Reference System Flat Panel Transfer Board Please refer to page 9-39 for detailed information Please refer to page 9-39 for detailed information 1-30 nanoX-TC Ultra size COM ExpressTM Type 10 Pinout Compatible Module with Intel(R) AtomTM Processor E6xx and EG20T PCH Features Computer-On-Modules Intel(R) AtomTM Processor E6xx from 600 MHz up to 1.6 GHz Up to 2 GB soldered DDR2 SDRAM at 800 MHz 24-bit LVDS and SDVO support 4x PCI Express x1 lanes Optional Intel(R) Platform Controller Hub EG20T for USB, LAN, SDIO, Serial & CAN bus and SATA COM ExpressTM COM.0 R2.0 Type 10 Pinout Ultra form factor 84 x 55 mm Operation at 0C to +70C or -40C to +85C Specifications Multi I/O and Storage Core System CPU Intel(R) AtomTM E680 / E680T*, 1.6 GHz, 3.9 W TDP Chipset Integrated in Intel(R) PCH EG20T Intel AtomTM E660 / E660T*, 1.3 GHz, 3.3W TDP USB Six USB 1.1/2.0 host ports and one USB 1.1/2.0 client port Intel(R) AtomTM E640 / E640T*, 1.0 GHz, 3.3W TDP SATA Two ports supporting SATA 1.5 Gb/s and 3 Gb/s Intel(R) AtomTM E620 / E620T*, 600 MHz, 2.7W TDP SDIO port (* T versions support -40C to +85C wide operating temperature range) SDIO/MMC supporting SDHC speed class 6 (shared with GPIO) SDIO storage TBD Serial and CAN One RS-232 (RX/TX) and one CAN (AX/RX) port (optional 2x RS-232 w/o CAN) (R) All processors support Intel(R) Hyper-Threading and Intel(R) Virtualization Technology L2 cache 512 KB on all processors Memory Soldered 512 MB, 1 or 2 GB DDR2 at 800 MHz LAN BIOS License-free bootloader or AMI UEFI BIOS GbE MAC Integrated in Intel(R) EG20T PCH Hardware Monitor Supply voltages and CPU temperature PHY Realtek RTL8211CL Debug Interface XDP SFF-26 extension for ICE debug Speed 10/100/1000 Mbps Embedded Features Instant on with Intel Bootloader support, OEM BIOS settings, Board Info & Statistics, ACPI 3.0, Smart Battery Management support, Watchdog with programmable timer ranges Power Specifications Expansion Busses 4 PCI Express x1 (0/1/2/3, port 3 is optionally used for EG20T PCH; no PCIe x4 support) LPC Bus, SMBus (system) , I2C (user) 4 GPI and 4 GPO (shared with SDIO on optional EG20T) SPI (supports BIOS only) Input Power 4.75 V - 21 V wide range, supports AT mode and ATX mode (with additional 5 Vsb) Power States Supports S0, S1, S3, S4, S5 Power Consumption 5W at 5V typical, 3W idle Smart Battery Support Yes Mechanical and Environmental Video 2D/3D Graphic Engine Integrated in Intel AtomTM Processor E6xx Decoding MPEG2, MPEG4, VC1, WMV9, H.264 and DivX Encoding MPEG4, H.264 (baseline at L3) LVDS Interface Single channel 18- or 24-bit pixel color depths with maximum resolution of up to 1280x768 @ 60 Hz. Pixel clock rate between 19.75 MHz (minimum) and 80 MHz (maximum). SDVO Serial digital video output supporting devices for DVI, TV-out, analog CRT. Maximum resolution of up to 1280x1024 @ 85 Hz and pixel clock rate up to 160 MHz. (R) Operating Temp Storage Temp Humidity Shock Vibration Compatibility Mechanical Certification 0C to 70C or industrial grade -40C to 85C -20C to 80C or industrial grade -40C to 85C 90% at 60C 15G peak-to-peak, 11ms duration, non-operation Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis PICMG COM ExpressTM COM.0 R2.0 Type 10 Ultra size 84 mm x 55 mm (3.3" x 2.17") CE, FCC, HALT Operating Systems Audio High Definition Audio Integrated in Intel AtomTM Processor E6xx Standard Support Characteristics Multi-channel audio stream, 32-bit sample depth, sample rate up to 192 kHz Extended Support (BSP) Embedded XP Audio Codec (R) Windows(R) XP / Windows(R) 7 Linux(R) On carrier (standard support for ALC888) WinCE 6.0 Linux(R) / Moblin VxWorks 6.x QNX AIDI Library 1-31 http://www.adlinktech.com/Computer-on-Module Functional Diagram Soldered Memory 512 MB ~ 2 GB DDR2 BIOS SPI LPC bus Intel(R) AtomTM Processor 18/24-bit LVDS SDVO HDA Audio XDP SFF-26 E6xx(T) 3x PCIe x1 (port 1~3) PCIe x1 (port 0) PCIe x1 (port 0) CAN bus (Ax/Rx) UART (Tx/Rx) 2x SATA (port 0,1) 6x USB Host 1x USB Client Intel(R) Platform Controller Hub LAN PHY RTL8211CL Switch EG20T SDIO/MMC port 0 4x GPI 4x GP0 GPIO PCA9535 SMBus 2 IC BC Ordering Information Modules Accessories Model Number Description nanoX-TC-E680-1G Intel(R) AtomTM E680 processor at 1.6GHz with PCH EG20T nanoX-TC-E680T-1G Intel(R) AtomTM E680T processor at 1.6GHz with PCH EG20T, Industrial grade temperature range from -40C to 85C nanoX-TC-E660-1G Intel(R) AtomTM E660 processor at 1.3GHz with PCH EG20T nanoX-TC-E660T-1G Intel(R) AtomTM E660T processor at 1.3GHz with PCH EG20T, Industrial grade temperature range from -40C to 85C nanoX-TC-E640-1G Intel(R) AtomTM E640 processor at 1.1GHz with PCH EG20T nanoX-TC-E640T-1G Intel(R) AtomTM E640T processor at 1.1GHz with PCH EG20T, Industrial grade temperature range from -40C to 85C nanoX-TC-E620-1G Intel(R) AtomTM E620 processor at 600 MHz with PCH EG20T nanoX-TC-E620T-1G Intel(R) AtomTM E620T processor at 600 MHz with PCH EG20T, Industrial grade temperature range from -40C to 85C Model Number Description Heat Spreaders HTS-nXTC-B Heatspreader for nanoX-TC with threaded standoffs for bottom mounting HTS-nXTC-BT Heatspreader for nanoX-TC with throughole standoffs for top mounting Passive Heatsinks THS-nXTC-B Multidirectional Heatsink for nanoX-TC with threaded standoffs for bottom mounting 1-32 nanoX-ML Ultra size COM ExpressTM Type 1 Pinout Compatible Module with Intel(R) AtomTM Processor Z5xx and US15W Chipset Features Computer-On-Modules Intel(R) AtomTM Processor Z530/Z510 Intel(R) System Controller Hub US15W One PCIe x1 (opt. 2 without LAN) 18/24-bit LVDS and SDVO GbE LAN, SATA, USB 2.0, SDIO, LPC AMIBIOS(R)8 BIOS Solid State Disk: 1 GB up to 8 GB Ultra Compact 84 x 55 mm footprint Specifications Multi I/O Core System Intel(R) AtomTM processor Z530 at 1.6 GHz with 533 MHz FSB, 2.3 watts TDP, supports Hyper-Threading IDE (PATA) Single channel IDE with UDMA (33/66/100) connects to onboard Solid State Disk of 1 GB up to 8 GB Intel(R) AtomTM processor Z510 at 1.1 GHz with 400 MHz FSB, 2.0 watts TDP SATA PATA to SATA bridge Memory Soldered 512/1024 MB non-ECC, unbuffered 400/533 MHz DDR2 USB Chipset Intel(R) System Controller Hub US15W BIOS AMIBIOS(R)8 with CMOS backup in 8 Mbit LPC Flash Power Specifications Hardware Monitor Supply voltages and CPU temperature Input Power Watchdog Timer Programmable timer ranges to generate RESET 4.75V ~ 14V wide range input support, with optional 5Vsb for ATX support Expansion Busses Two PCI Express x1 Power States Supports S0, S1, S3, S4, S5 LPC bus Power Consumption 5 W (with Atom Z510 and 512 MB memory, typical) CPU SMBus / I2C One SATA port Eight USB 2.0 ports capable of transfers up to 480 MB/s; one port optionally configurable as USB client Mechanical and Environmental Video Chipset GMA 500 integrated on Intel(R) on System Controller Hub US15W Features Ultra low power integrated 3D graphics core with full HD HW video decode engine and dual independent display support CRT Interface Analog VGA not supported LVDS Interface Single channel 18/24-bit at 25~112 MHz SDVO May be used for any external display device (HDMI/DVI, analog TV, VGA/CRT and LVDS); includes EDID and EDID-less support, and a 160 MHz pixel clock Audio Operating Temp. 0C to 60C Storage Temp. -20C to 80C Humidity 10% to 90%, storage: 5% to 95% (non condensing) Shock 15G peak-to-peak, 11ms duration, non-operation Vibration Non-operating: 1.88 Grms, 5-500 Hz, each axis Operating: 0.5 Grms, 5-500 Hz, each axis Compatibility PICMG COM ExpressTM COM.0 Type 1 Mechanical Ultra size 84 mm x 55 mm (3.3" x 2.17") Certifications CE, FCC Operating Systems Chipset Integrated on Intel(R) System Controller Hub US15W Type Supports Intel(R) High Definition Audio codec on carrier board Standard Support Windows(R) XP 32-bit Windows(R) Vista 32-bit Linux(R) 2.6.26 and up LAN Extended Support Embedded XP BSP Chipset Realtek RTL8111C PCI Express Gigabit Ethernet Controller WinCE BSP Interface 10/100/1000 Mbps with Wake-on-LAN and Alert on LAN support Linux(R) 2.6.x BSP 1-33 http://www.adlinktech.com/Computer-on-Module AIDI I2C Library for Win32, WinCE and Linux(R) Functional Diagram Intel(R) AtomTM Z510/Z530 FSB 400/533 MHz DDR2 400/533 DDR-2 Memory Controller LAN GbE soldered SDVO Intel(R) US15W SDVO RT8111C Graphics Core 200 MHz LVDS 18/24-bit HDA Audio PATA Slave Master LPC SDIO/ 8x MMC USB 2.0 SMBus I2C BC LPC PCIe x1, lane 0 LAN EIDE PATA 1x SSD Solid State Drive 1 GB up to 8 GB PATA to SATA Bridge SATA two PCIe x1 Ordering Information Modules Accessories Model Number Description nanoX-ML-51/512-0 Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM processor Z510 at 1.1 GHz and 512 MB DDR2 nanoX-ML-53/512-0 Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM processor Z530 at 1.6 GHz and 512 MB DDR2 nanoX-ML-51-512/4G Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM Processor Z510 at 1.1 GHz, 512 MB memory and 4 GB SSD storage Model Number Description Heat Spreaders HTS-nML-B Heatspreader for nanoX-ML (BGA CPU) with threaded standoffs Passive Heatsinks THS-nML-B Low profile Heatsink for nanoX-ML (BGA CPU) with threaded standoffs nanoX-ML-53-512/4G Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM Processor Z530 at 1.6 GHz, 512 MB memory and 4 GB SSD storage nanoX-ML-51-1024/4G Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM Processor Z510 at 1.1 GHz, 1GB memory and 4 GB SSD storage nanoX-ML-53-1024/4G Ultra COM ExpressTM Type 1 compatible module with Intel(R) AtomTM Processor Z530 at 1.6 GHz, 1GB memory and 4 GB SSD storage 1-34 nanoX-BASE COM ExpressTM Type 1 Reference Carrier Board with onboard PCIe-to-PCI Bridge Features Computer-On-Modules Six PCI Express(R) x1 (5 slots, 1 PCIe Mini Card slot) PCIe-to-PCI bridge, two PCITM slots SDVO ADD2 card slot LPC based Super I/O (enable/disable) SDIO/MMC support, multiplexed on GPIO Dual BIOS (both LPC and SPI) Compatible with PICMG(R) COM ExpressTM Carrier Design Guide Specifications Connectors Form Factor PICMG(R) COM ExpressTM Revision 1.0 COM ExpressTM Connector AB only, one 220-pin (Type 1) Supports Type 1 Basic and Ultra form factor modules LVDS Onboard 34-pin header Dimensions 305 mm x 240 mm (AT/ATX) Audio Mic/Line-in/Line-out on I/O panel Expansion Busses Five PCI Express(R) x1 slots SATA Two SATA connectors Two 32-bit PCITM v2.3 slots PCIe Mini Card One socket onboard (USB + PCIe x1) One PCI Express(R) Mini Card slot LAN 10/100/1000BASE-T compatible RJ45 on I/O panel One SDVO ADD2 slot USB 2.0 Five on I/O panel, one Mini-USB (client only) and one through PCIe Mini Card Serial Port Two DB-9 on I/O panel Parallel Port One header onboard One header for Smart Battery management communications (connects to ADLINK BattMan board) Core Module Interface LPC bus header BIOS / Debug POST LEDs Onboard diagnostics for BIOS POST code data and address on LPC bus Smart Battery Secondary BIOS Onboard sockets for secondary LPC & SPI BIOS KB/Mouse Two 6-pin mini DIN (on rear I/O panel) SDIO/MMC SD socket for bootable storage or function extension Active Components Feature Connectors SMBus, I2C, module control signals, flat panel control signals PCI Express Switch PLX PEX8505 switch with PCIE0 input from module Miscellaneous Reset, Power LED, HDD LED, Buzzer PCI Express to PCI Bridge PLX PEX8112 bridge with PCIe x1 input from PEX8505 switch Power Standard ATX connector Switches Onboard RESET button and ATX mini switch Super I/O Winbond WF83627DHG on LPC bus Audio Codec Realtek ALC888 High Definition Audio Codec Digital I/O I2C to GPIO bridge PCA9535 1-35 http://www.adlinktech.com/Computer-on-Module Functional Diagram USB0 USB1 Single Channel LVDS NC Flat Panel Control Signals USB3 SDVO USB4 Header PCIe x16 Slot Flat cable in 4-port USB RJ-45 & 2-port USB USB5 LAN USB2 SATA SATA0 SATA SATA1 Mini USB USB6 PCIe (x1) PCIE0 (x1) PCIe Switch HDA / AC'97 PCIe to PCI bridge GPIO / SDIO SDIO / MMC PEX 8112 PCIE1 (x1) Header PCIE2 (x1) SMBus Header Header PCIE3 (x1) GPIO PCA9535 EEPROM Header PCIe (x1) PCIe x16 Slot PCIe x1 Slot PCI PCI PCI Slot PCI Slot PCIe x1 Slot PCIe x1 Slot PCIe x1 Slot LPT1 I2C Header PCIe (x1) PCIe (x1) Audio Codec ALC888 AB PEX 8505 Audio 7.1 Channel PCI Express Mini Card Header Feature / Control Signals COM1 LPC Super I/O Winbond W83627DHG COM2 IrDA PS/2 KB/MS LPC 2nd LPC BIOS Ordering Information Carrier Model Number Description nanoX-BASE COM ExpressTM Type 1 Reference Carrier Board with onboard PCIe to PCI bridge 1-36 Starter Kit - nanoX This Computer-on-Module Starter Kit gets you going with Carrier Board Design and Software Verification in no time Includes Computer-On-Modules COM ExpressTM Type 1 core module Thermal solution (heatspreader or heatsink) nanoX-BASE Reference Carrier Board LVDS flat panel evaluation kit Schematics, Design Guide, and User Manuals ADLINK USB stick with Documentation, Drivers, BSPs, Libraries The nanoX Starter Kit consists of a COM ExpressTM Type 1 core module with ATX size reference carrier board that provides four PCI Express x1 slots, one PCI Express x16 slot (x1 link), two PCI slots, an SDVO/ADD2 slot, one PCIe Mini Card slot, one SDIO/MMC slot, USB 2.0, Gigabit LAN and Super I/O. ADLINK also provides additional development tools including a verified 10.1" LVDS panel, LVDS-to-TTL conversion board, ADD2 DVI card, power supply, thermal solution and cabling accessories. Contents Standard Items * Accessory kit: - LVDS flat panel cabling - SATA, SDVO, USB cables - Power cord - USB stick with documentation, drivers, libraries, and BSP for Linux, Embedded XP - Carrier Design Guide and product manuals * nanoX-BASE reference carrier board * 10.1" (1024 x 600) LVDS flat panel * SDVO to DVI adapter * Flat panel transfer board * ATX power supply Optional Items * COM Express Type 1 core module of your choice * Thermal solution of your choice (heatspreader or heatsink) COM Express Type 1/10 Module Carrier Board 1-37 Heatsink ADD2 LVDS Panel FPTB http://www.adlinktech.com/Computer-on-Module PSU Accessories How to order Starter Kit - nanoX ADLINK provides a "tailor made" Starter Kit service. We let you choose your preferred core module and thermal solution to suit your specific application development needs. Select a core module and thermal solution according to your needs Contact an ADLINK sales representative in your region Get the specific part number for your nanoX Starter Kit ADLINK also provides a set of Engineering Test Tools to save you time and expedite your application development BattMan Smart Battery Management Reference System LPC POST Debug Card Please refer to page 9-39 for detailed information Please refer to page 9-40 for detailed information 1-38 Engineering Test Tools BattMan Smart Battery Management Reference System Useful time saving tools to expedite your application development The BattMan Smart Battery Management Reference System supports two Smart Batteries and provides ATX power for COM Express mobile embedded systems. The BattMan system allows developers to easily implement battery power in COM Express based applications requiring high mobility. Computer-On-Modules Contents * BattMan module * Two Smart Batteries * Power adapter and cabling * USB disk with BattMan board reference schematic, drivers and documentation Ordering Information Flat Panel Transfer Board Model Number Description/Configuration StarterKit-Battman Smart Battery Reference Platform for COM ExpressTM modules (includes two Smart Batteries) The Flat Panel Transfer Board (FPTB) supports prototyping and verification of LVDS and TTL flat panel displays with Express-BASE and nanoX-BASE carrier boards and is equipped with an LVDS-toTTL converter to allow users to implement TTL displays with COM Express systems that support LVDS only. Onboard PWM circuitry supports backlight control for LVDS and TTL displays. Ordering Information Model Number Description/Configuration FPTB Flat Panel Transfer Board for LVDS-to-TTL signal conversion LCD 10.1" TFT HannStar 10.1" LVDS flat panel display (HSD100IFW1-A00) LVDS 30P to 34P+8P cable LVDS cable to connect HannStar HSD100IFW1-A00 LVDS flat panel display to FPTB, Express-BASE, or nanoX-BASE LVDS cable for FPTB FPTB LVDS-to-LVDS cable Note: Included in the Starter Kit - nanoX. PCIe x16 MXM Carrier Board ADLINK's PCIe x16 MXM carrier boards allow for discrete PCIe graphics expansion using a Mobile PCI Express Module (MXM). The MXM carrier board series supports MXM-II and MXM-III graphics modules, allowing developers to evaluate, prototype and verify MXM graphics modules before full integration into the custom carrier board design. Ordering Information 1-39 Model Number Description/Configuration MXM2CR PEG x16 MXM-II carrier board (w/o MXM graphics module) MXM3CR PEG x16 MXM-III carrier board (w/o MXM graphics module) MXM3-E4690 MXM-III module based on ATI RadeonTM E4690 GPU http://www.adlinktech.com/Computer-on-Module PCIe x16-to-two-x8 Adapter Card The ADLINK PCIe x16-to-two-x8 adapter card allows the use of two PCIe x8 add-on cards from a single PCIe x16 slot. Ordering Information LPC POST Debug Board Model Number Description/Configuration P16TO28 PCIe x16-to-two-x8 adapter card LPC POST debug board with secondary LPC BIOS and POST status LED. Can be easily connected to the LPC debug port on the Computer-on-Module to monitor BIOS POST status. A single step switch is provided for BIOS debug verification. Ordering Information COM-T6T2 Adapter Board COM Express Type 6 to Type 2 Conversion Model Number Description/Configuration LPC_DEBUG_2 LPC POST debug board with secondary LPC BIOS The COM-T6T2 adapter board allows COM Express Type 6 modules to be backwards compatible with Type 2 carrier boards. A SATAto-PATA converter and PCIe-to-PCI bridge are onboard to provide signal conversion to the required COM Express Type 2 interfaces. The SDVO port is rerouted to correspond with the Type 2 pin definition (no PCIe x16). Ordering Information T6-DDI Video Adapter Card COM Express Type 6 DDI to HDMI/DVI/DisplayPort Model Number Description/Configuration COM-T6T2 COM Express Type 6 to Type 2 adapter card (w/ SDVO) The T6-DDI Video Adapter Card provides connector access to COM Express Type 6 module Digital Display Interface (DDI) outputs. HDMI, DVI and DisplayPort outputs are provided. The T6-DDI is installed on the ADLINK Express-BASE6 Type 6 carrier board using a PCIe x16 slot with proprietary pinout. Ordering Information Model Number Description/Configuration T6-DDI COM Express Type 6 DDI-to-HDMI/DVI/DisplayPort adapter card 1-40 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ADLINK Technology: STARTERKIT-NANOX-TC-E680-1G STARTERKIT-NANOX-TC-E640-1G STARTERKIT-NANOX-TC-E620-1G