SCALE™-2 2SC0108T2E0-17
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2SC0108T2E0-17 Preliminary Data Sheet
Dual Channel Ultra-compact Low-cost SCALE™-2 Driver Core
Short De scription
The low-cost SCALE™-2 dual-driver core 2SC0108T2E0-17 (Lead free version of 2SC0108T2B0-17) combines
unrivalled compa ctness with broa d appli cabilit y. T he dr iver is designed for univer sal a pplications requiri ng high
reliability. The 2SC0108T2E0-17 drives all usual IGBT modules up to 600A/1200V or 450A/1700V. The
embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-level
topologies are also supp orted.
The 2SC0108T2E0-17 is the most compact driver core available for industrial applications, with a footprint of
only 45 x 34.3mm and an insertion height of max. 16mm. It allows even the most restricted insertion spaces
to be e fficient ly used . Com pare d with co nventi onal dri vers , the hig hly int egra ted SCA LE-2 chipset allow s about
85% of components to be dispensed with. This advantage is impressively reflected in increased reliability at
simultaneously minimized cost.
The 2SC0108T2E0-17 combines a complete two-channel driver core with all components required for driving,
such as a n isolat ed DC/ DC con verte r, short -circuit prot ection as well as supply voltage monitoring. Each of the
two output channels is electrically isolated from the primary side and the other secondary channel.
An output current of 8A and 1W drive power is available per channel, making the 2SC0108T2E0-17 an ideal
driver platform for universal usage in small and medium power applications. The driver provides a gate voltage
swing of +1 5V/–8V. The turn-o n voltage is regulate d to maintain a sta ble 15V rega rdless of the output pow er
level.
Its outstanding EMC allows safe a nd reliable operat ion in even hard ind ustr ial applications.
Product Highlights Applications
General purpose drives
Uninterruptible power supplies ( UPS)
Solar and wind power converters
Auxiliary converters for traction
Electro/hyb rid drive vehicles
Driving parallel-connected IGBTs
Switched mode power supplies (SMPS)
Medical (MRT, CT, X-Ray)
Laser technology
Ultra-compact dual channel driver
Highly integrated SCALE-2 chipset
Gate current ±8A, 1W output power per channel
+15V/-8V gate driving
Blocking voltages up to 1700V
Safe isolation to EN 5 0178
Short del ay and low jitter
Inter face for 3.3V...15V l ogic level
UL recognition E32 17 57 for UL508 C (NM MS2/ 8)
UL recognition E34 64 91 for UL609 50 -1 (NWGQ2/8)
Lead free
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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Safety Notice!
The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-
voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!
Any handling of electr onic devices is subject to the general specifications for protecting electrostatic-sensitive
devices according to inte rn ational sta ndard IE C 60747-1, Chapter IX or European standard EN 1000 15 (i. e. the
workplace, tools, etc. must comply with these standar ds). Otherw ise, this product may be damaged.
Impor tant Product Docum enta tion
This data sheet contains only product-specific data. For a detailed description, must-read application notes and
important information that apply to this product, please refer to “2SC0108T Descrip tion & Appli cation Manual”
on www.power.com/igbt-driver/go/2SC0108T
Absolut e Maxi mum Ra t ing s
Parameter Remarks Min Max Unit
Supply voltage VCC
VCC to GND 0 16 V
Logic inp ut and outp ut voltages Primary side, to GND -0.5 VCC+0.5 V
SOx current Failure condition, t otal current 20 mA
Gate peak current Iout Note 1 -8 +8 A
External gate resistance Turn-on and turn-off 2 Ω
IGBT gate charge 6.3 µC
Average sup ply cur rent ICC Notes 2, 3 260 mA
Output power Ambient temperature <70°C (Notes 4, 5) 1.2 W
Ambient temperature <85°C (Note 4) 1 W
Test voltage (50Hz/1min.) Primary t o secondary (Note 14) 5000 VAC(eff)
Secondary to secondary (Note 14) 4000 VAC(eff)
Switching frequency f 50 kHz
|dV/dt| Rate of change of input to output voltage (Note 10) 75 kV/μs
Operating voltage Primary/secondary, seco nda ry/secondary 1700 Vpeak
Operating temperature Note 5 -40 +85 °C
Storage temperature -40 +90 °C
Recommended Operating Conditions
Power Supply Remarks Min Typ Max Unit
Supply voltage
VCC
VCC to GND 14.5 15 15.5 V
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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Electrical Characteristics
All data refer to +25°C and VCC = 15V unless otherw ise specified.
Power supply Remarks Min Typ Max Unit
Supply current ICC Without load 31 mA
Coupling capacitance Cio Primary side to secondary side, per channel 19 pF
Power Supply Monitoring Remarks Min Typ Max Unit
Supply threshold VCC Primary side, clear fault 11.9 12.6 13.3 V
Primary side, set fault (Note 11) 11.3 12.0 12.7 V
Monitoring hysteresis Primary side, set/clear fault 0.35 V
Supply threshold VISOx-VEx Secondary side, clear fault 12.1 12.6 13.1 V
Secondary side, set fault (N ote 12) 11.5 12.0 12.5 V
Monitoring hysteresis Secon dary si de, set/clear fault 0.35 V
Supply threshold VEx-VCOMx Secondary side, clear fault 5 5.15 5.3 V
Secondary side, set fault (N ote 12) 4.7 4.85 5 V
Monitoring hysteresis Secon dary si de, set/clear fault 0.15 V
Logic Inputs and Outputs Remarks Min Typ Max Unit
Input bias current V(INx) > 3V 190 µA
Turn-on threshold V(INx) 2.6 V
Turn-off threshol d V(INx) 1.3 V
SOx output voltage Failure condition, I(SOx)<20mA 0.7 V
Short-Circuit Protection Remarks Min Typ Max Unit
Current throug h pin REFx R(REFx, VEx)<70kΩ 150 µA
Minimum response time Note 8 1.2 µs
Minimum blocking time Note 9 9 µs
Timing Charact eristics Remarks Min Typ Max Unit
Turn-on delay td(on) Note 6 90 ns
Turn-off del ay td(off) Note 6 75 ns
Jitter of turn-on delay Note 17 ±2 ns
Jitter of turn-off delay Note 17 ±2 ns
Output rise time tr(out) Note 7 17 ns
Output fall time tf(out) Note 7 15 ns
Transmission delay of fault state Note 13 360 ns
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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Electrical Isolation Remarks Min Typ Max Unit
Test voltage (50Hz/1s) Primary to secondary side (Note 14) 5000 5050 5100 Veff
Secon dary t o se c ondary side (Note 14) 4000 4050 4100 Veff
Partial discharge extinction volt. Primary to seco ndary side (Note 16) 1768 Vpeak
Secon dary t o se c ondary side (Note 16) 1700 Vpeak
Creepage distance Primary to secondary side 12.9 mm
Secon dary t o se c ondary side 8.5 mm
Clearance distance Primary to se condary side 12.9 mm
Secon dary t o se c ondary side 6.5 mm
Outputs Remarks Min Typ Max Unit
Blocking capacitance VISOx to VEx 9.4 µF
VEx to COMx 9.4 µF
Typical internal gate resistance Turn-on and turn-off (Note 15) 0.5 Ω
Output voltage swing
The output voltage swing consists of two distinct se gments. First, there is the tu rn-on voltag e VGHx between
pins GHx and VEx. VGHx is regulated and maintained at a constant level for all output power values and
frequencies.
The seco nd segm ent o f the output voltag e swing i s the turn-off voltag e VGLx. VGLx is measured between pins
GLx and VEx. It is a negative voltage. It changes with the output power to accommodate the inevitable
voltage drop across the i nternal DC/DC conver ter.
Output Voltage Remarks Min Typ Max Unit
Turn-on voltage, VGHx Any load condition 15.0 V
Turn-off volt a ge , VGLx No load -9.4 V
Turn-off volt a ge , VGLx 1W out put power -7.6 V
Turn-off volt a ge , VGLx 1.2W output power -7.2 V
Footnot es to the K ey D a ta
1 )
The maximum peak gate current refers to the highest current level occurring during the product
lifetime. It is an absolute value and does also apply for short pulses.
2 )
The average supply input current is limited for thermal reasons. Higher values than specified by the
absolute maximum rat ing are permissible (e.g. during p ower supply start up) if the average rem ains
below the given value, provid
ed the average is taken over a time period which is shorter than the
thermal time constants of the driver in the application.
3 )
There is no means of actively controlling or limiting the input current in the driver. In the case of
start-up wit h very high b
lo cking ca pacitor values , or in ca se of s hort cir cuit at the out put, t he suppl y
input current has to b e limited exter nally.
4 )
The maximum output power must not be exceeded at any time during operation. The absolute
maximum rating must also be observed for
time periods shorter than the thermal time constants of
the driver in the application.
5 )
An extended output power range is specified in the output power section for maximum ambient
temperatures of 70°C. In that case, the absolute maximum rating for the operating temperature
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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changes to (–40°C - 70°C) and the absolute max imum output power rati ng changes to 1.2 W.
6 )
The delay time is measured between 50% of the input signal and 10% voltage swing of the
corresp onding output. The delay tim e is independent of the output loading.
7 )
Output rise and fall times are measured between 10% and 90% of the nominal output swing. The
values are given for the driver side of the gate resistors without load. The time constant of the
output load in conjunction w ith the present gate resistors leads to an additional delay at the load side
of the gate resistors.
8 )
The minimum response time given is valid for the circuit given in the description and application
manual (Fig. 6) with the values of table 1 (Cax=0pF, Rthx=43kΩ).
9 )
The blocking time sets a minimum time span between the end of any fault state and the start of
normal operation (remove fault from pin SOx). The value of the blocking time can be adjusted at pin
TB. The specified blocking time is valid if TB is connected to GND.
10 )
This specification guarante e s that the dr ive information will be tr ansferred re liably even a t a high DC-
link voltage and with ultra-fast switching operations.
11 )
Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops
below this limit, a fault is transmit ted to both SOx outputs and the IGBTs are switched off.
12 )
Undervo ltage monitoring of the secondary-side supply voltage (VISOx to VEx and VEx to COMx which
correspond with the approximate turn-on and turn-off gate-
emitter voltages). If the corresponding
voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the
corresp onding SOx output.
13 )
Transmission delay of fault state from the secondary side to the corresponding primary status
output.
14 )
HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate
driver is suited for HiP ot te st ing. Nevert heles s, it is str ongly re comme nded t o limit the testing time to
1s slots as stipulated by EN 50178. Excessive HiPot testing a t voltages much higher than 1200VAC(eff)
may lead to insulation degradation. No degradation has been observed over 1min. testing at
5000VAC(eff). Every production sample s
hipped to customers has undergone 100% testing at the
given value fo r 1s.
15 )
The resulting gate resistance is the sum of the external and the internal gate resistance.
16 )
17 )
Partial discharge m easurement is performe d in accorda nce with IEC 60270 and iso lation coordination
specified in EN 50178. The partial discharge extinction voltage between primary and either secondary
side is coordinated for safe isolation to EN 50178.
Jitter measurements are performed with input signals INx switching between 0V an
d 5V referred to
GND, with a corresponding rise tim e and fall time of 15ns.
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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RoHS Statement
On the basis of Annexes II and III of E uropea n Direc tive 2011/ 65/E C of 08 Ju ne 201 1 on the re stri ctio n of the
use of certain hazardous substances in electrical and electronic equipment (RoHS), we hereby state that the
products described in this datasheet do not contain lead (Pb), mercury (Hg), hexavalent chromium (Cr VI),
cadmium (Cd), polibrometo of biphenyl (PBB) or polibrometo diphenyl ether (PBDE) in concentrations
exceeding the restrictions set forth in Annex II of 2011/65/EC with due consideration of the applicable
exemptions as listed in Annex III of 2011/65/EC.
Legal Disclaimer
The statements, technical information and recommendations contained herein are believed to be accurate as
of the date hereof. All parameters, numbers, values and other technical data included in the technical
information were calculated and determined to our best knowledge in accordance with the relevant technical
norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in
general. We exclude any representation or warranty, express or implied, in relation to the accuracy or
completeness of the statements, technical information and recommendations contained herein. No
responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information,
recommendations or opinions communicated and any liability for any direct, indirect or consequential loss or
damage suffered by any person arising therefrom is expressly discla imed.
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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Ordering I nfo rmat io n
The general terms and conditions of delivery of Power Integr ations Switzerland GmbH apply.
Type Designation Description
2SC0108T2E0-17 Dual-channel SCALE-2 driver core (Lead free version of 2SC0108T2B0-17)
Product home page: www.power.com/igbt-driver/go/2SC0108T
Refer to www.power.com/igbt-driver/go/nomenclature for information on driver nomenclature
Information about Other Products
For other drivers, product documentation, and application support
Please click: www.power.com
Manufacturer
Power Integrations Switze rland GmbH
Johann-Renfer-Strasse 15
2504 Biel-Bie nne, Swit ze rla nd
Phone +41 32 344 47 47
Fax +41 32 344 47 40
Email igbt-driver.sales@power.com
Website www.power.com/igbt-driver
© 2009…2015 Power Integrations Switzerland GmbH. All rig hts reserved.
We reserve the right to make any technical modifications without prior notice. Version 2.2 from 2016-05-20
SCALE™-2 2SC0108T2E0-17
Prelim i nary Dat a Shee t
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