CeraLink™ capacitor for fast-switching semiconductors
Low profile (LP) series
Series/Type: 0.25 µF, 900 V
Ordering code: Z63000Z2910Z 1Z21
Date: 2015-07-27
Version: 1.0
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Identification/Classification 1
(header 1 + top left bar):
CeraLink™ capacitor for fast-switching semiconductors
Identification/Classification 2
(header 2 + bottom left header bar):
Low profile (LP) series
Ordering code: (top right header bar)
Z63000Z2910Z 1Z21
Series/Type: (bottom right header bar)
0.25 µF, 900 V
Preliminary data (optional):
Preliminary data
Department:
PPD PI C
Date:
2015-07-27
Version:
1.0
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 2 of 16
Important notes at the end of this document.
Applications
• Designed for 1200 V semiconductor modules
• Power converters and inverters
• DC link/ snubber capacitor for power converters and inverters
Features
• High ripple current capability
• Low equivalent serial inductance (ESL)
• Low equivalent serial resistance (ESR)
• Low power loss
• Low dielectric absorption
• Optimized for high frequencies up to several MHz
• Increasing capacitance with DC bias up to operating voltage
• High capacitance density
• Minimized dielectric loss at high temperatures
• High reliability
• For reflow soldering only
Construction
• RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate)
• Copper inner electrodes
• Silver outer electrodes
• Silver coated copper-invar lead frame
• Epoxy resin adhesive
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 3 of 16
Important notes at the end of this document.
Dimensional drawings
Recommended solder pad:
Polarity:
Dimensions in mm
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 4 of 16
Important notes at the end of this document.
Vop
= 800 V
VR
= 900 V
Vws
= 1300 V
C0
= 0.07 µF ± 20%
Ceff,typ
= 0.13 µF
Cnom,typ
> 0.25 µF
tan δ
< 0.02
Rins,typ
> 1 GΩ
Tdevice
-40 °C... +125 °C
Tdevice
+125 °C... +150 °C
approx. 1.2 g
Typical values
ESR
0 VDC, 0.5 VRMS,
25 °C, 1 MHz
ESR
0 VDC, 0.5 VRMS,
25 °C, 1 kHz
ESL
Iop 1)
100 kHz
TA = 85 °C
Iop 1)
100 kHz
TA = 105 °C
mΩ
Ω
nH
ARMS
ARMS
43.5
10.8
2.5
3.6
2.9
1) Normal operating current without forced cooling at Tdevice = 125 °C. Higher values permissible at reduced life time.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 5 of 16
Important notes at the end of this document.
Typical characteristics as a function of temperature and voltage
(VAC = 0.5 VRMS, frequency = 1 kHz)
All given temperatures are device temperatures.
The curves show the relative changes of the capacitance, dissipation factor and ESR. The 100%
values correspond to Ceff,typ and tan δ which are given on page 4 of this data sheet.
9008007006005004003002001000
140
120
100
80
60
40
Voltage [VDC]
Capacitance [%]
-25
25
75
125
T/°C
150100500-50
130
120
110
100
90
80
70
60
50
40
Temperature [°C]
Capacitance [%]
0
800
900
Bias [V]
9008007006005004003002001000
700
600
500
400
300
200
100
0
Voltage [VDC]
Dissipation Factor [%]
-25
25
75
125
T/°C
150100500-50
700
600
500
400
300
200
100
0
Temperature [°C]
Dissipation Factor [%]
0
800
900
Bias [V]
9008007006005004003002001000
500
400
300
200
100
0
Voltage [VDC]
ESR [%]
-25
25
75
125
T/°C
150100500-50
600
500
400
300
200
100
0
Temperature [°C]
ESR [%]
0
800
900
Bias [V]
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 6 of 16
Important notes at the end of this document.
Typical capacitance values as a function of voltage
Large signal capacitance:
Quasistatic (slow variation of the voltage), 25 °C
The nominal capacitance is defined as the large signal
capacitance at Vop.
See glossary for further information.
Small signal capacitance:
0.5 VRMS, 1 kHz, 25 °C
The effective capacitance is defined as the small signal
capacitance at Vop.
9008007006005004003002001000
200
175
150
125
100
75
50
Voltage [VDC]
Capacitance [%]
large signal
small signal
Variable
Typical impedance and ESR as a function of frequency
VDC = 0 V, VAC = 0.5 VRMS, Tdevice = 25 °C
100000001000000100000100001000
10000
1000
100
10
1
0.1
0.01
Frequency [Hz]
|Z|, ESR [Ohm]
|Z| [Ohm]
ESR [Ohm]
Variable
Typical permissible current as a function of frequency
Measurement performed at Vop.
The values correspond to a device temperature of 125 °C.
No active cooling was used.
100806040200
3.5
3.0
2.5
2.0
1.5
1.0
Frequency [kHz]
Normal operation current [Arms]
85
105
[°C ]
Tamb
Aging
The capacitance has an aging behavior which shows a decrease of capacitance with time.
The typical aging rate is about 2.5% per logarithmic decade in hours.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 7 of 16
Important notes at the end of this document.
Marking of components
Manufacturer’s logo
CeraLink™ type
Nominal capacitance
Rated voltage
Lot number, 9 digits
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 8 of 16
Important notes at the end of this document.
Packaging
The CeraLink™ will be delivered in a blister tape and will be packed in a cardboard box.
Part orientation:
Dimensions in mm
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 9 of 16
Important notes at the end of this document.
Recommended reflow soldering profile
Profile feature
SAC Sn95.5Ag3.8Cu0.7 N2 atmosphere
Preheat and soak
- Temperature min
- Temperature max
- Time
Tsmin
Tsmax
tsmin to tsmax
150 °C
200 °C
60 … 180 seconds
Average ramp-up rate
TSmax to Tp
3 °C/ second max.
Liquidus temperature
Time at liquidus temperature
TL
tL
217 °C
60 … 150 seconds
Peak package body temperature
Tp1)
245 °C … 260 °C max.2)
Time (tp)3) within 5 °C of specified
classification temperature (Tc)
30 seconds3)
Average ramp-down rate
Tp to TSmax
6 °C/ second max.
Time 25 °C to peak temperature
maximum 8 minutes
1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Notes:
All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
After the soldering process, the capacitance is lowered. Applying VR to the device will re-establish the capacitance.
The components are suitable for reflow soldering to JEDEC J-STD-020D.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 10 of 16
Important notes at the end of this document.
General technical information
Storage
Only store CeraLink™ capacitors in their original packaging. Do not open the package prior to
processing.
Storage conditions in original packaging: temperature −25 °C to +45 °C, relative humidity ≤
75% annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CeraLink™ capacitors where they are exposed to heat or direct sunlight.
Otherwise the packaging material may be deformed or CeraLink™ may stick together, causing
problems during mounting.
Avoid contamination of the CeraLink™ surface during storage, handling and processing.
Avoid storing CeraLink™ devices in harmful environments where they are exposed to
corrosive gases (e.g. SOx, Cl).
Use CeraLink™ as soon as possible after opening factory seals such as polyvinyl-sealed
packages.
Solder CeraLink™ components within 6 months after shipment from EPCOS.
Handling
Do not drop CeraLink™ components or allow them to be chipped.
Do not touch CeraLink™ with your bare hands - gloves are recommended.
Avoid contamination of the CeraLink™ surface during handling.
The CeraLink™ was tested to withstand the board flex test defined in the AEC-Q200 Rev. D,
method 005.
The CeraLink™ uses copper lead frames to prevent mechanical stress to the ceramic. Too
much bending causes open mode. Avoid high mechanical stress like twisting after soldering
on a PCB.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 11 of 16
Important notes at the end of this document.
Mounting
Do not subject CeraLink™ devices to mechanical stress when encapsulating them with
sealing material or overmolding with plastic material. Encapsulation may lead to worse heat
dissipation too. Please ask for further information.
Do not scratch the electrodes before, during or after the mounting process.
Make sure contacts and housings used for assembly with CeraLink™ components are clean
before mounting.
The surface temperature of an operating CeraLink™ can be higher than the ambient
temperature. Ensure that adjacent components are placed at a sufficient distance from a
CeraLink™ to allow proper cooling.
Avoid contamination of the CeraLink™ surface during processing.
Soldering guidelines
The use of mild, non-activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Excessive usage of solder paste can reduce the mechanical robustness of the device,
whereas insufficient solder may cause the CeraLink™ to detach from the PCB. Use an
adequate amount of solder paste, but on the landing pads only.
If an unsuitable cleaning fluid is used, flux residue or foreign particles may stick to the
CeraLink™ surface and deteriorate its insulation resistance. Insufficient or improper cleaning
of the CeraLink™ may cause damage to the component.
Excessive washing like ultrasonic cleaning, can affect the connection between the ceramic
chip and the outer electrode. To avoid this, we give the following recommendation:
o Power: 20 W/l max.
o Frequency: 40 kHz max.
o Washing time: 5 minutes max.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 12 of 16
Important notes at the end of this document.
Glossary
Initial capacitance C0: is the value at the origin of the hysteresis without any applied direct
voltage.
Effective capacitance Ceff: occurs at Vop and is measured with an applied ripple voltage of
0.5 VRMS and 1 kHz. The CeraLink™ is designed to have its highest
capacitance value at the operating voltage Vop.
Nominal capacitance Cnom: is the value derived by the tangent of the mean hysteresis as the
derivation of the mean hysteresis is dQ/dV ~ C.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 13 of 16
Important notes at the end of this document.
Symbols and terms
AC Alternating current
C0 Initial capacitance
Ceff,typ Typical effective capacitance
Cnom,typ Typical nominal capacitance
DC Direct current
ESL Equivalent serial inductance
ESR Equivalent serial resistance
Iop Operating ripple current, root mean square value of sinusoidal AC current
LP Low profile
PCB Printed circuit board
PLZT Lead lanthanum zirconium titanate
Rins Insulation resistance
SAC Tin silver copper alloy; lead-free solder paste
TA Ambient temperature
tan δ Dissipation factor
Tdevice Device temperature. Tdevice = TA + ΔT (ΔT defines the self-heating of the device due to
applied current).
Vop Operating voltage
VR Rated voltage
VRMS Root mean square value of sinusoidal AC voltage
Vws Withstand voltage
ΔT Increase of temperature during operation
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 14 of 16
Important notes at the end of this document.
Cautions and warnings
General
Not for use in resonant circuits, where a voltage of alternating polarity occurs.
Not for AC applications. Consult your EPCOS representative for further details.
If used in snubber circuits, ensure that the sum of all voltages remains at the same polarity.
Some parts of this publication contain statements about the suitability of our CeraLink™ components
for certain areas of application, including recommendations about incorporation/design-in of these
products into customer applications. The statements are based on our knowledge of typical
requirements often made of our CeraLink™ devices in the particular areas. We nevertheless
expressly point out that such statements cannot be regarded as binding statements about the
suitability of our CeraLink™ components for a particular customer application. As a rule, EPCOS is
either unfamiliar with individual customer applications or less familiar with them than the customers
themselves. For these reasons, it is always incumbent on the customer to check and decide whether
the CeraLink™ devices with the properties described in the product specification are suitable for use
in a particular customer application.
Do not use EPCOS CeraLink™ components for purposes not identified in our specifications.
Ensure the suitability of a CeraLink™ in particular by testing it for reliability during design-in.
Always evaluate a CeraLink™ component under worst-case conditions.
Pay special attention to the reliability of CeraLink™ devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Consider derating at higher operating temperatures. As a rule, lower temperatures and
voltages increase the life time of CeraLink™ devices.
If steep surge current edges are to be expected, make sure your design is as low-inductive as
possible.
In some cases the malfunctioning of passive electronic components or failure before the end
of their service life cannot be completely ruled out in the current state of the art, even if they
are operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery
line applications such as clamp 30), ensure by suitable design of the application or other
measures (e.g. installation of protective circuitry, fuse or redundancy) that no injury or damage
is sustained by third parties in the event of such a malfunction or failure.
Specified values only apply to CeraLink™ components that have not been subject to prior
electrical, mechanical or thermal damage. The use of CeraLink™ devices in line-to-ground
applications is therefore not advisable, and it is only allowed together with safety
countermeasures such as thermal fuses.
CeraLink™ capacitor for fast-switching semiconductors Z63000Z2910Z 1Z21
Low profile (LP) series 0.25 µF, 900 V
Preliminary data
PPD PI C 2015-07-27
Please read Cautions and warnings and Page 15 of 16
Important notes at the end of this document.
Operation
Use CeraLink™ only within the specified operating temperature range.
Use CeraLink™ only within specified voltage and current ranges.
The CeraLink has to be operated in a dry atmosphere, which must not contain any additional
chemical vapors or substances.
Environmental conditions must not harm the CeraLink™. Use the capacitors under normal
atmospheric conditions only. A reduction of the oxygen partial pressure to below 1 mbar is not
permissible.
Prevent a CeraLink™ from contacting liquids and solvents.
Avoid dewing and condensation.
During operation, the CeraLink™ can produce audible noise due to its piezoelectric
characteristic.
EPCOS CeraLink™ components are mainly designed for encased applications. Under all
circumstances avoid exposure to:
o direct sunlight
o rain or condensation
o steam, saline spray
o corrosive gases
o atmosphere with reduced oxygen content
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
sheets, data books, other publications, on the EPCOS website, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the
ordering codes are due to different processes employed and do not affect the specifications of
the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes
Important notes
Page 16 of 16
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP,
CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,
MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries.
Further information will be found on the Internet at www.epcos.com/trademarks.
Mouser Electronics
Authorized Distributor
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Z63000Z2910Z001Z21