TDA1517N3 - NXP SEMICONDUCTORS

DATA SH EET

Product specification

Supersedes data of 2002 Jan 17 2004 Feb 18

INTEGRATED CIRCUITS

TDA1517; TDA1517P

2 x 6 W stereo power amplifier

2004 Feb 18 2

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

FEATURES

•Requires very few external components

•High output powe r

•Fixed gain

•Good ripple rejection

•Mute/st a ndby switch

•AC and DC short-circuit safe to groun d an d VP

•Thermally protected

•Reverse polarity safe

•Capability to handle high energy on outputs (VP=0V)

•No switch-on/switch-off plop

•Electrostatic discharge protection.

GENERAL DESCRIPTION

The TDA1517 is an integrated class-B dual output

amplifier in a pl astic single in-line medium pow er package

with fin (SIL9MPF), a plastic rectangular-bent single in-line

medium power package with fin (RBS9MPF) or a plastic

heat-dissipating dual in-line pa cka g e (H DIP1 8). The

device is primarily de velop ed for multi-media applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage 6.0 14.4 18.0 V

IORM repetitive peak output current −−2.5 A

Iq(tot) total quiescent current −40 80 mA

Isb standby current −0.1 100 μA

Isw switch-on current −−40 μA

|ZI|input impedance 50 −−kΩ

Pooutput power RL=4Ω; THD = 0.5% −5−W

RL=4Ω; THD = 10% −6−W

SVRR supply voltage ripple rejection fi= 100 Hz to 10 kHz 48 −−dB

αcs channel separation 40 −−dB

Gvclosed loop voltage gain 19 20 21 dB

Vno(rms) noise outp ut voltage (RMS value) −50 −μV

Tccrystal temperature −−150 °C

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA1517/N3 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1

TDA1517/N3/S5 RBS9MPF plastic rectangular-bent single in-line mediu m power package with

fin; 9 leads SOT352-1

TDA1517P HDIP18 plastic heat- d issipatin g du al in- line pack ag e; 18 leads SOT398-1

2004 Feb 18 3

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

mute/stand-by

switch input

MLC351

output 1

15 kΩ

x 1

stand-by

switch

mute

switch

stand-by

reference

voltage

18 kΩ

kΩ

mute switch Cm

power stage

mute switch

kΩ

power stage

275

SGND

signal

ground

PGND

output 2

non-inverting

input 1

non-inverting

input 2 9

supply voltage

ripple rejection

output

TDA1517

mute

reference

voltage

input

reference

voltage

power

ground

(substrate)

2004 Feb 18 4

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

PINNING

SYMBOL PIN DESCRIPTION

−INV1 1 non-inverting inp ut 1

SGND 2 signal ground

SVRR 3 supply voltage ripple rejection output

OUT1 4 output 1

PGND 5 power ground

OUT2 6 output 2

VP7 supply voltage

M/SS 8 mute/standby s wit ch input

−INV2 9 non-inverting inp ut 2

Fig.2 Pin configuration for SOT110 -1 and

SOT352-1.

handbook, halfpage

MLC352

OUT2

SGND

INV1

INV2

TDA1517

OUT1

M/SS

SVRR

PGND

Fig.3 Pin configuration for SOT3 98-1.

Pins 10 to 18 should be connected to GND or floating.

handbook, halfpage

MLC353

OUT2

SGND

INV1

INV2

TDA1517P

OUT1

M/SS

SVRR

PGND

FUNCTIONAL DESCRIPTION

The TDA1517 contains two identical amplifiers with

differential input stages. The gain of each amplifier is fixed

at 20 dB. A special feature of the devi ce is the

mute/standby switc h w hic h has the following features:

•Low standby current (<100 μA)

•Low mute/stand by switching current

(low cost supply switch)

•Mute condition.

2004 Feb 18 5

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage operating −18 V

no signal −20 V

VP(sc) AC and DC short-circuit safe voltage −18 V

VP(r) reverse polarity −6V

ERGOenergy handling capability at outputs VP=0V −200 mJ

IOSM non-repetitive pea k ou tput current −4A

IORM repetitive peak output current −2.5 A

Ptot total power dissipation see Fig.4 −15 W

Tstg storage temperature −55 +150 °C

Tamb operating ambient temperature −40 +85 °C

Tccrystal temperature −150 °C

SYMBOL TYPE NUMBER PARAMETER VALUE UNIT

Rth(j-c) TDA1517/N3; TDA1517/N3/S5 thermal resistance from junction to case 8 K/W

Rth(j-p) TDA1517P thermal resistance from junction to pins 15 K/W

Rth(j-a) TDA1517/N3; TDA1517/N3/S5;

TDA1517P thermal resistance from junction to

ambient 50 K/W

Fig.4 Power derating curve.

(1) Rth j-c =8K/W.

(2) Rth j-p =15K/W.

handbook, halfpage

25 0 50 150

MLC354

100

T ( C)

amb

(W)

(1)

(2)

2004 Feb 18 6

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

DC CHARACTERISTICS

VP=14.4V; T

amb =25°C; measured in Fig.6; unless otherwise specified.

Note

1. The circuit is DC adjusted at VP= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPsupply voltage note 1 6.0 14.4 18.0 V

Iq(tot) total quiescent current −40 80 mA

VODC output voltage −6.95 −V

Mute/standby switch

V8switch-on voltage level see Fig.5 8.5 −−V

Mute condition

VOoutput signal in mute position VI(max) =1V; f

i=20Hzto15kHz −−2mV

Standby condition

Isb DC current in standby co ndition −−100 μA

Vsw switch-on current −12 40 μA

2004 Feb 18 7

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

AC CHARACTERISTICS

VP=14.4V; R

L=4 Ω; f = 1 kHz; Tamb =25°C; measured in Fig.6; unless otherwise specified.

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency re sponse externally fixed.

3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and

a frequency betwee n 100 Hz and 10 kHz.

4. Noise voltage measu red in a bandwidth of 20 Hz to 20 kHz.

5. Noise output vo ltage independ ent of Rs (VI=0V).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Pooutput power THD = 0.5%; note 1 4 5 −W

THD = 10%; no te 1 5.5 6.0 −W

THD total harmonic distortion Po=1W −0.1 −%

flr low frequency roll-off at −3 dB; note 2 −45 −Hz

fhr high frequency roll-off at −1dB 20 −−kHz

Gvclosed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB

mute 48 −−dB

standby 80 −−dB

|Zi|input impedance 50 60 75 kΩ

Vno noise output voltage

on Rs=0Ω; note 4 −50 −μV

on Rs=10Ω; note 4 −70 100 μV

mute note 5 −50 −μV

αcs channel separation Rs=10Ω40 −−dB

|ΔGv|channel unbalance −0.1 1 dB

2004 Feb 18 8

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

Fig.5 Standby, mute and on co nditions.

handbook, halfpage

8.5

MLC355

6.4

3.3

(V)

;;;;;;;

;

;;;;;

;

;;;;;

;

;;;;;;;

ON (I = 40 mA)

mute (I = 40 mA)

standby (I 100 μA)

APPLICATION INFORMATION

Fig.6 Application circuit diagram.

handbook, full pagewidth

MLC356

100 nF

TDA1517

standby switch

220 nF

input 1

1000 μF 1000 μF

input

reference

voltage

2 5

signal

ground power

ground

1 9 220 nF input 2

2200

μF

internal

1/2 VP

100

μF

60 kΩ60 kΩ20 dB 20 dB

2004 Feb 18 9

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

PACKAGE OUTLINES

UNIT AA

max.

2A3b1D1

bcD

(1) E(1) Z

max.

(1)

eLPP

1q1q2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 18.5

17.8 3.7 8.7

8.0

15.8

15.4 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1

5.9

5.7

4.4

4.2

3.9

3.4 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1 95-02-25

03-03-12

0 5 10 mm

scale

0.25

q1q2

seating plane

pin 1 index

IL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110

-1

2004 Feb 18 10

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

UNIT A A

max.

2max.

A3b1D1

bcD

(2) E(2) Z(2)

(1) eLPP

1q1q2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 14.45

13.95 8.7

8.0

3.7 1.40

1.14 0.67

0.50 1.40

1.14 0.48

0.38 21.8

21.4 21.4

20.7 6.48

6.20 3.4

3.2

2.54 1

5.9

5.7

4.4

4.2

3.8

3.3 15.1

14.9

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Notes

1. Dimension is specified at seating plane.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT352-1 97-12-16

03-03-12

0 5 10 mm

scale

0.25

0.6

q1q2

seating plane

pin 1 index

BS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads SOT352

-1

2004 Feb 18 11

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT398-1 95-01-25

03-02-13

min. A

max. bmax.

1.40

1.14 0.67

0.50 0.47

0.38 21.85

21.35 6.5

6.2 3.9

3.1 0.252.54 7.62 8.32

8.02 8.7

7.7 14.7 0.51 3.7

inches 0.06

0.04 0.03

0.02 0.02

0.01

1.05

0.75

0.04

0.03 0.87

0.84 0.26

0.24 0.15

0.12 0.010.1 0.3 0.33

0.32 0.34

0.30 0.040.19 0.02 0.15

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

DIP18: plastic heat-dissipating dual in-line package; 18 leads SOT398

-1

2004 Feb 18 12

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brie f insight to wave, dip and manual

soldering. A more in-depth account of soldering ICs can be

found in our “Data Handbook IC26; Integrated Circuit

Packages” (document order number 9398 6 52 90011).

Wave solder ing is the preferred method for mounting of

through-hole moun t IC packages on a prin ted-circuit

board.

Soldering by dipping or by solder wave

Driven by legislation and env ironmental forces the

worldwide use of lead-free solder pastes is increas ing.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb- f ree respectively.

The total contact time of successive solder waves must not

exceed 5 seconds .

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necess ary immediately aft er soldering to ke ep the

temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temper ature of the solderin g iro n bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temp erature is between

300 and 400 °C, contact may be up to 5 seconds .

Suit ability of through-hole mount IC packages for dipping and wave soldering methods

Notes

1. For SDIP packages, the long itudinal axis must be parallel to the transport direction of the printed-circuit board.

2. For PMFP packages hot bar so ldering or manual soldering is suitable.

PACKAGE SOLDERING METHOD

DIPPING WAVE

CPGA, HCPGA −suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable(1)

PMFP(2) −not suitable

2004 Feb 18 13

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or co mpleting a design.

2. The product s ta tus of device(s) described in this document may have chang ed since this document wa s published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Pr oduction This document contains the pr oduct specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliab le .

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or conseq uential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa t ion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and / o r use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of custom er’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications and pr oducts.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doin g all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third p arty

customer(s). NXP does not accept any liability in this

respect.

2004 Feb 18 14

NXP Semiconductors Product specification

2 x 6 W stereo power amplifier TDA1517; TDA1517P

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratin gs only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the qua l ity and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subje ct to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to apply i ng the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyan ce or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export control

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, an d as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications be yond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e- mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form part o f an y q uotation or contra ct, is b elieve d to be accurate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other indus trial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors. No change s were

made to the content, except for the legal definitions and disclaimers.

Printed in The Netherlands R30/05/pp15 Date of release: 2004 Feb 18 Document order number: 9397 750 12926