4X3.80
2X11.18
21.46
40.00
6.60
2X1.65 ±0.15
8.38
6.48
-B-
IB
DETAIL G
6.35
4X2.54
15.24
I
CP
B
0.64 ±0.0259X
J
J
8.79
13.97
2.28
6X1.52
4X1.22
2.54
10.67
11.53
11.18
12XR0.50
9X0.50
11.4311.53
DETAIL D
5.68
13.93
2.78
CP CRITICAL PARAMETER. SUPPLIER MUST DEMONSTRATE MINIMUM CPK OF 1.3 WHERE APPLICABLE.
2X45°
Amphenol *
CP
CP
CP
CP
FULL R
PIN #1
R0.25
R0.25
R0.17
R0.25
R0.25
R0.17
27.80
CP
0.25 AB
5X2.54
-E-
15.24
3X5.08
-G-
0.5 A G E
0.2 AB C
0.25 AB
5X2.54
0.25 AB C
0.2 ABE
-A-
9X1.27
-C-
-F-
NOTE:
1.HOUSING: 33 % GLASS FILLED PPA, BLACK, UL 94-V0
CONTACTS: PHOSPHOR BRONZE
PLATING: JUMPER PINS: 1.27um NICKEL UMDER PLATING OVERALL
0.12um GOLD FLASH CONTACT MATING AREA
POINT OF MEASUREMENT IS 3.5mm FROM PIN TIP
2.54um TIN/LEAD SOLDER TAIL
POWER PINS: 1.27~2.54um NICKEL UNDERPLATING OVERALL
2.54~3.81um SN/PB OVERALL
SPECIFICATIONS:
RATED CURRENT: JUMPER PIN 3A
POWER PIN 5A
DIELECTRIC STRENGTH: 1000V FOR 1 MINUTE
INSULATION RESISTANCE: 5 X 10^3 M
TEMPERATURE : -40 ° TO +105 °
CONTACT RESISTANCE: 20 m MAX
PIN RETENTION FORCE:
JUMPER PINS 1.13KG MIN.
POWER PINS 0.91KG MIN.
REF. PCB DESIGN THICKNESS 1.22 ±0.13
2.PIN LOCATION AND TOLERANCE APPLIES TO BOTH THE INTERFACE AND SOLDER TAIL ENDS ON PINS
3.COMPONENTS MUST BE CLEANED TO THE BEST COMMERCIAL PRACTICES AVAILABLE WHICH WILL LEAVE NO CONTAMINATION.
MATERIAL RESIDUES. OR PROCESS RESIDUES WHICH ARE VISIBLE TO THE UNAIDED EYS. WE ARE CAUTIONED AGAINST
USDING PROCESS FLUIDS OR MATERIALS CONTAINING SILICONE OIL. CHLORINATED SOLVENTS. OR PHTHALATE PLASTICIZERS
4.GATES. FLASH. EJECTOR PIN MARKS. AND VENDOR IDENTIFICATION IS BELOW OR FLUSH TO 0.05 MAX. ABOVE PART SURFACE.
5.DRAFT OPTIONAL: IF USED. DRAFT TO BE 3 DEG MAX TO SUBTRACT MASS
6.APPLY COPLANARITY TOLERANCE USING THE TWO DATUM -F- SURFACES ON EITHER SIDE OF THE APPLICABLE SOLDER TAIL PATTERN.
7.PIN MUST BE STAMPED AND FROMED WITH ALL DIE ROLL EDGES ON THE OUTSIDE SURFACE AND ALL BURR EDGES ON THE INSIDE
SURFACE OF THE PIN
8.CONNECTOR COMPATIBILITY
THIS CONNECTOR IS INTENDED TO BE MATED WITH POWER CONNECTORS CONFORMING TO THE PARALLEL ATA-5 OR HIGHER
9.CONNECTOR MATING AND UNMATING FORCE
POWER SECTION: FORCE TO BE PER PARALLEL ATA-5 SPEC OR HIGHER WHEN USED WITH MATING CONECTORS TO NOTE 7
OF THIS DRAWING(REF. 1.75KG (3.85LBS) PER CONTACT MAX. MATING FORCE AND 113.5G (0.25LBS) PER CONTACT MIN.
UNMATING FORCE NOT INCLUDING HOUSING DETENT LOCKING FEATURES
10.PART CLEANLINESS TO BE PER MAXTOR SPEC 10194
11.ASSEMBLY SURFACE AREA = 35.0 CM^2
CP
0.38
1.02
3.40
60°
0.51
5.10
45°
3XR0.15
3X0.38
3X2.00
3X0.64
6.35
9X5.84 ±0.13
9X1.00MAX
4.8MAX
0.5MIN
9X2.67
9 SOLDER TAILS
0.32 PROFILE TO A CONTINUOUS
SMOOTH CURVE NO PARTING
LINE PERMITTED ANYWHERE
THROUGH R3.00 PROFILE
4X Ø3.50
7.80
4X6.10
Ø2.50
4X1.00 ±0.25
4X3.3MAX
R0.76
4X0.50MIN
HH
R0.50
1.52
3.05
1.14
Ø1.52
5-LOWER TERMINAL
4-UPPER TERMINAL
4-POWER PIN
1-INSULATOR
9X4.20
4X2.41
8.79 ±0.05
0.50
+0.10
- 0.03
5.20
0.64 ±0.13
9X0.33 MAX.
9X0.58 ±0.18
9X 0.75X45 °
4X Ø2.108 ±0.025
R0.25
CP
CP
CP
CP
4XR3.00
2X6.00
4X4.95
0.25 A G E
0.25 A G E
0.25 AGE
0.13
0.18 F
9X1.22
4X1.22
0.2 F
-F-
